阅读说明：本技术 半导体压力传感器及其制造方法 (Semiconductor pressure sensor and method for manufacturing the same ) 是由 吉川英治 于 2019-06-28 设计创作，主要内容包括：本发明提供一种制造稳定性较高的高精度的半导体压力传感器(100)。使第二硅基板(2)经由氧化膜(8)与形成了成为标准压力室(10)的凹部(3)及定位记号(4)的第一硅基板(1)的一个主面(1a)贴合,并使凹部(3)及定位记号(4)在由第二硅基板(2)覆盖的状态下接合。通过红外线传感器检测定位记号(4),利用该定位记号(4)进行定位,在位于凹部(3)的上方的第二硅基板(2)上所形成的隔膜(5)上,形成作为压敏元件部的计量电阻(6)。(The invention provides a high-precision semiconductor pressure sensor (100) with high manufacturing stability. A second silicon substrate (2) is bonded to one main surface (1a) of a first silicon substrate (1) on which a recess (3) and an alignment mark (4) that will become a standard pressure chamber (10) are formed, via an oxide film (8), and the recess (3) and the alignment mark (4) are bonded in a state covered with the second silicon substrate (2). A positioning mark (4) is detected by an infrared sensor, positioning is performed by the positioning mark (4), and a measuring resistor (6) as a pressure sensitive element section is formed on a diaphragm (5) formed on a second silicon substrate (2) located above a recess (3).)

1. A semiconductor pressure sensor, comprising:

a first silicon substrate having a recess and a positioning mark formed as a standard pressure chamber on one main surface thereof;

a second silicon substrate bonded to the one main surface of the first silicon substrate via an oxide film and covering the recess and the positioning mark; and

and a pressure detection unit including a diaphragm formed on the second silicon substrate located above the recess, and a pressure-sensitive element unit formed on the diaphragm.

2. The semiconductor pressure sensor according to claim 1,

the positioning mark is provided on a region spaced from the recess in a region covered with the second silicon substrate on the one main surface of the first silicon substrate.

3. A method of manufacturing a semiconductor pressure sensor, comprising:

forming a recess and a positioning mark to be a standard pressure chamber on one main surface of a first silicon substrate;

bonding the one main surface of the first silicon substrate to a second silicon substrate, and covering the recess and the positioning mark with the second silicon substrate;

forming a diaphragm on the second silicon substrate; and

and a step of detecting the positioning mark with an infrared camera, and forming a pressure-sensitive element portion on the second silicon substrate after positioning with the positioning mark.

4. The method of manufacturing a semiconductor pressure sensor according to claim 3, comprising:

pressure detecting portions including the diaphragm and the pressure-sensitive element portion are arranged in a matrix in one wafer constituting the first silicon substrate, the positioning mark is provided in a scribe line portion located between the adjacent pressure detecting portions,

and cutting the wafer along the dicing line portion to separate each of the pressure detecting portions from the wafer.

Technical Field

The application relates to a semiconductor pressure sensor and a method of manufacturing the same.

Background

As a semiconductor pressure sensor, there is a structure in which a second substrate provided with a pressure detection unit is bonded to a main surface of a first substrate provided with a recess serving as a standard pressure chamber. In a conventional semiconductor pressure sensor, for example, positioning marks for positioning when forming a pressure detection portion are provided on a main surface of a first substrate, and are provided in an exposed state between an outer peripheral end of a second substrate and an outer peripheral end of the first substrate, when viewed in a direction in which the first substrate and the second substrate overlap each other, and the second substrate does not cover the outer peripheral end of the second substrate (see, for example, patent document 1).

Further, in other examples, the following techniques are disclosed: that is, a pressure detection unit such as a recess and a diaphragm that are standard pressure chambers are provided on one substrate, and alignment marks are exposed on the surface of an insulating film on the substrate (see, for example, patent document 2).

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 5639985

Patent document 2: japanese patent No. 4250788

Disclosure of Invention

Technical problem to be solved by the invention

In the conventional technique, when a recess serving as a standard pressure chamber and a recess serving as a positioning mark are provided on the main surface of the first substrate, the positioning mark is exposed without being covered by the second substrate. The alignment mark is a recessed portion that is recessed shallower than the recessed portion of the standard pressure chamber, and foreign matter such as resist applied in the photolithography process may remain in the recessed portion of the alignment mark, and contamination due to the foreign matter may occur in the subsequent process, thereby reducing the manufacturing stability of the product.

Further, since the conventional semiconductor pressure sensor has a structure in which the positioning marks are provided on the outer edge portion of the first substrate not covered with the second substrate, when a plurality of semiconductor pressure sensors are manufactured on the wafer as the first substrate, the outer edge portion of the wafer is provided in the vicinity of the positioning marks, so that the positioning accuracy is excellent, while the central portion of the wafer, which is easily affected by the deformation of the wafer, is provided away from the positioning marks, so that the positioning accuracy tends to deteriorate, and the reliability also deteriorates as the product accuracy decreases.

The present application has been made to solve the above-described problems, and an object of the present application is to provide a semiconductor pressure sensor and a method of manufacturing the same, which have high manufacturing stability and reliability by suppressing contamination due to foreign matter remaining on a positioning mark and improving positioning accuracy.

Technical scheme for solving technical problem

The semiconductor pressure sensor according to the present application includes: a first silicon substrate having a recess and a positioning mark formed as a standard pressure chamber on one main surface thereof; a second silicon substrate bonded to the one main surface of the first silicon substrate via an oxide film and covering the recess and the positioning mark; and a pressure detection unit including a diaphragm formed on the second silicon substrate located above the recess, and a pressure-sensitive element unit formed on the diaphragm.

The method for manufacturing a semiconductor pressure sensor according to the present application includes: forming a recess and a positioning mark to be a standard pressure chamber on one main surface of a first silicon substrate; bonding the one main surface of the first silicon substrate to a second silicon substrate, and covering the recess and the positioning mark with the second silicon substrate; forming a diaphragm on the second silicon substrate; and a step of detecting the positioning mark with an infrared camera, performing positioning with the positioning mark, and forming a pressure sensitive element portion on the second silicon substrate.

Effects of the invention

According to the semiconductor pressure sensor of the present application, since the alignment mark is not exposed by being covered with the second silicon substrate, contamination can be suppressed even if foreign matter remains in the alignment mark. Further, since the positioning mark can be provided at an arbitrary position on the first silicon substrate covered with the second silicon substrate, the positioning mark can be arranged with a wider margin than in the case where the positioning mark is limited to the outer edge portion of the wafer, the positioning accuracy can be improved, and the semiconductor pressure sensor having high manufacturing stability and reliability can be obtained.

Further, according to the method for manufacturing a semiconductor pressure sensor of the present application, even if the positioning mark is covered with the second silicon substrate, the positioning mark can be detected by the infrared sensor and can be positioned by the positioning mark, and therefore, a semiconductor pressure sensor with high manufacturing stability and reliability can be obtained.

Drawings

Fig. 1 is a cross-sectional view showing a state where a semiconductor pressure sensor is formed on a wafer according to embodiment 1.

Fig. 2 is an enlarged cross-sectional view of a main portion showing one semiconductor pressure sensor of fig. 1.

Fig. 3 is a view showing a manufacturing process of the semiconductor pressure sensor, and is a cross-sectional view when the positioning mark is formed.

Fig. 4 is a diagram showing a manufacturing process of the semiconductor pressure sensor, and is a cross-sectional view when a concave portion serving as a standard pressure chamber is formed.

Fig. 5 is a view showing a manufacturing process of the semiconductor pressure sensor, and is a cross-sectional view at the time of oxide film formation.

Fig. 6 is a view showing a manufacturing process of the semiconductor pressure sensor, and is a cross-sectional view when the first silicon substrate and the second silicon substrate are bonded.

Fig. 7 is a diagram showing a manufacturing process of the semiconductor pressure sensor, and is a cross-sectional view at the time of forming the diaphragm.

Fig. 8 is a cross-sectional view showing the semiconductor pressure sensor according to embodiment 2.

Detailed Description

Embodiment 1.

The semiconductor pressure sensor 100 according to embodiment 1 of the present application will be described with reference to fig. 1 to 7. Fig. 1 is a cross-sectional view showing one wafer 101 after a plurality of semiconductor pressure sensors 100 according to embodiment 1 are manufactured, and shows a state before dicing is performed to separate each semiconductor pressure sensor 100 from the wafer 101. Fig. 2 is an enlarged cross-sectional view of a main portion of the semiconductor pressure sensor 100 showing the amount of one chip provided on the wafer 101 of fig. 1. Fig. 3 to 7 are process diagrams showing steps for manufacturing the semiconductor pressure sensor 100 of fig. 2.

As shown in fig. 1, in a stage before dicing, a plurality of semiconductor pressure sensors 100 are formed on a plane of a wafer 101 in the wafer 101, and a first silicon substrate 1 constituting one semiconductor pressure sensor 100 is arranged in a matrix on one plane, and as a whole, is formed in the shape of one wafer 101.

As shown in the cross-sectional structure of the wafer 101 in fig. 1, the mark 4 for forming the pressure detection unit 20 (shown in fig. 2 described later) is not provided on the terrace portion 12 located at the outer edge portion of the wafer 101, and the mark 4 is provided on the region of the one main surface 1a of the first silicon substrate 1 bonded to the second silicon substrate 2.

In addition, in the case where the positioning marks 4 are provided on the outer edge portion of the wafer 101, the number of the positioning marks is minimized, thereby suppressing the foreign matter remaining in the recessed portion shape, i.e., in the positioning marks 4.

As shown in fig. 2, a semiconductor pressure sensor 100 has a structure in which: the first silicon substrate 1 provided with the concave portion 3 and the alignment mark 4 constituting the standard pressure chamber 10 and the second silicon substrate 2 provided with the diaphragm 5 and the measuring resistor 6 are bonded via the oxide film 8. The pressure detection unit 20 is composed of a pressure sensitive element unit such as the reference pressure chamber 10, the diaphragm 5, and the measuring resistor 6.

Here, the recess 3 defines the outer shape of the diaphragm 5 by the shape of the end of the opening thereof, and defines the volume of the standard pressure chamber 10. The depth of the recess 3 is typically set to be in the range of about 50 to 300 μm, and the deeper the depth of the recess 3 dug downward from the one main surface 1a of the first silicon substrate 1, the larger the volume of the standard pressure chamber 10 can be secured, and even if there is a slow leak or the like in the standard pressure chamber 10, there is an advantage that the pressure fluctuation can be reduced and the characteristic fluctuation can be reduced, but on the other hand, the longer the processing time and the lower the yield, and therefore, the recess 3 can be processed by selecting an appropriate value from the typical range. The recess 3 may be formed by Deep Reactive Ion Etching (Deep Reactive Ion Etching) based on bosch process. By the DRIE processing based on the bosch process, the first silicon substrate 1 can be etched at high speed in a manner perpendicular to the one main surface 1a, and a necessary volume of the standard pressure chamber 10 can be secured without increasing the chip size of the semiconductor pressure sensor 100.

As described above, the shape of the diaphragm 5 is defined by the shape of the end portion of the opening of the recess 3 and the size thereof, and therefore, the shape and the size of the recess 3 provided on the one main surface 1a of the first silicon substrate 1 are determined in consideration of the thickness of the diaphragm 5 so as to obtain desired pressure-sensitive characteristics, breakdown voltage resistance, and the like as the semiconductor pressure sensor 100.

For example, when the measurement pressure is about 4 atmospheres, the thickness of the diaphragm 5 may be about 10 to 30 μm and the planar shape of the diaphragm 5 may be a square having one side of about 200 to 500 μm.

Since the reference pressure chamber 10 is a component for holding a pressure that is a reference for pressure measurement, it is desirable to make the interior of the reference pressure chamber 10 as high as possible in a vacuum as an absolute pressure sensor for general use. In order to obtain the standard pressure chamber 10 of high vacuum, for example, the first silicon substrate 1 and the second silicon substrate 2 may be bonded in the high vacuum chamber, and the inside of the standard pressure chamber 10 may be set to high vacuum.

Although fig. 1 and 2 show an example in which the oxide film 8 is provided on the one main surface 1a side of the first silicon substrate 1 and the second silicon substrate 2 are bonded via the oxide film 8, the oxide film 8 may be provided on the bonding surface side of the second silicon substrate 2 without providing the oxide film 8 on the one main surface 1a of the first silicon substrate 1, and the substrates may be bonded to each other. Alternatively, the oxide film 8 may be provided on both the first silicon substrate 1 and the second silicon substrate 2, and then bonded and joined together.

Further, the positioning mark 4 is formed on a region spaced from the recess 3, that is, on a surface region not provided with the recess 3 and not in contact with the recess 3, of a region covered with the second silicon substrate 2 on the one main surface 1a of the first silicon substrate 1. The positioning mark 4 is schematically shown in fig. 2, and a specific shape is not shown, but actually, an appropriate shape, size, and number are provided so as to be recognized by a stepper used for photolithography for forming the measuring resistor 6 and the like. For example, the alignment mark 4 at one position uses an aggregate of minute rectangular patterns obtained by aggregating a plurality of portions as follows: that is, each rectangular pattern has a side of about 1 to 5 μm and a depth of about 1 to 2 μm.

The semiconductor pressure sensor 100 has a structure in which the diaphragm 5 is bent when pressure is applied, and the deformation is detected by the measuring resistor 6. As shown in fig. 2, the metering resistor 6 is formed at a portion substantially along the outer periphery of the diaphragm 5. As a feature of the present application, a plurality of positioning marks 4 are arranged not only at the outer edge portion of the wafer but also at the central portion of the wafer in the surface of the wafer 101, and since positioning can be performed by the positioning marks 4 close to the processing target, the measuring resistor 6 can be formed at a predetermined position of the diaphragm 5 with high accuracy without being affected by the wafer diameter and warpage.

Further, since the alignment marks 4 are completely covered with the second silicon substrate 2 and are not exposed to the outside, even if foreign matter such as resist remains in the recesses constituting the alignment marks 4, the foreign matter does not fly out to the outside and dust can be prevented from flying out in advance.

Next, a method for manufacturing the semiconductor pressure sensor 100 according to the present invention will be described with reference to process diagrams of fig. 3 to 7. In the order of the manufacturing process of the semiconductor pressure sensor, fig. 3 is a sectional view showing the formation of the alignment mark 4, fig. 4 is a sectional view showing the formation of the recess 3 to be the standard pressure chamber 10, fig. 5 is a sectional view showing the formation of the oxide film 8, fig. 6 is a sectional view showing the bonding of the first silicon substrate 1 and the second silicon substrate 2, and fig. 7 is a sectional view showing the formation of the diaphragm 5.

As shown in fig. 3, on one main surface 1a of a first silicon substrate 1 in a wafer state, positioning marks 4 necessary for positioning when forming a recess 3 to be formed in a subsequent step and a pressure sensitive element portion such as a measuring resistor 6 are formed. The positioning mark 4 is provided in a detectable shape determined by a stepper, and the stepper can be used in the photolithography step. As a method for forming the positioning mark 4, for example, one main surface 1a of the first silicon substrate 1 may be etched by a plasma etching apparatus or the like. Here, since the alignment mark 4 can be visually recognized by a stepper, it is not necessary to etch more than necessary, and the depth of the concave portion constituting the alignment mark 4 is sufficient to be about 1 to 2 μm.

Next, as shown in fig. 4, positioning is performed using the positioning marks 4 as a standard, and the concave portion 3 is formed on the one main surface 1a of the first silicon substrate 1. The recess 3 is a standard pressure chamber 10 of a pressure sensor whose interior is kept in a vacuum state in a subsequent step, and the depth of the recess from the one main surface 1a may be arbitrarily set to a range of 50 to 300 μm, for example. The smaller the downward excavation of the recess 3, the smaller the machining load, but the smaller the volume of the standard pressure chamber 10, and therefore the depth of the recess 3 is selected in consideration of a trade-off relationship in which a pressure fluctuation due to a minute leak, that is, an output fluctuation is increased. When the depth is 50 μm or more, the relative undercut size of the concave portion 3 becomes large, and therefore, a DRIE apparatus by bosch process is generally used in the processing. However, similar to the formation of the alignment marks 4, the processing may be performed by a plasma etching apparatus. In addition, wet etching using an alkaline etching solution such as TMAH (tetramethylammonium hydroxide) can be applied, and a dry etching apparatus such as a plasma etching apparatus or a DRIE apparatus is not used.

After the formation of the recess 3 as described above, the first silicon substrate 1 is thermally oxidized to form the oxide film 8 on the front and back surfaces of the wafer 101 as shown in fig. 5. The thickness of the oxide film 8 is preferably about 0.2 to 1 μm. For simplification of description, the oxide film on the back surface 1b side of the first silicon substrate 1, which is not functionally relevant, is not shown.

Next, as shown in fig. 6, the one main surface 1a side of the first silicon substrate 1 on which the concave portion 3 is formed is overlapped with the second silicon substrate 2 prepared in advance, and the first silicon substrate 1 and the second silicon substrate 2 are bonded by performing thermal oxidation in an atmosphere of about 1100 ℃ by evacuation. By bonding the first silicon substrate 1 and the second silicon substrate 2 in this vacuum atmosphere, the standard pressure chamber 10 is hermetically sealed completely.

Next, as shown in fig. 7, the exposed surface of the second silicon substrate 2 is polished by a grinder or the like to be thin. Then, the surface of the second silicon substrate 2 is polished by CMP (Chemical Mechanical polishing) or the like so as to be in a mirror surface state. Thereby, the separator 5 is completed.

Next, the positioning mark 4 is positioned by a stepper, and a pressure-sensitive element portion constituting a pressure detection portion 20 such as a measuring resistor 6 is formed at a predetermined position of the diaphragm 5, thereby obtaining the semiconductor pressure sensor 100 shown in fig. 2. When the pressure sensitive element portion is formed, the positioning marks 4 are completely covered with the second silicon substrate 2, and therefore, neither of the front surface and the back surface thereof is shown. Therefore, in the present application, the positioning mark 4 is detected by an infrared camera. Since infrared rays can pass through the silicon substrate, the alignment marks 4 can be recognized from the second silicon substrate 2 side even when the second silicon substrate 2 is covered with infrared rays. When the measuring resistor 6 is formed, the positioning mark 4 near the processing target region detected by the infrared sensor is used for positioning, and thus processing with high precision can be performed.

Then, the protective film 7 is formed on the surface of the second silicon substrate 2 to protect the pressure detecting portion 20 such as the gauge resistor 6, thereby obtaining the semiconductor pressure sensor 100 shown in fig. 2. Here, as the protective film 7, a nitride film having moisture resistance and a thickness of about 1 μm can be used.

Since the semiconductor pressure sensors 100 of fig. 1 and 2 are in a state before being formed into the wafer 101, they can be processed into individual chips by cutting along the scribe line portions 9 (shown in fig. 8 described later) to have the size of each semiconductor pressure sensor 100.

Here, a case where the positioning mark 4 for positioning is present in the product after cutting in the manufacturing process of the product will be described. The alignment mark 4 is between the first silicon substrate 1 and the second silicon substrate 2, and is not exposed to the outside and sealed and remains in the product, but if the alignment mark 4 is separated from the recess 3 and no leak path is generated, the pressure detection performance is not affected at all.

In the conventional semiconductor pressure sensor, since the positioning mark for realizing the function of the standard position is provided only on the terrace portion on the outer peripheral edge of the wafer, the accuracy of the position of the measuring resistor with respect to the diaphragm becomes lower as the diameter of the wafer increases, and the accuracy of pressure detection of the product itself is lowered. However, by adopting the structure of the semiconductor pressure sensor 100 of the present invention, the area in which the alignment marks 4 can be arranged can be expanded over the entire area of several wafers 101. That is, by configuring to form the alignment marks 4 in the region that is separated from the recess 3 in the region bonded to the second silicon substrate 2 on the one main surface 1a of the first silicon substrate 1, the margin for forming the alignment marks 4 can be significantly increased. As a result, since the positioning mark 4 can be provided in the vicinity of the pressure detection unit 200 to be positioned, even if it is located in the center of the wafer 101, the concave portion 3 can be accurately positioned with respect to the positioning mark 4 and formed with high accuracy, and the measuring resistor 6 can be formed at an appropriate position with respect to the diaphragm 5, so that the accuracy of the finished product and the reliability of pressure measurement as a basic function can be improved.

In addition, the terrace portion 12 of the wafer 101 is originally a portion which is easily coated with a resist used in a photolithography process to be thick in view of its position and structure. Therefore, the resist tends to remain inside the positioning marks 4 provided on the terrace portion 12, which causes contamination of the manufacturing apparatus in the subsequent process. However, in the present invention, since the positioning marks 4 can be provided inside the wafer 101, the number of the positioning marks 4 provided at the outer edge portion of the wafer 101 can be reduced or set to 0, contamination by foreign matters remaining in the recesses of the positioning marks 4 can be suppressed, and manufacturing stability can be improved.

Thus, in the present invention, the arrangement of the alignment marks 4 is corrected, and the alignment marks 4 can be arranged in the region other than the recess 3 of the first silicon substrate 1 covered with the second silicon substrate 2, so that the alignment marks 4 can be mainly provided inside the wafer 101, thereby increasing the margin for forming the alignment marks 4. Therefore, the positioning marks 4 can be formed at appropriate positions with respect to all the semiconductor pressure sensors 100 on the wafer 101, positioning with high accuracy can be performed, and the accuracy of the semiconductor pressure sensors 100 when themselves are completed can be improved, so that high reliability can be obtained.

Embodiment 2.

Next, the semiconductor pressure sensor 100 according to embodiment 2 of the present application will be described with reference to fig. 8.

As described in embodiment 1 above, since the alignment mark 4 is formed in the region where the first main surface 1a of the first silicon substrate 1 is bonded to the second silicon substrate 2, the alignment mark 4 is completely covered with the second silicon substrate 2. However, the shallow recesses constituting the positioning marks 4 remain as minute voids in the bonding interface between the substrates. Since the alignment mark 4 is actually an aggregate of a plurality of minute patterns, there is a risk that the minute patterns communicate with each other, and there is a risk that a leak path is generated between the standard pressure chamber 10 and the outside depending on the arrangement of the alignment mark 4.

Therefore, embodiment 2 describes the following case: that is, the alignment marks 4 are selectively arranged on the scribe line portions 9 of the first silicon substrate 1 (wafer 101), and the alignment marks 4 are cut by dicing the wafer 101 to separate chips.

As shown in fig. 8, for example, the positioning mark 4 is provided in a scribe line portion located at an intermediate position between two adjacent pressure detecting portions 20 between the pressure detecting portions 20 arranged in a matrix in one wafer 101, and the positioning mark 4 remains in the scribe line portion 9 at a stage when the semiconductor pressure sensor 100 is completed on the wafer 101. In the case where the scribe line portions 9 are cut by dicing to singulate the chip, the positioning marks 4 can be eliminated from the completed chip. Alternatively, even when all the positioning marks 4 cannot be removed, the number of the positioning marks 4 can be greatly reduced by cutting out the scribe line portion 9.

By providing the positioning marks 4 on the scribe line portions 9, unevenness can be eliminated from the bonding interface between the first silicon substrate 1 and the second silicon substrate 2 in a product after being formed into a chip, and therefore, the bonding strength is improved, and the reliability of the product can be improved. Further, since the alignment mark 4 is eliminated in the chip, the risk of forming a leak path is greatly reduced, and the effect of improving the reliability of the airtightness can be obtained. Thus, the risk of the positioning mark 4 remaining in the product can be greatly reduced by the semiconductor pressure sensor 100 of embodiment 2.

While various exemplary embodiments and examples are described herein, the various features, aspects, and functions described in one or more embodiments are not limited in their application to a particular embodiment, but may be applied to embodiments alone or in various combinations.

Therefore, it is considered that numerous modifications not illustrated are also included in the technical scope disclosed in the present specification. For example, the present invention includes a case where at least one of the components is modified, added, or omitted, and a case where at least one of the components is extracted and combined with the components of the other embodiments.

Description of the reference symbols

1a first silicon substrate, 1a one main surface, 1b back surface, 2 a second silicon substrate, 3 recesses, 4 alignment marks, 5 diaphragms, 6 gauge resistors, 7 protective films, 8 oxide films, 9 scribe line portions, 10 standard pressure chambers, 12 terrace portions, 20 pressure detecting portions, 100 semiconductor pressure sensors, 101 wafers.