阅读说明：本技术 一种检测芯片裂缝的装置 (Device for detecting chip cracks ) 是由 胡伟国 胡贻升 于 2019-05-31 设计创作，主要内容包括：一种检测芯片裂缝的装置,以在实现裂片检测的同时,降低对功能电路造成的干扰。该装置包括：功能电路(110)以及位于功能电路(110)周围的裂片检测模块(120)。其中,裂片检测模块(120)包括前道器件层(121)和设置在前道器件层(121)上的层状结构(122),层状结构(122)中形成有导线(L),前道器件层(121)中形成有一个或多个第一电容(C1)。导线(L)的第一端用于连接电源正极,导线(L)的第二端用于连接电源负极,第一电容(C1)并联在导线(L)的第一端与导线(L)的第二端之间,导线(L)的第一端与第二端之间设置有检测接口,检测接口用于检测该芯片是否发生裂片。(A device for detecting chip cracks is used for reducing interference on a functional circuit while realizing crack detection. The device includes: the device comprises a functional circuit (110) and a splinter detection module (120) positioned around the functional circuit (110). The split detection module (120) comprises a front device layer (121) and a layered structure (122) arranged on the front device layer (121), wherein a lead (L) is formed in the layered structure (122), and one or more first capacitors (C1) are formed in the front device layer (121). The first end of wire (L) is used for connecting the power positive pole, and the second end of wire (L) is used for connecting the power negative pole, and first electric capacity (C1) connect in parallel between the first end of wire (L) and the second end of wire (L), is provided with the detection interface between the first end of wire (L) and the second end, and the detection interface is used for detecting whether this chip takes place the lobe of a leaf.)