阅读说明：本技术 一种pcb型电流传感器配件及其生产方法、电流传感器 (PCB type current sensor accessory, production method thereof and current sensor ) 是由 刘亮 田新良 付伟 丁永良 于 2021-09-15 设计创作，主要内容包括：本发明涉及一种PCB型电流传感器配件及其生产方法、一种电流传感器,所述配件包括第一骨架、磁片、第二骨架及磁环,所述第二骨架内设有供所述磁片插入的插槽,所述磁环内设有供第二骨架插入的通道,所述第一骨架内设有供所述磁环插入的通道,所述第一骨架及所述第二骨架组装前表面需缠绕漆包线。通过在第二骨架内设有插槽,在组装过程中,磁片可通过插槽安装在第二骨架内,此工艺设计操作更简便,制备产品合格率高,降低了生产成本,提高了经济效益。(The invention relates to a PCB type current sensor accessory, a production method thereof and a current sensor, wherein the accessory comprises a first framework, a magnetic sheet, a second framework and a magnetic ring, wherein an inserting slot for the magnetic sheet to insert is arranged in the second framework, a channel for the second framework to insert is arranged in the magnetic ring, a channel for the magnetic ring to insert is arranged in the first framework, and enameled wires need to be wound on the surfaces of the first framework and the second framework before assembly. Through being equipped with the slot in the second skeleton, in the assembly process, the magnetic sheet accessible slot is installed in the second skeleton, and this process design operation is more simple and convenient, and the preparation product qualification rate is high, has reduced manufacturing cost, has improved economic benefits.)

1. The utility model provides a PCB type current sensor accessory, characterized in that, the accessory includes first skeleton (10), magnetic sheet (20), second skeleton (30) and magnetic ring (40), be equipped with in second skeleton (30) and supply magnetic sheet (20) male slot, be equipped with in magnetic ring (40) and supply second skeleton (30) male passageway, be equipped with in first skeleton (10) and supply magnetic ring (40) male passageway, first skeleton (10) and second skeleton (30) equipment front surface need twine the enameled wire.

2. The PCB type current sensor accessory of claim 1, wherein a second base (31) is fixed at the bottom of the second framework (30), and 2 second pins (32) are arranged at the bottom of the second base (31).

3. The PCB type current sensor accessory of claim 2, wherein a first base (11) is fixed at the bottom of the first framework (10), a groove attached to the second base (31) is arranged at the bottom of the first base (11), and 2 first pins (12) are arranged at the bottom of the first base (11).

4. A production method of a PCB type current sensor accessory is characterized by comprising the following steps:

(1) the first framework (10) is wound: winding the first framework (10) with enameled wires, sequentially winding head-to-tail taps on the first pins (12) and dip-soldering tin on the pins;

(2) assembling the magnetic sheet (20) on the second framework (30): inserting the magnetic sheet (20) into the slot of the second framework (30), inserting the magnetic sheet into the slot of the second framework in place, and fixing the magnetic sheet on a port point by using quick-drying glue;

(3) and (3) winding the second framework (30): winding the second framework (30) with enameled wires, sequentially winding head and tail taps on the second pins (32) and dip-soldering tin on the pins;

(4) assembling: the second framework (30) is sleeved in the magnetic ring (40), and then the magnetic ring (40) is sleeved in the first framework (10).

5. The method for producing a PCB type current sensor accessory according to claim 4, wherein the enameled wires used in the steps (1) and (3) are polyurethane enameled wires with corresponding specifications and corresponding turns ratios.

6. The method for producing a PCB type current sensor accessory of claim 4, wherein the dip soldering process in the step (1) and the step (3) is less than 3.5S, and the dip soldering temperature is maintained between 365 ℃ and 370 ℃.

7. The method for producing the PCB type current sensor accessory according to claim 4, wherein the first framework (10) and the second framework (30) are wound by a winding machine in the steps (1) and (3), and the winding speed is controlled within the range of 2000 rpm to 2500 rpm; the tension is controlled to be in the range of 4gf to 15 gf.

8. A method for producing a PCB type current sensor accessory according to claim 4, characterized in that the step (4) is carried out in such a way that the second base (31) is embedded in the recess of the first base (11) during the assembly process.

9. The method for producing the PCB type current sensor accessory of claim 4, wherein after any step of the steps (1) to (4) is finished, visual inspection and comprehensive test are carried out, and repairable unqualified semi-finished products are repaired, wherein the visual inspection is used for monitoring whether the semi-finished product line sequence is confused, and whether false welding burn exists in welding or not; the comprehensive test firstly detects whether the winding turn ratio of each group of coils is accurate or not, and secondly detects the pressure-resistant monitoring process, and mainly detects the outer layer winding (signal input coil).

10. A current sensor, wherein said voltage sensor comprises a PCB-type current sensor assembly of any one of claims 1-3, a control board, and a housing, said assembly being mounted on said control board, said housing enclosing said assembly and said control board.

Technical Field

The invention relates to the technical field of sensors, in particular to a PCB type current sensor accessory and a production method thereof.

Background

The current sensor is a detection device which can sense the information of the current to be detected and convert the sensed information into an electric signal meeting certain standards or other information in required forms according to a certain rule for output so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.

In the traditional production process of the current sensor accessories, the magnetic sheets are arranged in the grooves of the framework in a positioning mode, glue is coated on the surfaces of the magnetic sheets and baked to be solidified, the process flow is complex, the manufacturing process is complex, the glue coating and assembling operation difficulty is high, the labor cost and the time cost in the production process of the current sensor are increased, the defective rate of the prepared current sensor accessories and products is high, and meanwhile the risk of potential electrical performance hazards is easy to occur.

Disclosure of Invention

It is an object of the present invention to provide a PCB-type current sensor assembly that solves the above-mentioned problems.

The scheme for solving the technical problems is as follows: the current sensor accessory comprises a first framework, a magnetic sheet, a second framework and a magnetic ring, wherein slots for the magnetic sheet to insert are formed in the second framework, channels for the second framework to insert are formed in the magnetic ring, channels for the magnetic ring to insert are formed in the first framework, and enameled wires need to be wound on the front surfaces of the first framework and the second framework before assembly.

The invention has the beneficial effects that: the magnetic sheet is arranged in the second framework, the magnetic sheet can be inserted into the second framework through the slot during assembly, and compared with the structure that the magnetic sheet is arranged in the groove of the framework according to positioning, the structural design is simpler and more convenient to operate, the qualification rate of the prepared product is high, the production cost is reduced, and the economic benefit is improved.

On the basis of the technical scheme, the invention can be further improved as follows.

Further, second skeleton bottom is fixed with the second base, second base bottom is equipped with 2 second pins.

Further, first skeleton bottom is fixed with first base, first base bottom be equipped with the recess of second base laminating, first base bottom is equipped with 2 first pins.

The beneficial effect of adopting the further scheme is that: through first base bottom be equipped with the recess of second base laminating makes first skeleton and the equipment of second skeleton are more convenient to be fixed a position, do not produce the skew to make the precision decline of sensor.

The invention also provides a production method of the PCB type current sensor accessory, which comprises the following steps:

(1) winding a first framework: the first framework is wound with the enameled wire, head and tail taps are sequentially wound on the first pins, and the pins are dip-welded with tin;

(2) assembling magnetic sheets on the second framework: inserting the magnetic sheet into the second framework slot, inserting the magnetic sheet into the second framework slot in place, and fixing the magnetic sheet on the port by using quick-drying glue;

(3) and (3) winding a second framework: the second framework is wound with the enameled wire, head and tail taps are sequentially wound on the second pins, and the pins are dip-welded with tin;

(4) assembling: sleeving the second framework in the magnetic ring, and then sleeving the magnetic ring in the first framework;

on the basis of the technical scheme, the invention can be further improved as follows.

Further, the enameled wires used in the step (1) and the step (3) are polyurethane enameled wires with corresponding specifications and corresponding turn ratios.

The beneficial effect of adopting the further scheme is that: the paint film of the polyurethane enameled wire is heated and cracked into volatile substances with low relative molecular mass, so that the paint film is damaged and tin is coated on the winding wire. Therefore, when the polyurethane enameled wire needs dip-welding, the coating does not need to be removed in advance, the production method of the winding wire is simplified, and the production efficiency is effectively improved.

Further, the dip soldering process in the step (1) and the step (3) is less than 3.5S, and the dip soldering temperature is maintained between 365 ℃ and 370 ℃.

The beneficial effect of adopting the further scheme is that: sufficient welding can be guaranteed through suitable welding temperature and time, so that the joints are completely fused together, false welding can occur due to too low temperature, the temperature is too high, and a framework rubber part can be scalded due to too long time.

Further, in the step (1) and the step (3), the first framework and the second framework are wound by a winding machine, and the winding speed is controlled within the range of 2000 rpm-2500 rpm; the tension is controlled to be in the range of 4gf to 15 gf.

The beneficial effect of adopting the further scheme is that: through the tensile size and the wire winding speed of regulation unwrapping wire ware to reach coil and arrange closely to have, be unlikely to each layer of wire winding, appear wire jumper, fold line and the too big wearing and tearing of tension scraping lacquer rete damaged condition, guarantee wire winding quality, improve the sensor precision.

Further, in the step (4), the second base needs to be embedded into the groove of the first base in the assembling process.

The beneficial effect of adopting the further scheme is that: through when the recess more conveniently assembles first skeleton with second skeleton location assembly does not take place the skew, improves the stability and the accuracy of sensor.

Further, after any step of the steps (1) to (4) is finished, visual inspection and comprehensive test are required, repairable unqualified semi-finished products are repaired, and the visual inspection is mainly used for monitoring whether the line sequence of the semi-finished products is mixed or not, whether false welding or scalding occurs in welding or not and the like; the comprehensive test firstly detects whether the winding turn ratio of each group of coils is accurate or not, and secondly detects the pressure-resistant monitoring process, and mainly detects the outer layer winding (signal input coil).

The beneficial effect of adopting the further scheme is that: after the steps are completed, the quality and the appearance are controlled, the repairable unqualified semi-finished products are repaired, and the defect flowing into the next procedure is avoided.

A third object of the present invention is to provide a current sensor: the current sensor comprises a PCB type current sensor accessory, a control panel and a shell, wherein the accessory is installed on the control panel, and the shell is arranged on the accessory and the control panel.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:

fig. 1 is a schematic diagram of components of a PCB-type current sensor according to an embodiment of the present invention when the current sensor is not assembled;

FIG. 2 is a schematic flow chart of the production process in example 1 of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

10. a first skeleton; 11. a first base; 12. a first pin; 20. a magnetic sheet; 30. a second skeleton; 31. a second base; 32. a second pin; 40. a magnetic ring.

Detailed Description

The principles and features of the present invention are described below in conjunction with the accompanying fig. 1-2, which are provided as examples to illustrate the invention and not to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

In the present invention, the sequence of step (1) to step (4) is not limited.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1-2, the present invention provides a current sensor, which includes a PCB-type current sensor assembly, a control board, and a housing, wherein the PCB-type current sensor assembly is mounted on the control board, and the housing is wrapped around the assembly and the control board.

The PCB type current sensor accessory comprises a first framework 10, a magnetic sheet 20, a second framework 30 and a magnetic ring 40, wherein slots for inserting the magnetic sheet 20 are formed in the second framework 30, channels for inserting the second framework 30 are formed in the magnetic ring 40, channels for inserting the magnetic ring 40 are formed in the first framework 10, and enameled wires need to be wound on the front surfaces of the first framework 10 and the second framework 30 in an assembling mode.

Preferably, a second base 31 is fixed at the bottom of the second framework 30, and 2 second pins 32 are arranged at the bottom of the second base 31.

Preferably, first skeleton 10 bottom is fixed with first base 11, and first base 11 bottom is equipped with the recess of laminating with second base 31, and first base 11 bottom is equipped with 2 first pins 12.

The slots are arranged in the second framework 30, and the magnetic sheets 20 are inserted into the second framework 30 through the slots, so that compared with a process of arranging the magnetic sheets into the grooves of the frameworks according to positioning, the process design is simpler and more convenient to operate, the qualification rate of prepared products is high, the production cost is reduced, and the economic benefit is improved; the bottom of the first base 11 is provided with a groove attached to the second base 31, so that the first framework 10 and the second framework 30 are more conveniently assembled and positioned without deviation; the first framework 10 and the second framework 30 are installed on the control panel through the first pins 12 and the second pins 32, so that deviation and shaking are not easy to generate, and the stability and accuracy of the sensor are ensured.

A production method of a PCB type current sensor fitting comprises the following steps:

(1) the first framework 10 is wound: the first framework 10 winds the enameled wire, head and tail taps sequentially wind the first pins 12, and the pins are dip-welded with tin;

(2) the second frame 30 is equipped with the magnetic sheet 20: inserting the magnetic sheet 20 into the slot of the second framework 30, inserting and installing in place, then fixing the magnetic sheet by quick-drying adhesive at the port, sequentially performing visual inspection and comprehensive test on the semi-finished product after the step is finished, and repairing the repairable unqualified semi-finished product;

(3) and (3) winding the second framework 30: the second framework 30 is wound with enameled wires, head and tail taps are sequentially wound on the second pins 32 and tin is dip-welded on the pins, then visual inspection and comprehensive test are sequentially carried out on the semi-finished products after the steps are finished, and repairable unqualified semi-finished products are repaired;

(4) assembling: sleeving the second framework 30 in the magnetic ring 40, sleeving the magnetic ring 40 in the first framework 10, controlling the matching distance and the matching direction in the assembling process, monitoring whether the assembling part has the phenomena of reverse direction and clamping failure, repairing the repairable unqualified semi-finished product, stopping the bad products from flowing into the next procedure, sequentially performing visual inspection and comprehensive test on the semi-finished product which is subjected to the step, and repairing the repairable unqualified semi-finished product;

preferably, the enameled wires used in the step (1) and the step (3) are polyurethane enameled wires with corresponding specifications and corresponding turn ratios. The paint film of the polyurethane enameled wire is heated and cracked into volatile substances with low relative molecular mass, so that the paint film is damaged and tin is coated on the winding wire. Therefore, when the polyurethane enameled wire needs dip-welding, the coating does not need to be removed in advance, the production method of the winding wire is simplified, and the production efficiency is effectively improved.

Preferably, the dip soldering process in the step (1) and the step (3) does not exceed 3.5S, and the dip soldering temperature is maintained between 365 ℃ and 370 ℃. Sufficient welding can be guaranteed through suitable welding temperature and time, so that the joints are completely fused together, false welding can occur due to too low temperature, the temperature is too high, and a framework rubber part can be scalded due to too long time.

Preferably, in the steps (1) and (3), the first framework 10 and the second framework 30 are wound by a winding machine, and the winding speed is controlled within the range of 2000 rpm-2500 rpm; the tension is controlled to be in the range of 4gf to 15 gf. Through the tensile size and the wire winding speed of regulation unwrapping wire ware to reach coil and arrange closely to have, be unlikely to each layer of wire winding, appear wire jumper, fold line and the too big wearing and tearing of tension scraping lacquer rete damaged condition, guarantee wire winding quality, improve the sensor precision.

Preferably, step (4) requires the second base 31 to be inserted into the groove of the first base 11 during the assembly process. First skeleton 10 and second skeleton 30 location assembly when more conveniently assembling through the recess, do not take place the skew, improve the stability and the accuracy of sensor.

The specific working principle and the using method of the invention are as follows: the slot is arranged in the second framework 30, and the magnetic sheet 20 can be assembled with the second framework 30 through the slot, so that the design simplifies the operation, improves the product qualification rate, and reduces the production cost. In the production process, enameled wires are wound on the surfaces of the first framework 10 and the second framework 30 assembled with the magnetic sheet 20, head and tail taps are sequentially wound on the first pins 12 and the second pins 32, the pins are soldered with tin, then the magnetic ring 40 is sleeved in the first framework 10, the second framework 30 is sleeved in the magnetic ring 40, and a qualified finished product through comprehensive test is the PCB type current sensor accessory. And mounting the accessory on a control board, and then mounting a shell, wherein a finished product after the test is qualified is the current sensor.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; the present invention may be readily implemented by those of ordinary skill in the art as illustrated in the accompanying drawings and described above; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the scope of the invention as defined by the appended claims; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.