阅读说明：本技术 一种led芯片集成cob光源模组 (Integrated COB light source module of LED chip ) 是由 黄剑 于 2021-08-11 设计创作，主要内容包括：本公开提供了一种LED芯片集成COB光源模组,包括COB模组、LED芯片、COB基板、硅片、陶瓷垫片和散热器；在COB基板封装LED芯片在组装过程中直接用陶瓷垫片连接在散热器固定着,由于陶瓷垫片为导热材料,对表面涂加导热硅脂,对填充陶瓷垫片与散热器、LED芯片之间的细小间隙,减小它们之间的接触热阻,同时无需再采用螺栓或连接器等方式固定,大大的简化产品的组装工艺。使用此COB基板封装LED芯片无需用连接器及螺栓或螺丝等部件固定,可通过连接于散热器上,集成COB光源模组。(The utility model provides a COB light source module integrated with an LED chip, which comprises a COB module, an LED chip, a COB substrate, a silicon chip, a ceramic gasket and a radiator; the COB substrate packaged LED chip is directly connected with the radiator and fixed in the assembling process through the ceramic gasket, the ceramic gasket is made of heat conducting materials, heat conducting silicone grease is coated on the surface of the ceramic gasket, small gaps among the ceramic gasket, the radiator and the LED chip are filled, thermal contact resistance between the ceramic gasket, the radiator and the LED chip is reduced, meanwhile, the ceramic gasket, the radiator and the LED chip are not required to be fixed in a bolt or connector mode, and the assembling process of the product is greatly simplified. The COB substrate is used for packaging the LED chip without fixing the LED chip by using connectors, bolts or screws and other parts, and the COB substrate can be connected onto a radiator to integrate the COB light source module.)

1. An LED chip integrated COB light source module is characterized by comprising a COB module, an LED chip, a COB substrate, a silicon wafer, a ceramic gasket and a radiator;

the COB module comprises an LED chip, a COB substrate, a ceramic gasket, a radiator and a silicon chip and is used for packaging the whole integrated COB light source;

the LED chip is positioned at the COB module, arranged at the top end of the silicon wafer, attached to the LED chip and used for converting electric energy into light energy;

the COB substrate is positioned at the top end of the ceramic gasket and is connected with the silicon wafer;

the ceramic gasket is arranged at the top end of the radiator and is used for forming a small gap between the radiator and the LED chip so as to reduce the thermal contact resistance between the radiator and the LED chip;

the radiator is positioned at the bottom of the ceramic gasket, and the ceramic radiator is arranged on the periphery of the COB substrate and is used for playing a key role in radiating the whole packaging system;

the chip, the silicon chip is located on the COB base plate, just the LED chip sets up on the silicon chip, be used for the LED chip has the controllability.

2. The LED chip integrated COB light source module set according to claim 1, wherein the body of the COB substrate is an insulating substrate or other high polymer material substrate.

3. The LED chip integrated COB light source module set according to claim 1, wherein a metal film plating layer formed by a film plating process is adopted at the bottom of the COB substrate, the ceramic gasket is arranged below the metal film plating layer of the COB substrate, and the ceramic gasket is connected with the COB substrate.

4. The LED chip-integrated COB light source module of claim 1, wherein the pitch of the LED chips is greater than 2 times the thickness of the LED chips.

5. The LED chip-integrated COB light source module of claim 1, wherein the pitch of the LED chips is greater than 4 times the thickness of the LED chips.

6. The LED chip integrated COB light source module of claim 1, wherein the ceramic gasket is a heat conductive material, a heat conductive silicone grease is applied to the surface of the ceramic gasket, and the thermal contact resistance between the ceramic gasket and the heat sink and the LED chip is reduced by filling the fine gaps between the ceramic gasket and the heat sink and between the ceramic gasket and the LED chip.

7. The LED chip integrated COB light source module of claim 1, wherein the COB substrate is an insulating substrate or other high molecular material substrate, and the COB package structure of the LED is formed on the front surface of the substrate.

8. The LED chip integrated COB light source module set according to claim 1, wherein the LED chip and the package for packaging are made of heat conductive epoxy resin, the chip is placed on the COB substrate surface directly, and the heat treatment is performed until the chip is firmly fixed on the COB substrate.

Technical Field

The invention relates to the technical field of COB light sources, in particular to an LED chip integrated COB light source module.

Background

With the development of recent years, the continuous development and change of the LED market and technology, the COB is gradually becoming one of the main packaging modes of the LED and has a trend of becoming mainstream packaging, and it is known that the bulb lamp packaged by the COB occupies about 40% of the market of the LED bulb. The COB concept was originally extended from the traditional semiconductor electronic packaging, and this technology, which is very mature in the semiconductor industry, was applied to the LED industry, changing the awareness of people on the light source, thereby enabling power-type lighting, and from then on, the LED light source turned on the courtesy of the COB era. However, in the assembly process, the mounting mode generally conducts heat conduction and heat dissipation by coating the heat conducting paste on the bottom of the light source, and the mode has certain defects, firstly, the heat dissipation mode of the heat conducting paste increases the thermal resistance of the LED chip, the heat dissipation channel is poor, and the heat dissipation performance of the product is reduced; the COB light source of prior art often too concentrates, not only can produce a large amount of heat gathers to shelter from each other between the COB light source, make the efficiency of COB light source not high, and the rate of utilization is not high.

Disclosure of Invention

An object of the embodiment of the present disclosure is to provide an integrated COB light source module of LED chip, can have better heat conductivility, and it is more convenient to assemble, and pottery COB encapsulates LED chip structure, can be applied to the indoor outer light of LED that uses the COB light source and have better effect.

Therefore, the present disclosure provides an LED chip integrated COB light source module, which includes a COB module, an LED chip, a COB substrate, a silicon wafer, a ceramic gasket and a heat sink; the COB module comprises an LED chip, a COB substrate, a ceramic gasket, a radiator and a silicon chip; for integrating the COB light source for the whole package. The LED chip is positioned at the COB module, arranged at the top end of the silicon wafer, attached to the LED chip and used for converting electric energy into light energy; the COB substrate is positioned at the top end of the ceramic gasket and is connected with the silicon wafer; the ceramic gasket is arranged at the top end of the radiator and used for reducing the contact thermal resistance between the radiator and the LED chip through small gaps between the radiator and the LED chip; the radiator is positioned at the bottom of the ceramic gasket, and the periphery of the COB substrate is provided with the ceramic radiator which is used for playing a key role in radiating the whole packaging system; the chip comprises a silicon chip, wherein the silicon chip is positioned on the COB substrate, and an LED chip is arranged on the silicon chip and used for controlling the LED chip.

Preferably, the body of the COB substrate is an insulating substrate or other polymer material substrate.

Preferably, a metal film electroplated layer formed by a film electroplating process is used at the bottom of the COB substrate, a ceramic gasket is arranged below the metal film electroplated layer of the COB substrate, and the ceramic gasket is connected with the COB substrate.

Preferably, the pitch of the LED chips is greater than 2 times the thickness of the LED chips.

Preferably, the pitch of the LED chips is greater than 4 times the thickness of the LED chips.

Preferably, the ceramic gasket is made of heat conducting materials, heat conducting silicone grease is coated on the surface of the ceramic gasket, and the small gaps among the ceramic gasket, the radiator and the LED chip are filled, so that the thermal contact resistance among the ceramic gasket, the radiator and the LED chip is reduced.

Preferably, the COB substrate is an insulating substrate or a COB package structure in which LEDs are formed on the front surface of another polymer substrate.

Preferably, the LED chip and the package for packaging adopt heat-conducting epoxy resin, the LED chip covers the silicon chip mounting point on the surface of the COB substrate by the heat-conducting epoxy resin, the silicon chip is directly mounted on the surface of the COB substrate, and the heat treatment is carried out until the silicon chip is firmly fixed on the COB substrate.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the COB light source module integrated with the LED chips on the COB substrate, the distance between the adjacent LED chips is larger than the thickness of the LED chips, so that the defect that the COB light source module integrated with the LED chips is excessively and intensively arranged is overcome, heat dissipation is facilitated, the cooperative working effect among the LED chips is optimized to a certain extent, all light is emitted from the side edge of each LED chip as far as possible, and the efficiency of the COB light source module is improved. The COB substrate packaged LED chip is directly connected with the radiator and fixed in the assembling process through the ceramic gasket, the ceramic gasket is made of heat conducting materials, heat conducting silicone grease is coated on the surface of the ceramic gasket, small gaps among the ceramic gasket, the radiator and the LED chip are filled, thermal contact resistance between the ceramic gasket, the radiator and the LED chip is reduced, meanwhile, the COB substrate packaged LED chip is not required to be fixed in a bolt or connector mode, and the assembling process of the product is greatly simplified. The COB substrate is used for packaging the LED chip without fixing the LED chip by using connectors, bolts or screws and other parts, and the COB substrate can be connected onto a radiator to integrate the COB light source module.

Drawings

To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can also obtain other drawings according to the drawings without inventive labor.

Fig. 2 is a schematic perspective view of an LED chip integrated COB light source module according to the present invention;

fig. 1 is a schematic structural diagram of an LED chip integrated COB light source module according to the present invention;

fig. 3 is a schematic view of an LED chip structure of an LED chip integrated COB light source module according to the present invention.

Wherein, in the figures, the respective reference numerals:

1. a COB module; 2. an LED chip; 3. a COB substrate; 4. a silicon wafer; 5. a ceramic gasket; 6. a heat sink.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The inventor finds that in the assembly process, the mounting mode generally conducts heat conduction and heat dissipation in a mode of coating heat conduction paste on the bottom of a light source, and the mode has certain defects, firstly, the heat dissipation mode of the heat conduction paste increases the thermal resistance of an LED chip, a heat dissipation channel is poor, and the heat dissipation performance of a product is reduced; often too concentrated at the COB light source, not only can produce a large amount of heat gathers to shelter from each other between the COB light source, make the efficiency of COB light source not high, the utilization ratio is not high promptly.

Referring to fig. 1 to 3, in an embodiment of the invention, an LED chip integrated COB light source module includes a COB module 1, an LED chip 2, a COB substrate 3, a silicon chip 4, a ceramic pad 5, and a heat sink 6.

Referring to fig. 1 to 3, the COB module 1 includes an LED chip 2, a COB substrate 3, a ceramic spacer 5, a heat sink 6, and a silicon chip 4, and is used to integrate the COB light source into the whole package. From this, at the COB light source module that whole encapsulation formed, and the integrated packaging technology of COB base plate 3 will be by the direct encapsulation of many LED chips 2 on COB base plate 3, as an illumination or other, the ceramic pad 5 and the direct heat dissipation of radiator 6 that connect through COB base plate 3, can not only reduce the manufacturing process and the cost of support, but also have the heat dissipation advantage that reduces the thermal resistance.

Referring to fig. 1 to 3, the LED chip 2 is located at the COB module 1, is disposed on the top end of the silicon chip 4, and is attached to the LED chip 2 for converting electrical energy into light energy. The LED chip 2 has two basic structures of lateral and vertical. The lateral structure of the LED chip 2 means that two electrodes of the chip are on the same side of the epitaxial wafer, and since the electrodes are on the same side, the current flows laterally in the n-and p-type confinement layers, which is not favorable for current diffusion and heat dissipation. In contrast, the vertical structure LED chip 2 means that two electrodes are distributed on different sides of the epitaxial wafer, and the patterned electrode and the entire p-type confinement layer are used as the second electrode, so that almost all current vertically flows through the epitaxial layer of the LED chip 2, and little current laterally flows. Respectively electrically connected with the positive pole and the negative pole on the heat sink or the PCB or the COB substrate 3. An external power supply is coupled to the ten and one poles on the COB substrate 3.

Referring to fig. 1 to 3, a COB substrate 3 is disposed on a top of a ceramic pad 5, and is connected to a silicon wafer 4. COB packaging is full name of on-board LED chip 2 packaging, is a technology for solving the LED heat dissipation problem, and is to adhere the LED chip 2 on the COB substrate 3 with conductive or non-conductive glue, and then perform lead bonding to realize the electrical connection.

Referring to fig. 2, the ceramic pad 5 is disposed on the top end of the heat sink 6, and the ceramic pad 5 is used for forming a small gap between the heat sink 6 and the LED chip 2 to reduce the thermal contact resistance therebetween. The ceramic spacer 5 is a material with high thermal conductivity, mainly made of alumina, has a pure white appearance and hard texture, and is mainly used for heat transfer and electrical isolation between the LED chip 2 and the heat sink 6. After the LED chip is tightly combined with the LED chip 2, the radiator 6 and the COB substrate 3, the sealing performance is excellent, the ideal effects of dust prevention, water prevention, heat conduction and insulation can be achieved, the LED chip can adapt to high-temperature, high-pressure and dusty severe working environments, and the safety and the stability of equipment operation are improved.

Referring to fig. 2, the heat spreader 6 is located at the bottom of the ceramic pad 5, and the periphery of the COB substrate 3 is a ceramic heat spreader, which plays a key role in heat dissipation of the entire package system. Thus, the heat sink 6 is an aluminum heat sink, and the surface of the aluminum heat sink is subjected to surface treatment by anodizing to increase the corrosion resistance of the aluminum material.

Referring to fig. 2, a silicon chip 4, the silicon chip 4 is disposed on the COB substrate 3, and the LED chip 2 is disposed on the silicon chip 4 for providing control capability on the LED chip 2. Thus, the silicon wafer 5 is an important material for manufacturing transistors and integrated circuits, and various semiconductor devices can be manufactured by means of photolithography, ion implantation, or the like on the silicon wafer 5, and the chip manufactured using the silicon wafer 5 has remarkable calculation capability.

Referring to fig. 1 to 3, the body of the COB substrate 3 is an insulating substrate or other polymer material substrate. From this, COB base plate 3 is because the coefficient of heat conductivity of aluminium is high, and the heat dissipation is good, can effectually derive inside heat. The COB substrate 3 is a unique metal-based copper-clad plate and has good thermal conductivity, electrical insulation performance and machining performance.

Referring to fig. 1 to 3, a metal film plating layer is formed on the bottom of the COB substrate 3 by a film plating process, a ceramic pad 5 is disposed under the metal film plating layer of the COB substrate 3, and the ceramic pad 5 is connected to the COB substrate 3. The technological process of the LED chip 2 on the COB substrate 3 is that firstly, a silicon chip placing point is covered on the surface of the COB substrate 3 by using heat conduction epoxy resin, then, the silicon chip 4 is directly placed on the surface of the COB substrate 3, heat treatment is carried out until the silicon chip 4 is firmly fixed on the COB substrate 3, and then, the electrical connection is directly established between the silicon chip 5 and the COB substrate 3 by using a wire bonding method.

Referring to fig. 1 to 3, the pitch of the LED chips 2 is greater than 2 times the thickness of the LED chips 2. Thereby avoided the too defect of concentrating the arranging of COB light source, be favorable to thermal dispersing, also optimized LED chip 2 collaborative work effect each other simultaneously to a certain extent, made 2 sides of every LED chip send whole light as far as possible, and then improved the efficiency of COB light source.

Referring to fig. 1 to 3, the pitch of the LED chips 2 is greater than 4 times the thickness of the LED chips 2. Through repeated tests and verification, under the condition of the proportion, the light condensation effect of the COB substrate 3 is better, light emitted by the LED chip 2 can be sufficiently concentrated and upwards emitted, and the light emitting efficiency of the LED chip 2 is remarkably improved.

Referring to fig. 2, the ceramic pad 5 is made of a heat conductive material, and a heat conductive silicone grease is applied to the surface of the ceramic pad to fill the small gaps between the ceramic pad 5 and the heat sink 6 and between the ceramic pad and the LED chip 2, thereby reducing the thermal contact resistance between the ceramic pad and the heat sink. Thermal resistance model and heat dissipation path of the LED chip 2. The factors that influence the thermal resistance of the LED chip 2 mainly include the surface flatness of the ceramic pad 5, the thicknesses of the ceramic pad 5 and the thermal grease, the thickness and shape of the heat sink 6, and the pressure of the fastening member, and these factors are related to the actual application conditions, so the thermal resistance between the LED chip 2 and the heat sink will also depend on the actual assembly conditions.

Referring to fig. 1 to 3, the COB substrate 3 is an insulating substrate or other high polymer material substrate, and the front surface of the insulating substrate or other high polymer material substrate forms a COB package structure of the LED. This COB base plate 3 adopts the film electroplating technology to form can the welded metal film plating layer, is equipped with radiator 6 below the metal film plating layer that can weld, introduces between metal film plating layer that can weld and radiator 6 and welds their tin cream layer through the reflow soldering technology.

Referring to fig. 1 to 3, the LED chip 2 and the package for packaging use a heat conductive epoxy, the LED chip 2 covers a silicon chip mounting point on the surface of the COB substrate 3 with the heat conductive epoxy, the silicon chip 4 is directly mounted on the surface of the COB substrate 3, and heat treatment is performed until the silicon chip 4 is firmly fixed to the COB substrate 3, thereby directly establishing an electrical connection between the silicon chip 4 and the substrate by using a wire bonding method.

The working principle and the using process of the invention are as follows: when the integrated COB light source module of LED chip 2, the integrated COB light source module of LED chip 2 of COB base plate 3 department, because interval between the adjacent LED chip 2 is greater than LED chip 2's thickness, thereby avoided the too concentrated defect of arranging of the integrated COB light source module of LED chip 2, be favorable to thermal dispersing, also optimized the collaborative work effect each other of LED chip 2 simultaneously to a certain extent, make 2 sides of every LED chip send whole light as far as possible, and then improved the efficiency of COB light source module. COB light source module that forms at whole encapsulation, and the integrated packaging technology of COB base plate 3 will be by the direct encapsulation of many LED chips 2 on COB base plate 3, as an illumination or other, the ceramic pad 5 and the direct heat dissipation of radiator 6 that connect through COB base plate 3, can not only reduce the manufacturing process and the cost of support, but also have the heat dissipation advantage that reduces the thermal resistance. The COB substrate 3 is used for packaging the LED chip 2, the LED chip 2 is directly connected with the ceramic gasket 5 and fixed on the radiator 6 in the assembling process, the ceramic gasket 5 is made of heat conducting materials, heat conducting silicone grease is coated on the surface of the ceramic gasket, small gaps among the ceramic gasket 5, the radiator 6 and the LED chip 2 are filled, thermal contact resistance between the ceramic gasket and the radiator is reduced, meanwhile, the ceramic gasket, the radiator and the LED chip are not required to be fixed in a bolt or connector mode, and the assembling process of the product is greatly simplified. The COB substrate 3 is used for packaging the LED chip 2 without fixing the LED chip by using connectors, bolts, screws and other parts, and can be connected onto the radiator 6 to integrate the COB light source module.

To this end, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.