阅读说明：本技术 一种绑定引脚自动化转换方法及系统 (Automatic conversion method and system for binding pins ) 是由 刘司洋 王醉 于 2021-02-10 设计创作，主要内容包括：本发明公开了一种绑定引脚自动化转换方法及系统,该绑定引脚自动化转换方法包括：定义显示面板的绑定引脚的信号标识；通过电子设计自动化程序,自动识别所述显示面板的绑定引脚的信号标识,生成并输出电路板的绑定引脚的信号标识。通过电子设计自动化程序自动将显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识,代替了人工制定检查面内绑定引脚和面外电路绑定引脚的操作,提高了工作效率,降低了人为出错率,且降低了人工成本。(The invention discloses a binding pin automatic conversion method and a system, wherein the binding pin automatic conversion method comprises the following steps: defining a signal identifier of a binding pin of a display panel; and automatically identifying the signal identification of the binding pin of the display panel through an electronic design automation program, and generating and outputting the signal identification of the binding pin of the circuit board. The signal identification of the display panel binding pins is automatically converted into the signal identification of the circuit board binding pins through the electronic design automation program, the manual operation of binding the pins in the check surface and binding the pins in the out-of-plane circuit is replaced, the working efficiency is improved, the manual error rate is reduced, and the labor cost is reduced.)

1. An automatic conversion method for binding pins is characterized by comprising the following steps:

defining a signal identifier of a binding pin of a display panel;

and automatically identifying the signal identification of the binding pin of the display panel through an electronic design automation program, and generating and outputting the signal identification of the binding pin of the circuit board.

2. The method for automatically converting the bound pins according to claim 1, wherein the signal identifiers of the bound pins of the display panel comprise pin serial numbers and pin signals.

3. The automatic conversion method for the bonding pins of claim 2, wherein the pin numbers of the bonding pins of the display panel are sequentially arranged Arabic numbers, and the pin signals of the bonding pins of the display panel are electrical signals connected with the bonding pins of the display panel.

4. The method for automatically converting the binding pins of claim 2, wherein the signal identification of the binding pins defining the display panel comprises:

artificially defining binding pins of the display panel, and identifying the binding pins of the display panel by using the two levels of the pin serial numbers and the pin signals respectively, wherein each pin serial number corresponds to one pin signal respectively.

5. The method for automatically converting the bound pins according to claim 1, wherein the automatically recognizing the signal identifiers of the bound pins of the display panel and generating and outputting the signal identifiers of the bound pins of the circuit board by an electronic design automation program comprises:

automatically identifying the signal identification of the binding pin of the display panel through the electronic design automation program;

generating a signal identifier of a first binding pin of the chip on film according to the signal identifier of the binding pin of the display panel;

generating a signal identifier of a binding pin of the circuit board according to the signal identifier of the first binding pin of the chip on film;

and outputting the signal identification of the binding pin of the circuit board.

6. The method according to claim 5, wherein the first bonding pins of the COF are bonding pins of the display panel, and the first bonding pins of the COF are in one-to-one correspondence with the bonding pins of the display panel.

7. The method for automatically converting bonding pins according to claim 5, wherein the generating the signal identifier of the bonding pin of the circuit board according to the signal identifier of the first bonding pin of the chip on film comprises:

and automatically combining the signal identifications of the first binding pins of the chip on film, which are adjacent and have the same pin signals, through the electronic design automation program, and redefining the combined signal identifications in sequence to obtain the signal identifications of the binding pins of the circuit board.

8. The method according to claim 7, wherein the bonding pins of the circuit board are bonding pins bonded to the second bonding pins of the chip on film, the bonding pins of the circuit board correspond to the second bonding pins of the chip on film one to one, and the second bonding pins of the chip on film are pins that achieve electrical signal conduction with the first bonding pins of the chip on film inside the chip on film.

9. The method for automatically converting bonding pins according to claim 5, wherein the generating the signal identifier of the bonding pin of the circuit board according to the signal identifier of the first bonding pin of the chip on film comprises:

automatically merging the signal identifications of the first binding pins of the chip on film, which are adjacent and have the same pin signal, through the electronic design automation program, and redefining the merged signal identifications in sequence to obtain the signal identification of the second binding pins of the chip on film;

and generating the signal identifier of the binding pin of the circuit board according to the signal identifier of the second binding pin of the chip on film.

10. An automated pin binding conversion system, comprising:

the definition module is used for defining the signal identification of the binding pin of the display panel;

the identification module is used for automatically identifying the signal identification of the binding pin of the display panel;

the conversion module is used for converting the signal identification of the binding pin of the display panel into the signal identification of the binding pin of the circuit board; and

and the output module is used for outputting the signal identification of the binding pin of the circuit board.

Technical Field

The invention relates to the field of display, in particular to a method and a system for automatically converting a bound pin.

Background

In display panel's design process, the pin of binding of walking the line in the face needs and the connecting pin phase-match of off-plate circuit, and prior art is that to walk the connecting pin of binding pin and off-plate circuit of line in the face and carry out the manual work and formulate and the inspection, however, the pin of binding of walking the line in the face often has several hundreds or even thousands, and the mode inefficiency of manual work formulation and inspection, make mistakes easily and with high costs, is unfavorable for the development of panel design. Therefore, it is desirable to provide an automatic conversion method and system for binding pins to solve the above-mentioned problems.

Disclosure of Invention

The embodiment of the invention provides an automatic conversion method and system for binding pins, which are used for solving the problems of low efficiency, high error probability and high cost caused by the fact that the binding pins for checking in-plane routing and the binding pins for out-of-plane circuits need to be manually made in the design process of the existing panel.

The embodiment of the invention provides an automatic conversion method for binding pins, which comprises the following steps:

a binding pin automatic conversion method comprises the following steps:

defining a signal identifier of a binding pin of a display panel;

and automatically identifying the signal identification of the binding pin of the display panel through an electronic design automation program, and generating and outputting the signal identification of the binding pin of the circuit board.

Optionally, in some embodiments of the present invention, the signal identifier of the binding pin of the display panel includes a pin serial number and a pin signal.

Optionally, in some embodiments of the present invention, the pin numbers of the binding pins of the display panel are sequentially arranged arabic numbers, and the pin signals of the binding pins of the display panel are electrical signals connected to the binding pins of the display panel.

Optionally, in some embodiments of the present invention, the signal identifier defining the bonding pin of the display panel includes:

artificially defining binding pins of the display panel, and identifying the binding pins of the display panel by using the two levels of the pin serial numbers and the pin signals respectively, wherein each pin serial number corresponds to one pin signal respectively.

Optionally, in some embodiments of the present invention, the automatically recognizing, by an electronic design automation program, the signal identifier of the bonding pin of the display panel, and generating and outputting the signal identifier of the bonding pin of the circuit board includes:

automatically identifying the signal identification of the binding pin of the display panel through the electronic design automation program;

generating a signal identifier of a first binding pin of the chip on film according to the signal identifier of the binding pin of the display panel;

generating a signal identifier of a binding pin of the circuit board according to the signal identifier of the first binding pin of the chip on film;

and outputting the signal identification of the binding pin of the circuit board.

Optionally, in some embodiments of the present invention, the first bonding pin of the chip on film is a pin bonded to the bonding pin of the display panel, and the first bonding pin of the chip on film corresponds to the bonding pin of the display panel one to one.

Optionally, in some embodiments of the present invention, the generating the signal identifier of the bonding pin of the circuit board according to the signal identifier of the first bonding pin of the chip on film includes:

and automatically combining the signal identifications of the first binding pins of the chip on film, which are adjacent and have the same pin signals, through the electronic design automation program, and redefining the combined signal identifications in sequence to obtain the signal identifications of the binding pins of the circuit board.

Optionally, in some embodiments of the present invention, the bonding pins of the circuit board are pins that are bonded to the second bonding pins of the chip on film, the bonding pins of the circuit board correspond to the second bonding pins of the chip on film one to one, and the second bonding pins of the chip on film are pins that achieve electrical signal conduction with the first bonding pins of the chip on film inside the chip on film.

Optionally, in some embodiments of the present invention, the generating the signal identifier of the bonding pin of the circuit board according to the signal identifier of the first bonding pin of the chip on film includes:

automatically merging the signal identifications of the first binding pins of the chip on film, which are adjacent and have the same pin signal, through the electronic design automation program, and redefining the merged signal identifications in sequence to obtain the signal identification of the second binding pins of the chip on film;

and generating the signal identifier of the binding pin of the circuit board according to the signal identifier of the second binding pin of the chip on film.

Correspondingly, an embodiment of the present invention further provides an automatic conversion system for binding pins, including:

the definition module is used for defining the signal identification of the binding pin of the display panel;

the identification module is used for automatically identifying the signal identification of the binding pin of the display panel;

the conversion module is used for converting the signal identification of the binding pin of the display panel into the signal identification of the binding pin of the circuit board; and

and the output module is used for outputting the signal identification of the binding pin of the circuit board.

The embodiment of the invention adopts a binding pin automatic conversion method and a system, wherein the binding pin automatic conversion method comprises the following steps: defining a signal identifier of a binding pin of a display panel; and automatically identifying the signal identification of the binding pin of the display panel through an electronic design automation program, and generating and outputting the signal identification of the binding pin of the circuit board. According to the invention, through an electronic design automation program, the signal identification of the binding pin of the display panel is automatically converted into the signal identification of the binding pin of the circuit board, so that the manual formulation and inspection operation for the in-plane binding pin and the out-of-plane binding pin is replaced, the working efficiency is improved, the manual error rate is reduced, and the labor cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a first flowchart of an automated bound pin conversion method according to an embodiment of the present invention;

FIG. 2 is a second flowchart of an automated bound pin conversion method according to an embodiment of the present invention;

FIG. 3 is a first conversion diagram of an automated conversion method for binding pins according to an embodiment of the present invention;

FIG. 4 is a second conversion diagram of the automatic conversion method for binding pins according to the embodiment of the present invention;

FIG. 5 is a third conversion diagram of the automatic conversion method for binding pins according to the embodiment of the present invention;

FIG. 6 is a first block diagram of an automated bound pin conversion system according to an embodiment of the present invention;

FIG. 7 is a block diagram of a second configuration of the automatic pin binding conversion system according to an embodiment of the present invention;

fig. 8 is a block diagram of a third structure of the automatic binding pin converting system according to the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Furthermore, it should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, and are not intended to limit the present invention. In the present invention, unless otherwise specified, the use of directional terms such as "upper" and "lower" generally means upper and lower in the actual use or operation of the device, particularly in the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.

The embodiment of the invention provides a binding pin automatic conversion method and system. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

In an embodiment, referring to fig. 1, fig. 1 shows a first flowchart of an automatic bound pin conversion method according to an embodiment of the present invention, where the automatic bound pin conversion method according to an embodiment of the present invention includes:

s1, defining a signal identifier of a binding pin of the display panel;

specifically, a user manually specifies the definition of each binding pin of the display panel, and gives a signal identifier to each binding pin of the display panel, wherein the signal identifier includes a pin serial number and a pin signal. Optionally, the arabic numerals are used as pin serial numbers, and the first-level identification is performed on the binding pins of the display panel by the sequentially arranged arabic numerals. Meanwhile, the electric signals connected with the binding pins are used as pin signals, and each binding pin of the display panel is correspondingly connected with at least one in-plane signal line of the display panel, namely, the electric signals transmitted by the in-plane signal lines of the display panel connected with the binding pins of the display panel carry out second-level identification on the binding pins of the display panel.

Referring to fig. 3, fig. 3 is a first conversion diagram of the automatic conversion method for the bound pins according to the embodiment of the present invention, and specifically shows a signal identifier of the bound pins of the display panel. As shown in fig. 3, the display panel has 1098 binding pins, the binding pins of the display panel are sequentially labeled and ordered from left to right by using arabic numerals 1, 2, 3.... 1096, 1097, and 1098, and the arabic numerals corresponding to the binding pins are the pin numbers of the binding pins; meanwhile, each binding pin performs identification of a pin signal level using the electrical signals TESTD, tesc, vcomm 1...... VCOM2, TESTB, and tetsta to which the binding pin is connected. As shown in the figure, the electrical signal connected to the binding pin with pin number 1 is TESTD, the pin signal of the binding pin is TESTD, and the signal identifier of the binding pin is pin number 1 and pin signal TESTD; the electric signal connected with the binding pin with the pin serial number of 6 is AVCOMR, the pin signal of the binding pin is AVCOMR, and the signal identification of the binding pin is the pin serial number of 6 and the pin signal AVCOMR. Each binding pin of the display panel is provided with a pin serial number and a pin signal, each pin serial number corresponds to one pin signal, one pin signal can correspond to one or more pin serial numbers, and when one pin signal corresponds to a plurality of pin serial numbers at the same time, the pin serial numbers can be adjacent or not.

And S2, automatically identifying the signal identification of the binding pin of the display panel through an electronic design automation program, and generating and outputting the signal identification of the binding pin of the circuit board.

In an embodiment, referring to fig. 2, fig. 2 is a flowchart illustrating a second method for automatically converting a bound pin according to an embodiment of the present invention. As shown in fig. 2, the method for automatically identifying the signal identifier of the bonding pin of the display panel and generating and outputting the signal identifier of the bonding pin of the circuit board by an electronic design automation program includes:

s21, automatically identifying the signal identification of the binding pin of the display panel by the electronic design automation program;

specifically, after the signal identifier of the binding pin of the display panel is defined, an electronic design automation program (EDA) can automatically identify the signal identifier of the binding pin of the display panel and read the signal identifier of the binding pin of the display panel, including the pin number and the pin signal of the binding pin of the display panel.

Referring to fig. 4, fig. 4 is a schematic diagram illustrating a second conversion of the automatic conversion method for the bound pins according to the embodiment of the present invention, specifically a table diagram illustrating the conversion of the signal identifier of the bound pin of the display panel into the signal identifier of the bound pin of the circuit board, where fig. 4 corresponds to fig. 3. After the electronic design automation program automatically reads the signal identifier of the binding Pin of the display panel, a signal identifier table corresponding to the Pin number and the Pin signal of the binding Pin (ACD Cell Pin) of the display panel as shown in the first two rows in fig. 4 or fig. 5 is obtained.

S22, generating a signal identifier of a first binding pin of the chip on film according to the signal identifier of the binding pin of the display panel;

in the design of the display panel, the first binding pins of the chip on film are the pins bound with the binding pins of the display panel, and the first binding pins of the chip on film correspond to the binding pins of the display panel one to one. The first binding pins of the chip on film are in one-to-one corresponding binding connection with the binding pins of the display panel, so that the number of the first binding pins of the chip on film is the same as that of the binding pins of the display panel, the pin numbers of the first binding pins of the chip on film are in one-to-one correspondence with and are the same as those of the binding pins of the display panel, the pin signals of the first binding pins of the chip on film are in one-to-one correspondence with and are the same as those of the binding pins of the display panel, the pin numbers of the first binding pins of the chip on film are in one-to-one correspondence with and are matched with each other, and the matching result is the same as that of the pin numbers of the binding pins of the display panel and.

As shown in the third and fourth rows in fig. 4 or the third and fourth rows in fig. 5, a signal identification table corresponding to the Pin serial number and the Pin signal of the first bonding Pin (COF Cell Pin) of the chip on film is obtained. The COF also has 1098 first binding pins, the first binding pins (COF Cell pins) of the COF sequentially carry out label sequencing from left to right by using Arabic numerals 1, 2, 3, and. Meanwhile, a Pin signal of a first binding Pin (COF Cell Pin) with a Pin number of 1 is the same as a Pin signal of a binding Pin (ACD Cell Pin) of a display panel with a Pin number of 1, and is TESTD; a Pin signal of a first binding Pin (COF Cell Pin) with a Pin number of 2 is identical to a Pin signal of a binding Pin (ACD Cell Pin) of a display panel with a Pin number of 2, and is tescc; a Pin signal of a first bonding Pin (COF Cell Pin) with a Pin number of 3 is the same as a Pin signal of a bonding Pin (ACD Cell Pin) of a display panel with a Pin number of 3, and is VCOM 1; and so on.

S23, generating a signal identifier of the binding pin of the circuit board according to the signal identifier of the first binding pin of the chip on film;

specifically, the electronic design automation program automatically merges the signal identifications of the first binding pins of the adjacent chip on film with the same pin signal, and redefines the merged signal identifications in sequence to obtain the signal identifications of the second binding pins of the chip on film, wherein the signal identifications of the second binding pins of the chip on film comprise redefined pin serial numbers and pin signals. Similarly, each second pin signal has a pin number and a pin signal, one pin number corresponds to one pin signal, one pin signal may correspond to one or more pin numbers, and when one pin signal corresponds to multiple pin numbers at the same time, the pin numbers are not adjacent.

The pin signal of the first binding pin with the pin number 1 is different from the pin signal of the first binding pin with the pin number 2, so that the signal identifier that the pin signal with the pin number 1 is TESTD is reserved and is used as the signal identifier that the pin signal with the pin number 1 of the second binding pin is TESTD; the pin signal of the first binding pin with the pin number of 2 is different from the pin signal of the first binding pin with the pin number of 3, so that the signal identifier of which the pin number of 2 is the TESC is reserved and is used as the signal identifier of which the pin number of 2 is the TESC; the pin signals of the first binding pins with the pin serial numbers of 3, 4 and 5 are VCOM1, the signal identifications of the first binding pins with the pin serial numbers of 3, 4 and 5 which are adjacent are merged and used as the signal identification that the pin serial number of the second binding pin is 3 and the signal identification is VCOM 1; the pin signal of the first binding pin with the pin number of 6 is different from the pin signal of the first binding pin with the pin number of 7, so that the pin signal is sequentially redefined as the signal identifier that the pin number of the second binding pin is 4 and the signal identifier is AVCOMR; by analogy, a signal identification table corresponding to the Pin serial number and the Pin signal of the second bonding Pin (COF PCBA Pin) of the chip on film as shown in the fifth row and the sixth row in fig. 4 or the fifth row and the sixth row in fig. 5 is obtained.

In the design of the display panel, the second bonding pins of the chip on film are the pins bonded with the bonding pins of the circuit board, and the second bonding pins of the chip on film correspond to the bonding pins of the circuit board one to one. The second binding pins of the chip on film are in one-to-one corresponding binding connection with the binding pins of the circuit board, so that the number of the second binding pins of the chip on film is the same as that of the binding pins of the circuit board, the pin numbers of the second binding pins of the chip on film are in one-to-one correspondence with and the same as that of the binding pins of the circuit board, the pin signals of the second binding pins of the chip on film are in one-to-one correspondence with and the same as those of the binding pins of the circuit board, the pin numbers of the binding pins of the circuit board are in one-to-one correspondence with and are matched with each other, and the matching result is the same as the matching result of the pin numbers of the second binding. Namely, the signal identifier of the binding pin of the circuit board is completely the same as the signal identifier of the second binding pin of the chip on film. In one embodiment, after the signal identifier of the first bonding Pin of the chip on film is converted into the signal identifier of the second bonding Pin of the chip on film, a signal identifier table of the bonding Pin (PCBA Pin) of the circuit board is generated according to the signal identifier of the second bonding Pin of the chip on film, as shown in the seventh row and the eighth row in fig. 4. In the two embodiments, after the signal identifier of the first bonding pin of the chip on film is converted into the signal identifier of the second bonding pin of the chip on film, the signal identifier table of the second bonding pin of the chip on film is regarded as the obtained signal identifier table of the bonding pin of the circuit board, and compared with the previous embodiment, the signal identifier table of the bonding pin of the circuit board does not need to be generated according to the signal identifier of the second bonding pin of the chip on film, as shown in fig. 5.

For the convenience of identification, the adjacent tables belonging to the same pin signal in the signal identification table can be filled with the same color, and the adjacent tables belonging to different pin signals can be filled with different colors.

And S24, outputting the signal identification of the binding pin of the circuit board.

According to the automatic conversion method for the bound pins, the signal identification of the bound pins of the display panel is automatically converted into the signal identification of the bound pins of the circuit board through an electronic design automation program, the operation of manually setting and checking the in-plane bound pins and the out-of-plane bound pins is replaced, the working efficiency is improved, the manual error rate is reduced, and the labor cost is reduced.

Correspondingly, the embodiment of the invention also provides an automatic binding pin conversion system, which is used for implementing the automatic binding pin conversion method provided by the invention. Referring to fig. 6, fig. 6 is a block diagram illustrating a first structure of a bundled pin automatic conversion system according to an embodiment of the present invention, and as shown in fig. 6, the bundled pin automatic conversion system includes:

a definition module 61, configured to define a signal identifier of a binding pin of a display panel;

specifically, the user manually specifies the definition of each binding pin of the display panel through the definition module 61, and gives a signal identifier to each binding pin of the display panel, where the signal identifier includes a pin number and a pin signal. Optionally, the arabic numerals are used as pin serial numbers, and the first-level identification is performed on the binding pins of the display panel by the sequentially arranged arabic numerals. Meanwhile, the electric signal connected with the binding pin is used as a pin signal, and the second-level identification is carried out on the binding pin of the display panel through the electric signal.

The identification module 62 is used for automatically identifying the signal identifier of the binding pin of the display panel;

specifically, the identification module 62 automatically identifies the signal identifier of the binding pin of the display panel in the definition module 61, and reads the signal identifier of the binding pin of the display panel, including the pin number and the pin signal of the binding pin of the display panel.

The conversion module 63 is configured to convert the signal identifier of the binding pin of the display panel into the signal identifier of the binding pin of the circuit board;

specifically, the conversion module 63 obtains the pin number and the pin signal of the binding pin of the display panel read by the identification module 62, and converts the pin number and the pin signal of the binding pin of the circuit board into a signal identifier corresponding to the pin signal.

And the output module 64 is used for outputting the signal identification of the binding pin of the circuit board.

In an embodiment, referring to fig. 7, fig. 7 shows a second structural block diagram of the automatic bound pin conversion system according to the embodiment of the present invention, and as shown in fig. 7, the conversion module 63 includes:

a first generating unit 631, configured to generate a signal identifier of a first bonding pin of a chip on film according to the signal identifier of the bonding pin of the display panel;

specifically, the first generating unit 631 obtains the pin number and the pin signal of the bonding pin of the display panel read by the identification module 62, and generates the signal identifier of the first bonding pin of the chip on film. The pin number of the first binding pin of the chip on film corresponds to and is the same as the pin number of the binding pin of the display panel, the pin signal of the first binding pin of the chip on film corresponds to and is the same as the pin signal of the binding pin of the display panel, the pin number of the first binding pin of the chip on film corresponds to and is matched with the pin signal, and the matching result is the same as the matching result of the pin number of the binding pin of the display panel and the pin signal.

A conversion unit 632, configured to convert the signal identifier of the first bonding pin of the chip on film into a signal identifier of the second bonding pin of the chip on film;

specifically, the conversion unit 632 acquires the signal identifier of the first binding pin of the epi-film in the first generation unit 631, automatically merges the signal identifiers of the first binding pins of the epi-film adjacent to each other and having the same pin signal, and redefines the merged signal identifiers in sequence to acquire the signal identifier of the second binding pin of the epi-film, where the signal identifier of the second binding pin of the epi-film includes the redefined pin number and pin signal. Similarly, each second pin signal has a pin number and a pin signal, one pin number corresponds to one pin signal, one pin signal may correspond to one or more pin numbers, and when one pin signal corresponds to multiple pin numbers at the same time, the pin numbers are not adjacent.

A second generating unit 633, configured to generate a signal identifier of a bonding pin of the circuit board according to the signal identifier of the second signal bonding pin of the chip on film;

the second binding pins of the chip on film are the pins bound with the binding pins of the circuit board, and the second binding pins of the chip on film correspond to the binding pins of the circuit board one by one. The second binding pins of the chip on film are in one-to-one corresponding binding connection with the binding pins of the circuit board, so that the number of the second binding pins of the chip on film is the same as that of the binding pins of the circuit board, the pin numbers of the second binding pins of the chip on film are in one-to-one correspondence with and the same as that of the binding pins of the circuit board, the pin signals of the second binding pins of the chip on film are in one-to-one correspondence with and the same as those of the binding pins of the circuit board, the pin numbers of the binding pins of the circuit board are in one-to-one correspondence with and are matched with each other, and the matching result is the same as the matching result of the pin numbers of the second binding.

In another embodiment, referring to fig. 8, fig. 8 is a block diagram illustrating a third structure of an automatic bound pin conversion system according to an embodiment of the present invention, and as shown in fig. 8, a conversion module 63 includes:

a first generating unit 631, configured to generate a signal identifier of a first bonding pin of a chip on film according to the signal identifier of the bonding pin of the display panel; and

a conversion unit 632, configured to convert the signal identifier of the first bonding pin of the chip on film into the signal identifier of the bonding pin of the circuit board;

because the signal identifier of the binding pin of the circuit board is completely the same as the signal identifier of the second binding pin of the chip on film, the conversion of the signal identifier of the first binding pin of the chip on film into the signal identifier of the second binding pin of the chip on film is regarded as the conversion of the signal identifier of the first binding pin of the chip on film into the signal identifier of the binding pin of the circuit board.

The method and the system for automatically converting the bound pins provided by the embodiment of the invention are described in detail, a specific example is applied in the text to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.