阅读说明：本技术 一种用于晶圆片的胶膜切割设备 (A glued membrane cutting equipment for wafer ) 是由 郑月英 于 2021-02-04 设计创作，主要内容包括：本发明公开了一种用于晶圆片的胶膜切割设备,其结构包括机体、滑块、龙门架,由于龙门在切割台顶部移动带动周围的气流流动,胶膜边沿受到气流的作用易上浮,通过限位机构中的转动环随着龙门架的移动与胶膜边沿表面接触,转动环将胶膜边沿下压捋平,减少切割台边沿的胶膜受到气流的作用上浮,减少胶膜边沿出现折皱的现象,有利于对胶膜切割的形状不发生改变,与晶圆片的表面大小吻合,能够正常用于覆盖在晶圆片表面,由于胶膜流体沾在转动环外壁,易出现胶膜受到流体的吸附力随着转动环转动的现象,通过配合块中的刮板将转动环外壁的胶膜流体清除,能够保持转动环外壁整洁。(The invention discloses a glue film cutting device for a wafer, which structurally comprises a machine body, a sliding block and a portal frame, because the gantry moves at the top of the cutting table to drive the surrounding air flow to flow, the edge of the adhesive film is easy to float upwards under the action of the air flow, the rotating ring in the limiting mechanism is contacted with the edge surface of the adhesive film along with the movement of the portal frame, the rotating ring presses the edge of the adhesive film flat, the adhesive film at the edge of the cutting table floats under the action of air flow, the phenomenon of cockling at the edge of the adhesive film is reduced, the shape of the adhesive film is not changed, the adhesive film is matched with the surface size of a wafer, and the adhesive film can be normally used for covering the surface of the wafer, because the adhesive film fluid is stuck on the outer wall of the rotating ring, the adhesive film is easy to rotate along with the rotating ring under the absorption force of the fluid, the adhesive film fluid on the outer wall of the rotating ring is removed through the scraper in the matching block, so that the outer wall of the rotating ring can be kept clean.)

1. The utility model provides a glued membrane cutting equipment for wafer, its structure includes organism (1), slider (2), portal frame (3), slider (2) horizontal installation is in organism (1) both sides middle part, portal frame (3) are located organism (1) top, and with slider (2) clearance fit, its characterized in that:

the gantry (3) is provided with a support frame (31), a cutter (32) and a limiting mechanism (33), the support frame (31) is located outside the gantry (3), the cutter (32) is vertically installed at the center of the top of the support frame (31), and the limiting mechanism (33) is embedded inside the middle of the support frame (31).

2. The apparatus as claimed in claim 1, wherein: stop gear (33) are equipped with cooperation groove (a1), bracing piece (a2), gear (a3), telescopic link (a4), rotating ring (a5), cooperation piece (a6), the inside central point in stop gear (33) left side is established in cooperation groove (a1), bracing piece (a2) right-hand member cover is inside cooperation groove (a1), gear (a3) link up and install in bracing piece (a2) right-hand member below, telescopic link (a4) are connected between bracing piece (a2) right-hand member and cooperation groove (a1) inner wall, rotating ring (a5) cover is at bracing piece (a2) left end, cooperation piece (a6) horizontal fixation is in stop gear (33) left side, and is located rotating ring (a5) top.

3. The apparatus as claimed in claim 2, wherein: the rotating ring (a5) is provided with a supporting shaft (s1), a ring body (s2), a clamping groove (s3), a contact plate (s4) and a reset strip (s5), the supporting shaft (s1) is located in the middle of the rotating ring (a5), the ring body (s2) is sleeved on the outer wall of the supporting shaft (s1), the clamping groove (s3) is sunken in the outer wall of the ring body (s2), the contact plate (s4) is sleeved in the clamping groove (s3), and the reset strip (s5) is clamped between the inner side of the contact plate (s4) and the inner wall of the clamping groove (s 3).

4. The apparatus as claimed in claim 3, wherein: contact plate (s4) are equipped with plate body (d1), bullet piece (d2), scrape piece (d3), plate body (d1) are located contact plate (s4) below, scrape piece (d3) and install at plate body (d1) top through bullet piece (d 2).

5. The apparatus as claimed in claim 2, wherein: the cooperation piece (a6) is equipped with expansion rod (e1), activity groove (e2), air cavity (e3), push pedal (e4), gag lever post (e5), expansion rod (e1) are installed on cooperation piece (a6) right side, activity groove (e2) are established at cooperation piece (a6) bottom surface middle part, air cavity (e3) set up inside cooperation piece (a6), and are located activity groove (e2) top, push pedal (e4) cover is inside air cavity (e3) bottom, gag lever post (e5) are installed between push pedal (e4) both ends top and air cavity (e3) inner wall.

6. The apparatus as claimed in claim 5, wherein: the push plate (e4) is provided with an exhaust hole (r1), a swinging block (r2) and a connecting shaft (r3), the exhaust hole (r1) penetrates through the upper surface and the lower surface of two ends of the push plate (e4), and the swinging block (r2) is connected and installed in the middle of the bottom surface of the push plate (e4) through the connecting shaft (r 3).

7. The apparatus as claimed in claim 6, wherein: swing piece (r2) are equipped with sliding tray (t1), push ball (t2), scraper blade (t3), sliding tray (t1) are established in swing piece (r2) middle part, push ball (t2) are arranged in sliding tray (t1) inside, scraper blade (t3) and swing piece (r2) bottom surface are even as an organic whole.

Technical Field

The invention belongs to the field of wafer coating, and particularly relates to adhesive film cutting equipment for a wafer.

Background

After the wafer is processed, covering an adhesive film on a product, which is beneficial to protecting the wafer and reducing the scratch phenomenon on the surface of the product in the transportation process, cutting the adhesive film into the size same as that of the product by adopting a cutting machine, horizontally placing the adhesive film on a cutting table of the cutting machine, enabling a gantry and a sliding block to be movably matched with each other to slide to drive the cutting machine to move, and irradiating laser of the cutting machine on the surface of the adhesive film so as to cut off the adhesive film in a hot melting way; when the cutting machine is used for cutting the adhesive film in the prior art, the gantry moves at the top of the cutting table to drive surrounding air flow to flow, the adhesive film is light in film-shaped quality, when the gantry moves, the adhesive film on the edge of the cutting table floats upwards under the action of the air flow, the phenomenon of cockling of the edge of the adhesive film occurs, and the shape of the adhesive film is changed when the adhesive film is cut, is not matched with the surface size of a wafer and cannot be normally used for covering the surface of the wafer.

Disclosure of Invention

In order to solve the problem that when the cutting machine is used for cutting the adhesive film in the prior art, the gantry moves at the top of the cutting table to drive surrounding air flow to flow, the adhesive film is light in film-shaped quality, when the gantry moves, the adhesive film at the edge of the cutting table floats upwards under the action of the air flow, the phenomenon of cockling at the edge of the adhesive film occurs, and the shape of the adhesive film is changed when the adhesive film is cut, is not matched with the surface size of a wafer and cannot be normally used for covering the surface of the wafer, the invention provides the adhesive film cutting equipment for the wafer.

In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a glued membrane cutting equipment for wafer, its structure includes organism, slider, portal frame, slider horizontal installation is in organism both sides middle part, the portal frame is located the organism top, and with slider clearance fit.

The portal frame is provided with a support frame, a cutter and a limiting mechanism, the support frame is located outside the portal frame, the cutter is vertically installed in the center of the top of the support frame, and the limiting mechanism is nested on the inner side of the middle of the support frame.

As a further improvement of the invention, the limiting mechanism is provided with a matching groove, a supporting rod, a gear, telescopic rods, rotating rings and matching blocks, the matching groove is formed in the center of the inner portion of the left side of the limiting mechanism, the right end of the supporting rod is sleeved in the matching groove, the gear is connected and installed above and below the right end of the supporting rod, the telescopic rods are connected between the right end of the supporting rod and the inner wall of the matching groove, the rotating rings are sleeved at the left end of the supporting rod, the matching blocks are horizontally fixed on the left side of the limiting mechanism and located above the rotating rings, the inner walls of the upper side and the lower side of the matching.

As a further improvement of the invention, the rotating ring is provided with three supporting shafts, three ring bodies, three clamping grooves, three contact plates and three reset strips, wherein the supporting shafts are positioned in the middle of the rotating ring, the ring bodies are sleeved on the outer walls of the supporting shafts, the clamping grooves are sunken on the outer walls of the ring bodies, the contact plates are sleeved in the clamping grooves, the reset strips are clamped between the inner sides of the contact plates and the inner walls of the clamping grooves.

As a further improvement of the invention, the contact plate is provided with a plate body, an elastic block and a scraping block, the plate body is positioned below the contact plate, the scraping block is arranged at the top of the plate body through the elastic block, the top of the scraping block is arc-surface-shaped, and the elastic block is made of rubber.

As a further improvement of the invention, the matching block is provided with an expansion rod, a movable groove, an air cavity, two expansion rods and a limiting rod, the expansion rod is arranged on the right side of the matching block, the movable groove is arranged in the middle of the bottom surface of the matching block, the air cavity is arranged in the matching block and is positioned above the movable groove, the push plate is sleeved in the bottom end of the air cavity, the limiting rod is arranged between the tops of the two ends of the push plate and the inner wall of the air cavity, the tops of the push plate are uneven surfaces, and the two expansion rods are arranged at the same horizontal angle.

As a further improvement of the invention, the push plate is provided with two exhaust holes, a swinging block and a connecting shaft, the exhaust holes penetrate through the upper surface and the lower surface of the two ends of the push plate, the swinging blocks are connected and installed in the middle of the bottom surface of the push plate through the connecting shaft, and the exhaust holes are symmetrically distributed.

As a further improvement of the invention, the swing block is provided with a sliding groove, a push ball and a scraper, the sliding groove is arranged in the middle of the swing block, the push ball is arranged in the sliding groove, the scraper is connected with the bottom surface of the swing block into a whole, and the bottom in the sliding groove is in a concave arc surface shape.

Advantageous effects

Compared with the prior art, the invention has the following beneficial effects:

1. because the gantry moves at the top of the cutting table to drive surrounding air flow, the edge of the adhesive film is easy to float under the action of the air flow, the rotating ring in the limiting mechanism is in contact with the surface of the edge of the adhesive film along with the movement of the gantry, the rotating ring presses the edge of the adhesive film down to be smooth, the phenomenon that the adhesive film at the edge of the cutting table floats under the action of the air flow is reduced, the phenomenon that the edge of the adhesive film is creased is reduced, the shape of the adhesive film is favorably not changed, the adhesive film is matched with the surface size of a wafer, and the adhesive film can be normally used.

2. Because glued membrane fluid is stained with at the swivel becket outer wall, the glued membrane easily appears and receives fluidic adsorption affinity along with the swivel becket pivoted phenomenon, clears away the glued membrane fluid of swivel becket outer wall through the scraper blade in the cooperation piece, can keep the swivel becket outer wall clean and tidy, reduces glued membrane fluid and is stained with at the swivel becket outer wall, reduces the glued membrane that does not cut and receives fluidic adsorption affinity along with the swivel becket pivoted phenomenon.

Drawings

Fig. 1 is a schematic structural diagram of an adhesive film cutting apparatus for a wafer according to the present invention.

Fig. 2 is a schematic structural view of a portal frame according to the present invention.

Fig. 3 is a schematic structural view of a front view section of a limiting mechanism of the present invention.

FIG. 4 is a side sectional view of a rotating ring according to the present invention.

Fig. 5 is a schematic side view of a contact plate according to the present invention.

FIG. 6 is a front sectional view of a mating block according to the present invention.

FIG. 7 is a side sectional structural schematic view of a push plate according to the present invention.

FIG. 8 is a side cross-sectional structural schematic view of a swing block of the present invention.

In the figure: the device comprises a machine body-1, a sliding block-2, a portal frame-3, a support frame-31, a cutter-32, a limiting mechanism-33, a matching groove-a 1, a support rod-a 2, a gear-a 3, an expansion rod-a 4, a rotating ring-a 5, a matching block-a 6, a support shaft-s 1, a ring-s 2, a clamping groove-s 3, a contact plate-s 4, a reset strip-s 5, a plate body-d 1, an elastic block-d 2, a scraping block-d 3, an expansion rod-e 1, a movable groove-e 2, an air cavity-e 3, a push plate-e 4, a limiting rod-e 5, an air exhaust hole-r 1, a swinging block-r 2, a connecting shaft-r 3, a sliding groove-t 1, a ball-t 2 and a scraper-t 3.

Detailed Description

The invention is further described below with reference to the accompanying drawings:

example 1:

as shown in figures 1 to 5:

the invention provides a glue film cutting device for a wafer, which structurally comprises a machine body 1, a sliding block 2 and a portal frame 3, wherein the sliding block 2 is horizontally arranged in the middle of two sides of the machine body 1, and the portal frame 3 is positioned above the machine body 1 and is movably matched with the sliding block 2.

The portal frame 3 is provided with a support frame 31, a cutter 32 and a limiting mechanism 33, the support frame 31 is located outside the portal frame 3, the cutter 32 is vertically installed at the center of the top of the support frame 31, and the limiting mechanism 33 is nested on the inner side of the middle of the support frame 31.

The limiting mechanism 33 is provided with a matching groove a1, a supporting rod a2, a gear a3, an expansion rod a4, a rotating ring a5 and a matching block a6, the matching groove a1 is arranged at the center of the inner portion of the left side of the limiting mechanism 33, the right end of the supporting rod a2 is sleeved in the matching groove a1, the gear a3 is connected and installed above and below the right end of the supporting rod a2, the expansion rod a4 is connected between the right end of the supporting rod a2 and the inner wall of the matching groove a1, the rotating ring a5 is sleeved at the left end of the supporting rod a2, the matching block a6 is horizontally fixed at the left side of the limiting mechanism 33 and located above the rotating ring a5, the inner walls of the upper side and the lower side of the matching groove a1 are tooth-shaped, which is beneficial to being movably matched with the gear a3, so that the supporting rod a2 pushes the rotating ring a5 to move, the supporting rod a2 can enable, the vibration of the supporting rod a2 caused by the machine is reduced.

The rotating ring a5 is provided with a support shaft s1, a ring body s2, clamping grooves s3, a contact plate s4 and a reset strip s5, the support shaft s1 is located in the middle of the rotating ring a5, the ring body s2 is sleeved on the outer wall of the support shaft s1, the clamping grooves s3 are recessed on the outer wall of the ring body s2, the contact plate s4 is sleeved inside the clamping grooves s3, the reset strip s5 is clamped between the inner side of the contact plate s4 and the inner wall of the clamping grooves s3, the number of the contact plates s4 is three, the contact plates can be uniformly contacted with the edges of the adhesive films, molten fluid at the edges of the adhesive films is.

Wherein, contact plate s4 is equipped with plate body d1, bullet piece d2, scrapes piece d3, plate body d1 is located contact plate s4 below, scrape piece d3 and install at plate body d1 top through bullet piece d2, it is the cambered surface form to scrape piece d3 top, can reduce with the surperficial frictional force of glued membrane for swivel ring a 5's slew velocity, bullet piece d2 is the rubber material, has the elasticity, is favorable to bullet piece d2 expansion to be pushed and contact with the glued membrane with scraping piece d 3.

The specific use mode and function of the embodiment are as follows:

in the invention, an adhesive film material is flatly paved on the top surface of a machine body 1, a portal frame 3 and a sliding block 2 are controlled to movably cooperate to move, a cutter 32 moves along with a support frame 31 to cut the adhesive film, when the portal frame 3 moves, the distance of a support rod a2 in a limiting mechanism 33 is adjusted according to the width of the adhesive film, the support rod a2 is pulled towards the left outer side of a matching groove a1 of the limiting mechanism 33, a gear a3 is movably matched with teeth on the inner wall of the matching groove a1, the support rod a2 pulls and expands a4, after a2 moves for a certain distance, a rotating ring a5 is attached to the upper surface of a cornea edge, along with the movement of the portal frame 3, a rotating ring a5 rotates by taking a support shaft s1 and a2 as a fulcrum, the adhesive film edge is flatly pressed down by the rotating ring a5, a resetting strip s 48 in the rotating ring a5 pushes a4 towards the outside of a clamping groove 39s 3, and fluid melted along with the adhesive film surface is removed by a, keep the glued membrane surface clean and tidy, through rotating ring a5 among the stop gear 33 along with the removal of portal frame 3 with glued membrane border surface contact, rotating ring a5 pushes down the glued membrane border and smooths out, reduces the glued membrane at cutting station border and receives the effect come-up of air current, reduces glued membrane border and appears the phenomenon of pincher trees, is favorable to not changing the shape of glued membrane cutting, coincide with the surface size of wafer, can normally be used for covering on the wafer surface.

Example 2:

as shown in fig. 6 to 8:

the matching block a6 is provided with an expansion rod e1, a movable groove e2, an air cavity e3, a push plate e4 and a limiting rod e5, the expansion rod e1 is installed on the right side of the matching block a6, the movable groove e2 is arranged in the middle of the bottom surface of the matching block a6, the air cavity e3 is arranged inside the matching block a6 and above the movable groove e2, the push plate e4 is sleeved inside the bottom end of the air cavity e3, the limiting rod e5 is installed between the tops of two ends of the push plate e4 and the inner wall of the air cavity e3, the top of the push plate e4 is an uneven surface, the stressed area of the top of the push plate e4 can be increased, the air flow inside the air cavity e4 is pushed and diffused when the push plate e4 moves upwards, the expansion rod e4 is provided with two expansion rods, and has the same horizontal angle, the stressed uniformity of the matching block a4 is facilitated, and the matching block a4 can be moved along with the moving distance of the rotating.

Wherein, push pedal e4 is equipped with exhaust hole r1, swing piece r2, links up axle r3, exhaust hole r1 runs through push pedal e4 both ends upper and lower surface, swing piece r2 installs push pedal e4 bottom surface middle part through linking up axle r3 linking, exhaust hole r1 is equipped with two and is the symmetric distribution, can increase the diffusion velocity of air current to can increase the diffusion area of air current, be favorable to the air current evenly to blow the glued membrane fluid of contact plate s4 outer wall and drop.

The swinging block r2 is provided with a sliding groove t1, a push ball t2 and a scraper t3, the sliding groove t1 is arranged in the middle of the swinging block r2, the push ball t2 is arranged in the sliding groove t1, the scraper t3 is connected with the bottom surface of the swinging block r2 into a whole, the bottom of the sliding groove t1 is in a concave arc surface shape, so that resistance and friction are reduced, the push ball t2 slides back and forth along the bottom of the sliding groove t1 to generate power, the swinging speed of the swinging block r2 is increased, and the swinging block r2 vibrates to enable the fluid adhesive film removed by the scraper t3 to drop.

The specific use mode and function of the embodiment are as follows:

in the invention, the rotating ring a5 is sleeved in the movable groove e2 of the matching block a6, when the rotating ring a5 moves, the matching block a6 is pushed to move by taking the expansion rod e1 as a fulcrum, when the rotating ring a5 rotates, the rotating ring a5 is movably matched with the push plate e5, the push plate e5 is pushed to the inner part of the air cavity e5 by the rotating ring a5, the push plate e5 is limited by the limiting rod e5, when the push plate e5 moves, the air flow in the air cavity e5 is diffused along the air exhaust hole r 5, the air flow blows and drops the contact film fluid on the outer wall of the rotating ring a5, the swinging block s5 is contacted with the swinging block r 5, the swinging block r 5 is swung by taking the scraper r 5 as a fulcrum, the film material on the outer wall of the contact plate s5 is removed by the scraper t 5, the pushing ball t 5 moves in the sliding groove t 5 to generate power, the swinging speed of the swinging block r 5 is increased, the material is beneficial to, the adhesive film fluid is prevented from being attached to the outer wall of the rotating ring a5, and the phenomenon that the uncut adhesive film rotates along with the rotating ring a5 due to the absorption force of the fluid is reduced.

The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.