阅读说明：本技术 胶片结构及其制造方法、胶片组件、发射端的组装方法 (Film structure and manufacturing method thereof, film assembly and assembling method of transmitting end ) 是由 张俊云 彭显龙 沈娟 毛庆敏 张海鹏 于 2021-09-07 设计创作，主要内容包括：本发明公开了一种胶片结构及其制造方法、胶片组件、发射端的组装方法,其属于电子器件连接技术领域,胶片结构包括盖膜及胶层,所述盖膜上设置有至少一条第一预断线,至少一条所述第一预断线将所述盖膜分割为多个膜体；胶层包括多个胶体,多个所述胶体与多个所述膜体一一对应,且所述胶体粘附于与其对应的所述膜体上；撕除一个所述膜体时,一个所述膜体沿所述第一预断线与其相邻的所述膜体分离,以露出该一个所述膜体上粘附的所述胶体。本发明提供的胶片结构能够用于粘接电子器件,且能降低灰尘等杂质粘附在胶层上的几率,进而具有较好的粘接效果。(The invention discloses a film structure and a manufacturing method thereof, a film assembly and an assembling method of an emission end, belonging to the technical field of electronic device connection, wherein the film structure comprises a cover film and a glue layer, wherein the cover film is provided with at least one first pre-breaking line which divides the cover film into a plurality of film bodies; the glue layer comprises a plurality of colloids, the plurality of colloids correspond to the plurality of film bodies one by one, and the colloids are adhered to the corresponding film bodies; when one film body is torn off, the film body is separated from the adjacent film body along the first pre-breaking line so as to expose the colloid adhered to the film body. The film structure provided by the invention can be used for bonding electronic devices, and can reduce the probability of impurities such as dust and the like adhering to the adhesive layer, thereby having better bonding effect.)

1. A film structure, comprising:

the film covering device comprises a covering film (1), wherein at least one first pre-breaking line (2) is arranged on the covering film (1), and the covering film (1) is divided into a plurality of film bodies (11) by the at least one first pre-breaking line (2);

the glue layer (3) comprises a plurality of colloids (31), the colloids (31) correspond to the film bodies (11) one by one, and the colloids (31) are adhered to the film bodies (11) corresponding to the colloids.

2. The film structure according to claim 1, wherein at least one second pre-breaking line (4) is further disposed on the cover film (1), the second pre-breaking line (4) extends from a first edge of the film body (11) to a second edge of the film body (11), and the first edge and the second edge are two opposite edges of the film body (11).

3. The film structure of claim 1, wherein the adhesive layer (3) comprises a first adhesive body (301), a second adhesive body (302) and a third adhesive body (303), the first adhesive body (301) is square and located at the center of the cover film (1), the second adhesive body (302) and the third adhesive body (303) are both circular, the second adhesive body (302) surrounds the first adhesive body (301), the third adhesive body (303) surrounds the second adhesive body (302), the first adhesive body (301) and the second adhesive body (302) are arranged at intervals, and the second adhesive body (302) and the third adhesive body (303) are arranged at intervals;

the cover film (1) comprises two first pre-breaking lines (2), wherein one first pre-breaking line (2) is located between the first colloid (301) and the second colloid (302), and the other first pre-breaking line (2) is located between the second colloid (302) and the third colloid (303).

4. Film structure according to claim 1, characterized in that the covering film (1) is square and that one corner of the covering film (1) is provided with a chamfer (12).

5. The film structure of claim 1, wherein the cover film (1) is a release film or a silicone adhesive film.

6. The film structure of claim 1, further comprising a protective film covering the cover film (1) and attached to the plurality of colloids (31), respectively.

7. A film assembly comprising a carrier tape (10) and a film structure according to any one of claims 1-5;

the carrier tape (10) comprises a first film piece (101), a second film piece (102) and a third film piece (103) which are arranged in a stacked mode, the second film piece (102) is provided with a limiting through hole (1021), the cover film (1) is located between the first film piece (101) and the second film piece (102), and the glue layer (3) is limited in the limiting through hole (1021) and is in contact with the third film piece (103).

8. A film assembly as claimed in claim 7, wherein the plurality of limiting through holes (1021) and the film structures are provided, the plurality of limiting through holes (1021) are provided at intervals along the extending direction of the first membrane (101), the plurality of limiting through holes (1021) correspond to the plurality of film structures one by one, and the adhesive layer (3) of the film structure is limited in the corresponding limiting through holes (1021).

9. The film assembly of claim 7, wherein a plurality of the limiting through holes (1021) are provided, a plurality of the limiting through holes (1021) correspond to a plurality of the glue bodies (31) one by one, and the glue bodies (31) are limited in the limiting through holes (1021) corresponding to the glue bodies (31).

10. A method of manufacturing a film structure, for manufacturing the film structure of any one of claims 1 to 6, comprising the steps of:

preparing a membrane;

sequentially forming at least one first pre-breaking line on the membrane to divide the membrane into a plurality of membrane bodies so as to form a cover membrane;

and sequentially adhering a plurality of colloids to the corresponding film body, and enabling the colloids to avoid the first pre-broken line so as to form the film structure.

11. A method of assembling a transmitting end by the film structure of any one of claims 1 to 6, comprising the steps of:

preparing a mother board;

bonding the film structure on the mother board through a glue layer, wherein a cover film is adhered on the glue layer;

tearing off one film body of the cover film to expose one colloid adhered to the one film body;

bonding the coil of the transmitting end to the colloid;

tearing off the other film body of the cover film to expose the other colloid adhered to the other film body;

bonding the magnet at the transmitting end to the other colloid;

tearing off the other film body of the cover film to expose the other colloid adhered to the other film body;

and adhering the PC board of the transmitting end to the other colloid.

Technical Field

The invention relates to the technical field of electronic device connection, in particular to a film structure and a manufacturing method thereof, a film assembly and an assembling method of an emitting end.

Background

At present, the double-sided adhesive tape for connecting electronic devices is made of a multipurpose PSA material, and the PSA has the advantages of good stability, strong controllability and the like. In addition, the PSA, which is commonly used as a material for connecting electronic devices, exhibits its expected use effect even in actual use. With the development of electronic technology, the variety of electronic devices is various, and there is a need to assemble different electronic devices on the same master many times, where the master refers to a structure for fixing a plurality of electronic devices, and is also called a spacer.

Among the prior art, be attached to one deck PSA glue film on the master mask, the PSA glue film coats and is stamped from the type membrane to prevent that the PSA glue film from being polluted by the impurity in the air, and then can guarantee the effect of pasting of PSA glue film. When bonding a plurality of electron devices on same mother set, earlier tear from the type membrane and remove to expose the PSA glue film, then pass through the PSA sticky joint on the mother set with a plurality of electron devices one by one.

However, when the electronic device is bonded, the PSA layer to which the electronic device has not been bonded is exposed to the air, and thus impurities such as dust in the air adhere to the PSA layer, and when the electronic device is subsequently bonded, the bonding effect is poor.

Disclosure of Invention

The invention aims to provide a film structure, a manufacturing method thereof and a film assembly, which are used for bonding electronic devices, can reduce the probability of impurities such as dust and the like adhering to a film layer and further have a better bonding effect.

As the conception, the technical scheme adopted by the invention is as follows:

a film structure comprising:

the cover film is provided with at least one first pre-breaking line, and the cover film is divided into a plurality of film bodies by the at least one first pre-breaking line;

the glue layer comprises a plurality of colloids, a plurality of colloids are in one-to-one correspondence with the membrane bodies, and the colloids are adhered to the membrane bodies corresponding to the colloids.

Optionally, at least one second pre-breaking line is further disposed on the cover film, the second pre-breaking line extends from the first edge of the film body to the second edge of the film body, and the first edge and the second edge are two opposite edges of the film body.

Optionally, the adhesive layer includes a first adhesive body, a second adhesive body and a third adhesive body, the first adhesive body is square and located at the center of the cover film, the second adhesive body and the third adhesive body are both annular, the second adhesive body surrounds the first adhesive body, the third adhesive body surrounds the second adhesive body, the first adhesive body and the second adhesive body are arranged at intervals, and the second adhesive body and the third adhesive body are arranged at intervals;

the cover film comprises two first pre-breaking lines, wherein one first pre-breaking line is positioned between the first colloid and the second colloid, and the other first pre-breaking line is positioned between the second colloid and the third colloid.

Optionally, the cover membrane is square, and one corner of the cover membrane is provided with a chamfer.

Optionally, the cover film is a release film or a silica gel adhesive film.

Optionally, the adhesive tape further comprises a protective film, the protective film covers the cover film, and the protective film is attached to the plurality of the colloids respectively.

A film assembly comprises a carrier tape and the film structure;

the carrier band is including first diaphragm, second diaphragm and the third diaphragm of range upon range of setting, the second diaphragm has spacing through-hole, the epiphragma is located first diaphragm with between the second diaphragm, the glue film is spacing in spacing through-hole, and with the contact of third diaphragm.

Optionally, spacing through-hole reaches the film structure sets up a plurality ofly, and is a plurality of spacing through-hole is followed the extending direction interval of first diaphragm sets up, and is a plurality of spacing through-hole is with a plurality of the film structure one-to-one, the glue film of film structure is spacing rather than corresponding in the spacing through-hole.

Optionally, the plurality of limiting through holes are arranged, the plurality of limiting through holes correspond to the plurality of colloids one to one, and the colloids are limited in the corresponding limiting through holes.

A method for manufacturing a film structure is used for manufacturing the film structure and comprises the following steps:

preparing a membrane;

sequentially forming at least one first pre-breaking line on the membrane to divide the membrane into a plurality of membrane bodies so as to form a cover membrane;

and sequentially adhering a plurality of colloids to the corresponding film body, and enabling the colloids to avoid the first pre-broken line so as to form the film structure.

A method for assembling a transmitting end by a film structure as described above, comprising the steps of:

preparing a mother board;

bonding the film structure on the mother board through a glue layer, wherein a cover film is adhered on the glue layer;

tearing off one film body of the cover film to expose one colloid adhered to the one film body;

bonding the coil of the transmitting end to the colloid;

tearing off the other film body of the cover film to expose the other colloid adhered to the other film body;

bonding the magnet at the transmitting end to the other colloid;

tearing off the other film body of the cover film to expose the other colloid adhered to the other film body;

and adhering the PC board of the transmitting end to the other colloid.

The invention has at least the following beneficial effects:

according to the film structure and the manufacturing method thereof, the film assembly and the assembling method of the transmitting end, the cover film is provided with the first pre-breaking line, so that the cover film is divided into the plurality of film bodies by the first pre-breaking line, the glue layer comprises the plurality of colloids corresponding to the plurality of film bodies one by one, each colloid can be adhered to one corresponding film body, when an electronic device is adhered to one colloid, only the film body corresponding to one colloid needs to be torn off, other film bodies do not need to be torn off, other colloids can be continuously protected by the other film bodies from being polluted by impurities such as dust, the adhering effect when other electronic devices are adhered is further ensured, and the film structure has high reliability and practicability.

Drawings

Fig. 1 is a schematic structural diagram of a cover film according to an embodiment of the present invention;

FIG. 2 is a first diagram illustrating a film structure according to a first embodiment of the present invention;

fig. 3 is a second schematic diagram of a film structure according to a first embodiment of the present invention;

FIG. 4 is a schematic structural diagram of another cover film provided in the first embodiment of the present invention;

fig. 5 is a schematic diagram of another film structure provided by an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a film assembly according to a second embodiment of the present invention;

fig. 7 is a schematic cross-sectional view of a film assembly according to a second embodiment of the present invention;

fig. 8 is a schematic cross-sectional view of another film assembly provided in accordance with a second embodiment of the present invention;

fig. 9 is a schematic cross-sectional view of another film assembly provided in accordance with a second embodiment of the present invention;

FIG. 10 is a flow chart of a film structure provided by an embodiment of the present invention when assembling a coil, a magnet and a PC board;

FIG. 11 is a flow chart of a method for manufacturing a pellicle according to a third embodiment of the present invention;

fig. 12 is a flowchart of an assembly method of a transmitting end according to a fourth embodiment of the present invention.

In the figure:

1. covering a film; 11. a membrane body; 12. chamfering; 2. a first pre-breaking line; 3. a glue layer; 31. a colloid; 301. a first colloid; 302. a second colloid; 303. a third colloid; 4. second pre-breaking; 5. third pre-breaking;

10. carrying a belt; 101. a first diaphragm; 102. a second diaphragm; 1021. a limiting through hole; 103. a third diaphragm; 20. a film structure; 30. a motherboard; 40. a coil; 50. a magnet; 60. a PC board.

Detailed Description

In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example one

The embodiment provides a film structure 20 for bonding electronic devices, which can reduce the probability of impurities such as dust adhering to the adhesive layer 3, and further has a better bonding effect.

As shown in fig. 1, the pellicle structure 20 includes a cover film 1 and a glue layer 3 attached to the cover film 1.

Wherein, be provided with at least one first pre-broken line 2 on the epiphragma 1, at least one first pre-broken line 2 will be covered the epiphragma 1 and is divided into a plurality of film body 11. The at least one first pre-breaking line 2 refers to one first pre-breaking line 2 or a plurality of first pre-breaking lines 2. The first pre-broken line 2 may be formed in a cutting process using a cutting blade having a plurality of blades arranged at intervals to form the first pre-broken line 2. It should be noted that the first pre-broken line 2 may also be referred to as a first broken line, which is not limited in this embodiment.

Glue film 3 is located a surface of epiphragma 1 to, glue film 3 includes a plurality of colloids 31, a plurality of colloids 31 and a plurality of membrane bodies 11 one-to-one, and the colloid 31 adhesion is on the membrane body 11 rather than corresponding for a plurality of colloids 31 can be mutually independent, each other do not influence. In the present embodiment, the relationship between the colloid 31 and the corresponding film body 11 may be: the shape and the size of the colloid 31 are the same as those of the membrane body 11, and the colloid 31 completely covers the corresponding membrane body 11; alternatively, the area of the colloid 31 is smaller than the area of the film body 11, so that the colloid 31 covers a part of the film body 11; still alternatively, the shape of the colloid 31 is similar to the shape of the corresponding membrane 11, but the area is smaller than the area of the membrane 11, which is not limited in this embodiment. In fig. 2 of the present embodiment, the area of the colloid 31 is smaller than the area of the membrane body 11, so that the membrane body 11 has vacant regions. It should be noted that in this embodiment, the thicknesses of the plurality of colloids 31 are the same, so as to avoid the height difference from occurring, and further, the effect after the electronic device is mounted is affected.

When the film structure 20 provided by the embodiment is used, when any one of the film bodies 11 is torn off, the any one of the film bodies 11 is separated from the adjacent film body 11 along one of the first pre-breaking lines 2 to expose the colloid 31 adhered to the any one of the film bodies 11, and the colloid 31 adhered to the adjacent film body 11 is still covered by the film body 11 and is not exposed in the air, so that the probability that the colloid 31 is polluted by impurities such as dust is reduced.

The film structure 20 that this embodiment provided, be equipped with first line 2 of breaking in advance on the epiphragma 1, make first line 2 of breaking in advance cut apart into a plurality of membranous bodies 11 with epiphragma 1, and glue film 3 includes a plurality of colloids 31 with a plurality of membranous bodies 11 one-to-one, make every colloid 31 can adhere on one membranous body 11 that it corresponds, when bonding an electron device on one colloid 31, only need with the membranous body 11 that this colloid 31 corresponds tear can, need not to tear other membranous bodies 11, make this other membranous body 11 can continue to protect other colloids 31 not by the pollution of impurity such as dust, and then the bonding effect when having guaranteed other electron devices of bonding back order, make film structure 20 have higher reliability and practicality.

In addition, in the prior art, when a plurality of electronic devices are adhered to the master plate one by one through PSA, the assembly times are large, and each assembly has an error, so that the accumulated tolerance is increased due to the increase of the assembly times. In the film structure 20 provided by this embodiment, the shape and size of the colloid 31 can be determined according to the shape and size of the electronic device actually bonded, and after the size and shape of the film body 11 are unified, the position of the colloid 31 adhered to the film body 11 is fixed, so that the error in mounting the electronic device can be reduced, that is, the colloid 31 adhered to the film body 11 in a unified manner can ensure the subsequent assembly precision, and further the reject ratio of the product is reduced.

Optionally, referring to fig. 1, fig. 3 or fig. 4, at least one second pre-breaking line 4 is further disposed on the cover film 1. The provision of the second pre-breaking line 4 can facilitate the tearing off of the film body 11. The second pre-breaking line 4 is arranged at a position where the second pre-breaking line 4 extends from a first edge of the film body 11 to a second edge of the film body 11, and the first edge and the second edge are two opposite edges of the film body 11, that is, the second pre-breaking line 4 is arranged across the film body 11, and in some cases, it can be understood that the second pre-breaking line 4 extends from one first pre-breaking line 2 to another first pre-breaking line 2.

Further, a third pre-breaking line 5 may be further disposed on the film body 11, as shown in fig. 4, the third pre-breaking line 5 extends a length inward from the edge of the film body 11. The setting of third line of pre-breaking 5 is convenient for tearing of lamina 11, and exemplarily, the position department that lamina 11 set up third line of pre-breaking 5 has slight perk, and at this moment, the operating personnel of being convenient for adopts instrument or manual clamp to rise lamina 11, and then is convenient for tear and removes lamina 11.

Optionally, the present embodiment provides a specific structure of the glue layer 3 and the cover film 1, please refer to fig. 3, in which the glue layer 3 includes a first glue 301, a second glue 302, and a third glue 303. The first colloid 301 is square and is positioned at the center of the cover membrane 1, the second colloid 302 and the third colloid 303 are both annular, the second colloid 302 surrounds the first colloid 301, and the first colloid 301 and the second colloid 302 are arranged at intervals; the third colloid 303 surrounds the second colloid 302, and the second colloid 302 and the third colloid 303 are disposed at an interval.

Accordingly, with reference to fig. 3, the cover film 1 includes two first pre-breaking lines 2, wherein one of the first pre-breaking lines 2 is located between the first colloid 301 and the second colloid 302, and the other first pre-breaking line 2 is located between the second colloid 302 and the third colloid 303.

Optionally, the embodiment further provides another specific structure of the glue layer 3 and the cover film 1, as shown in fig. 5, the cover film 1 is rectangular, and the cover film 1 has two first pre-breaking lines 2, and the cover film 1 is divided into three film bodies 11 by the two first pre-breaking lines 2. The glue layer 3 has three glue bodies 31, the three glue bodies 31 are respectively in a rectangular shape, and the length direction of the glue bodies 31 is parallel to the width direction of the cover film.

It is understood that the cover film 1 and the adhesive layer 3 may have other shapes, which is not limited in this embodiment.

Alternatively, as shown in fig. 4, the cover film 1 has a square shape, and one corner of the cover film 1 is provided with a chamfer 12 to facilitate alignment of the cover film 1 with the mother board 30 or the like, to further improve mounting accuracy.

In this embodiment, the cover film 1 is a release film or a silica gel adhesive film. Wherein, the silica gel mucosa can be a low mucosa or a weak silica gel mucosa, that is, the silica gel mucosa has small adhesive force.

Optionally, when the glue layer 3 is a double-sided glue, in order to prevent the film structure 20 from being contaminated during transportation, the film structure 20 further includes a protective film, specifically, the protective film covers the cover film 1, and the protective film is respectively attached to the plurality of glue bodies 31. The protective film may be a release film or a silicone adhesive film, which is not limited in this embodiment.

Example two

In another embodiment, as shown in fig. 6 to 9, the film assembly includes a carrier tape 10 and a film structure 20 according to the first embodiment.

The carrier tape 10 includes a first film sheet 101, a second film sheet 102, and a third film sheet 103, which are stacked, that is, the second film sheet 102 is located between the first film sheet 101 and the third film sheet 103. The second diaphragm 102 is provided with a limiting through hole 1021, the cover film 1 is positioned between the first diaphragm 101 and the second diaphragm 102, and the glue layer 3 is limited in the limiting through hole 1021 and is in contact with the third diaphragm 103, so that the first diaphragm 101, the second diaphragm 102 and the third diaphragm 103 can be matched with each other to fix the cover film 1 and the glue layer 3. By providing the limiting through hole 1021 on the second membrane 102, layered protection of the film structure 20 is achieved. If only set up two-layer from the type membrane, there is the difference in height between the surface of epiphragma 1 and the glue film 3, leads to two-layer unable protection glue film from the type membrane effectively, and then leads to appearing inefficacy in transportation or production process, through increasing second diaphragm 102, can utilize the thickness of second diaphragm 102 to compensate the difference in height between epiphragma 1 and the glue film 3.

Optionally, the first film 101 may be a low-adhesive film, the third film 103 may be a release film, the low-adhesive film is adhered to the upper surface of the cover film 1, the release film has a function of fixing the film structure 20, the release film is used for protecting the adhesive layer 3, and meanwhile, the limit through hole 1021 may be used for limiting, so that the film structure 20 is more stable.

In some embodiments, as shown in fig. 6, a plurality of limiting through holes 1021 and film structures 20 are provided, the plurality of limiting through holes 1021 are arranged at intervals along the extending direction of the first film 101, the plurality of limiting through holes 1021 correspond to the plurality of film structures 20 one-to-one, and the adhesive layer 3 of each film structure 20 is limited in the corresponding limiting through hole 1021.

In other embodiments, as shown in fig. 9, a plurality of limiting through holes 1021 are provided, the plurality of limiting through holes 1021 correspond to the plurality of colloids 31 one-to-one, and the colloids 31 are limited in the limiting through holes 1021 corresponding thereto.

EXAMPLE III

The present embodiment further provides a method for manufacturing the film structure 20 in the first embodiment, as shown in fig. 11, the method for manufacturing the film structure 20 includes the following steps:

s1, preparing a film.

The material of the membrane is a release film or a silica gel adhesive film, which is not limited in this embodiment. The size of the diaphragm is determined according to the size of the corresponding mother board 30.

And S2, sequentially forming at least one first pre-breaking line on the membrane sheet to divide the membrane sheet into a plurality of membrane bodies and further form the cover membrane.

And S3, sequentially adhering a plurality of colloids on the corresponding film bodies, and enabling the colloids to avoid the first pre-broken lines so as to form the film structure.

Alternatively, when the film structure further includes a second pre-break line, the second pre-break line is formed on the film sheet after step S2, and the second pre-break line crosses the first pre-break line, thereby forming the cover film.

Example four

The present embodiment provides an assembling method of a transmitting end, which is assembled by the film structure of the embodiment. Wherein the transmitting end includes a coil 40, a magnet 50 and a PC board 60. Specifically, as shown in fig. 12, the method for assembling the transmitting end includes the following steps:

s10, preparing a motherboard;

s20, adhering the film structure 20 to the motherboard 30 through a glue layer, wherein a cover film 1 is adhered to the glue layer;

s30, tearing off one membrane body of the cover membrane 1 to expose a colloid adhered to the membrane body;

s40, adhering the coil 40 of the transmitting end to a colloid;

s50, tearing off the other film body of the cover film to expose the other colloid adhered to the other film body;

s60, adhering the magnet 50 at the transmitting end to another colloid;

s70, tearing off the film body of the cover film to expose the colloid adhered to the film body;

and S80, adhering the PC board 60 at the transmitting end to another colloid.

Fig. 10 shows a flow chart of the film structure 20 shown in fig. 3 when assembling the emitter. First, as a step shown in fig. 10, a master 30 is prepared, and then a film structure 20 having substantially the same size as the master 30 is prepared. Then, as shown in step b of fig. 10, the pellicle structure 20 is bonded to the mother substrate 30, and specifically, the glue layer 3 on the pellicle structure 20 is bonded to the mother substrate 30. Subsequently, as shown in step c of fig. 10, the outermost film body 11 is torn off, and the outermost third colloid 303 is exposed. Then, as shown in step d of fig. 10, the coil 40 is bonded to the third colloid 303, and since only the third colloid 302 is exposed and the second colloid 302 and the first colloid 101 are not exposed, the second colloid 302 and the first colloid 101 can be prevented from being contaminated; in addition, since the position of the third colloid 303 is fixed and the area is not much different from the area of the coil 40, the accuracy of mounting the coil 40 can be improved and the error can be reduced. Next, as shown in step e of fig. 10, the film body 11 located in the middle ring is torn off, and at this time, the second colloid 302 is exposed, but the first colloid 301 is not exposed. Subsequently, as shown in step f of fig. 10, the magnet 50 is bonded to the second colloid 302. Next, as shown in step g of fig. 10, the film body 11 located at the center is torn off, and at this time, the first colloid 301 is exposed, and the shape and size of the first colloid 301 are the same as those of the PC board 60. Finally, as shown in fig. 10, step h, the PC board 60 is bonded to the first glue body 301, and the emitting end in step i is obtained as shown in fig. 10. Specifically, the transmitting terminal is a base portion of the wireless charger. The foregoing embodiments are merely illustrative of the principles and features of this invention, which is not limited to the above-described embodiments, but rather is susceptible to various changes and modifications without departing from the spirit and scope of the invention, which changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.