阅读说明：本技术 一种芯片镀膜制程中真空腔体零件的清洗方法 (Method for cleaning vacuum cavity part in chip coating process ) 是由 朱振华 何天阳 蒋发权 孔维龙 于 2021-09-15 设计创作，主要内容包括：本发明公开了一种芯片镀膜制程中真空腔体零件的清洗方法,包括(1)零件遮蔽：将铝制零件不含金的部分涂敷遮蔽胶,静置固化；(2)脱金：将遮蔽胶固化后的铝零件没入脱金液中,静置脱金；(3)清洗：将脱金后的铝零件用去离子水冲洗,并对残留在铝零件表面的固体杂质打磨处理；(4)脱胶清洗：将清洗后的铝零件进行脱胶处理；(5)抽滤：将脱金后的脱金液进行过滤,得到含金的脱金液,向脱金液中加入还原剂提取金,底渣王水溶解,再进行赶硝还原,加入还原剂提取金。本发明通过对脱金液配方的改进,利用脱金促进剂和十二烷基肌氨酸钠的共同作用,提高了氢氧化钾与碘化钾的活性,相比现有技术,本发明具有脱金速率快,且不腐蚀铝基材等优点。(The invention discloses a method for cleaning a vacuum cavity part in a chip coating process, which comprises the following steps of (1) shielding the part: coating shielding glue on the non-gold-containing part of the aluminum part, and standing and curing; (2) gold removal: immersing the aluminum part solidified by the shielding glue into a gold removing liquid, and standing for gold removing; (3) cleaning: washing the aluminum part subjected to the gold removal by using deionized water, and polishing solid impurities remained on the surface of the aluminum part; (4) degumming and cleaning: degumming the cleaned aluminum parts; (5) and (3) suction filtration: filtering the gold-removed solution to obtain gold-containing gold-removed solution, adding a reducing agent into the gold-removed solution to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold. The invention improves the formula of the gold removing liquid, utilizes the combined action of the gold removing accelerant and the sodium dodecyl sarcosinate, improves the activity of the potassium hydroxide and the potassium iodide, and has the advantages of high gold removing speed, no corrosion to an aluminum substrate and the like compared with the prior art.)

1. A method for cleaning a vacuum cavity part in a chip coating process is characterized by comprising the following steps:

(1) shielding parts: coating shielding glue on the part of the aluminum vacuum cavity part which does not contain gold, and standing until the shielding glue is solidified;

(2) gold removal: immersing the aluminum part after the curing of the shielding glue into a gold removing liquid, standing for gold removing until gold on the aluminum part is completely dissolved and removed;

(3) cleaning: washing the aluminum part subjected to the gold removal in the step (2) with deionized water, and polishing solid impurities remained on the surface of the aluminum part;

(4) degumming and cleaning: degumming the cleaned aluminum parts;

(5) and (3) suction filtration: and (3) filtering the gold-removed liquid obtained in the step (2) to obtain gold-containing gold-removed liquid, adding a reducing agent into the gold-removed liquid to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold.

2. The cleaning method according to claim 1, wherein the masking adhesive in step (1) is an emulsion pressure-sensitive adhesive obtained by emulsion polymerization of an acrylate monomer.

3. The cleaning method according to claim 1, wherein the part masking in step (1) is performed by applying a masking paste under an air draft environment.

4. The cleaning method according to claim 1, wherein the gold removing solution in the step (2) comprises the following components: potassium hydroxide, sodium lauryl sarcosinate, potassium iodide and a gold removal promoter.

5. The cleaning method according to claim 1, wherein the gold removing solution comprises the following components: 3-8g/L of potassium hydroxide, 3-12g/L of potassium iodide, 0.5-3g/L of sodium lauryl sarcosinate and 8-15g/L of gold removal promoter.

6. The cleaning method according to claim 5, wherein the gold removing solution comprises the following components: 5-6g/L of potassium hydroxide, 5-10g/L of potassium iodide, 1-2g/L of sodium lauryl sarcosinate and 10-12g/L of gold removal promoter.

7. The cleaning method according to claim 1, wherein the degumming treatment in step (1) is: and (3) uniformly coating the diluent on the surface of the shielding glue in an air draft environment, and washing with deionized water after the shielding glue is dissolved and the aluminum bottom layer is exposed.

8. The cleaning method according to claim 1, wherein the diluent is a polyol solvent.

9. The cleaning method according to claim 8, wherein the diluent comprises the following components in percentage by weight: 8-25% of glycol, 18-25% of alcohol, 6-25% of Naemarrhena water and the balance of water.

10. A vacuum chamber part prepared by the cleaning method of any one of claims 1 to 9.

Technical Field

The invention belongs to the technical field of part cleaning, and relates to a method for cleaning a vacuum cavity part in a chip coating process.

Background

A process for coating film on chip includes such steps as coating a layer of metal film on the surface of chip, and coating a layer of metal film on the surface of chip. The equipment used in the process is called physical vapor film deposition equipment and is also called PVD coating equipment. In the process, more and more metal is adhered to the vacuum chamber of the PVD coating equipment, and the deposited metal may cause peeling, slag dropping and the like on the spot, thereby affecting the stability of the coating process. Therefore, after a certain period of time, the parts of the vacuum chamber need to be cleaned by metal deposition before the production can be continued.

At present, vacuum cavity parts in a chip coating process have parts using aluminum as a base material, gold metal is deposited on the surfaces of the aluminum parts, and because the chemical properties of aluminum are active, the vacuum cavity parts are cleaned by the existing cleaning process, so that the aluminum base material is easily over-corroded, and the gold removing speed is slow, therefore, the development of a cleaning method which has high gold removing speed, does not corrode the aluminum base material and does not damage the aluminum parts is urgently needed.

Disclosure of Invention

In order to solve the technology, the invention provides a method for cleaning a vacuum cavity part in a chip coating process.

In order to achieve the purpose, the invention adopts the following technical scheme:

a method for cleaning a vacuum cavity part in a chip coating process comprises the following steps:

(1) shielding parts: coating shielding glue on the part of the aluminum vacuum cavity part which does not contain gold, and standing until the shielding glue is solidified;

(2) gold removal: immersing the aluminum part after the curing of the shielding glue into a gold removing liquid, standing for gold removing until gold on the aluminum part is completely dissolved and removed;

(3) cleaning: washing the aluminum part subjected to the gold removal in the step (2) with deionized water, and polishing solid impurities remained on the surface of the aluminum part;

(4) degumming and cleaning: degumming the cleaned aluminum parts;

(5) and (3) suction filtration: and (3) filtering the gold-removed liquid obtained in the step (2) to obtain gold-containing gold-removed liquid, adding a reducing agent into the gold-removed liquid to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold.

Preferably, the masking adhesive in the step (1) is an emulsion pressure-sensitive adhesive formed by polymerizing an acrylate monomer by an emulsion method.

Preferably, the part shielding in the step (1) is coated with shielding glue under the air draft environment.

Preferably, the gold removing liquid in the step (2) comprises the following components: potassium hydroxide, potassium iodide, sodium lauryl sarcosinate and a gold removal promoter.

Further preferably, the gold removing liquid comprises the following components: 3-8g/L of potassium hydroxide, 3-12g/L of potassium iodide, 0.5-3g/L of sodium lauryl sarcosinate and 8-15g/L of gold removal promoter. Further, the gold removing liquid comprises the following components: 5-6g/L of potassium hydroxide, 5-10g/L of potassium iodide, 1-2g/L of sodium lauryl sarcosinate and 10-12g/L of gold removal promoter.

Preferably, the degumming treatment in step (1) is: and (3) uniformly coating the diluent on the surface of the shielding glue in an air draft environment, and washing with deionized water after the shielding glue is dissolved and the aluminum bottom layer is exposed.

Further preferably, the diluent is a polyol solvent.

Further preferably, the diluent comprises the following components in percentage by weight: 8-25% of glycol, 18-25% of alcohol, 6-25% of Tianpan water and the balance of water; still more preferably, the diluent comprises the following components in percentage by weight: 10-20% of glycol, 20-22% of alcohol, 10-20% of Naemarrhena water and the balance of water.

The invention also provides a vacuum cavity part prepared by the cleaning method.

Preferably, the vacuum chamber part is an aluminum-based gold-plated part.

The invention has the beneficial effects that:

the method for cleaning the vacuum cavity part in the chip coating process improves the activity of potassium hydroxide and potassium iodide by improving the formula of the gold removing liquid and utilizing the combined action of the gold removing promoter and the sodium dodecyl sarcosinate.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Before the present embodiments are further described, it is to be understood that the scope of the invention is not limited to the particular embodiments described below; it is also to be understood that the terminology used in the examples is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention.

When numerical ranges are given in the examples, it is understood that both endpoints of each of the numerical ranges and any value therebetween can be selected unless the invention otherwise indicated. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

The present invention is not limited to the sources of the raw materials, and the raw materials used are all common commercial products unless otherwise specified. Wherein the gold removing promoter is lead oxide powder, and the masking glue is Fuji NE 3000S.

A method for cleaning a vacuum cavity part in a chip coating process comprises the following steps:

(1) shielding parts: coating shielding glue on the gold-free part of the aluminum vacuum cavity part in an air draft environment, and standing until the shielding glue is cured; the shielding adhesive is an emulsion pressure-sensitive adhesive formed by polymerizing an acrylate monomer by an emulsion method;

(2) gold removal: immersing the aluminum part after the curing of the shielding glue into a gold removing liquid, standing for gold removing until gold on the aluminum part is completely dissolved and removed;

the gold removing liquid comprises the following components: 3-8g/L of potassium hydroxide, 3-12g/L of potassium iodide, 0.5-3g/L of sodium lauryl sarcosinate and 8-15g/L of gold removal promoter;

(3) cleaning: washing the aluminum part subjected to the gold removal in the step (2) with deionized water, and polishing solid impurities remained on the surface of the aluminum part;

(4) degumming and cleaning: degumming the cleaned aluminum parts; specifically, under the air draft environment, uniformly coating a diluent on the surface of a shielding adhesive, and washing with deionized water after the shielding adhesive is dissolved and an aluminum bottom layer is exposed;

the diluent comprises the following components in percentage by weight: 8-25% of glycol, 18-25% of alcohol, 6-25% of Tianpan water and the balance of water;

(5) and (3) suction filtration: and (3) filtering the gold-removed liquid obtained in the step (2) to obtain gold-containing gold-removed liquid, adding a reducing agent into the gold-removed liquid to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold.

Example 1

A method for cleaning a vacuum cavity part in a chip coating process comprises the following steps:

(1) shielding parts: coating shielding glue on the gold-free part of the aluminum vacuum cavity part in an air draft environment, and standing until the shielding glue is cured; the shielding adhesive is an emulsion pressure-sensitive adhesive formed by polymerizing an acrylate monomer by an emulsion method;

(2) gold removal: immersing the aluminum part after the curing of the shielding glue into a gold removing liquid, standing for gold removing until gold on the aluminum part is completely dissolved and removed;

the gold removing liquid comprises the following components: 5g/L of potassium hydroxide, 8g/L of potassium iodide, 1.2g/L of sodium dodecyl sarcosinate and 10g/L of gold removal promoter;

(3) cleaning: washing the aluminum part subjected to the gold removal in the step (2) with deionized water, and polishing solid impurities remained on the surface of the aluminum part;

(4) degumming and cleaning: degumming the cleaned aluminum parts; specifically, under the air draft environment, uniformly coating a diluent on the surface of a shielding adhesive, and washing with deionized water after the shielding adhesive is dissolved and an aluminum bottom layer is exposed;

the diluent comprises the following components in percentage by weight: 15% of glycol, 20% of alcohol, 18% of Naemarrhena water and the balance of water;

(5) and (3) suction filtration: and (3) filtering the gold-removed liquid obtained in the step (2) to obtain gold-containing gold-removed liquid, adding a reducing agent into the gold-removed liquid to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold.

Example 2

A method for cleaning a vacuum cavity part in a chip coating process comprises the following steps:

(1) shielding parts: coating shielding glue on the gold-free part of the aluminum vacuum cavity part in an air draft environment, and standing until the shielding glue is cured; the shielding adhesive is an emulsion pressure-sensitive adhesive formed by polymerizing an acrylate monomer by an emulsion method;

(2) gold removal: immersing the aluminum part after the curing of the shielding glue into a gold removing liquid, standing for gold removing until gold on the aluminum part is completely dissolved and removed;

the gold removing liquid comprises the following components: 3g/L of potassium hydroxide, 12g/L of potassium iodide, 3g/L of sodium dodecyl sarcosinate and 15g/L of gold removal promoter.

(3) Cleaning: washing the aluminum part subjected to the gold removal in the step (2) with deionized water, and polishing solid impurities remained on the surface of the aluminum part;

(4) degumming and cleaning: degumming the cleaned aluminum parts; specifically, under the air draft environment, uniformly coating a diluent on the surface of a shielding adhesive, and washing with deionized water after the shielding adhesive is dissolved and an aluminum bottom layer is exposed;

the diluent comprises the following components in percentage by weight: 8% of glycol, 25% of alcohol, 6% of Tianna water and the balance of water;

(5) and (3) suction filtration: and (3) filtering the gold-removed liquid obtained in the step (2) to obtain gold-containing gold-removed liquid, adding a reducing agent into the gold-removed liquid to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold.

Example 3

A method for cleaning a vacuum cavity part in a chip coating process comprises the following steps:

(1) shielding parts: coating shielding glue on the gold-free part of the aluminum vacuum cavity part in an air draft environment, and standing until the shielding glue is cured; the shielding adhesive is an emulsion pressure-sensitive adhesive formed by polymerizing an acrylate monomer by an emulsion method;

(2) gold removal: immersing the aluminum part after the curing of the shielding glue into a gold removing liquid, standing for gold removing until gold on the aluminum part is completely dissolved and removed;

the gold removing liquid comprises the following components: 8g/L of potassium hydroxide, 3g/L of potassium iodide, 0.5g/L of sodium dodecyl sarcosinate and 8g/L of gold removal promoter;

(3) cleaning: washing the aluminum part subjected to the gold removal in the step (2) with deionized water, and polishing solid impurities remained on the surface of the aluminum part;

(4) degumming and cleaning: degumming the cleaned aluminum parts; specifically, under the air draft environment, uniformly coating a diluent on the surface of a shielding adhesive, and washing with deionized water after the shielding adhesive is dissolved and an aluminum bottom layer is exposed;

the diluent comprises the following components in percentage by weight: 25% of glycol, 18% of alcohol, 25% of Naemarrhena water and the balance of water;

(5) and (3) suction filtration: and (3) filtering the gold-removed liquid obtained in the step (2) to obtain gold-containing gold-removed liquid, adding a reducing agent into the gold-removed liquid to extract gold, dissolving the bottom slag aqua regia, performing nitrate-removing reduction, and adding a reducing agent to extract gold.

Comparative example 1

This comparative example differs from example 1 in that: the gold removing liquid comprises the following components: 10g/L of potassium hydroxide, 10g/L of potassium iodide, 5g/L of sodium dodecyl sarcosinate and 10g/L of gold removal promoter.

Comparative example 2

This comparative example differs from example 1 in that: the gold removing liquid comprises the following components: 7g/L of potassium hydroxide, 15g/L of potassium iodide, 0.3g/L of sodium dodecyl sarcosinate and 20g/L of gold removal promoter.

The experimental data of examples 1-3 and comparative examples 1-2 are shown in table 1.

TABLE 1

Group of	Time of gold removal h	Total amount of gold removed g	Efficiency of gold removal g/h
				Example 1	44	2426	55.14
Example 2	52	2209	42.48
				Example 3	55	2377	43.22
Comparative example 1	44	1589	36.11
				Comparative example 2	44	1530	34.77

As can be seen from the above-mentioned examples 1-3, the method for cleaning vacuum chamber parts in the chip coating process of the present invention has the advantages of short gold-removing time of 44-55h, gold-removing amount of 2209-2426g, and gold-removing efficiency of 42.48-55.14g/h, which indicates that the cleaning method of the present invention improves the formula of the gold-removing solution, utilizes the combined action of the gold-removing promoter and sarcosyl to improve the activity of potassium hydroxide and potassium iodide, has high gold-removing speed, and does not corrode the aluminum substrate.

Meanwhile, as can be seen from comparative examples 1 and 2, when the amount of each component in the gold removing solution is changed to the conventional amount, the gold removing efficiency is only 34.77-36.11g/h, which indicates that the amount of each component has a large influence on the gold removing rate, and when the amount of each component in the gold removing solution is changed to the conventional amount, the technical effect of improving the gold removing rate cannot be achieved.