阅读说明：本技术 一种集成式压力传感器模块 (Integrated pressure sensor module ) 是由 伊晨晖 顾益凡 陈希敏 王柯 于 2021-06-23 设计创作，主要内容包括：本发明涉及一种传感器结构。一种集成式压力传感器模块,包括陶瓷敏感元件,所述的陶瓷敏感元件是由陶瓷基座、陶瓷膜片和玻璃密封层构成,在陶瓷基座和陶瓷膜片上印刷有金属电极,在陶瓷基座的上方设有硬质PCBA板,在金属电极上设有接触点,导电件的一端与接触点相接,导电件的另一端穿过陶瓷基座与硬质PCBA板连接。本发明提供了一种能自动化组装,工艺简单,成本低,电路设计灵活性好,方便安装,传感器精度高的一种集成式压力传感器模块；解决了现有技术中存在的柔性PCBA成本高,尺寸大,容易共振；印刷PCB电接触不稳定,工艺复杂,灵活性差；不方便安装,传感器精度不高的技术问题。(The present invention relates to a sensor structure. The integrated pressure sensor module comprises a ceramic sensitive element, wherein the ceramic sensitive element is composed of a ceramic base, a ceramic diaphragm and a glass sealing layer, metal electrodes are printed on the ceramic base and the ceramic diaphragm, a hard PCBA (printed Circuit Board Assembly) board is arranged above the ceramic base, a contact point is arranged on each metal electrode, one end of a conductive piece is connected with the contact point, and the other end of the conductive piece penetrates through the ceramic base to be connected with the hard PCBA board. The integrated pressure sensor module provided by the invention can be automatically assembled, and has the advantages of simple process, low cost, good circuit design flexibility, convenience in installation and high sensor precision; the flexible PCBA in the prior art is high in cost, large in size and easy to resonate; the printed PCB has unstable electric contact, complex process and poor flexibility; inconvenient installation, the sensor precision is not high technical problem.)

1. The integrated pressure sensor module comprises a ceramic sensitive element, wherein the ceramic sensitive element is composed of a ceramic base, a ceramic diaphragm and a glass sealing layer, metal electrodes are printed on the ceramic base and the ceramic diaphragm, and the integrated pressure sensor module is characterized in that: a hard PCBA board is arranged above the ceramic base, a contact point is arranged on the metal electrode, one end of the conductive piece is connected with the contact point, and the other end of the conductive piece penetrates through the ceramic base to be connected with the hard PCBA board.

2. An integrated pressure sensor module as claimed in claim 1, wherein: the conductive parts are PIN needles, and at least three conductive parts are provided.

3. An integrated pressure sensor module as claimed in claim 1, wherein: PIN needle via hole welding is on the PCBA board of stereoplasm.

4. An integrated pressure sensor module according to claim 1, 2 or 3, wherein: and a plurality of conductive contacts are arranged on the hard PCBA board.

5. An integrated pressure sensor module according to claim 1, 2 or 3, wherein: the ceramic sensitive element is a ceramic capacitor type or a ceramic resistor type.

6. An integrated pressure sensor module according to claim 1, 2 or 3, wherein: the connecting points of the conductive parts and the PCBA are distributed on the outer sides of the chip and the components on the PCBA.

7. An integrated pressure sensor module according to claim 1, 2 or 3, wherein: the ceramic sensitive element is square, round or polygonal.

Technical Field

The present disclosure relates to sensor structures, and particularly to an integrated pressure sensor module.

Background

In recent years, the pressure sensing technology in China is developing vigorously, the application field is expanding rapidly, the technology related to the pressure sensor technology is wide, along with the intelligent development trend in the fields of automobiles, industry and Internet of things, the pressure sensor is growing rapidly, and the ceramic pressure sensor has the advantages of good corrosion resistance, abrasion resistance, impact resistance and thermal stability, high measurement accuracy, wide range of measurement, no pollution and the like, and is widely applied to pressure monitoring of key systems such as automobile engines, gearboxes, aftertreatment systems, thermal management systems, high-performance pressure transmitters for industrial control and the like.

Most of the existing ceramic pressure sensors are formed by welding a flexible PCBA (printed circuit board assembly) and a sensitive element or directly pasting a ceramic substrate, the structure and assembly of the existing ceramic pressure sensors are complex, the cost is high, the process of the existing ceramic pressure sensors is complex, the flexibility is poor, and the requirements of integration, flexibility and low cost cannot be met.

As in the Chinese patent: "pressure-capacitance formula ceramic pressure sensor (CN 209310957U) with printed circuit board", adopt the basic paster design of pottery, including the base, base one end is connected with moves the diaphragm, moves diaphragm one end middle part and is equipped with the dynamic electrode, the other end printing that the diaphragm was moved in the relative connection of base has the thick film circuit board, set up the connecting hole that at least three one end and dynamic electrode are linked together the other end and are linked together with the thick film circuit board outside on the thick film circuit board, be provided with conductive structure in the connecting hole. The design relates to the ceramic matrix thick film printing, sintering and pasting processes, and meanwhile, each circuit needs to be specially designed with a PCB layout, so that the flexibility is poor.

Disclosure of Invention

The integrated pressure sensor module provided by the invention can be automatically assembled, and has the advantages of simple process, low cost, good circuit design flexibility and high precision; solves the problems that the flexible PCBA in the prior art has high cost and large size and needs a plurality of soldering processes; the printed PCB has unstable electric contact, complex process and poor flexibility; inconvenient installation, the sensor precision is not high technical problem.

The technical problem of the invention is solved by the following technical scheme: the integrated pressure sensor module comprises a ceramic sensitive element, wherein the ceramic sensitive element is composed of a ceramic base, a ceramic diaphragm and a glass sealing layer, metal electrodes are printed on the ceramic base and the ceramic diaphragm, a hard PCBA (printed Circuit Board Assembly) board is arranged above the ceramic base, a contact point is arranged on each metal electrode, one end of a conductive piece is connected with the contact point, and the other end of the conductive piece penetrates through the ceramic base to be connected with the hard PCBA board. The split type design of hard PCBA and ceramic sensitive element has good flexibility, and when different performances are required, PCBA with different functions and ceramic sensitive element can be integrated together, so that the use requirements of different pressure sensors can be met. The hard PCBA solves the technical problems that a flexible PCB is high in cost, not beneficial to automatic assembly, needing to be welded for multiple times, large in sensor size, easy to resonate electronic components and the like, and meanwhile solves the technical problems that a ceramic-based printed PCB is poor in gold disc bonding force, unstable in electric contact, complex in printed patch process, poor in circuit design flexibility and the like. The sensitive element is tightly attached to the hard PCB, so that the problem that the temperature drift of the sensor is overlarge due to the fact that the distance between the sensitive element of the flexible PCB and the chip and the temperature resistor is large (air is separated) is solved.

After the ceramic sensitive element meeting the use requirement is integrated with the hard PCBA, the ceramic sensitive element is pressed into the plastic connector through interference fit, a traditional sensitive element plastic base is not needed, the number of parts is reduced, and the structure and the process are greatly simplified.

Preferably, the conductive members are PIN PINs, and at least three conductive members are provided. PIN needle via hole welding is on the PCBA board of stereoplasm. The sensitive element and the hard PCBA are welded by adopting PIN PINs, so that the technical problems that the flexible PCBA needs a complex metal edge card and the sensitive element is oversized are solved. Meanwhile, high-risk processes such as bonding and the like are avoided. The at least three PIN needles ensure that the hard PCBA board is effectively fixed on the ceramic base, so that the sensitive element and the hard PCBA board cannot move mutually, and the stability of the sensor is ensured. The distribution of PIN needle is nimble changeable, can install as required in suitable position on PCBA board, and multilateral installation or unilateral installation all can.

Preferably, a plurality of conductive contacts are arranged on the hard PCBA board. And pressure is applied to the conductive contact, so that the hard PCBA is in closer contact with the sensitive element, and the stability is good. Meanwhile, the conductive contact can also be used for connecting and arranging PIN needles in the sensor, the PIN needles can be pressed on the conductive contact through the elastic element, and the close connection and fixation of the PCBA board and the sensitive element are realized while the PIN needles are connected.

Preferably, the ceramic sensitive element is a ceramic capacitor or a ceramic resistor. The sensor flexibility is improved, and the sensor can be a capacitance type pressure sensor or a resistance type pressure sensor.

Preferably, the connection points of the conductive member and the PCBA are distributed outside the chip and the component on the PCBA. PIN needle distributes in the chip outside of PCBA board, and is little to circuit and chip arrangement on the PCBA.

Preferably, the ceramic sensitive element is square, round or polygonal.

Therefore, the integrated pressure sensor module of the invention has the following advantages: the process is simple, the volume is small, and the flexibility of circuit design is high; different sensitive elements and PCBA boards with different circuits can be selected according to requirements, so that different use requirements are met; the ceramic sensitive element is integrated with the hard PCB and pressed into the plastic connector through interference, a traditional sensitive element plastic base is not needed, the number of parts is reduced, the structure and the process are greatly simplified, the productivity is high, and the cost is low.

Drawings

Fig. 1 is a perspective view of an integrated pressure sensor module of the present invention.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is a perspective view of fig. 1 circumscribed with a PIN.

Detailed Description

The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings.

Example (b):

as shown in fig. 1, 2 and 3, an integrated pressure sensor module includes a ceramic sensing element 1, the ceramic sensing element 1 is composed of a ceramic base 11, a ceramic diaphragm 8 and a glass sealing layer 7, the ceramic base 11 and the ceramic diaphragm 8 are hermetically connected through the glass sealing layer 7, and metal electrodes 6 are printed on the ceramic base 11 and the ceramic diaphragm 8 to form a ceramic capacitive sensing element or a ceramic resistive sensing element. The ceramic sensor 1 may be circular, square or polygonal.

A rigid PCBA board 3 is mounted above the ceramic base 11, and a circuit and a chip are integrated on the PCBA board 3. Three through holes 5 are formed in the blank outside the chip of the PCBA board 3, conductive PIN PINs 4 are inserted into the through holes 5, and the conductive PIN PINs 4 penetrate through the hard PCBA board 3 and are connected with metal electrodes 6 of the ceramic sensitive element in a through hole welding mode. Of course, the adhesion may be increased after welding, depending on the case. Meanwhile, the PCBA board 3 is welded with the conductive contact 2, the conductive contact 2 is connected with a PIN 9 of the pressure sensor through an elastic element 10, such as a spring or an elastic sheet, and the other end of the PIN 9 penetrates through the shell to be connected with the connector.