阅读说明：本技术 一种支撑组件、显示模组和电子设备 (Supporting component, display module and electronic equipment ) 是由 张玉军 郭宁 于 2021-09-02 设计创作，主要内容包括：本申请实施例提供了一种支撑组件、显示模组和电子设备。其中,该支撑组件包括：支撑板、第一胶层、基材和第二胶层；支撑板、第一胶层、基材和第二胶层自下而上堆叠设置；基材与支撑板通过第一胶层贴合,支撑组件用于通过第二胶层与其他结构贴合,组成折叠屏设备的显示模组；支撑组件包括弯折区,支撑组件用于在弯折区产生弯折,支撑组件在弯折区设置有多个第一开孔,多个第一开孔沿着支撑板、第一胶层、基材和第二胶层的堆叠方向至少贯穿支撑板和基材。本申请实施例提供的支撑组件,通过第一开孔减小了支撑组件弯折时的内应力和支撑组件作用到显示模组其他结构上的内应力,因此显示模组在弯折后不会产生peeling现象,提高了显示模组的可靠性。(The embodiment of the application provides a supporting component, a display module and electronic equipment. Wherein, this supporting component includes: the adhesive tape comprises a supporting plate, a first adhesive layer, a base material and a second adhesive layer; the supporting plate, the first adhesive layer, the base material and the second adhesive layer are stacked from bottom to top; the base material is attached to the supporting plate through the first adhesive layer, and the supporting assembly is attached to other structures through the second adhesive layer to form a display module of the folding screen device; the supporting component comprises a bending area, the supporting component is used for bending in the bending area, a plurality of first openings are formed in the bending area, and at least the supporting plate and the base material penetrate through the plurality of first openings along the stacking direction of the supporting plate, the first adhesive layer, the base material and the second adhesive layer. The supporting component that this application embodiment provided has reduced the internal stress when supporting component buckles and the internal stress that supporting component used other structures of display module assembly through first trompil, consequently display module assembly can not produce the peeling phenomenon after buckling, has improved display module assembly's reliability.)

1. A support assembly, comprising:

the adhesive tape comprises a supporting plate, a first adhesive layer, a base material and a second adhesive layer;

the supporting plate, the first adhesive layer, the base material and the second adhesive layer are stacked from bottom to top;

the base material is attached to the supporting plate through the first adhesive layer, and the supporting assembly is attached to other structures through the second adhesive layer to form a display module of the folding screen device;

the supporting component comprises a bending area, the supporting component is used for bending the bending area, the supporting component is provided with a plurality of first holes which are distributed in an array mode at intervals, and the first holes at least penetrate through the supporting plate and the substrate along the stacking direction of the supporting plate, the first glue layer, the substrate and the second glue layer.

2. The support assembly of claim 1, wherein a plurality of the first openings extend through the support plate, the first glue layer, the substrate, and the second glue layer along the stacking direction.

3. The support assembly of claim 1, wherein a plurality of the first apertures are disposed on and extend through the support plate and the substrate along the stacking direction.

4. The support assembly of any of claims 1-3,

the first opening is a strip-shaped hole, and the length direction of the first opening is parallel to the bent axial lead of the support component;

the first openings are distributed in a spaced array along a direction parallel to the axis and a direction perpendicular to the axis.

5. The support assembly of claim 4,

the support component is also provided with a plurality of second openings in the bending area, and the second openings are distributed in an array at intervals;

the second holes are arranged on the surface, back to the first adhesive layer, of the support plate, and a certain depth H is formed along the stacking direction, and the depth H is smaller than the thickness B of the support plate in the stacking direction.

6. The support assembly of claim 5,

the second open pore is a strip-shaped pore, and the length direction of the second open pore is parallel to the axial lead;

the second opening hole continuously extends from one side end face of the supporting plate to the other side end face along the axial lead direction;

the second openings are distributed in a spaced array along a direction perpendicular to the axis.

7. The support assembly of any of claims 1-6,

the bending area comprises an inner bending area, the supporting assembly is used for bending the inner bending area towards the second glue layer, and the first holes are formed in the inner bending area in a plurality of modes.

8. The support assembly of claim 5 or 6,

the bending area comprises an outward bending area, the supporting component is used for bending towards the supporting layer direction in the outward bending area, and the plurality of second openings are formed in the outward bending area.

9. The support assembly of any of claims 1-8,

the first adhesive layer and the second adhesive layer are both pressure-sensitive adhesives.

10. A display module, comprising:

the support assembly of any of claims 1-9, display panel, third adhesive layer, first protective layer, fourth adhesive layer, and second protective layer;

the supporting assembly, the display panel, the third adhesive layer, the first protective layer, the fourth adhesive layer and the second protective layer are stacked from bottom to top;

the display panel with supporting component's substrate passes through the laminating of second glue film, first protective layer with display panel passes through the laminating of third glue film, the second protective layer with first protective layer passes through the laminating of fourth glue film.

11. The display module of claim 10,

the display panel is an Organic Light Emitting Diode (OLED) display panel.

12. The display module according to claim 10 or 11,

the third glue layer and the fourth glue layer are both optical glue.

13. The display module according to any one of claims 10-12,

the first protective layer is a polarizing layer, and the second protective layer is ultrathin glass or a transparent polyimide film.

14. An electronic device comprising one or more display modules, wherein at least one display module is the display module according to any one of claims 10-13.

Technical Field

The application relates to the technical field of display screens, in particular to a supporting component, a display module and electronic equipment.

Background

In recent years, the display screen technology of electronic devices has been developed rapidly, and particularly, the generation of flexible screens enables the electronic devices to develop more product forms, wherein a folding screen device is a product form emerging at present. At present, a display module of a folding screen device has a multilayer stack structure, which may include a support plate, a substrate, a display panel and at least one protective layer in sequence from bottom to top, wherein the support plate, the substrate, the display panel and the at least one protective layer are attached together through an adhesive layer (e.g., an Optical Clear Adhesive (OCA), a Pressure Sensitive Adhesive (PSA), etc.).

The display module assembly comprises at least one bending area, and the display module assembly is used for bending in the bending area to realize opening and closing of the body of the folding screen equipment. When the display module is bent, each layer structure can generate internal stress due to deformation and interaction. Under the effect of internal stress, original laminating state can be destroyed between each layer structure of display module assembly, leads to producing structure between some layers and peels off (peeling), leads to the display module assembly to appear the die stamping or damage.

Disclosure of Invention

The embodiment of the application provides a supporting component, display module assembly and electronic equipment to reduce the internal stress that the display module assembly of folding screen equipment produced when buckling, avoid the peeling phenomenon, improve the reliability of display module assembly.

In a first aspect, an embodiment of the present application provides a support assembly, including: the adhesive tape comprises a supporting plate, a first adhesive layer, a base material and a second adhesive layer; the supporting plate, the first adhesive layer, the base material and the second adhesive layer are stacked from bottom to top; the base material is attached to the supporting plate through the first adhesive layer, and the supporting assembly is attached to other structures through the second adhesive layer to form a display module of the folding screen device; the supporting component comprises a bending area, the supporting component is used for bending in the bending area, a plurality of first openings are formed in the bending area and distributed in an array mode at intervals, and the supporting plate and the base material are at least penetrated through the first openings along the stacking direction of the supporting plate, the first adhesive layer, the base material and the second adhesive layer.

The supporting component that this application embodiment provided, through the mode that sets up first trompil, at least to backup pad and substrate hollowing out the processing, internal stress and the supporting component internal stress of using other structures of display module assembly when having reduced the supporting component and buckling. Consequently, the laminating state between each layer structure of display module assembly can not destroyed by the internal stress, and display module assembly can not produce the peeling phenomenon after buckling, has improved display module assembly's reliability.

In one implementation, the plurality of first openings penetrate through the support plate, the first adhesive layer, the substrate and the second adhesive layer along the stacking direction. Like this, first trompil runs through whole supporting component along piling up the direction, has reduced the internal stress of backup pad, first glue film, substrate and second glue film when buckling effectively.

In one implementation, a plurality of first openings are disposed on the support plate and the substrate and penetrate the support plate and the substrate along the stacking direction. Like this first trompil only runs through backup pad and substrate along piling up the direction, and first glue film and second glue film still keep complete structure, need not the trompil, are favorable to reducing the processing degree of difficulty of supporting component when reducing the supporting component internal stress.

In one implementation mode, the first open hole is a strip-shaped hole, and the length direction of the first open hole is parallel to the axis line of the bending of the support component; the first openings are distributed at intervals in an array along the direction parallel to the axis and the direction vertical to the axis. The strip-shaped hole can form a larger hollowed area on the supporting component, so that a larger deformation space is provided for materials such as supporting plates and base materials, the bending performance of the materials such as the supporting plates and the base materials is improved, and the internal stress during bending is reduced.

In one implementation mode, the support component is further provided with a plurality of second openings in the bending area, and the plurality of second openings are distributed in an array at intervals; the second holes are arranged on the surface, back to the first glue layer, of the support plate, and a certain depth H is formed along the stacking direction and is smaller than the thickness B of the support plate in the stacking direction. Like this, the second trompil can be in the regional hollowing out of first trompil processing of realizing the backup pad, is favorable to improving the regional bending performance of backup pad outside first trompil, internal stress when reducing to buckle.

In one implementation mode, the second open hole is a strip-shaped hole, and the length direction of the second open hole is parallel to the axis; the second opening continuously extends from one side end face of the support plate to the other side end face along the axial lead direction; the second openings are distributed at intervals in an array along the direction perpendicular to the axis. The bar hole can form bigger hollowed area in the backup pad, is favorable to providing bigger deformation space for the backup pad, improves the bending performance of backup pad, internal stress when reducing to buckle.

In an implementation mode, the bending area comprises an inner bending area, the supporting assembly is used for bending towards the second glue layer in the inner bending area, and the plurality of first openings are formed in the inner bending area.

In one implementation, the bending region includes an outer bending region, the support assembly is configured to bend toward the support layer in the outer bending region, and the plurality of second openings are disposed in the outer bending region.

In one implementation, the first adhesive layer and the second adhesive layer are both pressure sensitive adhesives.

In a second aspect, an embodiment of the present application provides a display module, which includes: the display panel comprises a support assembly, a display panel, a third adhesive layer, a first protective layer, a fourth adhesive layer and a second protective layer, wherein the support assembly, the display panel, the third adhesive layer, the first protective layer, the fourth adhesive layer and the second protective layer are provided in the first aspect and various implementation manners of the first aspect; the supporting assembly, the display panel, the third adhesive layer, the first protective layer, the fourth adhesive layer and the second protective layer are stacked from bottom to top; the display panel is attached to the base material of the supporting component through the second adhesive layer, the first protective layer is attached to the display panel through the third adhesive layer, and the second protective layer is attached to the first protective layer through the fourth adhesive layer.

The display module assembly that this application embodiment provided has less stress when buckling, consequently, the laminating state between each layer structure of display module assembly can not destroyed by the internal stress, and display module assembly can not produce the peeling phenomenon after buckling, has improved display module assembly's reliability.

In one implementation, the display panel is an Organic Light Emitting Diode (OLED) display panel.

In one implementation, the third adhesive layer and the fourth adhesive layer are both optical adhesives.

In one implementation, the first protective layer is a polarizing layer and the second protective layer is ultra-thin glass or a transparent polyimide film.

In a third aspect, an embodiment of the present application provides an electronic device, where the electronic device includes one or more display modules, where at least one display module is a display module provided in the second aspect and each implementation manner of the second aspect.

Drawings

Fig. 1 is a schematic structural diagram of a folding screen device according to an embodiment of the present application;

fig. 2 is a schematic diagram of a display module according to an embodiment of the present disclosure after being unfolded;

fig. 3 is a schematic view of a display module of the folding screen apparatus in a folded state of the body according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a display module of a foldable screen device;

FIG. 5 is a schematic structural view of a support assembly provided in accordance with a first embodiment of the present application;

fig. 6 is a schematic diagram of a pattern of a hollow structure provided in an embodiment of the present application;

FIG. 7 is a schematic structural view of a support assembly provided in accordance with a second embodiment of the present application;

fig. 8 is a schematic structural diagram of a display module according to a third embodiment of the present application;

fig. 9 is a schematic view of a simulation bending test of a display module according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a display module according to a fourth embodiment of the present application.

Illustration of the drawings:

10-a body, 11-a display screen, 21-a support plate, 22-a display panel, 23-a cover plate, 31-a bending area, 32-a plane area, 41-an inward bending area, 42-an outward bending area, 51-a support plate, 52-a base material, 53-a display panel, 54-a first protective layer, 55-a second protective layer, 56-a pressure-sensitive adhesive, 57-a pressure-sensitive adhesive, 58-an optical adhesive, 59-an optical adhesive, 100-a support plate, 200-a first adhesive layer, 300-a base material, 400-a second adhesive layer, 510-a first opening, 520-a second opening, 610-a display panel, 620-a third adhesive layer, 630-a first protective layer, 640-a fourth adhesive layer and 650-a second protective layer.

Detailed Description

In recent years, the display screen technology of electronic devices has been developed rapidly, and particularly, the generation of flexible screens enables the electronic devices to develop more product forms, wherein a folding screen device is a product form emerging at present.

At present, folding screen equipment can be divided into inner folding screen equipment and outer folding screen equipment according to the difference of display module assembly folding direction. Fig. 1 is a schematic structural diagram of a folding screen device according to an embodiment of the present application. Wherein, the structure a in fig. 1 is a schematic structural view of the inner folding screen device, and the structure b in fig. 1 is a schematic structural view of the outer folding screen device. As shown in a structure a of fig. 1, the internal folding screen device means that a main body 10 of the electronic device can be folded toward a display module 11, and the display module 11 is hidden inside the main body 10 of the electronic device after the main body 10 of the electronic device is folded, thereby forming an effect that the display module 11 is hidden when the main body 10 is folded and appears when the main body 10 is unfolded; as shown in a structure b in fig. 1, the external folding screen device means that the main body 10 of the electronic device can be folded toward the back side of the main body 10, and the display module 11 surrounds the outside of the main body 10 of the electronic device after the main body 10 of the electronic device is folded, so that the display module 11 surrounds the main body 10 in a folded state of the main body 10 to form a surrounding screen, and the main body 10 presents a normal straight screen effect in an unfolded state.

Fig. 2 is a schematic diagram of a display module according to an embodiment of the present application after being unfolded. As shown in fig. 3, the display module may include at least one bending region 31, and the region outside the bending region 31 is a planar region 32. The bending area 31 is an area where the display module is bent when the body of the folding screen device is folded, and the flat area 32 is an area where the display module is not bent when the body of the folding screen device is folded. The number of bending zones 31 is determined by the number of folds of the body of the folding screen device, and the display module may comprise one bending zone 31 if the body of the folding screen device is folded only once (i.e. a single folding screen device), or two bending zones 31 if the body of the folding screen device is folded twice (i.e. a double folding screen device). As an example, the display module shown in fig. 2 includes a bending region 31, and flat regions 32 are located at left and right sides of the bending region 31 for implementing left and right bending of the body of the folding screen apparatus. The number of the bending regions 31 of the display module is not within the scope of the discussion of the embodiments of the present application, and therefore, the following description is not too extensive.

Fig. 3 is a schematic view of a display module of the foldable screen device in a folded state of the main body 10, taking the foldable screen device as an example. As shown in fig. 3, in the folded state of the fuselage 10, the bending zones may form an inflected zone 41 and an inflected zone 42 at different positions. The inward bending region 41 is a region where the display module is bent toward a side where an image is displayed, and the outward bending region 42 is a region where the display module is bent toward a side of the support plate. The bending region can specifically form the inward bending region 41 or the outward bending region 42, and the distribution of the inward bending region 41 and the outward bending region 42 may be different in different folding screen apparatuses, depending on the bending direction of the fuselage 10 and the structural design of the technician, which is not limited in the embodiment of the present application.

Fig. 4 is a schematic structural diagram of a display module of a conventional foldable screen device. As shown in fig. 4, the display module of the folding screen apparatus has a multi-layer stack structure, which may include a support plate 51, a base material 52, a display panel 53, a first protective layer 54, and a second protective layer 55 in this order from bottom to top. Wherein: the supporting board 51 may be, for example, a TA4 titanium alloy plate, the substrate 52 may be, for example, a polyimide PI substrate, the display panel 53 may be, for example, an Organic Light-Emitting Diode (OLED) display panel, the first protective layer 54 may be, for example, a polarizing layer Polarizer, and the second protective layer 55 may be, for example, a cover plate. Further, a pressure sensitive adhesive 56 is arranged between the support plate 51 and the base material 52, and the support plate 51 and the base material 52 are adhered together through the pressure sensitive adhesive 56; a pressure-sensitive adhesive 57 is arranged between the base material 52 and the display panel 53, and the base material 52 and the display panel 53 are adhered together through the pressure-sensitive adhesive 57; an optical adhesive 58 is arranged between the display panel 53 and the first protective layer 54, and the display panel 53 and the first protective layer 54 are adhered together through the optical adhesive 58; an optical adhesive 59 is disposed between the first protective layer 54 and the second protective layer 55, and the first protective layer 54 and the second protective layer 55 are bonded together by the optical adhesive 59. Generally, in actual production, the structure of the supporting plate 51/pressure-sensitive adhesive 56/substrate 52/pressure-sensitive adhesive 57 is usually present as a single component, and for the convenience of description, this component will be referred to as a supporting component.

As further shown in fig. 4, in order to reduce the internal stress of the display module during bending, the supporting plate 51 of the display module is hollowed out in the bending region. Although the hollowing treatment of the supporting plate 51 can reduce the internal stress of the display module during bending to a certain extent, the internal stress of the display module during bending is still large from the practical test, wherein the internal stress borne by the optical cement 58 between the display panel 53 and the first protective layer 54 is the largest, so that the optical cement 58 is easily peeled off from the attaching state with the display panel 53 and the first protective layer 54, peeling is generated, and the display module is stamped or damaged.

The following is a first embodiment of the present application.

The first embodiment of this application provides a supporting component, and this supporting component can further reduce the internal stress when the display module assembly buckles, avoids the peeling to produce. Fig. 5 is a schematic structural diagram of a support assembly according to a first embodiment of the present application. As shown in fig. 5, the support assembly includes: the adhesive tape comprises a support plate 100, a first adhesive layer 200, a substrate 300 and a second adhesive layer 400, wherein the support plate 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 are stacked from bottom to top. Specifically, the method comprises the following steps:

the supporting plate 100 may be a lowermost layer of the supporting assembly, and is generally made of a high modulus plate material, such as TA4 titanium alloy, stainless steel, polyvinyl alcohol (PVA) high modulus fiber, or other materials with certain plasticity and rigidity, and the supporting plate 100 is used for supporting and maintaining the shape of the display module in various opening and closing states of the body of the folding screen device.

The first adhesive layer 200 is disposed on the supporting plate 100, and the first adhesive layer 200 may be an adhesive layer formed by a pressure sensitive adhesive or an adhesive layer formed by an optical adhesive.

The substrate 300 is disposed on the first adhesive layer 200, and the substrate 300 is attached to the supporting board 100 through the first adhesive layer 200. The substrate 300 may be, for example, a mylar PET or polyimide PI substrate. The substrate 300 is used as a connecting structure between the supporting component and other structures of the display module, and the surface facing the supporting plate 100 is attached to the supporting plate 100 through the first adhesive layer 200, and the surface facing away from the supporting plate 100 is used for attaching to other structures (e.g., a display panel) of the display module.

The second adhesive layer 400 is disposed on the substrate 300, and the second adhesive layer 400 may be an adhesive layer formed by a pressure sensitive adhesive or an adhesive layer formed by an optical adhesive. The supporting component is used for being attached together with other structures of the display module through the second glue layer 400 to form the complete display module of the folding screen device.

In the embodiment of the present disclosure, the first adhesive layer 200 is disposed on the surface of the substrate 300 facing the supporting plate 100, and the second adhesive layer 400 is disposed on the surface of the substrate 300 opposite to the supporting plate 100, so that the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 actually form a double-sided adhesive structure, and the supporting plate 100 and the other structures of the display module can be regarded as being attached together by the double-sided adhesive.

In a specific implementation, the first adhesive layer 200 and the second adhesive layer 400 may be coated or bonded on two sides of the substrate 300 to form a double-sided adhesive tape, and then the double-sided adhesive tape is attached to the support plate 100; or the first adhesive layer 200 may be coated or adhered on the support plate 100, then the substrate 300 is attached to the first adhesive layer 200, and finally the second adhesive layer 400 is coated or adhered on the surface of the substrate 300 opposite to the support plate 100.

As further shown in fig. 5, the supporting assembly provided in the embodiment of the present application is further provided with a hollow structure. The cutout structure can be disposed in a bending region of the support member, for example. The hollow structure at least includes a plurality of first openings 510, and the plurality of first openings 510 are distributed in an array at intervals in the bending region of the support assembly.

In the embodiment of the present application, the first opening 510 may be a through hole, disposed on the supporting board 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400, and sequentially penetrates through the supporting board 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 along the stacking direction (which may be a direction perpendicular to the supporting board 100) of the supporting board 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400, so as to penetrate through the entire supporting assembly. In this way, in the bending region of the supporting component, the supporting plate 100, the first adhesive layer 200, the substrate 300, and the second adhesive layer 400 of the supporting component are all subjected to material removal through the first opening 510, so that the internal stress of the supporting plate 100, the first adhesive layer 200, the substrate 300, and the second adhesive layer 400 during bending is reduced.

Further, when the bending region of the support member includes an outer bending region and an inner bending region, the bending degree is larger considering that the support member is generally bent with a smaller radius in the inner bending region, and therefore, the plurality of first openings 510 are preferably distributed in the inner bending region of the support member to reduce the internal stress of the support member and the display module in the inner bending region.

As further shown in fig. 5, in one implementation, the hollow structure further includes at least one second opening 520. When the bending region of the support member includes an outer bending region and an inner bending region, the at least one second opening 520 may be disposed in the outer bending region of the support member, and when the number of the second openings 520 in the outer bending region is plural, the plural second openings 520 are distributed in a spaced array.

In a specific implementation, the second opening 520 may be a blind hole, and is disposed on the plate surface of the support plate 100 facing away from the substrate 300, and a certain depth H is formed towards the substrate 300, and the depth H of the second opening 520 is smaller than the thickness B of the support plate 100. Like this, when supporting component buckled, backup pad 100 can have bigger deformation space in the out-turned region, and consequently the internal stress that backup pad 100 produced in the out-turned region is littleer, is favorable to reducing the whole stress of supporting component and display module group in the out-turned region to, the face of backup pad 100 towards substrate 300 still can keep continuous structure in the out-turned region, has also guaranteed the structural strength in out-turned region.

In the embodiment of the application, the hollow structure can be obtained on the supporting component by adopting laser cutting or etching process.

For example, the hollow structure may be fabricated after the supporting board 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 are attached to form an integrated structure, for example: after the support plate 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 are bonded into an integral structure, a laser cutting process is adopted to cut and remove the material at the position where the first opening 510 needs to be formed, and the cutting depth once penetrates through the support plate 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400, so that the first opening 510 is obtained.

For example, the hollow structure may be fabricated before the supporting board 100, the first adhesive layer 200, the substrate 300, and the second adhesive layer 400 are attached to form an integrated structure, for example: before the support plate 100 is attached to the first adhesive layer 200, the substrate 300 and the second adhesive layer 400, a laser cutting process may be used to cut and remove the material at the position of the support plate 100 where the first opening 510 (and the second opening 520) are to be formed, so as to obtain the portion of the first opening 510 (and the second opening 520) located on the support plate 100; in addition, a laser cutting process may also be used to cut and remove the material at the position where the first opening 510 needs to be formed of the double-sided adhesive formed by the first adhesive layer 200, the substrate 300, and the second adhesive layer 400, so as to obtain the portion of the first opening 510 located on the double-sided adhesive; finally, the support plate 100 with the first opening 510 (and the second opening 520) and the double-sided adhesive with the first opening 510 are bonded to form a support assembly with an openwork structure.

In the embodiment of the application, the hollow structure can be obtained by cutting according to a specific pattern.

Fig. 6 is a pattern schematic diagram of the hollow structure provided in the embodiment of the present application. According to the pattern shown in fig. 6, in one implementation, the first openings 510 may be, for example, strip-shaped holes, the length direction of the first openings 510 is parallel to the axis L of the support member, and the plurality of first openings 510 are distributed in an array at intervals along the direction parallel to the axis L and the direction perpendicular to the axis L. The adjacent two first openings 510 have a certain interval therebetween in a direction parallel to the axis L and in a direction perpendicular to the axis L. In addition, in the direction parallel to the axis L, the plurality of first openings 510 are distributed from one end of the support plate 100 to the other end of the support plate 100, so that the support assembly can have good bending performance at any position in the direction parallel to the axis L. The plurality of first openings 510 are distributed over a width in a direction perpendicular to the axis L.

As further shown in fig. 6, in an implementation manner, the second openings 520 may be, for example, strip-shaped holes, a length direction of the second openings 520 is parallel to the axis L of the bending of the supporting component, the plurality of second openings 520 are distributed in an array at intervals along a direction perpendicular to the axis L, and a certain interval is provided between two adjacent second openings 520. The length of the second opening 520 is preferably the same as the width of the support plate 100 in a direction parallel to the axis L, so that the second opening 520 extends continuously from one side end surface to the other side end surface of the support plate 100 in the direction of the axis L so as to penetrate the support plate 100 in the direction of the axis L.

Therefore, the supporting assembly provided by the first embodiment of the application reduces the internal stress of each layer structure of the supporting assembly through the first opening structure, so that the stress applied to other structures of the display module by the supporting assembly (for example, the stress applied to the optical adhesive) is further reduced, and thus, the attaching state between each layer structure of the display module is not damaged due to overlarge stress, the display module is not prone to peeling after being bent, and the reliability of the display module is improved.

The following is a second embodiment of the present application.

The second embodiment of this application provides a supporting component, and this supporting component can further reduce the internal stress when the display module assembly buckles, avoids the peeling to produce. Fig. 7 is a schematic structural diagram of a support assembly according to a second embodiment of the present application. As shown in fig. 7, the support assembly includes: the adhesive tape comprises a support plate 100, a first adhesive layer 200, a substrate 300 and a second adhesive layer 400, wherein the support plate 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400 are stacked from bottom to top.

The support assembly provided by the second embodiment of the present application differs from the support assembly provided by the first embodiment of the present application in that:

the first openings 510 are disposed only on the supporting plate 100 and the substrate 300, and the first openings 510 are not disposed in the first adhesive layer 200 and the second adhesive layer 400. Wherein, on the support plate 100, the first opening 510 extends from the plate surface of the support plate 100 facing away from the substrate 300 to the plate surface of the support plate 100 facing the substrate 300, so as to penetrate through the support plate 100; on the substrate 300, the first opening 510 extends from a surface of the substrate 300 facing the support plate 100 to a surface of the substrate 300 facing away from the support plate 100, thereby penetrating the substrate 300. The first adhesive layer 200 is completely coated between the support plate 100 and the substrate 300 because the first opening 510 is not provided. The second glue layer 400 is completely coated on the surface of the substrate 300 opposite to the support plate 100 because the first opening 510 is not disposed.

In the embodiment of the present application, the supporting plate 100 and the substrate 300 of the supporting assembly are subjected to material removal through the first opening 510, so that when the supporting assembly is bent, the supporting plate 100 and the substrate 300 can obtain a larger deformation space, which is beneficial to releasing internal stress, and reduces the internal stress of each layer structure of the supporting assembly.

In the embodiment of the present application, the first opening 510 may be formed on the support plate 100 and the substrate 300 by a laser cutting or etching process.

For example, the first opening 510 may be formed before the support plate 100 and the substrate 300 are attached. For example: before the support plate 100 is attached to the substrate 300, a laser cutting process may be adopted to cut and remove a material of the support plate 100 at a position where the first opening 510 needs to be formed, so as to obtain a portion of the first opening 510 located on the support plate 100; moreover, before the glue layer is coated on the substrate 300, a laser cutting process may be used to cut and remove the material at the position of the substrate 300 where the first opening 510 is to be formed, so as to obtain the portion of the first opening 510 located on the substrate 300; then, coating or bonding a first glue layer 200 on the substrate 300 with the first openings 510; finally, the support plate 100 with the first opening 510 and the substrate 300 with the first opening 510 are attached to form an integrated structure through the first adhesive layer 200.

For example, the first opening 510 may be formed after the support plate 100 and the substrate 300 are attached. For example: the first adhesive layer 200 may be coated or adhered on the substrate 300, and the support plate 100 and the substrate 300 are attached to form an integrated structure through the first adhesive layer 200; then, a laser cutting or etching process is performed on the integrated structure formed by the support plate 100 and the substrate 300, and materials of the support plate 100 and the substrate 300 at positions where the first openings 510 need to be formed are cut and removed, so that the first openings 510 arranged on the support plate 100 and the first openings 510 arranged on the substrate 300 are obtained.

For other features of the second embodiment of the present application that are not specifically developed, please refer to the first embodiment of the present application, which will not be described herein again.

Therefore, the supporting assembly provided by the second embodiment of the application reduces the internal stress of each layer structure of the supporting assembly through the first opening structure, so that the stress applied to other laminated structures of the display module by the supporting assembly is further reduced, and thus, the attaching state between each layer structure of the display module is not damaged due to overlarge stress, the display module is not subjected to a peeling phenomenon after being bent, and the reliability of the display module is improved.

The following is a third embodiment of the present application.

The third embodiment of this application provides a display module assembly, compares with traditional bendable display module assembly, and the internal stress of the display module assembly when buckling that the third embodiment of this application provided is littleer, can avoid the production of peeling.

Fig. 8 is a schematic structural diagram of a display module according to a third embodiment of the present application. As shown in fig. 8, the display module includes: the supporting assembly, the display panel 610, the third adhesive layer 620, the first protective layer 630, the fourth adhesive layer 640, and the second protective layer 650 provided in the first embodiment of the present application and their implementation manners are stacked from bottom to top. Specifically, the method comprises the following steps:

the supporting member may serve as a lowermost layer of the display module, and as shown in fig. 5, the supporting member may include: a support plate 100; a first adhesive layer 200 disposed on the support plate 100; a substrate 300 disposed on the first adhesive layer 200, wherein the substrate 300 is attached to the supporting board 100 through the first adhesive layer 200; a second adhesive layer 400 disposed on the substrate 300; and a first opening 510 penetrating the support plate 100, the first adhesive layer 200, the substrate 300 and the second adhesive layer 400, and/or a second opening 520 disposed on the support plate 100.

The display panel 610 is disposed on the second adhesive layer 400, and the display panel 610 is attached to the substrate 300 through the second adhesive layer 400. The display panel 610 is used for displaying an image, and the display panel 610 may be, for example, a flexible Organic Light-Emitting Diode (OLED) display panel, or may be other flexible display panels, such as a flexible Micro LED display panel, a Mini LED display panel, and the like.

The third adhesive layer 620 is disposed on the display panel 610, and the third adhesive layer 620 may be an adhesive layer formed by an optical adhesive, or an adhesive layer formed by a pressure-sensitive adhesive.

The first protective layer 630 is disposed on the third adhesive layer 620, and the first protective layer 630 is attached to the display panel 610 through the third adhesive layer 620. The first protective layer 630 may be, for example, a polarizing layer Polarizer.

The fourth adhesive layer 640 is disposed on the first protective layer 630, and the fourth adhesive layer 640 may be an adhesive layer formed by an optical adhesive or an adhesive layer formed by a pressure-sensitive adhesive, for example.

The second passivation layer 650 is disposed on the fourth adhesive layer 640, and the second passivation layer 650, as a cover plate of the display module, may be made of ultra-thin glass or transparent polyimide film, so as to have good bending performance.

Fig. 9 is a schematic view of a simulation bending test of a display module according to an embodiment of the present application. As shown in fig. 9, in order to verify the capability of the display module assembly for reducing the internal stress during bending, the state of the display module assembly in the folded state of the foldable screen device body can be simulated and bent, and some sampling points are selected for internal stress sampling. Because the third adhesive layer usually bears the largest internal stress, two sampling points are selected in the third adhesive layer according to the embodiment of the present application, and are respectively located at the outer circular angle P1 of the second opening 520 region and the inner circular angle P2 of the second opening 520 region. In addition, two sampling points are selected on the fourth adhesive layer and are respectively located at the outer circular angle P3 of the second opening 520 area and the inner circular angle P4 of the second opening 520 area. The sampling results are shown in table 1:

TABLE 1

As can be seen from table 1: at the excircle corner of the second opening region, the internal stress borne by the third adhesive layer is reduced by 15% compared with the traditional display module scheme, and the internal stress borne by the fourth adhesive layer is reduced by 8% compared with the traditional display module scheme; at the inner circular corner of the second opening area, the internal stress borne by the third adhesive layer is reduced by 15% compared with the traditional display module scheme, and the internal stress borne by the fourth adhesive layer is reduced by 12% compared with the traditional display module scheme.

Therefore, the display module assembly provided by the third embodiment of the application has smaller stress when being bent, so that the attaching state between each layer structure of the display module assembly cannot be damaged by internal stress, the display module assembly cannot generate a peeling phenomenon after being bent, and the reliability of the display module assembly is improved.

The following is a fourth embodiment of the present application.

The fourth embodiment of this application provides a display module assembly, compares with traditional bendable display module assembly, and the internal stress of the display module assembly that the fourth embodiment of this application provided when buckling is littleer, can avoid the production of peeling.

Fig. 10 is a schematic structural diagram of a display module according to a fourth embodiment of the present application. As shown in fig. 10, the display module includes: the supporting assembly, the display panel 610, the third adhesive layer 620, the first protective layer 630, the fourth adhesive layer 640, and the second protective layer 650 provided in the second embodiment of the present application and their implementation manners, wherein the supporting assembly, the display panel 610, the third adhesive layer 620, the first protective layer 630, the fourth adhesive layer 640, and the second protective layer 650 are stacked from bottom to top. Specifically, the method comprises the following steps:

the supporting member may serve as a lowermost layer of the display module, and as shown in fig. 7, the supporting member may include: a support plate 100; a first adhesive layer 200 disposed on the support plate 100; a substrate 300 disposed on the first adhesive layer 200, wherein the substrate 300 is attached to the supporting board 100 through the first adhesive layer 200; a second adhesive layer 400 disposed on the substrate 300; and a first opening 510 penetrating the support plate 100 and the substrate 300, and/or a second opening 520 disposed on the support plate 100.

The display panel 610 is disposed on the second adhesive layer 400, and the display panel 610 is attached to the substrate 300 through the second adhesive layer 400. The display panel 610 is used for displaying an image, and the display panel 610 may be, for example, a flexible organic light emitting diode OLED display panel, or may be other flexible display panels, such as a flexible Micro LED display panel, a Mini LED display panel, and the like.

The third adhesive layer 620 is disposed on the display panel 610, and the third adhesive layer 620 may be an adhesive layer formed by an optical adhesive, or an adhesive layer formed by a pressure-sensitive adhesive.

The first protective layer 630 is disposed on the third adhesive layer 620, and the first protective layer 630 is attached to the display panel 610 through the third adhesive layer 620. The first protective layer 630 may be, for example, a polarizing layer.

The fourth adhesive layer 640 is disposed on the first protective layer 630, and the fourth adhesive layer 640 may be an adhesive layer formed by an optical adhesive or an adhesive layer formed by a pressure-sensitive adhesive, for example.

The second passivation layer 650 is disposed on the fourth adhesive layer 640, and the second passivation layer 650, as a cover plate of the display module, may be made of ultra-thin glass or transparent polyimide film, so as to have good bending performance.

Table 2 shows the results of performing the simulation bending test and sampling on the display module according to the fourth embodiment of the present application by using the simulation bending test and sampling manner shown in fig. 9.

TABLE 2

As can be seen from table 2: at the excircle corner of the second opening region, the internal stress borne by the third adhesive layer is reduced by 15% compared with the traditional display module scheme, and the internal stress borne by the fourth adhesive layer is reduced by 8% compared with the traditional display module scheme; at the inner circular corner of the second opening area, the internal stress borne by the third adhesive layer is reduced by 12% compared with the traditional display module scheme, and the internal stress borne by the fourth adhesive layer is reduced by 9% compared with the traditional display module scheme.

Therefore, the display module assembly provided by the fourth embodiment of the application has smaller stress when being bent, so that the attaching state between each layer structure of the display module assembly cannot be damaged by internal stress, the display module assembly cannot generate a peeling phenomenon after being bent, and the reliability of the display module assembly is improved.

The embodiment of the application also provides an electronic device, and the electronic device can be a folding screen device, a scroll screen device or any electronic device with a bendable display screen. The electronic device may include one or more display modules, wherein at least one display module is the display module provided in the third embodiment or the fourth embodiment of the present application, or at least one display module includes the support component provided in the first embodiment or the second embodiment of the present application and each implementation manner thereof. For example, the electronic device may be an internal folding screen device, and the internal folding screen device may include an internal screen module and an external screen module, where the internal screen module refers to a display module hidden in a folded state of the body, and the external screen module refers to a display module exposed in any state of the body, and the internal screen module is the display module provided in the third embodiment or the fourth embodiment of the present application.

It is understood that a person skilled in the art can combine, split, recombine and the like the embodiments of the present application to obtain other embodiments on the basis of several embodiments provided by the present application, and the embodiments do not depart from the scope of the present application.

The above embodiments are provided to explain the purpose, technical solutions and advantages of the present application in further detail, and it should be understood that the above embodiments are merely illustrative of the present application and are not intended to limit the scope of the present application, and any modifications, equivalent substitutions, improvements and the like made on the basis of the technical solutions of the present application should be included in the scope of the present application.