阅读说明：本技术 一种无荧光粉多基色led灯具的混光结构及其制备方法 (Light mixing structure of fluorescent powder-free multi-primary-color LED lamp and preparation method thereof ) 是由 罗昕 徐龙权 郭醒 王光绪 熊新华 付江 李宁 于 2021-01-26 设计创作，主要内容包括：本发明公开了一种无荧光粉多基色LED灯具的混光结构及其制备方法,该混光结构包括底板、基板、第一混光单元、第二混光单元。第一混光单元包含无荧光粉多基色LED灯珠,无荧光粉多基色LED灯珠包含四种不同主波长LED芯片。第二混光单元由呈四边形分布的第一混光单元组成,其内具有补色单元,混光结构制备时,根据补色单元设计不同的LED芯片排布结构,并利用固晶、焊接、封装工艺完成第一混光单元的制作,再根据补色单元设计,利用回流焊和安装工艺完成第二混光单元制作与布置。本发明能够消除无荧光粉多基色LED灯具中,不同单色光分别在不同方向富集而导致的灯具部分区域较明显的混光偏色现象,提高出光的光色均匀性。(The invention discloses a light mixing structure of a fluorescent powder-free multi-primary color LED lamp and a preparation method thereof. The first light mixing unit comprises a fluorescent powder-free multi-primary color LED lamp bead, and the fluorescent powder-free multi-primary color LED lamp bead comprises four LED chips with different main wavelengths. The second light mixing unit is composed of first light mixing units distributed in a quadrilateral shape, color complementing units are arranged in the second light mixing units, different LED chip arrangement structures are designed according to the color complementing units during preparation of the light mixing structure, manufacturing of the first light mixing units is completed through die bonding, welding and packaging processes, and manufacturing and arrangement of the second light mixing units are completed through reflow soldering and installation processes according to the color complementing unit design. The invention can eliminate the phenomenon of light mixing and color cast which is more obvious in partial areas of the lamp and is caused by the enrichment of different monochromatic light in different directions in the fluorescent powder-free multi-primary-color LED lamp, and improve the light color uniformity of the emergent light.)

1. The utility model provides a mixed light structure of no phosphor powder polybase color LED lamps and lanterns which characterized in that: the LED lamp comprises a bottom plate, a substrate, a first light mixing unit and a second light mixing unit, wherein the first light mixing unit comprises a fluorescent powder-free multi-primary-color LED lamp bead, and the fluorescent powder-free multi-primary-color LED lamp bead comprises four LED chips with different main wavelengths; the first light mixing units are arranged on the substrate, and the substrate is uniformly distributed on the bottom plate; the second light mixing unit is composed of four first light mixing units arranged in a quadrilateral shape, and a complementary color unit is arranged in the second light mixing unit.

2. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 1, wherein: the four adjacent first light mixing units forming the second light mixing unit are arranged in a square, rectangular or parallelogram shape.

3. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 1, wherein: the first light mixing unit has different chip arrangements, so that a complementary color unit is formed in the second light mixing unit.

4. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 3, wherein: the complementary color unit in the second light mixing unit is composed of LED chips with different dominant wavelengths from the adjacent first light mixing unit in the second light mixing unit and comprises a plurality of LED chips with four different dominant wavelengths in the second light mixing unit.

5. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 1, wherein: the packaging adhesive of the fluorescent powder-free multi-primary color LED lamp bead in the first light mixing unit is silica gel, epoxy resin or polyurethane, or silica gel, epoxy resin or polyurethane doped with a diffusion material, so that a primary optical lens of the fluorescent powder-free multi-primary color LED lamp bead is formed.

6. The method for preparing the light mixing structure of the fluorescent powder-free multi-primary color LED lamp according to claim 5, wherein the method comprises the following steps: the packaging method used by the packaging adhesive adopts one of direct chip on board packaging, silicon substrate packaging, metal substrate packaging, ceramic substrate packaging or glass fiber substrate packaging.

7. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 5, wherein: the diffusion material is one of silicon dioxide, titanium dioxide and organic silicon resin micro-nano scattering particles.

8. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 1, wherein: the LED lamp comprises a secondary optical lens, wherein the secondary optical lens is arranged on a substrate and covers the fluorescent powder-free multi-primary-color LED lamp bead.

9. The light mixing structure of the phosphor-free multi-primary color LED lamp according to claim 8, wherein: the secondary optical lens is made of one of polycarbonate, polymethyl methacrylate, glass, silica gel or epoxy resin.

10. A preparation method of a light mixing structure of a fluorescent powder-free multi-primary color LED lamp is characterized by comprising the following steps: firstly, adjusting the die bonding sequence of different dominant wavelength monochromatic light LED chips according to a designed complementary color unit, forming a monochromatic light LED chip layout or a plurality of different monochromatic light LED chip layouts of a first light mixing unit through a die bonding process, and completing the manufacture of the first light mixing unit by using ultrasonic gold wire welding and glue filling processes; secondly, according to the design of the complementary color unit, sequentially pasting the first light mixing units with different monochromatic light LED chips on the corresponding positions of the substrate printed with the solder paste by using a chip mounter, placing the substrate in a reflow furnace for reflow soldering, and uniformly arranging the substrate on the bottom plate in a screw fixing or colloid fixing mode; and finally, the complementary color unit in the second light mixing unit comprises a plurality of LED chips with four different main wavelengths, and the manufacturing of the light mixing structure is completed.

Technical Field

The invention relates to a semiconductor lighting technology, in particular to a light mixing structure for improving the light color uniformity of a fluorescent powder-free multi-primary color LED lamp and a preparation method thereof.

Background

According to the semiconductor lighting research plan of the United states energy agency, the limit value of the efficiency of synthesizing white light by the fluorescent powder-free multi-primary color LED is 350lm/W, which is larger than the limit value of the white light lighting efficiency excited by the fluorescent powder, which is 250lm/W, so that the eye of the research institutions at home and abroad is more and more focused in the research and development of the fluorescent powder-free multi-primary color LED lighting field, and the fluorescent powder-free multi-primary color LED white light lighting is the development trend of the next generation of semiconductor lighting technology. However, when the LED chips with multiple dominant wavelengths are packaged into the all-in-one phosphor-free multi-primary-color LED lamp bead, due to the difference in spatial layout of the LED chips with different dominant wavelengths in the phosphor-free multi-primary-color LED lamp bead, the light type of the monochromatic light may shift toward the direction of the position of the LED chip itself. Finally, light with different colors is enriched in different directions in the lamp, and a mixed light color cast phenomenon occurs on the lamp mask, the panel or the edge position of the lamp. If there is not many primary colors LED lamp pearl of phosphor powder and add big visual angle lens, the eccentric phenomenon of light type is more obvious, and can be towards the opposite direction skew of LED chip self position, and mixed light colour cast phenomenon is more serious.

Chinese patent No. CN103280443B, publication date 2016, 10, and 05, which discloses a multi-primary color combined COB and a method for manufacturing the same, wherein a light emitting region is divided on a substrate, and LED chips are welded on the light emitting region, and the LED lamp bead is composed of at least three colors of LED chips; the LED chips with different colors form a light mixing unit, the light mixing units are uniformly distributed in the light emitting area, first light mixing is carried out on the light mixing units, the LED chips with multiple colors are mixed to obtain needed colors, then light emitted by each light mixing unit is uniformly mixed, and uniform light emitting of monochromatic light in the whole light emitting surface is ensured. However, in the light source layout of the method, the relative positions of the single-color LED chips in the LED lamp bead are consistent, and the phenomenon of single-color light enrichment in a certain direction still exists, so that the phenomenon of regional mixed light color cast caused by the adoption of the multi-in-one fluorescent powder-free multi-primary-color pure LED cannot be eliminated.

Disclosure of Invention

The first objective of the present invention is to provide a light mixing structure capable of improving the light color uniformity of the emitted light, and the light mixing structure solves the problem of non-uniform light color on the face mask or panel of the fluorescent powder-free multi-primary color LED lamp by rearranging the LED chips and the lamp beads.

The second purpose of the invention is to provide a preparation method of the light mixing structure of the phosphor-free multi-primary color LED lamp, which can improve the color uniformity of the phosphor-free multi-primary color LED lamp and effectively improve the more obvious light mixing color cast phenomenon of the phosphor-free multi-primary color LED lamp.

The first object of the present invention is achieved by:

the utility model provides a mixed light structure of no phosphor powder polybase color LED lamps and lanterns which the characteristic is: the LED light source comprises a bottom plate, a substrate, a first light mixing unit and a second light mixing unit, wherein the first light mixing unit comprises a plurality of fluorescent powder-free multi-primary-color LED lamp beads, and each fluorescent powder-free multi-primary-color LED lamp bead comprises four LED chips with different main wavelengths; the first light mixing units are arranged on the substrate, and the substrate is uniformly distributed on the bottom plate; the second light mixing unit is composed of four first light mixing units arranged in a quadrilateral shape and comprises a complementary color unit.

Furthermore, four adjacent first light mixing units forming the second light mixing unit are arranged in a square, rectangular or parallelogram shape, so that a color complementing unit can be formed in the second light mixing unit to improve the space color uniformity of the lamp.

Further, the complementary color unit in the second light mixing unit is composed of LED chips with different dominant wavelengths in adjacent first light mixing units in the second light mixing unit, and the first light mixing units have different LED chip arrangement modes, so that the complementary color unit includes a plurality of monochromatic LED chips with four different dominant wavelengths from different first light mixing units.

Preferably, the first light mixing unit comprises four LED chips with different dominant wavelengths within the range of 380-780nm, the phosphor-free multi-primary-color LED lamp bead adopts a phosphor-free process, the packaging adhesive adopts silica gel, epoxy resin or polyurethane, or silica gel, epoxy resin or polyurethane doped with a diffusion material, so as to form a primary optical lens of the phosphor-free multi-primary-color LED lamp bead; the packaging method adopts one of direct chip on board packaging, silicon substrate packaging, metal substrate packaging, ceramic substrate packaging or glass fiber substrate packaging; the diffusion material is one of silicon dioxide, titanium dioxide or organic silicon resin micro-nano scattering particles, and the light mixing effect of the first light mixing unit is improved.

Preferably, the first light mixing unit can further optionally include a secondary lens, the secondary lens covers the phosphor-free multi-primary-color LED lamp bead, and the secondary optical lens is made of one of polycarbonate, polymethyl methacrylate, glass, silica gel or epoxy resin.

The second object of the invention is achieved by:

a preparation method of a light mixing structure of a fluorescent powder-free multi-primary color LED lamp comprises the following specific steps:

A. firstly, adjusting the die bonding sequence of different dominant wavelength monochromatic light according to a designed complementary color unit, and forming a chip layout or a plurality of different chip layouts of a first light mixing unit by using each monochromatic light LED chip in the first light mixing unit through a die bonding process; welding gold wires to the chip electrodes and the support electrodes by using a wire bonding machine after die bonding; packaging the bracket into a fluorescent powder-free multi-primary-color LED lamp bead by using a glue pouring process by using packaging glue as a primary lens for emitting and mixing light of the chip to finish the manufacture of the first light mixing unit; if the first light mixing unit comprises the secondary lens, the secondary optical lens is arranged on the substrate through the through hole or the adhesive, and covers the fluorescent powder-free multi-primary-color LED lamp bead to complete the manufacture of the first light mixing unit comprising the secondary lens;

B. secondly, printing solder paste on the substrate, placing the substrate printed with the solder paste at a pasting position on a pasting machine, and sequentially adsorbing the first light mixing units with different chip arrangements on the corresponding substrate by the pasting machine according to the design of a color complementing unit; setting the temperature of a reflow oven, and placing the substrate pasted with the first light mixing unit in the reflow oven for reflow soldering; welded after the substrate is cooled, the substrate is uniformly arranged on the bottom plate in a screw fixing or colloid fixing mode to enable the four adjacent light mixing units to be in quadrilateral distribution in the substrate to be adjacent, the first light mixing units form the second light mixing unit, the color complementing unit in the second light mixing unit contains four different dominant wavelength monochromatic light LED chips from the two adjacent first light mixing units, and finally, the manufacturing of the light mixing structure is completed.

Compared with the prior art, the technical scheme provided by the invention has the advantages that:

the LED chips with different dominant wavelengths are pre-mixed in the first light mixing unit, after the first light mixing unit pre-mixes light, the monochromatic LED chips have different relative positions in the two adjacent first light mixing units in the second light mixing unit, so that the color complementing unit formed by the monochromatic LED chips comprises four LED chips with different dominant wavelengths, light emitted by the first light mixing unit can further complement and mix light in space, the enrichment phenomenon of the monochromatic light of the fluorescent powder-free multi-primary-color LED lamp beads in a certain direction in space is eliminated, and the spatial light color uniformity of the fluorescent powder-free multi-primary-color LED lamp is further improved.

Drawings

FIG. 1 is a simplified diagram of a conventional phosphor-free first light mixing unit layout;

FIG. 2 is a schematic top view illustrating a conventional manufacturing process of a first light mixing unit according to the present invention;

FIG. 3 is a schematic cross-sectional view illustrating a conventional manufacturing process of a first light mixing unit according to the present invention;

fig. 4 is a schematic top view of a layout of a light mixing structure according to embodiment 1 of the present invention;

fig. 5 is an enlarged schematic view of a second light mixing unit in embodiment 1 of the invention;

fig. 6 is a schematic top view of a layout of a light mixing structure according to embodiment 2 of the present invention;

fig. 7 is an enlarged schematic view of a second light mixing unit in embodiment 2 of the invention.

Detailed Description

The technical solution in the embodiment of the present invention is further described below with reference to the drawings in the embodiment of the present invention. In addition, the drawings of the present invention are not to scale, but are to be understood as being simplified and not to scale.

Fig. 1 is a simplified schematic diagram of a layout of a first light mixing unit of a conventional phosphor-free multi-primary-color LED, in which a first light mixing unit 11 is disposed on a substrate 12, and the substrate 12 is uniformly disposed on a lamp bottom plate 13. Taking four monochromatic light LED chips with different dominant wavelengths, namely a blue light chip (B), a green light chip (G), a yellow light chip (Y) and a red light chip (R), as an example, the layout of the chip positions of the conventional phosphor-free multi-primary-color LED first light mixing unit is shown, and it can be seen that the arrangement directions of the LED chips with different colors are consistent in all the first light mixing units.

Fig. 2 and fig. 3 are schematic top view and schematic cross-sectional view of a manufacturing process of a phosphor-free multi-primary color LED lamp bead 111 in the conventional phosphor-free multi-primary color LED first light mixing unit 11 according to the present invention, where the phosphor-free multi-primary color LED lamp bead 111 includes a bracket 1111 and four different dominant wavelength monochromatic LED chips 1112, 1113, 1114, 1115, and further includes a potting adhesive 1116 encapsulating the phosphor-free multi-primary color LED lamp bead 111. The preparation process comprises the following steps:

A. the single-color LED chips 1112, 1113, 1114 and 1115 in the first light mixing unit 11 are placed on the bracket 1111 through a die bonding process;

B. encapsulating the bracket 1111 into a phosphor-free multi-primary-color LED lamp bead 111 by using an encapsulating process through an encapsulating adhesive 1116 to form a first light mixing unit 11;

C. if the secondary optical lens is selected, the secondary optical lens 112 is placed on the fluorescent-powder-free multi-primary-color LED lamp bead 111 to form the first light mixing unit 11 including the secondary optical lens.

In fig. 2, the LED chips are located in four directions, which causes the light to shift to the direction of the LED chips, and if the secondary optical lens is added, the light pattern will shift to the opposite direction of the LED chips because the LED chips are not located at the center of the secondary optical lens, and the shift is more obvious.

If the conventional first light mixing unit layout shown in fig. 1 is adopted as the light mixing structure, the color cast phenomenon of mixed light will occur on the mask of the whole luminaire finally due to the light type deviation shown in fig. 2. Fig. 1 is a comparison diagram of the present invention, which is useful for understanding two specific embodiments of the present invention. Two specific embodiments of the present invention will now be described.

Example 1:

fig. 4 is a schematic top view of the layout of the light mixing structure in embodiment 1, in which the first light mixing units 21 are disposed on the substrate 22, and the substrate 22 is uniformly disposed on the bottom plate 23 of the lamp. The four first light mixing units 21 at the upper left corner are combined into a second light mixing unit 24, so that the light source arrangement of the whole lamp can be seen, and the result is actually obtained by copying and translating the second light mixing unit 24.

Fig. 5 is an enlarged schematic view of the second light mixing unit 24 according to embodiment 1, wherein the second light mixing unit 24 includes first light mixing sub-units 241, 242, 243, and 244, respectively.

The first light mixing sub-units 241, 242, 243, and 244 are the same light mixing unit, that is, the first light mixing unit 21 belonging to the same LED chip arrangement position.

The arrangement positions of the four different dominant wavelength LED chips in the first light mixing subunit 241 are the same as that of the first light mixing subunit 244.

The arrangement positions of the four different dominant wavelength LED chips in the first light mixing subunit 242 are the same as those of the first light mixing subunit 243.

The first light-mixing subunit 242 is formed by rotating the first light-mixing subunit 241 by 180 degrees, and the first light-mixing subunit 244 is formed by rotating the first light-mixing subunit 243 by 180 degrees.

The yellow chip (Y) and the green chip (G) in the first light mixing subunit 241, and the red chip (R) and the blue chip (B) in the first light mixing subunit 243 form a complementary color unit 245.

The red chip (R) and the green chip (G) in the first light mixing subunit 241, and the yellow chip (Y) and the blue chip (B) in the first light mixing subunit 242 constitute a complementary color unit 246.

Since the light of the four LED chips with different dominant wavelengths in the complementary color units 245 and 246 can be mixed into white light in space, the color shift phenomenon of mixed light caused by single color light enrichment in the same direction is eliminated.

Similarly, the first light mixing subunit 243 and the first light mixing subunit 244, and the first light mixing subunit 242 and the first light mixing subunit 244 in the second light mixing unit 24 also improve the color cast phenomenon of mixed light according to the same light mixing complementary color principle.

The light mixing structure of example 1 can be realized by the following preparation method:

A. according to the design of the color complementing units 245 and 246, placing the single-color LED chips of the first mixed photon unit 241 on the bracket through a die bonding process, and welding gold wires on the chip electrodes and the bracket electrodes by a wire bonding machine to finally form an un-glue-poured bracket with only one LED chip arrangement position;

B. packaging the bracket into a fluorescent powder-free multi-primary-color LED lamp bead by using packaging glue through a glue filling process, wherein the packaging glue is silica gel, epoxy resin or polyurethane, or silica gel, epoxy resin or polyurethane doped with a diffusion material, so as to form a primary optical lens for mixing light emitted by the LED chip; the diffusion material is one of silicon dioxide, titanium dioxide and organic silicon resin micro-nano scattering particles, and is beneficial to further mixing light of the monochromatic light chips with four dominant wavelengths in the fluorescent powder-free multi-primary color LED lamp bead; the support packaging adopts one of direct chip packaging, metal substrate packaging, silicon substrate packaging, ceramic substrate packaging and glass fiber substrate packaging; the fabrication of the first light mixing subunits 241, 242, 243, 244 is completed.

C. Printing solder paste on the substrate 22, and placing the substrate 22 printed with the solder paste at a chip mounting position on a chip mounter; according to the design of the complementary color units 245 and 246, different first mixed photon units 241, 242, 243 and 244 are adsorbed by a chip mounter and are respectively pasted on corresponding substrates;

D. setting the temperature of the reflow furnace, and placing the substrate 22 with the first light mixing unit 21 attached thereon in the reflow furnace for reflow soldering; after the welded substrates 22 are cooled, the substrates are uniformly arranged on the lamp bottom plate 23 by screw fixation or colloid fixation according to the design of the complementary color units 245 and 246, the four first light mixing sub-units 241, 242, 243 and 244 which are distributed in a quadrilateral shape and are adjacent between the adjacent substrates 22 form a second light mixing unit 24, and the designed complementary color units 245 and 246 are formed in the second light mixing unit 24.

E. If the first light mixing subunits 241, 242, 243, and 244 include the secondary lens, the secondary optical lens is mounted on the substrate 22 through the through hole or the adhesive, and covers the fluorescent powder-free multi-primary color LED lamp bead; the secondary optical lens material is one of polycarbonate, polymethyl methacrylate, glass, silica gel or epoxy resin.

Finally, the preparation of the light mixing structure of example 1 was completed.

Example 2:

fig. 6 is a schematic top view of a layout of a light mixing structure in embodiment 2, and the difference between embodiment 2 and embodiment 1 is: in the second light mixing unit of embodiment 2, the LED chips of the first light mixing unit have different orientations and different manufacturing methods.

In fig. 6, the first light mixing unit 31 is placed on a substrate 32, and the substrate 32 is uniformly arranged on the lamp base plate 33; the four first light mixing units 31 are combined into the second light mixing unit 34, and it can be seen that the light source arrangement of the lamp is the result of the second light mixing unit 34 after being replicated and translated.

Fig. 7 is an enlarged schematic view of the second light mixing unit 34 according to embodiment 2, in which the second light mixing unit 34 has four first light mixing sub-units 341, 342, 343, and 344, respectively.

The four first light mixing sub-units 341, 342, 343, 344 belong to the light mixing unit arranged with two different LED chip positions, i.e. the light mixing unit 31 arranged with two different LED chip positions.

The relative arrangement positions of the four color LED chips in the first light-mixing subunit 344 are the same as the relative arrangement position of the first light-mixing subunit 341, and the first light-mixing subunit 341 can form the first light-mixing subunit 344 after rotating 180 degrees along the central origin. The arrangement positions of the four color chips in the first light-mixing subunit 343 are the same as those of the first light-mixing subunit 342, and the first light-mixing subunit 343 can be formed by rotating the first light-mixing subunit 342 by 180 degrees along the central origin.

The first light mixing subunit 342 is formed by interchanging the positions of the first row of LED chips and the second row of LED chips in the first light mixing subunit 341, that is, the first light mixing subunit 342 and the first light mixing subunit 341 are the first light mixing units 31 with two different LED chip positions.

The yellow chip (Y) and the green chip (G) in the first light-mixing subunit 341, and the blue chip (B) and the red chip (R) in the first light-mixing subunit 343 also form a complementary color unit 345.

The red chip (R) and the green chip (G) in the first light mixing subunit 341, and the blue chip (B) and the yellow chip (Y) in the first light mixing subunit 342 constitute a complementary color unit 346.

Since the lights of the four LEDs with different dominant wavelengths in the complementary color units 345 and 346 can be mixed into white light in space, the color shift phenomenon of mixed light caused by single color light enrichment in the same direction is eliminated.

Similarly, the first light-mixing sub-unit 343 and the first light-mixing sub-unit 344, and the first light-mixing sub-unit 342 and the first light-mixing sub-unit 344 in the second light-mixing unit 34 also improve the color cast phenomenon by the same light-mixing complementary color principle.

The light mixing structure of embodiment 2 is realized by the following manufacturing method:

A. according to the design of the color complementing units 345 and 346, during die bonding, die bonding of the first type of first light mixing unit is completed according to the arrangement method of the LED chips in the first light mixing subunit 341, then the die bonding sequence of the LED chips with different dominant wavelengths and monochromatic light is switched, and die bonding of the second type of first light mixing unit is completed according to the arrangement method of the LED chips in the first light mixing subunit 342. And welding gold wires to the chip electrodes and the support electrodes of the two die bonding schemes by using a wire bonding machine so as to form the non-glue-pouring support at two different LED chip arrangement positions.

B. Packaging the bracket into a fluorescent powder-free multi-primary-color LED lamp bead by using packaging glue through a glue filling process, wherein the packaging glue is silica gel, epoxy resin or polyurethane, or silica gel, epoxy resin or polyurethane doped with a diffusion material, so as to form a primary optical lens for mixing light emitted by the LED chip; the diffusion material is one of silicon dioxide, titanium dioxide and organic silicon resin micro-nano scattering particles, and is beneficial to further mixing light of the monochromatic light chips with four dominant wavelengths in the fluorescent powder-free multi-primary color LED lamp bead; the support package can adopt one of direct chip package, metal substrate package, silicon substrate package, ceramic substrate package and glass fiber substrate package; the fabrication of the first photonic mixing units 341, 342, 343, 344 is completed.

C. Printing solder paste on the substrate 32, and placing the substrate 32 printed with the solder paste at a chip mounting position on a chip mounter; according to the design of the complementary color units 345 and 346, different first light mixing subunits 341, 342, 343 and 344 are adsorbed by a chip mounter and respectively pasted on corresponding substrates;

D. the temperature of the reflow furnace is set, and the substrate 32 to which the first light mixing unit 31 is attached is placed in the reflow furnace and subjected to reflow soldering. After the soldered substrate 32 is cooled, it is uniformly arranged on the lamp bottom plate 33 by means of screw mounting or glue fixing according to the design of the complementary color units 345 and 346. The four first light-mixing sub-units 341, 342, 343, 344, which are adjacent to each other and distributed in a quadrilateral shape, between the adjacent substrates 32 constitute the second light-mixing unit 34, and the designed complementary color units 345, 346 are formed in the second light-mixing unit 34.

E. If the first light mixing subunits 341, 342, 343, 344 contain secondary lenses, the secondary optical lenses are mounted on the substrate 32 through the through holes or the adhesive, and cover the non-phosphor multi-primary color LED lamp beads; the secondary optical lens material is one of polycarbonate, polymethyl methacrylate, glass, silica gel or epoxy resin;

finally, the preparation of the light mixing structure of example 2 was completed.

While the invention has been described with respect to a specific embodiment, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made herein without departing from the spirit and scope of the invention, including other light mixing structures that use complementary color principles.