阅读说明：本技术 一种半导体材料的平面研磨装置及其使用方法 (Plane grinding device for semiconductor material and using method thereof ) 是由 王永恒 顾在意 彭华新 庄须叶 王卿璞 李�学 于 2021-08-13 设计创作，主要内容包括：本发明公开了一种半导体材料的平面研磨装置,包括研磨装置本体,所述研磨装置本体的侧面固定连接有两个吸尘罩,所述研磨装置本体的侧面固定连接有两个吸尘盒；还公开了此装置的使用方法,包括驱动电机运转的同时通过同步带带动丝杆发生转动,从而带动驱动块上下移动,驱动块不断挤压环形气囊,环形气囊不断向固定盒内泵入气体等。本发明能够防止细小尘粒漂浮在外界空气中,避免细小尘粒对工作人员造成伤害,还能防止细小尘粒对一些精密的电子设备造成损坏,保证研磨工作的正常进行,其次,不仅能够防止滤网堵塞的情况出现,还无需大量水流进行降尘,同时能够保证除尘的效果,也能够对研磨车间内的空气进行净化处理。(The invention discloses a plane grinding device for semiconductor materials, which comprises a grinding device body, wherein two dust hoods are fixedly connected to the side surface of the grinding device body; the use method of the device is further disclosed, and the device comprises the steps that the driving motor rotates and simultaneously drives the screw rod to rotate through the synchronous belt, so that the driving block is driven to move up and down, the driving block continuously extrudes the annular air bag, and the annular air bag continuously pumps gas into the fixed box. The invention can prevent fine dust particles from floating in the outside air, avoid the fine dust particles from injuring workers, prevent the fine dust particles from damaging some precise electronic equipment, and ensure the normal operation of grinding work.)

1. The plane grinding device for the semiconductor materials comprises a grinding device body (1) and is characterized in that two dust hoods (12) are fixedly connected to the side face of the grinding device body (1), two dust boxes (2) are fixedly connected to the side face of the grinding device body (1), communication covers (3) communicated with the interior of the dust boxes (2) are fixedly connected to the side faces of the two dust boxes (2), a plurality of fine needles (11) are fixedly connected to the inner faces, opposite to the communication positions of the two communication covers (3) and the corresponding dust boxes (2), air outlet cylinders (4) are fixedly communicated to the top faces of the two communication covers (3), dust receiving boxes (5) are fixedly communicated to the bottom faces of the two communication covers (3), and the two dust hoods (12) are communicated with the corresponding dust boxes (2) through air pipes;

the inner bottom surfaces of the two dust collection boxes (2) are fixedly provided with driving motors (6), the tail ends of output shafts of the driving motors (6) are fixedly connected with a plurality of axial flow fan blades (7), the axial flow fan blades (7) positioned in the same dust collection box (2) are arranged right opposite to the corresponding air pipe openings, and the inner surfaces of the two dust collection boxes (2) are fixedly connected with two fixing plates (8);

the dust collection box is characterized in that dust collection mechanisms (9) are arranged in the two dust collection boxes (2), and driving assemblies (10) matched with the dust collection mechanisms (9) are further arranged in the two dust collection boxes (2).

2. The plane grinding device for the semiconductor materials and the using method of the plane grinding device are characterized in that the dust removing mechanism (9) comprises a mounting box (91), a fixing box (92), a piece of flannelette (93), two liquid guiding rods (94) and an annular air bag (95), the fixing box (92) is fixedly connected to the side face of the mounting box (91), an opening is formed in the side face of the fixing box (92) in a penetrating mode, the flannelette (93) is bonded to the inner face of the opening, one end of each of the two liquid guiding rods (94) is bonded to the side face of the flannelette (93), the other end of each of the two liquid guiding rods (94) extends into the mounting box (91), the insides of the two mounting boxes (91) are filled with soapy water, and the fixing box (92) is communicated with the annular air bag (95) through a hose.

3. The plane grinding device of the semiconductor material and the using method thereof as claimed in claim 1, wherein the driving assembly (10) comprises a screw rod (101) and a driving block (102), the screw rod (101) is installed between the two fixing plates (8), two ends of the screw rod (101) are respectively connected with the mutually close side surfaces of the two fixing plates (8) in a rotating way, the driving block (102) is sleeved on the screw rod (101) in a threaded way, the screw rod (101) is connected with the output shaft of the driving motor (6) in a transmission way through a synchronous belt, and the mounting box (91) is fixedly connected with the side surface of the driving block (102);

the top surface of the annular air bag (95) is bonded to the side surface of one of the fixing plates (8), and the bottom surface of the annular air bag (95) is bonded to the top surface of the driving block (102).

4. A flat grinder for semiconductor materials, according to claim 3, wherein the two drive blocks (102) are attached at their sides to the inner surfaces of the two suction boxes (2).

5. A device for plane grinding of semiconductor material as defined in claim 2, wherein each of said four liquid-guiding bars (94) is made of a material having liquid-absorbing properties.

6. A flat grinder for semiconductor materials, as in claim 1, characterized by the fact that a plurality of said fine needles (11) are uniformly distributed on the inner face of the corresponding communicating hood (3).

7. A device for plane polishing of semiconductor material according to any of claims 1 to 6, used in the following way:

the worker starts the driving motor (6), the driving motor (6) drives the axial flow fan blades (7) to rotate when running, and the axial flow fan blades (7) suck outside air and fine dust particles into the dust collection box (2) in the rotating process;

the driving motor (6) drives the screw rod (101) to rotate through the synchronous belt while running, so that the driving block (102) is driven to move up and down, the driving block (102) continuously extrudes the annular air bag (95), and the annular air bag (95) continuously pumps gas into the fixed box (92);

the two liquid guide rods (94) guide soapy water in the mounting box (91) into the lint (93), a large number of bubbles are generated when gas passes through the lint (93), air doped with fine dust particles is in contact with the bubbles, and the fine dust particles are attached to the surfaces of the bubbles;

the bubbles with fine dust particles attached to the surfaces float upwards and enter the inside of the communicating cover (3), the bubbles are contacted with a plurality of fine needles (11) in the communicating cover (3), the bubbles are punctured, and the fine dust particles fall down along with small liquid beads formed when the bubbles are cracked and fall into the inside of the dust receiving box (5).

Technical Field

The invention relates to the technical field of semiconductor material processing, in particular to a plane grinding device for a semiconductor material and a using method thereof.

Background

Semiconductor materials are a class of electronic materials that have semiconductor properties and can be used to fabricate semiconductor devices and integrated circuits.

When a semiconductor chip is processed, raw materials of the semiconductor chip need to be ground, different chips have different requirements on thickness, the raw materials of the semiconductor chip need to be fixed well and can be stably ground, the semiconductor material can generate fine dust particles similar to dust in the grinding process, the fine dust particles float in the air and are not only easily sucked into the body by workers operating equipment, but also adhere to some precise electronic components of the equipment and are easily affected to the normal work of the equipment, so a dust suction device is required to absorb and treat the fine dust particles in the grinding process, the dust suction device in the prior art mainly filters the fine dust particles doped in the air through a filter screen, but the filter screen is easily blocked after being used for a long time, and the dust suction device plays a dust fall effect through water mist, which wastes water resources, further, since the dust-falling effect is limited, it is necessary to design a surface polishing apparatus for a semiconductor material and a method for using the same to solve the above problems.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a plane grinding device for semiconductor materials and a using method thereof.

In order to achieve the purpose, the invention adopts the following technical scheme:

a plane grinding device for semiconductor materials comprises a grinding device body, wherein two dust hoods are fixedly connected to the side face of the grinding device body, two dust boxes are fixedly connected to the side face of the grinding device body, communicating covers communicated with the interior of the dust boxes are fixedly connected to the side faces of the two dust boxes, a plurality of fine needles are fixedly connected to the inner faces, opposite to the communicating positions of the corresponding dust boxes, of the two communicating covers, air outlet barrels are fixedly communicated with the top faces of the two communicating covers, dust receiving boxes are fixedly communicated with the bottom faces of the two communicating covers, and the two dust hoods are communicated with the corresponding dust boxes through air pipes;

the inner bottom surfaces of the two dust collection boxes are fixedly provided with driving motors, the tail ends of output shafts of the driving motors are fixedly connected with a plurality of axial flow fan blades, the axial flow fan blades positioned in the same dust collection box are arranged right opposite to the corresponding air pipe openings, and the inner surfaces of the two dust collection boxes are fixedly connected with two fixing plates;

the dust collection box comprises two dust collection boxes, and is characterized in that a dust removal mechanism is arranged in each of the two dust collection boxes, and a driving assembly matched with the dust removal mechanism is further arranged in each of the two dust collection boxes.

As a preferable technical scheme, the dust removal mechanism comprises a mounting box, a fixing box, a piece of lint, two liquid guide rods and an annular air bag, wherein the fixing box is fixedly connected to the side face of the mounting box, an opening is formed in the side face of the fixing box in a penetrating mode, the lint is adhered to the inner face of the opening, one end of each of the two liquid guide rods is adhered to the side face of the lint, the other end of each of the two liquid guide rods extends into the mounting box, soapy water is filled in the mounting boxes, and the fixing box is communicated with the annular air bag through a hose.

As a preferred technical scheme of the invention, the driving assembly comprises a screw rod and a driving block, the screw rod is installed between two fixing plates, two ends of the screw rod are respectively rotatably connected with the mutually close side surfaces of the two fixing plates, the driving block is sleeved on the screw rod in a threaded manner, the screw rod is in transmission connection with an output shaft of a driving motor through a synchronous belt, and the mounting box is fixedly connected with the side surface of the driving block;

the top surface of the annular air bag is bonded on the side surface of one of the fixing plates, and the bottom surface of the annular air bag is bonded on the top surface of the driving block.

As a preferable technical solution of the present invention, the side surfaces of the two driving blocks are respectively attached to the inner surfaces of the two dust boxes.

As a preferable technical solution of the present invention, the four liquid guiding rods are made of a material having liquid absorbing performance.

In a preferred embodiment of the present invention, the plurality of fine needles are uniformly distributed on the inner surface of the corresponding communication cover.

A plane grinding device for semiconductor materials is used by the following method:

the worker starts the driving motor, the driving motor drives the plurality of axial flow fan blades to rotate when running, and the plurality of axial flow fan blades suck outside air and fine dust particles into the dust collection box in the rotating process;

the driving motor drives the screw rod to rotate through the synchronous belt while running, so that the driving block is driven to move up and down, the driving block continuously extrudes the annular air bag, and the annular air bag continuously pumps air into the fixed box;

the two liquid guide rods guide soapy water in the mounting box into the lint, a large number of bubbles are generated when gas passes through the lint, air doped with fine dust particles is in contact with the bubbles, and the fine dust particles are attached to the surfaces of the bubbles;

the bubbles with fine dust particles attached to the surfaces float upwards and enter the inside of the communicating cover, the bubbles are in contact with the fine needles in the communicating cover, the bubbles are punctured, and the fine dust particles fall down along with small liquid beads formed when the bubbles break and fall into the inside of the dust receiving box.

The invention has the following beneficial effects:

1. by arranging the driving motor and the axial flow fan blades, the driving motor can drive the axial flow fan blades to rotate when running, and the axial flow fan blades can suck outside air into the dust collection box in the rotating process, so that fine dust particles generated in the grinding process can be sucked into the dust collection box by the dust collection cover, the fine dust particles are prevented from floating in the outside air, the fine dust particles are prevented from injuring workers, the fine dust particles can be prevented from damaging some precise electronic equipment, and the normal operation of grinding work is ensured;

2. through setting up dust removal mechanism and drive assembly, the operation that accompanies driving motor, the drive block can be continuous reciprocates, make produce a large amount of bubbles in the dust absorption box, when the air that has tiny dirt particle contacts with these bubbles, tiny dirt particle can attach to the surface at the bubble, thereby reach the effect of the tiny dirt particle of doping in the deaerate, when the bubble contacts with a plurality of thin needles that communicate in the cover, the bubble can be stabbed, these tiny dirt particles can fall down along with the little liquid pearl that forms when the bubble breaks this moment, and finally fall into the inside that connects the dirt box, thereby play the effect of dust removal dust fall, adopt this kind of mode, not only can prevent that the condition of filter screen jam from appearing, still need not a large amount of rivers and carry out the dust fall, the effect of dust removal can be guaranteed simultaneously, also can carry out purification treatment to the air in the grinding workshop.

Drawings

FIG. 1 is a schematic structural diagram of a flat polishing apparatus for semiconductor materials and a method for using the same according to the present invention;

FIG. 2 is a schematic view of the interior of a dust suction box of a flat polishing apparatus for semiconductor materials and a method for using the same according to the present invention;

fig. 3 is a schematic structural diagram of a flat polishing apparatus for semiconductor materials and a dust removing mechanism using the same according to the present invention.

In the figure: the grinding device comprises a grinding device body 1, a dust collection box 2, a communication cover 3, an air outlet cylinder 4, a dust collection box 5, a driving motor 6, an axial flow fan blade 7, a fixing plate 8, a dust collection mechanism 9, a mounting box 91, a fixing box 92, lint 93, a liquid guide rod 94, an annular air bag 95, a driving assembly 10, a screw rod 101, a driving block 102, a fine needle 11 and a dust collection cover 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-3, a plane grinding device for semiconductor materials, comprising a grinding device body 1, two dust hoods 12 fixedly connected to the side of the grinding device body 1, wherein each dust hood 12 has a funnel-shaped structure to facilitate the suction of the outside air into the two dust boxes 2, two dust boxes 2 fixedly connected to the side of the grinding device body 1, a communication hood 3 communicated with the inside of the dust box 2 is fixedly connected to the side of each dust box 2, a plurality of fine needles 11 are fixedly connected to the inner surfaces of the two communication hoods 3 opposite to the communication positions of the corresponding dust boxes 2, air outlet cylinders 4 are fixedly communicated with the top surfaces of the two communication hoods 3, further, filter screens can be mounted on the inner surfaces of the two air outlet cylinders 4 to enable the dust in the outside air and other magazines to enter the inside of the two communication hoods 3 through the two air outlet cylinders 4, dust collecting boxes 5 are fixedly communicated with the bottom surfaces of the two communication hoods 3, the two dust hoods 12 are communicated with the corresponding dust boxes 2 through air pipes;

the inner bottom surfaces of the two dust collection boxes 2 are fixedly provided with driving motors 6, the tail ends of output shafts of the driving motors 6 are fixedly connected with a plurality of axial flow fan blades 7, the axial flow fan blades 7 positioned on the same driving motor 6 are distributed in a circumferential equidistant manner, and the axial flow fan blades 7 positioned in the same dust collection box 2 are arranged right opposite to the corresponding air pipe orifices, so that the axial flow fan blades 7 can suck outside air into the dust collection boxes 2 when rotating, and the inner surfaces of the two dust collection boxes 2 are fixedly connected with two fixing plates 8;

the two dust collection boxes 2 are respectively provided with a dust removal mechanism 9, and the two dust collection boxes 2 are also provided with a driving assembly 10 matched with the dust removal mechanisms 9.

Referring to fig. 1-2, the dust removing mechanism 9 includes a mounting box 91, a fixing box 92, a lint 93, two liquid guiding rods 94 and an annular air bag 95, the fixing box 92 is fixedly connected to a side surface of the mounting box 91, an opening is formed in the side surface of the fixing box 92 in a penetrating mode, the lint 93 is bonded to the inner surface of the opening, the lint 93 can be made of breathable cloth with good water absorption performance, one ends of the two liquid guiding rods 94 are bonded to the side surface of the lint 93, the other ends of the two liquid guiding rods 94 extend into the mounting box 91, soapy water is filled into the two mounting boxes 91, molecules in the soapy water are molecules with a hydrophobic section and a hydrophilic end, surface tension of the solution can be greatly reduced after the soapy water is mixed into the molecules, and the fixing box 92 and the annular air bag 95 are communicated with each other through a hose.

Referring to fig. 2, the driving assembly 10 includes a screw rod 101 and a driving block 102, the screw rod 101 is installed between the two fixing plates 8, two ends of the screw rod 101 are rotatably connected with the mutually adjacent side surfaces of the two fixing plates 8, the driving block 102 is sleeved on the screw rod 101 in a threaded manner, the screw rod 101 is connected with an output shaft of the driving motor 6 through a synchronous belt in a transmission manner, and the mounting box 91 is fixedly connected with the side surface of the driving block 102;

the top surface of the annular air bag 95 is bonded to the side surface of one of the fixing plates 8, and the bottom surface of the annular air bag 95 is bonded to the top surface of the driving block 102.

Referring to fig. 2, the side surfaces of the two driving blocks 102 are respectively attached to the inner surfaces of the two dust boxes 2, so that the driving blocks 102 are prevented from being driven to rotate when the screw rod 101 rotates, and the driving blocks 102 can only move up and down along the screw rod 101.

Referring to fig. 3, each of the four liquid-guiding rods 94 is made of a material having liquid-absorbing properties, and may be a sponge material or the like.

Referring to fig. 2, a plurality of fine needles 11 are uniformly distributed on the inner surface of the corresponding communication cover 3, so that air bubbles in the communication cover 3 can be completely punctured by the fine needles 11.

A plane grinding device for semiconductor materials is used by the following method:

the worker starts the driving motor 6, the driving motor 6 drives the plurality of axial flow fan blades 7 to rotate when running, and the plurality of axial flow fan blades 7 suck outside air and fine dust particles into the dust collection box 2 in the rotating process;

the driving motor 6 drives the screw rod 101 to rotate through the synchronous belt while running, so as to drive the driving block 102 to move up and down, the driving block 102 continuously extrudes the annular air bag 95, and the annular air bag 95 continuously pumps gas into the fixed box 92;

the two liquid guide rods 94 guide the soapy water in the mounting box 91 into the lint 93, a large amount of bubbles are generated when the gas passes through the lint 93, the air doped with fine dust particles is in contact with the bubbles, and the fine dust particles are attached to the surfaces of the bubbles;

the bubbles attached with fine dust particles on the surface float upwards and enter the inside of the communicating cover 3, the bubbles are contacted with the plurality of fine needles 11 in the communicating cover 3, the bubbles are punctured, and the fine dust particles fall down along with small liquid beads formed when the bubbles break and fall into the inside of the dust receiving box 5.

In the present invention, since the structures of the absorption cover 12, the dust box 2, and the connection cover 3 on both sides of the polishing apparatus body 1 are completely the same, only one of the structures on both sides of the polishing apparatus body 1 will be specifically described here: at the in-process that uses grinder body 1 to grind semiconductor material, the staff can start driving motor 6, driving motor 6 can drive a plurality of axial fan blade 7 when moving and take place to rotate, a plurality of axial fan blade 7 can inhale the inside of dust collection box 2 to the outside air at the pivoted in-process, so, the tiny dust particle that produces among the grinding process can be inhaleed the inside of dust collection box 2 by suction hood 12, prevent that tiny dust particle from floating in the outside air.

The driving motor 6 can also drive the screw rod 101 to rotate through the synchronous belt when in operation, because the side of the driving block 102 is attached to the inner surface of the dust collection box 2, the driving block 102 cannot be driven to rotate in the rotating process of the screw rod 101, so that the driving block 102 can move up and down along the screw rod 101, the driving block 102 can continuously extrude the annular air bag 95 in the up and down moving process, and the annular air bag 95 can continuously pump air into the fixed box 92.

Because one end of each of the two liquid guiding rods 94 is connected with the lint 93 and the other end thereof extends into the mounting box 91 filled with soapy water, under the liquid absorbing capacity of the two liquid guiding rods 94, the soapy water in the mounting box 91 permeates into the lint 93 along the two liquid guiding rods 94, so that the lint 93 is full of the soapy water, when the annular air bag 95 pumps air towards the inside of the fixing box 92, the air is blown out through the lint 93 soaked with the soapy water, the molecules in the soap are molecules with a hydrophobic section and a hydrophilic end, the surface tension of the solution is greatly reduced after being mixed with the water, when the air is blown out through the lint 93, the air does not have enough tension to pull the surface of the soap water solution to break the surface, a large number of bubbles can be formed on the surface of the lint 93 and can escape towards the inside of the dust absorption box 2, similar to the principle of using soap water blowing bubbles, when the air doped with fine dust particles contacts with the bubbles, the fine dust particles can be attached to the surfaces of the air bubbles, so that the effect of removing the fine dust particles doped in the air is achieved, and the fine dust particles doped in the air can be fully removed in the mode due to the large contact area between a large number of air bubbles and the air.

Under the air current effect that a plurality of axial fan blades 7 produced, the surface attachment has the bubble of tiny dirt particle to upwards float, and enter the inside of intercommunication cover 3, when the bubble contacts with a plurality of thin needles 11 in the intercommunication cover 3, the bubble can be stabbed, these tiny dirt particles can fall down along with the little liquid bead that forms when the bubble breaks this moment, and finally fall into the inside that connects dirt box 5, and clean air then can flow from the inside of intercommunication cover 3 through play chimney 4, thereby play the effect of dust removal dust fall, adopt this kind of mode, not only can prevent that the condition of filter screen jam from appearing, still need not a large amount of rivers and carry out the dust fall, can guarantee the effect of dust removal simultaneously.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.