阅读说明：本技术 一种阵列式分布的led发光模组及利用此模组的安装方法 (LED light-emitting module distributed in array and installation method using same ) 是由 周坚风 李桂明 黄强 付帅 武梦 于 2021-08-17 设计创作，主要内容包括：本发明公开了一种阵列式分布的LED发光模组及利用此模组的安装方法,包括底板以及固定连接于底板顶部的散热基座,所述散热基座的顶部活动连接有导热载板,所述导热载板的顶部活动连接有LED二极管,且LED二极管的底部通过针脚插接于导热载板内部,本发明涉及LED发光模组技术领域。该阵列式分布的LED发光模组及利用此模组的安装方法,将LED二极管插接在导热载板内部,并且针脚采用弯折插入,再利用防护圈以及夹紧板和夹紧垫的设置可实现LED二极管的固定,避免二极管与导热载板的脱离,且无需焊接,同时将散热基座与导热载板之间进行拆卸连接,可方便实现散热基座内结构的维护和更换,操作便利,减少了人员的工作强度。(The invention discloses an array-distributed LED light-emitting module and an installation method using the same, and the LED light-emitting module comprises a bottom plate and a heat dissipation base fixedly connected to the top of the bottom plate, wherein the top of the heat dissipation base is movably connected with a heat conduction carrier plate, the top of the heat conduction carrier plate is movably connected with an LED diode, and the bottom of the LED diode is inserted into the heat conduction carrier plate through pins. The LED light-emitting module distributed in the array mode and the installation method using the LED light-emitting module are characterized in that the LED diodes are inserted into the heat-conducting support plate in an inserting mode, pins are inserted in a bending mode, the LED diodes can be fixed by the aid of the protective rings, the clamping plates and the clamping pads, the diodes are prevented from being separated from the heat-conducting support plate, welding is not needed, meanwhile, the heat-radiating base and the heat-conducting support plate are connected in a disassembling mode, maintenance and replacement of the inner structure of the heat-radiating base can be conveniently achieved, operation is convenient, and working intensity of workers is reduced.)

1. The utility model provides a LED of array distribution sends out optical module, includes bottom plate (1) and fixed connection in heat dissipation base (2) at bottom plate (1) top, its characterized in that: the top of the heat dissipation base (2) is movably connected with a heat conduction carrier plate (3), the top of the heat conduction carrier plate (3) is movably connected with an LED diode (4), the bottom of the LED (4) is inserted into the heat-conducting carrier plate (3) through pins (5), the top of the heat-conducting carrier plate (3) is provided with jacks (18) matched with the pins (5), and the inner wall of the jack (18) is fixedly connected with a protective ring (6), the top of the heat-conducting carrier plate (3) is provided with a movable groove (7), and one side of the inner wall of the movable groove (7) is fixedly connected with a buffer spring (8), one end of the buffer spring (8) is fixedly connected with a clamping plate (9) which penetrates through the top of the movable groove (7), the bottom of the clamping plate (9) is fixedly connected with a clamping pad (10), and the top of the heat dissipation base (2) is provided with a fixing mechanism (11);

the fixing mechanism (11) comprises a fixing rod (111), a connecting plate (112) is fixedly connected to the periphery of the heat-conducting carrier plate (3), a fixing groove (113) is formed in the top of the heat-radiating base (2), a threaded rod (114) penetrating through the heat-radiating base (2) is connected to the inner thread of the fixing groove (113), a U-shaped clamping block (115) matched with the fixing rod (111) is rotatably connected to one end, located inside the fixing groove (113), of the threaded rod (114), and an elastic pad (116) is fixedly connected to the inner wall of the U-shaped clamping block (115);

the top swing joint of heat conduction carrier plate (3) has protection casing (12), protection casing (12) are including base member (121), the top of base member (121) has waterproof membrane (122) through the binder bonding, and the top of waterproof membrane (122) has hydrophobic layer (123) through the adhesive bonding, the bottom fixedly connected with sealing washer (124) of protection casing (12).

2. The array-type distributed LED light-emitting module as claimed in claim 1, wherein: the bottom end of the fixing rod (111) is fixedly connected with the top of the connecting plate (112), and the front and the back of two sides of the top of the heat-conducting carrier plate (3) are fixedly connected with connecting rods (13).

3. The array-type distributed LED light-emitting module as claimed in claim 2, wherein: the surface of the connecting rod (13) is rotatably connected with a rotating ring (14), and two sides of the surface of the rotating ring (14) are fixedly connected with baffle plates (15).

4. The LED light module as claimed in claim 3, wherein: the inner wall of the rotating ring (14) is fixedly connected with an elastic ring (17) on the surface of the connecting rod (13), and the bottom of the baffle plate (15) is in contact with the top of the protective cover (12).

5. The array-type distributed LED light-emitting module as claimed in claim 1, wherein: the heat dissipation base (2) is internally provided with a heat dissipation mechanism (16), the heat dissipation mechanism (16) comprises a heat conduction column (161), and the top end of the heat conduction column (161) is fixedly connected with the bottom of the heat conduction carrier plate (3).

6. The LED light module as claimed in claim 5, wherein: the heat dissipation structure is characterized in that the top end of the heat conduction column (161) is fixedly connected with a heat conduction pipe (162), heat dissipation grooves (163) are formed in the two sides of the heat dissipation base (2), and heat dissipation fins (164) are fixedly connected between the top and the bottom of the inner wall of each heat dissipation groove (163) through vertical rods.

7. The LED light module as claimed in claim 6, wherein: the bottom fixedly connected with semiconductor refrigeration piece (165) of heat conduction carrier plate (3), the bottom fixedly connected with radiator fan (166) of heat dissipation base (2) inner wall.

8. The array-type distributed LED light-emitting module according to claim 7, wherein: the heat dissipation device comprises a heat dissipation base (2), wherein the bottom of the inner wall of the heat dissipation base (2) is fixedly connected with a wind collection cover (167) at the periphery of a heat dissipation fan (166), and heat dissipation holes (168) are formed in the bottoms of the front surface and the back surface of the heat dissipation base (2).

9. A method for installing LED light-emitting modules distributed in an array manner is characterized in that: the method specifically comprises the following steps:

s1, mounting the LED diode (4) and the heat-conducting carrier plate (3): pins (5) at the bottom of an LED pole tube (4) are inserted into jacks (18), a protective ring (6) in the jacks (18) clamps and fixes the pins (5), and a clamping plate (9) is limited and fixed by a clamping pad (10) through the buffering force of a buffer spring (8);

s2, mounting the heat-conducting carrier plate (3) and the heat-radiating base (2): placing the heat-conducting carrier plate (3) on the top of the heat-radiating base (2), enabling connecting plates (112) on the periphery of the heat-conducting carrier plate (3) to be located inside a groove in the top of the heat-radiating base (2), then rotating a threaded rod (114), enabling the threaded rod (114) to rotate and driving a U-shaped fixture block (115) to move towards the direction of a fixing rod (111), and enabling the U-shaped fixture block (115) to be clamped on the fixing rod (111) through an elastic pad (116), so that the heat-radiating base (2) and the heat-conducting carrier plate (3) are fixed;

s3, mounting the protective cover (12) and the heat-conducting carrier plate (3): place protection casing (12) on heat conduction carrier plate (3) to cover in the surface of LED diode (4), rotatory swivel becket (14) makes swivel becket (14) rotate along connecting rod (13), and swivel becket (14) drive baffle (15) and rotate then, makes baffle (15) be located the top of protection casing (12), carries out spacing fixed to protection casing (12) then.

10. The method as claimed in claim 9, wherein the LED light emitting modules are arranged in an array, and the method comprises the following steps: the elastic ring (17) is used for increasing the friction between the rotating ring (14) and the connecting rod (13).

Technical Field

The invention relates to the technical field of LED light-emitting modules, in particular to an array-type distributed LED light-emitting module and an installation method using the same.

Background

The LED light-emitting module is one of the LED modules, the LED module can be divided into an LED light-emitting module and an LED backlight module, the LED module is formed by arranging LEDs (light-emitting diodes) together according to a certain rule and then packaging the LEDs, and products formed by waterproof treatment are added, the LED light-emitting module is a product which is widely applied in the LED product, and has great difference in the aspects of structure and electronics.

Referring to a UV LED module of chinese patent publication No. CN111933628A, by distributing UV LED chip arrays of 1-150 μm size (i.e. Mini or Micro), it is possible to change the UV light emitted by a few high-power large-size UV LED chips into light emitted by tens or hundreds or thousands of Mini or Micro UV LED chips, on one hand, the total light intensity can be kept unchanged, the UV LED chips work in the area with the highest electro-optical conversion efficiency, and heat generation is reduced, on the other hand, the heat dissipation is accelerated by distributed heat dissipation, the size of the heat sink can be greatly reduced, portability and service life are improved, the small-pitch UV LED chip arrays can adapt to a very small built-in space, the application range of the UV lamp is expanded, and even a wearable UV lamp is realized, however, the following disadvantages exist with reference to this patent and the prior art:

1. in the patent, the LED chip is welded and fixed on the carrier plate through the pins to form the LED module, when a single LED chip is damaged and needs to be maintained or replaced, the LED module needs to be disassembled forcefully, so that the damage of the surface of the carrier plate is easily caused, the plugging of the subsequent LED chip is influenced, meanwhile, in order to achieve an efficient heat dissipation effect, the heat dissipation mechanism and the LED module are fixedly arranged in an integrated manner, the disassembly and the assembly are inconvenient, the maintenance of the subsequent heat dissipation mechanism is influenced, and the arrangement causes the problems that the operation of the LED module is complex in the installation process, and the working intensity of personnel is increased;

2. in the above-mentioned patent, the radiating effect is realized only to the mode that the LED sends out light chip and only adopts the array dispersion, and passive form radiating effect is not good, and the heat is piled up the life who has shortened the chip, and LED exposes in the easy income of external moisture simultaneously, causes the phenomenon of short circuit, has certain potential safety hazard.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides an array-distributed LED light-emitting module and an installation method using the same, and solves the problems that when a single LED chip is damaged and needs to be maintained or replaced, the surface of a support plate is easily damaged due to strong disassembly, the subsequent insertion of the LED chip is influenced, a heat dissipation mechanism and the LED module are fixedly arranged in an integrated manner, the disassembly and the assembly are inconvenient, the passive heat dissipation effect is poor, and the waterproof effect is not achieved.

Technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a LED light-emitting module group that array distributes, includes bottom plate and fixed connection in the heat dissipation base at bottom plate top, the top swing joint of heat dissipation base has the heat conduction support plate, the top swing joint of heat conduction support plate has the LED diode, and the bottom of LED diode is passed through the stitch and is pegged graft inside the heat conduction support plate, the jack with stitch looks adaptation is seted up at the top of heat conduction support plate, and the inner wall fixedly connected with guard ring of jack, the movable groove has been seted up at the top of heat conduction support plate, and one side fixedly connected with buffer spring of movable groove inner wall, buffer spring's one end fixedly connected with runs through the clamp plate to the movable groove top, and the bottom fixedly connected with of clamp plate presss from both sides tight pad, the top of heat dissipation base is provided with fixed establishment.

The fixing mechanism comprises a fixing rod, a connecting plate is fixedly connected to the periphery of the heat conduction support plate, a fixing groove is formed in the top of the heat dissipation base, a threaded rod penetrating through the heat dissipation base is connected to the inner portion of the fixing groove through threads, a U-shaped clamping block matched with the fixing rod is connected to one end, located inside the fixing groove, of the threaded rod in a rotating mode, and an elastic pad is fixedly connected to the inner wall of the U-shaped clamping block.

The top swing joint of heat conduction support plate has the protection casing, the protection casing includes the base member, the top of base member has the water proof membrane through the binder bonding, and the top of water proof membrane has the hydrophobic layer through the binder bonding, the bottom fixedly connected with sealing washer of protection casing.

Preferably, the bottom end of the fixing rod is fixedly connected with the top of the connecting plate, and the front and the back of the two sides of the top of the heat-conducting carrier plate are fixedly connected with connecting rods.

Preferably, the surface of the connecting rod is rotatably connected with a rotating ring, and two sides of the surface of the rotating ring are fixedly connected with baffle plates.

Preferably, the inner wall of the rotating ring is fixedly connected with an elastic ring on the surface of the connecting rod, and the bottom of the baffle is in contact with the top of the protective cover.

Preferably, the heat dissipation base is internally provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat conduction column, and the top end of the heat conduction column is fixedly connected with the bottom of the heat conduction support plate.

Preferably, the top fixedly connected with heat pipe of heat conduction post, the radiating groove has all been seted up to the both sides of heat dissipation base, and through montant fixedly connected with radiating fin between the top of radiating groove inner wall and the bottom.

Preferably, the bottom of the heat-conducting carrier plate is fixedly connected with a semiconductor refrigerating sheet, and the bottom of the inner wall of the heat-radiating base is fixedly connected with a heat-radiating fan.

Preferably, the bottom of the inner wall of the heat dissipation base is fixedly connected with a wind collection cover at the periphery of the heat dissipation fan, and heat dissipation holes are formed in the bottoms of the front surface and the back surface of the heat dissipation base.

The invention also discloses an installation method of the LED light-emitting modules distributed in an array manner, which specifically comprises the following steps:

s1, mounting of the LED diode and the heat conduction carrier plate: inserting pins at the bottom of the LED into the jacks, clamping and fixing the pins by the protection rings in the jacks, and limiting and fixing the pins by the clamping pads through the buffer force of the buffer springs by the clamping plates;

s2, mounting the heat-conducting carrier plate and the heat-radiating base: placing the heat-conducting support plate on the top of the heat-radiating base, enabling the connecting plate on the periphery of the heat-conducting support plate to be located inside the groove on the top of the heat-radiating base, then rotating the threaded rod, enabling the threaded rod to rotate and driving the U-shaped fixture block to move towards the direction of the fixed rod until the U-shaped fixture block is clamped on the fixed rod through the elastic pad, and accordingly fixing the heat-radiating base and the heat-conducting support plate;

s3, mounting of the protective cover and the heat conduction carrier plate: place the protection casing on the heat conduction support plate to cover on the surface of LED diode, rotatory swivel becket makes the swivel becket rotate along the connecting rod, and the swivel becket drives the baffle then and rotates, makes the baffle be located the top of protection casing, carries out spacing fixed then to the protection casing.

Preferably, the elastic ring is used for increasing friction between the rotating ring and the connecting rod.

(III) advantageous effects

The invention provides an array distributed LED light-emitting module and an installation method using the same. The method has the following beneficial effects:

(1) the LED light-emitting module comprises a bottom plate and a heat dissipation base fixedly connected to the top of the bottom plate, wherein the top of the heat dissipation base is movably connected with a heat conduction support plate, the top of the heat conduction support plate is movably connected with an LED diode, the bottom of the LED diode is inserted into the heat conduction support plate through pins, the top of the heat conduction support plate is provided with jacks matched with the pins, the inner wall of each jack is fixedly connected with a protection ring, the top of the heat conduction support plate is provided with a movable groove, one side of the inner wall of each movable groove is fixedly connected with a buffer spring, one end of each buffer spring is fixedly connected with a clamping plate penetrating through the top of the corresponding movable groove, the bottom of each clamping plate is fixedly connected with a clamping pad, and the top of the heat dissipation base is provided with a fixing mechanism; the fixing mechanism comprises a fixing rod, a connecting plate is fixedly connected to the periphery of the heat-conducting support plate, a fixing groove is formed in the top of the heat-radiating base, a threaded rod penetrating through the outside of the heat-radiating base is connected to the inner portion of the fixing groove in a threaded mode, the threaded rod is located at one end of the inside of the fixing groove and is connected with a U-shaped clamping block matched with the fixing rod in a rotating mode, an elastic pad is fixedly connected to the inner wall of the U-shaped clamping block, an LED diode is connected to the inside of the heat-conducting support plate in an inserting mode, pins are inserted in the heat-conducting support plate in a bending mode, fixing of the LED diode can be achieved by means of the aid of the protection ring, the clamping plate and the clamping pad, separation of the diode from the heat-conducting support plate is avoided, welding is not needed, connection is disassembled between the heat-radiating base and the heat-conducting support plate, maintenance and replacement of the structure in the heat-radiating base can be achieved conveniently, operation is convenient, and working strength of personnel is reduced.

(2) The LED light-emitting module with array distribution and the installation method using the same, a heat dissipation mechanism is arranged in a heat dissipation base, the heat dissipation mechanism comprises a heat conduction column, the top end of the heat conduction column is fixedly connected with the bottom of a heat conduction carrier plate, the top end of the heat conduction column is fixedly connected with a heat conduction pipe, both sides of the heat dissipation base are provided with heat dissipation grooves, a heat dissipation fin is fixedly connected between the top and the bottom of the inner wall of the heat dissipation groove through a vertical rod, the bottom of the heat conduction carrier plate is fixedly connected with a semiconductor refrigeration sheet, the bottom of the inner wall of the heat dissipation base is fixedly connected with a heat dissipation fan, the bottom of the inner wall of the heat dissipation base is fixedly connected with a wind collection cover at the periphery of the heat dissipation fan, heat dissipation holes are arranged at the bottom of the front and the back of the heat dissipation base, the heat generated when the LED diode works can be discharged, and cold air generated by the heat dissipation fan and the semiconductor refrigeration sheet is transmitted to the periphery of the LED diode, the purpose of efficient heat dissipation and refrigeration is achieved, and the service life of the LED light-emitting module is prolonged.

(3) The LED light-emitting module distributed in the array mode and the installation method using the LED light-emitting module comprise a base body through a protective cover, a waterproof film is adhered to the top of the base body through a binder, a hydrophobic layer is adhered to the top of the waterproof film through the binder, and a sealing ring is fixedly connected to the bottom of the protective cover, so that the phenomenon that external rainwater enters the interior of the protective cover to easily cause short circuit can be avoided.

(4) The LED light-emitting module distributed in the array mode and the installation method using the LED light-emitting module are characterized in that the bottom of the inner wall of the heat dissipation base is fixedly connected with the heat dissipation fan, and the bottom of the inner wall of the heat dissipation base is fixedly connected with the air collection cover which is positioned at the periphery of the heat dissipation fan, so that air blown out by the heat dissipation fan can be effectively and intensively blown to the semiconductor refrigerating sheet, and the circulation of heat is accelerated.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a structural cross-sectional view of the present invention;

FIG. 3 is a top view of the heat dissipation base of the present invention;

FIG. 4 is a top view of the shield of the present invention;

FIG. 5 is a sectional view of the air collecting cover according to the present invention;

FIG. 6 is an enlarged view of a portion of the invention at A in FIG. 1;

FIG. 7 is a cross-sectional view of the structure of the shield and the thermally conductive carrier plate of the present invention;

FIG. 8 is a schematic view of the structure of the shield of the present invention;

FIG. 9 is an enlarged view of a portion of the invention at B in FIG. 7;

fig. 10 is a schematic block diagram of the architecture of the system of the present invention.

In the figure: 1-bottom plate, 2-heat dissipation base, 3-heat conduction carrier plate, 4-LED diode, 5-pin, 6-protection ring, 7-movable groove, 8-buffer spring, 9-clamping plate, 10-clamping pad, 11-fixing mechanism, 111-fixing rod, 112-connecting plate, 113-fixing groove, 114-threaded rod, 115-U-shaped fixture block, 116-elastic pad, 12-protective cover, 121-base body, 122-waterproof film, 123-hydrophobic layer, 124-sealing ring, 13-connecting rod, 14-rotating ring, 15-baffle, 16-heat dissipation mechanism, 161-heat conduction column, 162-heat conduction pipe, 163-heat dissipation groove, 164-heat dissipation fin, 165-semiconductor refrigeration piece, 166-heat dissipation fan, heat dissipation heat, 167-wind collecting cover, 168-heat dissipation hole, 17-elastic ring, 18-jack.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 10, an embodiment of the present invention provides a technical solution: an LED light-emitting module distributed in an array manner comprises a bottom plate 1 and a heat-radiating base 2 fixedly connected to the top of the bottom plate 1, wherein the top of the heat-radiating base 2 is movably connected with a heat-conducting carrier plate 3, the top of the heat-conducting carrier plate 3 is movably connected with an LED diode 4, the bottom of the LED diode 4 is inserted into the heat-conducting carrier plate 3 through pins 5, the LED is called As an LED for short and is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N) and the like, when electrons and holes are compounded, visible light can be radiated, so that the LED can be made into a light-emitting diode which can be used As an indicator lamp in circuits and instruments or form character or digital display, a gallium arsenide diode emits red light, a gallium phosphide diode emits green light, a silicon carbide diode emits yellow light, a gallium nitride diode emits blue light, and the LED comprises an organic light-emitting diode OLED and an inorganic light-emitting diode LED due to chemical properties, the jack 18 of 5 looks adaptations of stitch is seted up at the top of heat conduction support plate 3, and the inner wall fixedly connected with guard ring 6 of jack 18, movable groove 7 has been seted up at the top of heat conduction support plate 3, and one side fixedly connected with buffer spring 8 of movable groove 7 inner wall, buffer spring 8's one end fixedly connected with runs through the clamp plate 9 to movable groove 7 top, and the bottom fixedly connected with of clamp plate 9 presss from both sides tight pad 10, and the top of heat dissipation base 2 is provided with fixed establishment 11.

The fixing mechanism 11 comprises a fixing rod 111, a connecting plate 112 is fixedly connected to the periphery of the heat-conducting carrier plate 3, a fixing groove 113 is formed at the top of the heat-radiating base 2, a threaded rod 114 penetrating to the outside of the heat-radiating base 2 is connected to the inner thread of the fixing groove 113 in a threaded manner, a U-shaped fixture block 115 matched with the fixing rod 111 is rotatably connected to one end of the threaded rod 114 located inside the fixing groove 113, an elastic pad 116 is fixedly connected to the inner wall of the U-shaped fixture block 115, the bottom end of the fixing rod 111 is fixedly connected to the top of the connecting plate 112, a protective cover 12 is movably connected to the top of the heat-conducting carrier plate 3, connecting rods 13 are fixedly connected to the front and the back of the two sides of the top of the heat-conducting carrier plate 3, a rotating ring 14 is rotatably connected to the surface of the connecting rod 13, baffle plates 15 are fixedly connected to the two sides of the surface of the rotating ring 14, and an elastic ring 17 is fixedly connected to the inner wall of the rotating ring 14 and located on the surface of the connecting rod 13, the bottom of the shield 15 is in contact with the top of the shield 12.

The protection casing 12 includes base member 121, and there is waterproof membrane 122 at the top of base member 121 through the binder bonding, and there is hydrophobic layer 123 at the top of waterproof membrane 122 through the binder bonding, and the bottom fixedly connected with sealing washer 124 of protection casing 12, thereby sealing washer 124 can realize avoiding outside rainwater to enter into the inside phenomenon that causes the short circuit easily of protection casing 12.

The heat dissipation mechanism 16 is arranged in the heat dissipation base 2, the heat dissipation mechanism 16 comprises a heat conduction column 161, the top end of the heat conduction column 161 is fixedly connected with the bottom of the heat conduction carrier plate 3, the top end of the heat conduction column 161 is fixedly connected with a heat conduction pipe 162, the heat conduction pipe 162 is made of copper material, heat dissipation grooves 163 are formed in two sides of the heat dissipation base 2, and heat dissipation fins 164 are fixedly connected between the top and the bottom of the inner wall of each heat dissipation groove 163 through vertical rods, so that heat generated during the operation of the LED diode 4 can be discharged, cold air generated by a heat dissipation fan 166 and a semiconductor refrigeration piece 165 is transmitted to the periphery of the LED diode 4, the purpose of high-efficiency heat dissipation refrigeration is achieved, the service life of the LED light-emitting module is prolonged, the semiconductor refrigeration piece 165 is also called as a thermoelectric refrigeration piece, and is a heat pump, and has the advantages of no sliding part, is limited in some spaces and has high reliability requirement, on the occasion of no refrigerant pollution, by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be achieved.

The invention also discloses an installation method of the LED light-emitting modules distributed in an array manner, which specifically comprises the following steps:

s1, mounting the LED diode 4 and the heat-conducting carrier plate 3: inserting pins 5 at the bottom of an LED 4 into jacks 18, clamping and fixing the pins 5 by protective rings 6 in the jacks 18, and limiting and fixing the pins 5 by clamping pads 10 through buffer force of buffer springs 8 by clamping plates 9;

s2, mounting the heat-conducting carrier plate 3 and the heat-dissipating base 2: placing the heat-conducting carrier plate 3 on the top of the heat-radiating base 2, so that the connecting plates 112 on the periphery of the heat-conducting carrier plate 3 are located inside the grooves on the top of the heat-radiating base 2, then rotating the threaded rod 114, so that the threaded rod 114 rotates and drives the U-shaped fixture block 115 to move towards the fixing rod 111 until the U-shaped fixture block 115 is clamped on the fixing rod 111 through the elastic pad 116, so that the heat-radiating base 2 and the heat-conducting carrier plate 3 are fixed;

s3, mounting the protective cover 12 and the heat-conducting carrier plate 3: place protection casing 12 on heat conduction support plate 3 to cover on the surface of LED 4, rotatory swivel ring 14, make swivel ring 14 rotate along connecting rod 13, swivel ring 14 drives baffle 15 and rotates then, makes baffle 15 be located the top of protection casing 12, carries out spacing fixed then to protection casing 12.

In the embodiment of the present invention, the elastic ring 17 is used to increase the friction between the rotating ring 14 and the connecting rod 13.

And those not described in detail in this specification are well within the skill of those in the art.

During the use, with bottom plate 1 through bolt fixed connection in the use place, when LED diode 4 opens the use, can produce more heat, at this moment the heat transmits to the heat pipe 162 surface through heat conduction support plate 3 and heat conduction post 161, the heat that the heat pipe 162 surface gived off then transmits to the air by the inside radiating fin 164 of radiating groove 163, and open radiator fan 166 and semiconductor refrigeration piece 165 simultaneously, radiator fan 166 bloies to the top, cooperate the refrigeration effect of semiconductor refrigeration piece 165 to transmit the cold volume to around LED diode 4, carry out the refrigeration of dispelling the heat fast to it, hydrophobic layer 123 can prevent that surface moisture from condensing on the surface of protection casing 12, waterproof membrane 122 and sealing washer 124's setting can avoid surface moisture to enter into inside protection casing 12 simultaneously, thereby realize the guard action to LED diode 4.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.