阅读说明：本技术 一种设备故障分析方法 (Equipment fault analysis method ) 是由 李军 李建祥 张翅飞 满亚勤 钟用 程莹 何晓亮 于 2021-01-26 设计创作，主要内容包括：本发明属于故障分析技术领域,具体公开一种设备故障分析方法,包括如下步骤：S1：获取目标设备的原始红外热像图像,并获取原始红外热像图像的温度数据；S2：根据温度数据,对原始红外热像图像进行温度修正,得到温度修正红外热像图像；S3：对温度修正红外热像图像进行轮廓提取,得到若干故障区域；S4：获取各个故障区域的故障判定数据,并根据故障判定数据得到故障分析结果。本发明解决了现有技术存在的人力成本投入大、检测效率低以及无法观测故障区域的细节导致故障分析精确度低的问题。(The invention belongs to the technical field of fault analysis, and particularly discloses an equipment fault analysis method, which comprises the following steps: s1: acquiring an original infrared thermal image of target equipment, and acquiring temperature data of the original infrared thermal image; s2: according to the temperature data, temperature correction is carried out on the original infrared thermal image to obtain a temperature corrected infrared thermal image; s3: carrying out contour extraction on the temperature correction infrared thermal image to obtain a plurality of fault areas; s4: and acquiring fault judgment data of each fault area, and obtaining a fault analysis result according to the fault judgment data. The invention solves the problems of high labor cost investment, low detection efficiency and low fault analysis accuracy caused by incapability of observing details of a fault area in the prior art.)

1. An equipment fault analysis method is characterized in that: the method comprises the following steps:

s1: acquiring an original infrared thermal image of target equipment, and acquiring temperature data of the original infrared thermal image;

s2: according to the temperature data, temperature correction is carried out on the original infrared thermal image to obtain a temperature corrected infrared thermal image;

s3: carrying out contour extraction on the temperature correction infrared thermal image to obtain a plurality of fault areas;

s4: and acquiring fault judgment data of each fault area, and obtaining a fault analysis result according to the fault judgment data.

2. The equipment fault analysis method according to claim 1, characterized in that: the temperature data of the step S1 includes the temperature maximum value of the original infrared thermal image and the preset value of the temperature range of interest.

3. The equipment fault analysis method according to claim 2, characterized in that: the specific steps of step S2 are as follows:

s2-1: acquiring a power function conversion value of temperature correction according to the temperature data, and initializing the power function conversion value;

s2-2: and according to the initialized power function conversion value, performing temperature correction on the original infrared thermal image to obtain a temperature corrected infrared thermal image.

4. The equipment fault analysis method according to claim 3, wherein: in step S2-1, the formula of the temperature-corrected power function conversion value is:

E＝Ceil[(T_max-T_min)/N_TOI]

in which E is a power functionA transformed value; ceil [. X]Returning a function as a minimum integer; t is_max、T_minRespectively representing the maximum value and the minimum value of the temperature of the original infrared thermal image in the temperature data; the N _ TOI is a preset interesting temperature range value of the original infrared thermal image in the temperature data.

5. The equipment fault analysis method according to claim 3, wherein: in step S2-1, the initialization formula of the power function transform value is:

in the formula, E is a power function conversion value.

6. The equipment fault analysis method according to claim 3, wherein: in step S2-2, the formula of the temperature correction is:

in the formula, N (i, j) is a temperature value of the temperature correction infrared thermal image; f (i, j) is the temperature value of the original infrared thermal image; i. j is a transverse indicating quantity and a longitudinal indicating quantity respectively; e is a power function transformation value; a is a setting parameter of gray value offset; b is a setting parameter of the bending degree of the curve and the stretching degree; c is a setting parameter of the temperature value offset.

7. The equipment fault analysis method according to claim 1, characterized in that: the specific method of step S3 is as follows: and preprocessing the temperature correction infrared thermal image to obtain a preprocessed image, and extracting the outline of the preprocessed image to obtain a plurality of fault areas.

8. The equipment fault analysis method according to claim 7, wherein: the preprocessing comprises gray processing and binarization processing of the temperature correction infrared thermal image.

9. The equipment fault analysis method according to claim 1, characterized in that: the specific steps of step S4 are as follows:

s4-1: filling and extracting each fault area to obtain a corresponding range area image;

s4-2: acquiring the area of the range area image to obtain corresponding fault judgment data;

s4-3: obtaining a corresponding fault grade according to the fault judgment data;

s4-4: and obtaining a fault analysis result according to the fault grade.

10. The equipment fault analysis method according to claim 9, wherein: in step S4-3, the specific method for presetting the fault level is as follows: and acquiring historical fault judgment data of all target devices, and performing grade division according to the historical fault judgment data to obtain corresponding fault grades.

Technical Field

The invention belongs to the technical field of fault analysis, and particularly relates to an equipment fault analysis method.

Background

The power equipment mainly comprises power generation equipment and power supply equipment, and the planned maintenance system adopted by most power equipment in a power system has serious defects, such as frequent temporary maintenance, insufficient maintenance or excessive maintenance, blind maintenance and the like, so that the equipment maintenance cost is huge in all countries in the world every year. How to rationally arrange the maintenance of power equipment, save the maintenance expense, reduce the maintenance cost, guarantee simultaneously that the system has higher reliability, be an important subject to system operation personnel.

The problems existing in the prior art are as follows:

1) the mode of patrolling and examining depends on the manual work to overhaul power equipment mostly, and this kind of mode human cost drops into greatly, and detection efficiency is low to rely on experienced workman to carry out analysis and judgement to specific fault situation usually, its failure diagnosis accuracy is low, because there is the error in manual diagnosis, causes serious incident easily and leads to the fault situation to continue to enlarge.

2) The fault area is mainly concentrated in the higher region of temperature, that is to say the detection temperature interval that really needs to pay close attention to accounts for a small proportion, and the temperature of air in the detection range is lower for whole temperature interval is great, can't observe the detail in fault area, just also can't help patrolling and examining personnel to make accurate judgement.

Disclosure of Invention

The present invention aims to solve at least one of the above technical problems to a certain extent.

Therefore, the invention aims to provide an equipment fault analysis method, which is used for solving the problems of high labor cost investment, low detection efficiency and low fault analysis accuracy caused by incapability of observing details of a fault area in the prior art.

The technical scheme adopted by the invention is as follows:

an equipment fault analysis method comprises the following steps:

s1: acquiring an original infrared thermal image of target equipment, and acquiring temperature data of the original infrared thermal image;

s2: according to the temperature data, temperature correction is carried out on the original infrared thermal image to obtain a temperature corrected infrared thermal image;

s3: carrying out contour extraction on the temperature correction infrared thermal image to obtain a plurality of fault areas;

s4: and acquiring fault judgment data of each fault area, and obtaining a fault analysis result according to the fault judgment data.

Further, the temperature data of step S1 includes the temperature maximum value of the original infrared thermography image and the preset temperature range of interest value.

Further, the specific step of step S2 is:

s2-1: acquiring a power function conversion value of temperature correction according to the temperature data, and initializing the power function conversion value;

s2-2: and according to the initialized power function conversion value, performing temperature correction on the original infrared thermal image to obtain a temperature corrected infrared thermal image.

Further, in step S2-1, the formula of the temperature-corrected power function conversion value is:

E＝Ceil[(T_max-T_min)/N_TOI]

in the formula, E is a power function transformation value; ceil [. X]Returning a function as a minimum integer; t is_max、T_minRespectively representing the maximum value and the minimum value of the temperature of the original infrared thermal image in the temperature data; the N _ TOI is a preset interesting temperature range value of the original infrared thermal image in the temperature data.

Further, in step S2-1, the initialization formula of the power function transform value is:

in the formula, E is a power function conversion value.

Further, in step S2-2, the formula of the temperature correction is:

in the formula, N (i, j) is a temperature value of the temperature correction infrared thermal image; f (i, j) is the temperature value of the original infrared thermal image; i. j is a transverse indicating quantity and a longitudinal indicating quantity respectively; e is a power function transformation value; a is a setting parameter of gray value offset; b is a setting parameter of the bending degree of the curve and the stretching degree; c is a setting parameter of the temperature value offset.

Further, the specific method of step S3 is: and preprocessing the temperature correction infrared thermal image to obtain a preprocessed image, and extracting the outline of the preprocessed image to obtain a plurality of fault areas.

Further, the preprocessing comprises gray processing and binarization processing of the temperature correction infrared thermal image.

Further, the specific step of step S4 is:

s4-1: filling and extracting each fault area to obtain a corresponding range area image;

s4-2: acquiring the area of the range area image to obtain corresponding fault judgment data;

s4-3: obtaining a corresponding fault grade according to the fault judgment data;

s4-4: and obtaining a fault analysis result according to the fault grade.

Further, in step S4-3, the specific method for presetting the fault level is as follows: and acquiring historical fault judgment data of all target devices, and performing grade division according to the historical fault judgment data to obtain corresponding fault grades.

The invention has the beneficial effects that:

the invention provides an equipment fault analysis method, which avoids manual inspection, reduces the labor cost investment and improves the inspection efficiency, and under the condition that the temperature interval is not changed, the temperature difference stretching method of the high-temperature area is adopted, so that the temperature correction infrared thermal image can show more high-temperature part details, the fault positioning is accurately realized, the intelligent fault analysis is carried out on the target equipment, and the fault analysis accuracy is improved while the intellectualization is realized.

Other advantageous effects of the present invention will be described in detail in the detailed description.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a flow chart of a method of device fault analysis.

Detailed Description

The invention is further described with reference to the following figures and specific embodiments. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Functional details disclosed herein are merely illustrative of example embodiments of the invention. This invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention. When the terms "comprises," "comprising," "includes," and/or "including" are used herein, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and/or groups thereof.

It should also be noted that, in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may, in fact, be executed substantially concurrently, or the figures may sometimes be executed in the reverse order, depending upon the functionality/acts involved.

It should be understood that specific details are provided in the following description to facilitate a thorough understanding of example embodiments. However, it will be understood by those of ordinary skill in the art that the example embodiments may be practiced without these specific details. For example, systems may be shown in block diagrams in order not to obscure the examples in unnecessary detail. In other instances, well-known processes, structures and techniques may be shown without unnecessary detail in order to avoid obscuring example embodiments.

Example 1

In this embodiment, an equipment fault analysis system is firstly established, the equipment fault analysis system includes a thermal infrared imager, a microprocessor, a communication module and a data analysis center, the thermal infrared imager, the microprocessor and the communication module are arranged at each target device, the microprocessor is respectively in communication connection with the thermal infrared imager and the communication module, the communication module is in communication connection with the data analysis center, the thermal infrared imager is used for acquiring an original thermal infrared image of the target device and sending the original thermal infrared image to the microprocessor, the microprocessor sends the original thermal infrared image to the data analysis center through the communication module for equipment fault analysis, manual inspection is avoided, labor cost investment is reduced, and inspection efficiency is improved.

The thermal infrared imager is a device which converts an image of temperature distribution of a target object into a visible image by means of infrared radiation detection of the target object, signal processing, photoelectric conversion and the like by using an infrared thermal imaging technology, accurately quantifies actually detected heat and images the whole of the target object in a surface form in real time, so that a suspected fault area which is generating heat can be accurately identified, an operator preliminarily judges heating conditions and fault positions by an image color displayed on a screen and a hotspot tracking display function and strictly analyzes the heating conditions and the fault positions at the same time, and high efficiency and high accuracy are realized in problem confirmation.

As shown in fig. 1, the present embodiment provides an apparatus fault analysis method, including the following steps:

s1: acquiring an original infrared thermal image of target equipment, and acquiring temperature data of the original infrared thermal image;

the temperature data comprises the temperature maximum value of the original infrared thermal image and a preset interesting temperature range value;

s2: according to the temperature data, temperature correction is carried out on the original infrared thermal image to obtain a temperature corrected infrared thermal image, and the specific steps are as follows:

s2-1: acquiring a power function conversion value of temperature correction according to the temperature data, and initializing the power function conversion value;

the formula of the temperature-corrected power function transform value is:

E＝Ceil[(T_max-T_min)/N_TOI]

in the formula, E is a power function transformation value; ceil [. X]Returning a function as a minimum integer; t is_max、T_minRespectively representing the maximum value and the minimum value of the temperature of the original infrared thermal image in the temperature data; n _ TOI is a preset interesting temperature range value of an original infrared thermal image in temperature data;

the initialized formula of the power function transformation value is as follows:

in the formula, E is a power function transformation value;

s2-2: according to the initialized power function transformation value, temperature correction is carried out on the original thermal infrared image to obtain a temperature corrected thermal infrared image, the display range of a high-temperature area of the original thermal infrared image is enlarged, so that the corrected thermal image can show more high-temperature part details, under the normal condition, the mapping of temperature values and gray values is the average mapping in a temperature interval, in the scheme, function transformation is used for revising the temperature values, the temperature difference of the high-temperature area is stretched, and the temperature difference of the low-temperature area is compressed;

the formula for the temperature correction is:

in the formula, N (i, j) is a temperature value of the temperature correction infrared thermal image; f (i, j) is the temperature value of the original infrared thermal image; i. j is a transverse indicating quantity and a longitudinal indicating quantity respectively; e is a power function transformation value; a is a setting parameter of gray value offset; b is a setting parameter of the bending degree of the curve and the stretching degree; c is a setting parameter of temperature value offset;

s3: preprocessing the temperature correction infrared thermal image to obtain a preprocessed image, and extracting the outline of the preprocessed image to obtain a plurality of fault areas;

the preprocessing comprises gray processing and binarization processing of the temperature correction infrared thermal image;

the gray processing maps the corrected temperature value to a gray value, can display more details of a high-temperature part of the original infrared thermal image, and then carries out binarization processing, so that subsequent contour extraction is facilitated;

traversing the binary image, determining a non-zero point as a starting point, sequentially searching for non-zero values in 8 adjacent pixels, using the non-zero values as subsequent traversal points, continuously searching according to the same method, simultaneously screening and combining special conditions such as intersection and overlapping of contour lines, and the like, finally splicing adjacent connected areas to obtain the contour of a fault area, and obtaining a plurality of fault areas according to the contour;

s4: acquiring fault judgment data of each fault area, and obtaining a fault analysis result according to the fault judgment data, wherein the method specifically comprises the following steps:

s4-1: filling and extracting each fault area in the temperature correction infrared thermal image to obtain a corresponding range area image, wherein in the embodiment, the range area image is taken as an area array, and if a plurality of range area images exist, the range area images are respectively extracted as a plurality of area arrays;

s4-2: acquiring the area of the range area image, and respectively carrying out area calculation and form calculation on the single area array to obtain corresponding fault judgment data;

s4-3: obtaining a corresponding fault grade according to the fault judgment data;

the specific method for presetting the fault grade comprises the following steps: acquiring historical fault judgment data of all target devices, and performing grade division according to the historical fault judgment data to obtain corresponding fault grades, wherein the fault grades are shown in a table 1;

TABLE 1

Failure class	Description of faults
		S	Serious defect, must stop
A	More serious defect, to be confirmed manually
		B	General defects, which may be temporarily left unprocessed, require statistical data to be included
C	Is normal

S4-4: according to the fault levels, a fault analysis result is obtained, namely the fault description of the current target equipment can be obtained according to each fault level in the table 1, and the specific fault condition of the current target equipment can be obtained by a worker.

It will be apparent to those skilled in the art that the modules or steps of the present invention described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and they may alternatively be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, or fabricated separately as individual integrated circuit modules, or fabricated as a single integrated circuit module from multiple modules or steps. Thus, the present invention is not limited to any specific combination of hardware and software.

The embodiments described above are merely illustrative, and may or may not be physically separate, if referring to units illustrated as separate components; if reference is made to a component displayed as a unit, it may or may not be a physical unit, and may be located in one place or distributed over a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: modifications of the technical solutions described in the embodiments or equivalent replacements of some technical features may still be made. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

The present invention is not limited to the above-described alternative embodiments, and various other forms of products can be obtained by anyone in light of the present invention. The above detailed description should not be taken as limiting the scope of the invention, which is defined in the claims, and which the description is intended to be interpreted accordingly.