阅读说明：本技术 一种连接器和印刷线路板总成 (Connector and printed circuit board assembly ) 是由 杜红红 于 2021-08-04 设计创作，主要内容包括：本发明公开了一种连接器和印刷线路板总成,连接器包括：印刷线路板；焊盘,成对地设置在印刷线路板上；封装主体；引脚,电性连接到封装主体,其中引脚包括两端的两个凸起结构和在两个凸起结构之间建立连接的凹陷结构,并且两个凸起结构正对印刷线路板上与两个凸起结构相对应的焊盘对相对设置。本发明能够使高速信号正常布线,降低制程,缩减成本。(The invention discloses a connector and a printed circuit board assembly, wherein the connector comprises: a printed wiring board; pads provided in pairs on the printed wiring board; a package body; and the pins are electrically connected to the packaging body, each pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are opposite to the bonding pad pairs corresponding to the two protruding structures on the printed circuit board. The invention can ensure that the high-speed signal is normally wired, reduce the manufacturing process and reduce the cost.)

1. A connector, comprising:

a package body;

the pin is electrically connected to the packaging body, wherein the pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged opposite to the bonding pad pair corresponding to the two protruding structures on the printed circuit board.

2. The connector of claim 1, wherein the connector includes a plurality of said pins, and wherein both of said raised structures of each of said pins are in the same position on each of said pins.

3. The connector of claim 1, wherein the recessed feature is disposed opposite a high speed via on a printed wiring board corresponding to the recessed feature.

4. The connector of claim 3, wherein the high speed vias are located between the pair of pads.

5. The connector of claim 1, wherein the two bump structures are electrically connected to the pair of pads by solder.

6. A printed wiring board assembly, comprising:

a printed wiring board;

pads provided in pairs on the printed wiring board;

a package body;

the pin is electrically connected to the packaging body, wherein the pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged opposite to the bonding pad pair corresponding to the two protruding structures on the printed circuit board.

7. The assembly of claim 6, wherein the connector comprises a plurality of said pins, and wherein both said raised structures of each said pin are in the same position on each said pin.

8. The assembly of claim 6, wherein the recessed feature is disposed opposite a high speed via on the printed wiring board corresponding to the recessed feature.

9. The assembly of claim 8, wherein the high speed via is located between the pair of pads.

10. The assembly of claim 6, wherein the two bump structures are electrically connected to the pair of pads by solder.

Technical Field

The present invention relates to the field of printed circuit boards, and more particularly, to a connector and a printed circuit board assembly.

Background

In the design process of a PCB (printed circuit board), the performance of the whole board card is greatly influenced by a high-speed line part; with the increase of various signal rates in the board card, the requirement for high-speed wiring in the PCB board is higher and higher.

In the design of the server, under the action of factors such as the size of a case, customer requirements and the like, the requirements on the size and thickness of a PCB (printed circuit board) card are strict, and the wiring in the PCB card is limited to a certain extent according to the size of the card; on the other hand, with the upgrading of CPUs (central processing units) and the increase of signal rates, demands for high-speed signal in-board wiring are also increasing. The CPU of the current new platform has new requirements for PCIE (computer and peripheral equipment connection standard extension) signals: the wiring at the PIN outlet position of the high-speed connector and the wiring after the through hole can not be overlapped, namely, the two layers of wiring can not be in the same direction. However, because the size of the board card and the position of the connector are limited by the two factors of the structural positioning, the inner layer routing is not free from space in other directions.

In addition, the distance between two rows of PINs (PINs) of the connector is limited, if the outgoing line of the upper row of PINs is punched downwards, the distance between the through holes of the upper row of PINs and the lower row of PINs does not meet the requirement, crosstalk between signals can be caused, and therefore punching into the connector is not allowed. Due to the position limitation of the board frame and the connector, the conventional high-speed line routing mode cannot meet the requirement, and the condition is common in the prior art. This problem can only be solved by using special processes: the through hole is punched on the PIN, the requirement on the distance from the through hole to another row of PIN feet can be met, the routing path is smooth, the phenomenon that the surface layer inner layer routing is overlapped is avoided, and the routing requirement can be met.

Because the integrated circuit board is the through-hole commonly used, directly beat the words on PIN, follow-up PIN foot go up tin and have a tin leakage phenomenon, consequently need fill up the via hole through resin for the POFV technology, then copper facing is carried out on the top layer, just can make the PIN foot can satisfy welding conditions. However, the POFV process is relatively complex, the distance between the wiring lines in the board is larger than that of the common process, and the influence on the relatively dense board cards is large; in addition, the POFV process is expensive, and the cost of one board card is increased.

Aiming at the problems of difficult wiring, large manufacturing process and high cost of high-speed signals in the prior art, no effective solution is available at present.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a connector capable of normally routing high-speed signals, reducing the manufacturing process and reducing the cost.

In view of the above object, a first aspect of embodiments of the present invention provides a connector, including:

a package body;

and the pins are electrically connected to the packaging body, each pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged opposite to the bonding pads corresponding to the two protruding structures on the printed circuit board.

In some embodiments, the connector includes a plurality of pins, and the two raised structures of each pin are in the same location on each pin.

In some embodiments, the recessed features are disposed opposite high speed vias on the printed wiring board that correspond to the recessed features.

In some embodiments, the high speed vias are located between the pair of pads.

In some embodiments, the two bump structures and the pair of pads are electrically connected by solder.

A second aspect of an embodiment of the present invention provides a printed wiring board assembly including:

a printed wiring board;

pads provided in pairs on the printed wiring board;

a package body;

and the pins are electrically connected to the packaging body, each pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged opposite to the bonding pads corresponding to the two protruding structures on the printed circuit board.

In some embodiments, the connector includes a plurality of pins, and the two raised structures of each pin are in the same location on each pin.

In some embodiments, the recessed features are disposed opposite high speed vias on the printed wiring board that correspond to the recessed features.

In some embodiments, the high speed vias are located between the pair of pads.

In some embodiments, the two bump structures and the pair of pads are electrically connected by solder.

The invention has the following beneficial technical effects: the connector and the printed circuit board assembly provided by the embodiment of the invention use the printed circuit board; pads provided in pairs on the printed wiring board; a package body; the pin is electrically connected to the packaging body, the pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures and the technical scheme that the pad pairs corresponding to the two protruding structures are oppositely arranged on the printed circuit board can enable high-speed signals to be normally wired, the manufacturing process is reduced, and the cost is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a cross-sectional structural view of a connector provided by the present invention;

fig. 2 is a schematic plan view of a printed wiring board assembly provided by the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.

It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.

In view of the above, a first aspect of the embodiments of the invention provides an embodiment of a connector that enables high-speed signals to be normally routed, reduces manufacturing processes, and reduces costs. Fig. 1 shows a cross-sectional view of a first embodiment of a connector provided by the present invention.

The connector, as shown in fig. 1, includes:

a package body;

and the pins are electrically connected to the packaging body, each pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged opposite to the bonding pads corresponding to the two protruding structures on the printed circuit board.

In some embodiments, the connector includes a plurality of pins, and the two raised structures of each pin are in the same location on each pin.

In some embodiments, the recessed features are disposed opposite high speed vias on the printed wiring board that correspond to the recessed features.

In some embodiments, the high speed vias are located between the pair of pads.

In some embodiments, the two bump structures and the pair of pads are electrically connected by solder.

Because the current high-speed signal rate is increased, the routing of the PIN part on the surface layer of the high-speed routing in the PCB and the routing of the inner layer are required not to be in the same direction. Conventional connector PINs are packaged on a PCB board with a rectangular PAD for each PIN, and after soldering, the connector PINs are entirely attached to the PADs. The package of the present invention is modified to have a PIN corresponding to two small rectangular PADs, see fig. 1, with a gap between the two PADs.

The PIN of the connector is also designed into a shape that the two ends are thick and the middle is thin, so that even if a via hole is formed in the middle, the problem of tin leakage does not occur during tin coating on the connector. After welding, the PIN feet with thick two ends are attached to two rectangular PADs on the PCB, and then the workpiece feeding is completed.

The packaging method is characterized in that a high-speed line through hole can be formed in the middle of two small rectangular PADs on a PCB, and the PADs on which the through hole is connected can be flexibly selected according to various factors such as different wiring spaces, high-speed line trends and connector positions, so that the overlapping of the surface layer wiring direction and the inner layer wiring direction is avoided, as shown in fig. 2 (the oblique line part in fig. 2 indicates a PAD, and the grid part indicates a through hole). Meanwhile, the through hole does not influence tin on the connector, a POFV process does not need to be additionally introduced, and the signal requirement can be met and the cost can be saved.

To create the desired printed wiring board, the present invention first packages the connector into a connector PIN corresponding to two small rectangular PADs, and places the completed connector package in the PCB board according to the structural orientation. Then, various factors such as the starting end position of the high-speed line in the integrated board, the board type and the like plan a high-speed line path, and the high-speed line via hole at the connector is determined to be connected with which PAD to avoid the superposition with the direction of the inner layer high-speed line according to the high-speed line path, so that the surface layer routing is completed. And finally, continuing subsequent wiring according to the layout flow.

As can be seen from the above embodiments, the connector provided by the embodiments of the present invention is formed by using a printed wiring board; pads provided in pairs on the printed wiring board; a package body; the pin is electrically connected to the packaging body, the pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures and the technical scheme that the pad pairs corresponding to the two protruding structures are oppositely arranged on the printed circuit board can enable high-speed signals to be normally wired, the manufacturing process is reduced, and the cost is reduced.

A second aspect of an embodiment of the present invention provides a printed wiring board assembly including:

a printed wiring board;

pads provided in pairs on the printed wiring board;

a package body;

and the pins are electrically connected to the packaging body, each pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged opposite to the bonding pads corresponding to the two protruding structures on the printed circuit board.

The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

The various illustrative logical blocks, modules, and circuits described in connection with the disclosure herein may be implemented or performed with the following components designed to perform the functions described herein: a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination of these components. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP, and/or any other such configuration.

Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.

In view of the above, a second aspect of the embodiments of the present invention provides an embodiment of a printed circuit board assembly for normally routing high-speed signals, reducing manufacturing processes and reducing costs. The printed wiring board assembly includes:

a printed wiring board;

pads provided in pairs on the printed wiring board;

a package body;

and the pins are electrically connected to the packaging body, each pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are arranged right opposite to the bonding pads corresponding to the two protruding structures on the printed circuit board.

In some embodiments, the connector includes a plurality of pins, and the two raised structures of each pin are in the same location on each pin.

In some embodiments, the recessed feature is disposed directly opposite a high speed via on the printed wiring board corresponding to the recessed feature.

In some embodiments, the high speed vias are located between the pair of pads.

In some embodiments, the two bump structures and the pair of pads are electrically connected by solder.

Because the current high-speed signal rate is increased, the routing of the PIN part on the surface layer of the high-speed routing in the PCB and the routing of the inner layer are required not to be in the same direction. Conventional connector PINs are packaged on a PCB board with a rectangular PAD for each PIN, and after soldering, the connector PINs are entirely attached to the PADs. The package of the present invention is modified to have a PIN corresponding to two small rectangular PADs, see fig. 1, with a gap between the two PADs.

The PIN of the connector is also designed into a shape that the two ends are thick and the middle is thin, so that even if a via hole is formed in the middle, the problem of tin leakage does not occur during tin coating on the connector. After welding, the PIN feet with thick two ends are attached to two rectangular PADs on the PCB, and then the workpiece feeding is completed.

The packaging method is characterized in that a high-speed line through hole can be formed between two small rectangular PADs on the PCB, and the through hole can be flexibly selected to be connected with the PAD on which side according to various factors such as different wiring spaces, high-speed line trends and connector positions, so that the overlapping of the surface layer wiring direction and the inner layer wiring direction is avoided, as shown in figure 2. Meanwhile, the through hole does not influence tin on the connector, a POFV process does not need to be additionally introduced, and the signal requirement can be met and the cost can be saved.

To create the desired printed wiring board, the present invention first packages the connector into a connector PIN corresponding to two small rectangular PADs, and places the completed connector package in the PCB board according to the structural orientation. Then, various factors such as the starting end position of the high-speed line in the integrated board, the board type and the like plan a high-speed line path, and the high-speed line via hole at the connector is determined to be connected with which PAD to avoid the superposition with the direction of the inner layer high-speed line according to the high-speed line path, so that the surface layer routing is completed. And finally, continuing subsequent wiring according to the layout flow.

As can be seen from the above embodiments, the printed circuit board assembly provided by the embodiments of the present invention is formed by using a printed circuit board; pads provided in pairs on the printed wiring board; a package body; the pin is electrically connected to the packaging body, wherein the pin comprises two protruding structures at two ends and a concave structure for establishing connection between the two protruding structures, and the two protruding structures are right opposite to the technical scheme that the pad pair corresponding to the two protruding structures on the printed circuit board is arranged, so that high-speed signals can be normally wired, the manufacturing process is reduced, and the cost is reduced.

The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments of the present invention.

It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items. The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.

The various illustrative logical blocks, modules, and circuits described in connection with the disclosure herein may be implemented or performed with the following components designed to perform the functions described herein: a general purpose processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination of these components. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP, and/or any other such configuration.

It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.

Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.