阅读说明：本技术 后退高度的改进 (Improvements in retreat height ) 是由 A·霍弗拉克 C·B·M·范·米尔 R·J·赛克斯 于 2019-06-04 设计创作，主要内容包括：一种粘接测试设备,其配置用于确定存在于基底上的粘接和/或材料的强度,所述粘接测试设备包括：力测量模块,其用于对所述粘接和/或所述材料施加剪切力；以及位移模块和控制器,其被配置为用于控制力测量模块和位移模块之间的距离,从而可以设定剪切工具的剪切高度。(A bonding test apparatus configured to determine the strength of a bond and/or material present on a substrate, the bonding test apparatus comprising: a force measurement module for applying a shear force to the bond and/or the material; and a displacement module and a controller configured for controlling a distance between the force measurement module and the displacement module such that a shear height of the shear tool can be set.)

1. A bonding test apparatus configured for determining the strength of a bond and/or material present on a substrate, the bonding test apparatus comprising:

1) a force measurement module, comprising:

-a shearing tool configured for applying a shearing force to the bonding and/or the material;

2) a displacement module, comprising:

-a movable rigid body;

-a movable member configured for movably connecting the force measurement module to the displacement module, thereby providing a displacement distance between the rigid body and the force measurement module;

-a displacement sensor configured for measuring the displacement distance;

3) a controller configured to:

-monitoring the measured displacement distance;

-moving the rigid body towards the substrate and thereby also the force measurement module towards the substrate until the shear tool is in contact with the substrate to obtain a contact displacement distance;

-controlling the displacement member to clamp the force measurement module to the displacement module such that the distance between the substrate and the shear tool is the contact displacement distance;

-moving the rigid body and thereby also the force measurement module based on the contact displacement distance to set a shear height of the shear tool.

2. The adhesion testing apparatus of claim 1, wherein the force measurement module further comprises a shear sensor coupled to the shear tool and configured to measure the shear force applied.

3. The adhesion testing apparatus of any preceding claim, wherein the displacement sensor comprises a linear encoder having a grating and a readhead.

4. The adhesion testing apparatus of any one of the preceding claims, wherein the displacement member comprises:

-a piston, one end of which is connected to the force measuring module;

-a chamber which is expandable in a vertical direction in use, wherein the other end of the piston is connected to an expandable portion of the chamber;

-an inlet/outlet for introducing and removing fluid into and from the expandable chamber to expand and contract the expandable chamber to control the displacement distance between the displacement module and the force measurement module.

5. The adhesion test apparatus of any one of the preceding claims, wherein the controller is configured to detect contact of the shear tool with the substrate by monitoring a decrease in the measured displacement distance.

6. Method for determining the strength of a bond and/or a material present on a substrate using a bond testing apparatus according to any of the preceding claims, wherein the method comprises the steps of:

-monitoring, by the controller, the measured displacement distance;

-moving the rigid body, and thus the force measurement module, downwards by the controller until the shear tool is in contact with the substrate, thereby obtaining a contact displacement distance;

-controlling the displacement member by the controller to clamp the force measurement module to the displacement module such that the distance between the substrate and the shear tool is the contact displacement distance;

-moving, by the controller, the rigid body and thereby also the force measurement module based on the contact displacement distance to set a shear height of the shear tool.

7. The method of claim 6 and claim 4, wherein the controlling step comprises:

-introducing the fluid into the expandable chamber or removing the fluid from the expandable chamber.

8. The method of any of claims 6 to 7, wherein the step of moving the rigid body downward comprises:

-detecting contact of the shearing tool with the substrate by monitoring a decrease in the measured displacement distance.

Disclosure of Invention

It is an object of the present disclosure to provide a bond testing apparatus and corresponding method, which is capable of accurately setting the shear height of a shear tool.

In a first aspect of the present disclosure, there is provided a bonding test apparatus configured for determining the strength of a bond and/or a material present on a substrate, the bonding test apparatus comprising:

1) a force measurement module, comprising:

-a shearing tool configured for applying a shearing force to the bonding and/or the material;

2) a displacement module, comprising:

-a movable rigid body, preferably movable in a substantially vertical direction in use;

-a movable member configured for movably connecting the force measurement module to the displacement module, thereby providing a displacement distance between the rigid body and the force measurement module;

-a displacement sensor configured for measuring the displacement distance;

3) a controller configured to:

-monitoring the measured displacement distance;

-moving the rigid body towards the substrate and thereby also the force measurement module towards the substrate until the shear tool is in contact with the substrate to obtain a contact displacement distance;

-controlling the displacement member to clamp the force measurement module to the displacement module such that the distance between the substrate and the shear tool is the contact displacement distance;

-based on the contact displacement distance, preferably vertically moving the rigid body and thereby also preferably vertically moving the force measurement module to set a shear height of the shear tool.

Preferably, the force measurement module comprises a shear sensor connected to the shear tool and configured to measure the shear force applied.

In the context of the present disclosure, the displacement member may be formed in such a way that it acts as some kind of shock absorber. This enables the displacement member to be configured to connect the displacement module to the force measurement module such that the distance between these modules remains constant. The displacement member is then configured to absorb the impact, i.e. the shear tool is in contact with the substrate. The result is a smaller displacement distance between the force measuring module and the displacement module.

The displacement member is further formed such that it can be controlled such that the distance between the displacement module and the force measurement module is controllable. Thus, the displacement member may be operated as an active element by using hydraulic or pneumatic principles or any similar method.

The displacement member includes, for example:

-a piston, one end of which is connected to the force measuring module;

-a chamber which is expandable in a vertical direction in use, wherein the other end of the piston is connected to an expandable portion of the chamber;

-an inlet/outlet for introducing and removing fluid into and from the expandable chamber to expand and contract the expandable chamber to control the displacement distance between the displacement module and the force measurement module.

Drawings

Features of the present invention will become apparent from the following description with reference to the accompanying drawings, in which:

fig. 1 shows a schematic view of a shear tool and bond in an aligned position prior to testing the bond.

Fig. 2 shows a schematic view of the invention and the components it comprises.

Fig. 3a to 3b show schematic views of the operation sequence of the present invention when implementing accurate back-off.

Detailed Description

In the schematic view of fig. 1, an electrical (or semiconductor) component 1 is bonded to a base or substrate 2, which is the bond to be tested. There are many different types of "electrical components," including but not limited to electrical packages, silicon chips, copper conductors, and solder balls. There are also many different types of substrates including, but not limited to, FR4 or ceramic circuit boards and silicon chips. The shear tool 3 is mounted to a body 4, the body 4 being in most cases a force measuring system. The shear tool 3 is aligned at a set back distance D1 from the substrate 2. Then, the part and the shear tool were brought into contact in the direction of arrow 5 by the adhesion tester while maintaining the distance D1. When the tool collides with the electrical component 1, the adhesion is tested, typically recording the force from the sensor as well as the amount of movement in the direction of arrow 5 and the time taken. The quality of the bond is characterized by the force measurement and the type of failure in the bond (known as the "failure mode"). In the known art, the alignment accuracy of the receding distance D1 is typically ± 1 μm. The present invention can achieve this alignment accuracy, as well as substantially less alignment accuracy.

Fig. 2 shows a schematic view of the invention and the components it comprises. The shear tool 3 and body/sensor 4 are rigidly mounted to the member 6, the member 6 in turn being rigidly mounted to the member 7, but leaving the member 6 free to move relative to the member 7 in a range along the line 8. The lines 8 are substantially perpendicular to the top surface of the substrate 2. The relative positions of the parts 6 and 7 are measured by displacement sensors shown as parts 9 and 10. The accuracy of measuring the relative distance between the components 6 and 7 along the line 8 using the sensors 9, 10 should be of the order of 0.1 μm to 0.01 μm. In a preferred embodiment of the invention, but not limited to, the displacement sensor is a linear encoder having a grating 9 and a readhead 10. The component 6 may be firmly clamped to the component 7 by some method while the component 6 is still movable along the line 8, wherein the sub-micron repeatability along the line 8 between successive clamps is of the order of at least 0.1 μm. Methods for achieving this are known to those skilled in the art. In a preferred embodiment, the clamping is by supplying compressed air to the piston 17 via the port 11, pulling the piston 17 and then clamping the component 6 to the component 7.

The electrical component 1 and its substrate 2, known as a "sample" when combined, are mounted on a movable "platform" 12 such that the electrical component 1 and its substrate 2 can be moved relative to the tool 3 along an axis 13. The platform is known to those skilled in the art as a component that produces precise linear motion along an axis, in this case axis 13. There may also be another axis perpendicular to the plane of fig. 2, so that electrical components and other similar components can be moved to the testing position of the tool 3. The platform 12 is secured to the main frame 14. Likewise, a platform 15, also fixed to the frame 14, can move the component 7 along the axis 16. The combination of these platforms allows the tool 3 to be aligned/positioned in a number of different positions relative to the sample. For the purposes of the present invention, the platform 15 has an accuracy of at least 0.1 μm along the axis 16. For the purposes of the present invention, the tool 3 may advantageously be aligned to the set-back distance D1 and moved along the axis 13 to the sample. Fig. 2 is a preferred embodiment, but the present invention includes alternatives to accomplish the same purpose in different configurations, such as, but not limited to, securing the sample to frame 14 and providing movement of the tool along axis 13 by securing platform 12 to platform 15.

Fig. 3a to 3b show schematic views of the operation sequence of the present invention when implementing accurate back-off. The operation sequence is as follows: fig. 3a, 3b, 3c, and finally fig. 3d, where the tool is at the desired setback distance.

In fig. 3a the tool 3 is not at the desired setback height D1 and the tool 3 is at rest with all other components relevant to the present invention. It can be seen that there is a gap L1 between the parts 6 and 7.

In fig. 3b, the platform 15 drives the tool 3 along the axis of the line 8 and the parts connecting the tool 3 to the platform such that the tool 3 collides with the substrate 2. The contact between the tool 3 and the substrate 1 results in a reduction of the distance L1 to L2. The resulting movement between the parts 6 and 7 is detected by sensors 9, 10. Contact between the tool 3 and the substrate 2 may be detected by any method, but in a preferred embodiment is detected by sensors 9, 10. Upon detection of contact between the tool 3 and the substrate 2, the sensors 9, 10 register their measurement positions and may also instruct the platform 15 to stop. Preferably, the detection method that detects contact between the tool and the substrate and the quality and speed of the moving parts is designed so as not to damage the tool or the substrate.

In fig. 3c, the component 6 is clamped to the component 7 by moving along the axis of line 8 until the previously shown L2 is reduced to zero. This is achieved by supplying compressed air to port 11 to cause piston 17 to provide the clamping movement and clamping force as previously described in the preferred embodiment. The movement of the component 6 relative to the component 7 is detected and recorded by sensors 9, 10. The difference in position of the sensors 9, 10 in the steps shown in fig. 3b and 3c will be the distance parallel to the axis of the line 8 which now separates the tool 3 and the substrate 2.

In fig. 3D, the tool 3 is driven by the platform 15 to the required back-off distance, the platform 15 moving a distance L2 minus D1. In these illustrations, D1 is less than L2, so the tool has moved closer to the substrate. If the required D1 is greater than the L2 of these illustrated conventions, then the travel distance will be negative and the tool will move away from the substrate.