阅读说明：本技术 用于碳化硅电荷平衡功率器件中的终端的系统和方法 (System and method for termination in silicon carbide charge balanced power devices ) 是由 斯蒂芬·戴利·阿瑟 列扎·甘迪 亚历山大·维克托罗维奇·博洛特尼科夫 戴维·阿兰·利林菲尔德 于 2019-12-20 设计创作，主要内容包括：一种碳化硅(SiC)电荷平衡(CB)器件(4)包括CB层(18A),该CB层包括第一外延(epi)层(14A)。第一epi层的有源区域(6)包括第一导电类型的第一掺杂浓度和第二导电类型的第一多个CB区(34)。第一epi层的终端区域(10)包括第一导电类型的最小epi掺杂浓度。SiC-CB器件还包括器件层(16),该器件层包括设置在CB层上的第二epi层(14Z)。第二epi层的有源区域(6)包括第一导电类型的第一掺杂浓度。器件层(16)的终端区域(10)包括第一导电类型的最小epi掺杂浓度和第二导电类型的第一多个浮空区(68),该第一多个浮空区形成器件的结终端(12Z)。(A silicon carbide (SiC) Charge Balance (CB) device (4) includes a CB layer (18A) including a first epitaxial (epi) layer (14A). An active region (6) of the first epi layer includes a first doping concentration of the first conductivity type and a first plurality of CB regions (34) of the second conductivity type. A termination region (10) of the first epi layer includes a minimum epi doping concentration of the first conductivity type. The SiC-CB device also includes a device layer (16) including a second epi layer (14Z) disposed on the CB layer. The active region (6) of the second epi layer includes a first doping concentration of the first conductivity type. A termination region (10) of the device layer (16) includes a minimum epi doping concentration of the first conductivity type and a first plurality of floating regions (68) of the second conductivity type forming a junction termination (12Z) of the device.)

1. A silicon carbide (SiC) Charge Balance (CB) device (4), comprising:

a first Charge Balance (CB) layer (18) comprising a first epitaxial (epi) layer (14A), wherein an active region (6) of the first epi layer comprises a first doping concentration of a first conductivity type and a first plurality of CB regions (34) of a second conductivity type, and wherein a termination region (10) of the first epi layer comprises a minimum epi doping concentration of the first conductivity type;

a device layer (16) comprising a second epi layer (14Z) disposed on the first CB layer, wherein an active region (6) of the second epi layer comprises the first doping concentration of the first conductivity type, and wherein a termination region (10) of the device layer comprises the minimum epi doping concentration of the first conductivity type and a first plurality of float-outs (68) of the second conductivity type, the first plurality of float-outs forming a first junction termination (12Z) of the device; and

a CB bus region (38) of the second conductivity type, wherein the CB bus region extends between and electrically couples a certain one of the first plurality of CB regions of the first CB layer to the certain region of the device layer having the second conductivity type.

2. The SiC-CB device of claim 1, wherein the minimum epi doping concentration is less than or equal to 2 x 10¹⁵cm^-3。

3. The SiC-CB device of claim 1, wherein the first junction termination (12) comprises a Floating Field Ring (FFR), a single-zone Junction Termination Extension (JTE), a multi-zone JTE, a graded zone JTE, a multi-float-zone JTE, a spatially modulated JTE, or a combination thereof.

4. The SiC-CB device of claim 1, wherein said first epi layer (14A) has a thickness (37A) between 2 microns (μ ι η) and 12 μ ι η.

5. The SiC-CB device of claim 1, wherein the termination region (10) of the first epi layer (14A) includes a second plurality of floating regions (68) of the second conductivity type, the second plurality of floating regions forming a second junction termination (12A) of the device.

6. The SiC-CB device of claim 5, wherein the second junction terminal (12A) includes a first bulk charge, wherein the first junction terminal (12Z) has a second bulk charge greater than the first bulk charge.

7. The SiC-CB device of claim 1, wherein the first epitaxial (epi) layer (14A) is disposed on a base layer (20) formed of a wide bandgap material.

8. The SiC-CB device of claim 1, comprising a second CB layer including a third epi layer disposed below the first CB layer (18A), wherein an active region (6) of the third epi layer includes the first doping concentration of the first conductivity type and a second plurality of CB regions of the second conductivity type, and wherein a termination region (10) of the third epi layer includes the minimum epi doping concentration of the first conductivity type.

9. The SiC-CB device of claim 8, wherein the termination region (10) of the third epi layer includes a second plurality of floating voids of the second conductivity type, the second plurality of floating voids forming a second junction termination of the device.

10. The SiC-CB device of claim 9, wherein the second junction termination comprises a Floating Field Ring (FFR), a single-zone Junction Termination Extension (JTE), a multi-zone JTE, a graded zone JTE, a multi-float-zone JTE, a spatially modulated JTE, or a combination thereof.

11. A method of fabricating a silicon carbide Charge Balance (CB) device (4), comprising:

forming a first CB layer (18A) by:

forming a first epitaxial (epi) layer (14A) on the base layer, wherein the first epi layer includes a minimum epi doping concentration of the first conductivity type;

implanting an active region (6) of said first epi layer at a first doping concentration of said first conductivity type that is significantly greater than said minimum epi doping concentration; and

implanting a first plurality of CB regions (34) of a second conductivity type into an active region (6) of the first epi layer;

forming a device layer (16) by:

forming a second epi layer (14Z) on the first CB layer, wherein the second epi layer includes the minimum epi doping concentration of the first conductivity type;

implanting an active region (6) of the second epi layer with the first doping concentration of the first conductivity type; and

forming a first junction termination (12Z) in the device layer by injecting a first plurality of floating regions (68) of the second conductivity type into a termination region (10) of the second epi layer; and

implanting a CB bus region (38) of the second conductivity type to extend from the first plurality of CB regions (34) of the first CB layer to a region of the device layer of the second conductivity type.

12. The method of claim 11, wherein said minimum epi doping concentration is less than or equal to 2 x 10¹⁵cm^-3。

13. The method of claim 11 wherein implanting the active region (6) of the first epi layer (14A) or implanting the active region (6) of the second epi layer (14Z) comprises implanting at an implant energy greater than or equal to 500 kilo-electron volts (keV) and less than or equal to 50 mega-electron volts (MeV).

14. The method of claim 11, wherein the first junction terminal (12Z) comprises a Junction Terminal Extension (JTE), wherein a width (11) of the JTE is less than four times a combined thickness (37A, 37Z) of the first and second epi layers.

15. The method of claim 11, comprising:

forming a second junction terminal (12A) in the first CB layer (18) by injecting a second plurality of floating-out regions (68) of the second conductivity type into the termination region (10) of the first epi layer.

Background

The subject matter disclosed herein relates to silicon carbide (SiC) power devices, and more particularly, to SiC Charge Balance (CB) power devices.

For semiconductor power devices, terminations (such as junction terminations) may be used to generally prevent electric fields from collecting near the edges of the active area of the device during reverse bias operation. However, while terminations improve device reliability and operability, there are also costs associated with using terminations. For example, the termination typically occupies a certain amount of die area (referred to herein as the termination area) of the semiconductor power device. Together with other parts of the device (e.g. gate bus region, gate pad region, etc.), the termination region constitutes what is referred to herein as an overhead region of the device. Thus, while the active area of the device includes device cells (e.g., Metal Oxide Semiconductor Field Effect Transistor (MOSFET) cells) for power conversion, the overhead area includes features that support the operation of these device cells.

Therefore, to improve performance, it may be desirable to maximize the ratio of the active area to the overhead area of the device. The wide termination results in a large termination area, which results in a large overhead area, and which limits the amount of die area available for the active area of the device. Thus, by reducing the overhead area, the ratio of active area to overhead area may be increased, which may improve the efficiency and/or operation of the device.

Disclosure of Invention

In an embodiment, a silicon carbide (SiC) Charge Balance (CB) device includes a first Charge Balance (CB) layer including a first epitaxial (epi) layer. The active region of the first epi layer includes a first doping concentration of a first conductivity type and a first plurality of CB regions of a second conductivity type. Further, the termination region of the first epi layer includes a minimum epi doping concentration of the first conductivity type. The SiC-CB device also includes a device layer including a second epi layer disposed on the first CB layer. The active region of the second epi layer includes a first doping concentration of the first conductivity type. The termination region of the device layer includes a minimum epi doping concentration of the first conductivity type and a plurality of first floating-out regions of the second conductivity type that form a first junction termination of the device.

In another embodiment, a method of fabricating a silicon carbide Charge Balance (CB) device includes: a first CB layer is formed. Forming the first CB layer includes forming a first epitaxial (epi) layer on the base layer. The first epi layer includes a minimum epi doping concentration of the first conductivity type. Forming the first CB layer may further include implanting the active region of the first epi layer with a first doping concentration of the first conductivity type that is substantially greater than the minimum epi doping concentration. Additionally, forming the first CB layer may include implanting a first plurality of CB regions having the second conductivity type into the active region of the first epi layer. The method of fabricating the SiC-CB device further includes forming a device layer. Forming the device layer may include forming a second epi layer on the first CB layer. The second epi layer includes a minimum epi doping concentration of the first conductivity type. Forming the device layer may also include implanting an active region of the second epi layer with a first doping concentration of the first conductivity type. Further, forming the device layer may include forming a first junction termination in the device layer by injecting a first plurality of floating regions having a second conductivity type into a termination region of the second epi layer.

In another embodiment, a SiC-CB device includes a first Charge Balance (CB) layer including a first epitaxial (epi) layer. The termination region of the first epi layer includes a minimum epi doping concentration of the first conductivity type. Further, the SiC-CB device includes a device layer including a second epi layer disposed on the first CB layer. The termination region of the device layer includes a minimum epi doping concentration of the first conductivity type and a plurality of floating-out regions of the second conductivity type that form junction terminations of the device.

Drawings

These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:

FIG. 1 is a schematic diagram illustrating a cross-sectional view of a portion of a multilayer silicon carbide charge balance (SiC-CB) device having an active region and having a termination region that includes a floating doped region, in accordance with an embodiment;

FIG. 2 is a top view of a portion of the multilayer SiC-CB device of FIG. 1 according to an embodiment;

FIG. 3 is a schematic diagram illustrating a termination region of an embodiment of the SiC-CB device of FIG. 1, including an equal rate line (RQ) illustrating an impact ionization rate present under reverse bias conditions, in accordance with an embodiment;

FIG. 4 is a graph plotting the percentage of peak breakdown voltage obtained as a function of the ratio of the Junction Termination Extension (JTE) width of an exemplary SiC-CB device to the one-dimensional (1-D) depletion width of the device, in accordance with an embodiment;

FIG. 5 is a schematic diagram illustrating a cross-sectional view of a portion of another example of a multilayer SiC-CB device having a termination region including a first junction termination and a second junction termination, in accordance with embodiments;

FIG. 6 is a schematic diagram illustrating a cross-sectional view of a termination region of an embodiment of the SiC-CB device of FIG. 5, including an isocratic line illustrating an impact ionization rate present under a reverse bias condition, in accordance with an embodiment;

FIG. 7 is a graph illustrating termination regions per cubic centimeter (cm) as different SiC-CB device structures according to an embodiment^-3) Breakdown voltage of the SiC-CB device as a function of the doping concentration of (a); and

fig. 8 is a flow diagram of a process of an embodiment for fabricating a SiC-CB device having one or more junction terminations, according to an embodiment.

Detailed Description

One or more specific embodiments will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, when introducing elements of various embodiments of the present disclosure, the articles "a," "an," and "the" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having" are intended to be open-ended and mean that there may be additional elements other than the listed elements. In addition, it should be understood that references to "one embodiment" or "an embodiment" of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. If ranges are disclosed, the endpoints of all ranges directed to the same component or property are inclusive and independently combinable. The modifier "about" used in connection with a quantity is inclusive of the stated value and has the meaning dictated by the context (e.g., includes the degree of process variation or error associated with measurement of the particular quantity). The modifier "substantially" when used in connection with a descriptive term is intended to convey that the descriptive term applies primarily, substantially, or predominantly (e.g., to greater than 90%, greater than 95%, or greater than 99%) and may be used to account for limited exceptions that may arise due to process variations and technical limitations as understood by those skilled in the art.

As used herein, the term "layer" refers to a material that is disposed in a continuous or discontinuous manner on at least a portion of an underlying surface. Further, the term "layer" does not necessarily mean that the material provided has a uniform thickness, but the material provided may have a uniform or variable thickness. Further, the term "layer" as used herein refers to a single layer or a plurality of layers, unless the context clearly dictates otherwise. As used herein, the term "disposed on … …" means that the layers are disposed in direct contact with each other or in indirect contact through intervening layers, unless expressly indicated otherwise. As used herein, the term "adjacent" means that two layers are disposed consecutively and in direct contact with each other.

In the present disclosure, when a layer/device is described as being "on" another layer or substrate, it is to be understood that the layers/devices can be in direct contact with each other or have one (or more) layer(s) or feature(s) between layers and between devices. Furthermore, the term "on … …" describes the relative position of layers/devices with respect to each other and does not necessarily mean "on top of … …" as the relative position "above" or "below" depends on the orientation of the device with respect to the viewer. Moreover, the use of "top," "bottom," "above," "below," "upper," "buried," and variations of these terms is made for convenience, and does not require any particular orientation of the components unless otherwise specified. With this in mind, as used herein, the terms "under", "buried", "intermediate" or "bottom" refer to features that are relatively closer to the substrate layer (e.g., epitaxial layers, termination regions), while the terms "top" or "upper" refer to particular features that are relatively furthest from the substrate layer (e.g., epitaxial layers, termination regions).

The present embodiments relate to designs and methods for fabricating silicon carbide charge balance (SiC-CB) devices. The disclosed designs and methods may be used to fabricate SiC-CB devices such as Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), Junction Field Effect Transistors (JFETs), Bipolar Junction Transistors (BJTs), diodes, and other SiC-CB devices that may be beneficial for applications related to medium voltage (e.g., 2kV-10kV) and high voltage (e.g., greater than or equal to 10kV) power conversion. As discussed below, the disclosed SiC-CB device design includes a multilayer termination region implemented using repeated epitaxial growth and dopant implantation steps. As used herein, the term "multilayer" and references to specific numbers of layers (e.g., "two layers," "three layers," "four layers") refer to the number of epitaxial SiC layers (referred to herein as epi layers).

More particularly, the present embodiments relate to designs and methods for fabricating termination, such as junction termination, of silicon carbide charge balance (SiC-CB) devices. In general, the disclosed termination design satisfies several design parameters to provide effective terminations (e.g., edge terminations) for SiC-CB devices. For example, the disclosed termination design provides a breakdown voltage close to that of the device (event). The disclosed termination design is also relatively robust to process variations (e.g., dopant concentration in the implanted region, dopant concentration in the epitaxial layer, percentage of dopant activation, etc.). Additionally, the disclosed termination design consumes a relatively small portion of the die area and is relatively low in manufacturing cost relative to typical junction termination designs. For example, certain disclosed SiC-CB device embodiments may be fabricated using common semiconductor fabrication equipment (such as high volume ion implantation systems used in existing Si/SiC device fabrication) to provide additional cost benefits.

As discussed in detail below, the disclosed SiC-CB termination designs include one or more n-type and/or p-type doped regions arranged in a particular manner to form a junction termination, such as a Junction Termination Extension (JTE), thereby allowing for a gradual reduction in the magnitude of the electric field outside of the active region (e.g., conductive region) of the SiC-CB device under high breakdown voltage operation. In various embodiments, these doped regions may be implemented as unconnected blocks, continuous pillars, bars, segments, grids, dots, or any other suitable shape. In some embodiments, these doped regions may be described as "floating," meaning that they are not in electrical contact with the device terminals or under an externally applied bias; however, in other embodiments, at least a portion of these regions may be in electrical contact with device terminals. The location and dimensions of these implanted regions in the termination region of the disclosed SiC-CB devices are designed to achieve high blocking voltages to prevent premature device breakdown due to electric field crowding effects and to allow reliable operation of these devices, especially when subjected to long-term high temperature/high voltage operation. Furthermore, by using high energy ion implantation to control the doping of the epitaxial (epi) layer within the active region of the SiC-CB device, and for example by controlling the doping of the termination region of the device, the disclosed termination design occupies less die area than conventional junction termination designs, which significantly increases the ratio of active area to overhead area without performance loss in terms of breakdown voltage.

In view of the above, fig. 1 shows a cross-sectional view of an embodiment of a SiC-CB device 4A according to an embodiment of the present scheme, having an active region 6 and an intermediate region 8, and a termination region 10 having a junction termination, such as a Junction Termination Extension (JTE) 12. It will be appreciated that certain well-known design elements (e.g., top metallization, passivation, etc.) may be omitted in order to more clearly show certain components of the SiC-CB device 4A.

The illustrated embodiment of the SiC-CB device 4A includes several epitaxial (epi) layers 14 forming, inter alia, a device layer 16 and a Charge Balance (CB) layer 18 of the SiC-CB device 4. Although the illustrated embodiment includes two epi layers 14 (e.g., 14A and 14Z), the SiC-CB device 4A may include any suitable number of epi layers 14 (e.g., 3, 4, 5, 6, or more) to produce a SiC-CB device 4A having a particular desired voltage rating. In some embodiments, epi layer 14 is generally formed of one or more wide bandgap semiconductor materials, such as silicon carbide, gallium nitride, diamond, aluminum nitride, and/or boron nitride. The epi layer 14 may be fabricated using repeated cycles of epitaxial overgrowth. As illustrated, a first epi layer 14A is disposed over and adjacent to substrate layer 20, and a second epi layer 14Z (e.g., a device epi layer) is disposed over and adjacent to first epi layer 14A. In other embodiments, the SiC-CB device 4A may include additional epi layers 14 (e.g., 14B, 14C, 14D, etc.) that include any suitable number of CB layers 18 interposed between the first epi layer 14A and the device epi layer 14Z and/or disposed below the first epi layer 14A.

It will be appreciated that for the present embodiment, the epi layer 14 may be formed at a lowest controllable doping level, e.g., without any intentional epi doping (e.g., without any dopants intentionally introduced). It should be appreciated, however, that because impurities (such as nitrogen) may be present in the instruments and/or tools used during the epitaxial growth process, epi layer 14 may still include a small amount of epi doping (e.g., of the first conductivity type), referred to herein as the "minimum epi doping concentration". Thus, while the epi layer 14 may be formed without an intentional doping concentration, the actual epi doping concentration of the epi layer 14 may generally be 8.0 × 10¹³cm^-3Or higher depending on the equipment used for epitaxial growth. For example, in certain embodiments discussed below, the minimum epi doping concentration of the first conductivity type (e.g., n-type) may be less than 5.0 x 10¹⁵cm^-3Less than 2X 10¹⁵cm^-3Less than 1X 10¹⁵cm^-3Or at 8X 10¹³cm^-3And 1X 10¹⁵cm^-3In the meantime.

Thus, is obtained byOther SiC devices differ in that, since epi layer 14 begins with a minimum epi doping concentration, portions of epi layers 14A and 14Z are then implanted twice, once for each conductivity type, to obtain the desired structure (e.g., device structure, CB structure). After the first implant of the first conductivity type, device region 6 and intermediate region 8 of SiC-CB device 4A have a particular doping concentration of the first dopant type (e.g., greater than or equal to 5 x 10)¹⁵cm^-3). For example, when the first conductivity type is n-type, nitrogen, phosphorus, arsenic, antimony, and/or the like may be used as a dopant. Alternatively, when the first conductivity type is p-type, boron, aluminum, and/or the like may be used as a dopant. Subsequently, a second implantation is used to form regions of the second conductivity type within portions of the active region 6 and the intermediate region 8.

Accordingly, the termination region 24 disposed in the termination region 10 of the SiC-CB device 4A may have a first doping concentration of the first conductivity type. Further, the intermediate region 28 disposed in the intermediate region 8 of the SiC-CB device 4A may have a second doping concentration of the first conductivity type. Further, the active region 32 disposed in the active region 6 of the SiC-CB device 4A may have a third doping concentration of the first conductivity type. For example, as discussed in more detail below, to define the active region 6 and the intermediate region 8, the doping concentration of the active region 32 and the doping concentration of the intermediate region 28 may be greater than the doping concentration of the termination region 24. For example, in some embodiments, the doping concentration of the first conductivity type in active region 32 and intermediate region 28 may be greater than or equal to 5 x 10¹⁵Per cubic centimeter (cm)^-3) E.g. 1.0 x 10¹⁶cm^-3. For such embodiments, the doping concentration of the first conductivity type (e.g., the minimum epi doping concentration) in termination region 24 may be less than or equal to 2.0 x 10¹⁵cm^-3. Furthermore, the doping concentration of the first conductivity type in some portions of the epi layer (e.g., termination region 24, intermediate region 28, and/or active region 32, respectively) may be the same or different within a certain device region (e.g., termination region 10, intermediate region 8, and/or active region 6).

For the embodiment shown in fig. 1, in active region 6, top surface 42 of device layer 16 includes a well region 40 (e.g., p-well region 40) having the second conductivity type disposed adjacent a source region 44 (e.g., n-type source region 44) having the first conductivity type. A dielectric layer 46 (also referred to as a gate insulating layer or gate dielectric layer) is disposed adjacent device layer 16, and a gate electrode 48 is disposed adjacent dielectric layer 46. Further, the CB layer 18 is disposed on a substrate layer 20 (e.g., a semiconductor substrate layer, a wide bandgap substrate layer), and a drain contact 50 is disposed on a bottom 52 of the SiC-CB device 4A adjacent to the substrate layer 20. As additionally illustrated in the embodiment of fig. 1, source contact 54 is disposed adjacent to top surface 42 of device layer 16 and is disposed on a portion of both source region 44 and well region 40 of device layer 14.

During the illustrated on-state operation of the SiC-CB device 4A, the appropriate gate voltage (e.g., equal to or higher than the threshold voltage (V) of the SiC-CB device 4A_TH) Creates inversion layer formation in the channel region 62 and an enhanced conduction path in the Junction Field Effect Transistor (JFET) region 64 due to carrier accumulation, allowing current to flow from the drain contact 50 (e.g., drain electrode, drain terminal) to the source contact 54 (e.g., source electrode, source terminal) within portions of the active region 6 and/or in the intermediate region 8. Channel region 62 may generally be defined as an upper portion of well region 40 disposed below gate electrode 48 and dielectric layer 46.

To reduce on-state resistance (rds (on)) and the on-state conduction losses resulting therefrom, SiC-CB device 4A includes CB layer 18 formed in active region 32A and intermediate region 28A of first epi layer 14A. CB layer 18 includes a set of CB regions 34 implanted in active region 32A and intermediate region 28A. Within CB layer 18, CB region 34 is oppositely doped relative to active region 32A and remaining portion 36 of intermediate region 28A. In other words, for SiC-CB device 4 having n-type active region 32 and/or intermediate region 28, CB region 34 is p-type, while for SiC-CB device 4 having p-type active region 32A and/or intermediate region 28, CB region 34 is n-type. Further, CB region 34 and active region 32A and remaining portion 36 of intermediate region 28A are each generally designed to be substantially depleted and to provide a similar amount (e.g., substantially equal amount) from ionized dopants under reverse biasEffective charge (e.g., per square centimeter (cm)^-2) Normalized to the device active area 6). The charge balance structure shown allows the SiC-CB device 4A to achieve high breakdown voltage and low on-state resistance since both the p-type semiconductor portion and the n-type semiconductor portion are fully depleted under nominal blocking conditions.

In some embodiments, the disclosed CB region 34 and CB layer 18 may have one or more characteristics (e.g., doping, width, depth, spacing, etc.), as described FOR the floating charge balance region in U.S. patent No. 9,735,237 entitled "ACTIVE AREA DESIGNS FOR SILICON CARBIDE card SUPER-JUNCTION POWER device active area design" filed on 26.6.2015, the disclosure of which is incorporated herein by reference in its entirety FOR all purposes. For example, in some embodiments, the thickness 37A and 37Z of each epi layer 14A and 14Z is less than or equal to 20 μm, such as between 5 μm and 20 μm, between 2 μm and 12 μm, between 5 μm and 12 μm, between 10 μm and 12 μm, and the like. Additionally, the thickness 39 of the CB region 34 is in the range of 0.5 μm to 1.0 μm. For such embodiments, the dopant concentration of the CB region 34 may be between 2 x 10¹⁶Per cubic centimeter (cm)^-3) And 1X 10¹⁸cm^-3In the meantime. More specifically, in some embodiments, CB region 34 may be described as having approximately 2 x 10 since CB region 34 may be implanted with a variable dopant concentration profile¹³Per square centimeter (cm)^-2) (e.g., +/-20% and/or +/-50%) of the overall charge (e.g., dose). The overall charge may be determined and/or adjusted based in part on the depth to which CB region 34 is implanted and/or the implant acceleration energy used to implant CB region 34. In such embodiments, portions of epi layer 14 within active region 6 and/or intermediate region 8 (e.g., active region 32 and/or intermediate region 28, respectively) may be doped to greater than or equal to 5 x 10¹⁵cm^-3May be used, which may result in a transistor having a particular on-resistance (e.g., less than 7 milliohms per square centimeter (mOhm/cm)²) And a particular breakdown voltage (e.g., greater than 3kV, greater than 4.5 kV). In some embodiments, the doping concentration of the set of CB regions 34 is divided by the doping concentration of the CB regions 34The thickness may be greater than or equal to 5 x 10¹²cm^-2And less than or equal to about 1 x 10¹⁴cm^-2. Accordingly, in such embodiments, the doping concentration of the set of CB regions 34 may be between 5 x 10¹⁶cm^-3And 2X 10¹⁸cm^-3In the meantime. Further, in some embodiments, for example, the SiC-CB device 4A may include fewer or additional CB layers 18 (e.g., two CB layers 18, three CB layers 18, four CB layers 18, etc.) to achieve a desired voltage rating.

Further, it should be understood that the doping of epi layer 14, the doping of CB region 34, thickness 37 of epi layer 14, thickness 39 of CB region 34, and other characteristics may be varied for different embodiments to achieve a desired electrical performance (e.g., a desired breakdown voltage) of SiC-CB device 4. For example, in some embodiments, certain device parameters (e.g., thickness 37 and doping of epi layer 14) may be selected to provide a breakdown voltage of SiC-CB device 4A of between approximately 1 kilovolt (kV) and 10kV, between 1kV and 5kV, or any other suitable range.

Additionally, the illustrated embodiment of the SiC-CB device 4A includes a Charge Balance (CB) bus 38 electrically coupled to at least a portion of the CB region 34. The CB bus 38 has the same conductivity type as the CB region 34, which is opposite to the conductivity type implanted into the active region 32 and/or the remainder 36 of the intermediate region 28. Thus, for SiC-CB devices 4 having n-type active regions 32 and/or intermediate regions 28, CB bus 38 and CB regions 34 are p-type, while for SiC-CB devices 4 having p-type active regions 32 and/or intermediate regions 28, CB bus 38 and CB regions 34 are n-type. Further, the doping concentration of the CB bus 38 may be the same or different than the set of CB regions 34 of the CB layer 18. Further, as illustrated, CB bus 38 is in contact with and electrically coupled with well region 40 (which has the same conductivity type as CB bus 38), intermediate well region 66 (which has the same conductivity type as CB bus 38) and CB region 34 of device layer 16. The CB bus 38 may be injected into a portion of each epi layer 14. In particular, the disclosed CB bus 38 may extend vertically (e.g., along the Y-axis) from one or more well regions 40 and/or from one or more features (e.g., intermediate well regions 66) near the top surface 42 of the device layer 16 to at least a portion of the CB region 34. Thus, the illustrated CB bus 38 connects (e.g., electrically couples) the well region 40 to at least a portion of the CB region 34.

In some embodiments, the disclosed CB bus 38 may have one or more characteristics (e.g., doping, width, depth, spacing, etc.), as described for the connection region in co-pending U.S. patent application No. 15/077,579 entitled "SUPER-JUNCTION SEMICONDUCTOR POWER device with fast switching CAPABILITY," filed 3, 22, 2016, the disclosure of which is incorporated herein by reference in its entirety for all purposes. For example, in some embodiments, the width of the CB bus 38 along the X axis may be between 1 μm and 5 μm. Further, in some embodiments, the doping concentration of the CB bus 38 may be at 5 x 10¹⁵cm^-3And 1X 10¹⁷cm^-3E.g. at 5 x 10¹⁵cm^-3And 4X 10¹⁶cm^-3And/or in the range of 1 x 10¹⁶cm^-3And about 1X 10¹⁷cm^-3In the meantime.

For the embodiment shown in fig. 1, termination region 10 includes a junction termination, such as JTE12, of the second conductivity type implanted into termination region 24Z. In some embodiments, JTE12 includes several implant regions of dopants of a second conductivity type (e.g., p-type) that extend from intermediate region 8 by a width 11 and are used to reconfigure the electric field in at least termination region 10 of SiC-CB device 4. In certain embodiments, these implanted regions include the floating regions 68, which are implemented in the SiC-CB device 4A of fig. 1 as unconnected, dopant-implanted blocks. When the floating regions 68 are arranged as disclosed, they gradually reduce the strength of the electric field outside the active region 6 of the SiC-CB device 4A during the high-voltage blocking operation. Additionally, the SiC-CB device 4A may also include several passivation layers 70 disposed on the device layer 16 in the termination region 10, which may be formed of one or more dielectric materials that help reduce the electric field above the device layer 16.

As noted above, the floating-out regions 68 of the SiC-CB device 4A are shown as regions of opposite conductivity type relative to the minimum epi doping of the epi layer 14Z (e.g., termination region 24Z) in which they are located. When the embodiment of the SiC-CB device 4A shown in fig. 1 is in the off state under reverse bias, the floating regions 68 are depleted to provide ionized dopants (immobile charges), which when appropriately sized, shaped, and positioned relative to the X-axis and Z-axis allow the electric field to be reconstructed within the perimeter of the SiC-CB device 4A (e.g., within the termination region 10). More specifically, when the floating regions 68 are depleted under reverse bias, they prevent electric field peaks and provide an electric field distribution that gradually decreases in magnitude with increasing distance from the active region 6 of the SiC-CB device 4A. Under reverse bias, the particular electric field profile in the termination region 10 of the SiC-CB device 4A depends, for example, on the profile of the dopants (e.g., dopant concentration, size and location of the float-off region 68).

For the embodiment of the SiC-CB device 4A shown in fig. 1, the float-out region 68 has a particular depth 72. In other embodiments, the floating region 68 may extend through the entire thickness of the device epitaxial layer 14Z (e.g., thickness 37Z). Additionally, for the embodiment shown in fig. 1, the width 74 of the float-off region 68 and the spacing 76 between the float-off regions 68 in the termination region 10 vary (e.g., decrease or increase) as the distance from the active region 6 of the SiC-CB device 4A increases to provide a gradual decrease in the effective sheet doping concentration (effective sheet doping concentration) in the termination region 10. It will be appreciated that in other embodiments, the width 74 of the floating-out regions 68 decreases significantly with increasing distance from the active region 6, while the spacing 76 between the floating-out regions 68 remains substantially constant. In other embodiments, the spacing 76 between the floating zones 68 increases significantly with increasing distance from the active region 6, while the width 74 of the floating zones 68 remains substantially constant. Further, in some embodiments, the SiC-CB device may include at least one additional JTE12 in at least one buried epi layer (e.g., CB layer 18), as described below with reference to fig. 5. In such an embodiment, the float zones 68 of each epi layer 14A and 14Z may have different depths 72, widths 74, and spacings 76. Additionally, in some embodiments, multiple masking/photolithography steps may be used to fabricate JTE12 for each epi layer 14.

Further, in some embodiments, the disclosed float-out region 68 may have one or more characteristics (e.g., doping, width, depth, spacing, etc.), as described FOR the float-out region in co-pending U.S. patent application No. 16/060,549 entitled EDGE TERMINATION design FOR SILICON CARBIDE SUPER JUNCTION POWER DEVICES, filed on 8.6.2018, the disclosure of which is incorporated herein by reference in its entirety FOR all purposes. For example, in some embodiments, the width 74 of each of the float-out regions 68 may be between 0.8 microns (μm) and about 5 μm, while the spacing 76 between the float-out regions 68 may be generally less than the thickness of the corresponding epi layer 14 in which the float-out regions 68 are disposed (e.g., the thickness 37Z of the epi layer 14Z of the device). Further, the depth 72 of each of the float-out zones 68 may be about 1 μm. Furthermore, the overall charge (e.g., dose) of JTE12 may be at 6X 10¹²cm^-2And 3X 10¹³cm^-2In the meantime. For example, in some embodiments, the bulk charge of device layer JTE 12Z may be 1.6 × 10¹³cm^-2。

Additionally or alternatively, in some embodiments, the disclosed JTEs 12 and/or float-out regions 68 may have one or more characteristics (e.g., doping, width, depth, spacing, etc.), as described for JTEs and/or discrete regions, respectively, in U.S. patent No. 9,406,762 entitled "SEMICONDUCTOR device DEVICE WITH JUNCTION TERMINATION EXTENSION" filed 5, 15, 2013, the disclosure of which is incorporated herein by reference in its entirety for all purposes. For example, in some embodiments, the effective doping profile of JTE12 decreases monotonically as a function of distance from intermediate region 8 along the X-axis. That is, for example, each of the float-out regions 68 may be separated from another float-out region by a respective spacing 76 and/or a respective additional spacing 80 shown in fig. 2 such that the doping profile of JTE12 generally decreases with increasing distance from intermediate region 8 along the X-axis.

JTE12 described herein provides an illustrative example of junction termination, and more specifically, JTE12 described herein depicts an illustrative example of a graded region JTE. However, in some embodiments, an implanted region having a second conductivity type (e.g., p-type), such as the floating region 68, may additionally or alternatively be implemented to have one or more characteristics corresponding to another termination and/or junction termination structure. For example, the implant region may be implemented as a single region JTE (which may include a single implant region in contact with the interwell region 66), and/or as a multi-region JTE (which may include two or more connected implant regions). In some embodiments, the two or more connected implant regions may have the same or different characteristics, and at least one of the two or more connected implant regions may contact the intermediate well region 66. Additionally, in some embodiments, an implant region may be implemented to form a multi-float region JTE. In such an embodiment, the first implant region may contact the intermediate well region 66, while a set of additional implant regions (such as the float-off regions 68) having different pitches and/or widths may be implanted without connecting to the first implant region and without connecting to each other. Further, in some embodiments, an implant region (e.g., the float-out region 68) may be implemented to form a Float Field Ring (FFR) termination. In such an embodiment, the floating regions 68 may be implanted without connecting to each other and without connecting to the intermediate well regions 66. Additionally or alternatively, an implant region may be implemented to form a spatially modulated JTE, which may include a first implant region in contact with the intermediate well region and unconnected to an additional set of implant regions implanted to form an FFR. Thus, it is to be understood that the techniques described herein may be applied to any suitable junction termination (such as single-region JTE, multi-region JTE, graded JTE, multi-float-region JTE, FFR, spatially modulated JTE, etc.), and the embodiments described herein are intended to be illustrative and not limiting.

Fig. 2 shows a top view (perpendicular to the schematic diagram of fig. 1) of a SiC-CB device 4A according to an embodiment of the present scheme. More specifically, fig. 2 illustrates a top view of an embodiment of a SiC-CB device 4B having a termination region 10 that includes a floating void region 68 implemented as a disconnected doped mass. In particular, fig. 2 shows a top view of a cross section of the device layer JTE 12Z and the exposed CB layer 18. For simplicity, device layer JTE 12Z and CB layer 18 are shown in the same top view. However, it is understood that the CB layer 18 may be disposed at a different depth (e.g., along the Y-axis) than the device layer JTE 12Z, as indicated by the cross-section.

For the embodiment shown in FIG. 2, each of the float-out zones 68 has a particular length 78 along the Z-axis, and an additional spacing 80. In some embodiments, the length 78 of each of the float-out regions 68 may be between 0.8 μm and about 5 μm, while the additional spacing 80 between the float-out regions 68 may be generally less than the thickness 37 of the corresponding epi layer 14 in which the float-out regions 68 are disposed (e.g., the thickness 37Z of the epi layer 14Z of the device). Although the floating void regions 68 are illustrated as unconnected blocks, the floating void regions 68 may be implemented as unconnected blocks, continuous columns, bars, segments, grids, dots, or any other suitable shape. Accordingly, the length 78 of the float-out zone 68 and the additional spacing 80 between the float-out zone 68 may vary between certain embodiments. Further, as described above, the floating void region 68 may be implemented to have characteristics (e.g., length 78, additional spacing 80, etc.) for forming alternative termination and/or junction termination structures. Accordingly, the embodiments disclosed herein are intended to be illustrative and not restrictive.

As further illustrated, each CB region 34 may be described as having a particular width 82 and a particular spacing 84. In some embodiments, the width 82 of each CB region 34 is between 0.1 μm and 2 μm, and the spacing 84 between CB regions 34 is between 1 μm and 6 μm. However, as discussed above, the dimensions of CB region 34 (e.g., thickness 39, width 82, and/or spacing 84) may vary for different embodiments to achieve a desired electrical performance (e.g., a desired breakdown voltage) of SiC-CB device 4. Further, in certain embodiments, the dimensions of the CB region 34 (e.g., thickness 39, width 82, and/or spacing 84) may be different in different CB layers 18. In different embodiments, the CB region 34 may have different cross-sectional shapes (e.g., defined by an implantation mask and/or implantation energy/dose). For some embodiments, the shape of the CB region 34 may be substantially constant along the Y-axis.

Turning now to fig. 3, a cross-sectional view of an embodiment of a portion of a SiC-CB device 4A having JTE12 is shown. Additionally, fig. 3 includes an isocratic line 100 indicating the incidence of collisions (e.g., impact ionization rate) present in different regions of the SiC-CB device 4A under reverse bias conditions. It may be noted that the collision occurrence rate is indicated as being higher (e.g., larger) when the rate lines 100 are close to each other, and lower when there is a larger spacing between the rate lines 100.

In some embodiments, reconfiguring the electric field of the SiC-CB device 4A may include forming JTEs 12 such that avalanche breakdown (a result of impact ionization) occurs outside the termination region 10 (e.g., within the active region 6 and/or the intermediate region 8) at a nominal voltage rating. That is, for example, avalanche breakdown may be isolated to the active region 6 and/or the intermediate region 8, which may maximize the breakdown voltage of the SiC-CB device 4A, thereby achieving a breakdown voltage that is close to what the device should have. Thus, as shown, the collision incidence is highest at the charge balance region 34 and well region 66 in the middle region 8 and decreases outward from these regions. Thus, using the disclosed JTE design, the incidence of collisions within the termination region 10 is minimized and may gradually decrease as the distance from the intermediate region 8 and/or the active region 6 increases.

Returning briefly to fig. 1, it can be appreciated that in a conventional SiC device (e.g., having 5.0 x 10 in the termination region)¹⁵cm^-3Or higher epi-doped SiC devices), the width 11 of JTE12 may be greater than or equal to five times the one-dimensional (1-D) depletion width of the device, where the 1-D depletion width may be approximately the depth of active region 6 (e.g., the sum of thicknesses 37 of epi layers 14), in order to contain avalanche breakdown within active region 6 and/or intermediate region 8. That is, for example, the ratio of the width 11 of JTE12 to the 1-D depletion width of the device may be 5: 1. However, as shown in graph 120 shown in fig. 4, to achieve a peak (e.g., maximum) breakdown voltage in SiC-CB device 4A having one or more CB layers 18 and termination region 24 with the smallest epi doping concentration, the ratio of width 11 of JTE12 to the 1-D depletion width of SiC-CB device 4A may be significantly reduced. Thus, by using the disclosed JTE design, it is now recognized that for the SiC-CB device 4A, the ratio of the active region 6 to the overhead region (e.g., including the termination region 10) of the SiC-CB device 4A may be increased. Thus, die area available for active region 6The domain may be increased.

More specifically, graph 120 plots an example of the percentage of peak breakdown voltage that may be achieved by SiC-CB device 4A having a particular ratio of width 11 of JTE12 (e.g., the width of termination region 10) to the 1-D depletion width of the device. On the left side of line 122 (e.g., for a ratio of JTE12 width 11 to the device's 1-D depletion width below about 1.5), avalanche breakdown occurs at JTE12 (e.g., termination region 10) and/or at the intersection of JTE12 and intermediate well region 66. Further, in some embodiments, plotted curve 124 may include a peak value that exceeds 100% of the peak breakdown voltage. This peak indicates the transition from avalanche breakdown occurring in JTE12 to avalanche breakdown occurring in the combination of JTE12 and active region 6 and/or intermediate region 8. To the right of line 122 (e.g., for a ratio of width 11 of JTE12 to the 1-D depletion width of the device of greater than or equal to about 1.5), avalanche breakdown desirably occurs at active region 6 and/or at intermediate region 8, rather than in termination region 10 of SiC-CB device 4A. Thus, embodiments of SiC-CB device 4A where the ratio of the width 11 of JTE12 to the 1-D depletion width of the device is greater than or equal to about 1.5 can achieve a maximum breakdown voltage (e.g., 100% of the peak breakdown voltage) of the SiC-CB device 4.

Turning now to fig. 5, in some embodiments, the disclosed SiC-CB device 4 may include a plurality of junction terminations, such as a plurality of JTEs 12. For example, as shown, SiC-CB device 4B includes a first JTE 12A in the same epi layer 14A as CB layer 18 and a second JTE 12Z (e.g., device JTE) in the same epi layer 14Z (e.g., device layer 16) as intermediate well region 66. In some embodiments, the doping profile of the first JTE 12A may be the same as the doping profile of the device layer JTE 12Z. However, in other embodiments, the doping profile of the first JTE 12A may be different from the doping profile of the JTE 12A. For example, in some embodiments, the overall charge (e.g., dose) of the first JTE 12A may be lower than the overall charge of the device layer JTE 12Z. For example, the first JTE 12A may have a 9.0 × 10¹²Per square centimeter (cm)^-2) And the device layer JTE 12Z may have a 1.6 × 10 dose¹³cm^-2An effective amount of (a). In this implementationIn an example, the first JTE 12A may be implanted simultaneously with the CB layer 18 (e.g., with the CB region 34). For example, using the same material (e.g., Al, B, N, P, etc.) and using the same dose/energy during the same ion implantation step used to implant the set of CB regions 34, the floated regions 68 of the first JTE 12A may be implanted with the same dopant type (e.g., P-type or N-type dopants), which may reduce fabrication time and cost. In other embodiments, the floating regions 68 of the first JTE12 use different dopant materials and/or dose/energy implants, which may increase fabrication time and cost, but enable greater design flexibility (e.g., dopant materials, effective integrated charge, etc.) of the first JTE 12A.

Further, as noted above, the SiC-CB device may include any number of epi layers 14 and/or CB layers 18. Thus, while the illustrated embodiment includes two JTEs 12 (e.g., 12A and 12Z), it is understood that in some embodiments, the SiC-CB device 4B may include a respective JTE12 (e.g., 12B, 12C, 12D, etc.) in each epi layer 14 (including CB layer 18). Alternatively, SiC-CB device 4B may include JTE12 for each epi layer of a set of epi layers 14, such that JTE12 is adjacent to every other epi layer 14, every third epi layer 14, and so on. Accordingly, the embodiments described herein are intended to be illustrative and not restrictive.

Further, as described herein, the electric field of the SiC-CB device 4B may be reconstructed based in part on JTE12 (e.g., 12A, 12Z), which may affect the location of avalanche breakdown within the SiC-CB device 4B. Thus, to demonstrate the effect of multiple JTEs 12 on avalanche breakdown of SiC-CB device 4, fig. 6 shows a cross-sectional view of a portion of an embodiment of SiC-CB device 4B with first JTE 12A and device layer JTE 12Z. Additionally, fig. 6 includes an isocratic line 100 indicating the incidence of collisions (e.g., impact ionization rate) present in different regions of the SiC-CB device 4B in a reverse biased state, as described with reference to fig. 3. As further described with reference to fig. 3, the collision occurrence rate is indicated as being higher (e.g., greater) when the rate lines 100 are close to each other, and lower when there is a greater spacing between the rate lines 100.

In the illustrated embodiment, avalanche breakdown occurs primarily in the CB layer 18 and the device epi layer 14Z (e.g., at the intermediate well region 66), as shown by the rate lines 100 in close proximity to one another, indicating the highest incidence of collisions. Further, as described above with reference to fig. 3, the incidence of collisions of the SiC-CB device 4B gradually decreases as one moves outward from the CB layer 18 and the intermediate well region 66. Further, in some embodiments, since the effective dose of the device JTE 12Z is larger than that of the first JTE 12A, the incidence of collisions may drop faster in the termination region 24Z than in the termination region 24A. Thus, the terminal area 10 of the illustrated embodiment has a different collision occurrence distribution than that of the embodiment shown in fig. 3.

For the embodiment shown in fig. 6, the width 11 of each of the device layers JTE 12Z and first JTE 12A shown is approximately 50 microns (μm). Thus, while the incidence of collisions in the termination region 24A of fig. 6 is greater than the incidence of collisions in the termination region 24A of fig. 3, the ratio of the active region 6 to the termination region 10 of the embodiment shown in fig. 6 is greater than the embodiment shown in fig. 3. Accordingly, certain parameters of the termination region 10 (e.g., width 11, number and doping concentration of JTEs 12, and other characteristics) may be varied for different embodiments to achieve desired electrical performance of the SiC-CB device 4 (e.g., desired breakdown voltage, ratio of active region 6 to termination region 10, etc.). For example, as described in more detail below, a termination region 10 with a single device layer JTE 12Z may be designed with a termination region 24 having a first minimum epi doping concentration, while a termination region 10 with multiple JTEs 12 may be designed with a termination region 24 having a second minimum epi doping concentration that is greater than (e.g., includes greater tolerance for unintentional epi doping) the first minimum epi doping concentration.

As described above, the termination region 24 (e.g., 24A, 24Z) may have a minimum epi doping concentration that is significantly lower than the doping concentration of the first conductivity type in the active region 32 and/or the intermediate region 28 of the device. In some embodiments, along with the width of JTE12, the doping concentration of termination region 24 may affect the maximum breakdown voltage of SiC-CB device 4 and/or the location of avalanche breakdown within SiC-CB device 4. To reveal this relationship, graph 1 shown in FIG. 740 shows the doping concentration (cm) as epi in the termination region 24^-3) Examples of breakdown voltages of the SiC-CB devices 4A and 4B as a function of (a).

A first curve 142 on the graph 140 plots the breakdown voltage of the embodiment of the SiC-CB device 4A of fig. 1 as a function of epi doping concentration in the termination region 24. More specifically, a first curve 142 illustrates an example of a relationship between the breakdown voltage of the SiC-CB device 4A having a single device JTE12 and the epi doping concentration of the termination region 24. As further illustrated, the exemplary SiC-CB device 4A has a nominal breakdown voltage of 2650 volts (V). To the left of the first line 144 (e.g., for less than or equal to 2.0 x 10)¹⁵cm^-3Which is considered herein as the minimum epi doping concentration for this SiC device 4A), avalanche breakdown of the SiC-CB device 4A occurs in the active region 6 and/or the intermediate region 8 (e.g., at the CB layer 18). To the right of the first line 144 (e.g., for greater than 2.0 x 10)¹⁵cm^-3Doping concentration) avalanche breakdown occurs at the termination region 10 (e.g., device JTE 12) and/or at the intersection of the device JTE12 with the intermediate well region 66. As a result, for values greater than 2.0X 10¹⁵cm^-3The maximum breakdown voltage of the SiC-CB device 4A decreases as the epi doping concentration of the termination region 24 increases (e.g., the minimum epi doping concentration of the present embodiment). Thus, for a SiC-CB device 4A having a termination region 10 with a single JTE12, the termination region 24 may be less than or equal to 2.0 x 10¹⁵cm^-3(e.g., 8.0X 10)¹³cm^-3，1.0×10¹⁵cm^-3) Is implanted at epi doping concentration.

A second curve 146 on the graph 140 plots the breakdown voltage of the embodiment of the SiC-CB device 4B of fig. 5 as a function of epi doping concentration in the termination region 24. More specifically, second curve 146 illustrates an example of a relationship between the breakdown voltage of SiC-CB device 4B having first JTE 12A disposed in first epi layer 14A (e.g., CB layer 18) and device layer JTE 12Z disposed in device epi layer 14Z and the doping concentration of termination region 24, where SiC-CB device 4B has a due breakdown voltage of 2650 volts (V). On the left side of the second line 148 (e.g.,for a value less than or equal to 5.0X 10¹⁵cm^-3Which is considered herein as the minimum epi doping concentration of the SiC device 4B), avalanche breakdown occurs in the active region 6 and/or the intermediate region 8 (e.g., in the CB layer 18). To the right of the second line 148 (e.g., for greater than 5.0 x 10)¹⁵cm^-3Doping concentration) avalanche breakdown occurs in the termination region 10 (e.g., device layer JTE 12Z) and/or at the intersection of the device layer JTE 12Z and the intermediate well region 66. As a result, for values greater than 5.0X 10¹⁵cm^-3The maximum breakdown voltage of the SiC-CB device 4B decreases as the epi doping concentration of the termination region 24 increases (e.g., the minimum epi doping concentration of the present embodiment). Thus, termination region 24 may be less than or equal to 5.0 × 10 for SiC-CB device 4B having first JTE 12A and device layer JTE 12Z¹⁵cm^-3(e.g., 2.5X 10)¹⁵cm^-3、3.0×10¹⁵cm^-3、4.0×10¹⁵cm^-3) Is performed.

As shown by the difference between the doping concentrations represented by the first line 144 and the second line 148, including the additional JTE12 in the termination region 10 of the SiC-CB device 4 increases the epi doping concentration range of the termination region 24 suitable for promoting maximum breakdown of the SiC-CB device 4. That is, for example, the range of minimum epi doping concentrations for termination region 24 may have greater tolerance for increasing epi doping concentrations for device designs having a greater number of JTEs 12.

Fig. 8 is a flow diagram of a process 200 for fabricating an embodiment of a SiC-CB device 4 having one or more junction terminations, such as one or more JTEs 12 (e.g., 4A, 4B), according to an embodiment described herein. Although the following description of process 200 is described in a particular order that represents particular embodiments, it should be noted that process 200 may be performed in any suitable order. Further, some steps may be repeated or skipped altogether, and additional steps may be included in process 200. The following description of the process 200 is described with reference to the embodiments of the SiC-CB device 4 illustrated in fig. 1, 2, and 5.

The illustrated process begins by forming (process block 202) an epi layer having a minimum epi doping concentration of a first conductivity type on a base layer. In some embodiments, the base layer may include a semiconductor substrate layer 20. As described above, the substrate layer 20 may be made of silicon, silicon carbide (SiC), gallium nitride, diamond, aluminum nitride, and/or boron nitride. Alternatively, the epi layer may be formed on another epi layer 14 and/or the CB layer 18, as described in more detail below.

To form the first epi layer 14A on the base layer, the epi layer 14A may be grown using Chemical Vapor Deposition (CVD). However, in some embodiments, epi layer 14A may be grown onto the base layer using any suitable technique. epi layer 14A may be formed of one or more wide bandgap semiconductor materials such as silicon carbide, gallium nitride, diamond, aluminum nitride, and/or boron nitride. Further, as discussed above, epi layer 14A may have a first conductivity type (e.g., n-type) and a low dopant concentration relative to other regions of SiC-CB device 4 (e.g., CB region 34, JTE12, etc.). More specifically, for a SiC-CB device 4A having a single JTE12 (e.g., device layer JTE 12Z), the first epi layer 14A may be less than or equal to 2.0 x 10¹⁵cm^-3(e.g., at 8.0X 10)¹³cm^-3And 1.0X 10¹⁵cm^-3In between) is formed. In embodiments having two or more JTEs 12 (e.g., 4B), first epi layer 14A may be less than or equal to 5.0 x 10¹⁵cm^-3Is formed at the minimum epi doping concentration.

After forming the first epi layer 14A on the base layer, the illustrated process continues to form (process block 204) the CB layer 18 by implanting a region of the first conductivity type into the first epi layer 14A. More specifically, to form CB layer 18, one or more regions having a first conductivity type may be implanted into active region 32A and/or intermediate region 28A within first epi layer 14A to adjust the doping concentration of active region 32A and/or intermediate region 28A to be greater than or equal to 5 x 10¹⁵Per cubic centimeter (cm)^-3) For example 1.0X 10¹⁶cm^-3The doping concentration of (c). Referring to fig. 1, the implant region may form the remaining portion 36 of the CB layer 18. Further, as shown, the implanted region of the first conductivity type (e.g., n-type) may extendThrough the thickness 37A of the first epi layer 14A. Thus, in some embodiments, the region of the first conductivity type may be implanted using a suitable high energy ion implantation technique. Thus, each of the one or more regions may be implanted to a depth greater than 1 μm (e.g., to a depth of 5 μm to 15 μm) within epi layer 14A. Further, each of the one or more regions may be implanted using an implant energy of greater than 500keV and/or less than 50 MeV. Thus, a high-energy implantation mask (e.g., silicon-on-insulator (SOI), polysilicon, thick silicon oxide, high-Z material) may be used in conjunction with high-energy ion implantation. As used herein, "high Z material" refers to a material having an atomic number greater than or equal to 26, such as a metal, including but not limited to iron (Fe), nickel (Ni), molybdenum (Mo)), silver (Ag), platinum (Pt), and the like.

Additionally, to form CB layer 18, a set of CB regions 34 of a second conductivity type (e.g., p-type) are implanted (process block 206) into active region 32A and/or intermediate region 28A. As described above, the doping concentration of each of the set of CB regions 34 may be less than or equal to 1 x 10¹⁸cm^-3And/or greater than or equal to 2 x 10¹⁶cm^-3. More specifically, in some embodiments, because each of the set of CB regions 34 may be implanted with a variable dopant concentration profile, the CB regions 34 may be described as having approximately 2 x 10¹³cm^-2(e.g., +/-20% and/or +/-50%) of the overall charge (e.g., dose). The overall charge may be determined and/or adjusted based in part on the depth of the set of CB regions 34 implants and/or the implant acceleration energy used to implant the set of CB regions 34. Further, the set of CB regions 34 may be implanted according to any suitable means (e.g., high energy implant, low energy implant), as discussed below. For example, in some embodiments, a mask may be formed over at least a portion of epi layer 14A prior to implanting the set of CB regions 34. The mask may be formed of silicon oxide, silicon nitride, polysilicon, silicon, a metal layer, a resist layer, or a suitable combination thereof. Further, the mask may be formed using any suitable means. That is, for example, a mask may be deposited, grown, and/or coated directly onto the portion of epi layer 14A. In addition, once the mask material has been deposited on the epi layer14A, a mask can be formed by patterning (e.g., photolithographically patterning) a mask material to expose or expose a portion of the epi layer 14A. The set of CB regions 34 may then be selectively implanted through the exposed portions of epi layer 14A, and the mask may then be removed.

In some embodiments, the set of CB regions 34 may be implanted using standard low energy implantation techniques. For example, the set of CB regions 34 may be implanted to a depth of less than or equal to 1 μm. Accordingly, each CB region 34 may be implanted using an implant energy of less than 500 keV. However, in some embodiments, the set of CB regions 34 may be implanted in accordance with a suitable high-energy ion implantation technique. Further, each CB region 34 may be implanted using an implant energy greater than 500keV and/or less than 50 MeV. Further, the mask may be a high energy implantation mask (e.g., silicon-on-insulator (SOI), polysilicon, thick silicon oxide, high Z material) used in conjunction with high energy ion implantation.

In some embodiments, after forming CB layer 18, process 200 continues with injecting (process block 208) a floating region having the second conductivity type into termination region 24A of first epi layer 14A to define a junction termination, such as JTE. More specifically, to fabricate the SiC-CB device 4B with at least the first JTE 12A inside the SiC-CB device 4B (e.g., disposed in at least the CB layer 18) and the device layers JTE 12Z adjacent to the surface 42 of the SiC-CB device 4B, as shown in fig. 5, the float zone 68 may be implanted into the termination region 24A of the first epi layer 14A. As further described above, in SiC-CB devices with additional epi layers 14 (e.g., 14B, 14C, etc.), the float zones 68 may be selectively implanted into each epi layer 14, every other epi layer 14, and so on.

The floating regions 68 may be implanted according to any suitable means (e.g., high energy implantation, low energy implantation) as described above with respect to the set of CB regions 34. Thus, in some embodiments, the floating-out regions 68 may then be selectively implanted through portions of the termination region 24A exposed by a mask formed over the termination region 24A, which may then be removed. For example, the float-out regions 68 may be implanted to a depth of less than or equal to 1 μm. Accordingly, each of the float-out regions 68 may be implanted using an implant energy of less than 500 keV. However, in some embodiments, the float-out region 68 may be implanted in accordance with a suitable high-energy ion implantation technique. Thus, for such embodiments, each of the floating zones 68 may be implanted into the epi layer 14A to a depth greater than about 5 μm and/or less than about 15 μm. Further, each of the float-out regions 68 may generally be implanted using an implantation energy of greater than 500keV and/or less than 50 MeV.

Further, in some embodiments, the float zone 68 may be injected simultaneously with the set of CB regions 34. For example, the same material (e.g., Al, B, N, P, etc.) is used and the same dose/energy (e.g., 9.0 x 10) is used during the same ion implantation step used to implant the set of CB regions 34¹²cm^-2) The floating regions 68 of the first JTE 12A may be implanted with the same dopant type (e.g., p-type or n-type dopants), which may reduce fabrication time and cost. In other embodiments, the floating regions 68 of the first JTE12 may use different dopant materials and/or dose/energy implants, which may increase fabrication time and cost, but may enable greater design flexibility (e.g., dopant materials, effective bulk charge, etc.) of the first JTE 12A.

In an embodiment having only device layer JTE 12Z, as shown in fig. 1, process 200 may be performed without implanting floating region 68 into termination region 24A of first epi layer 14A. Nonetheless, a portion of the process 200 (e.g., process block 202, process block 204, process block 206, and/or process block 208) may be repeated one or more times in order to form a suitable number of CB layers 14 in the SiC-CB device 4. Accordingly, after injecting the float-out region 68 and/or in embodiments having only the device layer JTE 12Z, the process 200 may continue to determine (decision block 208) whether to add additional CB layers 18B to the SiC-CB device 4. In embodiments with one or more additional CB layers 18, a second epi layer 14B may be formed on the previously implanted CB layer 18A (process block 202) and a second CB layer 18B may be formed (e.g., process block 204, process block 206). Further, as described above, additional floating zones 68 may optionally be injected (process block 208) to define additional JTEs 12.

After completing fabrication of the one or more CB layers 18, the illustrated process 200 continues to form (process block 212) a device epi layer 14Z having a minimum epi doping concentration of the first conductivity type. As discussed with reference to the formation of one or more epi layers 14 of the CB layer 18 (process block 202), CVD may be used to grow the device epi layer 14Z. Alternatively, the device epi layer 14Z may be grown onto the underlying CB layer 18 using any suitable technique. The device epi layer 14Z may also be formed of one or more wide bandgap semiconductor materials such as silicon carbide, gallium nitride, diamond, aluminum nitride, and/or boron nitride.

Further, the device epi layer 14Z may have a minimum epi doping concentration of the first conductivity type (e.g., n-type). More specifically, for a SiC-CB device 4A having a single JTE12 (e.g., device layer JTE 12Z), the device epi layer 14Z may be formed with a minimum epi doping concentration that is less than or equal to 2.0 x 10¹⁵cm^-3E.g. at 8.0 x 10¹³cm^-3And 1.0X 10¹⁵cm^-3In the meantime. In embodiments having two or more JTEs 12 (e.g., 12A, 12Z), the device epi layer 14Z may be less than or equal to 5.0 x 10¹⁵cm^-3Is formed at the minimum epi doping concentration. Further, in some embodiments, one or more regions of the first conductivity type may be implanted into a first portion (e.g., active region 32Z and intermediate region 28Z) of the device epi layer 14Z to adjust the doping concentration of the first conductivity type in other portions of the device epi layer 14Z to be greater than or equal to 5 x 10¹⁵Per cubic centimeter (cm)^-3) E.g. 1.0X 10¹⁶cm^-3The doping concentration of (c).

Process 200 may then continue to form (process block 214) certain device features within active region 32Z and/or intermediate region 28Z of device epi layer 14Z to define device layer 16. That is, for example, CB bus 38, well region 40, source region 44, etc. may be formed (e.g., implanted) in active region 32Z and/or intermediate region 28Z to define device layer 16. For example, in some embodiments, the CB bus 38 may be implanted into the active zone 32Z and the intermediate zone 28Z using high energy implantation techniques. That is, for example, the CB bus 38 may be implanted with an implant acceleration energy between about 500keV and about 60MeV to achieve a desired depth. In some embodiments, for example, the CB bus 38 may be injected such that it is connected to and electrically coupled with one or more CB regions 34. Further, while process block 212 is described herein as a single step, it is understood that forming the device features (e.g., CB bus 38, well region 40, intermediate well region 66, source region 44, etc.) may include multiple steps, such as a separate implant step for each respective feature and/or multiple implant steps for each feature. In some embodiments, for example, two or more portions of the CB bus 38 may be implanted during different respective steps involved in fabricating the SiC-CB device 4. For example, in a SiC-CB device 4B having a plurality of CB layers 18 (e.g., a first CB layer 18A and a second CB layer 18B), a first portion of the CB bus 38 may be implanted after the second CB layer 18B is formed to connect to and electrically couple with one or more CB regions 34 in the first CB layer 18A. Subsequently, a second portion of the CB bus may be implanted into device layer 16 to connect to and electrically couple with the first portion of CB bus 38 and one or more CB regions 34 in second CB layer 18B and to well region 40 and/or intermediate well region 66. Accordingly, the embodiments described herein are intended to be illustrative and not restrictive.

Further, process 200 may include implanting (process block 216) a floating region having the second conductivity type into termination region 24Z of device epi layer 14Z to define a junction termination, such as device layer JTE 12Z. As described above with reference to process block 206, the floating region 68 may be implanted to a depth (e.g., greater than about 5 μm and/or less than about 15 μm, or less than or equal to 1 μm, respectively) within the termination region 24Z according to any suitable means (e.g., high energy implantation, low energy implantation). Further, in some embodiments, the float-out regions 68 implanted into the termination region 24Z may have the same effective doping profile as the float-out regions 68 implanted into the termination region 24 (e.g., 24A, 24B, etc.) formed in the previous step of the process 200 (e.g., process block 206). However, in other embodiments, the floating-out region 68 implanted into the termination region 24Z may have a different effective doping profile than the floating-out region 68 implanted into other termination regions 24 (e.g., 24A, 24B, etc.). For example, JTE 12Z defined by the floating region 68 implanted into the device termination region 24Z may have a JTE of 1.6×10¹³cm^-2And the JTE 12A defined by the floating region 68 injected into the termination region 24A may have a 9.0 x 10¹²cm^-2As discussed above. Subsequently, other processing steps may be performed to form other features of the SiC-CB device 4 (e.g., the gate electrode 48, the dielectric layer 46, the source contact 54, the drain contact 50, etc.) to form a functional device in accordance with the present disclosure.

The technical effect of the scheme comprises the effective terminal of the SiC-CB device. Additionally, the disclosed terminal design consumes a relatively small portion of die area and is relatively inexpensive to manufacture relative to typical terminal designs. For example, the disclosed Junction Termination Extension (JTE) may be designed to have a width such that the ratio of the JTE width to the one-dimensional (1-D) depletion width is minimized (e.g., less than 5, such as between 1.5 and 5, between 1.5 and 4, between 1.5 and 3, between 1.5 and 2), which results in a device having an increased die area available for the active region. Additionally, the disclosed termination design enables avalanche breakdown to desirably occur primarily in the active and/or intermediate regions of the device, thereby enabling the breakdown voltage to approach the intended breakdown voltage of the device.

This written description uses examples to disclose the invention and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those of ordinary skill in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.

The technology presented and claimed herein is cited and applied to physical objects and embodiments of a matter of practical nature which clearly improve the art and are therefore not abstract, intangible or purely theoretical. Further, if any claim appended to the end of this specification contains one or more elements designated as "means for performing [ function … …" or "step for performing [ function … …"), it is intended that such elements be construed in accordance with 35 u.s.c.112 (f). However, for any claim that contains elements specified in any other way, such elements should not be construed according to 35 u.s.c.112 (f).