阅读说明：本技术 一种用于晶圆贴片过程中保护膜的保护装置 (Protection device for protective film in wafer mounting process ) 是由 不公告发明人 于 2021-09-16 设计创作，主要内容包括：本发明公开了一种用于晶圆贴片过程中保护膜的保护装置,包括支撑座,所述支撑座的顶部一端设有支撑板一,所述支撑板一的上部套设有旋转套筒,所述旋转套筒侧边设有贴片机构,所述支撑板一的一侧顶部设有横梁,所述横梁的底部设有压平机构,所述支撑座的顶部另一端设有支撑柱,所述支撑柱内设有升降限位装置,所述升降限位装置贯穿于所述支撑柱顶部延伸至所述支撑柱的上方并顶部设有顶板,所述顶板的顶部设有支撑板二,所述支撑板二的顶部设有晶圆支撑盘,通过设置若干个软性球体及滚动球对晶圆表面进行摩擦,促使将表面上的保护膜内残留的空气进行有效的排出,增加保护膜与晶圆表面之间的粘合性,从而有效的保护保护膜。(The invention discloses a protective film protector used in the wafer chip mounting process, which comprises a supporting seat, wherein one end of the top of the supporting seat is provided with a first supporting plate, the upper part of the first supporting plate is sleeved with a rotary sleeve, the side edge of the rotary sleeve is provided with a chip mounting mechanism, the top of one side of the first supporting plate is provided with a cross beam, the bottom of the cross beam is provided with a flattening mechanism, the other end of the top of the supporting seat is provided with a supporting column, the supporting column is internally provided with a lifting limiting device, the lifting limiting device penetrates through the top of the supporting column and extends to the upper part of the supporting column, the top of the supporting column is provided with a second supporting plate, the top of the second supporting plate is provided with a wafer supporting disk, the surface of a wafer is rubbed by arranging a plurality of soft balls and rolling balls, so that the air remained in the protective film on the surface is effectively discharged, the adhesiveness between the protective film and the surface of the wafer is increased, thereby effectively protecting the protective film.)

1. The protection device for the protective film in the wafer mounting process is characterized by comprising a supporting seat (1), a first supporting plate (2) is arranged at one end of the top of the supporting seat (1), a rotating sleeve (3) is sleeved on the upper portion of the first supporting plate (2), a mounting mechanism (4) is arranged on the side edge of the rotating sleeve (3), a cross beam (5) is arranged at the top of one side of the first supporting plate (2), a flattening mechanism (6) is arranged at the bottom of the cross beam (5), a supporting column (7) is arranged at the other end of the top of the supporting seat (1), the supporting column (7) is a hollow column, a lifting limiting device is arranged in the supporting column (7), penetrates through the top of the supporting column (7) and extends to the position above the supporting column (7), a top plate (8) is arranged at the top of the top plate (8), and a second supporting plate (9) is arranged at the top of the top plate (8), and a wafer supporting disk (10) is arranged at the top of the second supporting plate (9).

2. The protection device for the protective film in the wafer mounting process according to claim 1, wherein the flattening mechanism (6) comprises a fixed plate (11), a motor (12) is disposed at the bottom of the fixed plate (11) and near one end of the first support plate (2), an output shaft is connected to an output end of the motor (12), the output shaft penetrates through the fixed plate (11) and extends to the upper side of the fixed plate (11), a rotating pull rod (13) is disposed at the top of the output shaft, a first cylinder (14) is disposed above the surface of the output shaft and between the rotating pull rod (13) and the fixed plate (11), the bottom of the first cylinder (14) is fixed at one end of the top of the fixed plate (11), a rotating gear (15) is disposed at the other end of the top of the rotating pull rod (13), and a V-shaped plate (17) is disposed at the top center of the rotating gear (15), the top center department of V template (17) is equipped with pull rod three (16), wherein, V template right-hand member bottom is equipped with does not change gear (20), the bottom center department of not changing gear (20) is equipped with slider (18), slider (18) below be equipped with slider (18) matched with U template (19), the bottom of U template (19) is fixed the top of fixed plate (11) and be close to on one side of backup pad (2).

3. The protective film protector for wafer mounting process according to claim 2, wherein a first pull rod (21) is arranged on the top of the left end of the V-shaped plate (17), a second pull rod (22) is arranged on the top of the other end of the first pull rod (21), the other end of the second pull rod (22) is connected to the top of one end of the third pull rod (16), wherein a first connecting column (23) is arranged at the bottom of the intersecting end of the second pull rod (22) and the first pull rod (21), a second connecting column (24) is arranged at the bottom of the first connecting column (23), a third connecting column (25) is arranged at the bottom of the second connecting column (24), a fourth connecting column (26) is arranged at the bottom of the third connecting column (25), a fixed disc (27) is arranged at the bottom of the fourth connecting column (26), and a plurality of uniformly arranged rotating members (28) are arranged outside the fixed disc (27), the top of the rotating piece (28) is provided with a limiting block (29).

4. The protection device for the protective film in the wafer mounting process according to claim 3, wherein the bottom of the rotating member (28) is provided with a connecting rotating rod (30), two ends of the connecting rotating rod (30) are provided with rolling balls (31), the rolling balls (31) are made of rubber, and a plurality of connecting rotating rods (30) are obliquely arranged at the periphery of the bottom of the fixed disk (27) in the same direction.

5. The protection device for the protective film in the wafer mounting process according to claim 4, wherein the bottom of the surface of the connecting column III (25) is provided with a plurality of uniformly arranged bent rods (32), the bottom of each bent rod (32) is provided with a soft sphere (33), the sizes of the soft spheres (33) are the same, the diameter of each soft sphere (33) is larger than that of each rolling sphere (31), and meanwhile, each soft sphere (33) is located above the mounting mechanism (4).

6. The protection device for the protective film in the wafer mounting process according to claim 1, wherein the lifting and lowering limiting device comprises a side tooth lifting and lowering column (34), the side tooth lifting and lowering column (34) is inserted into the supporting column (7) and fixedly connected with the bottom of the top plate (8) at the top, an inverted trapezoid groove (35) is provided at an upper portion of one side of the supporting column (7) far away from the first supporting plate (2), the trapezoid groove (35) communicates the inside of the supporting column (7) with the outside, and a tooth at the left side of the side tooth lifting and lowering column (34) is inserted through the trapezoid groove (35).

7. A protection device for protecting a film in a wafer mounting process according to claim 6, it is characterized in that a lifting adjusting disc (36) is arranged on the outer side of the trapezoidal groove (35), an arc-shaped convex plate (37) engaged with the side tooth lifting column (34) is arranged on the inner side of the lifting adjusting disk (36), the two ends of the center of the arc-shaped convex plate (37) are respectively provided with a limiting lock plate (38), the limiting lock plates (38) are respectively positioned at the two sides of the outer part of the supporting column (7), wherein, a fixed shaft is inserted between the two end limit locking plates (38) and one end of the lifting adjusting plate (36) which is positioned below the lifting adjusting plate, a lock wheel (39) matched with the side edge of the supporting column (7) is arranged between the other ends of the limit lock plates (38), and a locking adjusting rod (40) is arranged on one side of the locking wheel (39) far away from the supporting column (7).

8. The protection device for the protective film in the wafer mounting process according to claim 7, wherein a rocker (41) is disposed at the middle of the outer side of the lifting adjusting disk (36), a supporting elastic member (42) is disposed below the rocker (41) and below the side edge of the lifting adjusting disk (36), the supporting elastic member (42) is made of soft stainless steel to form a corrugated structure, wherein a first support plate (43) is disposed at the outer end of the supporting elastic member (42), a second support plate (44) is disposed at the bottom of the first support plate (43), and one end of the second support plate (44) is fixed at a position below the outer side of the supporting column (7).

Technical Field

The invention relates to the technical field of electronic product production, in particular to a protective film protection device used in a wafer mounting process.

Background

The electronic product refers to an electronic product for daily consumer life. It belongs to a specific household appliance, contains electronic components, and is generally applied to entertainment, communication and document purposes, such as telephones, audio equipment, televisions, DVD players, even electronic clocks and the like. The chip, also called microcircuit, microchip, integrated circuit, refers to the silicon chip containing integrated circuit, the volume is very small, it is the most important part in the electronic product, and it undertakes the functions of operation and storage. The whole process of chip manufacturing comprises the steps of chip design, wafer manufacturing, packaging manufacturing, cost testing and the like; the manufacturing raw material is a wafer. The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.

In the actual production process, the Back of the wafer needs to be ground, commonly called Back Grinding, so that the thickness of the wafer is controlled within the thickness range of micron level, and the finally manufactured chip is thinner, thereby meeting the production requirements of electronic products. The grinding process comprises the steps of pasting, grinding and tearing, wherein the pasting is an auxiliary process before the grinding of the wafer, namely, the IC pattern on the front side of the wafer is pasted by a special protective film (wafer tape), so that the IC pattern on the front side is protected from being damaged when the back side of the wafer is ground; the tearing sheet is the process of tearing off the protective film.

However, in the existing wafer mounting device, the following problems often occur: the protective film is attached to the front surface of the wafer in a sliding friction mode in the process of attaching the protective film, the protective film is easily scratched due to the fact that the friction force applied to the surface of the protective film is large, IC patterns on the surface of the wafer are easily exposed out of the protective film and damaged in the process of grinding the front surface of the wafer downwards, the wafer is caused to lose efficacy, and the reject ratio of the wafer is improved.

Disclosure of Invention

The technical task of the present invention is to provide a protection device for a protection film in a wafer mounting process, so as to solve the above problems.

The technical scheme of the invention is realized as follows:

the utility model provides a protection device for wafer paster in-process protection film, includes the supporting seat, the top one end of supporting seat is equipped with backup pad one, the upper portion cover of backup pad one is equipped with rotatory sleeve, rotatory sleeve side is equipped with paster mechanism, one side top of backup pad one is equipped with the crossbeam, the bottom of crossbeam is equipped with the mechanism of flattening, the top other end of supporting seat is equipped with the support column, the support column is the cavity post, be equipped with lift stop device in the support column, lift stop device run through in the support column top extends to the top and the top of support column are equipped with the roof, the top of roof is equipped with backup pad two, the top of backup pad two is equipped with the wafer supporting disk.

Preferably, the flattening mechanism comprises a fixed plate, a motor is arranged at the bottom of the fixed plate and at one end close to the first supporting plate, an output end of the motor is connected with an output shaft, the output shaft penetrates through the fixed plate and extends to the upper part of the fixed plate, the top part of the output shaft is provided with a rotating pull rod, a first column body is arranged on the upper part of the surface of the output shaft and between the rotating pull rod and the fixed plate, the bottom of the first column body is fixed on one end of the top of the fixed plate, the other end of the top of the rotating pull rod is provided with a rotating gear, a V-shaped plate is arranged at the center of the top of the rotating gear, a third pull rod is arranged at the center of the top of the V-shaped plate, wherein the bottom of the right end of the V-shaped plate is provided with a non-rotating gear, the center of the bottom of the non-rotating gear is provided with a slide block, the slider below be equipped with slider matched with U template, the bottom of U template is fixed the top of fixed plate just is close to on one side of backup pad one.

Preferably, the top of the left end of the V-shaped plate is provided with a first pull rod, the top of the other end of the first pull rod is provided with a second pull rod, the other end of the second pull rod is connected to the top of one end of a third pull rod, the bottom of the intersected end of the second pull rod is provided with a first connecting column, the bottom of the first connecting column is provided with a second connecting column, the bottom of the second connecting column is provided with a third connecting column, the bottom of the third connecting column is provided with a fourth connecting column, the bottom of the fourth connecting column is provided with a fixed disc, the outer side of the fixed disc is provided with a plurality of uniformly-arranged rotating parts, and the top of each rotating part is provided with a limiting block.

Preferably, the bottom of rotating member all is equipped with the connection bull stick, the both ends of connecting the bull stick all are equipped with the roll ball, the roll ball is the rubber material preparation and forms, and wherein, a plurality of is connected the bull stick and all adopts same direction slope to arrange in the peripheral department in the bottom of fixed disk.

Preferably, the bottom of the surface of the connecting column III is provided with a plurality of uniformly arranged bent rods, the bottoms of the bent rods are provided with soft spheres, the sizes of the soft spheres are the same, the diameters of the soft spheres are larger than those of the rolling balls, and meanwhile, the soft spheres are all positioned above the patch mechanism.

Preferably, the lifting limiting device comprises a side tooth lifting column, the side tooth lifting column is inserted into the supporting column, the top of the side tooth lifting column is fixedly connected with the bottom of the top plate, an inverted trapezoidal groove is formed in the upper portion of one side of the supporting column, the upper portion of the one side of the supporting column is far away from the supporting column, the trapezoidal groove is communicated with the outside, and teeth on the left side of the side tooth lifting column penetrate through the trapezoidal groove.

As preferred, the trapezoidal recess outside is equipped with lifting adjusting disk, lifting adjusting disk inboard be equipped with side tooth lift post engaged with's arc flange, the center department both ends of arc flange all are equipped with spacing jam plate, spacing jam plate all is located the outside both sides of support column, wherein, both ends spacing jam plate just are located alternate between lifting adjusting disk's the below one end and be equipped with the fixed axle, be equipped with between the spacing jam plate other end with support column side matched with lock wheel, lock wheel just keeps away from one side of support column is equipped with the locking regulation pole.

Preferably, a rocker is arranged in the middle of the outer side of the lifting adjusting disc, a supporting elastic piece is arranged below the rocker and on the lower portion of the side edge of the lifting adjusting disc, the supporting elastic piece is made of soft stainless steel to form a corrugated structure, a first supporting plate is arranged at the outer end of the supporting elastic piece, a second supporting plate is arranged at the bottom of the first supporting plate, and one end of the second supporting plate is fixed to the lower portion of the outer side of the supporting column.

Compared with the prior art, the invention has the advantages and positive effects that:

1. the protection device is characterized in that a paster structure is arranged on a first support plate, a flattening mechanism is arranged above the paster mechanism, and a lifting limiting device is arranged below the paster mechanism, wherein the paster mechanism is an existing mechanism, namely an existing conventional mechanism capable of pasting a paster, the paster mechanism is limited on the first support plate through a rotary sleeve, so that the paster can be operated by external operation when needing to work, specifically, the paster mechanism can be manually rotated above a wafer support disc, the wafer support disc is lifted to a proper position through the lifting function of the lifting limiting device, a protective film is attached to the surface of a wafer through the paster mechanism, then the paster mechanism is rotated to the other side, the protective film on the surface is rotated and exhausted through the flattening mechanism above, so that the tightness between the protective film and the wafer is increased, and the protective film cannot be displaced with the wafer in the grinding process, the grinding effect of the wafer is better.

2. The flattening mechanism adopts a plurality of spherical structures to realize the rotary rolling movement, so that the pressure action on the surface of the wafer is promoted in the rotary rolling process, the protective film on the surface of the wafer can be effectively pressed and attached on the surface of the wafer, residual air in the wafer can be well removed, meanwhile, the pressure among the balls is equal, because the tightness of the bonding can be well controlled, in addition, the flatting mechanism mainly adopts the soft ball bodies arranged at the same interval on the periphery and the rolling ball in the middle to press the wafer surface protective film by the total rotating movement, because the protective film is made of soft materials, the protective film can be effectively prevented from being scraped in the processes of pressing, jointing and exhausting, meanwhile, the exhaust flattening mechanism can play a role in protecting the protective film, and the protective film is prevented from displacing or bulging in the wafer grinding process.

3. The connecting rotating rods at the bottom of the fixed disk are obliquely arranged in the same direction, rolling balls at two ends of the connecting rotating rods are enabled to move on the surface of the wafer under the rotation of the connecting column four, the rolling balls are in surface contact with the wafer, when the connecting column four rotates and moves, the rolling balls deform after being rubbed, the queue of the rolling balls uniformly arranged in a plurality of is enabled to change, wherein the rolling balls can be enabled to roll in one direction simultaneously in the rubbing and rotating process, the air in the middle is enabled to be driven all around, the rolling balls rotate in the direction under the driving of the friction until the rolling balls are mutually crossed and arranged into a row to form a circular structure, and the direction is driven to rotate under the driving of the friction, so that the formed reciprocating circular motion has a good laminating and pressing effect on the protective film in the middle of the wafer.

4. Compared with the prior art that one air bag is used for pressurizing and exhausting, the uniformly arranged spherical flattening mechanisms have better exhausting effect, and have better attaching effect when simultaneously pressurizing and pressing different parts, so that the protective film is better attached to the surface of the wafer, and the attaching property between the protective film and the wafer is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic diagram of an overall architecture according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a flattening mechanism according to an embodiment of the invention;

FIG. 3 is a schematic illustration of a non-rotating gear end configuration according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a three-terminal structure of a connecting column according to an embodiment of the present invention;

FIG. 5 is a first view of a bottom of a mounting plate in use according to an embodiment of the present invention;

FIG. 6 is a second view of the bottom of the mounting plate in use according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a side tooth lifting column end structure according to an embodiment of the invention;

fig. 8 is a schematic structural view of an elevation adjustment disk end according to an embodiment of the present invention.

In the figure:

1. a supporting seat; 2. a first support plate; 3. rotating the sleeve; 4. a patch mechanism; 5. a cross beam; 6. a flattening mechanism; 7. a support pillar; 8. a top plate; 9. a second support plate; 10. a wafer supporting plate; 11. a fixing plate; 12. a motor; 13. rotating the pull rod; 14. a first column body; 15. rotating the gear; 16. a third pull rod; 17. a V-shaped plate; 18. a slider; 19. a U-shaped plate; 20. the gear is not rotated; 21. a first pull rod; 22. a second pull rod; 23. connecting a column I; 24. connecting a second column; 25. connecting a column III; 26. connecting a column IV; 27. fixing the disc; 28. a rotating member; 29. a limiting block; 30. connecting the rotating rod; 31. a rolling ball; 32. bending a rod; 33. a soft sphere; 34. a side tooth lifting column; 35. a trapezoidal groove; 36. a lifting adjusting disc; 37. an arc-shaped convex plate; 38. a limit locking plate; 39. a lock wheel; 40. locking the adjusting rod; 41. a rocker; 42. a support elastic member; 43. a first support plate; 44. and a second support plate.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

The invention is further described with reference to the following figures and specific examples.

According to an embodiment of the invention, as shown in fig. 1-8:

the invention provides a protective film protection device used in a wafer chip mounting process, which comprises a supporting seat 1, wherein a supporting plate I2 is arranged at one end of the top of the supporting seat 1, a rotating sleeve 3 is sleeved on the upper portion of the supporting plate I2, a chip mounting mechanism 4 is arranged on the side edge of the rotating sleeve 3, a cross beam 5 is arranged at the top of one side of the supporting plate I2, a flattening mechanism 6 is arranged at the bottom of the cross beam 5, a supporting column 7 is arranged at the other end of the top of the supporting seat 1, the supporting column 7 is a cavity column, a lifting limiting device is arranged in the supporting column 7, the lifting limiting device penetrates through the top of the supporting column 7 and extends to the position above the supporting column 7, a top plate 8 is arranged at the top of the top plate 8, and a wafer supporting disk 10 is arranged at the top of the supporting plate II 9.

Wherein, as shown in fig. 2-6, the flattening mechanism 6 includes a fixing plate 11, a motor 12 is disposed at the bottom of the fixing plate 11 and at one end close to the first support plate 2, an output end of the motor 12 is connected with an output shaft, the output shaft penetrates through the fixing plate 11, extends to the top of the fixing plate 11, is provided with a rotating pull rod 13 at the top, a first cylinder 14 is disposed on the upper surface of the output shaft and located between the rotating pull rod 13 and the fixing plate 11, the bottom of the first cylinder 14 is fixed at one end of the top of the fixing plate 11, a rotating gear 15 is disposed at the other end of the top of the rotating pull rod 13, a V-shaped plate 17 is disposed at the center of the top of the rotating gear 15, a third pull rod 16 is disposed at the center of the top of the V-shaped plate 17, wherein a non-rotating gear 20 is disposed at the bottom of the right end of the V-shaped plate, a slider 18 is disposed at the center of the bottom of the non-rotating gear 20, a U-shaped plate 19 matched with the sliding block 18 is arranged below the sliding block 18, the bottom of the U-shaped plate 19 is fixed to the top of the fixing plate 11 and is close to one side of the first support plate 2, a first pull rod 21 is arranged at the top of the left end of the V-shaped plate 17, a second pull rod 22 is arranged at the top of the other end of the first pull rod 21, the other end of the second pull rod 22 is connected to the top of one end of the third pull rod 16, a first connecting column 23 is arranged at the bottom of the intersecting end of the second pull rod 22 and the first pull rod 21, a second connecting column 24 is arranged at the bottom of the first connecting column 23, a third connecting column 25 is arranged at the bottom of the second connecting column 24, a fourth connecting column 26 is arranged at the bottom of the third connecting column 25, a fixed disk 27 is arranged at the bottom of the fourth connecting column 26, a plurality of uniformly arranged rotating pieces 28 are arranged on the outer side of the fixed disk 27, and a limit block 29 is arranged at the top of the rotating pieces 28, the bottom of rotating member 28 all is equipped with connects bull stick 30, the both ends of connecting bull stick 30 all are equipped with rolling ball 31, rolling ball 31 is the rubber material preparation and forms, and wherein, a plurality of connects bull stick 30 and all adopts same direction slope to arrange in the peripheral department in bottom of fixed disk 27.

Meanwhile, the bottom of the surface of the third connecting column 25 is provided with a plurality of uniformly arranged bent rods 32, the bottoms of the bent rods 32 are provided with soft spheres 33, the sizes of the soft spheres 33 are the same, the diameter of each soft sphere 33 is larger than that of each rolling ball 31, and meanwhile, each soft sphere 33 is located above the surface mounting mechanism 4.

Another embodiment, according to fig. 1, 7-8;

the lifting limiting device comprises a side tooth lifting column 34, the side tooth lifting column 34 is inserted in the supporting column 7, the top of the side tooth lifting column 34 is fixedly connected with the bottom of the top plate 8, an inverted trapezoidal groove 35 is formed in the upper portion of one side of the supporting column 7, which is far away from the first supporting plate 2, the trapezoidal groove 35 enables the inside of the supporting column 7 to be communicated with the outside, left teeth of the side tooth lifting column 34 penetrate through the trapezoidal groove 35, a lifting adjusting disc 36 is arranged on the outer side of the trapezoidal groove 35, an arc convex plate 37 meshed with the side tooth lifting column 34 is arranged on the inner side of the lifting adjusting disc 36, limiting locking plates 38 are arranged at two ends of the center of the arc convex plate 37, the limiting locking plates 38 are located on two outer sides of the supporting column 7, fixing shafts are inserted between the limiting locking plates 38 at two ends and one end of the lifting adjusting disc 36, a locking wheel 39 matched with the side edge of the supporting column 7 is arranged between the other ends of the limiting locking plates 38, and a locking adjusting rod 40 is arranged on one side, far away from the supporting column 7, of the locking wheel 39.

In addition, a rocker 41 is arranged in the middle of the outer side of the lifting adjusting disc 36, a supporting elastic member 42 is arranged below the rocker 41 and on the lower portion of the side edge of the lifting adjusting disc 36, the supporting elastic member 42 is made of a soft stainless steel material to form a corrugated structure, a first support plate 43 is arranged at the outer end of the supporting elastic member 42, a second support plate 44 is arranged at the bottom of the first support plate 43, and one end of the second support plate 44 is fixed at the lower position of the outer side of the support column 7.

The detailed use method and action of the embodiment are as follows:

a control key capable of controlling the driving of a motor 12 is arranged on the surface of a first support plate 2, a wafer is firstly clamped on a wafer support plate 10 with a circular clamping groove, a chip mounting mechanism is rotated to the left side position by means of external force, then a locking adjusting rod 40 is pressed downwards by means of external acting force to enable the locking adjusting rod 40 to be pressed on the side edge of a support column 7, a splayed inclined angle is generated between a lifting adjusting plate 36 and a trapezoidal groove 35, a rocker 41 is driven to rotate to enable the rocker 41 to drive the lifting adjusting plate 36 on the side edge to rotate, an arc-shaped convex plate 37 arranged on the right side of the lifting adjusting plate 36 drives a side tooth lifting column 34 with engaged side edges to generate up-and-down motion, after the side tooth lifting column 34 is lifted upwards, the top plate 8 is propped against a top plate 8 to enable the top plate 8 to prop against the wafer support plate 10 on the top of a second support plate 9 to be lifted to a proper position and then stop moving, and then the chip mounting mechanism 4 is driven to work, the chip attaching mechanism 4 attaches the protective film to the surface of the wafer, wherein the chip attaching mechanism 4 is a conventional device and drives a device with an automatic film attaching function, which is not specifically described in detail in the present embodiment.

After the protective film is attached to the surface of the wafer by the chip attaching mechanism 4, the chip attaching mechanism 4 is rotated to the right side again, then the rising state of the wafer supporting disk 10 is adjusted according to the height requirement, so that the top surface of the wafer supporting disk 10 just rises to a proper position and stops moving, at this time, the motor 12 is driven to operate, the motor 12 drives the output shaft to rotate, the output shaft just drives the rotating pull rod 13 at the top to rotate, and the rotating pull rod 13 drives the rotating gear 15 at the left end to rotate, wherein the V-shaped plate 17 is arranged at the center of the top of the rotating gear 15, the V-shaped plate 17 is fixed on the top of the rotating gear 15 and changes along with the rotation of the rotating gear 15, so that the right end of the V-shaped plate 17 at the top presses the non-rotating gear 20 after the rotating gear 15 rotates, and the slide block 18 at the center of the bottom of the non-rotating gear 20 moves in the U-shaped groove of the U-shaped plate 19, the left end of the V-shaped plate 17 is matched with the three pull rods to limit the moving angle range, wherein points A, B, C, D, E and O can be adopted for distinguishing, when the rotation angle of the O and the rotation angle of the rotating gear 15 are always consistent, the B pushes the non-rotating gear 20 to move on the U-shaped plate 19, the E can be limited on an original point, the position of the rotating gear 15 after rotating is driven to change after the B moves back and forth on the U-shaped plate 19, when the B moves forwards, the C is slowly close to the E, the D moves forwards leftwards at the moment, and when the B moves backwards, the distance between the C and the E is slowly increased, so that the D moves rightwards.

Therefore, the connecting column one 23 is driven to reciprocate according to the motion track of the upper part, the connecting column one 23 drives the connecting column two 24 below, the connecting column two 24 pulls the connecting column three 25 connected, so that the soft balls 33 arranged on the bottom of the surface of the connecting column three 25 are just rubbed back and forth on the surface of the wafer, meanwhile, the connecting column four 26 on the bottom of the connecting column three 25 drives the fixed disk 27 on the bottom to change the position, so that the rolling balls 31 arranged on the periphery of the bottom of the fixed disk 27 generate angular rotation after being in contact with the surface of the wafer for rubbing, the adjacent connecting rotating rods 30 are enabled to be switched between separation and crossing without stop, when the adjacent connecting rotating rods 30 are crossed under the rotating force generated by rubbing, the rolling balls 31 at two ends are rolled on a circumferential line to form a circular structure, otherwise, the rolling balls 31 at the two ends are separated, so that the protective film adhered to the surface of the wafer is continuously exhausted, residual air in the middle is driven to the periphery, and then the protective film is driven out from the periphery under the matching of the rolling balls 33 on the outer side, and the adhesion degree between the protective film and the wafer is effectively protected.

Finally, after the gas on the surface of the wafer is exhausted, the locking adjusting rod 40 is broken off to the upper right, the limiting locking plates 38 at the two ends push the lifting adjusting disk 36 to the left, the arc-shaped convex plates 37 at the side edges are separated from the teeth at the side edges of the side tooth lifting columns 34, the side tooth lifting columns 34 directly fall, and the lifting limiting device returns.

The present invention can be easily implemented by those skilled in the art from the above detailed description. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the basis of the disclosed embodiments, a person skilled in the art can combine different technical features at will, thereby implementing different technical solutions.