阅读说明：本技术 一种电路板组件及电子设备 (Circuit board assembly and electronic equipment ) 是由 史鹏飞 叶鹏 杨森 于 2021-07-09 设计创作，主要内容包括：本申请涉及电路板组件和电子设备,电路板组件包括：电路板；通孔回流器件,通孔回流器件与电路板焊接；支撑件,沿电路板组件的厚度方向,支撑件支撑于通孔回流器件与电路板之间。能够将通孔回流器件相对于电路板的位置抬高,当通孔回流器件的引脚与电路板焊接时,能够抬高引脚与电路板焊接的位置,使得引脚长度较大的通孔回流器件不仅能够适用于厚度较大的电路板,还能够适用于厚度较小的电路板,提高通孔回流器件的适用性,降低重新设计通孔回流器件所需的成本和周期。同时,还能够促进引脚与电路板之间的接触位置居中,提高通孔回流器件与电路板之间的焊接可靠性,并抬高通孔回流器件的插口的位置,从而便于用户使用。(The application relates to a circuit board assembly and an electronic device, the circuit board assembly includes: a circuit board; the through hole reflow device is welded with the circuit board; and the supporting piece is supported between the through hole reflow device and the circuit board along the thickness direction of the circuit board assembly. Can raise the position of through-hole backward flow device for the circuit board, when the pin of through-hole backward flow device and circuit board welding, can raise pin and circuit board welded position for the great through-hole backward flow device of pin length not only can be applicable to the great circuit board of thickness, can also be applicable to the less circuit board of thickness, improves the suitability of through-hole backward flow device, reduces required cost and the cycle of redesign through-hole backward flow device. Simultaneously, can also promote the contact position between pin and the circuit board between central, improve the welding reliability between through-hole backward flow device and the circuit board to raise the position of the socket of through-hole backward flow device, thereby the user of being convenient for uses.)

1. A circuit board assembly, comprising:

a circuit board;

a through-hole reflow device soldered to the circuit board;

and the supporting piece is supported between the through hole reflow device and the circuit board along the thickness direction of the circuit board assembly.

2. The circuit board assembly of claim 1, wherein the via reflow device includes a body portion and a pin, the pin is soldered to the circuit board, and the support is supported between the body portion and the circuit board.

3. The circuit board assembly of claim 2, wherein the body portion includes a transition portion connected to and bent with respect to the pin;

the support is supported between the transition portion and the circuit board.

4. A circuit board assembly according to claim 3, wherein the body portion is parallel to the circuit board.

5. The circuit board assembly according to claim 4, wherein the leads include a plurality of first leads and a plurality of second leads, and a size of the first leads is larger than a size of the second leads in a thickness direction of the circuit board assembly;

the transition part comprises a first transition part connected with the first pin and a second transition part connected with the second pin;

a first supporting piece is arranged between at least part of the first transition part and the circuit board, and/or a second supporting piece is arranged between at least part of the second transition part and the circuit board;

the thicknesses of the first supporting pieces are the same, the thicknesses of the second supporting pieces are the same, and the thicknesses of the first supporting pieces are larger than the thicknesses of the second supporting pieces.

6. A circuit board assembly according to claim 3, wherein the body portion is arranged obliquely to the circuit board along a plane perpendicular to a thickness direction of the circuit board assembly.

7. The circuit board assembly of claim 6, wherein the angle of inclination of the via reflow device is 0.5 ° to 2 °.

8. The circuit board assembly of claim 6, wherein the body portion includes a plurality of the transition portions, and wherein the support is disposed between a portion of the transition portions and the circuit board to tilt the through hole reflow device.

9. The circuit board assembly according to claim 6, wherein the pins comprise a plurality of first pins and a plurality of second pins, and the size of the first pins is larger than that of the second pins along the thickness direction of the circuit board assembly;

the body portion further comprises a socket, and the second pin is located between the socket and the first pin along a first direction;

the transition part comprises a first transition part connected with the first pin and a second transition part connected with the second pin, and the supporting piece is arranged between the second transition part and the circuit board.

10. The circuit board assembly according to any one of claims 2 to 9, wherein the circuit board is provided with a through hole, and a part of the pin extends into the through hole and is welded with a side wall of the through hole;

the circuit board is provided with a first surface and a second surface which are oppositely arranged along the thickness direction of the circuit board assembly, the first surface is positioned at one end far away from the through hole reflow device, and the pin does not exceed the first surface.

11. The circuit board assembly according to any one of claims 1 to 9, wherein the support member is at least one of a metal member, a non-metal member, or an electronic component.

12. The circuit board assembly according to any one of claims 1 to 9, wherein the support member is bonded or soldered to the through-hole reflow device;

the supporting piece and the circuit board are bonded or welded.

13. An electronic device, characterized in that the electronic device comprises:

a housing;

a circuit board assembly according to any one of claims 1 to 12;

wherein the circuit board assembly is mounted to the housing.

Technical Field

The application relates to the technical field of electronic equipment, in particular to a circuit board assembly and electronic equipment.

Background

In the electronic assembly process, the mounted electronic components mainly include a chip component and a plug-in component, and the conventional reflow soldering technology is adopted for soldering the plug-in component, and the plug-in component is usually arranged on the circuit board through a through-hole reflow device. At present, as electronic equipment develops towards the direction of light and thin, the thickness of a circuit board becomes thinner and thinner, and the length of a pin of a through hole reflow device welded with the circuit board cannot be overlong, so that the application range of the through hole reflow device with longer pin length is greatly reduced, the period required for redeveloping a new through hole reflow device is longer, and the cost is higher.

Disclosure of Invention

The embodiment of the application provides a circuit board assembly and electronic equipment, which can improve the applicability of a through hole backflow device and reduce the cost.

In a first aspect, an embodiment of the present application provides a circuit board assembly, including: a circuit board; the through hole reflow device is welded with the circuit board; and the supporting piece is supported between the through hole reflow device and the circuit board along the thickness direction of the circuit board assembly.

In this application embodiment, when supporting circuit board and through-hole backward flow device along thickness direction through support piece, can raise the position of through-hole backward flow device for the circuit board, when the pin of through-hole backward flow device and circuit board welding, can raise the position of pin and circuit board welding, make the great through-hole backward flow device of pin length not only can be applicable to the great circuit board of thickness, can also be applicable to the less circuit board of thickness, improve the suitability of through-hole backward flow device, reduce the required cost and the cycle of redesign through-hole backward flow device. Meanwhile, when the circuit board and the through hole reflow device are supported along the thickness direction through the support, the contact position between the pin and the circuit board can be promoted to be centered, the welding reliability between the through hole reflow device and the circuit board is improved, and in addition, the position of a socket (such as TYPEC of electronic equipment) of the through hole reflow device can be raised, so that the use by a user is facilitated.

In one possible embodiment, the through-hole reflow device includes a body portion and a pin, the pin is soldered to the circuit board, and the support is supported between the body portion and the circuit board. At this time, the support can be prevented from affecting the soldering between the pin and the circuit board.

In one possible embodiment, the body portion includes a transition portion, the transition portion is connected with the pin and is bent relative to the pin; the supporting part is supported between the transition part and the circuit board.

In one possible embodiment, the body portion is parallel to the circuit board. In the embodiment of the application, after setting up support piece, each position of through-hole backward flow device is all raised, this somatic part and pin are all raised promptly, and each position of this somatic part is raised highly the same, thereby make after raising that this somatic part is still parallel with the circuit board, at this moment, make the position of other electronic component of being connected with circuit board assembly's through-hole backward flow device also raised, when this through-hole backward flow device has the socket, thereby the high rising of this socket promotes the socket central, convenient to use of user.

In one possible embodiment, the pins comprise a plurality of first pins and a plurality of second pins, and the size of the first pins is larger than that of the second pins along the thickness direction of the circuit board assembly; the transition part comprises a first transition part connected with the first pin and a second transition part connected with the second pin; first supporting pieces are arranged between at least part of the first transition parts and the circuit board, and/or second supporting pieces are arranged between at least part of the second transition parts and the circuit board; the thickness of each first supporting piece is the same, the thickness of each second supporting piece is the same, and the thickness of the first supporting piece is greater than that of the second supporting piece.

In this embodiment, when the first support members are disposed between the at least two first transition portions and the circuit board, and no support member is disposed between the second transition portion and the circuit board, the raised dimension of the through hole reflow device is equal to the thickness of the first support member, and when the thicknesses of the first support members are the same, the raised dimensions of the through hole reflow device are the same, that is, the body portion is parallel to the circuit board; when the second supporting pieces are arranged between the at least two second transition parts and the circuit board, and the supporting pieces are not arranged between the first transition parts and the circuit board, the raised size of the through hole reflow device is equal to the thickness of the second supporting pieces, and when the thicknesses of the second supporting pieces are the same, the raised sizes of all the parts of the through hole reflow device are the same, namely the body part is parallel to the circuit board; when the first supporting piece is arranged between the at least two first transition portions and the circuit board, the second supporting piece is arranged between the at least two second transition portions and the circuit board, and the thickness of the first supporting piece is larger than that of the second supporting piece, the height of the through hole reflow device which is lifted up is the thickness of the second supporting piece, so that the body portion is parallel to the circuit board.

In a possible embodiment, the body portion is arranged obliquely with respect to the circuit board along a plane perpendicular to the thickness direction of the circuit board assembly. In this embodiment, after the support member is provided, the pins of the through-hole reflow device are raised, so that the pins with larger size can still be used for the circuit board with smaller thickness. Meanwhile, one part of the body part in the through hole reflow device is lifted, and the other part is not lifted, or all the positions of the body part in the through hole reflow device are lifted, and the lifted heights of all the positions are different, so that the body part is inclined relative to the circuit board after the lifting. At this time, a part of the position of the through-hole reflow device is raised, so that the position of other electronic components connected to the position is also raised, and when the through-hole reflow device has a socket, the height of the socket is raised, which is convenient for a user to use.

In one possible embodiment, the angle of inclination α of the via reflow device is 0.5 ° to 2 °. In this embodiment, when the inclination angle α of the through hole reflow device is too large (for example, greater than 2 °), a part of the through hole reflow device is raised too high, that is, the raised height of the pin of the part is too large, and there is a problem that the contact area between the pin and the circuit board is too small, which results in too low connection reliability; when the inclination angle α of the through hole reflow device is too small (for example, less than 0.5 °), the height at which a part of the through hole reflow device is raised is too small, and the socket cannot be raised to a preset position, resulting in poor appearance performance of the electronic device. Therefore, when the inclination angle alpha of the through hole reflux device is 0.5-2 degrees, the part of the through hole reflux device can be raised to the preset height while the welding reliability between the pin of the through hole reflux device and the circuit board is high, so that the user requirements are met.

In one possible embodiment, the body portion includes a plurality of transition portions, and a support is disposed between a portion of the transition portions and the circuit board to tilt the through-hole reflow device.

In one possible embodiment, the pins comprise a plurality of first pins and a plurality of second pins, and the size of the first pins is larger than that of the second pins along the thickness direction of the circuit board assembly; the body part further comprises a socket, and the second pin is positioned between the socket and the first pin along the first direction; the transition part comprises a first transition part connected with the first pin and a second transition part connected with the second pin, and a support part is arranged between the second transition part and the circuit board.

In this embodiment, along the first direction, the second transition portion is closer to the socket than the first transition portion, so that when the supporting member is disposed between the at least two second transition portions and the circuit board, the second transition portion is lifted and drives the socket to be lifted, and the first transition portion is not lifted, so that the main body of the through-hole reflow device is inclined relative to the circuit board.

In one possible embodiment, the circuit board is provided with a through hole, and a part of the pin extends into the through hole and is welded with the side wall of the through hole; the circuit board is provided with a first surface and a second surface which are oppositely arranged along the thickness direction of the circuit board assembly, the first surface is positioned at one end far away from the through hole reflow device, and the pin does not exceed the first surface.

In this embodiment, the first surface of the circuit board, which is far away from the through-hole reflow device, needs to be brushed with tin in order to be soldered with other components, and when the first surface is uneven, there is a risk of detinning, resulting in lower reliability of soldering between the circuit board and other components. When the pin of the through hole reflow device does not exceed the first surface, detinning caused by the protrusion of the pin on the first surface can be prevented, thereby improving the welding reliability between the circuit board and other components.

In one possible embodiment, the support is at least one of a metallic member, a non-metallic member, or an electronic component.

In a possible embodiment, the support is bonded or soldered to the through-hole reflow device; the supporting piece and the circuit board are bonded or welded.

In a second aspect, an embodiment of the present application provides an electronic device, including: a housing; the circuit board assembly is the circuit board assembly above; wherein the circuit board assembly is mounted to the housing.

In the embodiment of the application, when supporting circuit board and through-hole backward flow device of circuit board subassembly through support piece along thickness direction, can raise the position of through-hole backward flow device for the circuit board, when the pin of through-hole backward flow device and circuit board welding, can raise pin and circuit board welded position, make the great through-hole backward flow device of pin length not only can be applicable to the great circuit board of thickness, can also be applicable to the less circuit board of thickness, improve the suitability of through-hole backward flow device, reduce the required cost and the cycle of redesign through-hole backward flow device, reduce electronic equipment's cost. Meanwhile, when the circuit board and the through hole backflow device are supported in the thickness direction through the supporting piece, the contact position between the pin and the circuit board can be promoted to be centered, the welding reliability between the through hole backflow device and the circuit board is improved, and in addition, the position of a socket (such as TYPEC of the electronic equipment) of the through hole backflow device in the electronic equipment can be raised, so that the use of a user is facilitated, and the use experience of the electronic equipment is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

FIG. 1 is a schematic diagram of a circuit board assembly provided herein in a first embodiment;

FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;

FIG. 3 is a front view of FIG. 1;

FIG. 4 is a schematic structural view of the through-hole reflow device and the support member of FIG. 1;

FIG. 5 is a schematic structural diagram of a circuit board assembly provided herein in a second embodiment;

FIG. 6 is a top view of FIG. 5;

FIG. 7 is a schematic diagram of the relative positions of the circuit board and the through-hole reflow device of FIG. 5;

FIG. 8 is a sectional view taken along line A-A of FIG. 6;

FIG. 9 is a sectional view taken along line B-B of FIG. 6;

FIG. 10 is a schematic view of the structure of the through-hole reflow device and the support member of FIG. 5;

FIG. 11 is a schematic illustration showing the positions of the through-hole reflow device and the support member of FIG. 1, wherein the support member is a metal member;

fig. 12 is a schematic diagram of the positions of the via reflow device and the support in fig. 1, wherein the support is an electronic component;

fig. 13 is a schematic view of the relative positions of the hole reflow device and the support member of fig. 5, wherein the support member is a metal member.

Reference numerals:

1-a circuit board;

11-a through hole;

12-a first surface;

13-a second surface;

2-a via reflow device;

21-a body portion;

211-a transition;

211 a-first transition;

212 a-a second transition;

212-a socket;

22-pin;

221-a first pin;

222-a second pin;

3-a support member.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Detailed Description

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

In one embodiment, the present application is described in further detail below with reference to specific embodiments and accompanying drawings.

The embodiment of the application provides a Circuit Board assembly, fig. 1 and fig. 2 show the structure of the Circuit Board assembly, the Circuit Board assembly includes a Circuit Board 1 and a through-hole reflow device 2, wherein the Circuit Board 1 may specifically be a Printed Circuit Board (PCB), the through-hole reflow device 2 (the structure in the dashed line frame in fig. 1 and fig. 2) is used for installing an insertion component on the Circuit Board 1, and the Circuit Board 1 and the through-hole reflow device 2 are soldered by a pin 22, thereby realizing that the external insertion component is electrically connected with the Circuit Board 1, and the soldering between the through-hole reflow device 2 and the Circuit Board 1 may specifically adopt a reflow soldering technique.

Meanwhile, a front view of the circuit board assembly is shown in fig. 3, the circuit board assembly further includes a support member 3, and the support member 3 is supported between the through-hole reflow device 2 and the circuit board 1 in a thickness direction Z of the circuit board assembly.

In this embodiment, when supporting circuit board 1 and through-hole backward flow device 2 along thickness direction Z through support piece 3, can raise through-hole backward flow device 2 for the position of circuit board 1, when pin 22 of through-hole backward flow device 2 and circuit board 1 weld, can raise the position of pin 22 and circuit board 1 welding, even make the great through-hole backward flow device 2 of pin 22 length not only can be applicable to the great circuit board 1 of thickness, can also be applicable to the less circuit board 1 of thickness, improve the suitability of through-hole backward flow device 2, reduce the required cost of redesign through-hole backward flow device 2 and cycle. Meanwhile, when the circuit board 1 and the through-hole reflow device 2 are supported by the support 3 in the thickness direction Z, the contact position between the pins 22 and the circuit board 1 can be centered, the soldering reliability between the through-hole reflow device 2 and the circuit board 1 can be improved, and in addition, the position of the socket 212 (e.g., a TYPEC port of the electronic device) of the through-hole reflow device 2 can be raised, so that the appearance performance of the electronic device can be improved, and the use by a user is facilitated.

Specifically, in the circuit board assembly shown in fig. 2 and 3, the circuit board 1 is provided with a through hole 11, and a part of the pin 22 extends into the through hole 11 and is soldered to a side wall of the through hole 11; along the thickness direction Z of the circuit board assembly, the circuit board 1 has a first surface 12 and a second surface 13 which are oppositely arranged, the first surface 12 is located at one end far away from the through hole reflow device 2, and the pins 22 do not exceed the first surface 12.

In this embodiment, the first surface 12 of the circuit board 1, which is away from the through-hole reflow device 2, needs to be brushed with tin in order to be soldered with other components, and when the first surface 12 is uneven, there is a risk of detinning, resulting in low reliability of soldering between the circuit board 1 and other components. When the leads 22 of the through-hole reflow device 2 do not exceed the first surface 12, detinning caused by the leads 22 protruding from the first surface 12 can be prevented, thereby improving the soldering reliability between the circuit board 1 and other components.

In addition, in the present application, by providing the support 3 between the circuit board 1 and the via reflow device 2, so as to raise the position of the via reflow device 2, it is achieved that the pins 22 of the via reflow device 2 do not extend beyond the first surface 12.

Specifically, in the circuit board assembly shown in fig. 3, the through-hole reflow device 2 includes a body portion 21, the body portion 21 is a main structure of the through-hole reflow device 2, the pins 22 are connected to the body portion 21, and the support 3 is supported between the body portion 21 and the circuit board 1.

In this embodiment, when the supporting member 3 is supported between the body 21 and the circuit board 1 instead of between the pins 22 and the circuit board 1, the supporting member 3 does not occupy the space between the pins 22 and the circuit board 1, and the supporting member 3 can be prevented from affecting the soldering between the pins 22 and the circuit board 1.

More specifically, as shown in fig. 1, 3 and 4, wherein fig. 1 and 3 show the structure of a circuit board assembly, fig. 4 shows a specific structure of the via reflow device 2 in fig. 1 and 3. In the through hole reflow device 2, the body portion 21 includes a transition portion 211, the transition portion 211 is connected to the pin 22 and is bent relative to the pin 22, wherein the transition portion 211 is used for connecting the pin 22 of the through hole reflow device 2 and the body portion 21, so as to realize the bending of the pin 22, so that the pin 22 is soldered to the circuit board 1; the support 3 is supported between the transition portion 211 and the circuit board 1, thereby raising the position of the transition portion 211 relative to the circuit board 1 and thus raising the position of the pins 22 connected to the transition portion 211.

In a specific embodiment, in the circuit board assembly shown in fig. 3, the body portion 21 of the through-hole reflow device 2 is parallel to the circuit board 1, that is, after the support 3 is disposed, each position of the through-hole reflow device 2, that is, the body portion 21 and the pins 22, are raised, and the height of the body portion 21 is the same, so that the body portion 21 is parallel to the circuit board 1 after the raising, and at this time, the position of other electronic components connected to the through-hole reflow device 2 of the circuit board assembly is also raised, and when the through-hole reflow device 2 has the socket 212, the height of the socket 212 is raised, for example, when the socket 212 is a TYPEC interface of an electronic device, the TYPEC interface is raised relative to a center, the appearance performance of the electronic device is improved, and the use by a user is facilitated.

Specifically, as shown in the circuit board assembly in fig. 3 and the via reflow device 2 in fig. 4, the leads 22 of the via reflow device 2 include a plurality of first leads 221 and a plurality of second leads 222, and along the thickness direction Z of the circuit board assembly, the size of the first leads 221 is larger than that of the second leads 222, that is, the height of the first leads 221 is larger than that of the second leads 222; the transition part 211 includes a first transition part 211a connected to the first lead 221 and a second transition part 211b connected to the second lead 222, and since the height of the first lead 221 is greater than that of the second lead 222, the height of the first transition part 211a is greater than that of the second transition part 211 b.

At this time, a first supporting member is disposed between the at least two first transition portions 211a and the circuit board 1, and/or a second supporting member is disposed between the at least two second transition portions 211b and the circuit board 1, the thicknesses of the first supporting members are the same, the thicknesses of the second supporting members are the same, and the thickness of the first supporting member is greater than the thickness of the second supporting member, so that the main body 21 is parallel to the circuit board 1.

In this embodiment, when the first support members are disposed between the at least two first transition portions 211a and the circuit board 1, and the support member 3 is not disposed between the second transition portion 211b and the circuit board 1, the raised dimension of the through hole reflow device 2 is equal to the thickness of the first support member, and when the thicknesses of the first support members are the same, the raised dimensions of the through hole reflow device 2 are the same, that is, the main body 21 is parallel to the circuit board 1; when the second supports are arranged between the at least two second transition portions 211b and the circuit board 1, and the support 3 is not arranged between the first transition portion 211a and the circuit board 1, the raised dimension of the through hole reflow device 2 is equal to the thickness of the second supports, and when the thicknesses of the second supports are the same, the raised dimensions of the through hole reflow device 2 are the same, that is, the body portion 21 is parallel to the circuit board 1; when a first support member is disposed between the at least two first transition portions 211a and the circuit board 1, and a second support member is disposed between the at least two second transition portions 211b and the circuit board 1, and the thickness of the first support member is greater than that of the second support member, the height at which the through hole reflow device 2 is lifted can be the thickness of the second support member, so that the body portion 21 is parallel to the circuit board 1.

As shown in fig. 4, in the through hole reflow device 2, the through hole reflow device 2 includes two first pins 221 and two second pins 222, and correspondingly, includes two first transition portions 211a and two second transition portions 211b, and a support 3 with the same thickness is disposed between the two second transition portions 211b and the circuit board 1, so that the through hole reflow device 2 is raised by the height of the thickness of the support 3. In addition, the first pins 221 and the second pins 222 are arranged side by side, so that the first transition portion 211a is located above the second transition portion 211b, when the through hole reflow device 2 is soldered to the circuit board 1, as shown in fig. 1, the adjacent first pins 221 and second pins 222 are located in the same through hole 11, and at this time, the circuit board 1 only needs to be provided with two through holes 11 soldered to the through hole reflow device 2. Or, each pin 22 of the through hole reflow device 2 may be staggered, so that the first transition portion 211a and the second transition portion 211b are staggered, when the through hole reflow device 2 is soldered to the circuit board 1, the circuit board 1 needs to be provided with four through holes 11, and the four pins 22 respectively extend into the corresponding through holes 11, thereby realizing soldering.

In another embodiment, fig. 5 and 6 show a schematic structural view of a circuit board assembly in another embodiment, the body portion 21 is arranged obliquely with respect to the circuit board 1 along a plane perpendicular to the thickness direction Z of the circuit board assembly, i.e. after the support 3 is arranged, the pins 22 of the through-hole reflow device 2 are raised, so that the pins 22 with larger dimensions can still be used for circuit boards 1 with smaller thickness. Meanwhile, a part of the body portion 21 of the through-hole reflow device 2 is raised and the other part is not raised, or each position of the body portion 21 of the through-hole reflow device 2 is raised and the raised heights of the positions are different, so that the body portion 21 is inclined with respect to the circuit board 1 after the raising, and at this time, the relative positions of the through-hole reflow device 2 and the circuit board 1 are as shown in fig. 7. At this time, a portion of the position of the through-hole reflow device 2 is raised, so that the position of other electronic components connected to the position is also raised, and when the through-hole reflow device 2 has the socket 212, the height of the socket 212 is raised, for example, when the socket 212 is a TYPEC interface of an electronic device, so that the TYPEC interface is raised with respect to the position of the middle frame, thereby facilitating centering of the TYPEC interface, improving the appearance performance of the electronic device, and facilitating the use of a user.

Specifically, as shown in the positional relationship between the through hole reflow device 2 and the circuit board 1 shown in fig. 7, the through hole reflow device 2 is inclined with respect to the circuit board 1, and the inclination angle α is 0.5 ° to 2 °, for example, the inclination angle α may specifically be: 0.5 °, 1 °, 1.5 °, 2 °, etc.

In this embodiment, when the inclination angle α of the through hole reflow device 2 is too large (for example, greater than 2 °), a part of the through hole reflow device 2 is raised too high, that is, the raised height of the pin 22 of the part is too large, and there is a problem that the contact area between the pin 22 and the circuit board 1 is too small, which results in too low connection reliability; when the inclination angle α of the through-hole reflow device 2 is too small (for example, less than 0.5 °), the height at which a part of the through-hole reflow device 2 is raised is too small, and the socket 212 cannot be raised to a predetermined position, resulting in poor appearance performance of the electronic apparatus. Therefore, when the inclination angle α of the through hole reflow device 2 is 0.5 ° to 2 °, the soldering reliability between the pin 22 of the through hole reflow device 2 and the circuit board 1 is high, and a part of the through hole reflow device 2 can be raised to a preset height to meet the user demand.

In a specific embodiment, the body portion 21 includes a plurality of transition portions 211, and a support 3 is disposed between a part of the transition portions 211 and the circuit board 1, and no support 3 is disposed between another part of the transition portions 211 and the circuit board 1, so as to incline the through hole reflow device 2; alternatively, a support 3 is disposed between each transition portion 211 and the circuit board 1, and at least some of the supports 3 have different heights, so as to incline the through hole reflow device 2. Both the two modes can conveniently realize the inclination of the through hole reflux device 2, so that the through hole reflux device 2 can meet the use requirements of users.

Specifically, as shown in fig. 5 to 9 and the through hole reflow device 2 shown in fig. 10, in the through hole reflow device 2, the pins 22 include a plurality of first pins 221 and a plurality of second pins 222, along the thickness direction Z of the circuit board assembly, the size of the first pins 221 is larger than that of the second pins 222, that is, the height of the first pins 221 is larger than that of the second pins 222, and the body portion 21 further includes sockets 212, the sockets 212 are used for connecting with external electronic components, and along the first direction X, the second pins 222 are located between the sockets 212 and the first pins 221. The transition part 211 includes a first transition part 211a connected to the first lead 221 and a second transition part 211b connected to the second lead 222, and since the height of the first lead 221 is greater than that of the second lead 222, the height of the first transition part 211a is greater than that of the second transition part 211 b.

At this time, the support 3 is disposed between the at least two second transition portions 211b and the circuit board 1, and the support 3 is not disposed between the first transition portions 211b and the circuit board 1.

In this embodiment, along the first direction X, the second transition portion 211b is closer to the socket 212 than the first transition portion 211a, so that when the supporting member 3 is disposed between at least two second transition portions 211b and the circuit board 1, the second transition portion 211b is lifted and drives the socket 212 to be lifted, and the first transition portion 211a is not lifted, so that the main body 21 of the through hole reflow device 2 is inclined with respect to the circuit board 1.

In the through hole reflow device 2 shown in fig. 10, the through hole reflow device 2 includes two first pins 221 and two second pins 222, and accordingly includes two first transition portions 211a and two second transition portions 211b, and a support member 3 is disposed between each of the two second transition portions 211b and the circuit board 1.

In the above embodiments, the support 3 is at least one of a metal member, a non-metal member or an electronic component, as long as it can support the through-hole reflow device 2 to raise its position. Wherein the electronic component may be a failed electronic component.

Specifically, the support 3 is bonded or soldered to the through-hole reflow device 2; the support 3 is bonded or welded to the circuit board 1.

When the support 3 is a metal part, a non-metal part or an electronic component, the support 3, the through-hole reflow device 2 and the circuit board 1 can be bonded together, and when the support 3 is a metal part or an electronic component, the support 3, the through-hole reflow device 2 and the circuit board 1 can be soldered together.

Fig. 11 and 12 show schematic views of the soldering position between the through hole reflow device 2 and the circuit board 1, wherein the transition portion 211 of the through hole reflow device 2 is soldered to the support 3 to form the structure shown in fig. 4, and then the support 3 is soldered to the circuit board 1, so that the through hole reflow device 2 is raised as a whole, i.e., the body portion 21 is parallel to the circuit board 1. In the embodiment shown in fig. 11, the supporting member 3 is a metal member, and in the embodiment shown in fig. 12, the supporting member 3 is an electronic component.

Fig. 13 shows a positional relationship between the through hole reflow device 2 and the support 3, wherein the support 3 is disposed between the two second transition portions 211b of the through hole reflow device 2 and the circuit board 1, the support 3 is not disposed between the two first transition portions 211a and the circuit board 1, and the support 3 is a metal member, the support 3 is first soldered to the two second transition portions 211b to form the structure shown in fig. 10, and then the support 3 is soldered to the circuit board 1, so that a part of the through hole reflow device 2 is raised, that is, the body portion 21 of the through hole reflow device 2 is inclined with respect to the circuit board 1.

The embodiment of the application also provides electronic equipment, which comprises a shell and a circuit board assembly arranged on the shell, wherein the circuit board assembly is the circuit board assembly in any one of the embodiments. In this embodiment, when supporting the circuit board 1 and the through hole reflow device 2 in the circuit board assembly along the thickness direction Z through the support member 3, the position of the through hole reflow device 2 relative to the circuit board 1 can be raised, when the pin 22 of the through hole reflow device 2 is welded with the circuit board 1, the position of the pin 22 welded with the circuit board 1 can be raised, i.e. the through hole reflow device 2 with the larger length of the pin 22 not only can be suitable for the circuit board 1 with the larger thickness, but also can be suitable for the circuit board 1 with the smaller thickness, the applicability of the through hole reflow device 2 is improved, the cost and the period required for redesigning the through hole reflow device 2 are reduced, thereby the cost and the design of the electronic equipment are reduced, and the processing period is shortened. Meanwhile, when the circuit board 1 and the through-hole reflow device 2 are supported by the support 3 in the thickness direction Z, the contact position between the pins 22 and the circuit board 1 can be also promoted to be centered, the soldering reliability between the through-hole reflow device 2 and the circuit board 1 can be improved, and in addition, the position of the socket 212 (e.g., TYPEC port of the electronic device) of the through-hole reflow device 2 in the electronic device can be raised, so that the appearance performance of the electronic device can be improved, and the use by a user can be facilitated.

The electronic device may be a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a Personal Digital Assistant (PDA), an Augmented Reality (AR) device, a Virtual Reality (VR) device, an Artificial Intelligence (AI) device, a wearable device, a vehicle-mounted device, an intelligent home device, and/or a smart city device, and the specific type of the electronic device is not particularly limited in the embodiments of the present application.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.