阅读说明：本技术 一种散粒芯片取放的方法 (Method for taking and placing bulk chip ) 是由 陈永胜 张晓飞 于 2021-09-13 设计创作，主要内容包括：本发明涉及散粒芯片取放设备技术领域,具体涉及一种散粒芯片取放的方法,具体操作步骤为：S1：先通过摇盘真空接口使得摇盘与真空设备进行连接,然后将芯片倒入摇盘内,前后摇动,正向芯片会自动落入模穴中并被真空吸住,反向芯片落入模穴后,由于芯片上表面是斜面,模穴四周也是斜面,芯片即无法在模穴中卡住从而滑出,其他正向芯片会继续滑入模穴内,从而将所有模穴填满,本发明通过各个装置之间的配合作用可将芯片放置的位置精度可达到0.05mm.保证锡膏点可以完全在芯片的中心,提高了产品的良率及稳定性。(The invention relates to the technical field of loose chip taking and placing equipment, in particular to a method for taking and placing loose chips, which comprises the following specific operation steps: s1: the invention can ensure that the position precision of the chip can reach 0.05mm through the matching action among all devices, ensure that a tin paste point can be completely in the center of the chip, and improve the yield and the stability of products.)

1. A method for taking and placing a bulk chip is characterized in that: the specific operation steps are as follows:

s1: firstly, the rocking disc (200) is connected with vacuum equipment through the rocking disc vacuum interface (210), then the chip is poured into the rocking disc (200), the rocking disc is rocked forwards and backwards, the forward chip automatically falls into the die cavity (230) and is sucked by vacuum, after the reverse chip falls into the die cavity (230), because the upper surface of the chip is an inclined plane, the periphery of the die cavity (230) is also an inclined plane, the chip cannot be clamped in the die cavity to slide out, and other forward chips continuously slide into the die cavity (230), so that all the die cavities (230) are filled;

s2: after the rocking disc (200) is fully rocked with chips, the chips are placed on a rocking disc placing frame (130) above the rocking disc placing table (100), the rocking disc placing frame (130) is designed with two positions, and after one of the rocking disc chips is used up, the chip is automatically switched to the other rocking disc (200);

s3: after the rocking disc (200) is placed on the rocking disc placing frame (130), a motor a (110) is started, the motor a (110) can drive a lead screw (120) to rotate, and a rocking disc placing table (100) arranged when the lead screw (120) rotates can drive the rocking disc (200) to move to the position right below a main fixing plate (300);

s4: then, a motor c on the Z-axis manipulator (410) drives an electric slide rail b to enable a slide fixing frame (430) to drive a main fixing plate (300) to move downwards, then a vacuum chamber in a suction nozzle fixing plate (310) is vacuumized through vacuum equipment, then the suction nozzle fixing plate (310) can suck a chip through a rubber suction nozzle (311), and before the rubber suction nozzle (311) is contacted with the chip, the angle of the suction nozzle fixing plate (310) is finely adjusted through an X-direction rotary adjusting block (320), a Y-direction rotary adjusting block (330) and a horizontal direction adjusting block (340) so that the rubber suction nozzle (311) can be completely attached to the chip on the rocking disc (200);

s5: after the rubber suction nozzle (311) is completely attached, the arranged vacuum flow sensor (420) can detect the vacuum value at the suction nozzle fixing plate (310), when the vacuum value measured by the vacuum flow sensor (420) does not reach a set value, the vacuum flow sensor is stopped to alarm, prompt inspection and confirmation are carried out, if the vacuum value measured by the vacuum flow sensor (420) reaches the set value, the arranged Z-axis manipulator (410) can control the main fixing plate (300) to move upwards, and a motor b (520) in the arranged Y-axis manipulator (500) can enable the fixing assembly (400) to move towards the right side through an electric sliding rail a (510), so that the suction nozzle fixing plate (310) moves to be right above the welding disc (600);

s6: the arranged Z-axis manipulator (410) controls the main fixing plate (300) to move downwards, so that the rubber suction nozzle (311) is contacted with the upper end of the welding disc (600), then the vacuum equipment is closed, and the chip can fall onto the welding disc (600) from the rubber suction nozzle (311).

2. The method of claim 1, wherein: electronic slide rail a (510) bottom outer wall fixedly connected with backup pad, backup pad bottom portion is fixed with support column (440) through bolted connection's mode, electronic slide rail a (510) right side tip is fixed with motor b (520) through the mode of rotating the connection, motor b (520) bottom portion and backup pad fixed connection.

3. The method of claim 1, wherein: the rocking disc placing table is characterized in that a motor a (110) is arranged at the bottom of the outer wall of the left side end of the rocking disc placing table (100), a lead screw (120) is fixed at the end of the right side of the motor a (110) in a rotating connection mode, the bottom end of the rocking disc placing table (100) is connected with the lead screw (120) in a sleeved connection mode through a threaded connection mode, the top end portion of the rocking disc placing table (100) is provided with a rocking disc placing frame (130), the rocking disc placing frame (130) is provided with two sets, and the rocking disc placing frame (130) is connected with a rocking disc (200) in a clamping connection mode.

4. The method of claim 1, wherein: the edge of the outer wall of the top end of the rocking disc (200) is fixedly connected with a rocking disc flange (220), the outer wall of the top end of the rocking disc (200) is provided with a mold cavity (230), and the periphery of the mold cavity (230) is provided with an inclined plane.

5. The method of claim 4, wherein: the outer wall of the front end of the rocking disc (200) is fixedly provided with a rocking disc vacuum interface (210), the bottom end part of the mold cavity (230) is provided with a vacuum hole (231), and the vacuum hole (231) is connected with the rocking disc vacuum interface (210).

6. The method of claim 1, wherein: z axle manipulator (410) include electronic slide rail b, electronic slide rail b top portion fixedly connected with motor c, slip mount (430) are connected with electronic slide rail b through sliding connection's mode, the mode that slip mount (430) bottom portion is connected through rotating is fixed with Y to rotatory accent piece (330), Y is provided with Y to rotatory accent piece (330) bottom portion, Y is provided with horizontal direction accent piece (340) to rotatory accent piece (330) left side tip.

7. The method of claim 6, wherein: the Y-direction rotation adjusting block (330) is fixedly connected with an X-direction rotation adjusting block (320), the X-direction rotation adjusting block (320) is connected with the outer wall of the top end of a main fixing plate (300), the bottom end of the main fixing plate (300) is provided with a suction nozzle fixing plate (310) in a bolt connection mode, a vacuum chamber is arranged in the suction nozzle fixing plate (310), and a sealing ring is arranged at the joint of the suction nozzle fixing plate (310) and the main fixing plate (300).

8. The method of claim 7, wherein: the bottom end of the suction nozzle fixing plate (310) is provided with rubber suction nozzles (311) in an array mode.

9. The method of claim 1, wherein: the Z-axis manipulator (410) is characterized in that a fixing assembly (400) is arranged at the front end part, a vacuum flow sensor (420) is fixedly connected onto the fixing assembly (400), and the vacuum flow sensor (420) is matched with a vacuum chamber for use.

Technical Field

The invention relates to the technical field of loose chip taking and placing equipment, in particular to a method for taking and placing a loose chip.

Background

In electronics is a way to miniaturize circuits (mainly including semiconductor devices, also passive components, etc.) and is usually fabricated on the surface of a semiconductor wafer. The integrated circuit in which the circuit is manufactured over the surface of the semiconductor chip is also referred to as a thin film integrated circuit. Another type of thick film hybrid integrated circuit is a miniaturized circuit formed by a discrete semiconductor device and passive components integrated into a substrate or wiring board. This document relates to monolithic integrated circuits, i.e., thin film integrated circuits.

At present, the picking and placing of the loose chip are of a glue type, the size of a solder paste point is difficult to control in the mode, the chip is easy to short circuit, a glue needle is easy to deform, the replacement is complicated, and the adjustment is troublesome.

Therefore, it is necessary to invent a method for picking and placing a bulk chip.

Disclosure of Invention

Therefore, the invention provides a method for picking and placing a bulk chip, which aims to solve the problems that the prior method for picking and placing the bulk chip is of a viscose type, the size of a solder paste point is difficult to control, the chip is easy to cause short circuit, a viscose needle is easy to deform, the replacement is complicated, and the adjustment is troublesome.

In order to achieve the above purpose, the invention provides the following technical scheme: a method for picking and placing a bulk chip comprises the following specific operation steps:

s1: firstly, the rocking disc is connected with vacuum equipment through a rocking disc vacuum interface, then the chip is poured into the rocking disc and is rocked back and forth, the forward chip automatically falls into the mold cavity and is sucked by vacuum, after the reverse chip falls into the mold cavity, because the upper surface of the chip is an inclined plane and the periphery of the mold cavity is also an inclined plane, the chip cannot be clamped in the mold cavity and then slides out, and other forward chips continuously slide into the mold cavity, so that all the mold cavities are filled;

s2: after the rocking disc is fully rocked with chips, the rocking disc is placed on a rocking disc placing frame above a rocking disc placing table, the rocking disc placing frame is designed with two positions, and after one rocking disc chip is used up, the rocking disc is automatically switched to the other rocking disc;

s3: after the rocking disc is placed on the rocking disc placing frame, a motor a is started, the motor a can drive a lead screw to rotate, and a rocking disc placing table arranged when the lead screw rotates can drive the rocking disc to move to the position under the main fixing plate;

s4: then, a motor c on the Z-axis manipulator drives an electric slide rail b to enable a sliding fixing frame to drive a main fixing plate to move downwards, then a vacuum chamber in a suction nozzle fixing plate is vacuumized through vacuum equipment, then the suction nozzle fixing plate can suck a chip through a rubber suction nozzle, and before the rubber suction nozzle is contacted with the chip, the angle of the suction nozzle fixing plate is finely adjusted through an X-direction rotary adjusting block, a Y-direction rotary adjusting block and a horizontal adjusting block, so that the rubber suction nozzle can be completely attached to the chip on a rocking disc;

s5: after the rubber suction nozzle is completely attached, a vacuum flow sensor is arranged to detect a vacuum value at a suction nozzle fixing plate, when the vacuum value measured by the vacuum flow sensor does not reach a set value, the vacuum flow sensor is stopped to alarm to prompt inspection and confirm, if the vacuum value measured by the vacuum flow sensor reaches the set value, a Z-axis manipulator is arranged to control a main fixing plate to move upwards, and a motor b in a Y-axis manipulator is arranged to enable a fixing assembly to move towards the right side through an electric sliding rail a, so that the suction nozzle fixing plate moves to a position right above a welding disc;

s6: the Z-axis manipulator of setting can control the main fixed plate and move down for rubber suction nozzle and welding dish upper end contact, vacuum equipment closes afterwards, and the chip can fall into on the welding dish from the rubber suction nozzle.

Preferably, the outer wall of the bottom end of the electric sliding rail a is fixedly connected with a supporting plate, the bottom end part of the supporting plate is fixedly provided with a supporting column in a bolt connection mode, the end part of the right side of the electric sliding rail a is fixedly provided with a motor b in a rotation connection mode, and the bottom end part of the motor b is fixedly connected with the supporting plate.

Preferably, the outer wall bottom of the left side end of the rocking disc placing table is provided with a motor a, the end part of the right side of the motor a is fixed with a screw rod in a rotating connection mode, the bottom end part of the rocking disc placing table is connected with the screw rod in a sleeved connection mode through threads, the top end part of the rocking disc placing table is provided with a rocking disc placing frame, the rocking disc placing frame is provided with two sets, and the rocking disc placing frame is connected with the rocking disc in a clamping connection mode.

Preferably, the edge of the outer wall of the top end of the rocking disc is fixedly connected with a rocking disc flange, the outer wall of the top end of the rocking disc is provided with a mold cavity, and the periphery of the mold cavity is provided with an inclined plane.

Preferably, a rocking disc vacuum interface is fixed on the outer wall of the front end of the rocking disc, a vacuum hole is formed in the bottom end of the mold cavity, and the vacuum hole is connected with the rocking disc vacuum interface.

Preferably, the Z-axis manipulator includes electric slide rail b, electric slide rail b top portion fixedly connected with motor c, the slip mount is connected with electric slide rail b through sliding connection's mode, slip mount bottom portion is fixed with Y to rotatory accent piece through the mode of rotating the connection, Y is provided with Y to rotatory accent piece bottom portion, Y is provided with the horizontal direction accent piece to rotatory accent piece left side tip.

Preferably, the bottom end part of the Y-direction rotation adjusting block is fixedly connected with the X-direction rotation adjusting block, the bottom end part of the X-direction rotation adjusting block is connected with the outer wall of the top end of the main fixing plate, the bottom end part of the main fixing plate is provided with a suction nozzle fixing plate in a bolt connection mode, a vacuum chamber is arranged in the suction nozzle fixing plate, and a sealing ring is arranged at the connection part of the suction nozzle fixing plate and the main fixing plate.

Preferably, the bottom end of the suction nozzle fixing plate is provided with rubber suction nozzles in an array manner.

Preferably, a fixing assembly is arranged at the front end of the Z-axis manipulator, a vacuum flow sensor is fixedly connected to the fixing assembly, and the vacuum flow sensor is matched with a vacuum chamber for use.

The invention has the beneficial effects that: the invention can ensure that the position precision of the chip can reach 0.05mm through the cooperation among all the devices, ensure that the solder paste point can be completely in the center of the chip, and improve the yield and the stability of the product.

Drawings

FIG. 1 is a schematic view of the front view of the present invention;

FIG. 2 is a side view of the present invention;

FIG. 3 is an enlarged schematic view of FIG. 2 at A in accordance with the present invention;

FIG. 4 is a schematic top view of the present invention;

FIG. 5 is a schematic view of the top view of the rocking disk according to the present invention;

FIG. 6 is a schematic cross-sectional view of the side view of the rocking disk of the present invention;

FIG. 7 is an enlarged view of the structure of FIG. 6 at B according to the present invention.

In the figure: 100. a rocking disc placing table; 110. a motor a; 120. a lead screw; 130. a rocking disc placing frame; 200. shaking the plate; 210. a rocking disc vacuum interface; 220. a rocking disc flange; 230. a mold cavity; 231. a vacuum hole; 300. a main fixing plate; 310. a suction nozzle fixing plate; 311. a rubber suction nozzle; 320. rotating and adjusting the block in the X direction; 330. rotating and adjusting the block in the Y direction; 340. adjusting blocks in the horizontal direction; 400. a fixing assembly; 410. a Z-axis manipulator; 420. a vacuum flow sensor; 430. a sliding fixing frame; 440. a support pillar; 500. a Y-axis manipulator; 510. an electric slide rail a; 520. a motor b; 600. and (7) welding a disc.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

Referring to the attached drawings 1-7, the method for taking and placing the bulk chip provided by the invention comprises the following specific operation steps:

s1: firstly, the rocking disc 200 is connected with vacuum equipment through the rocking disc vacuum interface 210, then the chip is poured into the rocking disc 200 and rocked back and forth, the forward chip automatically falls into the mold cavity 230 and is sucked by vacuum, after the reverse chip falls into the mold cavity 230, because the upper surface of the chip is an inclined surface and the periphery of the mold cavity 230 is also an inclined surface, the chip cannot be clamped in the mold cavity and then slides out, and other forward chips continuously slide into the mold cavity 230, so that all the mold cavities 230 are filled;

s2: after the rocking disc 200 is fully rocked with chips, the rocking disc is placed on the rocking disc placing frame 130 above the rocking disc placing table 100, the rocking disc placing frame 130 is designed with two positions, and after one of the rocking disc chips is used up, the chip is automatically switched to the other rocking disc 200;

s3: after the rocking disc 200 is placed on the rocking disc placing frame 130, starting the motor a110, wherein the motor a110 can drive the screw rod 120 to rotate, and the rocking disc placing table 100 arranged when the screw rod 120 rotates can drive the rocking disc 200 to move to the position under the main fixing plate 300;

s4: then, a motor c on the Z-axis manipulator 410 drives an electric slide rail b to enable a slide fixing frame 430 to drive a main fixing plate 300 to move downwards, then a vacuum chamber in a suction nozzle fixing plate 310 is vacuumized through vacuum equipment, then the suction nozzle fixing plate 310 can suck a chip through a rubber suction nozzle 311, and before the rubber suction nozzle 311 is contacted with the chip, the angle of the suction nozzle fixing plate 310 is finely adjusted through an X-direction rotation adjusting block 320, a Y-direction rotation adjusting block 330 and a horizontal direction adjusting block 340, so that the rubber suction nozzle 311 can be completely attached to the chip on the rocking disc 200;

s5: after the rubber suction nozzle 311 is completely attached, the arranged vacuum flow sensor 420 detects the vacuum value at the suction nozzle fixing plate 310, when the vacuum value measured by the vacuum flow sensor 420 does not reach a set value, the vacuum flow sensor is stopped to alarm, prompt inspection and confirmation are carried out, if the vacuum value measured by the vacuum flow sensor 420 reaches the set value, the arranged Z-axis manipulator 410 controls the main fixing plate 300 to move upwards, and the motor b520 in the arranged Y-axis manipulator 500 enables the fixing assembly 400 to move towards the right side through the electric sliding rail a510, so that the suction nozzle fixing plate 310 moves to the position right above the welding disc 600;

s6: the Z-axis robot 410 is provided to control the main fixing plate 300 to move downward so that the rubber suction nozzle 311 comes into contact with the upper end of the bonding pad 600, and then the vacuum apparatus is turned off and the chip is dropped from the rubber suction nozzle 311 onto the bonding pad 600.

Further, the outer wall of the bottom end of the electric slide rail a510 is fixedly connected with a support plate, the bottom end of the support plate is fixedly provided with a support column 440 in a bolt connection mode, the right end of the electric slide rail a510 is fixedly provided with a motor b520 in a rotation connection mode, the bottom end of the motor b520 is fixedly connected with the support plate, specifically, the electric slide rail a510 and the electric slide rail b are both composed of a screw rod and a straight slide rail, and the Y-axis manipulator 500 is arranged to move the main fixing plate 300 adsorbed with the chip from the upper side of the rocking disc placing table 100 to the upper side of the welding disc 600;

further, a motor a110 is arranged at the bottom of the outer wall of the left side end of the rocking disc placing table 100, a lead screw 120 is fixed at the right side end of the motor a110 in a rotating connection mode, the bottom end of the rocking disc placing table 100 is in sleeve connection with the lead screw 120 in a threaded connection mode, a rocking disc placing frame 130 is arranged at the top end of the rocking disc placing table 100, two groups of rocking disc placing frames 130 are arranged, the rocking disc placing frames 130 are connected with the rocking discs 200 in a clamping connection mode, specifically, the motor a110 is arranged to drive the lead screw 120 to rotate, and the lead screw 120 can drive the rocking disc placing table 100 to move left and right when rotating, so that the main fixing plate 300 can absorb chips of the rocking discs 200 fixed on the two groups of rocking disc placing frames 130;

further, the edge of the outer wall of the top end of the rocking disc 200 is fixedly connected with a rocking disc rib 220, the outer wall of the top end of the rocking disc 200 is provided with a die cavity 230, the periphery of the die cavity 230 is provided with an inclined surface, specifically, the rocking disc rib 220 is arranged to prevent a chip from being separated from the rocking disc 200 when a user rocks the rocking disc 200, the arranged die cavity 230 is 0.1mm larger than the chip and has the same depth as the chip, the periphery of the die cavity 230 is provided with an inclined surface of 60 degrees, and the back surface of the chip is also provided with an inclined surface, so that only the front surface of the chip falls into the die cavity 230 to be sucked and fixed, and the back surface of the chip falls into the die cavity 230 to be slid away from the die cavity 230, so as to ensure that the front surface of the chip falls into the die cavity 230;

further, a rocking disc vacuum interface 210 is fixed on the outer wall of the front end of the rocking disc 200, a vacuum hole 231 is formed at the bottom end of the mold cavity 230, the vacuum hole 231 is connected with the rocking disc vacuum interface 210, specifically, a vacuum chamber a is formed at the bottom of the rocking disc 200, the vacuum chamber a is communicated with the vacuum hole 231 and the rocking disc vacuum interface 210, and thus, a vacuum device can suck and fix the chip through the vacuum chamber a and the vacuum hole 231;

further, the Z-axis manipulator 410 includes an electric slide rail b, a motor c is fixedly connected to the top end of the electric slide rail b, the sliding fixing frame 430 is connected with the electric slide rail b in a sliding connection manner, a Y-direction rotation adjusting block 330 is fixed to the bottom end of the sliding fixing frame 430 in a rotation connection manner, a Y-direction rotation adjusting block 330 is arranged at the bottom end of the Y-direction rotation adjusting block 330, and a horizontal direction adjusting block 340 is arranged at the left end of the Y-direction rotation adjusting block 330, specifically, the Z-axis manipulator 410 is arranged for adjusting the height of the main fixing plate 300 through the sliding fixing frame 430, and the X-direction rotation adjusting block 320, the Y-direction rotation adjusting block 330 and the horizontal direction adjusting block 340 are arranged for finely adjusting the angle of the main fixing plate 300, so as to ensure that the main fixing plate 300 can adsorb and shake all chips on the tray 200 at one time;

further, the bottom end of the Y-direction rotation adjusting block 330 is fixedly connected with an X-direction rotation adjusting block 320, the bottom end of the X-direction rotation adjusting block 320 is connected with the outer wall of the top end of the main fixing plate 300, the bottom end of the main fixing plate 300 is provided with a suction nozzle fixing plate 310 in a bolt connection manner, a vacuum chamber is arranged in the suction nozzle fixing plate 310, and a sealing ring is arranged at the connection position of the suction nozzle fixing plate 310 and the main fixing plate 300;

further, the bottom end of the nozzle fixing plate 310 is provided with rubber nozzles 311 in an array manner, and specifically, the rubber nozzles 311 are arranged to ensure that damage to the chip is reduced when the chip is sucked;

further, a fixing component 400 is arranged at the front end of the Z-axis manipulator 410, a vacuum flow sensor 420 is fixedly connected to the fixing component 400, the vacuum flow sensor 420 is matched with the vacuum chamber for use, specifically, the vacuum flow sensor 420 is arranged for measuring a vacuum value in the vacuum chamber after the rubber suction nozzle 311 adsorbs a chip, and when the value does not reach a set value, the machine is stopped to alarm to prompt inspection and confirm;

the using process of the invention is as follows: firstly, the rocking disc 200 is connected with a vacuum device through the rocking disc vacuum interface 210, then the chip is poured into the rocking disc 200, the rocking disc is rocked back and forth, the forward chip can automatically fall into the die cavity 230 and is sucked by vacuum, after the reverse chip falls into the die cavity 230, because the upper surface of the chip is an inclined plane, the periphery of the die cavity 230 is also an inclined plane, the chip can not be clamped in the die cavity and can slide out, other forward chips can continuously slide into the die cavity 230, so that all the die cavities 230 are filled, after the rocking disc 200 is fully rocked, the rocking disc 200 is placed on the rocking disc placing rack 130 above the rocking disc placing rack 100, after the rocking disc 200 is placed on the rocking disc placing rack 130, the motor a110 is started, the motor a110 can drive the screw rod 120 to rotate, the rocking disc placing rack 100 arranged when the screw rod 120 rotates can drive the rocking disc 200 to move to be under the main fixing plate 300, and then the motor c on the Z-axis manipulator 410 drives the electric slide rail b to drive the main fixing rack 430 to move the main fixing rack 300 downwards, then, the vacuum chamber in the nozzle fixing plate 310 is vacuumized by a vacuum device, then the nozzle fixing plate 310 can suck the chip through the rubber suction nozzle 311, before the rubber suction nozzle 311 contacts the chip, the angle of the nozzle fixing plate 310 is finely adjusted by the arranged X-direction rotation adjusting block 320, Y-direction rotation adjusting block 330 and horizontal direction adjusting block 340, so that the rubber suction nozzle 311 can be completely attached to the chip on the rocking disc 200, after the rubber suction nozzle 311 is completely attached, the arranged vacuum flow sensor 420 can detect the vacuum value at the nozzle fixing plate 310, when the vacuum value measured by the vacuum flow sensor 420 does not reach the set value, the alarm prompt check is stopped, if the vacuum value measured by the vacuum flow sensor 420 reaches the set value, the arranged Z-axis manipulator 410 can control the main fixing plate 300 to move upwards, and the arranged motor b520 in the Y-axis manipulator 500 can make the fixing assembly 400 move towards the right side through the electric sliding rail a510, so that the nozzle fixing plate 310 moves to a position right above the bonding pad 600, the Z-axis robot 410 is arranged to control the main fixing plate 300 to move downward, so that the rubber nozzle 311 makes contact with the upper end of the bonding pad 600, and then the vacuum apparatus is turned off, and the chip falls onto the bonding pad 600 from the rubber nozzle 311.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solution described above. Therefore, any simple modifications or equivalent substitutions made in accordance with the technical solution of the present invention are within the scope of the claims of the present invention.