阅读说明：本技术 焊接方法、电子组件及夹具 (Welding method, electronic component and clamp ) 是由 葛伟 林良 于 2021-09-08 设计创作，主要内容包括：本发明提供了一种焊接方法、电子组件及夹具,用于焊接电子组件,电子组件包括散热块、芯片和电路板,焊接方法包括：S10、在散热块的焊接面上涂抹焊锡膏,在芯片的底部涂抹焊锡膏；S20、将电路板和芯片分别贴合在焊接面上；S30、使用夹具固定电子组件,夹具包括第一压板、弹性件和第二压板,其中,使用第一压板压住电路板,使用弹性件压住芯片,使用第二压板压住弹性件；S40、将连接好的电子组件和夹具放入加热装置加热,加热预定时间后将电子组件和夹具取出；S50、待冷却后将夹具从电子组件上拆卸下来。通过本发明提供的技术方案,能够解决现有技术中电子组件散热效果差的问题。(The invention provides a welding method, an electronic assembly and a clamp, which are used for welding the electronic assembly, wherein the electronic assembly comprises a radiating block, a chip and a circuit board, and the welding method comprises the following steps: s10, coating solder paste on the welding surface of the heat dissipation block, and coating solder paste on the bottom of the chip; s20, respectively attaching the circuit board and the chip to the welding surface; s30, fixing the electronic assembly by using a clamp, wherein the clamp comprises a first pressing plate, an elastic piece and a second pressing plate, the first pressing plate is used for pressing the circuit board, the elastic piece is used for pressing the chip, and the second pressing plate is used for pressing the elastic piece; s40, placing the connected electronic assembly and the clamp into a heating device for heating, and taking out the electronic assembly and the clamp after heating for a preset time; and S50, after cooling, detaching the clamp from the electronic assembly. Through the technical scheme provided by the invention, the problem of poor heat dissipation effect of the electronic component in the prior art can be solved.)

1. A soldering method for soldering an electronic component (10), the electronic component (10) including a heat slug (11), a chip (12) and a circuit board (13), the soldering method comprising:

s10, coating solder paste on the welding surface of the heat dissipation block (11), and coating solder paste on the bottom of the chip (12);

s20, respectively attaching the circuit board (13) and the chip (12) to the welding surfaces;

s30, fixing the electronic component (10) by using a clamp (20), wherein the clamp (20) comprises a first pressing plate (21), an elastic piece (22) and a second pressing plate (23), the first pressing plate (21) is used for pressing the circuit board (13), the elastic piece (22) is used for pressing the chip (12), and the second pressing plate (23) is used for pressing the elastic piece (22);

s40, placing the connected electronic component (10) and the clamp (20) into a heating device for heating, and taking out the electronic component (10) and the clamp (20) after heating for a preset time;

and S50, after cooling, detaching the clamp (20) from the electronic assembly (10).

2. Welding method according to claim 1, characterised in that said slug (11) is of one-piece construction, in said

S30, the electronic component (10) and the clamp (20) are integrally placed in a heating device to be heated synchronously.

3. The welding method according to claim 1, characterized in that the heat slug (11) is a split structure, the heat slug (11) comprising a first block (111) and a second block (112); wherein the content of the first and second substances,

in S10, solder paste is applied to the bonding surfaces of the first block (111) and the second block (112), respectively;

in S20, attaching the circuit board (13) to the first block (111) and the chip (12) to the second block (112);

in the S30, connecting the first pressing plate (21) and the first block (111), the first pressing plate (21), the first block (111), and the circuit board (13) constituting a first assembly (31); connecting the second pressure plate (23) and the second block (112), wherein the second pressure plate (23), the second block (112), the elastic member (22) and the chip (12) form a second assembly (32);

in the S40, putting the first module (31) and the second module (32) into a heating device for heating respectively;

in S50, the first pressing plate (21) is detached after the first component (31) is cooled, and the second pressing plate (23) and the elastic member (22) are detached after the second component (32) is cooled.

4. The welding method according to claim 3, characterized in that the clamp (20) further comprises two baffles (24), the welding method further comprising:

in S30, the two stoppers 24 are used to clamp both sides of the second block 112, the thickness of the stoppers 24 is larger than the sum of the thicknesses of the second block 112 and the chip 12 to prevent solder paste from flowing down the second block 112 after melting, and the second assembly 32 includes the two stoppers 24.

5. The welding method of claim 3, further comprising, after the S50:

s60, connecting the first block (111) and the second block (112) by using a fastener.

6. Soldering method according to claim 1, characterised in that the electronic component (10) comprises two circuit boards (13), the clamp (20) comprises two first press plates (21), the two first press plates (21) are used for pressing the two circuit boards (13) in a one-to-one correspondence, and the chip (12) is located between the two circuit boards (13) after the soldering of the electronic component (10) is completed.

7. The welding method according to claim 1, characterized in that, in the S30,

pressing the circuit board (13) with the first pressing plate (21) includes: aligning a positioning pin (211) on the first pressure plate (21) with a positioning hole (113) on the heat dissipation block (11), and penetrating and screwing a first bolt sleeved with an elastic gasket and a flat gasket into the first pressure plate (21) and the heat dissipation block (11);

pressing the elastic member (22) with the second pressing plate (23) includes: and abutting the second pressing plate (23) with the elastic piece (22), and penetrating a second bolt sleeved with an elastic gasket and a flat gasket into the second pressing plate (23) and the radiating block (11) and screwing.

8. The welding method of claim 1, further comprising:

before the step S10, before soldering paste is coated, the oxidized surface of the welding area of the electronic component (10) is cleaned by using sand paper, alcohol and a cleaning cloth, and the periphery of the heat dissipation block (11) is wound by using a high-temperature adhesive tape;

before the step S30, coating high-temperature paper on the surface of the circuit board (13);

in the S40, the heating temperature of the heating device is 265 ℃ to 275 ℃, and the heating time is 1.5 minutes to 2.5 minutes;

after the S50, excess solder on the electronic component (10) is wiped off with sandpaper, and the electronic component (10) is wiped with alcohol and a cleaning cloth.

9. An electronic component (10), characterized in that the electronic component (10) employs the soldering method according to any one of claims 1 to 8, the electronic component (10) comprises a heat sink (11), a chip (12) and two circuit boards (13), the chip (12) and the two circuit boards (13) are soldered on the heat sink (11), and the chip (12) is located between the two circuit boards (13).

10. The electronic assembly (10) of claim 9, wherein the heat slug (11) has a plurality of connection holes (114) and positioning holes (113), and the circuit board (13) has through holes corresponding to the connection holes (114) and the positioning holes (113), respectively.

11. The electronic assembly (10) according to claim 9, wherein the heat dissipation block (11) is a split structure, the heat dissipation block (11) comprises two first blocks (111) and a second block (112) disposed between the two first blocks (111), the second block (112) and the two first blocks (111) are detachably connected by a fastener, the two circuit boards (13) are respectively soldered on the two first blocks (111), and the chip (12) is soldered on the second block (112); the first block body (111) is provided with a plurality of connecting holes (114) and positioning holes (113), and the circuit board (13) is provided with through holes respectively corresponding to the connecting holes (114) and the positioning holes (113).

12. A clamp (20), wherein the clamp (20) is used for the welding method according to any one of claims 1 to 8, the clamp (20) comprises a first pressing plate (21), an elastic member (22) and a second pressing plate (23), wherein the first pressing plate (21) comprises a plate body (212) and a plurality of positioning pins (211) arranged on the plate body (212), the plate body (212) is provided with a plurality of first through holes (2121) for penetrating fasteners, the second pressing plate (23) is provided with a limiting groove (231) and a second through hole (232) for penetrating fasteners, and the limiting groove (231) is in limiting fit with one end of the elastic member (22).

Technical Field

The invention relates to the technical field of electronic assembly welding, in particular to a welding method, an electronic assembly and a clamp.

Background

At present, when a circuit board or a chip in an electronic component is welded, a large amount of heat is often generated in the welding process, if the heat is not dissipated in time, the efficiency, the power and the like of a system can be deteriorated, and the electronic component can be even burnt out in a serious condition.

In the prior art, when the electronic component is assembled, the circuit board is fixed on the radiating block by screws and then welded, and by adopting the mode, the circuit board cannot be fully contacted with the radiating block, so that the contact surface between the circuit board and the radiating block is small, and the radiating effect of the electronic component is poor.

Disclosure of Invention

The invention provides a welding method, an electronic assembly and a clamp, which aim to solve the problem of poor heat dissipation effect of the electronic assembly in the prior art.

In order to solve the above-mentioned problems, according to one aspect of the present invention, there is provided a soldering method for soldering an electronic component including a heat slug, a chip, and a circuit board, the soldering method comprising: s10, coating solder paste on the welding surface of the heat dissipation block, and coating solder paste on the bottom of the chip; s20, respectively attaching the circuit board and the chip to the welding surface; s30, fixing the electronic assembly by using a clamp, wherein the clamp comprises a first pressing plate, an elastic piece and a second pressing plate, the first pressing plate is used for pressing the circuit board, the elastic piece is used for pressing the chip, and the second pressing plate is used for pressing the elastic piece; s40, placing the connected electronic assembly and the clamp into a heating device for heating, and taking out the electronic assembly and the clamp after heating for a preset time; and S50, after cooling, detaching the clamp from the electronic assembly.

Further, the heat dissipation block is of an integrated structure, and in S30, the electronic component and the jig are integrally placed in a heating device to be heated simultaneously.

Furthermore, the radiating block is of a split structure and comprises a first block body and a second block body; in S10, solder paste is applied to the bonding surfaces of the first block and the second block, respectively; in S20, attaching the circuit board to the first block and attaching the chip to the second block; in S30, connecting a first pressing plate and a first block, the first pressing plate, the first block and the circuit board constituting a first assembly; connecting a second pressure plate with a second block body, wherein the second pressure plate, the second block body, the elastic piece and the chip form a second assembly; in S40, placing the first component and the second component into a heating device for heating respectively; in S50, the first pressing plate is detached after the first component is cooled, and the second pressing plate and the elastic member are detached after the second component is cooled.

Further, the fixture further comprises two baffles, and the welding method further comprises: at S30, two baffles are used to clamp both sides of the second block, the baffles having a thickness greater than the sum of the thicknesses of the second block and the die to prevent solder paste from flowing down the second block after melting, and the second assembly includes two baffles.

Further, after S50, the welding method further includes: and S60, connecting the first block body and the second block body by using a fastener.

Furthermore, the electronic assembly comprises two circuit boards, the clamp comprises two first pressing plates, the two first pressing plates are used for pressing the two circuit boards in a one-to-one correspondence mode, and after the electronic assembly is welded, the chip is located between the two circuit boards.

Further, in S30, pressing the circuit board using the first pressing plate includes: aligning a positioning pin on the first pressure plate with a positioning hole on the radiating block, and penetrating and screwing a first bolt sleeved with an elastic gasket and a flat gasket into the first pressure plate and the radiating block; pressing the elastic member using the second pressing plate includes: and the second pressing plate is abutted against the elastic piece, and a second bolt sleeved with an elastic gasket and a flat gasket penetrates into the second pressing plate and the radiating block and is screwed down.

Further, the welding method further comprises: before S10, before the soldering paste is coated, the oxidized surface of the welding area of the electronic component is cleaned by abrasive paper, alcohol and cleaning cloth, and the periphery of the heat dissipation block is wound by a high-temperature adhesive tape; before S30, coating high-temperature paper on the surface of the circuit board; in S40, the heating temperature of the heating device is 265 ℃ to 275 ℃ and the heating time is 1.5 minutes to 2.5 minutes; after S50, the electronic component is wiped with sandpaper to remove excess solder, and the electronic component is wiped with alcohol and a cleaning cloth.

According to another aspect of the present invention, there is provided an electronic component using the above soldering method, the electronic component including a heat slug, a chip, and two circuit boards, the chip and the two circuit boards being soldered on the heat slug, the chip being located between the two circuit boards.

Furthermore, the heat dissipation block is provided with a plurality of connecting holes and positioning holes, and the circuit board is provided with through holes respectively corresponding to the connecting holes and the positioning holes.

Furthermore, the heat dissipation block is of a split structure and comprises two first blocks and a second block arranged between the two first blocks, the second block and the two first blocks are detachably connected through fasteners, the two circuit boards are respectively welded on the two first blocks, and the chip is welded on the second block; the first block body is provided with a plurality of connecting holes and positioning holes, and the circuit board is provided with through holes respectively corresponding to the connecting holes and the positioning holes.

According to another aspect of the invention, a clamp is provided, the clamp is used for the welding method, and the clamp comprises a first pressing plate, an elastic member and a second pressing plate, wherein the first pressing plate comprises a plate body and a plurality of positioning pins arranged on the plate body, the plate body is provided with a plurality of first through holes for penetrating through fastening members, the second pressing plate is provided with a limiting groove and a second through hole for penetrating through fastening members, and the limiting groove is in limiting fit with one end of the elastic member.

The technical scheme of the invention is applied to provide a welding method for welding an electronic assembly, wherein the electronic assembly comprises a radiating block, a chip and a circuit board, and the welding method comprises the following steps: s10, coating solder paste on the welding surface of the heat dissipation block, and coating solder paste on the bottom of the chip; s20, respectively attaching the circuit board and the chip to the welding surface; s30, fixing the electronic assembly by using a clamp, wherein the clamp comprises a first pressing plate, an elastic piece and a second pressing plate, the first pressing plate is used for pressing the circuit board, the elastic piece is used for pressing the chip, and the second pressing plate is used for pressing the elastic piece; s40, placing the connected electronic assembly and the clamp into a heating device for heating, and taking out the electronic assembly and the clamp after heating for a preset time; and S50, after cooling, detaching the clamp from the electronic assembly. By adopting the method, the circuit board and the chip are respectively attached to the welding surface of the radiating block, and the circuit board and the chip are respectively pressed by the clamp, so that the circuit board and the chip can be fully contacted with the radiating block, the contact surface between the circuit board and the chip is increased, and the radiating effect is improved. Therefore, in the welding process, heat can be timely dissipated out through the radiating block, and damage to the circuit board and the chip is avoided. Wherein, because soldering tin layer thickness can change after the melting of soldering tin, push down the chip through using the elastic component, can play the cushioning effect to the chip after soldering tin layer thickness changes.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic flow chart of a welding method according to an embodiment of the present invention;

FIG. 2 illustrates an assembly view of an electronic assembly in accordance with one embodiment of the present invention;

FIG. 3 is a diagram showing a structure of a heat dissipating block according to the first embodiment;

FIG. 4 is a block diagram of a first block according to a first embodiment;

FIG. 5 illustrates an assembly view of a second component in a welding method provided in accordance with a second embodiment of the present invention;

FIG. 6 is a block diagram showing a first component in the second embodiment;

FIG. 7 is a structural view showing a second presser plate in the second embodiment;

fig. 8 shows a schematic diagram of an electronic component provided by the third embodiment of the present invention.

Wherein the figures include the following reference numerals:

10. an electronic component; 11. a heat dissipating block; 111. a first block; 112. a second block; 113. positioning holes; 114. connecting holes; 12. a chip; 13. a circuit board;

20. a clamp; 21. a first platen; 211. positioning pins; 212. a plate body; 2121. a first through hole; 22. an elastic member; 23. a second platen; 231. a limiting groove; 232. a second through hole; 24. a baffle plate;

31. a first component; 32. a second component.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 7, an embodiment of the present invention provides a soldering method for soldering an electronic component 10, the electronic component 10 including a heat slug 11, a chip 12, and a circuit board 13, the soldering method including: s10, coating solder paste on the welding surface of the heat dissipation block 11, and coating solder paste on the bottom of the chip 12; s20, respectively attaching the circuit board 13 and the chip 12 to the welding surfaces; s30, fixing the electronic component 10 by using the fixture 20, wherein the fixture 20 comprises a first pressing plate 21, an elastic member 22 and a second pressing plate 23, wherein the first pressing plate 21 is used for pressing the circuit board 13, the elastic member 22 is used for pressing the chip 12, and the second pressing plate 23 is used for pressing the elastic member 22; s40, placing the connected electronic component 10 and the clamp 20 into a heating device for heating, and taking out the electronic component 10 and the clamp 20 after heating for a preset time; s50, after cooling, the clip 20 is removed from the electronic assembly 10.

By adopting the method, the circuit board 13 and the chip 12 are respectively attached to the welding surfaces of the radiating block 11, and the circuit board 13 and the chip 12 are respectively pressed by the clamp 20, so that the circuit board 13 and the chip 12 can be fully contacted with the radiating block 11, the contact surface between the circuit board and the chip is increased, and the radiating effect is improved. Therefore, in the welding process, heat can be timely dissipated through the radiating block 11, and damage to the circuit board 13 and the chip 12 is avoided. Since the thickness of the solder layer changes after the solder paste is melted, the elastic member 22 presses the chip 12, so that the chip 12 can be buffered after the thickness of the solder layer changes.

In which the heat dissipation block 11 is an integrated structure, in S30, the electronic component 10 and the jig 20 are integrally put into a heating device to be heated simultaneously. The heat dissipation block 11 is arranged into an integral structure, so that the processing and the installation are convenient; by integrally placing the electronic component 10 and the jig 20 into a heating device, the soldering efficiency and the soldering quality are improved.

In the second embodiment of the present invention, the heat dissipation block 11 is a split structure, and the heat dissipation block 11 includes a first block 111 and a second block 112; in S10, solder paste is applied to the bonding surfaces of the first block 111 and the second block 112, respectively; in S20, the circuit board 13 is attached to the first block 111, and the chip 12 is attached to the second block 112; in S30, the first pressing plate 21 and the first block 111 are connected, the first pressing plate 21, the first block 111, and the circuit board 13 constituting the first assembly 31; connecting the second pressing plate 23 with the second block 112, wherein the second pressing plate 23, the second block 112, the elastic part 22 and the chip 12 form a second assembly 32; in S40, the first component 31 and the second component 32 are respectively placed into a heating device for heating; in S50, the first presser plate 21 is detached after the first component 31 is cooled, and the second presser plate 23 and the elastic member 22 are detached after the second component 32 is cooled.

By adopting the method, the circuit board 13 is attached to the first block 111, the chip 12 is attached to the second block 112, the first pressing plate 21 is connected with the first block 111, and the second pressing plate 23 is connected with the second block 112, so that the circuit board 13 and the chip 12 can be fully contacted with the heat dissipation block 11, the contact surface between the circuit board and the chip is increased, and the heat dissipation effect is improved. Therefore, in the welding process, heat can be timely dissipated through the radiating block 11, and damage to the circuit board 13 and the chip 12 is avoided. Since the thickness of the solder layer changes after the solder is melted, the elastic member 22 presses the chip 12, so that the chip 12 can be buffered after the thickness of the solder layer changes; the first component 31 and the second component 32 are respectively placed into a heating device for heating, so that the operation is simpler and more convenient.

Wherein, the fixture 20 further comprises two baffles 24, and the welding method further comprises: in S30, the two shutters 24 are used to sandwich both sides of the second block 112, the shutters 24 having a thickness larger than the sum of the thicknesses of the second block 112 and the chip 12 to prevent solder paste from flowing down the second block 112 after melting, and the second assembly 32 includes the two shutters 24. By setting the thickness of the dam 24 to be greater than the sum of the thicknesses of the second block 112 and the chip 12, the chip 12 can be fixed and the solder paste can be prevented from flowing down the second block 112 after being melted. As shown in fig. 5, the two baffles 24 and the second block 112 are connected by means of bolts, so as to facilitate the installation and the disassembly.

Further, after S50, the welding method further includes: s60, connecting the first block 111 and the second block 112 using a fastener. The fastener comprises a bolt, a nut and an elastic gasket; when connecting, firstly, the elastic gasket is sleeved on the bolt, then the bolt is penetrated through the first block 111 and the second block 112, and finally the bolt is locked by the nut.

As shown in fig. 2, the electronic assembly 10 includes two circuit boards 13, the fixture 20 includes two first pressing plates 21, the two first pressing plates 21 are used for pressing the two circuit boards 13 one by one, and after the electronic assembly 10 is soldered, the chip 12 is located between the two circuit boards 13. Through the arrangement, the two circuit boards 13 and the chip 12 can be welded at the same time, and the welding efficiency is improved.

Specifically, in S30, pressing the circuit board 13 using the first pressing plate 21 includes: aligning the positioning pin 211 on the first pressing plate 21 with the positioning hole 113 on the heat dissipation block 11, and penetrating and screwing a first bolt sleeved with an elastic gasket and a flat gasket into the first pressing plate 21 and the heat dissipation block 11; pressing the elastic member 22 using the second pressing plate 23 includes: the second pressing plate 23 is abutted against the elastic member 22, and a second bolt sleeved with an elastic gasket and a flat gasket is inserted into the second pressing plate 23 and the heat dissipation block 11 and is screwed down. This arrangement enables the first presser plate 21 to be accurately assembled with the heat radiation block 11 by aligning the positioning pins 211 on the first presser plate 21 with the positioning holes 113 on the heat radiation block 11; the elastic gasket and the flat gasket are sleeved on the first bolt, so that the buffering effect can be achieved after the thickness of the soldering tin layer is changed. The second pressing plate 23 is abutted against the elastic member 22, and a constant force can be applied to the elastic member 22 to press the chip 12; the second bolt provided with the elastic gasket and the flat gasket in a sleeved mode penetrates into the second pressing plate 23 and the radiating block 11, and the buffering effect can be achieved after the thickness of the soldering tin layer changes.

Further, the welding method further comprises: before S10, before the soldering paste is coated, the oxidized surface of the welding area of the electronic component 10 is cleaned by using sand paper, alcohol and cleaning cloth, and the periphery of the heat dissipation block 11 is wound by using a high-temperature adhesive tape; before S30, high-temperature paper is coated on the surface of the circuit board 13; in S40, the heating temperature of the heating device is 265 ℃ to 275 ℃ and the heating time is 1.5 minutes to 2.5 minutes; after S50, excess solder on the electronic component 10 is wiped with sandpaper, and the electronic component 10 is wiped with alcohol and a cleaning cloth. Abrasive paper, alcohol and cleaning cloth are used for cleaning the oxidized surface of the welding area of the electronic component 10, so that the welding efficiency can be improved; the high-temperature adhesive tape is wound around the periphery of the heat dissipation block 11, so that high-temperature soldering tin can be prevented from flowing down the heat dissipation block 11; coating high-temperature paper for absorbing solder paste; setting the heating temperature and the heating time within the above ranges can improve the welding quality better.

Optionally, the soldering method further includes manufacturing the corresponding heat dissipation block 11, the aluminum alloy fixture 20 and the supporting PCB according to a drawing, where the PCB is the circuit board 13.

As shown in fig. 8, in the third embodiment of the present invention, an electronic component 10 is provided, where the electronic component 10 adopts the above-mentioned soldering method, the electronic component 10 includes a heat dissipation block 11, a chip 12, and two circuit boards 13, the chip 12 and the two circuit boards 13 are both soldered on the heat dissipation block 11, and the chip 12 is located between the two circuit boards 13.

By adopting the method, the two circuit boards 13 and the two chips 12 are attached to the welding surface of the radiating block 11, and the two circuit boards 13 and the two chips 12 are respectively pressed by the clamp 20, so that the two circuit boards 13 and the two chips 12 can be fully contacted with the radiating block 11, the contact surface between the two circuit boards is increased, and the radiating effect is improved. Therefore, in the welding process, heat can be timely dissipated through the radiating block 11, and damage to the circuit board 13 and the chip 12 is avoided. Since the thickness of the solder layer changes after the solder paste is melted, the elastic member 22 presses the chip 12, so that the chip 12 can be buffered after the thickness of the solder layer changes.

The heat dissipating block 11 has a plurality of connecting holes 114 and positioning holes 113, and the circuit board 13 has through holes corresponding to the connecting holes 114 and the positioning holes 113. The plurality of through holes corresponding to the connection holes 114, the positioning holes 113, and the positioning holes 113 are provided, respectively, so that the mounting and the positioning can be performed better.

Further, the heat dissipation block 11 is a split structure, the heat dissipation block 11 includes two first blocks 111 and a second block 112 disposed between the two first blocks 111, the second block 112 and the two first blocks 111 are detachably connected by a fastener, the two circuit boards 13 are respectively soldered on the two first blocks 111, and the chip 12 is soldered on the second block 112; the first block 111 has a plurality of connecting holes 114 and positioning holes 113, and the circuit board 13 has through holes corresponding to the connecting holes 114 and the positioning holes 113.

The second block 112 and the two first blocks 111 are detachably connected through fasteners, wherein the fasteners can comprise bolts, nuts and gaskets, the gaskets are sleeved on the bolts, then the bolts penetrate through the second block 112 and the two first blocks 111, and finally the bolts are locked through the nuts. The plurality of through holes corresponding to the connection holes 114, the positioning holes 113, and the positioning holes 113 are provided, respectively, so that the mounting and the positioning can be performed better. Wherein, the first block 111 and the second block 112 are both provided with through holes for penetrating the same fastener, which is convenient for assembly.

Optionally, through holes corresponding to the plurality of connecting holes 114, the positioning holes 113, and the positioning holes 113 are disposed around the first block 111 and the circuit board 13, so as to reduce or avoid damage to the internal structure of the circuit board 13 during assembly.

In the fourth embodiment of the present invention, a fixture 20 is provided, the fixture 20 is used in the above-mentioned welding method, the fixture 20 includes a first pressing plate 21, an elastic member 22, and a second pressing plate 23, wherein the first pressing plate 21 includes a plate body 212 and a plurality of positioning pins 211 disposed on the plate body 212, the plate body 212 has a plurality of first through holes 2121 for passing fasteners, the second pressing plate 23 has a limiting groove 231 and a second through hole 232 for passing fasteners, and the limiting groove 231 is in limiting fit with one end of the elastic member 22.

By the plurality of positioning pins 211 on the plate body 212, the accuracy in assembling can be improved; a limiting groove 231 is arranged on the second pressing plate 23 and can limit the elastic element 22, so that the moving range of the elastic element 22 is limited; the assembly is facilitated by providing a plurality of first and second through holes 2121 and 232 on the first and second pressing plates 21 and 23.

Optionally, the clamp 20 further comprises two baffles 24, the thickness of the baffles 24 being greater than the thickness of the second block 112, the two baffles 24 being adapted to clamp the second block 112. This arrangement can effectively prevent the heated solder paste from flowing down the second block 112. The clamp 20 also includes a fastener, a resilient washer and a flat washer. Set up the plain washer of resilient pads, can guarantee to play the cushioning effect after soldering tin layer thickness changes.

In the second embodiment of the present invention, the specific steps of the welding method are as follows;

step 1: manufacturing corresponding heat dissipation blocks 11, the clamp 20 and a matched PCB according to drawings with different sizes, and leaving corresponding positioning holes 113 and connecting holes 114 according to the drawings;

step 2: cleaning the oxidized surface of the soldering area of the electronic component 10 using sandpaper, alcohol and a cleaning cloth;

and step 3: respectively coating solder paste on the welding surfaces of the first block body 111 and the second block body 112 and the back of the chip 12, and winding the peripheries of the first block body 111 and the second block body 112 by using a high-temperature adhesive tape;

and 4, step 4: attaching the circuit board 13 to the first block 111 and attaching the chip 12 to the second block 112; locking the first block 111 and the second block 112;

and 5: connecting the first pressing plate 21 and the first block 111, wherein the first pressing plate 21, the first block 111 and the circuit board 13 form a first assembly 31; connecting the second pressing plate 23 with the second block 112, wherein the second pressing plate 23, the second block 112, the elastic part 22 and the chip 12 form a second assembly 32;

step 6: placing the first component 31 and the second component 32 into a heating device respectively for heating; the first pressing plate 21 is detached after the first assembly 31 is cooled, and the second pressing plate 23 and the elastic piece 22 are detached after the second assembly 32 is cooled;

and 7: each clamp 20 is removed and fasteners are used to pass through the first block 111 and the second block 112 to lock the first block 111 and the second block 112 together.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.