阅读说明：本技术 架桥剂、组合物、母料、封装胶膜及电子元器件 (Bridging agent, composition, master batch, packaging adhesive film and electronic component ) 是由 唐国栋 李伯耿 周光大 侯宏兵 梅云宵 魏梦娟 于 2021-08-26 设计创作，主要内容包括：本发明提供了一种架桥剂、组合物、母料、封装胶膜及电子元器件。该架桥剂具有以下结构通式的环状结构：R～(1)-xR～(2)-y[CH-3SiO]-n,其中,n为偶数且4≤n≤10；R～(1)和R～(2)均连接在Si原子,且R～(1)为带有末端双键的基团；R～(2)为碳原子数为4至14的直链烷基或支链烷基；x为大于1且小于n的偶数,且x+y等于n；R～(1)之间两两对位存在,R～(2)之间两两对位存在,两两对位的R～(1)相同,两两对位的R～(2)相同,不存在对位关系的R～(1)相同或不同,不存在对位关系的R～(2)相同或不同。本申请的架桥剂降低了其在聚烯烃树脂中的迁移几率,从而提高了聚烯烃树脂的耐蠕变性,进而延长了电子元器件的寿命。(The invention provides a bridging agent, a composition, a master batch, a packaging adhesive film and an electronic component. The bridging agent has a cyclic structure of the following structural general formula: r 1 x R 2 y [CH 3 SiO] n Wherein n is an even number and n is more than or equal to 4 and less than or equal to 10; r 1 And R 2 Are all bonded to a Si atom, and R 1 Is a group with a terminal double bond; r 2 Is a straight chain alkyl or branched alkyl group having 4 to 14 carbon atoms;x is an even number greater than 1 and less than n, and x + y is equal to n; r 1 Are in pairwise alignment between R 2 In pairs, R in pairs 1 Same, pairwise aligned R 2 Same, R having no para-relation 1 R, identical or different, not in para relationship 2 The same or different. The bridging agent reduces the migration probability of the bridging agent in polyolefin resin, thereby improving the creep resistance of the polyolefin resin and further prolonging the service life of electronic components.)

1. A bridging agent, characterized in that the bridging agent has a cyclic structure of the following general structural formula: r¹ _xR² _y[CH₃SiO]_nWherein n is an even number and n is more than or equal to 4 and less than or equal to 10; r¹And R²Are all bonded to a Si atom, and said R¹Is a group with a terminal double bond; the R is²Is a straight chain alkyl or branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than n, and x + y is equal to n; the R is¹In pairwise alignment between R and R²In pairwise alignment, R in pairwise alignment¹Same, pairwise aligned R²Same, said R having no para-relation¹The same or different R's having no para-relationship²The same or different.

2. The bridging agent of claim 1, wherein R is¹Is C₂~C₁₀The group having a terminal double bond of (A), the group R²Is C₄~C₁₄Straight chain alkyl or C₄~C₁₄Branched alkyl groups of (a).

3. The bridging agent of claim 1 wherein n is an even number and 4. ltoreq. n.ltoreq.8.

4. The bridging agent of claim 1, wherein R is¹Is selected fromAny one of alkenyl, methacryloxypropyl and allyl.

5. The bridging agent of any one of claims 1 to 4 wherein R is²Is C₈~C₁₄Straight chain alkyl or C₈~C₁₄The branched alkyl of (1), the R²Is selected from any one of octyl, nonyl, decyl, isooctyl, isononyl and isodecyl.

6. A composition, comprising, in parts by weight: 100 parts by weight of a nonpolar polyolefin resin and 0.1 to 3 parts by weight of a bridging agent, wherein the bridging agent is the bridging agent according to any one of claims 1 to 5.

7. The composition of claim 6, wherein the non-polar polyolefin resin is selected from any one or more of low density polyethylene and ethylene-alpha olefin copolymer, and the ethylene-alpha olefin copolymer is selected from any one or more of linear low density polyethylene, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-pentene copolymer, ethylene-hexene copolymer and ethylene-octene copolymer.

8. A masterbatch comprising a composition, characterized in that said composition is a composition according to claim 6 or 7.

9. An encapsulating film obtained by mixing and melt-extruding the components of the composition, wherein the composition is the composition of claim 6 or 7.

10. An electronic component, the electronic component includes any one of a solar cell, a liquid crystal panel, an electroluminescent device, a plasma display device, and a touch screen, wherein at least one surface of the electronic component is in contact with an encapsulation adhesive film, and the encapsulation adhesive film is the encapsulation adhesive film according to claim 9.

Technical Field

The invention relates to the technical field of photoelectricity, in particular to a bridging agent, a composition, a master batch, a packaging adhesive film and an electronic component.

Background

Polyolefin materials such as ethylene-octene copolymers synthesized by catalysis of metallocene catalysts are widely used as packaging materials for efficient electronic components such as double-sided PERC battery packs, N-type battery packs and dual-glass packs due to good insulating property, water resistance, PID resistance and acidification corrosion-free property. Specifically, the packaging material can play a role in mounting, fixing, sealing and protecting the chip, so that the chip is isolated from the outside, and the performance of the electric appliance is prevented from being reduced due to the corrosion of impurities in the air to the chip. However, the conventional encapsulating material is low in heat resistance and tensile resistance, so that the electronic component is easy to lose efficacy under the energy of heat, light, radiation and the like during encapsulation, and along with the extension of the working time of the electronic component, the heat and deformation released by the long-time working of the electronic component further cause the deformation and deterioration of the encapsulating material, so that the service life of the electronic component is finally shortened.

Disclosure of Invention

The invention mainly aims to provide a bridging agent, a composition, a master batch, a packaging adhesive film and an electronic component, so as to solve the problem that the service life of the electronic component is shortened due to lower heat resistance and tensile resistance of a packaging material in the prior art.

In order to achieve the above object, according to one aspect of the present invention, there is provided a bridging agent having a cyclic structure of the following general structural formula: r¹ _xR² _y[CH₃SiO]_nWherein n is an even numberN is more than or equal to 4 and less than or equal to 10; r¹And R²Are all bonded to a Si atom, and R¹Is a group with a terminal double bond; r²Is a straight chain alkyl or branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than n, and x + y is equal to n; r¹Are in pairwise alignment between R²In pairs, R in pairs¹Same, pairwise aligned R²Same, R having no para-relation¹R, identical or different, not in para relationship²The same or different.

Further, the above R¹Is C₂~C₁₀With a terminal double bond, R²Is C₄~C₁₄Straight chain alkyl or C₄~C₁₄Branched alkyl groups of (a).

Further, n is an even number and 4. ltoreq. n.ltoreq.8.

Further, the above R¹Any one selected from vinyl, methacryloxypropyl and allyl.

Further, the above R²Is C₈~C₁₄Straight chain alkyl or C₈~C₁₄Branched alkyl of R²Is selected from any one of octyl, nonyl, decyl, isooctyl, isononyl and isodecyl.

According to another aspect of the present invention, there is provided a composition comprising, in parts by weight: 100 parts by weight of non-polar polyolefin resin and 0.1-3 parts by weight of bridging agent, wherein the bridging agent is the bridging agent.

Further, the non-polar polyolefin resin is selected from any one or more of low density polyethylene and ethylene-alpha olefin copolymer, and the ethylene-alpha olefin copolymer is selected from any one or more of linear low density polyethylene, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-pentene copolymer, ethylene-hexene copolymer and ethylene-octene copolymer.

According to another aspect of the present invention, there is provided a masterbatch comprising a composition as described above.

According to another aspect of the present invention, there is provided an encapsulating film obtained by mixing and melt-extruding the components of the composition, wherein the composition is the composition described above.

According to another aspect of the present invention, an electronic component is provided, where the electronic component includes any one of a solar cell, a liquid crystal panel, an electroluminescent device, a plasma display device, and a touch screen, at least one surface of the electronic component is in contact with a packaging adhesive film, and the packaging adhesive film is the above-mentioned packaging adhesive film.

Polyolefin resin materials generally need to be chemically crosslinked in the presence of a bridging agent, so as to ensure the heat resistance and tensile resistance of the packaging material. By applying the technical scheme of the invention, the bridging agent is a cyclic silane compound with a similar centrosymmetric structure, on one hand, the centers of positive and negative charges of the cyclic silane compound coincide, so that the bridging agent is a non-polar molecular compound, and the compatibility of the bridging agent and non-polar polyolefin resin is improved according to the principle of similarity compatibility. In another aspect, R of the long carbon chain substituent²The substituent increases physical entanglement with the molecular chain of the polyolefin resin, so that the compatibility with the polyolefin resin is further improved. Thus, the migration problem of the bridging agent is greatly reduced by the two factors. Meanwhile, R in the bridging agent molecule¹The terminal double bond provided by the substituent group is used as a chemical crosslinking point and can be chemically bonded with a polyolefin resin molecular chain under the initiation action of heat, light, irradiation and the like, so that a larger crosslinking structure is formed, the creep resistance of the polyolefin resin is further improved, and the service life of electronic components is further prolonged.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.

As analyzed by the background art, the problem that the service life of an electronic component is shortened due to the fact that the heat resistance and tensile resistance of a packaging material are low exists in the prior art, and in order to solve the problem, the invention provides a bridging agent, a composition, a master batch, a packaging adhesive film and the electronic component.

In one exemplary embodiment of the present application, a bridging agent is provided, the bridging agent having a cyclic structure of the general structural formula: r¹ _xR² _y[CH₃SiO]_nWherein n is an even number and n is more than or equal to 4 and less than or equal to 10; r¹And R²Are all bonded to a Si atom, and R¹Is a group with a terminal double bond; r²Is a straight chain alkyl or branched alkyl group having 4 to 14 carbon atoms; x is an even number greater than 1 and less than n, and x + y is equal to n; r¹Are in pairwise alignment between R²Two by two exist in contraposition.

Polyolefin resin materials generally need to be chemically crosslinked in the presence of a bridging agent, so as to ensure the heat resistance and tensile resistance of the packaging material. The bridging agent is a cyclic silane compound with a similar centrosymmetric structure, and on one hand, the positive and negative charge centers of the cyclic silane compound are superposed, so that the bridging agent is a non-polar molecular compound, and the compatibility of the bridging agent and non-polar polyolefin resin is improved according to the principle of similar compatibility. In another aspect, R of the long carbon chain substituent²The substituent increases physical entanglement with the molecular chain of the polyolefin resin, so that the compatibility with the polyolefin resin is further improved. Thus, the migration problem of the bridging agent is greatly reduced by the two factors. Meanwhile, R in the bridging agent molecule¹The terminal double bond provided by the substituent group is used as a chemical crosslinking point and can be chemically bonded with a polyolefin resin molecular chain under the initiation action of heat, light, irradiation and the like, so that a larger crosslinking structure is formed, the creep resistance of the polyolefin resin is further improved, and the service life of electronic components is further prolonged.

In one embodiment of the present application, R¹Is C₂~C₁₀With a terminal double bond, R²Is C₄~C₁₄Straight chain alkyl or C₄~C₁₄Branched alkyl groups of (a).

Preferably R¹Is C₂~C₁₀The group with terminal double bond is more beneficial to improving the polymerization efficiency and effect of the bridging agent molecule and the polyolefin resin, C₄~C₁₄Straight chain alkyl or C₄~C₁₄The branched alkyl is more favorable for increasing the physical entanglement degree of the branched alkyl with the molecular chain of the polyolefin resin, so that the compatibility of the branched alkyl with the polyolefin resin is further improved.

In one embodiment of the present application, n is an even number and 4. ltoreq. n.ltoreq.8.

The larger n is, the larger the cyclic skeleton of the crosslinking agent molecule is, and in order to reduce the large skeleton of the crosslinking agent molecule as much as possible, the compatibility thereof in the polyolefin resin is deteriorated, preferably 4. ltoreq. n.ltoreq.8, further preferably n is 4 or 6, further more preferably n is 4.

In order to further enhance the efficiency of polymerization of the bridging agent molecules with the polyolefin resin molecular chains, R is preferably selected¹Any one selected from vinyl, methacryloxypropyl and allyl.

Preferably R²Is C₈~C₁₄Straight chain alkyl or C₈~C₁₄Branched alkyl of R²Any one of octyl, nonyl, decyl, isooctyl, isononyl and isodecyl is selected, which is more favorable for improving the compatibility of the bridging agent and the polyolefin resin.

In another exemplary embodiment of the present application, there is provided a composition comprising, in parts by weight: 100 parts by weight of non-polar polyolefin resin and 0.1-3 parts by weight of bridging agent, wherein the bridging agent is the bridging agent.

The bridging agent is a cyclic silane compound with a similar centrosymmetric structure, and on one hand, the positive and negative charge centers of the cyclic silane compound are superposed, so that the bridging agent is a non-polar molecular compound, and the compatibility of the bridging agent and non-polar polyolefin resin is improved according to the principle of similar compatibility. In another aspect, R of the long carbon chain substituent²The substituent increases physical entanglement with the molecular chain of the polyolefin resin, so that the compatibility with the polyolefin resin is further improved. Thus, the migration problem of the bridging agent is greatly reduced by the two factors. Meanwhile, R in the bridging agent molecule¹The terminal double bond provided by the substituent is used as a chemical crosslinking point and can be initiated under heat, light, irradiation and the likeUnder the action of the composite, the composite is polymerized with polyolefin resin molecular chains to form a larger crosslinking structure, so that the creep resistance of the polyolefin resin is improved, and the service life of an electronic component can be prolonged by using the packaging material obtained by the composite.

Of course, those skilled in the art may also add additives such as a tackifying assistant, an ultraviolet light stabilizer, an ultraviolet light absorber, an antioxidant, a coloring agent, and an inorganic filler to the composition according to actual needs, and may further include a compound capable of decomposing to generate a hydrogen abstraction-type radical in the composition, thereby further improving the crosslinking effect between the bridging agent molecules and the polyolefin resin molecules, which is not described herein again.

In order to further improve the non-polar polyolefin resin having better compatibility with the bridging agent, the non-polar polyolefin resin is preferably selected from one or more of low density polyethylene and ethylene-alpha olefin copolymer, and the ethylene-alpha olefin copolymer is preferably selected from one or more of linear low density polyethylene, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-pentene copolymer, ethylene-hexene copolymer and ethylene-octene copolymer.

In another exemplary embodiment of the present application, there is provided a masterbatch comprising a composition as described above.

The master batch obtained by adopting the composition has more uniform and stable composition, and has excellent performance and longer service life in subsequent use.

In another exemplary embodiment of the present application, there is provided an adhesive packaging film obtained by mixing and melt-extruding the components of the composition, wherein the composition is the composition described above.

The packaging film may be a single-layer type film or a multi-layer type film. In the case of a multi-layer type adhesive film, at least one layer comprises the composition provided by the present invention.

The packaging adhesive film obtained by the composition has excellent packaging effect.

In another exemplary embodiment of the present application, an electronic component is provided, where the electronic component includes any one of a solar cell, a liquid crystal panel, an electroluminescent device, a plasma display device, and a touch panel, at least one surface of the electronic component is in contact with an encapsulating adhesive film, and the encapsulating adhesive film is the encapsulating adhesive film described above.

The packaging adhesive film is used for fixing, packaging and protecting electronic components, so that the influence of external factors on the electronic components can be reduced as much as possible, and the service life of the electronic components is prolonged.

The advantageous effects of the present application will be described below with reference to specific examples and comparative examples.

The preparation methods of the bridging agents related to the following examples and comparative examples can refer to the synthesis steps of the bridging agent A:

0.1 mol of methylvinyldimethoxysilane and 0.1 mol of octylmethyldimethoxysilane were poured into a 250mL round-bottomed flask, and 0.2 mol of a hydrochloric acid solution having a pH of 5 was added. The reaction was stirred in a 50 ℃ oil bath for 5 hours to give a clear solution. After removing the by-product methanol by a rotary evaporator, 5 g of anhydrous magnesium sulfate was added, dried for 24 hours, and filtered to obtain a clear liquid. Finally, the mixture is separated and purified by a silica gel column bonded with carbon 18. The fluidity is methanol, and the final component of the outflow is the bridging agent A.

The GC-MS gas chromatograph-mass spectrometer is used for detection, and specific parameters are shown in the table 1.

A bridging agent A: the peak position on GC-MS was 18.4 minutes, and the molecular weight was 516.29.

And (3) a bridging agent B: wherein R is₃Is octyl; the peak position on GC-MS was 21.5 minutes, and the molecular weight was 688.33.

And (3) a bridging agent C: wherein R is₄Is octyl, R₅Is decyl; the peak position on GC-MS was 24.7 minutes, and the molecular weight was 1088.65.

A bridging agent D: wherein R is₆、R₈Is octyl, R₇Is decyl; the peak position on GC-MS was 29.2 minutes, and the molecular weight was 1418.89.

A bridging agent E:

a bridging agent: TAIC.

Example 1

100 parts by weight of ethylene-octene copolymer (DOW Engage PV 8669) and 1 part by weight of bridging agent A, R¹ ₂R² ₂[CH₃SiO]₄(wherein R is¹Is vinyl, R²Octyl) were mixed in a planetary mixer until the crosslinking agent was completely absorbed into the ethylene-octene copolymer particles, and the surface of the particles was dried. The dried particles were dried using a plate with an aspect ratio of 32: 1, plasticizing and extruding by a single-screw extruder with the screw diameter of 150mm, wherein the temperature of a screw sleeve is 60-90 ℃. And then, forming a film and casting through a T-shaped die head, extruding the film through an embossing roller and a rubber roller to form a specific texture structure on the surface, cooling the film to room temperature through a cooling roller, and rolling to obtain a packaging adhesive film with the thickness of 0.6 mm.

Example 2

Example 2 differs from example 1 in that,

R¹is methacryloxypropyl, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

Example 3

Example 3 differs from example 1 in that,

R¹is allyl, and finally obtains a packaging adhesive film with the thickness of 0.6 mm.

Example 4

Example 4 differs from example 1 in that,

R²is decyl, and finally obtains a packaging adhesive film with the thickness of 0.6 mm.

Example 5

Example 5 differs from example 1 in that,

R²is butyl, and finally obtains a packaging adhesive film with the thickness of 0.6 mm.

Example 6

Example 6 differs from example 1 in that,

3 parts of bridging agent A by weight, and finally obtaining a packaging adhesive film with the thickness of 0.6 mm.

Example 7

Example 7 differs from example 1 in that,

the bridging agent A accounts for 0.1 part by weight, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

Example 8

Example 8 differs from example 1 in that,

and replacing ethylene-octene copolymer with low-density polyethylene to finally obtain a packaging adhesive film with the thickness of 0.6 mm.

Example 9

Example 9 differs from example 1 in that,

and replacing the ethylene-octene copolymer with the ethylene-butene copolymer to finally obtain the packaging adhesive film with the thickness of 0.6 mm.

Example 10

Example 10 differs from example 1 in that the bridging agent was bridging agent B, and finally a packaging adhesive film with a thickness of 0.6mm was obtained.

Example 11

Example 11 is different from example 1 in that the bridging agent is bridging agent C, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

Example 12

Example 12 is different from example 1 in that the bridging agent is bridging agent D, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

Example 13

100 parts by weight of ethylene-octene copolymer (DOW Engage PV 8669) and 1 part by weight of bridging agent A, R¹ ₂R² ₂[CH₃SiO]₄(wherein R is¹Is vinyl, R²Octyl group), 0.5 part by weight of t-butyl peroxy-2-ethylhexyl carbonate (TBEC), and the three were mixed in a planetary mixer until the crosslinking agent was completely absorbed into the ethylene-octene copolymer particles, and the surfaces of the particles were dried. Plasticizing and extruding the dried particles by using a single-screw extruder with the length-diameter ratio of 32 and the screw diameter of 150mm, wherein the temperature of a screw sleeve is 60-90 ℃. And then, forming a film and casting through a T-shaped die head, extruding the film through an embossing roller and a rubber roller to form a specific texture structure on the surface, cooling the film to room temperature through a cooling roller, and rolling to obtain a packaging adhesive film with the thickness of 0.6 mm.

Example 14

100 parts by weight of ethylene-octene copolymer (DOW Engage PV 8669) and 1 part by weight of bridging agent A, R¹ ₂R² ₂[CH₃SiO]₄(wherein R is¹Is vinyl, R²Octyl group), 0.5 part by weight of benzophenone, and mixing the three substances in a planetary mixer until the crosslinking agent is completely absorbed into the ethylene-octene copolymer particles, and drying the surface of the particles. Plasticizing and extruding the dried particles by using a single-screw extruder with the length-diameter ratio of 32 and the screw diameter of 150mm, wherein the temperature of a screw sleeve is 60-90 ℃. And then, forming a film and casting through a T-shaped die head, extruding the film through an embossing roller and a rubber roller to form a specific texture structure on the surface, cooling the film to room temperature through a cooling roller, and rolling to obtain a packaging adhesive film with the thickness of 0.6 mm.

Comparative example 1

Comparative example 1 is different from example 1 in that,

0.01 part by weight of bridging agent A to finally obtain a packaging adhesive film with the thickness of 0.6 mm.

Comparative example 2

Comparative example 2 is different from example 1 in that,

the bridging agent A accounts for 4 parts by weight, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

Comparative example 3

Comparative example 3 is different from example 1 in that,

the bridging agent is TAIC, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

Comparative example 4

Comparative example 4 is different from example 1 in that,

the bridging agent is a bridging agent E, and finally the packaging adhesive film with the thickness of 0.6mm is obtained.

(1) And (3) testing the crosslinking degree and the tensile strength:

the packaging adhesive films obtained in examples 1 to 12 and comparative examples 1 to 4 were irradiated with high-energy electron beams, respectively, at an irradiation dose of 40 KGy. The adhesive film of example 13 was laminated for 18 minutes in a laminator at 150 ℃. The packaging adhesive film of example 14 was irradiated with an ultraviolet lamp having a center wavelength of 365nm at an irradiation dose of 5000mJ/cm². Respectively weighing 1g of packaging adhesive film subjected to electron beam irradiation, or packaging adhesive film subjected to high-temperature lamination, or packaging adhesive film subjected to ultraviolet irradiation, performing Soxhlet extraction for 5 hours by using boiling dimethylbenzene, then filtering by using a 30-mesh stainless steel filter screen, then placing in a vacuum drying oven at 145 ℃ for 3 hours, performing reduced pressure drying, and finally calculating the weight of residues on the screen as A (g) and calculating the crosslinking degree by using the following formula. Degree of crosslinking (% by weight) = a × 100%.

And (3) removing the surface texture of the irradiated packaging adhesive film by using a laminating machine, then stamping by using a standard die to obtain a dumbbell-shaped standard sample strip with the thickness of 0.6mm, and testing according to the ASTM D638-8 standard to obtain the tensile strength of the packaging adhesive film, wherein the unit is MPa.

(2) Absorption capacity of auxiliary

The bridging agents A to E, TAIC were prepared into 50mL of 70% methanol solutions for later use. 1g of ethylene-octene copolymer particles (DOW engage PerPV 8669) were weighed into stainless steel cages, which were then immersed in the previously described methanol solution and the particles were allowed to completely submerge into the solution. The whole soaking process was continued for 4 hours with ambient temperature being maintained at 25 ℃. After the soaking, the polymer particles were taken out, the surface liquid was wiped off with a paper towel, and the weight was weighed to obtain a value B (g), i.e., the absorption capacity of the auxiliary agent = (B-1) × 100%.

The tensile strengths of the adhesive sealant films obtained in examples 1 to 14 and comparative examples 1 to 4 are shown in Table 2.

The auxiliary absorption capacities of the bridging agents A to E, TAIC are shown in Table 3.

The data in table 3 above show that the compatibility of the bridging agent of the present application with polyolefin resins is significantly better than the compatibility of the prior art bridging agent E, TAIC with polyolefin resins.

From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:

polyolefin resin materials generally need to be chemically crosslinked in the presence of a bridging agent, so as to ensure the heat resistance and tensile resistance of the packaging material. The bridging agent is a cyclic silane compound with a similar centrosymmetric structure, and on one hand, the positive and negative charge centers of the cyclic silane compound are superposed, so that the bridging agent is a non-polar molecular compound, and the compatibility of the bridging agent and non-polar polyolefin resin is improved according to the principle of similar compatibility. In another aspect, R of the long carbon chain substituent²The substituent increases physical entanglement with the molecular chain of the polyolefin resin, so that the compatibility with the polyolefin resin is further improved. Thus, the migration problem of the bridging agent is greatly reduced by the two factors. Meanwhile, R in the bridging agent molecule¹The terminal double bond provided by the substituent group is used as a chemical crosslinking point and can be polymerized under the initiation action of heat, light, radiation and the likeThe molecular chain of the olefin resin is chemically bonded, so that a larger cross-linking structure is formed, the creep resistance of the polyolefin resin is further improved, and the service life of electronic components is further prolonged.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.