阅读说明：本技术 通讯接口套件装置及采用其的通讯方法、传感器套件装置 (Communication interface kit device, communication method using same, and sensor kit device ) 是由 王明聪 周健 章磊 邱文渊 冯玮 于 2020-12-24 设计创作，主要内容包括：本发明公开了通讯接口套件装置及采用其的通讯方法、传感器套件装置,涉及通讯技术领域。该装置包括：微控制单元,多个传感器通讯接口,选通单元,传感器外接组件,电源模块；其中,传感器通讯接口与选通单元设置于微控制单元与传感器外接组件之间；传感器通讯接口与微控制单元连接,选通单元与传感器外接组件的接口连接；基于传感器外接组件的类型确定多个传感器通讯接口中的一个或多个适配通讯接口,通过选通单元,使一个或多个适配通讯接口与传感器外接组件的接口建立连通,进而使微控制单元基于连通,在电源模块供电的情况下,实现与传感器外接组件的数据交互。该装置能够满足各种不同的外接组件的连接需求,灵活适配各种通讯接口。(The invention discloses a communication interface external member device, a communication method adopting the same and a sensor external member device, and relates to the technical field of communication. The device includes: the system comprises a micro control unit, a plurality of sensor communication interfaces, a gating unit, a sensor external component and a power module; the sensor communication interface and the gating unit are arranged between the micro control unit and the sensor external component; the sensor communication interface is connected with the micro control unit, and the gating unit is connected with an interface of the sensor external component; one or more adaptive communication interfaces in the plurality of sensor communication interfaces are determined based on the type of the sensor external component, the one or more adaptive communication interfaces are communicated with the interface of the sensor external component through the gating unit, and then the micro control unit is communicated to realize data interaction with the sensor external component under the condition that the power supply module supplies power. The device can meet the connection requirements of various different external components and flexibly adapt to various communication interfaces.)

1. A communication interface kit apparatus, comprising:

the system comprises a micro-control unit (100), a plurality of sensor communication interfaces (200), a gating unit (300), a sensor external component (400) and a power module (500); wherein the content of the first and second substances,

the sensor communication interface (200) and the gating unit (300) are arranged between the micro control unit (100) and the sensor external component (400); the sensor communication interface (200) is connected with the micro-control unit (100), and the gating unit (300) is connected with an interface of the sensor external component (400);

one or more adaptive communication interfaces in the plurality of sensor communication interfaces (200) are determined based on the type of the sensor external component (400), and the one or more adaptive communication interfaces are communicated with the interface of the sensor external component (400) through the gating unit (300), so that the micro control unit (100) realizes data interaction with the sensor external component (400) based on the communication under the condition that the power module (500) supplies power.

2. The apparatus according to claim 1, wherein the gating unit (300) comprises: a plurality of gates (310); the gate (310) comprises: a pin header (311) and a jump cap (312);

one end of the pin header (311) is connected with the sensor communication interface (200), and the other end of the pin header is connected with an interface of the sensor external component (400);

the jump cap (312) is used for enabling the adaptive communication interface to be communicated with an interface of the sensor external component (400) when the jump cap is in contact with the pin header (311).

3. The apparatus according to claim 1, wherein the gating unit (300) comprises: a channel gating unit (321) and a dial switch (322);

the dial switch (322) is used for controlling through the channel gating unit (321) when the switch is closed, so that the adaptive communication interface is communicated with the interface of the sensor external component (400).

4. The apparatus of claim 1, wherein said determining an adapted communication interface of said plurality of sensor communication interfaces (200) based on a type of sensor external component (400) comprises:

determining one or more adapted communication interface identifications of the plurality of sensor communication interfaces (200) based on the type identification of the sensor external component (400);

and taking the sensor communication interface corresponding to the one or more adaptive communication interface identifications as the adaptive communication interface.

5. The apparatus of claim 1, wherein the sensor communication interface (200) comprises: GPIO interface, UART interface, SPI interface, I2C interface, ADC interface, RS485 interface.

6. A communication method applied to the communication interface kit apparatus according to any one of claims 1 to 5, the method comprising:

acquiring type identification of a sensor external component (400);

determining an adaptive communication interface in the communication interface suite device based on the type identifier of the sensor external component (400), and further establishing communication between the adaptive communication interface and the interface of the sensor external component (400) through the gating unit (300);

and under the condition that the power supply module (501) supplies power, enabling the micro control unit (100) to be in data communication with the sensor external component (400) based on the communication.

7. A sensor kit apparatus, comprising: -a backplane (600), -a top plane (700), -a backplane and top plane connector (800), and-a communication interface kit assembly according to any of claims 1-5;

wherein, the bottom plate (600) is connected with the upper plate (700) through the bottom plate and the upper plate connector (800);

the micro control unit (100) and the power supply module (500) in the communication interface suite device are arranged on the bottom plate (600); a plurality of sensor communication interfaces (200), a gating unit (300) and a sensor external connection assembly (400) in the communication interface suite device are arranged on an upper plate (700);

the base plate (600) further comprises: a radio frequency module (601);

the radio frequency module (601) is used for providing a wireless communication function for the micro control unit (100).

Technical Field

The invention relates to the technical field of communication, in particular to a communication interface kit device, a communication method adopting the communication interface kit device and a sensor kit device adopting the communication interface kit device.

Background

In the process of developing a sensor suite product, functions and communication interfaces of each component need to be defined according to requirements, circuit design is carried out, and when product functions are iterated or new external sensors are added, developers need to carry out circuit design again to meet the connection requirements of new external components.

In the process of implementing the invention, the prior art at least has the following problems:

in the development process of series products of the sensor suite, when new external components are connected for communication, circuit design needs to be carried out again, the product development rate is low, the circuit design of the sensor suite cannot meet the universality, and manpower and material resources are wasted.

Disclosure of Invention

In view of this, embodiments of the present invention provide a communication interface kit device, a communication method using the same, and a sensor kit device, which can meet connection requirements of various external components and flexibly adapt to various communication interfaces.

To achieve the above object, according to an aspect of an embodiment of the present invention, there is provided a communication interface kit device including:

the system comprises a micro control unit, a plurality of sensor communication interfaces, a gating unit, a sensor external component and a power module; wherein the content of the first and second substances,

the sensor communication interface and the gating unit are arranged between the micro control unit and the sensor external component; the sensor communication interface is connected with the micro control unit, and the gating unit is connected with an interface of the sensor external component;

one or more adaptive communication interfaces in the plurality of sensor communication interfaces are determined based on the type of the sensor external component, the one or more adaptive communication interfaces are communicated with the interface of the sensor external component through the gating unit, and then the micro control unit is communicated with the sensor external component to realize data interaction with the sensor external component under the condition that the power module supplies power.

Optionally, the gating unit includes: a plurality of gates; the gating member includes: pin header, jump cap;

one end of the pin header is connected with a sensor communication interface, and the other end of the pin header is connected with an interface of the sensor external connection component;

and the jump cap is used for establishing communication between the adaptive communication interface and the interface of the sensor external component when the jump cap is in contact with the pin header.

Optionally, the gating unit includes: a channel gating unit and a dial switch;

the dial switch is used for controlling through the channel gating unit when the switch is closed, so that the adaptive communication interface is communicated with an interface of the sensor external component.

Optionally, the determining an adapted communication interface of the plurality of sensor communication interfaces based on the type of the sensor external component includes:

determining one or more adaptive communication interface identifications in the plurality of sensor communication interfaces based on the type identification of the sensor external component;

and taking the sensor communication interface corresponding to the one or more adaptive communication interface identifications as the adaptive communication interface.

Optionally, the sensor communication interface comprises: GPIO interface, UART interface, SPI interface, I2C interface, ADC interface, RS485 interface.

According to another aspect of the embodiments of the present invention, there is provided a communication method applied to the communication interface kit apparatus provided by the present invention, including:

acquiring a type identifier of an external component of a sensor;

determining an adaptive communication interface in the communication interface suite device based on the type identifier of the sensor external component, and further establishing communication between the adaptive communication interface and the interface of the sensor external component through the gating unit;

and under the condition that the power supply module supplies power, the micro control unit is enabled to carry out data communication with the sensor external component based on the communication.

According to another aspect of an embodiment of the present invention, there is provided a sensor kit device including:

the communication interface kit comprises a bottom plate, an upper plate, a bottom plate and upper plate connector assembly and the communication interface kit device provided by the invention;

the bottom plate and the upper plate are connected with the upper plate connector through the bottom plate;

the micro control unit and the power module in the communication interface suite device are arranged on the bottom plate; a plurality of sensor communication interfaces, a gating unit and a sensor external component in the communication interface suite device are arranged on the upper plate;

the base plate further includes: a radio frequency module;

the radio frequency module is used for providing a wireless communication function for the micro control unit.

One embodiment of the above invention has the following advantages or benefits: because the adoption has set up a plurality of sensor communication interfaces and gating unit, with according to the type of sensor through gating unit control adaptation communication interface and the external subassembly interface intercommunication of sensor, and then make little the control unit can carry out the technical means of data interaction with the external subassembly of sensor under the condition of power module power supply, so overcome the circuit design of sensor external member among the prior art and can't satisfy the commonality, whenever there is new external subassembly to connect the communication and all need to carry out circuit design again and the product research and development speed that leads to is slower, the technical problem of extravagant manpower and materials, and then can satisfy the connection demand of various different external subassemblies, the technological effect of various communication interfaces of nimble adaptation.

Further effects of the above-mentioned non-conventional alternatives will be described below in connection with the embodiments.

Drawings

The drawings are included to provide a better understanding of the invention and are not to be construed as unduly limiting the invention. Wherein:

FIG. 1 is a schematic diagram of the components of a communication interface kit apparatus according to a first embodiment of the present invention;

FIG. 2(a) is a schematic diagram of a connection unit of a communication interface kit according to a second embodiment of the present invention;

FIG. 2(b) is a schematic diagram illustrating a connection unit of a communication interface kit according to a third embodiment of the present invention;

fig. 3 is a schematic main flow chart of a communication method according to a fourth embodiment of the present invention;

FIG. 4(a) is a schematic view of the components of a base plate of a sensor assembly according to a fifth embodiment of the present invention;

FIG. 4(b) is a schematic view of upper plate components in a sensor assembly according to a fifth embodiment of the present invention;

FIG. 5(a) is a schematic view of the upper plate components of a water leak sensor kit assembly in accordance with a sixth embodiment of the present invention;

FIG. 5(b) is a schematic diagram of an upper board circuit structure for a water leakage sensor kit device according to a sixth embodiment of the present invention;

FIG. 6(a) is a schematic view of upper plate components for a fluid level sensor package apparatus according to a seventh embodiment of the present invention;

FIG. 6(b) is a schematic diagram of a top plate circuit configuration for a fluid level sensor package apparatus according to a seventh embodiment of the present invention;

FIG. 7(a) is a schematic view of upper plate components for a water pressure sensor kit assembly in accordance with an eighth embodiment of the present invention;

FIG. 7(b) is a schematic diagram of an upper plate circuit structure for a water pressure sensor kit apparatus according to an eighth embodiment of the present invention;

fig. 8(a) is a schematic view of upper plate components for a temperature and humidity sensor kit device according to a ninth embodiment of the present invention;

fig. 8(b) is a schematic diagram of a circuit structure of an upper board for a temperature and humidity sensor kit device according to a ninth embodiment of the present invention;

FIG. 9(a) is a schematic view of upper plate components for a light sensor package apparatus according to a tenth embodiment of the present invention;

FIG. 9(b) is a schematic diagram of a top board circuit structure for a light sensor package apparatus according to a tenth embodiment of the present invention;

FIG. 10(a) is a schematic view of upper plate components for a noise sensor package apparatus according to an eleventh embodiment of the present invention;

FIG. 10(b) is a schematic diagram of a top board circuit structure for a noise sensor package apparatus according to an eleventh embodiment of the present invention;

FIG. 11(a) is a schematic view of the upper plate components of a leak, level and illumination three-in-one sensor suite arrangement according to a twelfth embodiment of the present invention;

fig. 11(b) is a schematic diagram of an upper board circuit structure of a water-leakage, liquid-level and illumination three-in-one sensor suite device according to a twelfth embodiment of the invention.

Detailed Description

Exemplary embodiments of the present invention are described below with reference to the accompanying drawings, in which various details of embodiments of the invention are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the invention. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

Fig. 1 is a schematic diagram of components of a communication interface kit according to a first embodiment of the present invention, as shown in fig. 1, the communication interface kit includes:

the system comprises a micro-control unit 100, a plurality of sensor communication interfaces 200, a gating unit 300, a sensor external component 400 and a power supply module 500; wherein the content of the first and second substances,

the sensor communication interface 200 and the gating unit 300 are arranged between the micro control unit 100 and the sensor external component 400; the sensor communication interface 200 is connected with the micro control unit 100, and the gating unit 300 is connected with an interface of the sensor external component 400;

one or more adaptive communication interfaces in the plurality of sensor communication interfaces 200 are determined based on the type of the sensor external component 400, and the one or more adaptive communication interfaces are communicated with the interface of the sensor external component 400 through the gating unit 300, so that the micro control unit 100 realizes data interaction with the sensor external component 400 based on the communication under the condition that the power module 500 supplies power.

According to the communication interface suite device, the plurality of sensor communication interfaces and the gating unit are arranged, so that the adaptive communication interfaces are controlled to be communicated with the sensor external component interface through the gating unit according to the type of the sensor, and further the micro control unit can perform data interaction with the sensor external component under the condition of power supply of the power module, so that the technical problems that the circuit design of the sensor suite in the prior art cannot meet the universality, the product research and development speed is low and manpower and material resources are wasted due to the fact that circuit design needs to be carried out again when a new external component performs connection communication are solved, the connection requirements of various different external components can be met, and the technical effects of various communication interfaces are flexibly adapted.

Fig. 2(a) is a schematic diagram illustrating a gating unit in a communication interface kit according to a second embodiment of the present invention, and as shown in fig. 2(a), the gating unit 300 may include:

a plurality of gates 310; wherein the gate 310 includes: pin header 311, jump cap 312;

one end of the pin header 311 is connected to the sensor communication interface 200, and the other end is connected to the interface of the external sensor assembly 400.

The jumper cap 312 is used for establishing communication between the adaptive communication interface and the interface of the sensor external component 400 when the jumper cap is in contact with the pin header 311.

FIG. 2(b) is a schematic diagram illustrating a connection unit of a communication interface kit according to a third embodiment of the present invention; as shown in fig. 2(b), the gating unit 300 may further include:

a channel gating unit 321, a toggle switch 322;

the dial switch 322 may be configured to control the channel gating unit 321 to establish communication between the adaptive communication interface and the interface of the sensor external component 400 when the corresponding switch is closed.

When the corresponding channel function is started through the dial switch, the channel gating unit automatically realizes the communication between the current channel and the external communication interface, and the product is convenient to develop and iterate quickly.

In some embodiments, the determining an adapted communication interface of the plurality of sensor communication interfaces 200 based on the type of the sensor-external assembly 400 includes:

determining one or more adapted communication interface identifications of the plurality of sensor communication interfaces 200 based on the type identification of the sensor external component 400;

and taking the sensor communication interface corresponding to the one or more adaptive communication interface identifications as the adaptive communication interface.

In some embodiments, the sensor communication interface 200 comprises: GPIO interface, UART interface, SPI interface, I2C interface, ADC interface, RS485 interface.

Wherein, GPIO interface (General Purpose Input Output) is General Purpose Input/Output port;

a UART interface (Universal Asynchronous Receiver/Transmitter) is a Universal Asynchronous Receiver/Transmitter interface;

the SPI Interface (Serial Peripheral Interface) is a Serial Peripheral Interface;

the I2C interface (Inter-Integrated Circuit) is a two-wire serial bus interface;

the ADC interface (Analog to Digital Converter) is an Analog to Digital Converter interface.

Fig. 3 is a schematic main flow chart of a communication method according to a fourth embodiment of the present invention, as shown in fig. 3, the communication method is applied to a communication interface kit apparatus provided by the present invention, and includes:

s301, acquiring a type identifier of the sensor external component 400;

step S302, determining an adaptive communication interface in the communication interface suite device based on the type identifier of the sensor external component 400, and further establishing communication between the adaptive communication interface and the interface of the sensor external component 400 through the gating unit 300;

step S303, under the condition that the power module 501 supplies power, the micro control unit 100 performs data communication with the sensor external component 400 based on the communication.

FIG. 4(a) is a schematic view of the components of a base plate of a sensor assembly according to a fifth embodiment of the present invention;

FIG. 4(b) is a schematic view of upper plate components in a sensor assembly according to a fifth embodiment of the present invention;

as shown in fig. 4(a) and 4(b), the sensor kit device includes:

a backplane 600, an upper plane 700, a backplane and upper plane connector 800, and a communication interface kit apparatus provided by the present invention;

wherein, the bottom plate 600 and the upper plate 700 are connected with the upper plate connector 800 through the bottom plate;

the micro control unit 100 and the power module 500 in the communication interface kit device are arranged on the bottom plate 600; a plurality of sensor communication interfaces 200, a gating unit 300 and a sensor external component 400 in the communication interface suite device are arranged on an upper plate 700;

the base plate 600 further includes: a radio frequency module 601;

the rf module 601 is used for providing a wireless communication function for the mcu 100.

In a bottom plate circuit of the sensor suite device, a power supply module, an MCU (micro control unit) module and a radio frequency module of the sensor suite are mainly designed; the power supply module can provide proper power supply for all modules on the circuit according to the power supply requirement of the sensor; except for the communication with the radio frequency module, the MCU module can connect idle IO and communication interfaces of the MCU to the connectors of the bottom plate and the upper plate as much as possible; the radio frequency module can provide a wireless communication function;

in the upper plate circuit of the sensor suite device, the sensor suite device mainly comprises all communication interfaces and power supplies of external components, and a gating unit selects a proper communication interface to connect according to the communication interface requirements of the external components so as to meet the communication requirements of flexibly adapting to different external components (sensors).

FIG. 5(a) is a schematic view of the upper plate components of a water leak sensor kit assembly in accordance with a sixth embodiment of the present invention;

FIG. 5(b) is a schematic diagram of an upper board circuit structure for a water leakage sensor kit device according to a sixth embodiment of the present invention;

as shown in fig. 5(a) and 5(b), when the water leakage sensor is designed, the external water leakage sensor monitoring unit needs to be connected through the communication interface, the GPIO needs to be used for communication, and the jump cap can be used for communicating the GPIO interface with the external communication interface, so that the state information of the water leakage sensor monitoring unit can be read, and the water leakage sensor product development can be rapidly carried out.

FIG. 6(a) is a schematic view of upper plate components for a fluid level sensor package apparatus according to a seventh embodiment of the present invention;

FIG. 6(b) is a schematic diagram of a top plate circuit configuration for a fluid level sensor package apparatus according to a seventh embodiment of the present invention;

as shown in fig. 6(a) and 6(b), when designing the liquid level sensor, the external liquid level sensor monitoring unit needs to be connected through the communication interface, the UART needs to be used for communication, the jump cap can be used for communicating the UART interface with the external communication interface, so that the state information of the liquid level sensor monitoring unit can be read, and the liquid level sensor product development can be rapidly carried out.

FIG. 7(a) is a schematic view of upper plate components for a water pressure sensor kit assembly in accordance with an eighth embodiment of the present invention;

FIG. 7(b) is a schematic diagram of an upper plate circuit structure for a water pressure sensor kit apparatus according to an eighth embodiment of the present invention;

as shown in fig. 7(a) and 7(b), when designing the water pressure sensor, the external water pressure sensor monitoring unit needs to be connected through the communication interface, the SPI needs to be used for communication, and the jump cap can be used for communicating the SPI interface with the external communication interface, so that the state information of the water pressure sensor monitoring unit can be read, and the water pressure sensor product development can be rapidly carried out.

Fig. 8(a) is a schematic view of upper plate components for a temperature and humidity sensor kit device according to a ninth embodiment of the present invention;

fig. 8(b) is a schematic diagram of a circuit structure of an upper board for a temperature and humidity sensor kit device according to a ninth embodiment of the present invention;

as shown in fig. 8(a) and 8(b), when designing the temperature and humidity sensor, the external water leakage sensor monitoring unit needs to be connected through the communication interface, I2C needs to be used for communication, and the jump cap can be used for communicating the I2C interface with the external communication interface, so that the state information of the temperature and humidity sensor monitoring unit can be read, and the temperature and humidity sensor product development can be rapidly carried out.

FIG. 9(a) is a schematic view of upper plate components for a light sensor package apparatus according to a tenth embodiment of the present invention;

FIG. 9(b) is a schematic diagram of a top board circuit structure for a light sensor package apparatus according to a tenth embodiment of the present invention;

as shown in fig. 9(a) and 9(b), when designing the illumination sensor, the external illumination sensor monitoring unit needs to be connected through the communication interface, the ADC needs to be used for communication, and the jumper cap can be used for communicating the ADC interface with the external communication interface, so that the state information of the illumination sensor monitoring unit can be read, and the development of the illumination sensor product can be rapidly performed.

FIG. 10(a) is a schematic view of upper plate components for a noise sensor package apparatus according to an eleventh embodiment of the present invention;

FIG. 10(b) is a schematic diagram of a top board circuit structure for a noise sensor package apparatus according to an eleventh embodiment of the present invention;

as shown in fig. 10(a) and 10(b), when designing a noise sensor, the external noise sensor monitoring unit needs to be connected through the communication interface, GPIO needs to be used for communication, and the jump cap can be used for communicating the RS485 interface with the external communication interface, so that the state information of the noise sensor monitoring unit can be read, and the development of noise sensor products can be rapidly carried out.

FIG. 11(a) is a schematic view of the upper plate components of a leak, level and illumination three-in-one sensor suite arrangement according to a twelfth embodiment of the present invention;

fig. 11(b) is a schematic diagram of an upper board circuit structure of a water-leakage, liquid-level and illumination three-in-one sensor suite device according to a twelfth embodiment of the invention.

As shown in fig. 11(a), 11(b), when the design leaks, the liquid level, when the trinity sensor of illumination, need be through three kinds of external sensor monitoring units of communication interface connection, need use GPIO, UART, ADC carry out the communication, can use the jump cap with GPIO, UART, ADC interface and external communication interface intercommunication, just so can read the state information who leaks, the liquid level, the illumination sensor monitoring unit, leak fast, the liquid level, the trinity sensor product development of illumination.

According to the technical scheme of the embodiment of the invention, because a plurality of sensor communication interfaces and gating units are arranged, the adaptive communication interfaces are controlled to be communicated with the sensor external component interface through the gating units according to the types of the sensors, and then the micro control unit can perform data interaction with the sensor external component under the condition of power supply of the power module, so that the technical problems that the circuit design of the sensor suite in the prior art cannot meet the universality, and the product research and development rate is slow and manpower and material resources are wasted due to the fact that circuit design needs to be carried out again when a new external component performs connection communication are solved, the connection requirements of various external components can be met, and the technical effects of various communication interfaces can be flexibly adapted.

The above-described embodiments should not be construed as limiting the scope of the invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions can occur, depending on design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.