阅读说明：本技术 电子部件及其制造方法 (Electronic component and method for manufacturing the same ) 是由 及川彰 北西真一路 于 2020-03-09 设计创作，主要内容包括：在电子部件中,电子元件具有第一表面。绝缘的环绕部件具有第二表面,从第二表面露出第一表面,且与电子元件的周边紧密接触。布线基板与由第一表面和第二表面构成的第三表面相对。绝缘的接合部件插入至第三表面和布线基板之间以将两者接合。导电的凸块位于第三表面与布线基板之间,将电子元件和布线基板电连接。接合部件具有从第三表面侧贯通至布线基板侧且容纳凸块的通孔。在俯视透视时,通孔的至少一部分与第二表面重叠。(In an electronic component, an electronic element has a first surface. The insulating surrounding part is provided with a second surface, the first surface is exposed from the second surface, and the insulating surrounding part is tightly contacted with the periphery of the electronic element. The wiring substrate is opposed to a third surface constituted by the first surface and the second surface. An insulating bonding member is interposed between the third surface and the wiring substrate to bond the two. The conductive bump is located between the third surface and the wiring substrate, and electrically connects the electronic element and the wiring substrate. The bonding member has a through hole penetrating from the third surface side to the wiring substrate side and accommodating the bump. At least a portion of the through hole overlaps the second surface in a perspective top view.)

1. An electronic component, comprising:

an electronic component having a first surface;

an insulating surrounding member having a second surface from which the first surface is exposed and which is in close contact with the periphery of the electronic element;

a wiring substrate opposed to a third surface constituted by the first surface and the second surface;

an insulating bonding member interposed between the third surface and the wiring substrate to bond the both;

a conductive bump located between the third surface and the wiring substrate, electrically connecting the electronic element and the wiring substrate;

the bonding member includes a through hole penetrating from the third surface side to the wiring substrate side and accommodating the bump;

at least a portion of the through-hole overlaps the second surface in a top perspective view.

2. The electronic component of claim 1, at least a portion of the bump overlapping the second surface in a top perspective view.

3. The electronic component according to claim 1 or 2, the first surface being provided with a vibration region that vibrates in response to an electric signal input to the electronic element, the through hole overlapping with the vibration region in a perspective top view.

4. The electronic component according to any one of claims 1 to 3, the surrounding component covering a side surface of the electronic element over an entire circumference of the electronic element and covering a surface of the electronic element on a side opposite to the first surface.

5. The electronic component according to any one of claims 1 to 4, comprising: more than two electronic components which are closely contacted with the same surrounding part, and a conductor pattern which is at least partially positioned on the second surface and is connected with the more than two electronic components.

6. The electronic component according to any one of claims 1 to 5, the joining component comprising: a resin and a plurality of glass frits mixed in the resin.

7. The electronic component according to any one of claims 1 to 6, wherein the wiring substrate has an external terminal electrically connected to the electronic element in a region overlapping with the third surface in a perspective view in a plan view, on a surface on a side opposite to the third surface.

8. A method of manufacturing an electronic component, comprising:

a configuration step of closely contacting the first surface of the electronic element on the support body;

a forming step of supplying an insulating material around the electronic component on the support body and curing to form a surrounding part;

a removing step of removing the support body from the first surface and a second surface of the surrounding member where the first surface is exposed;

a bonding step of disposing an insulating material as a bonding member between a third surface constituted by the first surface and the second surface and a wiring substrate to bond the third surface and the wiring substrate, and disposing a conductive bump between the third surface and the wiring substrate to electrically connect the electronic component and the wiring substrate;

in the bonding step, a through hole that penetrates the material as the bonding member from the third surface side to the wiring substrate side and accommodates the bump is formed in the material as the bonding member;

at least a portion of the through-hole overlaps the second surface in a top perspective view.

9. The method for manufacturing an electronic component according to claim 8, wherein a material of the joining member is a sheet in an uncured state.

Technical Field

The present disclosure relates to an electronic component such as a SAW (surface acoustic wave) device and a manufacturing method thereof.

Background

There is known an electronic component including: an electronic component and a wiring substrate on which the electronic component is mounted face down (for example, patent documents 1 and 2). The wiring substrate has an external terminal located on the opposite side of the surface on which the electronic component is mounted, and input/output to/from the electronic component is performed via the external terminal. The electronic component and the wiring substrate are electrically connected to each other by, for example, conductive bumps interposed therebetween. The electronic component of patent document 1 has a sealing member made of a conductive adhesive between an electronic element and a wiring board. The electronic component of patent document 2 has a resin that covers the upper surface of the wiring substrate from above the electronic element and seals the electronic element.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2001-94390

Patent document 2: international publication No. 2013/039149

Disclosure of Invention

An electronic component of an aspect of the present disclosure includes: an electronic component, an insulating surrounding member, a wiring substrate, an insulating joining member, and a conductive bump. The electronic component has a first surface. The surrounding part is provided with a second surface which is tightly contacted with the periphery of the electronic element, so that the first surface is exposed from the second surface. The wiring substrate faces a third surface formed by the first surface and the second surface. The joining member is located between the third surface and the wiring substrate to join the two. The bump is located between the third surface and the wiring substrate and electrically connects the electronic element and the wiring substrate. The bonding member has a through hole penetrating from the third surface side to the wiring substrate side and accommodating the bump. At least a portion of the through-hole overlaps the second surface in a top perspective view.

A method of manufacturing an electronic component of one aspect of the present disclosure includes: an arranging step of bringing a first surface of the electronic component into close contact with the support; a forming step of supplying and curing an insulating material around the electronic component on the support body to form a surrounding part; a removing step of removing the support body from the first surface and from a second surface of the surrounding member where the first surface is exposed; and a bonding step of disposing an insulating material as a bonding member between a third surface constituted by the first surface and the second surface and a wiring substrate to bond the third surface and the wiring substrate, and disposing a conductive bump between the third surface and the wiring substrate to electrically connect the electronic component and the wiring substrate. In the bonding step, a through hole that penetrates the material as the bonding member from the third surface side to the wiring substrate side and accommodates the bump is formed in the material as the bonding member. At least a portion of the through-hole overlaps the second surface in a top perspective view.

Drawings

Fig. 1(a) and 1(b) are perspective views showing the appearance of the electronic component of the first embodiment, as viewed from the upper surface side and the lower surface side.

Fig. 2 is a schematic sectional view taken along line II-II of fig. 1 (b).

Fig. 3 is a schematic perspective view showing a structure of an example of an electronic element included in the electronic component of fig. 1 (a).

Fig. 4 is a schematic top perspective view of the electronic component of fig. 1 (a).

Fig. 5(a), 5(b) and 5(c) are schematic views showing some examples of materials of a bonding member in the electronic component of fig. 1 (a).

Fig. 6 is a flowchart showing an example of steps of the method for manufacturing an electronic component shown in fig. 1 (a).

Fig. 7(a), 7(b), 7(c) and 7(d) are schematic sectional views complementary to fig. 6.

Fig. 8(a), 8(b), and 8(c) are sectional views showing continuation of fig. 7 (d).

Fig. 9 is a schematic sectional view showing the structure of an electronic component of the second embodiment.

Fig. 10 is a schematic sectional view showing the structure of an electronic component of the third embodiment.

Fig. 11 is a schematic top perspective view of the electronic component of fig. 10.

Detailed Description

Hereinafter, the electronic component of the embodiment will be described with reference to the drawings. Further, the drawings used in the following description are schematic, and the dimensional ratios on the drawings are not necessarily in agreement with reality. Also, the drawings are not necessarily to scale relative to each other.

In the second and subsequent embodiments, basically, only the differences from the previously described embodiments will be described. Matters not specifically mentioned may be considered to be the same as the previously described embodiments.

< first embodiment >

(integral Structure of electronic parts)

Fig. 1(a) is a perspective view of the electronic component 1 of the first embodiment as viewed from the upper surface side, and fig. 1(b) is a perspective view of the electronic component 1 as viewed from the lower surface side.

Further, the electronic component 1 may be either upward or downward in any direction, but for convenience, the expression of the upper surface or the lower surface is used by defining that the positive side of the z direction in the rectangular coordinate system xyz is upward. Further, unless otherwise specified, a top view or a top perspective view refers to viewing in the z-direction.

The electronic component 1 is formed in a substantially thin rectangular parallelepiped shape, for example. The size of the electronic component 1 may be an appropriate size. For example, the length of one side is 1mm to 5mm in plan view, and the thickness is 0.3mm to 2mm (however, smaller than the short side in plan view).

The lower surface of the electronic component 1 is exposed with a plurality of external terminals 3A to 3F (hereinafter, a to F may be omitted). The electronic component 1 is disposed such that a lower surface thereof faces a mounting substrate, not shown, and is mounted on the mounting substrate by bonding pads provided on the mounting substrate and the plurality of external terminals 3 via bumps, not shown. Then, for example, the electronic component 1 receives a signal via any one of the plurality of external terminals 3, performs predetermined processing on the received signal, and outputs from any one of the plurality of external terminals 3.

The number, position, shape, size, and the like of the external terminals 3 can be appropriately set according to the internal structure, and the like, of the electronic component 1. For example, the external terminals 3 are provided in 4 or more (6 in the illustrated example) and arranged along the outer edge of the lower surface of the electronic component 1. Of these, four external terminals 3 are located at four corners of the lower surface of the electronic component 1. Of course, the external terminals 3 located inside the lower surface of the electronic component 1 may be provided. The planar shape of the external terminal 3 may be, for example, a rectangle (illustrated example), or may be a trapezoid or a circle.

The electronic component 1 may be regarded as having, for example, three layers (plate-like) stacked in the z direction. One is a body substrate 5 which plays a core role in the function of the electronic component 1. The other is a terminal substrate 7 having an external terminal 3. The remaining one is an insulating joint member 9 that is joined to the body substrate 5 and the terminal substrate 7. In fig. 1(a) and 1(b), the boundary between the above three layers appears in appearance. However, three layers are not observed in appearance.

Fig. 2 is a schematic sectional view taken along line II-II of fig. 1 (b). However, as in fig. 1(a), the + z direction is located above the paper surface.

One or more (usually a plurality of) conductive bumps 11 are provided between the body substrate 5 and the terminal substrate 7 in addition to the bonding member 9. The bump 11 is bonded (fixed) to the body substrate 5 and the terminal substrate 7, and electrically connects the body substrate 5 and the terminal substrate 7.

The main body substrate 5 includes: one or more (two in the illustrated example) electronic components 13A and 13B (hereinafter, a and B may be omitted), an insulating surrounding part 15 surrounding the electronic component 13, and a re-wiring layer 17 on the lower surface side of the electronic component 13 and the surrounding part 15. The electronic component 13 plays a central role in the function of the electronic component 1. The surrounding part 15 helps to protect the electronic components 13 and the like. The rewiring layer 17 is bonded to the bump 11 to mediate an electrical signal between the electronic component 13 and the terminal substrate 7.

(electronic component)

Fig. 3 is a schematic perspective view showing a structure of an example of the electronic component 13. In fig. 3, the + z direction is located below the paper surface, contrary to fig. 2.

The electronic component 13 has a lower surface 13b facing the terminal substrate 7. The lower surface 13b is substantially flat. The overall shape and size of the electronic component 13 can be set as appropriate. In the illustrated example, the electronic component 13 has a substantially thin rectangular parallelepiped shape. An example of the thickness of the electronic component 13 is 0.20mm to 0.25 mm.

When two or more electronic components 13 are provided, the two or more electronic components 13 may be identical to each other or different from each other in shape and/or size. In the example shown in fig. 2, the thicknesses of the two electronic components 13 are equal to or relatively close to each other. For example, in the whole of two or more electronic components 13, the thickness of the thickest electronic component 13 is 1.3 times or less, 1.2 times or less, or 1.1 times or less the thickness of the thinnest electronic component 13. In addition, any of the thicknesses of all the electronic components 13 of two or more may be within the above-described dimensional example (0.20mm to 0.25 mm).

The electronic component 13 has a plurality of component terminals 21 made of a layered conductor on the lower surface 13b. The electronic component 13 having such component terminals 21 can be regarded as a chip component that can be surface-mounted. Such chip-type electronic component 13 may be a so-called bare chip, a packaged chip, or a packaged chip of a wafer-level chip size. The present embodiment takes a bare chip or the like as an example. In addition, the chip-type electronic component 13 may be directly mounted on a mounting board (not shown) in a different manner from the present embodiment (having versatility), or may be configured to be suitable for the configuration of the electronic component 1 of the present embodiment.

The electronic component 13 may have an appropriately detailed structure and function. In the case where two or more electronic elements 13 are provided, the two or more electronic elements 13 may be the same type of electronic element (for example, both SAW elements) having the same basic principle, or may be completely different electronic elements (for example, SAW elements, semiconductor elements, and the like). In the description of the present embodiment, the electronic element 13 is exemplified by the SAW element system.

The electronic element 13 as a bare chip type SAW element includes, for example, an element substrate 23, one or more excitation electrodes 25 (only one is shown in fig. 3) provided on the lower surface of the element substrate 23, the above-described element terminal 21 provided on the lower surface of the element substrate 23, and an element wiring 27 connecting the excitation electrode 25 and the element terminal 21. The lower surface 13b of the electronic component 13 is constituted by the lower surface of the component substrate 23 and a conductor layer (excitation electrode 25 or the like) overlapping the lower surface.

Although not particularly illustrated, the electronic component 13 may have, in addition to the above, an insulating film that exposes the component terminal 21 and covers the excitation electrode 25 and a region of the lower surface of the component substrate 23 exposed from the excitation electrode 25. In this case, the lower surface 13b of the electronic component 13 is mainly constituted by an insulating film. Such an insulating film may be used only to reduce corrosion of the excitation electrode 25, and may also have an acoustically advantageous effect.

The shape and size of the element substrate 23 are substantially the same as those of the electronic element 13, for example. Therefore, the above description of the shape and size of the electronic component 13 can be applied to the shape and size of the element substrate 23.

In the element substrate 23, at least the surface (lower surface) on which the excitation electrode 25 is provided is made of a piezoelectric body. The piezoelectric body is made of, for example, a single crystal having piezoelectricity. The single crystal being, for example, crystal (SiO)₂) Lithium niobate (LiNbO)₃) Single crystal or lithium tantalate (LiTaO)₃) And (3) single crystal. The chamfer angle can be set as appropriate according to the type of SAW used, and the like.

The element substrate 23 may be formed of a piezoelectric body (or a piezoelectric substrate) as a whole, or may be formed with a piezoelectric layer on a support substrate made of an appropriate material, or may be formed by bonding a piezoelectric substrate and a support substrate. In addition, the side surfaces and the upper surface (+ z-side surface) of the element substrate 23 may be covered with an insulating layer or the like thinner than the thickness of the element substrate 23. Even with such a coating, the electronic component 13 can be regarded as a bare chip.

The excitation electrode 25 is a so-called idt (inter digital transducer) and includes a pair of comb-teeth electrodes 29. Each comb-tooth electrode 29 has a bus bar 29a and a plurality of electrode fingers 29b extending from the bus bar 29 a. The pair of comb-teeth electrodes 29 are arranged to mesh with each other (the plurality of electrode fingers 29b intersect with each other). Since fig. 3 is a schematic view, the illustrated number of electrode fingers 29b included in each comb-tooth electrode 29 is small. In practice, more electrode fingers 29b may be provided than shown. In addition, a standard shape of the excitation electrode 25 is shown in fig. 3. Unlike the illustration, the excitation electrode 25 may be provided with a so-called apodization, a so-called dummy electrode may be provided, or the bus bar 29a may be inclined with respect to the propagation direction of the SAW.

Since fig. 3 is a schematic diagram, only one excitation electrode 25 is shown. In practice, a plurality of excitation electrodes 25 may be provided. In addition, reflector electrodes may be provided on both sides of the excitation electrode 25 in the propagation direction of the SAW (x direction in fig. 3). More than one excitation electrode 25 may constitute a SAW resonator, a ladder resonator filter, a dual-or multi-mode resonator filter and/or a wave splitter etc.

When a signal is input to the excitation electrode 25, the signal is converted into a SAW and propagates in a direction (x direction) orthogonal to the electrode fingers 29b along the lower surface of the element substrate 23, and is converted again into a signal and output from the excitation electrode 25. In this process, the signal is filtered, etc. Since propagation of SAW is accompanied by vibration of the lower surface 13b of the electronic component 13, a region where the excitation electrode 25 (and the reflector electrode) is provided on the lower surface 13b becomes a vibration region 13c that vibrates in response to an electric signal input to the electronic component 13.

When a plurality of excitation electrodes 25 are provided, only one vibration region 13c may be defined on the lower surface 13b, the region including all of the plurality of excitation electrodes 25 (and reflector electrodes), or a plurality of vibration regions 13c may be defined on the lower surface 13b, each of the vibration regions 13c including more than one excitation electrode 25. In the description of the present embodiment, the former definition is adopted for convenience. In this case, the vibration region 13c may be defined, for example, as a smallest rectangle or ellipse (a simple shape without a depression on the outer edge) including all the excitation electrodes 25, or as a shape having a concavity and convexity on the outer edge. In the illustrated example, since only one excitation electrode 25 is schematically shown, the vibration region 13c has a rectangular shape.

The number and positions of the element terminals 21 and the element wirings 27 may be set as appropriate in accordance with the number, arrangement, and the like of one or more excitation electrodes 25. In the illustrated example, four element terminals 21 are provided at four corners of the element substrate 23. From another point of view, the plurality of element terminals 21 are arranged so as to surround the vibration region 13 c. In addition, the shape and size of the element terminal 21 may be set as appropriate. As will be apparent from the description below, in the present embodiment, the element terminals 21 are not intended to be bonded to conductive bumps, and therefore can be made smaller than usual.

In the illustrated example, only two of the four element terminals 21 are connected to the excitation electrode 25, and the other two element terminals 21 are electrically floating. For example, in a manner different from the present embodiment, when the electronic component 13 is mounted on a mounting substrate (not shown), the electrically floating component terminal 21 (dummy terminal) contributes to bonding the electronic component 13 and the mounting substrate. Further, in the present embodiment, such a dummy terminal may not be provided, or if there is, the dummy terminal may be excluded from the definition of the element terminal.

The excitation electrodes 25, the element terminals 21, and the element wirings 27 (conductor layers overlapping the lower surface of the element substrate 23) are made of an appropriate metal, for example, an Al — Cu alloy. They may be formed of the same material or may be formed of different materials from each other. Each of these members may be made of one material, or may be made of a plurality of materials, such as a laminate of a plurality of layers made of different materials. The element terminal 21 may have: a layer made of the same material as that of the excitation electrode 25 and the element wiring 27, and a layer made of another material covering the layer.

(surrounding part)

Returning to fig. 1 and 2, the surrounding member 15 has a lower surface 15b facing the terminal substrate 7. For example, the surrounding member 15 has a substantially thin rectangular parallelepiped shape (a shape including the electronic component 13), and the surrounding member 15 has an upper surface 15a and a lower surface 15b on the back side thereof. The surrounding part 15 is brought into close contact with the periphery of the electronic component 13 so that the lower surface 13b of the electronic component 13 is exposed from the lower surface 15b of the surrounding part. Thus, the lower surface 13b and the lower surface 15b form a substantially flat combined surface 19.

More specifically, the surrounding part 15 covers the side surface of the electronic component 13 over the entire circumference of the electronic component 13, and covers the upper surface 13a of the electronic component 13. That is, the electronic component 13 is embedded in the surrounding member 15 in a state where the lower surface 13b is exposed. In addition, the upper surface 15a of the surrounding part 15 constitutes the entire upper surface of the electronic component 1. The surface of the electronic component 13 covered with the surrounding part 15 is substantially in close contact with the surrounding part 15 (adhered to the surrounding part 15).

Further, although not particularly shown, the surrounding part 15 may cover only the side surface of the electronic component 13, leaving the upper surface 13a of the electronic component 13 exposed. In this case, the surrounding member 15 may cover the entire side surface of the electronic component 13 in the up-down direction, or may cover only a part of the side surface of the electronic component 13 on the lower surface 13b side. In addition, the surrounding part 15 does not necessarily cover the side surface of the electronic component 13 over the entire circumference of the electronic component 13. For example, the surrounding part 15 may be in a shape having no portion between the two electronic components 13.

As the material of the surrounding member 15, for example, various materials generally used for sealing electronic components can be used. The material of the surrounding member 15 may be an organic material, an inorganic material, or a combination of both. Examples of the organic material include resins. Examples of the inorganic material include a material in an amorphous state in which a plurality of kinds of inorganic particles are bonded to each other.

When the material of the surrounding member 15 is a resin, the resin is, for example, a thermosetting resin. Examples of the thermosetting resin include epoxy resins, phenol resins, melamine resins, urea resins, and unsaturated polyester resins. The resin may be mixed with a filler composed of insulating particles. The filler is made of, for example, a material having a lower linear expansion coefficient than the resin. Examples of the material of the insulating particles include silicon dioxide, aluminum oxide, phenol, polyethylene, glass fiber, and graphite.

Although not particularly illustrated, the surrounding member 15 may be composed of two or more layers of materials different from each other. For example, the surrounding part 15 may have an insulating film in close contact with the side and upper surfaces 13a of the electronic component 13 and the rewiring layer 17, and a molding resin covering the insulating film.

The size of the surrounding member 15 can be set as appropriate. For example, the thickness of the surrounding part 15 above the upper surface 13a of the electronic component 13 may be smaller than, equal to, or larger than the thickness of the electronic component 13. Likewise, the thickness of the surrounding part 15 from the side of the electronic element 13 to the side of the surrounding part 15 may be less than, equal to, or greater than the thickness and/or length of one side of the electronic element 13.

(rewiring layer)

The rewiring layer 17 has at least one conductor layer 35. The conductor layer 35 has body terminals 35a electrically connected to the element terminals 21 (fig. 3) of the electronic element 13. The electronic component 13 and the terminal board 7 are electrically connected by the bonding of the body terminal 35a and the bump 11. Therefore, for example, the bump 11 may be disposed at a position different from the position of the element terminal 21 in a top perspective view.

More specifically, in the illustrated example, the rewiring layer 17 includes: an insulating layer 31 overlapping the combined surface 19 composed of the electronic component 13 and the surrounding member 15, a plurality of through conductors 33 penetrating the insulating layer 31, and a conductor layer 35 overlapping the insulating layer 31. The plurality of through conductors 33 overlap the plurality of element terminals 21. The conductor layer 35 includes, in addition to the plurality of body terminals 35a, a plurality of wiring patterns 35b that connect the plurality of through conductors 33 and the plurality of body terminals 35 a.

Although not particularly illustrated, the rewiring layer 17 may have only the conductor layer 35 directly overlapping the combined surface 19 without the insulating layer 31 and the through conductor 33. In addition, conversely, the rewiring layer 17 may have two or more insulating layers 31 and/or two or more conductor layers 35. Although the through conductor 33 is described as a different portion from the conductor layer 35 for convenience, it may be formed of the same material as the conductor layer 35 at the same time.

The shape of the rewiring layer 17 as a whole in a plan view may be an appropriate shape. In the illustrated example, the rewiring layer 17 (more specifically, the insulating layer 31) substantially overlaps the entire surface of the combined surface 19. However, the region overlapping with the vibration region 13c is a non-arrangement region of the rewiring layer 17. Thereby, the possibility that the rewiring layer 17 affects the vibration characteristics of the vibration region 13c is reduced.

Further, although not particularly illustrated, the rewiring layer 17 may have a non-arrangement region in addition to the vibration region 13 c. For example, the outer edge of the re-wiring layer 17 may be located inward of the outer edge of the combined surface 19. In addition, conversely, the rewiring layer 17 may have an insulating layer 31 covering the vibration region 13 c. Such an insulating layer 31 may merely help to protect the excitation electrode 25 from corrosion, or may exert an acoustically advantageous effect.

The thickness of the rewiring layer 17 can be set as appropriate. For example, the thickness of the re-wiring layer 17 is sufficiently small compared to the thickness of the electronic element 13 and the thickness of the bonding member 9. For example, when comparing the thicknesses of the rewiring layer 17 and the thickest part of the junction member 9, the former is 1/2 or less or 1/5 or less of the latter. However, a relatively thick re-wiring layer 17 may also be provided.

The material of the insulating layer 31 may be an organic material, an inorganic material, or a combination of both. Alternatively, a known material for a rewiring layer of a semiconductor element and/or a circuit board may be used. The insulating layer 31 may be formed of a plurality of materials, such as the same material as the whole, or a plurality of layers formed of different materials may be stacked.

The plan view shape and width of the insulating layer 31 can be basically explained by the plan view shape and width of the entire rewiring layer 17 except for the hole for disposing the through conductor 33. The insulating layer 31 overlapping the combination surface 19 has an opening (reference numeral omitted) overlapping the element terminal 21. The opening has substantially the same shape and size as those of the element terminal 21 in plan view. The thickness of the insulating layer 31 can be set as appropriate.

The material of the through conductor 33 may be, for example, an appropriate metal, and may be the same as or different from the material of the conductor layer 35 to which the through conductor 33 is connected. The through conductor 33 has substantially the same shape and size as the element terminal 21 in a plan view, for example.

The conductor layer 35 may be, for example, an appropriate metal, and a known material for a rewiring layer of a semiconductor element and/or a circuit board may be used. The conductor layer 35 may be formed of a single material, or may be formed of a plurality of materials, such as a laminate of a plurality of layers formed of different materials. The thickness of the conductor layer 35 is arbitrary.

The boundary between the body terminal 35a and the wiring pattern 35b may be clear or unclear. For example, the main body terminal 35a may be wider than the wiring pattern 35b in a plan view, as a clear boundary. In addition, for example, the body terminal 35a has: a layer made of the same material as that of the wiring pattern 35b, and a layer made of another material covering the layer and adapted to be bonded to the bumps 11.

(terminal substrate)

The terminal substrate 7 is formed of, for example, a so-called rigid printed wiring board. The structure may be the same as various known structures except for specific shapes and sizes, etc. The terminal board 7 may be a double-sided board having two conductor layers in total on only the front and back surfaces, or may be a multilayer board having three or more conductor layers. In the description of the present embodiment, a multilayer board is taken as an example.

The terminal substrate 7 is formed in a substantially thin rectangular parallelepiped shape, for example. The shape and size of the terminal substrate 7 in plan view are substantially the same as those of the main body substrate 5 in plan view. For example, the terminal substrate 7 has a shape and a size that fit the main body substrate 5 in a top perspective view, and an area difference between the terminal substrate 7 and the main body substrate 5 is 40% or less, 20% or less, or 10% or less of an area of the main body substrate 5. However, the terminal substrate 7 and the body substrate 5 may be different from each other in shape and/or size in plan view. In addition, the thickness of the terminal substrate 7 may be thinner than, equal to, or thicker than the thickness of the main body substrate 5.

The terminal substrate 7 includes, for example, an insulating substrate 37 and a conductor provided on the insulating substrate 37. The conductor includes, for example, a plurality of conductor layers 39 located on the upper surface, inside and lower surface of the insulating substrate 37, and a plurality of through conductors 41 located inside the insulating substrate 37 and connecting the conductor layers 39 to each other.

The insulating substrate 37 constitutes a main part of the outer shape of the terminal substrate 7, and the above description of the shape and size of the terminal substrate 7 can be applied to the shape and size of the insulating substrate 37. The insulating substrate 37 is formed by laminating a plurality of insulating layers 37 a. The thickness and the number of stacked layers of the insulating layer 37a can be set as appropriate. The insulating substrate 37 (insulating layer 37a) is formed of an inorganic material containing, for example, resin, ceramic, and/or an amorphous state. The insulating substrate 37 (insulating layer 37a) may be made of a single material or a composite material such as a substrate in which a base material is impregnated with a resin.

The conductor layer 39 overlapping the upper surface of the insulating substrate 37 includes a plurality of pads 43 joined to the bumps 11. The conductor layer 39 overlapping the lower surface of the insulating substrate 37 includes a plurality of external terminals 3. The conductor layer 39 (wiring pattern included in the conductor layer) and the plurality of through conductors 41 penetrating the insulating layer 37a, which are sandwiched between the insulating layers 37a, contribute to connecting the plurality of pads 43 and the plurality of external terminals 3. The shapes and dimensions of the plurality of conductor layers 39 and the plurality of through conductors 41 can be set as appropriate.

These conductors may be formed of the same material or different materials for a plurality of portions. These materials may be an appropriate metal, may be composed of one material, may be composed of a plurality of materials such as a laminate of a plurality of layers made of different materials, or the like. The pad 43 may have a structure suitable for bonding with the bump 11. Similarly, the external terminal 3 may have a structure suitable for bonding to a bump for mounting the electronic component 1 on a mounting substrate not shown.

As described above, the position and the like of the external terminal 3 can be appropriately set. Regarding the relationship with the main body substrate 5, for example, a part or all of the external terminals 3 (in the present embodiment, all) overlap the main body substrate 5 (combined surface 19) in a perspective view in a plan view. The external terminals 3 overlapping the main body substrate 5 may have an area entirely overlapping the main body substrate 5 (illustrated example) or partially overlapping the main body substrate 5.

Although not particularly illustrated, the terminal substrate 7 may have an electronic component constituted by the conductor layer 39 and/or the through conductor 41. Examples of such electronic components include resistors, inductors, capacitors, resonators, and filters. In addition, the terminal substrate 7 may include a chip component mounted on an upper surface or housed inside.

(joining member)

The joining member 9 is a layered member having a substantially constant thickness, and has a through hole 45 penetrating the joining member 9 from the main body substrate 5 side to the terminal substrate 7 side. The through hole 45 overlaps with the position where the bump 11 is disposed in a transparent plan view so that the bump 11 can be disposed between the body substrate 5 and the terminal substrate 7. Further, the through hole 45 overlaps the vibration region 13c of the electronic component 13 in a plan perspective view, and contributes to reducing the influence of the bonding member 9 on the vibration of the vibration region 13 c.

The through hole 45 is sealed. The portion (the portion not shaded in fig. 2) of the through hole 45 where the material such as the bump is not disposed may be in a vacuum state (a state in which the pressure is reduced from the atmospheric pressure), or may be in the presence of an appropriate gas (for example, an inert gas).

In the cross section orthogonal to the body substrate 5 and the terminal substrate 7 as shown in fig. 2, the shape of the inner surface (wall surface) of the through hole 45 and the like can be set as appropriate. For example, the inner surface may be orthogonal to the main body substrate 5 and the terminal substrate 7, may be inclined, may be flat, or may be curved.

The shape and size of the outer edge of the joining member 9 are substantially the same as those of the outer edges of the main body substrate 5 and the terminal substrate 7. However, the shape and/or size of the outer edge of the engaging member 9 may be different from those of the terminal substrate 7 and/or the body substrate 5. The thickness of the engaging member 9 can be set as appropriate. For example, the thickness of the joining member 9 is smaller than the thickness of the terminal substrate 7 and the thickness of the electronic component 13. However, the thickness of the joining member 9 may be larger than the thickness of the terminal substrate 7 and the thickness of the electronic component 13.

The joining member 9 is made of, for example, a resin described later, and is adhered to the main body substrate 5 and the terminal substrate 7 to join the two. More specifically, in the illustrated example, the bonding member 9 adheres to the rewiring layer 17 (mainly the insulating layer 31). However, the bonding member 9 may be adhered to the electronic element 13 and/or the surrounding member 15 via the non-arrangement region of the re-wiring layer 17.

(bump)

The bump 11 is interposed between the body terminal 35a and the pad 43 to join them. The bump 11 is made of, for example, solder. The solder may be Pb-Sn alloy solder using lead, or may be lead-free solder such as Au-Sn alloy solder, Au-Ge alloy solder, Sn-Ag alloy solder, and Sn-Cu alloy solder. Further, the bump 11 may be formed of a conductive adhesive. The conductive adhesive is a resin mixed with a conductive filler. The resin is, for example, a thermosetting resin.

(connection of two electronic components)

Both the electronic components 13A and 13B are electrically connected to the same external terminal 3 (here, 3B). More specifically, one of the plurality of pads 43 bonded to the electronic component 13A via the bump 11 and one of the plurality of pads 43 bonded to the electronic component 13B via the bump 11 are connected to the external terminal 3B through circuits constituted by the wiring pattern (conductor layer 39) of the terminal substrate 7 and the through conductor 41, respectively. Further, although not particularly illustrated, two circuits from the pad 43 to the external terminal 3B may be merged on the upper surface or inside of the terminal substrate 7 before reaching the external terminal 3B.

Examples of the electronic component 1 having two or more electronic elements 13 electrically connected to the same external terminal 3 include a demultiplexer (duplexer). In this case, the external terminal 3B is electrically connected to an antenna, not shown, via a mounting board on which the electronic component 1 is mounted. One of the electronic components 13A and 13B (13A in the following description) constitutes a transmission filter that allows only an electric signal having a frequency within a transmission pass band to pass therethrough. The other of the electronic components 13A and 13B (13B in the following description) constitutes a reception filter that allows only an electric signal having a frequency within a reception pass band to pass therethrough. The pass band for transmission and the pass band for reception do not overlap each other. These pass bands may be set according to various criteria. The following is an example of the operation of the electronic component 1 as a demultiplexer.

The external terminal 3A electrically connected to the electronic element 13A receives, for example, a transmission signal containing information to be transmitted and having been modulated and upconverted (converted into a high-frequency signal having a carrier frequency). The transmission signal may be an unbalanced signal input to the external terminal 3A or a balanced signal input to the external terminal 3A and the other external terminals 3 (excluding the external terminals connected to the electronic component 13B). The electronic element 13A removes unnecessary components other than the transmission passband from the transmission signal input via the external terminal 3A (and the other external terminal 3), and outputs the transmission signal to the external terminal 3B. The signal output to the external terminal 3B is converted into a radio signal (radio wave) via an antenna (not shown) and transmitted.

In addition, a radio signal received by an antenna (not shown) is converted into an electric signal (reception signal) by the antenna and input to the external terminal 3B. The electronic element 13B removes unnecessary components other than the reception passband from the reception signal received by the external terminal 3B, and then outputs the reception signal to the external terminal 3C. The reception signal output from the electronic component 13B may be an unbalanced signal output to the external terminal 3C, or may be a balanced signal output to the external terminal 3C and the other external terminals 3 (excluding the external terminals connected to the electronic component 13A).

(shape and position of through-hole in top perspective)

Fig. 4 is a schematic top perspective view of the electronic component 1. Here is illustrated: the outer edge of the electronic component 13, the component terminal 21, the vibration region 13c, the bump 11, the outer edge of the bonding member 9, and the through hole 45(45A and 45B) of the bonding member 9. In addition, the wiring pattern 35b connecting the element terminal 21 and the body terminal 35a is schematically shown by a straight line.

Further, here, the vibration region 13c is drawn slightly wider than that in fig. 3. Specifically, the vibration region 13c is enlarged as compared with fig. 3 to include a portion between the element terminals 21 adjacent to each other along the outer edge of the element substrate 23.

As is apparent from fig. 2, in the present embodiment, the figure showing the outer edge of the joining member 9 in fig. 4 may be regarded as showing the outer edge of the surrounding member 15 and the outer edge of the terminal substrate 7. The pattern showing the bump 11 in fig. 4 can be regarded as showing the body terminal 35a of the body substrate 5 and the pad 43 of the terminal substrate 7. Therefore, in the following description, the description of the size and position of the bump 11 in a top perspective may be applied to the size and position of the body terminal 35a and the pad 43.

Further, as described above, the boundary between the body terminal 35a and the wiring pattern 35b may not be clear. In addition, the body terminal 35a can be made sufficiently large compared to the bump 11. Therefore, it looks the opposite, but the region of the conductor layer 35 overlapping with the bump 11 in a top perspective may be defined as the body terminal 35 a. Similarly, as for the land 43, a region where the conductor layer 39 on the upper surface of the terminal substrate 7 overlaps with the bump 11 in a top perspective view may be defined as the land 43.

The joint member 9 has, for example, two through holes 45A and 45B as the through hole 45. The through hole 45A corresponds to the electronic component 13A, and the through hole 45A overlaps the vibration region 13c of the electronic component 13A and accommodates the bump 11 electrically connected to the electronic component 13A in a top perspective view. Likewise, the through hole 45B corresponds to the electronic component 13B, and the through hole 45B overlaps the vibration region 13c of the electronic component 13B and accommodates the bump 11 electrically connected to the electronic component 13B in a top perspective view.

The shape of each through hole 45 in a plan view can be set as appropriate. In the illustrated example, the planar shape of the through hole 45 is a rectangular shape in which the bump 11 is located at four corners. Further, for example, the through-hole 45 may be circular or elliptical. In addition, the through-holes 45 located between the bumps 11 adjacent to each other in the direction surrounding the electronic component 13 may have a smaller diameter. In this case, the area of the joining member 9 in plan view can be increased, and the joining area between the main body substrate 5 and the terminal substrate 7 can be increased.

The through hole 45 has a portion extending to the outside of the electronic component 13 in a top perspective view. In other words, at least a part of the through hole 45 overlaps with the lower surface 15b of the surrounding member 15. In the illustrated example, the through-hole 45 extends to the outside of the electronic component 13 over the entire circumference thereof. The area of the portion of the through hole 45 located outside the electronic component 13 may be set as appropriate. For example, the area may be smaller than, equal to, or larger than the area of the electronic element 13, and in addition, may be a minimum area in which the bump 11 can be configured as described below.

Since the through hole 45 extends to the outside of the electronic component 13 in a perspective view, at least a part of the bump 11 (the body terminal 35a and the land 43 from another point of view) may be located outside the electronic component 13. For example, in the illustrated example, each of the plurality of bumps 11 corresponding to the electronic component 13A is located outside the electronic component 13A. Each of the plurality of bumps 11 corresponding to the electronic component 13B has a portion thereof located outside the electronic component 13B.

As with the bump 11 corresponding to the electronic component 13B, when a part of the bump 11 is located outside the electronic component 13, the size of the part located outside thereof can be set as appropriate. For example, the area (projected area, hereinafter, the area in the top perspective view is also applied) of the portion may be 1/2 smaller than the area of the bump 11 in the top perspective view, and may be 1/2 or more, or 2/3 or more.

The bump 11 and the inner surface of the through-hole 45 may be separated from each other (example in the drawing) or may contact each other. The distance at the time of separation (shortest distance unless otherwise specified, the same applies hereinafter) may be set as appropriate. For example, the distance may be smaller than 1/2, which is the diameter of the equivalent circle of the bump 11, or may be 1/2 or more in a top view perspective.

The position of the bump 11 with respect to the electronic component 13 can be set as appropriate. For example, the plurality of bumps 11 may be configured to surround the electronic component 13 (illustrated example), and may be arranged only on one side of the predetermined direction with respect to the electronic component 13. In the former case, the plurality of bumps 11 may be located on the corner side (on the extension of the diagonal line) of the electronic component 13 (in the illustrated example), or may be located on both sides in the opposing direction of a pair of side edges of the electronic component 13.

The positional relationship between the element terminals 21 electrically connected to each other and the bumps 11 can be set as appropriate. In the illustrated example, the element terminals 21 located on the same corner side as the electronic element 13 are electrically connected to the bumps 11. From another point of view, the plurality of element terminals 21 and the plurality of bumps 11 are connected so that the plurality of wiring patterns 35b do not cross each other. However, since the rewiring layer 17 includes two or more conductor layers 35 and the like, the plurality of wiring patterns 35b may be connected to cross each other.

As described above, the plurality of element terminals 21 may include a dummy terminal in an electrically floating state. The device terminal 21 may be in a state of not being electrically connected to any bump 11, or may be electrically connected to an electrically floating bump 11. In addition, the through conductor 33, the body terminal 35a, the bump 11, and/or the pad 43 corresponding to the dummy terminal may not be provided.

The element terminals 21 of the electronic element 13 are apparently fitted in the outer edge of the electronic element 13 (element substrate 23) in a perspective view in plan view. Therefore, as is apparent from the above description, at least a part of the bump 11 is positioned outside the electronic component 13 with respect to the component terminal 21 in a plan perspective view. Further, in the illustrated example, the bump 11 is farther from the vibration region 13c than the element terminal 21. For example, when the element terminal 21 and the bump 11 electrically connected to each other are compared, the distance between the bump 11 and the vibration region 13c is 1.2 times or more, 2 times or more, or 5 times or more the distance between the element terminal 21 and the vibration region 13 c.

In the illustrated example, the bump 11 is larger than the element terminal 21 in a transparent plan view. For example, when comparing the bump 11 and the element terminal 21 which are electrically connected to each other, the area of the bump 11 is 1.2 times or more, 2 times or more, or 5 times or more the area of the element terminal 21 in a top perspective view.

(materials of joining members)

The material of the joining member 9 may be an organic material, an inorganic material, or a combination of both. The material of the joining member 9 may be a base material mixed with a filler, or may be formed by laminating a plurality of layers made of different materials. Fig. 5(a) to 5(c) are schematic views each showing an example of a material of the bonding member 9.

In the example of fig. 5(a), the joining member 9 has a resin 47 as a base material and a glass frit 49 as a filler.

The resin 47 is, for example, a thermosetting resin. Examples of the thermosetting resin include epoxy resins, phenol resins, melamine resins, urea resins, and unsaturated polyester resins. When the surrounding part 15 is made of resin, the resin 47 may be the same as or different from the resin of the surrounding part 15.

The glass constituting the glass frit 49 contains silicate as a main component, and includes quartz glass, soda-lime glass, and borosilicate glass. For example, the glass has a lower linear expansion coefficient than the resin 47. For example, the resin 47 has a linear expansion coefficient of 25 μ/deg.C or more, and the frit 49 has a linear expansion coefficient of 3 μ/deg.C or more and 8 μ/deg.C or less.

The shape, particle size and filling ratio of the frit 49 can be set as appropriate. In the illustrated example, the shape of the frit 49 is a needle shape (cullet shape). However, the shape of the frit 49 may be other shapes such as a sphere. An example of the particle diameter (diameter corresponding to a circle) of the frit 49 is 1 μm or more and 100 μm or less. An example of the volume filling rate of the frit 49 is, for example, 5% or more and 95% or less.

By including the plurality of glass frits 49, the coefficient of linear expansion of the joining member 9 is closer to the coefficient of linear expansion of the electronic component 13 and the terminal substrate 7 than in the case where the joining member 9 is composed of only the resin 47. An example of the linear expansion coefficient of each component in this case will be given. The linear expansion coefficient of the electronic component 13 (component substrate 23) is not less than 3 μ/DEG C and not more than 17 μ/DEG C. The terminal substrate 7 has a linear expansion coefficient of 5 μ/DEG C or more and 20 μ/DEG C or less. The linear expansion coefficients of the resin 47 and the glass frit 49 are as described above.

In the example of fig. 5(b), the joining member 9 is formed of a plurality of layers (three layers in the illustrated example). More specifically, the joining member 9 has an upper layer 51, an intermediate layer 53, and a lower layer 55 in this order from the main body substrate 5 side to the terminal substrate 7 side.

For example, the middle layer 53 is thicker than the upper layer 51 and the lower layer 55, which helps to ensure that the thickness of the bonding member 9 is adapted to the thickness of the bump 11. The upper layer 51 and the lower layer 55 are made of, for example, a material having higher adhesiveness than the intermediate layer 53.

For example, like the joining member 9 shown in fig. 5(a), the middle layer 53 is composed of a material having the resin 47 and the plurality of glass frits 49. However, since the middle layer 53 need not have an adhesive function, the resin 47 may be a different resin from the resin 47 of fig. 5 a. In addition, unlike the illustrated example, the intermediate layer 53 may be formed of an inorganic material in an amorphous state or a crystalline state, or may be formed of a plurality of layers stacked. The ratio of the thickness of the middle layer 53 to the thickness of the joining member 9 may be appropriately set, and may be, for example, 1/2 or more, 2/3 or more, or 4/5 or more.

The upper layer 51 and the lower layer 55 are made of, for example, only resin. As the resin, for example, those exemplified in the description of the resin 47 may be used.

In the example of fig. 5(c), like a printed wiring board made of resin, the joint member 9 has a base material 57 and a resin 47 covering the base material 57 (from another point of view, impregnated in the base material 57).

The base material 57 is, for example, glass cloth (an example shown), glass nonwoven fabric, synthetic fiber cloth, or paper, and a known substrate of a printed wiring board can be used. In fig. 5(c), a longitudinal section of warp yarns and a cross section of weft yarns of the glass cloth are schematically shown. For the glass constituting the glass cloth, the description of the glass constituting the frit 49 can be applied. The diameters of the warp and weft of the glass cloth can be set as appropriate. For example, the wire diameter (diameter corresponding to a circle) of the glass cloth is 1 μm to 20 μm. As for the resin 47, the description of fig. 5(a) can be applied.

Since the bonding member 9 has the base material 57, the coefficient of linear expansion thereof is reduced as compared with the case where it is made of, for example, only the resin 47, and the coefficient of linear expansion is made close to the coefficients of linear expansion of the electronic component 13 and the terminal substrate 7. In addition, the base material 57 also contributes to improvement in strength of the electronic component 1. Further, the joining member 9 of fig. 5(c) may be used as the middle layer 53 of fig. 5 (b).

(method for manufacturing electronic Components)

Fig. 6 is a flowchart showing an example of the steps of the method for manufacturing the electronic component 1. Fig. 7(a) to 8(c) are schematic cross-sectional views complementary to fig. 6, and correspond to fig. 2. In fig. 7(a) to 8(c), details may be omitted from fig. 2. As the manufacturing method proceeds, the state and shape of the material constituting the electronic component 1 change, but the same reference numerals may be used before and after the change.

In step ST1, as shown in fig. 7(a), the support 59 is prepared. The support 59 is, for example, a member having a flat upper surface. The upper surface has a size capable of arranging a plurality of electronic components 1. However, fig. 7(a) shows a range corresponding to one electronic component 1. The support 59 is configured by applying an adhesive 63 to the resin sheet 61, for example, and is supported by a support member not shown. The support 59 may be formed by applying a bonding agent or an adhesive to a flat upper surface of a support, not shown.

In step ST2, as shown in fig. 7(B), the electronic components 13A and 13B are disposed on the upper surface of the support 59. More specifically, the electronic component 13 is disposed with the lower surface 13b side facing the upper surface of the support 59. The positional relationship between the electronic components 13A and 13B at this time is the same as that in the electronic component 1. Here, the figures show the electronic elements 13A and 13B corresponding to only one electronic component 1, but the upper surface of the support 59 is configured with the electronic elements 13A and 13B corresponding to a plurality of electronic components 1.

In step ST3, as shown in fig. 7(c), the material as the surrounding member 15 is supplied onto the support 59 and cured. Thereby, the electronic components 13A and 13B are embedded in the surrounding part 15. However, since the lower surface 13b of the electronic component 13 is in close contact with the support 59, it is not covered by the surrounding part 15 but is exposed from the lower surface 15b of the surrounding part 15. From another point of view, the electronic components 13A and 13B and the surrounding member 15 are combined to constitute a plurality of wafers 65 to be used by curing the material as the surrounding member 15.

The material for the surrounding member 15 may be, for example, liquid or powder. The supply method of the material of the surrounding member 15 can be set as appropriate. For example, the liquid material may be supplied by a dispenser or screen printing, and a sheet-like formed body which becomes liquid by heating may also be provided.

As the curing of the material of the surrounding member 15, for example, it is performed by heating the material while pressurizing. The specific method thereof can be set as appropriate. For example, the material may be heated by a heater of a not-shown support that supports the support 59, and/or may be pressed from above by a mold having a heater.

In step ST4, as shown in fig. 7(d), the support 59 is removed from the wafer 65. The support 59 may be removed by peeling, or by melting the support 59 or dissolving it in a chemical solution. In addition, the surface from which the supporting body 59 is removed can be appropriately cleaned.

In step ST5, as shown in fig. 8(a), the surface of the wafer 65 from which the supporting body 59 has been removed (combined surface 19) is provided with the re-wiring layer 17. The rewiring layer 17 can be formed by a known method such as an additive method or a semi-additive method. The main body substrate 5 is configured by forming a rewiring layer 17.

In step ST6, as shown in fig. 8(b), the main body substrate 5 and the terminal substrate 7 are bonded by the bonding member 9 and the bump 11. From another point of view, the wafer 65 on which the plurality of body substrates 5 are formed and the wafer 67 on which the plurality of terminal substrates 7 are formed are bonded by the wafer 69 on which the plurality of bonding members 9 are formed and the bumps 11.

The material as the joining member 9 is a sheet in a semi-cured state (uncured) such as a prepreg of a circuit board. Prior to bonding, through holes 45 are formed in the sheet. The method of forming the through-hole 45 may be an appropriate method such as laser machining or punching. The viscosity of the uncured sheet and the like can be appropriately set.

Then, the sheet to be the joining member 9 is heated and cured, for example, in a state of being sandwiched between the body substrate 5 and the terminal substrate 7. Thereby, the joining member 9 is brought into close contact with (adhered to) the main body substrate 5 and the terminal substrate 7, and further, the both are joined. Further, the sheet may first be abutted with either the terminal substrate 7 or the main body substrate 5. When the material (including materials other than the sheet material) as the joining member 9 is cured, an appropriate pressure may be applied as needed.

Unlike the illustrated example, the joining member 9 may be a liquid material printed on the terminal substrate 7 or the main body substrate 5. As a printing method in this case, screen printing may be used. In addition, the joining member 9 may be constituted by a sheet that is melted by heating and then cured at the end of heating to exert an adhesive function.

First, the bump 11 is disposed on one of the body substrate 5 (body terminal 35a) and the terminal substrate 7 (pad 43). Then, when the main body substrate 5 and the terminal substrate 7 are laminated via the material as the joining member 9, they are accommodated in the through-holes 45 and come into contact with the other of the main body substrate 5 and the terminal substrate 7. Thereafter, melted by heating and then solidified at the end of heating, and joined to the body terminal 35a and the land 43.

The heating for bonding the bonding member 9 and the heating for bonding the bump 11 may be the same step. For example, the bonding member 9 and the bump 11 may be bonded substantially simultaneously by heating with a reflow oven. The bonding may be performed in an appropriate gas atmosphere such as a vacuum atmosphere or an inert gas atmosphere.

In step ST7, as shown in fig. 8(c), the laminated body of the wafers 65, 67 and 69 is cut and diced. Thereby, the electronic component 1 is manufactured. The cutting may be performed by a known method, for example, a cutting blade or a laser may be used.

In the above description, the mode of manufacturing the electronic component 1 in wafer units has been described. However, the above steps may be performed for each electronic component 1.

As described above, in the present embodiment, the electronic component 1 includes the electronic element 13, the surrounding component 15, the wiring substrate (the terminal substrate 7), the bonding component 9, and the bump 11. The electronic component 13 has a first surface (lower surface 13 b). The insulating surrounding part 15 has a second surface (lower surface 15b) that is in close contact with the periphery of the electronic component 13 while exposing the lower surface 13b from the lower surface 15b. The terminal substrate 7 faces a third surface (combined surface 19) composed of the lower surface 13b and the lower surface 15b. An insulating joint member 9 is interposed between the combining surface 19 and the terminal substrate 7 to join the two. The conductive bump 11 is positioned between the combination surface 19 and the terminal substrate 7 to electrically connect the electronic component 13 and the terminal substrate 7. The joining member 9 has a through hole 45 penetrating from the combining surface 19 side to the terminal substrate 7 side and accommodating the bump 11. At least a part of the through hole 45 overlaps the lower surface 15b (outside the electronic component 13) in a top perspective view.

Therefore, for example, the through hole 45 may be expanded to the outside of the electronic component 13 in a state where the airtightness of the through hole 45 is maintained by the lower surface 15b of the surrounding member 15, and/or the position of the through hole 45 may be shifted to the outside of the electronic component 13. In other words, the degree of freedom in designing the through-hole 45 is improved. From another point of view, the surrounding member 15 not only helps to protect the electronic component 13, but also helps to define a portion of the through-hole 45 to be sealed outside the electronic component 13. By increasing the degree of freedom in designing the through hole 45, the degree of freedom in disposing the bump 11 is also increased, and the degree of freedom in designing the electronic component 13 is also increased.

In the present embodiment, at least a part of the bump 11 overlaps the lower surface 15b of the surrounding member 15 (outside the electronic component 13) in a top perspective view.

As described above, since at least a portion of the through hole 45 overlaps the lower surface 15b, at least a portion of the bump 11 accommodated in the through hole 45 may overlap the lower surface 15b. From another point of view, the surrounding member 15 protects the electronic component 13, and improves the degree of freedom in designing the through hole 45, and also helps to position a part of the rewiring layer 17 bonded to the bump 11 outside the electronic component 13. This further increases the degree of freedom in designing the electronic component 13. For example, the requirement that the element terminals 21 of the electronic element 13 have a shape, size, and material suitable for bonding with the bumps 11 is reduced. In addition, since the element terminals 21 do not have to support the electronic element 13, the necessity of having to be disposed at four corners is reduced. As a result, for example, the width of the vibration region 13c is more easily secured with respect to the width of the lower surface 13b of the electronic component 13. In other words, the electronic component 13 can be miniaturized with respect to the vibration region 13 c. This increases the number of electronic components 13 that can be extracted from the wafer on which the plurality of component substrates 23 are formed, thereby improving productivity.

In the present embodiment, the lower surface 13b of the electronic component 13 has a vibration region 13c that vibrates in response to an electric signal input to the electronic component 13. The through hole 45 also overlaps the vibration region 13c in a perspective top view.

In this case, for example, since a part of the through hole 45 is located outside the electronic component 13, the through hole 45 becomes easier to widen with respect to the width of the lower surface 13b of the electronic component 13, thereby making it easier to widen the vibration region 13c with respect to the lower surface 13b. In other words, as described above, the electronic component 13 can be miniaturized and the productivity can be improved. In addition, a space for promoting the vibration of the vibration region 13c and a space for accommodating the bump 11 are secured by one through hole 45. This can simplify the shape of the joining member 9 in plan view, and can enlarge the through hole 45. As a result, for example, the formation of holes in the material (for example, a sheet in an uncured state) as the joining member 9 is facilitated.

In the present embodiment, the surrounding part 15 covers the side surface of the electronic component 13 over the entire circumference of the electronic component 13, and also covers the surface (upper surface 13a) on the side opposite to the lower surface 13b of the electronic component 13.

Thus, for example, the surrounding member 15 enhances the protection of the electronic component 13. In addition, for example, the fixing strength between the surrounding part 15 and the electronic component 13 is also improved. In addition, for example, when the through hole 45 extends from the lower surface 13b of the electronic component 13 to the lower surface 15b of the surrounding member 15, if peeling occurs between the side surface of the electronic component 13 and the side surface of the surrounding member 15, a gap resulting from the peeling thereof communicates with the through hole 45. When the surrounding part 15 covers the entire circumference of the side surface of the electronic component 13 and the upper surface 13a, the possibility that the gap communicating with the through hole 45 is opened to the outside of the electronic component 1 is reduced. Thereby improving the reliability of the airtightness of the through-hole 45.

In the present embodiment, the joining member 9 has a resin 47 and a plurality of glass frits 49 mixed in the resin 47.

Therefore, for example, by adjusting the coefficient of linear expansion of the joining member 9 by the frit 49, the difference in thermal expansion between the joining member 9 and the body substrate 5 can be reduced, and/or the difference in thermal expansion between the joining member 9 and the terminal substrate 7 can be reduced. Thereby, for example, the possibility of peeling and/or thermal stress generation due to a difference in thermal expansion can be reduced. When the electronic component 13 is a SAW element, since the thermal stress generated in the element substrate 23 affects the propagation characteristics of the SAW, the reduction of the thermal stress improves the reliability of the electrical characteristics of the electronic component 1.

In the present embodiment, the external terminal 3 electrically connected to the electronic component 13 is provided on the surface of the terminal substrate 7 opposite to the third surface (the mating surface 19) in a region overlapping the mating surface 19 in a perspective plan view.

When the terminal substrate 7 has the above-described configuration, it can be said that the terminal substrate 7 constitutes the chip-type electronic component 1 together with the electronic element 13. Since at least a part of the through hole 45 can be located outside the electronic element 13 so that the vibration region 13c is relatively large, the vibration region 13c can also be made large in the chip-type electronic component 1. From another point of view, in the present embodiment, the chip-type electronic component 1 can be miniaturized with respect to the vibration region 13 c.

In the present embodiment, the manufacturing method of the electronic component 1 includes a disposing step (ST2), a forming step (ST3), a removing step (ST4), and a bonding step (ST 6). In the placement step, the first surface (lower surface 13b) of the electronic component 13 is closely attached to the support 59. In the forming step, an insulating material is supplied to the periphery of the electronic component 13 on the support 59 and cured to form the surrounding part 15. In the removing step, the supporting body 59 is removed from the lower surface 13b of the electronic component 13 and the second surface (lower surface 15b) of the surrounding part 15 exposed from the lower surface 13b. In the bonding step, an insulating material as the bonding member 9 is disposed between the third surface (combined surface 19) composed of the lower surface 13b and the lower surface 15b and the terminal substrate 7, and the combined surface 19 and the terminal substrate 7 are bonded, and at the same time, the conductive bump 11 is disposed between the combined surface 19 and the terminal substrate 7 to electrically connect the electronic component 13 and the terminal substrate 7. In the bonding step, a through hole 45 that penetrates the material as the bonding member 9 from the combination surface 19 side to the terminal substrate 7 side and accommodates the bump 11 is formed as the material of the bonding member 9. At least a part of the through hole 45 overlaps the lower surface 15b of the surrounding member 15 (outside the electronic component 13) in a perspective view in plan view.

According to such a manufacturing method, for example, the electronic component 1 of the present embodiment can be more easily realized. For example, compared with a manner in which the preformed (cured) surrounding member 15 and the electronic component 13 are joined by an adhesive (this manner may also be included in the technique of the present disclosure), it is easier to form the surrounding member 15 having a shape corresponding to the shape of the electronic component 13, and it is easier to improve the adhesion between the electronic component 13 and the surrounding member 15. Further, by forming the wafer 65 by connecting a plurality of electronic components 13 to each other with a material used as the surrounding part 15, a plurality of electronic components 1 can also be manufactured simultaneously (formation of the rewiring layer 17, bonding of the body substrate 5 and the terminal substrate 7, and the like).

In addition, in the present embodiment, the material as the joining member 9 is a sheet in an uncured state.

In this case, for example, unlike an embodiment in which a liquid material is disposed as the bonding member 9 by screen printing (this embodiment may also be included in the technique of the present disclosure), a base material 57 (glass cloth or the like) as shown in fig. 5(c) may be disposed in the bonding member 9. In addition, for example, the diameter of the filler (glass frit 49, etc.) may be increased. As a result, for example, the linear expansion coefficient of the joint member 9 is reduced, and/or the strength of the joint member 9 is more easily increased.

< second embodiment >

Fig. 9 is a schematic cross-sectional view showing the structure of an electronic component 201 of the second embodiment, which corresponds to fig. 2 of the first embodiment.

In the first embodiment, both the electronic components 13A and 13B are electrically connected to the same external terminal 3 (3B in the example of fig. 2). In this embodiment, the electronic components 13A and 13B are also electrically connected to the external terminal 3B.

However, in the first embodiment, the two element terminals 21 electrically connected to the external terminals 3B of the electronic elements 13A and 13B are electrically connected to the terminal substrate 7 via different body terminals 35 a. In contrast, in the present embodiment, both the element terminals 21 (not shown here, refer to fig. 3 and 4) electrically connected to the external terminals 3B of the electronic elements 13A and 13B are electrically connected to the external terminals 3B through the same body terminals 35 a.

In other words, the electronic components 13A and 13B are connected to each other through the conductor layer 35 (more specifically, the conductor pattern formed by the wiring pattern 35B and the body terminal 35a) at least a part of which is located on the lower surface 15B of the surrounding part 15. From another point of view, the electronic components 13A and 13B share the body terminal 35a, the bump 11, and the pad 43.

Due to the above difference, in the present embodiment, the circuit from the pad 43 to the external terminal 3B in the terminal substrate 7 is also different from the first embodiment. Specifically, in the first embodiment, paths separated (at least partially) from each other are constituted from two pads 43 to the external terminal 3B, but in the present embodiment, one path is constituted from one pad 43 to the external terminal 3B.

In addition, in the first embodiment, the through hole 45 is provided for each electronic component 13, but in the present embodiment, a plurality of (two in the illustrated example) electronic components 13 are provided in common with the through hole 245. In other words, the through-holes 245 accommodate the bumps 11 corresponding to the plurality of electronic components 13. From another point of view, the engaging member 9 of the first embodiment has a plurality of through holes 45, while the engaging member 209 of the present embodiment has one through hole 245. The shape of the through-hole 245 may be an appropriate shape, for example, the two through-holes 45A and 45B of the first embodiment are connected (a shape in which a part or all of the isolation therebetween disappears).

As described above, in the present embodiment, the electronic component 201 includes the electronic element 13, the surrounding component 15, the terminal substrate 7, the bonding component 209, and the bump 11. In a top perspective view, at least a part of the through hole 245 overlaps the lower surface 15b of the surrounding member 15 (is located outside the electronic component 13). Therefore, the same effects as those of the first embodiment are obtained. For example, the degree of freedom in designing the through-hole 245 can be increased.

Further, in the present embodiment, the electronic component 1 includes: two or more electronic components 13A and 13B which are in close contact with the same surrounding member 15, and a conductor pattern (a body terminal 35a and a wiring pattern 35B) which is at least partially located on the second surface (lower surface 15B) of the surrounding member 15 and which connects the two or more electronic components 13A and 13B to each other.

Therefore, for example, in addition to protecting the electronic component 1 and improving the degree of freedom in designing the through hole 245, the surrounding component 15 also contributes to the arrangement of the conductor patterns connecting the electronic elements 13 to each other. This can simplify the structure of the terminal board 7, for example. In addition, for example, the influence of the terminal substrate 7 on the electrical connection of the electronic components 13A and 13B can be reduced. As a result, for example, variations in the electrical characteristics of the body substrate 5 before and after the body substrate 5 is mounted on the terminal substrate 7 are reduced.

< third embodiment >

Fig. 10 is a schematic cross-sectional view showing the structure of an electronic component 301 according to a third embodiment, which corresponds to fig. 2 of the first embodiment. Fig. 11 is a schematic top perspective view showing the structure of an electronic component 301, which corresponds to fig. 4 of the first embodiment.

In the first embodiment, each through hole 45 accommodates the bump 11 and overlaps with the vibration region 13c in a top perspective. On the other hand, in the present embodiment, the bonding members 309 have first through holes 345(345A and 345B) overlapping the vibration region 13c and second through holes 346A and 346B for accommodating the bumps 11, respectively. The first and second through holes 345 and 345B do not communicate with each other.

For example, the first through hole 345 is accommodated in the electronic component 13 in a top perspective. However, a portion of the first via 345 may be located outside the electronic element 13. For example, at least a part of the second through hole 346 is located outside the electronic component 13 (overlapping with the lower surface 15b of the surrounding member 15) in a top perspective view. In the illustrated example, the second through hole 346A corresponding to the electronic component 13A is entirely located outside the electronic component 13A. The second through hole 346B corresponding to the electronic component 13B has a portion located outside the electronic component 13B.

The shape and size of the first through-hole 345 and the second through-hole 346 may be appropriately set. For example, the shape may be rectangular, circular, elliptical, etc.

As described above, in the present embodiment, the electronic component 301 includes the electronic element 13, the surrounding component 15, the terminal substrate 7, the bonding component 309, and the bump 11. In a top perspective view, at least a part of the second through hole 346 overlaps the lower surface 15b of the surrounding member 15 (is located outside the electronic component 13). Therefore, the same effects as those of the first embodiment are obtained. For example, the degree of freedom in designing the second via 346 may be increased.

In addition, in the present embodiment, the bonding member 309 has the first through hole 345 overlapping the vibration region 13c in a top perspective view and the second through hole 346 accommodating the bump 11.

In this case, for example, as compared with the first embodiment, the area ratio occupied by the through-hole in the bonding member 309 can be reduced, and the reliability of the bonding between the body substrate 5 and the terminal substrate 7 can be improved. As a result, for example, reliability of the sealing property of the first through hole 345 overlapping the vibration region 13c can be improved. In addition, for example, since the vibration region 13c and the bump 11 are arranged in different through holes, the possibility that dust or the like generated around the bump 11 enters the vibration region 13c is reduced. In the region overlapping with the vibration region 13c, by improving the sealing property or reducing the probability of dust entering, the probability of the electrical characteristics of the vibration region 13c changing due to corrosion or the like can be reduced.

Further, in the above-described embodiment, the terminal substrate 7 is one example of a wiring substrate. The lower surface 13b of the electronic component 13 is an example of a first surface. The lower surface 15b of the surrounding part 15 is an example of the second surface. The combination surface 19 is an example of a third surface.

The technique of the present disclosure is not limited to the above embodiments, and can be implemented by various embodiments.

The above-described embodiments may be appropriately combined. For example, the structure in which the two electronic components 13A and 13B of the second embodiment are electrically connected to each other through the rewiring layer 17 can be applied to the first embodiment and the second embodiment.

Specifically, for example, in the embodiment in which the bonding member 9 of the first embodiment is provided, the body terminal 35a, the bump 11, and the pad 43 connected to the external terminal 3B on the electronic component 13A side may be removed, and the wiring pattern 35B connected to the electronic component 13A may be extended to the through hole 45B corresponding to the electronic component 13B, so that the body terminal 35a, the bump 11, and the pad 43 corresponding to the electronic component 13B may share the electronic component 13A. In contrast thereto, the wiring pattern 35B connected to the electronic component 13B may extend to the through hole 45A corresponding to the electronic component 13A.

In addition, for example, in the embodiment in which the bonding member 9 of the first embodiment or the bonding member 309 of the third embodiment is provided, the body terminals 35a, the bumps 11, and the lands 43 are not shared by the two electronic components 13A and 13B, and the two electronic components 13A and 13B may be electrically connected by providing the new wiring pattern 35B or the like that connects the body terminals 35a to each other.

For example, the through hole 245 provided in common in two or more electronic components 13 of the second embodiment may be applied to a mode in which the body terminal 35a, the bump 11, and the pad 43 are not shared between two electronic components 13, as in the first embodiment. In the second embodiment, in a top perspective view, the through holes overlapping both the vibration region 13c and the bump 11 are connected to form one through hole. Similarly, the first through holes 345 and the second through holes 346 in the third embodiment may be connected to each other.

The electronic component is not limited to the piezoelectric component or the elastic wave component. For example, the electronic element may be a semiconductor element (IC or the like), a resistive element, an inductor, or a capacitor. The piezoelectric element is not limited to the SAW element. For example, the piezoelectric element may be a piezoelectric thin Film Resonator (FBAR) or an elastic boundary wave element (however, included in a SAW element in a broad sense).

The wiring substrate is not limited to a terminal substrate for constituting a chip-type electronic component. For example, the wiring substrate may be used as a motherboard (main board) of an electronic apparatus such as a mobile apparatus.

Even if the through hole is located outside the electronic component in a top view, the bump, the body terminal and the land bonded to the bump, which are accommodated in the through hole, do not have to be located outside the electronic component. These can be accommodated in the electronic component in a top perspective.

In the present embodiment, the rewiring layer 17 is provided on the third surface (the build-up surface 19) so that the body terminals 35a included in the rewiring layer 17 are bonded to the pads 43 of the terminal substrate 7. However, such a rewiring layer 17 may not be provided, the element terminal 21 may be a body terminal, and the element terminal 21 and the pad 43 may be bonded by the bump 11.

Description of the symbols

1.. an electronic component, 7.. a terminal substrate (wiring substrate), 9.. a joining member, 11.. a bump, 13.. an electronic component, 13b.. a lower surface (first surface) of the electronic component, 15.. a surrounding member, 15b.. a lower surface (second surface) of the surrounding member, 19.. a combining surface (third surface), 45.. a through hole.