阅读说明：本技术 一种显示面板、显示模组及其制备方法 (Display panel, display module and preparation method thereof ) 是由 陈立强 石佳凡 张胜星 于 2021-09-13 设计创作，主要内容包括：本发明提供一种显示面板、显示模组及其制备方法。该显示面板具有显示区和第一绑定区,第一绑定区位于显示区的外围；第一绑定区包括第一区和第二区,第二区位于所述第一区的远离所述显示区的一侧；显示面板包括基底膜层和电路膜层；所述电路膜层位于所述基底膜层上方；所述基底膜层和所述电路膜层分别由所述显示区延伸至所述第一绑定区；位于所述第二区的所述基底膜层的厚度小于位于所述第一区的所述基底膜层的厚度,以使位于所述第二区的所述基底膜层和所述电路膜层的叠层能弯折。该显示面板能避免基底膜层激光切割边缘可导电的灰尘颗粒与导电胶中的导电粒子共同作用,造成第一绑定区相邻线路之间发生短路,进而确保该显示面板的显示效果。(The invention provides a display panel, a display module and a preparation method thereof. The display panel is provided with a display area and a first binding area, wherein the first binding area is positioned on the periphery of the display area; the first binding area comprises a first area and a second area, and the second area is positioned on one side of the first area far away from the display area; the display panel comprises a substrate film layer and a circuit film layer; the circuit film layer is positioned above the base film layer; the substrate film layer and the circuit film layer extend from the display area to the first binding area respectively; the thickness of the base film layer located in the second region is smaller than that of the base film layer located in the first region, so that the lamination of the base film layer and the circuit film layer located in the second region can be bent. The display panel can avoid the common effect of dust particles which can be conducted by the laser cutting edge of the substrate film layer and conductive particles in the conductive adhesive, so that short circuit occurs between adjacent lines of the first binding area, and further the display effect of the display panel is ensured.)

1. A display panel is provided with a display area and a first binding area, wherein the first binding area is positioned at the periphery of the display area;

the first binding area comprises a first area and a second area, and the second area is positioned on one side of the first area far away from the display area;

the display panel comprises a substrate film layer and a circuit film layer; the circuit film layer is positioned above the base film layer; the substrate film layer and the circuit film layer extend from the display area to the first binding area respectively;

wherein the thickness of the base film layer in the second region is smaller than the thickness of the base film layer in the first region, so that the stack of the base film layer and the circuit film layer in the second region can be bent.

2. The display panel of claim 1, wherein the circuit film layer comprises a first circuit trace, a first bonding electrode, and a first bonding trace;

the first circuit routing is positioned in the display area;

the first binding electrode is positioned in the first area;

the first binding trace extends from the first region to the second region;

the first circuit trace is connected with the first binding trace; the first binding wire is connected with the first binding electrode.

3. The display panel according to claim 2, wherein the thickness of the base film layer located in the second region is in a range of 10-20 μm;

the thickness of the base film layer located at the first region ranges from 70 to 165 μm.

4. The display panel according to claim 3, wherein the width of the second region along the arrangement direction of the display region, the first region and the second region is 200-300 μm.

5. The display panel according to any one of claims 1 to 4, wherein the substrate film layer located in the display region and the first region includes a first sub-layer, a second sub-layer, and a third sub-layer;

the base film layer located in the second region includes the first sublayer; alternatively, the base film layer located in the second region further comprises the second sub-layer;

the first sublayer, the second sublayer and the third sublayer are sequentially far away from the circuit film layer for superposition;

the first sub-layer is made of any one of PET, PI and PC;

the third sublayer is made of any one of PET, PI and PC;

the second sub-layer is made of acrylic glue or silica gel.

6. A display module comprising a peripheral circuit board, characterized by further comprising the display panel of any one of claims 1 to 5,

the peripheral circuit board is bound and connected with the circuit film layer of the first binding area of the display panel through conductive adhesive;

one side edge of the second area of the display panel, which is far away from the first area, is a free edge;

the free edge of the substrate film layer positioned in the second area of the display panel is not in contact with the conductive adhesive.

7. The display module assembly of claim 6, wherein the peripheral circuit board has a second bonding area and a circuit area, the second bonding area and the circuit area being butted;

the peripheral circuit board comprises a substrate, and a second circuit wire, an insulating layer, a second binding electrode and a second binding wire which are arranged on one side of the substrate close to the display panel;

the second circuit wiring is positioned in the circuit area; the insulating layer is positioned on one side of the second circuit routing wire, which is far away from the substrate, and the orthographic projection of the insulating layer on the substrate covers the circuit area;

the second binding electrode and the second binding wire are positioned in the second binding area;

the second circuit wire is connected with the second binding wire; the second binding wire is connected with the second binding electrode;

the second binding electrode and the first binding electrode in the display panel are arranged face to face and are bound and connected through the conductive adhesive;

the lamination of the substrate film layer and the circuit film layer in the second area is bent towards the direction far away from the conductive adhesive, and at least part of the lamination is attached to one side edge end face of the corresponding butt joint line of the insulating layer.

8. The display module according to claim 7, wherein the conductive adhesive is spread over the non-bent areas of the first and second regions;

the conductive adhesive contains conductive particles, and the conductive particles positioned in the orthographic projection overlapping area of the first binding electrode and the second binding electrode on the substrate can enable the first binding electrode and the second binding electrode to be electrically connected.

9. The display module according to claim 7, wherein a water blocking glue is further disposed at a position where the substrate film layer and the circuit film layer in the second region are attached to the edge end surfaces of the insulating layer, and an orthographic projection of the water blocking glue on the substrate covers a seam between the substrate film layer and the insulating layer at the attached position.

10. The display module assembly according to claim 7, wherein the peripheral circuit board further comprises a circuit device disposed on a side of the substrate away from the second circuit trace, and an orthographic projection of the circuit device on the substrate is located on the circuit area;

the circuit device is electrically connected with the second circuit trace.

11. A method for manufacturing a display module according to any one of claims 6 to 10, comprising: thinning the thickness of the substrate film layer in the second area of the display panel by adopting a laser ablation process;

and binding and connecting the display panel and a peripheral circuit board by adopting conductive adhesive, and pressing the lamination of the substrate film layer and the circuit film layer positioned in the second area by the peripheral circuit board to bend so as to ensure that the free edge of the substrate film layer positioned in the second area is not contacted with the conductive adhesive.

12. The method of claim 11, wherein when the display panel and the peripheral circuit board are bonded and connected by the conductive adhesive, the insulating layer of the peripheral circuit board presses the lamination of the substrate film layer and the circuit film layer in the second region to bend in a direction away from the conductive adhesive, so that at least a portion of the lamination of the substrate film layer and the circuit film layer in the second region is attached to an end face of one side edge of the corresponding pair line of the insulating layer.

Technical Field

The invention belongs to the technical field of display, and particularly relates to a display panel, a display module and a preparation method of the display module.

Background

At present, before a module process is performed on a flexible OLED (Organic Light-Emitting Diode) display screen, laser cutting is generally performed, and a large mother board is cut into small display panel sub-boards.

When the mother board is cut, the laser cutting can cause the organic layer at the cutting line position of the binding area to be carbonized to form conductive dust particles (Ash); when a flexible circuit board (COF) or a peripheral circuit board (FPC) is bound, the display panel sub-boards formed by cutting are usually bound and connected by adopting conductive adhesive containing conductive particles; because the metal of the flexible circuit board or the peripheral circuit board is exposed at the position corresponding to the cutting line of the binding area of the display panel daughter board, the dust particles and the conductive particles in the conductive adhesive have the same action, the short circuit between the adjacent circuits of the binding area is easily caused, and the display effect is influenced.

Disclosure of Invention

The invention provides a display panel, a display module and a preparation method thereof aiming at the problems. The display panel can avoid the common effect of dust particles which can be conducted by the laser cutting edge of the substrate film layer and conductive particles in the conductive adhesive, so that short circuit occurs between adjacent lines of the first binding area, and further the display effect of the display panel is ensured.

The invention provides a display panel, which is provided with a display area and a first binding area, wherein the first binding area is positioned at the periphery of the display area;

the first binding area comprises a first area and a second area, and the second area is positioned on one side of the first area far away from the display area;

the display panel comprises a substrate film layer and a circuit film layer; the circuit film layer is positioned above the base film layer; the substrate film layer and the circuit film layer extend from the display area to the first binding area respectively;

the thickness of the base film layer located in the second region is smaller than that of the base film layer located in the first region, so that the lamination of the base film layer and the circuit film layer located in the second region can be bent.

Optionally, the circuit film layer includes a first circuit trace, a first bonding electrode, and a first bonding trace;

the first circuit routing is positioned in the display area;

the first binding electrode is positioned in the first area;

the first binding trace extends from the first region to the second region;

the first circuit trace is connected with the first binding trace; the first binding wire is connected with the first binding electrode.

Optionally, the thickness of the base film layer located in the second region is in the range of 10-20 μm;

the thickness of the base film layer located at the first region ranges from 70 to 165 μm.

Optionally, the width of the second region along the arrangement direction of the display region, the first region and the second region is 200-.

Optionally, the substrate film layer located in the display area and the first area includes a first sub-layer, a second sub-layer and a third sub-layer;

the base film layer located in the second region includes the first sublayer; alternatively, the base film layer located in the second region further comprises the second sub-layer;

the first sublayer, the second sublayer and the third sublayer are sequentially far away from the circuit film layer for superposition;

the first sub-layer is made of any one of PET, PI and PC;

the third sublayer is made of any one of PET, PI and PC;

the second sub-layer is made of acrylic glue or silica gel.

The invention also provides a display module, which comprises a peripheral circuit board and the display panel,

the peripheral circuit board is bound and connected with the circuit film layer of the first binding area of the display panel through conductive adhesive;

one side edge of the second area of the display panel, which is far away from the first area, is a free edge;

the free edge of the substrate film layer positioned in the second area of the display panel is not in contact with the conductive adhesive.

Optionally, the peripheral circuit board has a second bonding area and a circuit area, and the second bonding area is butted with the circuit area;

the peripheral circuit board comprises a substrate, and a second circuit wire, an insulating layer, a second binding electrode and a second binding wire which are arranged on one side of the substrate close to the display panel;

the second circuit wiring is positioned in the circuit area; the insulating layer is positioned on one side of the second circuit routing wire, which is far away from the substrate, and the orthographic projection of the insulating layer on the substrate covers the circuit area;

the second binding electrode and the second binding wire are positioned in the second binding area;

the second circuit wire is connected with the second binding wire; the second binding wire is connected with the second binding electrode;

the second binding electrode and the first binding electrode in the display panel are arranged face to face and are bound and connected through the conductive adhesive;

the lamination of the substrate film layer and the circuit film layer in the second area is bent towards the direction far away from the conductive adhesive, and at least part of the lamination is attached to one side edge end face of the corresponding butt joint line of the insulating layer.

Optionally, the conductive adhesive is spread over the unbent areas of the first area and the second area;

the conductive adhesive contains conductive particles, and the conductive particles positioned in the orthographic projection overlapping area of the first binding electrode and the second binding electrode on the substrate can enable the first binding electrode and the second binding electrode to be electrically connected.

Optionally, a water-blocking adhesive is further disposed at a joint position of the substrate film layer and the circuit film layer in the second region and an edge end face of the insulating layer, and an orthographic projection of the water-blocking adhesive on the substrate covers a joint between the substrate film layer and the circuit film layer in the joint position and the insulating layer.

Optionally, the peripheral circuit board further includes a circuit device, the circuit device is disposed on a side of the substrate away from the second circuit trace, and an orthographic projection of the circuit device on the substrate is located in the circuit region;

the circuit device is electrically connected with the second circuit trace.

The invention also provides a preparation method of the display module, which comprises the following steps: thinning the thickness of the substrate film layer in the second area of the display panel by adopting a laser ablation process;

and binding and connecting the display panel and a peripheral circuit board by adopting conductive adhesive, and pressing the lamination of the substrate film layer and the circuit film layer positioned in the second area by the peripheral circuit board to bend so as to ensure that the free edge of the substrate film layer positioned in the second area is not contacted with the conductive adhesive.

Optionally, when the display panel and the peripheral circuit board are bound and connected by the conductive adhesive, the insulating layer of the peripheral circuit board presses the lamination of the substrate film layer and the circuit film layer in the second region to bend in a direction away from the conductive adhesive, so that at least part of the lamination of the substrate film layer and the circuit film layer in the second region is attached to an end face of one side edge of the corresponding butt joint line of the insulating layer.

The invention has the beneficial effects that: according to the display panel provided by the invention, the thickness of the base film layer positioned in the second area is smaller than that of the base film layer positioned in the first area, so that the lamination of the base film layer and the circuit film layer positioned in the second area can be bent, and when the display panel is bound and connected with the peripheral circuit board subsequently, the peripheral circuit board can press the lamination of the base film layer and the circuit film layer positioned in the second area to be bent to a position where the lamination is not contacted with the conductive adhesive used for binding and connecting, so that the phenomenon that dust particles which can be conducted at the laser cutting edge of the base film layer and conductive particles in the conductive adhesive have the same action to cause short circuit between adjacent lines of the first binding area is avoided, and the display effect of the display panel is further ensured.

By adopting the display panel in the embodiment, the free edge of the substrate film layer positioned in the second area of the display panel is not contacted with the conductive adhesive, so that the display module provided by the invention can prevent the short circuit between adjacent lines of the first binding area caused by the coaction of conductive dust particles at the free edge formed by laser cutting of the substrate film layer and conductive particles in the conductive adhesive, and further ensure the display effect of the display panel.

Drawings

FIG. 1 is a schematic diagram of a display panel daughter board in which a substrate film layer is lapped with an insulating layer in a peripheral circuit board at a butt joint position according to the prior art;

FIG. 2 is a schematic top view of a display panel sub-board with conductive dust particles at the cutting lines and conductive particles in conductive adhesive causing short circuits between adjacent lines in a bonding area according to the prior art;

FIG. 3 is a schematic cross-sectional view of the structure taken along section line AA in FIG. 2;

FIG. 4 is a schematic top view of a display panel according to an embodiment of the present invention;

FIG. 5 is a schematic sectional view of the structure taken along the line BB of FIG. 4;

FIG. 6 is a schematic top view of a display module according to an embodiment of the present invention;

fig. 7 is a schematic sectional view of the structure along section line CC in fig. 6.

Wherein the reference numerals are:

1. a base film layer; 11. a first sublayer; 12. a second sublayer; 13. a third sublayer; 2. a circuit film layer; 21. a first circuit trace; 22. a first binding electrode; 23. a first binding wire; 100. a display area; 101. a first binding region; 102. a first region; 103. a second region; 3. a peripheral circuit board; 31. a substrate; 32. a second circuit trace; 33. an insulating layer; 34. a second binding electrode; 35. a second binding wire; 36. a circuit device; 4. a conductive adhesive; 40. conductive particles; 104. a second binding region; 105. a circuit area; 5. water-blocking glue; 6. a display panel daughter board; 7. electrically conductive dust particles; 106. a binding region; 8. binding the electrodes; 9. and (6) routing the circuit.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, a display panel, a display module and a method for manufacturing the display panel and the display module according to the present invention are described in further detail below with reference to the accompanying drawings and the detailed description.

In the disclosed technology, when binding electrodes on a display panel sub-board and binding electrodes on a flexible circuit board or a peripheral circuit board are bound and connected, conductive adhesive is coated in binding areas of the binding electrodes and the flexible circuit board or the peripheral circuit board in advance, then the binding electrodes of the binding electrodes and the binding electrodes are correspondingly attached face to face, and the binding electrodes of the binding electrodes and the binding electrodes are electrically connected through conductive particles in the conductive adhesive.

Referring to fig. 1, the flexible circuit board or the peripheral circuit board 3 has metal exposed at a position corresponding to the cutting line P of the binding region 106 of the display panel daughter board 6, the cutting edge of the display panel daughter board 6 contacts with the exposed metal region of the flexible circuit board or the peripheral circuit board 3, and the two are bonded by the conductive adhesive 4; this may cause the conductive dust particles 7 at the position of the cutting line P of the display panel sub-board 6 to interact with the conductive particles 40 in the conductive adhesive 4, which may cause a short circuit between adjacent lines of the bonding area 106, and affect the display effect.

Referring to fig. 1, when the flexible circuit board or the peripheral circuit board 3 is designed and manufactured, the insulating layer 33 on the flexible circuit board or the peripheral circuit board 3, which is located on the same side of the substrate 31 as the bonding electrodes 8 and the circuit traces 9 connected to the bonding electrodes 8 and covers the circuit traces 9, generally has a certain thickness; in the binding region 106 of the display panel daughter board 6, the binding electrode 8 is arranged on the base film layer 1 with thicker thickness; when the display panel daughter board 6 is bound and connected to the flexible printed circuit board or the peripheral printed circuit board 3, in order to avoid short circuit between adjacent lines of the binding region 106 due to the interaction of the conductive dust particles 7 at the position of the cutting line P of the display panel daughter board 6 and the conductive particles 40 in the conductive adhesive 4, the substrate film layer 1 in the display panel daughter board 6 and the insulating layer 33 in the flexible printed circuit board or the peripheral printed circuit board 3 are overlapped at the abutting position, and the substrate film layer 1 in the display panel daughter board 6 is overlapped on the abutting edge surface of the insulating layer 33 away from the substrate 31 side, because the thickness of the substrate film layer 1 and the thickness of the insulating layer 33 are both relatively thick, a relatively large overlapping section difference Q is caused by the overlapping, so that poor crimping occurs between the binding electrodes 8 of the display panel daughter board 6 and the flexible printed circuit board or the peripheral printed circuit board 3.

Now, referring to fig. 2 and fig. 3, in order to avoid a large step caused by the overlapping of the substrate film layer 1 and the insulating layer 33 at the abutting position in the bonding region 106, the insulating layer 33 is usually separated from the cut edge 200 and 300 μm of the display panel sub-panel 6 to avoid poor compression joint between the bonding electrodes 8. Meanwhile, in order to prevent the external water and oxygen from permeating into the gap region between the insulating layer 33 and the cut edge of the display panel sub-panel 6, the water blocking glue 5 is coated on the gap region for blocking. But still cannot solve the technical problem that the dust particles 7 capable of conducting electricity at the position of the cutting line P of the display panel sub-board 6 and the conductive particles 40 in the conductive adhesive 4 act together to cause short circuit between adjacent lines of the binding area 106.

In view of the above problem that the dust particles at the position of the cutting line of the sub-panel of the display panel and the conductive particles in the conductive adhesive act together to cause a short circuit between adjacent lines of the bonding region, an embodiment of the present invention provides a display panel, and referring to fig. 4 and 5, the display panel has a display region 100 and a first bonding region 101, and the first bonding region 101 is located at the periphery of the display region 100; the first binding region 101 includes a first region 102 and a second region 103, and the second region 103 is located on a side of the first region 102 away from the display region 100; the display panel comprises a substrate film layer 1 and a circuit film layer 2; the circuit film layer 2 is positioned above the substrate film layer 1; the substrate film layer 1 and the circuit film layer 2 respectively extend from the display area 100 to the first binding area 101; the thickness of the base film layer 1 located in the second region 103 is smaller than that of the base film layer 1 located in the first region 102, so that the stack of the base film layer 1 and the circuit film layer 2 located in the second region 103 can be bent.

Wherein, the edge of one side of the second region 103 far away from the first region 102 is formed by laser cutting, the substrate film layer 1 is made of organic material, and the conductive dust particles 7 are formed at the laser cut edge of the substrate film layer 1 located in the second region 103. The thickness of the substrate film layer 1 in the second area 103 is smaller than that of the substrate film layer 1 in the first area 102, so that the lamination of the substrate film layer 1 and the circuit film layer 2 in the second area 103 can be bent, and when the display panel is bound and connected with a peripheral circuit board subsequently, the peripheral circuit board can press the lamination of the substrate film layer 1 and the circuit film layer 2 in the second area 103 to be bent to a position where the lamination is not contacted with conductive adhesive used for binding and connecting, thereby avoiding the common action of the dust particles 7 which can be conducted at the laser cutting edge of the substrate film layer 1 and the conductive particles in the conductive adhesive, causing short circuit between adjacent lines of the first binding area 101, and further ensuring the display effect of the display panel.

Optionally, the circuit film layer 2 includes a first circuit trace 21, a first bonding electrode 22 and a first bonding trace 23; the first circuit trace 21 is located in the display area 100; the first binding electrode 22 is located in the first region 102; the first bonding trace 23 extends from the first region 102 to the second region 103; the first circuit trace 21 is connected to the first bonding trace 23; the first bonding wire 23 is connected to the first bonding electrode 22.

Optionally, the first circuit trace 21, the first bonded electrode 22 and the first bonded trace 23 are located at the same layer.

Further optionally, the first circuit trace 21, the first bonding electrode 22, and the first bonding trace 23 may also be located on different layers, an inorganic insulating layer is disposed between electrodes or traces on different layers, and the electrodes or traces on different layers are connected by via holes formed in the inorganic insulating layer. The inorganic insulating layer is usually thin, and thus the bending performance of the circuit film layer 2 is not substantially affected.

Alternatively, the thickness h1 of the base film layer 1 located in the second region 103 ranges from 10 to 20 μm; the thickness h2 of the base film layer 1 located at the first region 102 ranges from 70 to 165 μm.

Alternatively, the base film layer 1 located in the display region 100 and the first region 102 includes a first sublayer 11, a second sublayer 12, and a third sublayer 13; the base film layer 1 located in the second region 103 comprises said first sublayer 11. The first sublayer 11, the second sublayer 12 and the third sublayer 13 are sequentially overlapped away from the circuit film layer 2; the first sublayer 11 is made of any one of PET, PI and PC; the third sublayer 13 is made of any one of PET, PI and PC; the second sub-layer 12 is made of acrylic glue or silica gel.

Optionally, the base film layer 1 located in the second region 103 further comprises a second sub-layer 12.

Optionally, the thickness of the first sub-layer 11 is in the range of 10-15 μm. The thickness of the second sub-layer 12 is in the range of 10-50 μm. The thickness of the third sub-layer 13 is in the range of 50-100 μm. Wherein, the thickness difference between the base film layer 1 in the second region 103 and the base film layer 1 in the first region 102 is the sum of the thicknesses of the second sub-layer 12 and the third sub-layer 13; alternatively, the difference in thickness between the base film layer 1 located in the second region 103 and the base film layer 1 located in the first region 102 is the sum of the thickness of the third sub-layer 13 and a part of the thickness of the second sub-layer 12.

Optionally, the thickness difference between the base film layer 1 in the second region 103 and the base film layer 1 in the first region 102 is realized by performing laser irradiation ablation on the base film layer 1 from the third sublayer 13 side of the base film layer 1 by using a carbon dioxide laser ablation process, so that the ablated part of the base film layer 1 is vaporized to reduce the thickness of the base film layer 1, and the base film layer 1 is reduced to a thickness which is more easily bent.

Optionally, in the first bonding region 101, an inorganic insulating layer may be further disposed between the substrate film layer 1 and the circuit film layer 2, and the thickness of the inorganic insulating layer is relatively thin, so that the bending performance of the circuit film layer 2 is not substantially affected. The inorganic insulating layer can enhance the adhesion of the circuit film layer 2 on the base film layer 1, and can better prevent external water and oxygen from invading the circuit film layer 2 to cause the circuit film layer to be oxidized and corroded.

Optionally, in the display area 100, an organic electroluminescent device and an encapsulation film layer are disposed on a side of the circuit film layer 2 facing away from the substrate film layer 1. The circuit film layer 2 in the display area 100 further includes a pixel circuit, such as a TFT driving circuit, and some signal lines (e.g., power signal lines, scan signal lines, data lines, control signal lines, etc.) connected to the pixel circuit, i.e., first circuit traces 21, where the first circuit traces 21 extend from the display area 100 to the first bonding area 101 so as to be connected to the first bonding electrodes 22 in the first bonding area 101. The first circuit trace extending into the first bonding zone 101 forms a first bonding trace 23.

Optionally, the width m of the second region 103 along the arrangement direction L of the display region 100, the first region 102 and the second region 103 is 200-300 μm. Wherein, in the disclosed technology, the binding area arranged at the periphery of the display area is only the first area, in order to solve the problem that the dust particles at the cutting line position of the display panel sub-board and the conductive particles in the conductive adhesive are in the same action to cause short circuit between the adjacent lines of the binding area, when the mother board is cut into the display panel sub-board, the cutting line is extended outwards by a certain distance to form the second area 103, namely, after the cutting line is extended outwards, the first binding area 101 comprises the first area 102 and the second area 103, after the basement membrane layer 1 of the second area 103 is thinned, in the binding process of the display panel and the peripheral circuit board, all or part of the basement membrane layer 1 in the second area 103 can be bent under the binding pressure of the peripheral circuit board to ensure that the cutting edge line is not contacted with the conductive adhesive for binding connection, thereby solving the problem that the dust particles at the cutting line position and the conductive particles in the conductive adhesive are in the same action, causing a short circuit between adjacent lines in the bonding area. The width m of the second region 103 ensures that the base film layer 1 in this region can be bent well under the binding pressure of the peripheral circuit board so that the cut edge line thereof does not contact with the conductive adhesive for binding connection.

According to the display panel provided by the embodiment of the invention, the thickness of the base film layer 1 positioned in the second region 103 is smaller than that of the base film layer 1 positioned in the first region 102, so that the lamination of the base film layer 1 and the circuit film layer 2 positioned in the second region 103 can be bent, and when the display panel is bound and connected with a peripheral circuit board subsequently, the peripheral circuit board can press the lamination of the base film layer 1 and the circuit film layer 2 positioned in the second region 103 to be bent to a position where the lamination is not contacted with conductive glue used for binding and connecting, so that the phenomenon that dust particles 7 capable of conducting electricity at the laser cutting edge of the base film layer 1 and conductive particles in the conductive glue interact with each other to cause short circuit between adjacent lines of the first bound region 101 is avoided, and the display effect of the display panel is further ensured.

The embodiment of the invention also provides a display module, referring to fig. 6 and 7, which comprises a peripheral circuit board 3 and a display panel in the embodiment, wherein the peripheral circuit board 3 is bound and connected with the circuit film layer 2 of the first binding area 101 of the display panel through a conductive adhesive 4; one side edge of the second region 103 of the display panel far away from the first region 102 is a free edge; the free edge of the base film layer 1 in the second region 103 of the display panel is not in contact with the conductive paste 4.

Wherein, one side edge of the second region 103 of the display panel far from the first region 102 is cut by laser to form a free edge, and conductive dust particles 7 are formed at the free edge of the base film layer 1 in the display panel. Through making the free edge that is located the basement membrane layer 1 of display panel second zone 103 and conductive adhesive 4 contactless, can avoid the dust granule 7 that the free edge that basement membrane layer 1 laser cutting formed can electrically conduct to act together with the conductive particle in the conductive adhesive 4, cause and take place the short circuit between the adjacent circuit of first binding district 101, and then ensure this display panel's display effect.

Optionally, the peripheral wiring board 3 has a second bonding area 104 and a circuit area 105, and the second bonding area 104 and the circuit area 105 are butted; the peripheral circuit board 3 includes a substrate 31, a second circuit trace 32 disposed on one side of the substrate 31 near the display panel, an insulating layer 33, a second bonding electrode 34, and a second bonding trace 35; the second circuit trace 32 is located in the circuit region 105; the insulating layer 33 is located on a side of the second circuit trace 32 away from the substrate 31, and an orthographic projection of the insulating layer 33 on the substrate 31 covers the circuit region 105; the second bonding electrode 34 and the second bonding wire 35 are located in the second bonding region 104; the second circuit trace 32 is connected to the second bonding trace 35; the second bonding wire 35 is connected to the second bonding electrode 34; the second binding electrode 34 is arranged opposite to the first binding electrode 22 in the display panel and is bound and connected through the conductive adhesive 4; the laminated layer of the base film layer 1 and the circuit film layer 2 in the second region 103 is bent in a direction away from the conductive adhesive 4, and at least a part of the laminated layer is attached to an end face of one side of the corresponding pair of bonding wires of the insulating layer 33.

Wherein, when peripheral circuit board 3 and display panel bind and are connected, peripheral circuit board 3 oppresses the stromatolite that is located the basement membrane layer 1 and the circuit rete 2 of second district 103 on the display panel and buckles to the direction of keeping away from conducting resin 4 to make the free edge that is located the basement membrane layer 1 of second district 103 and conducting resin 4 contactless, and then avoid the free edge that basement membrane layer 1 laser cutting formed can electrically conduct dust granule 7 and the electrically conductive particle synergism in the electrically conductive glue 4, cause and take place the short circuit between the adjacent circuit of first binding district 101, and then ensure this display panel's display effect.

Optionally, the conductive adhesive 4 is fully distributed in the unbent areas of the first area 102 and the second area 103; this ensures that the first binding electrode 22 of the first binding region 101 and the second binding electrode 34 of the second binding region 104 can be firmly and reliably bound; the conductive paste 4 contains conductive particles, and the conductive particles located in the orthographic projection overlapping area of the first binding electrode 22 and the second binding electrode 34 on the substrate 31 can electrically connect the first binding electrode 22 and the second binding electrode 34.

Optionally, a water blocking adhesive 5 is further disposed at the joint position of the edge end faces of the substrate film layer 1 and the circuit film layer 2 in the second region 103 and the insulating layer 33, and an orthographic projection of the water blocking adhesive 5 on the substrate 31 covers the joint position between the substrate film layer 1 and the circuit film layer 2 and the insulating layer 33. The water blocking glue 5 is used for blocking external water and oxygen from permeating into the display module from the joint of the attaching position, so that corrosion to circuit wiring inside the display module is avoided.

Optionally, the water blocking glue 5 is acrylic glue, silica gel or other glue materials capable of blocking water and oxygen.

Optionally, the peripheral circuit board 3 further includes a circuit device 36, the circuit device 36 is disposed on a side of the substrate 31 away from the second circuit trace 32, and an orthographic projection of the circuit device 36 on the substrate 31 is located in the circuit region 105; the circuit device 36 is electrically connected with the second circuit trace 32.

Among other things, circuit devices 36 are devices such as driver chips, capacitors, resistors, etc. The circuit device 36 is electrically connected to the second circuit trace 32 through a via hole opened in the substrate 31.

Alternatively, the peripheral circuit board 3 may be a peripheral printed circuit board, or may be a flexible circuit board for realizing the binding connection between the display panel and the peripheral printed circuit board.

Based on the above structure of the display module, an embodiment of the present invention further provides a method for manufacturing the display module, including: step S1: and thinning the thickness of the substrate film layer in the second area of the display panel by adopting a laser ablation process.

In the step, the base film layer is subjected to laser irradiation ablation from the side, away from the first binding electrode, of the base film layer in the second area by adopting a carbon dioxide laser ablation process, so that the ablated part of the base film layer is vaporized, the thickness of the base film layer is reduced, and the base film layer is reduced to the thickness which is easier to bend.

Step S2: and the display panel is bound and connected with the peripheral circuit board by adopting the conductive adhesive, and the peripheral circuit board presses the lamination and bending of the substrate film layer and the circuit film layer positioned in the second area so as to ensure that the free edge of the substrate film layer positioned in the second area is not contacted with the conductive adhesive.

Optionally, when the display panel is bound and connected with the peripheral circuit board through the conductive adhesive, the insulating layer of the peripheral circuit board presses the lamination of the substrate film layer and the circuit film layer in the second region to bend towards a direction away from the conductive adhesive, so that at least part of the lamination of the substrate film layer and the circuit film layer in the second region is attached to an end face of one side edge of the corresponding butt joint line of the insulating layer.

According to the display module provided by the embodiment of the invention, by adopting the display panel in the embodiment, the free edge of the substrate film layer positioned in the second area of the display panel is not contacted with the conductive adhesive, the phenomenon that dust particles which can be conducted at the free edge formed by laser cutting of the substrate film layer and conductive particles in the conductive adhesive are in combined action to cause short circuit between adjacent lines of the first binding area can be avoided, and the display effect of the display panel is further ensured.

The display module provided by the invention can be any product or component with a display function, such as an OLED panel, an OLED television, a display, a mobile phone, a navigator and the like.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.