阅读说明：本技术 一种基于半柔性印制电路板的显示驱动封装及其制作方法 (Display drive package based on semi-flexible printed circuit board and manufacturing method thereof ) 是由 朱道田 于 2021-08-25 设计创作，主要内容包括：本发明公开了一种基于半柔性印制电路板的显示驱动封装及其制作方法,包括背板、灯板和平整涂覆在灯板表面的有机硅密封剂,所述灯板为9-12个Mini-LED芯片串联成一个矩形发光区域,多个所述矩形发光区域进行并联形成灯板,所述Mini-LED每个芯片上点涂覆盖有半球形有机硅密封剂。本发明有机硅密封剂的低挥发性在可靠性测试之前/之后提供了一致的光学透射率,可以保证背光板整体光学系统不受破坏,蓝光将均匀地由半柔性印制电路板射出,有机硅密封剂可以最大程度上排除与空气接触导致的不良,大大降低了不良率,只需更换该Mini-LED芯片,无需将整个Mini-LED半柔性印制电路板进行返工或报废,大大降低了Mini-LED半柔性印制电路板的生产成本和废品率。(The invention discloses a display driving package based on a semi-flexible printed circuit board and a manufacturing method thereof, wherein the display driving package comprises a back plate, a lamp panel and an organic silicon sealant which is flatly coated on the surface of the lamp panel, the lamp panel is formed by connecting 9-12 Mini-LED chips in series to form a rectangular light emitting area, a plurality of the rectangular light emitting areas are connected in parallel to form the lamp panel, and the hemispherical organic silicon sealant is coated on each Mini-LED chip in a dotted mode. The low volatility of the organic silicon sealant provides consistent optical transmittance before/after reliability test, the whole optical system of the backlight plate can be ensured not to be damaged, blue light can be uniformly emitted from the semi-flexible printed circuit board, the organic silicon sealant can eliminate the defects caused by contact with air to the maximum extent, the reject ratio is greatly reduced, only the Mini-LED chip needs to be replaced, the whole Mini-LED semi-flexible printed circuit board does not need to be reworked or scrapped, and the production cost and the rejection ratio of the Mini-LED semi-flexible printed circuit board are greatly reduced.)

1. The utility model provides a show drive encapsulation based on semi-flexible printed circuit board, includes that backplate (1), lamp plate (2) and flat coating have organic silicon sealant (3) on lamp plate (2) surface, its characterized in that: the LED lamp is characterized in that the lamp panel (2) is formed by connecting 9-12 Mini-LED chips in series to form a rectangular light emitting area, the rectangular light emitting areas are connected in parallel to form the lamp panel (2), and the Mini-LED chips are coated with an organic silicon sealant (3).

2. A display driver package based on a semi-flexible printed circuit board according to claim 1, wherein: the back plate (1) is a Mini-LED semi-flexible printed circuit board.

3. A display driver package based on a semi-flexible printed circuit board according to claim 1, wherein: the silicone encapsulant includes silicone, cyclotetrasiloxane, trisiloxane, arylsilsesquioxane, alkyne, and silica.

4. A display driver package based on a semi-flexible printed circuit board according to claim 1, wherein: the Mini-LED chips were 320 μm by 200 μm in size.

5. A display driver package based on a semi-flexible printed circuit board according to claim 1, wherein: the silicone encapsulant coating the outside of the Mini-LED chip provides a consistent optical refractive index.

6. The method for manufacturing a display driver package based on a semi-flexible printed circuit board according to claim 1, wherein: the method comprises the following steps:

arranging a display driving array: installing Mini-LED chips on the surface of a Mini-LED semi-flexible printed circuit board, wherein 9-12 Mini-LED chips are connected in series to form a rectangular light emitting area, and a plurality of rectangular light emitting areas are connected in parallel;

preparing a sealant: stirring and mixing silicon resin, cyclotetrasiloxane, trisiloxane, aryl silsesquioxane, alkyne and silicon dioxide to form an organic silicon sealant;

point coating and packaging: coating the organic silicon sealant on the surface of the Mini-LED semi-flexible printed circuit board according to the position of the Mini-LED chip;

and (3) curing: placing the surface of the point-coated Mini-LED semi-flexible printed circuit board in an environment of 150 ℃, sealing, isolating and preserving heat for 60 minutes;

and (3) detection: and after natural cooling, detecting the Mini-LED chips on the Mini-LED semi-flexible printed circuit board, taking down the bad Mini-LED chips individually, continuously replacing, performing spot coating and packaging, curing and re-detecting.

7. The method for manufacturing a display driver package based on a semi-flexible printed circuit board according to claim 3, wherein: the mass ratio of the silicone resin to the cyclotetrasiloxane to the trisiloxane to the arylsilsesquioxane to the alkyne to the silicon dioxide is 1:1.5:1:2:1.2: 1.2.

8. The method for manufacturing a display driver package based on a semi-flexible printed circuit board according to claim 1, wherein: the curing is sealed and isolated by nitrogen.

Technical Field

The invention belongs to the technical field of electronic products, and particularly relates to a display drive package based on a semi-flexible printed circuit board and a manufacturing method thereof.

Background

At present, the size of a Mini-LED chip is 320um x 200um, the bonding pads of a positive connecting circuit and a negative connecting circuit are 180um x 80um, the gap between the bonding pads is 180 mu m, and the requirement on production precision is high; in order to meet the requirements of high resolution and high brightness, the chip matrix arrangement density of the 4K product is high, and thousands of chips are generally required to be arranged on a 75-inch substrate;

in the traditional process, one of thousands of chips is defective, which leads to the rework or scrap of the entire Mini-LED backlight board, and the display driving package based on the Mini-LED semi-flexible printed circuit board directly improves the rework efficiency of the Mini-LED backlight board and effectively improves the production yield of the Mini-LED backlight board.

Disclosure of Invention

The invention aims to solve the problems in the background art and provides a display driving package based on a semi-flexible printed circuit board and a manufacturing method thereof.

The technical scheme adopted by the invention is as follows:

the utility model provides a show drive encapsulation based on semi-flexible printed circuit board, includes backplate, lamp plate and the organic silicon sealant of level and smooth coating on the lamp plate surface, the lamp plate is that 9-12 Mini-LED chips establish ties into a rectangle light emitting area, and is a plurality of the rectangle light emitting area carries out parallelly connected formation lamp plate, the point of Mini-LED chip is scribbled and is covered with the organic silicon sealant.

Preferably, the back plate is a Mini-LED semi-flexible printed circuit board.

Preferably, the silicone sealant comprises silicone, cyclotetrasiloxane, trisiloxane, arylsilsesquioxane, alkyne, and silica.

Preferably, the Mini-LED chip has a size of 320 μm by 200 μm.

Preferably, the silicone encapsulant provides a uniform optical refractive index coating on the outside of the Mini-LED chip.

A manufacturing method of display drive packaging based on a semi-flexible printed circuit board is characterized by comprising the following steps: the method comprises the following steps:

arranging a display driving array: installing Mini-LED chips on the surface of a Mini-LED semi-flexible printed circuit board, wherein 9-12 Mini-LED chips are connected in series to form a rectangular light emitting area, and a plurality of rectangular light emitting areas are connected in parallel;

preparing a sealant: stirring and mixing silicon resin, cyclotetrasiloxane, trisiloxane, aryl silsesquioxane, alkyne and silicon dioxide to form an organic silicon sealant;

point coating and packaging: coating the organic silicon sealant on the surface of the Mini-LED semi-flexible printed circuit board according to the position of the Mini-LED chip;

and (3) curing: placing the surface of the point-coated Mini-LED semi-flexible printed circuit board in an environment of 150 ℃, sealing, isolating and preserving heat for 60 minutes;

and (3) detection: and after natural cooling, detecting the Mini-LED chips on the Mini-LED semi-flexible printed circuit board, taking down the bad Mini-LED chips individually, continuously replacing, performing spot coating and packaging, curing and re-detecting.

Preferably, the mass ratio of the silicone resin, cyclotetrasiloxane, trisiloxane, arylsilsesquioxane, alkyne and silicon dioxide is 1:1.5:1:2:1.2: 1.2.

Preferably, the curing is sealed off with nitrogen.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

1. in the invention, the low volatility of the organic silicon sealant provides consistent optical transmittance before/after reliability test, so that the whole optical system of the backlight plate can be ensured not to be damaged, blue light can be uniformly emitted from the semi-flexible printed circuit board, the organic silicon sealant can ensure that the Mini-LED chip has good air tightness, the defects caused by contact with air are eliminated to the maximum extent, and the defect rate is greatly reduced.

2. In the invention, because the Mini-LED chips are packaged by the organic silicon sealant in a single spot coating manner, when one Mini-LED chip fails, only the Mini-LED chip needs to be replaced without reworking or scrapping the whole Mini-LED semi-flexible printed circuit board, thereby greatly reducing the production cost and the rejection rate of the Mini-LED semi-flexible printed circuit board.

Drawings

FIG. 1 is a schematic view of the internal structure of the present invention.

The labels in the figure are: 1. a back plate; 2. a lamp panel; 3. a silicone sealant.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Real-time example 1:

referring to fig. 1, a display driver encapsulation based on semi-flexible printed circuit board, including backplate 1, lamp plate 2 and the organic silicon sealant 3 of flat coating on 2 surfaces of lamp plate, its characterized in that: the lamp panel 2 is formed by connecting 9-12 Mini-LED chips in series to form a rectangular light emitting area, the rectangular light emitting areas are connected in parallel to form the lamp panel 2, the Mini-LED chips are coated with an organic silicon sealant in a spot mode, the backboard 1 is a Mini-LED semi-flexible printed circuit board, and the size of each Mini-LED chip is 320 mu m x 200 mu m.

The silicone encapsulant 3 includes silicone, cyclotetrasiloxane, trisiloxane, arylsilsesquioxane, alkyne, and silica, which provides a consistent optical index of refraction coating the outside of the Mini-LED chip.

By adopting the technical scheme:

the low volatility of the organic silicon sealant 3 provides consistent optical transmittance before/after reliability test, so that the whole optical system of the backlight plate can be guaranteed not to be damaged, blue light can be uniformly emitted by the semi-flexible printed circuit board, the organic silicon sealant can guarantee that the Mini-LED chip has good air tightness, the defects caused by contact with air are eliminated to the maximum extent, and the defect rate is greatly reduced.

Because the Mini-LED chips are packaged by the organic silicon sealant in a single spot coating mode, when one Mini-LED chip fails, only the Mini-LED chip needs to be replaced, the whole Mini-LED semi-flexible printed circuit board does not need to be reworked or scrapped, and the production cost and the rejection rate of the Mini-LED semi-flexible printed circuit board are greatly reduced.

Example 2:

taking a Mini-LED semi-flexible printed circuit board and a plurality of Mini-LED chips, and manufacturing a display drive package according to the following steps:

arranging a display driving array: installing Mini-LED chips on the surface of a Mini-LED semi-flexible printed circuit board, connecting 9 Mini-LED chips in series to form a rectangular light emitting area, manufacturing 10 rectangular light emitting areas in parallel, and uniformly arranging the rectangular light emitting areas on the surface of the Mini-LED semi-flexible printed circuit board;

preparing a sealant: stirring and mixing silicon resin, cyclotetrasiloxane, trisiloxane, aryl silsesquioxane, alkyne and silicon dioxide to form an organic silicon sealant;

point coating and packaging: coating the organic silicon sealant 3 on the surface of the Mini-LED semi-flexible printed circuit board according to the position of the Mini-LED chip;

and (3) curing: placing the surface of the point-coated Mini-LED semi-flexible printed circuit board in an environment of 150 ℃, sealing and isolating, preserving heat for 60 minutes, and curing and sealing and isolating by adopting nitrogen;

and (3) detection: and after natural cooling, detecting the Mini-LED chips on the Mini-LED semi-flexible printed circuit board, taking down the bad Mini-LED chips individually, continuously replacing, performing spot coating and packaging, curing and re-detecting.

The mass ratio of the silicone resin, the cyclotetrasiloxane, the trisiloxane, the aryl silsesquioxane, the alkyne and the silicon dioxide is 1:1:1:1: 1.

Example 3:

taking a Mini-LED semi-flexible printed circuit board and a plurality of Mini-LED chips, and manufacturing a display drive package according to the following steps:

arranging a display driving array: installing Mini-LED chips on the surface of a Mini-LED semi-flexible printed circuit board, connecting 9 Mini-LED chips in series to form a rectangular light emitting area, manufacturing 10 rectangular light emitting areas in parallel, and uniformly arranging the rectangular light emitting areas on the surface of the Mini-LED semi-flexible printed circuit board;

preparing a sealant: stirring and mixing silicon resin, cyclotetrasiloxane, trisiloxane, aryl silsesquioxane, alkyne and silicon dioxide to form an organic silicon sealant 3;

point coating and packaging: coating the organic silicon sealant 3 on the surface of the Mini-LED semi-flexible printed circuit board according to the position of the Mini-LED chip;

and (3) curing: placing the surface of the point-coated Mini-LED semi-flexible printed circuit board in an environment of 150 ℃, sealing and isolating, preserving heat for 60 minutes, and curing and sealing and isolating by adopting nitrogen;

and (3) detection: and after natural cooling, detecting the Mini-LED chips on the Mini-LED semi-flexible printed circuit board, taking down the bad Mini-LED chips individually, continuously replacing, performing spot coating and packaging, curing and re-detecting.

The mass ratio of the silicone resin, the cyclotetrasiloxane, the trisiloxane, the aryl silsesquioxane, the alkyne and the silicon dioxide is 1:1.5:1:2:1.2: 1.2.

Example 4:

taking a Mini-LED semi-flexible printed circuit board and a plurality of Mini-LED chips, and manufacturing a display drive package according to the following steps:

arranging a display driving array: installing Mini-LED chips on the surface of a Mini-LED semi-flexible printed circuit board, connecting 9 Mini-LED chips in series to form a rectangular light emitting area, manufacturing 10 rectangular light emitting areas in parallel, and uniformly arranging the rectangular light emitting areas on the surface of the Mini-LED semi-flexible printed circuit board;

preparing a sealant: stirring and mixing silicon resin, cyclotetrasiloxane, trisiloxane, aryl silsesquioxane, alkyne and silicon dioxide to form an organic silicon sealant;

point coating and packaging: coating the organic silicon sealant on the surface of the Mini-LED semi-flexible printed circuit board according to the position of the Mini-LED chip;

and (3) curing: placing the surface of the point-coated Mini-LED semi-flexible printed circuit board in an environment of 150 ℃, sealing and isolating, preserving heat for 60 minutes, and curing and sealing and isolating by adopting nitrogen;

and (3) detection: and after natural cooling, detecting the Mini-LED chips on the Mini-LED semi-flexible printed circuit board, taking down the bad Mini-LED chips individually, continuously replacing, performing spot coating and packaging, curing and re-detecting.

The mass ratio of the silicone resin, the cyclotetrasiloxane, the trisiloxane, the aryl silsesquioxane, the alkyne and the silicon dioxide is 1:2:1:1:1.4: 1.4.

Example 5:

taking a Mini-LED semi-flexible printed circuit board and a plurality of Mini-LED chips, and manufacturing a display drive package according to the following steps:

arranging a display driving array: installing Mini-LED chips on the surface of a Mini-LED semi-flexible printed circuit board, connecting 9 Mini-LED chips in series to form a rectangular light emitting area, manufacturing 10 rectangular light emitting areas in parallel, and uniformly arranging the rectangular light emitting areas on the surface of the Mini-LED semi-flexible printed circuit board;

preparing a sealant: stirring and mixing silicon resin, cyclotetrasiloxane, trisiloxane, aryl silsesquioxane, alkyne and silicon dioxide to form an organic silicon sealant;

point coating and packaging: coating the organic silicon sealant on the surface of the Mini-LED semi-flexible printed circuit board according to the position of the Mini-LED chip;

and (3) curing: placing the surface of the point-coated Mini-LED semi-flexible printed circuit board in an environment of 150 ℃, sealing and isolating, preserving heat for 60 minutes, and curing and sealing and isolating by adopting nitrogen;

and (3) detection: and after natural cooling, detecting the Mini-LED chips on the Mini-LED semi-flexible printed circuit board, taking down the bad Mini-LED chips individually, continuously replacing, performing spot coating and packaging, curing and re-detecting.

The mass ratio of the silicone resin, the cyclotetrasiloxane, the trisiloxane, the aryl silsesquioxane, the alkyne and the silicon dioxide is 2:1:2:4:1: 1.

Fabricated display driver packages made according to examples 2-5 were tested for optical transmission with a silicone sealant therein, giving the following data:

examples	2	3	4	5
					Optical transmittance	91.05％	95.11％	90.55％	86.56％

As can be seen from the above data, embodiment 3 is the best embodiment of the present invention, and can provide the highest optical transmittance, and ensure that the entire optical system of the backlight is not damaged, and the blue light will be emitted from the semi-flexible printed circuit board uniformly.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.