阅读说明：本技术 具有温度传感器元件的传感器装置和其制造方法 (Sensor arrangement with a temperature sensor element and method for the production thereof ) 是由 D.洛伦兹 L.彼得森 于 2020-03-18 设计创作，主要内容包括：本发明涉及一种具有温度传感器元件(13)的传感器装置和其制造方法,利用该传感器装置应该实现短的响应时间。传感器装置具有用于电连接传感器装置(1)与外部设备的连接器件(14)、用于将温度传感器元件(13)电连接至连接器件(14)的电线(17)、用于保持温度传感器元件(13)和电线(17)的具有测量区段(24)的载体(10)以及外罩(19),外罩至少包围温度传感器元件(13)。电线(17)具有等于或小于0.08mm～(2)的横截面面积,并且直接布置在载体(10)上或布置在单独的线路载体(15)上并且借助单独的线路载体布置在载体(10)上。本发明还涉及一种包括压力传感器作为另外的传感器的传感器装置。(The invention relates to a sensor device having a temperature sensor element (13), with which a short response time is to be achieved, and to a method for the production thereof. The sensor device has a connecting means (14) for electrically connecting the sensor device (1) to an external device, a wire (17) for electrically connecting the temperature sensor element (13) to the connecting means (14), a carrier (10) having a measuring section (24) for holding the temperature sensor element (13) and the wire (17) to form a connectionAnd a cover (19) that surrounds at least the temperature sensor element (13). The electric wire (17) has a thickness of 0.08mm or less 2 And is arranged directly on the carrier (10) or on a separate line carrier (15) and by means of the separate line carrier on the carrier (10). The invention also relates to a sensor device comprising a pressure sensor as a further sensor.)

1. A sensor device having the following components:

-a temperature sensor element (13);

-connection means (14) for electrically connecting the sensor device (1) with an external device;

-an electrical wire (17) for electrically connecting the temperature sensor element (13) to a connecting means (14);

-a carrier (10) for holding the temperature sensor element (13) and the electrical wire (17), the carrier having a measuring section (24);

-a housing (19) enclosing at least the temperature sensor element (13);

-wherein the wire (17) has a thickness equal to or less than 0.08mm²Cross-sectional area of; and is

-wherein the electrical wire (17) is arranged directly on the carrier (10) or on a separate line carrier (15) and by means of the separate line carrier on the carrier (10).

2. Sensor device according to claim 1, wherein the electrical line (17) is designed as a circuit spatially integrated on the carrier (19) and/or on the circuit carrier (15) or as a completely or at least partially flexible circuit carrier (15).

3. The sensor device according to claim 1, wherein the electrical line (17) is configured as a lead frame and is mounted on the carrier (10).

4. Sensor device according to claim 2 or 3, wherein, in addition to the electrical line (17), contact surfaces (16.1, 16.2) are formed at least on the carrier (10) or on a separate line carrier (15) for connecting the electrical line (17) to the temperature sensor element (13) and/or to the connecting means (14).

5. Root of herbaceous plantThe sensor device according to any one of the preceding claims, wherein the carrier (10) consists of a plastic having 5 x 10 at 20 ℃ at least in the measurement section (24) and in the section directly adjacent thereto^-6m²A thermal conductivity of/s or less.

6. The sensor device according to any of the preceding claims, wherein the thermal conductivity of the housing (19) is at least half an order of magnitude higher than the thermal conductivity of the carrier (10).

7. The sensor device according to one of the preceding claims, wherein the carrier (10) is of multi-part construction and/or has a measuring section (24) on one end and a connecting section (25) on a second end spaced apart therefrom.

8. The sensor device according to any one of the preceding claims, wherein the sensor device has a pressure sensor (2), at least one further sensor.

9. Sensor device according to claim 8, wherein the sensor device (1) has a circuit board (31) equipped with electronic components (33) for using the temperature sensor element (13), wherein the circuit board (31) belongs to a further sensor of the sensor device (1).

10. The sensor device according to claim 8 or 9, wherein the carrier (10) extends locally through a pressure channel (22) of a pressure sensor (2) of the sensor device (1) without closing the pressure channel, and the temperature sensor element (13) is located outside a pressure sleeve (20) of the pressure sensor (2).

11. Measuring device with a wall for limiting a volume or a volume flow of a medium and a sensor device according to one of the preceding claimsWherein the sensor device (1) protrudes at least with its measuring head (26) through a wall into a volume or a volume flow, wherein the temperature sensor element (13) has t₉₀A response time in the range of tens of seconds to about 100 seconds in a liquid medium or a gaseous medium with flow, and in the range of one second to ten seconds in a liquid medium with flow.

12. A method for manufacturing a sensor device according to any one of the preceding claims, the method comprising the method steps of:

-providing a temperature sensor element (13), a carrier (10) for holding the temperature sensor element (13), and connection means (14) for electrically connecting the sensor device (1) with an external device;

-mounting the temperature sensor element (13) on a carrier (10);

-constructing wires (17) for electrically connecting the temperature sensor element (13) to the connection means (14) on the carrier (10) and establishing a connection between the temperature sensor element (13) and the connection means (14) by means of the wires (17);

-wherein the wire (17) is configured with equal to or less than 0.08mm²And at least partially following the shaping of the carrier (10); and is

-encapsulating the temperature sensor element (13) with a thermally conductive material.

13. The method according to claim 12, wherein the electrical line (17) is constructed directly on the carrier (10) or is mounted on a separate line carrier (15) and on the carrier (10) by means of the separate line carrier.

14. The method according to claim 12 or 13, wherein the wire (17) is constructed by means of at least one of the methods from the list of:

laser direct structuring of the additive or subtractive material of the carrier (10) for the production of line structures directly on the carrier (10), which laser direct structuring is subsequently also referred to as LDS technique,

-two-component injection moulding with the carrier (10) configured as a preform and the electrical wire (17) subsequently configured on the preform,

-manufacturing an electric wire (17) on the carrier (10) or on a wiring carrier (15) by means of hot stamping printing,

-producing a carrier (10) or a circuit carrier (15) with electrical wires (17) by means of film back injection molding,

-forming electrical lines (17) on a line carrier (15) formed as an at least partially flexible printed circuit board,

-manufacturing a leadframe.

15. Method according to one of claims 12 to 14, wherein contact surfaces (16.1, 16.2) for contacting electrical lines (17) are formed on the carrier (10) directly or by means of a circuit carrier (15).