阅读说明：本技术 用于地板中的粘结件、地板及地板的制作方法 (Adhesive part for floor, floor and manufacturing method of floor ) 是由 胡敬牧 柯马克 于 2019-02-02 设计创作，主要内容包括：本发明提供一种地板,包括表面层、基材层和粘结件,所述粘结件设于所述表面层和所述基材层之间。所述粘结件包括第一粘结层和与所述第一粘结层连接的第二粘结层。所述第一粘结层由液态的第一粘结剂固化形成,所述第一粘结层粘结所述表面层,且液化后的所述第一粘结层在所述表面层的表面上的润湿角小于预设润湿角。所述第二粘结层由液态的第二粘结剂固化形成,所述第二粘结层粘结所述基材层,液化后的所述第二粘结层在所述基材层的表面上的润湿角小于预设润湿角。本发明采用所述粘结件粘结所述基材层和所述表面层,解决了现有地板中基材层和表面层之间容易分离,地板容易受损的问题。(The invention provides a floor which comprises a surface layer, a base material layer and a bonding piece, wherein the bonding piece is arranged between the surface layer and the base material layer. The adhesive member includes a first adhesive layer and a second adhesive layer connected to the first adhesive layer. The first bonding layer is formed by solidifying a liquid first bonding agent, the first bonding layer is bonded with the surface layer, and the wetting angle of the liquefied first bonding layer on the surface of the surface layer is smaller than a preset wetting angle. The second bonding layer is formed by solidifying a liquid second binder, the second bonding layer is bonded with the base material layer, and the wetting angle of the liquefied second bonding layer on the surface of the base material layer is smaller than a preset wetting angle. The invention adopts the bonding piece to bond the substrate layer and the surface layer, and solves the problems that the substrate layer and the surface layer are easy to separate and the floor is easy to damage in the existing floor.)

A bonding piece is used for bonding a surface layer and a base material layer in a floor and is characterized by comprising a first bonding layer and a second bonding layer connected with the first bonding layer, wherein the first bonding layer is formed by curing a liquid first bonding agent and is used for bonding the surface layer, and the wetting angle of the liquefied first bonding layer on the surface of the surface layer is smaller than a preset wetting angle; the second bonding layer is formed by solidifying a liquid second binder, the second bonding layer is used for bonding the base material layer, and the wetting angle of the liquefied second bonding layer on the surface of the base material layer is smaller than a preset wetting angle.

A bonding element according to claim 1, wherein the predetermined wetting angle is less than or equal to 90 °.

An adhesive member according to claim 1 or 2, further comprising a carrier connected between the first adhesive layer and the second adhesive layer, the carrier comprising a first surface and a second surface arranged opposite to the first surface, the first adhesive layer being formed by curing the first adhesive in the liquid state on the first surface, the second adhesive layer being formed by curing the second adhesive in the liquid state on the second surface, the wetting angle of the first adhesive in the liquid state on the first surface and the wetting angle of the second adhesive in the liquid state on the second surface both being smaller than the preset wetting angle.

The bonding member according to claim 3, wherein the first surface and the second surface have the same or different roughness.

The adhesive of claim 3, wherein the wetting angle of the first liquid adhesive on the first surface is less than the wetting angle of the first liquefied adhesive layer on the surface of the surface layer, and/or the wetting angle of the second liquid adhesive on the second surface is less than the wetting angle of the second liquefied adhesive layer on the surface of the substrate layer.

A bonding member according to claim 1, wherein the first bonding agent is the same as or different from the second bonding agent.

A floor panel, comprising: a surface layer, a substrate layer, and the adhesive member according to any one of claims 1 to 6, the adhesive member being provided between the surface layer and the substrate layer, the first adhesive layer being adhered to the surface layer, and the second adhesive layer being adhered to the substrate layer.

Floor panel as claimed in claim 7, characterized in that the floor panel further comprises a further surface layer, which is located on the side of the substrate layer facing away from the bonding element and is connected to the substrate layer.

-floor panel according to claim 8, characterized in that it also comprises a further adhesive element, which is connected between the further surface layer and the substrate layer.

-floor panel according to any of the claims 7 to 9, characterized in that the surface of the surface layer facing away from the adhesive element is a rough surface.

-floor panel according to any of the claims 7 to 10, characterized in that it also comprises a wear layer, which is laminated to the surface of the surface layer facing away from the adhesive.

A method of manufacturing a floor panel for use in manufacturing a floor panel according to any of claims 7-11, comprising:

providing a base material layer, a bonding piece and a surface layer which are sequentially stacked;

hot-pressing the surface layer, the adhesive member and the substrate layer to melt the first adhesive layer and the second adhesive layer, wherein the first adhesive layer melts to form a liquid first adhesive on the surface of the surface layer facing the substrate layer, the wetting angle of the liquid first adhesive on the surface of the surface layer facing the substrate layer is smaller than the preset wetting angle, the second adhesive layer melts to form a liquid second adhesive on the surface of the substrate layer facing the surface layer, and the wetting angle of the liquid second adhesive on the surface of the substrate layer facing the surface layer is smaller than the preset wetting angle;

and cooling and solidifying the liquid first adhesive and the liquid second adhesive so as to enable the bonding piece to bond the surface layer and the substrate layer.

The method of manufacturing a floor panel as claimed in claim 12, wherein the step of providing the base material layer, the adhesive member, and the surface layer, which are sequentially stacked, further comprises: providing another adhesive member and another surface layer, wherein the another surface layer, the another adhesive member, the base material layer, the adhesive member, and the surface layer are laminated in this order.

The method of manufacturing a floor panel as claimed in claim 13, wherein the step of hot-pressing the surface layer, the adhesive member and the base material layer comprises: hot-pressing the surface layer, the adhesive member, the base material layer, the another adhesive member, and the another surface layer to melt the first adhesive layer and the second adhesive layer of the adhesive member and the another adhesive member;

the step of cooling and solidifying the liquid first adhesive and the liquid second adhesive comprises: the first binder in a liquid state and the second binder in a liquid state are cooled and solidified to cause the bonding member to bond the surface layer and the base material layer and simultaneously cause the other bonding member to bond the base material layer and the other surface layer.

The method of making a floor panel as claimed in claim 13, further comprising: hot-pressing the surface layer, the adhesive member, the substrate layer, the other adhesive member and the other surface layer to melt a first adhesive layer and a second adhesive layer of the other adhesive member, wherein the first adhesive layer melts to form a liquid first adhesive, and the second adhesive layer melts to form a liquid second adhesive;

and cooling and solidifying the liquid first adhesive and the liquid second adhesive so as to enable the other bonding piece to bond the base material layer and the other surface layer.