阅读说明：本技术 触摸显示装置 (Touch display device ) 是由 李陵熙 金玟秀 张成旭 于 2020-08-05 设计创作，主要内容包括：公开了一种用于防止布线之间发生短路的触摸显示装置。该触摸显示装置包括与覆盖发光元件的封装单元形成边界的堰,并且堰形成为使得其在与布线重叠的区域中的高度和其在与该布线不重叠的区域中的高度彼此不同,其中布线连接到设置在封装单元上的触摸电极,从而,防止布线之间发生短路。(Disclosed is a touch display device for preventing short-circuiting between wirings. The touch display device includes a dam forming a boundary with an encapsulation unit covering the light emitting elements, and the dam is formed such that a height thereof in a region overlapping with a wiring connected to a touch electrode provided on the encapsulation unit and a height thereof in a region not overlapping with the wiring are different from each other, thereby preventing a short circuit between the wirings.)

1. A touch display device comprising:

a light emitting element disposed on a substrate;

a packaging unit disposed on the light emitting element;

a plurality of touch electrodes disposed on the encapsulation unit;

a wiring connected to the plurality of touch electrodes; and

at least one weir formed such that a height thereof in a region overlapping with the wiring and a height thereof in a region not overlapping with the wiring are different from each other.

2. The touch display device of claim 1, wherein the at least one weir comprises:

a low weir provided in a region overlapping with the wiring; and

a high weir disposed in a region not overlapping the wire, the high weir having a higher height than the low weir.

3. The touch display device of claim 2, wherein the low weir is disposed between the wires.

4. The touch display device of claim 2, wherein the high weirs are disposed between the wires.

5. The touch display device of claim 1, wherein the at least one weir comprises:

a first weir disposed adjacent to an active region where the light emitting element is disposed; and

a second weir spaced apart from the first weir and farther from the active region than the first weir,

wherein the first weir comprises:

a first low weir provided in a region overlapping with the wiring; and

a first high weir provided in a region not overlapping with the wiring, the first high weir having a higher height than the first low weir, and

wherein the second weir comprises:

a second low weir provided in a region overlapping with the wiring; and

a second high weir disposed in a region not overlapping with the wiring, the second high weir having a higher height than the first low weir.

6. The touch display device of claim 5, wherein the first and second low weirs are disposed between the wires.

7. The touch display device of claim 5, wherein the first and second high weirs are disposed between the wires.

8. The touch display device of claim 5, wherein the first low weir has a lower height than the second low weir.

9. The touch display device of claim 5, wherein a separation distance between the first high weir and the second high weir is shorter than a separation distance between the first low weir and the second low weir.

10. The touch display device of claim 5, wherein each of the first and second high weirs comprises:

a first sub-weir disposed on the substrate;

a second sub-weir disposed on a top surface and a side surface of the first sub-weir; and

a third sub-weir disposed on the second sub-weir.

11. The touch display device of claim 10, wherein at least one of the first and second low weirs comprises at most two of the first to third sub-weirs.

12. The touch display device of claim 10, wherein at least one of the first and second low weirs comprises the first to third sub-weirs, and

wherein any one of the first to third sub-weirs included in the first and second low weirs has a lower height than any one of the first to third sub-weirs included in the first and second high weirs.

13. The touch display device of claim 10, further comprising:

a thin film transistor connected to the light emitting element;

a pixel planarization layer disposed on the thin film transistor;

a bank disposed on the pixel planarization layer; and

a spacer disposed on the bank.

14. The touch display device of claim 13, wherein the first sub-weir is formed of the same material as the pixel planarization layer,

wherein the second sub-weir is formed of the same material as the bank, and

wherein the third sub-weir is formed of the same material as the spacer.

15. The touch display device of claim 1, wherein the wiring is disposed along a side surface of the encapsulation unit.

16. The touch display device of claim 1, wherein the encapsulation unit comprises a plurality of inorganic encapsulation layers and at least one organic encapsulation layer.

17. The touch display device of claim 16, further comprising:

a touch pad electrically connected to the wiring.

18. The touch display device of claim 17, wherein at least one of the plurality of inorganic encapsulation layers extends more toward the touch pad than the at least one organic encapsulation layer.

19. The touch display device of claim 1, wherein the at least one weir is formed below the routing.

Technical Field

The present invention relates to a touch display device, and more particularly, to a touch display device for preventing a short circuit between wirings.

Background

A touch screen is an input device through which a user can input a command by selecting an instruction displayed on a screen of a display device using a hand or an object. That is, the touch screen converts a contact position in direct contact with a hand of a person or an object into an electric signal, and receives a selected instruction based on the contact position as an input signal. Such a touch screen may replace a separate input device, such as a keyboard or a mouse, which is connected to and operated by a display device, and thus the application range of the touch screen is continuously increasing.

Recently, research and development have been actively conducted on a touch screen integrated display device in which a touch screen is disposed on a display panel such as a liquid crystal display panel or an organic electroluminescent display panel. However, in a process of manufacturing a wiring for driving a touch screen, a short circuit may occur between adjacent wirings.

Disclosure of Invention

Accordingly, the present invention is directed to a touch display device that substantially obviates one or more problems due to limitations and disadvantages of the related art.

An object of the present invention is to provide a touch display device for preventing a short circuit between wirings.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these objects and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, a touch display device includes a dam forming a boundary with an encapsulation unit covering a light emitting element, and the dam is formed such that a height thereof in a region overlapping with a wiring (the wiring is connected to a touch electrode provided on the encapsulation unit) and a height thereof in a region not overlapping with the wiring are different from each other, thereby preventing a short circuit between the wirings.

It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principle of the invention. In the drawings:

fig. 1 is a perspective view showing a touch display device according to the present invention;

fig. 2 is a plan view illustrating the touch display device shown in fig. 1;

FIG. 3 is a cross-sectional view of the touch display device taken along lines I-I 'and II-II' of FIG. 2;

FIG. 4 is an enlarged plan view of area A in FIG. 2;

FIG. 5 is a plan view showing another embodiment of the weir shown in FIG. 2;

FIG. 6 is a plan view showing in detail the weir shown in FIGS. 2 and 5;

fig. 7A and 7B are perspective views illustrating the first and second weirs shown in fig. 6;

FIG. 8 is a cross-sectional view of the weir taken along line III-III' of FIG. 6;

FIGS. 9A-9C are cross-sectional views of the weir taken along line IV-IV' in FIG. 6;

fig. 10 is a sectional view illustrating a touch display device including an auxiliary electrode according to the present invention; and is

Fig. 11 is a sectional view illustrating a touch display device according to another embodiment of the present invention.

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings.

Fig. 1 is a perspective view of a touch display device according to the present invention.

The touch display device shown in fig. 1 senses the presence or absence of a touch and a touch position by sensing a change in a mutual capacitance Cm (touch sensor) or a self-capacitance in response to a user touch by the touch electrodes 152e and 154e shown in fig. 2 during a touch period. The touch display device shown in fig. 1 displays an image by a unit pixel including the light emitting element 120. As shown in fig. 1, the unit pixel is composed of red (R), green (G), and blue (B) sub-pixels SP, and W sub-pixels SP, which are arranged in rows, or formed in a Pentile structure. The touch display device includes a plurality of sub-pixels SP arranged in a matrix on a substrate 111, a packing unit 140 disposed on the plurality of sub-pixels SP, and a touch sensor Cm disposed on the packing unit 140.

The substrate 111 is formed of a plastic material or a glass material, which is flexible so as to be foldable or bendable. For example, the substrate 111 is formed of Polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polycarbonate (PC), Polyethersulfone (PES), Polyacrylate (PAR), Polysulfone (PSF), or Cyclic Olefin Copolymer (COC).

As shown in fig. 2 and 3, the touch sensor Cm includes a touch insulating film 156 disposed on the encapsulation unit 140, and further includes a touch sensing line 154 and a touch driving line 152 disposed to cross each other, with the touch insulating film 156 interposed between the touch sensing line 154 and the touch driving line 152. The touch sensor Cm charges using a touch driving pulse supplied to the touch driving line 152 and discharges the charge to the touch sensing line 154.

The touch driving line 152 includes a plurality of first touch electrodes 152e and a first bridge 152b electrically connecting the first touch electrodes 152e to each other.

The first touch electrodes 152e are spaced apart from each other at regular intervals in the X direction as a first direction on the touch insulating film 156. Each first touch electrode 152e is electrically connected to an adjacent first touch electrode 152e via a first bridge 152 b.

The first bridge 152b is formed on the second inorganic encapsulation layer 146 or on a touch buffer film (not shown) disposed on the second inorganic encapsulation layer. The first bridge 152b is exposed through a touch contact hole 150 penetrating the touch insulating film 156, and is electrically connected to the first touch electrode 152 e.

The touch sensing line 154 includes a plurality of second touch electrodes 154e and a second bridge 154b electrically connecting the second touch electrodes 154e to each other.

The second touch electrodes 154e are spaced apart from each other at regular intervals in the Y direction as the second direction on the touch insulating film 156. Each of the second touch electrodes 154e is electrically connected to an adjacent second touch electrode 154e via a second bridge 154 b.

The second bridge 154b is disposed on the touch insulating film 156 coplanar with the second touch electrode 154e, and thus is electrically connected to the second touch electrode 154e in a state without a separate contact hole.

According to the present invention, each of the touch driving lines 152 and the touch sensing lines 154 is connected to a touch driving unit (not shown) via a wiring 160 and a touch pad 170.

The touch pad 170 is connected to a signal transfer film (not shown) on which the touch driving unit is mounted. The touch pad 170 is composed of a first touch pad electrode 172 and a second touch pad electrode 174.

The first touch pad electrode 172 is disposed on at least one of the substrate 111, the buffer layer 112, and the interlayer insulating film 114 disposed under the encapsulation unit 140. The first touch pad electrode 172 is formed of the same material as at least one of the gate electrode 132, the source electrode 136, and the drain electrode 138 of the driving transistor T2130 on the same plane, and has a single layer structure or a multi-layer structure. For example, since the first touch pad electrode 172 is formed of the same material as the source and drain electrodes 136 and 138 and disposed on the interlayer insulating film 114, the first pad electrode 172 is formed through the same mask process as the source and drain electrodes 136 and 138.

The second touch pad electrode 174 is electrically connected to the first touch pad electrode 172, and the first touch pad electrode 172 is exposed through a pad contact hole 176 penetrating the protective film 108 and the touch insulating film 156.

Since the second touch pad electrode 174 is formed through the same mask process as the first and second touch electrodes 152e and 154e, the second touch pad electrode 174 is formed of the same material as the first and second touch electrodes 152e and 154e on the same plane. The second touch pad electrode 174 extends from the wiring 160 and thus is electrically connected to the wiring 160 in a state where there is no separate contact hole.

In addition, the second touch pad electrode 174 is exposed to the outside and is connected to a signal transmission film (not shown) on which the touch driving unit is mounted via an anisotropic conductive film.

The display pads 178 are also disposed in the non-active area (bezel) where the touch pads 170 are disposed. For example, as shown in FIG. 2, the display pads 178 may be disposed between the touch pads 170, or the touch pads 170 may be disposed between the display pads 178. Alternatively, the touch pad 170 may be disposed at one side of the display panel, and the display pad 178 may be disposed at the opposite side of the display panel. However, the arrangement of the touch pads 170 and the display pads 178 is not limited to the structure shown in fig. 2, and may be variously changed according to the design requirements of the display device.

The display pad 178 is formed in a stacked structure different from that of the touch pad 170, or in the same stacked structure as that of the touch pad 170.

The wiring 160 transmits a touch driving pulse generated in the touch driving unit to the touch driving line 152, and transmits a touch signal from the touch sensing line 154 to the touch driving unit through the touch pad. Accordingly, the wiring 160 is formed between each of the first and second touch electrodes 152e and 154e and the touch pad 170 to electrically connect each of the first and second touch electrodes 152e and 154e to the touch pad 170.

The wiring 160 is disposed on the second inorganic encapsulation layer 146, the touch insulation film 156, or the touch buffer film (not shown) along the side surface of the encapsulation unit 140. As shown in fig. 2, the wiring 160 extends from the first touch electrode 152e to at least one of the left and right sides of the active area AA, and is connected to the touch pad 170. In addition, the wiring 160 extends from the second touch electrode 154e to at least one of the upper and lower sides of the active area, and is connected to the touch pad 170. Such an arrangement of the wiring 160 may be variously changed according to design requirements of the display device. The wire 160 is disposed over the at least one weir 180 or 190 to intersect the at least one weir 180 or 190.

A touch protection film (not shown) is formed to cover the wiring 160, the touch electrodes 152e and 154e, and the bridges 152b and 154 b. A touch protective film (not shown) prevents the touch electrodes 152e and 154e and the bridges 152b and 154b from being damaged by external impact or moisture.

According to the present invention, each of the first and second touch electrodes 152e and 154e is formed in an area corresponding to the plurality of sub-pixels SP in consideration of the size of an area touched by a user. For example, each of the touch electrodes 152e and 154e is formed in an area several times to several hundred times larger than the size of one sub-pixel SP.

The first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b are formed in a single-layer structure or a multi-layer structure using an opaque metal (e.g., Ta, Ti, Cu, or Mo) having high corrosion resistance and acid resistance and having excellent conductivity, or formed in a single-layer structure or a multi-layer structure using a transparent conductive film based on ITO, IZO, IGZO, or ZnO and an opaque metal. For example, the first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b are formed of a low-resistance metal Ti/Al/Ti. Accordingly, the resistance and capacitance of each of the touch electrodes 152e and 154e and the bridges 152b and 154b are reduced. As a result, the RC time constant is reduced, thereby improving the touch sensitivity.

As shown in fig. 3 and 4, the first and second touch electrodes 152e and 154e and the first and second bridges 152B and 154B including the opaque metal are formed in a mesh shape such that they do not overlap with the light emitting regions of the red (R), green (G), and blue (B) sub-pixels SP, but overlap with the banks 128 disposed between the light emitting regions.

The first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154b formed in a mesh shape overlap the bank 128 and have a line width equal to or less than a line width of the bank 128. Accordingly, it is possible to prevent the aperture ratio and the transmittance from being deteriorated due to the first and second touch electrodes 152e and 154e and the first and second bridges 152b and 154 b.

Each sub-pixel SP includes a pixel driving circuit and a light emitting element 120 connected to the pixel driving circuit.

The pixel driving circuit includes a switching transistor Tl, a driving transistor T2, and a storage capacitor Cst. In the present invention, a structure in which the pixel driving circuit includes two transistors T and one capacitor C is described by way of example, but the present invention is not limited thereto. That is, a pixel driving circuit having a 3T1C structure or a 3T2C structure (in which three or more transistors T and one or more capacitors C are provided) may be used.

The switching transistor T1 is turned on when a scan pulse is supplied to the scan line SL, and supplies a data signal supplied to the data line DL to the storage capacitor Cst and the gate of the driving transistor T2.

The driving transistor T2 controls a current supplied from a high Voltage (VDD) supply line to the light emitting element 120 in response to a data signal supplied to the gate of the driving transistor T2, thereby adjusting the amount of light emitted from the light emitting element 120. Even when the switching transistor T1 is turned off, a constant amount of current is supplied to the light emitting element 120 by using the voltage charged in the storage capacitor Cst, thereby causing the driving transistor T2 to maintain light emission by the light emitting element 120 until a data signal of the next frame is supplied.

As shown in fig. 3, the driving thin film transistor T2130 includes: a semiconductor layer 134, the semiconductor layer 134 being disposed on the buffer layer 112; a gate electrode 132, the gate electrode 132 overlapping with the semiconductor layer 134 with the gate insulating film 102 interposed between the gate electrode 132 and the semiconductor layer 134; and a source electrode 136 and a drain electrode 138, the source electrode 136 and the drain electrode 138 being formed on the interlayer insulating film 114 so as to be in contact with the semiconductor layer 134. The semiconductor layer 134 is formed of at least one of an amorphous semiconductor material, a polycrystalline semiconductor material, and an oxide semiconductor material.

The light emitting element 120 includes an anode 122, a light emitting stack 124 formed on the anode 122, and a cathode 126 formed on the light emitting stack 124.

The anode electrode 122 is electrically connected to a drain electrode 138 of the driving thin film transistor T2130, and the drain electrode 138 is exposed through a pixel contact hole penetrating the pixel planarization layer 118.

At least one light emitting stack 124 is formed on the anode 122 in a light emitting region defined by the bank 128. The at least one light emitting stack 124 is formed by stacking a hole-related layer, an organic light emitting layer, and an electron-related layer in this order or in reverse order on the anode 122. In addition, the light emitting stack 124 may include a first light emitting stack and a second light emitting stack facing each other with the charge generation layer interposed therebetween. In this case, the organic light emitting layer of any one of the first and second light emitting stacks generates blue light, and the organic light emitting layer of the other one of the first and second light emitting stacks generates yellow-green light, thereby generating white light through the first and second light emitting stacks. Since the white light generated in the light emitting laminate 124 is incident on the color filter positioned above or below the light emitting laminate 124, a color image can be realized. Alternatively, colored light corresponding to each sub-pixel may be generated in each light emitting stack 124 without a separate color filter to achieve a color image. That is, the light emitting stack 124 of the red (R) sub-pixel may generate red light, the light emitting stack 124 of the green (G) sub-pixel may generate green light, and the light emitting stack 124 of the blue (B) sub-pixel may generate blue light.

The cathode 126 is formed to face the anode 122, and the light emitting stack 124 is disposed between the cathode 126 and the anode 122.

The encapsulation unit 140 prevents external moisture or oxygen from entering the light emitting element 120 that is susceptible to the external moisture or oxygen. To this end, the encapsulation unit 140 includes a plurality of inorganic encapsulation layers 142 and 146 and an organic encapsulation layer 144 disposed between the plurality of inorganic encapsulation layers 142 and 146. An inorganic encapsulation layer 146 is disposed on top of the encapsulation unit 140. In this case, the encapsulation unit 140 includes at least two inorganic encapsulation layers 142 and 146 and at least one organic encapsulation layer 144. In the present invention, the structure of the encapsulation unit 140 in which the organic encapsulation layer 144 is disposed between the first inorganic encapsulation layer 142 and the second inorganic encapsulation layer 146 will be described by way of example.

The first inorganic encapsulating layer 142 is formed on the substrate 111 on which the cathode 126 has been formed at a position closest to the light emitting element 120. The first inorganic encapsulation layer 142 is made of an inorganic insulating material (e.g., silicon nitride (SiN)) capable of being deposited at a low temperature_x) Silicon oxide (SiO)_x) Silicon oxynitride (SiON) or aluminum oxide (Al)₂O₃) ) is formed. Accordingly, since the first inorganic encapsulation layer 142 is deposited in a low temperature atmosphere, damage to the light emitting stack 124, which is easily affected by a high temperature atmosphere, may be prevented in the process of depositing the first inorganic encapsulation layer 142.

The second inorganic encapsulation layer 146 is formed on the substrate 111 on which the organic encapsulation layer 144 has been formed, covering the top surface and the side surfaces of each of the organic encapsulation layer 144 and the first inorganic encapsulation layer 142. Accordingly, the second inorganic encapsulation layer 146 minimizes or prevents external moisture or oxygen from penetrating into the first inorganic encapsulation layer 142 and the organic encapsulation layer 144. The second inorganic encapsulation layer 146 is made of, for example, silicon nitride (SiN)_x) Silicon oxide (SiO)_x) Silicon oxynitride (SiON) or aluminum oxide (Al)₂O₃) The inorganic insulating material of (1).

The organic encapsulation layer 144 serves to relieve stress between layers due to bending of the organic light emitting display device and to improve planarization performance. The organic encapsulation layer 144 is formed of an organic insulating material such as acrylic, epoxy, polyimide, polyethylene, or silicon oxycarbide (SiOC).

When the organic encapsulation layer 144 is formed by the inkjet method, at least one weir 180 or 190 is provided to prevent the organic encapsulation layer 144 in a liquid state from being diffused to the edge of the substrate 111. The at least one dam 180 or 190 may prevent the organic encapsulation layer 144 from being diffused to a pad region formed at the outermost portion of the substrate 111, in which the touch pad 170 and the display pad 178 are disposed. To this end, as shown in fig. 2, at least one dam 180 or 190 may be formed to completely surround the active region where the light emitting element 120 is disposed, or as shown in fig. 5, at least one dam 180 or 190 may be formed only between the active region and the pad region. When the pad region provided with the touch pad 170 and the display pad 178 is disposed at one side of the substrate 111, at least one dam 180 or 190 is disposed only at the one side of the substrate 111. When the pad region provided with the touch pad 170 and the display pad 178 is disposed at the opposite side of the substrate 111, at least one dam 180 or 190 is disposed at the opposite side of the substrate 111. In the present invention, a structure in which at least one weir includes a first weir 180 and a second weir 190 spaced apart from each other will be described by way of example.

As shown in fig. 6, the first weir 180 is disposed close to the active region and includes a first low weir 182 and a first high weir 184 having different heights from each other. As shown in fig. 7A and 7B, the height LH1 of the first low weir 182 is formed lower than the height LH2 of the second low weir 192.

The second weir 190 is disposed farther from the active region than the first weir 180, and includes a second low weir 192 and a second high weir 194 having different heights from each other. As shown in fig. 7A, 7B and 8, the height HH2 of the second high weir 194 is formed to be equal to or higher than the height HH1 of the first high weir 184.

The first and second high weirs 184 and 194 are disposed in a region not overlapping with the wiring 160, and are formed to have a height higher than that of the first and second low weirs 182 and 192. The first and second low weirs 182 and 192 are disposed in a region overlapping the wiring 160 and are formed to have a height lower than that of the first and second high weirs 184 and 194.

In this case, as shown in fig. 7A, the first low weir 182 and the second low weir 192 are disposed between the wirings 160. Alternatively, as shown in fig. 7B, the first high dam 184 and the second high dam 194 are disposed between the wirings 160.

As shown in fig. 8, each of the first and second high weirs 184 and 194 is formed in a three-layered structure in which first to third sub weirs 188a, 188b and 188c are sequentially stacked.

The first sub-weirs 188a are formed together of the same material as the pixel planarization layer 118 through the same mask process.

The second sub-weirs 188b are formed together of the same material as the dikes 128 by the same mask process. The second sub-weir 188b is disposed on the side surface and the top surface of the first sub-weir 188a to cover the side surface and the top surface of the first sub-weir 188 a. Since the second sub-weir 188b increases the bottom surface area of each of the weir 180 and the weir 190, the weir 180 and the weir 190 are prevented from collapsing.

Spacers (not shown) are disposed on the banks 128 to support a Fine Metal Mask (FMM) for forming the light emitting stack 124. The third sub-weirs 188c are formed together of the same material as the spacers by the same mask process. The third sub-weir 188c is formed on the top surface of the second sub-weir 188 b.

The first and second low weirs 182 and 192 are formed to have a height lower than that of the first and second high weirs 184 and 194. That is, as shown in fig. 9A to 9C, each of the first and second low weirs 182 and 192 has a two-layer or less layer structure using at most two of the first to third sub-weirs 188a, 188b, and 188C. In this case, the second low weir 192 disposed farther from the active region is formed higher than the first low weir 182 disposed closer to the active region.

Each of the first and second low weirs 182 and 192 shown in fig. 9A is formed as a two-layer structure composed of two of the first to third sub-weirs 188a, 188b and 188 c. The height of any one of the two sub weirs included in the second low weir 192 is formed to be higher than the height of any one of the two sub weirs included in the first low weir 182. For example, each of the first and second low weirs 182 and 192 is formed as a two-layer structure composed of the first and second sub-weirs 188a and 188 b. The second low weir 192 is formed in a two-layer structure in which a first sub-weir 188a higher than the first sub-weir 188a of the first low weir 182 and as high as the first sub-weir 188a of the first high weir 184, and a second sub-weir 188b are sequentially stacked.

The first low weir 182 shown in fig. 9B is formed in a single-layer structure composed of any one of the first to third sub-weirs 188a, 188B and 188c, and the second low weir 192 is formed in a two-layer structure composed of two of the first to third sub-weirs 188a, 188B and 188 c.

The first low weir 182 shown in fig. 9C is formed in a two-layer structure composed of two of the first to third sub-weirs 188a, 188b and 188C. The second low weir 192 is formed as a three-layer structure in which the first to third sub-weirs 188a, 188b and 188c are sequentially stacked. At least one of the first to third sub-weirs 188a, 188b and 188c included in the second low weir 192 is formed to have a height lower than that of at least one of the first to third sub-weirs 188a, 188b and 188c included in the second high weir 194. For example, first sub-weir 188a included in second low weir 192 is formed to have a lower height than that of first sub-weir included in second high weir 194.

In this way, since the first and second low weirs 182 and 192 overlapping the wiring 160 are formed to have a lower height than the first and second high weirs 184 and 194, the valley between the first and second low weirs 182 and 192 is formed to be shallower than the valley between the first and second high weirs 184 and 194. Therefore, when the wiring 160 is patterned to cross the first and second low weirs 182 and 192, a residual film of the wiring 160 does not remain in a shallow valley between the first and second low weirs 182 and 192, thereby preventing a short circuit between the wirings 160.

The spaced distance D2 between the first low weir 182 and the second low weir 192 having the lower height is formed to be longer than the spaced distance D1 between the first high weir 184 and the second high weir 194 having the higher height. Therefore, even when the organic encapsulation layer 144 is diffused over the first low weir 182, a moving path of the organic encapsulation layer 144 is increased due to an increase in a spaced distance between the first low weir 182 and the second low weir 192, thereby preventing the organic encapsulation layer 144 from being diffused over the second low weir 192.

As shown in fig. 10, the auxiliary electrode 196 may be disposed on the first sub-weir 188a of each of the first low weir 182 and the first high weir 184. The auxiliary electrode 196 is not disposed between the weir 180 and the weir 190, but is disposed between the first sub-weir 188a of each of the first low weir 182 and the first high weir 184 and the pixel planarization layer 118. Accordingly, the height of each of the first low weir 182 and the first high weir 184 may be increased while maintaining a shallow depth of the valley between the weir 180 and the weir 190, thereby preventing the organic encapsulation layer 144 from spreading over the second low weir 192 and the second high weir 194.

The cathode 126 is connected to a low Voltage (VSS) supply line 106 through an auxiliary electrode 196. A low Voltage (VSS) supply line 106 is formed on the substrate 111 using the same material as the source and drain electrodes 136 and 138. The auxiliary electrode 196 is disposed between the low Voltage (VSS) supply line 106 and the cathode 126, and electrically connects the low Voltage (VSS) supply line 106 to the cathode 126. The auxiliary electrode 196 is formed of the same material as the cathode 126.

Fig. 11 is a sectional view showing a touch display device according to a second embodiment of the present invention.

The touch display device shown in fig. 11 includes the same components as the touch display device shown in fig. 3, except that it further includes a black matrix 164. Therefore, detailed description of the same components will be omitted.

The black matrix 164 is disposed to overlap the bank 128. The black matrix 164 serves to distinguish the sub-pixel regions and prevent optical interference and light leakage between adjacent sub-pixel regions. The black matrix 164 is formed of a black insulating material with high resistance, or is formed by laminating at least two of a red (R) color layer, a green (G) color layer, and a blue (B) color layer.

In addition, since the black matrix 164 has light absorption, reflection of external light by the touch electrodes 152e and 154e and the bridges 152b and 154b may be reduced, thereby preventing the touch electrodes 152e and 154e and the bridges 152b and 154b from being visible under the external light. In addition, the black matrix 164 may be disposed to also overlap the wiring 160, thereby reducing reflection of external light by the wiring 160.

The touch planarization layer 162 is formed under the black matrix 164 using an organic insulating material, and planarizes the substrate 111 on which the touch electrodes 152e and 154e and the bridges 152b and 154b are formed.

The color filter may be disposed between the black matrices 164. That is, the color filter is disposed to overlap each sub-pixel SP. When the emission layer included in the light emitting stack 124 emits white light, the color filter is disposed on the encapsulation unit 140. When the light emitting layers included in the light emitting laminate 124 emit red, green, and blue light corresponding to the respective sub-pixels, the color filter may be omitted from the display device.

In the present invention, a structure in which a color filter array including at least one of the touch planarization layer 162, the color filter, or the black matrix 164 is disposed on the touch electrodes 152e and 154e is described by way of example. Alternatively, the color filter array may be disposed under the touch electrodes 152e and 154e, particularly, between the touch electrodes 152e and 154e and the encapsulation unit 140.

When the color filter array is disposed between the touch electrodes 152e and 154e and the encapsulation unit 140, a spaced distance between the touch electrodes 152e and 154e and the light emitting elements 120 is increased due to the color filter array. Accordingly, a capacitance value of a parasitic capacitance formed between the touch electrodes 152e and 154e and the light emitting element 120 may be minimized, and thus, mutual influence between the touch electrodes 152e and 154e and the light emitting element 120 due to coupling between the touch electrodes 152e and 154e and the light emitting element 120 may be prevented.

The present invention is also applicable to a touch display device having a bending region.

As is apparent from the above description, the touch display device according to the present invention includes a weir formed such that a shape of the weir in a region overlapping with the wiring and a shape of another weir in a region not overlapping with the wiring are different from each other. Therefore, the depth of the valley between the weirs can be reduced, thereby preventing the occurrence of short circuits between the wirings.

In addition, since the height of the dam formed in the region not overlapping with the wire is higher than the height of the dam formed in the region overlapping with the wire, the organic encapsulation layer can be prevented from diffusing to the pad region above the dam.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.