阅读说明：本技术 基板湿处理装置及基板清洗方法 (Substrate wet processing apparatus and substrate cleaning method ) 是由 冯传彰 吴庭宇 蔡文平 刘茂林 李威震 于 2019-11-08 设计创作，主要内容包括：一种基板湿处理装置及基板清洗方法,所述基板湿处理装置包含浸泡模块,设置在浸泡模块下游的喷除模块,可相对浸泡模块及喷除模块移动的进程机器,及连接进程机器的控制模块。浸泡模块包括用于装满溶液的浸泡槽,及至少部分浸泡在溶液中的浸泡支架。喷除模块包括多个喷除支架及至少一个喷嘴,每一喷除支架用来支撑一个垂直摆放的基板。进程机器配置成一次一个地运送垂直摆放的基板。控制模块用于控制进程机器的动作,使得进程机器一次一个地将基板移动到浸泡支架,一次一个地将浸泡支架上的基板移动到喷除支架上,及一次一个地将喷除支架上的基板移出喷除模块,所述基板清洗方法通过基板湿处理装置来执行,因此可减少供存放基板的空间和支撑结构。(A substrate wet processing apparatus includes a soaking module, a spraying module disposed at a downstream of the soaking module, a process machine movable relative to the soaking module and the spraying module, and a control module connected to the process machine. The soaking module comprises a soaking tank filled with the solution and a soaking bracket at least partially soaked in the solution. The spraying module comprises a plurality of spraying brackets and at least one nozzle, and each spraying bracket is used for supporting a substrate which is vertically arranged. The process machine is configured to transport vertically positioned substrates one at a time. The control module is used for controlling the action of the process machine, so that the process machine moves the substrates to the soaking support one at a time, moves the substrates on the soaking support to the spraying and removing support one at a time, and moves the substrates on the spraying and removing support out of the spraying and removing module one at a time.)

1. A substrate wet processing device is suitable for cleaning a substrate, and is characterized in that: the substrate wet processing apparatus includes:

the soaking module comprises a soaking tank filled with a solution and a soaking bracket at least partially soaked in the solution;

the spraying module is arranged at the downstream of the soaking module and comprises a plurality of spraying brackets and at least one nozzle, and each spraying bracket is used for supporting a vertically arranged substrate;

a processing machine movable relative to the soak module and the blow-off module, the processing machine configured to transport vertically positioned substrates one at a time; and

a control module connected to the process machine, the control module for controlling the action of the process machine such that the process machine moves substrates one at a time to the soak rack, moves substrates on the soak rack one at a time to the blast rack, and moves substrates on the blast rack one at a time out of the blast module.

2. The substrate wet processing apparatus according to claim 1, wherein: the process machine comprises a process seat, a base frame, two extension frames and two process claws, wherein the process seat can move relative to the soaking module and the spraying module, the base frame is arranged on the process seat and can move along the vertical direction relative to the process seat, the two extension frames are mutually spaced and extend downwards from the base frame, and the two process claws are respectively arranged at the tail ends of the extension frames and extend oppositely and jointly support the lower part of the substrate.

3. The substrate wet processing apparatus according to claim 2, wherein: the process machine conveys the substrate in such a manner that a normal vector of the substrate is parallel to a forward direction thereof, and a size of a space defined by the base frame, the extension frame, and the process claw together is larger than a face of the substrate having the normal vector so that the substrate can pass through the space.

4. The substrate wet processing apparatus according to claim 2, wherein: the soaking bracket can reciprocate along the up-and-down direction relative to the soaking groove, the size of the space defined by the base frame, the extension frame and the process claw of the process machine is enough to enable the substrate to move up and down in the space driven by the soaking bracket, and the distance between the process claws is larger than the width of the soaking bracket along the transverse direction.

5. The substrate wet processing apparatus according to claim 1, wherein: each spraying support comprises a support body, two supporting wheels and a positioning piece, wherein the supporting wheels are mutually spaced and rotatably arranged on the support body and are used for jointly supporting the vertically placed substrates, and the positioning piece is movably arranged on the support body and is used for positioning the upper parts of the substrates.

6. The substrate wet processing apparatus according to claim 5, wherein: each support wheel is formed with an annular positioning groove for fitting a part of the periphery of the substrate.

7. The substrate wet processing apparatus according to claim 1, wherein: the spraying module comprises a plurality of spraying grooves for the spraying support to be arranged in and a plurality of nozzles which are arranged in the spraying grooves respectively and are used for spraying high-pressure liquid.

8. The substrate wet processing apparatus according to claim 1, wherein: the substrate wet processing apparatus further includes a cleaning/drying module disposed downstream of the spray module, a first turn table disposed upstream of the soak module, and a second turn table disposed between the spray module and the cleaning/drying module.

9. The substrate wet processing apparatus according to claim 8, wherein: the cleaning/drying module includes a drying seat, and a rotating table rotatably installed on the drying seat and used for bearing the horizontally placed substrate.

10. The substrate wet processing apparatus according to claim 8, wherein: the first steering table comprises a steering seat, four abutting pieces and four steering claws, the abutting pieces are arranged on the steering seat, the four steering claws are movably arranged on the steering seat, the steering seat can move between a horizontal position and a vertical position, the abutting pieces are used for supporting or abutting against a substrate, the steering claws can clamp the substrate in a releasing mode, and the first steering table is used for transposing the substrate which is horizontally arranged into the vertical arrangement so as to enable the process machine to convey the substrate.

11. The substrate wet processing apparatus according to claim 8, wherein: the second steering table comprises a steering seat, four abutting pieces and four steering claws, wherein the abutting pieces are arranged on the steering seat, the four steering claws are movably arranged on the steering seat, the steering seat can move between a horizontal position and a vertical position, the abutting pieces are used for supporting or abutting a substrate, the steering claws can clamp the substrate in a releasable mode, and the second steering table is used for transposing the substrate which is vertically arranged on the process machine to be horizontally arranged on the cleaning/drying module.

12. A substrate cleaning method performed by the substrate wet processing apparatus according to claim 1, characterized in that: the substrate cleaning method comprises the following steps:

a) moving a substrate to the soaking bracket by the process machine at a preset time interval until a preset number of substrates are placed in the soaking module;

b) every other preset time, the process machine moves the substrate placed on the soaking support for the longest time to the spraying removal support, and moves one substrate to the soaking support until a preset number of substrates are placed in the spraying removal module; and

c) and moving the substrate placed for the longest time in the spraying removal module out of the spraying removal module, moving the substrate placed for the longest time on the soaking support to the spraying removal support, and moving one substrate to the soaking support by the process machine every preset time.

Technical Field

The present invention relates to a wet processing apparatus, and more particularly, to a substrate wet processing apparatus for cleaning a substrate.

Background

A conventional wet processing apparatus for cleaning a substrate includes a soaking tank filled with a solution, a spraying tank disposed downstream of the soaking tank, a drying chamber disposed downstream of the spraying tank, and at least one transfer machine. In operation, the transport machine first moves a batch of substrates into the solution in the soak tank, and then, after the soak operation is complete, moves the substrates out of the soak tank for subsequent spray removal and drying operations. However, the substrates are preferably treated one by one while performing the blasting and drying operations. Therefore, additional space and support structures are required to store the substrate that has just been soaked.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a substrate wet processing apparatus capable of overcoming the defects of the prior art.

Therefore, the substrate wet processing device is suitable for cleaning the substrate and comprises a soaking module, a spraying module arranged at the downstream of the soaking module, a process machine capable of moving relative to the soaking module and the spraying module, and a control module connected with the process machine. The soaking module comprises a soaking tank filled with a solution and a soaking support at least partially soaked in the solution. The spraying module comprises a plurality of spraying brackets and at least one nozzle, and each spraying bracket is used for supporting a substrate which is vertically arranged. The process machine is configured to transport vertically positioned substrates one at a time. The control module is used for controlling the action of the process machine, so that the process machine moves the substrates to the soaking bracket one at a time, moves the substrates on the soaking bracket to the spraying bracket one at a time, and moves the substrates on the spraying bracket out of the spraying module one at a time.

Another object of the present invention is to provide a substrate cleaning method performed by the substrate wet processing apparatus.

The substrate cleaning method comprises the following steps: a) moving a substrate to the soaking bracket by the process machine at a preset time interval until a preset number of substrates are placed in the soaking module; b) every other preset time, the process machine moves the substrate placed on the soaking support for the longest time to the spraying removal support, and moves one substrate to the soaking support until a preset number of substrates are placed in the spraying removal module; and c) every other preset time, the process machine moves the substrate placed for the longest time in the spraying removal module out of the spraying removal module, moves the substrate placed for the longest time on the soaking support to the spraying removal support, and moves one substrate to the soaking support.

The substrate wet processing apparatus and the substrate cleaning method performed by the substrate wet processing apparatus having the above-mentioned structure have the advantages that the time for each processed substrate to be treated in the cleaning unit of the substrate wet processing apparatus is substantially the same, and therefore, an additional space and a support structure are not required to store the substrate which has just been subjected to the soaking operation.

Drawings

FIG. 1 is a schematic top view illustrating one embodiment of a substrate wet processing apparatus of the present invention;

FIG. 2 is a partial perspective view illustrating a transfer machine of the substrate wet processing apparatus;

fig. 3A to 3C are partial perspective views illustrating the operation of a first turn table of the substrate wet processing apparatus;

FIG. 4 is a partial perspective view illustrating cooperation between the first turn table and a process machine of the substrate wet processing apparatus;

FIG. 5 is a partial perspective view illustrating the process machine and a soak module of the substrate wet processing apparatus;

FIG. 6 is a partial perspective view illustrating the cooperation between the process machine and an infusion support of the infusion module;

FIG. 7 is a partial perspective view illustrating a spray module of the substrate wet processing apparatus;

FIG. 8 is a partial perspective view illustrating a second turn table and a cleaning/drying module of the substrate wet processing apparatus;

FIG. 9 is a partial perspective view illustrating the cooperation between the second steering stage and the wash/dry module; and

FIG. 10 is a flowchart illustrating a substrate cleaning method according to an embodiment of the present invention.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and examples.

Referring to fig. 1, the substrate wet processing apparatus of the present invention is adapted to clean a substrate 9, such as a wafer, and includes at least one cleaning unit 100. The cleaning unit 100 includes a soak module 5, a blow-off module 6 disposed downstream of the soak module 5, a process machine 3, and a control module 8 coupled to the process machine 3.

Referring to fig. 5 and 6, the soaking module 5 includes a soaking tank 51 filled with a solution, and a soaking support 52 disposed in the soaking tank 51. The soaked stent 52 is at least partially soaked in the solution. In one embodiment, the soaking frame 52 is formed with a plurality of grooves 521, and the grooves 521 are used for being respectively embedded with a plurality of substrates 9 vertically arranged. In one embodiment, the soaking frame 52 can carry one or more substrates 9 vertically arranged and can reciprocate along an up-and-down direction relative to the soaking tank 51 to enhance the soaking operation.

Referring to fig. 7, the spray module 6 includes a plurality of spray grooves 61 (see fig. 1), a plurality of spray brackets 62 (only one is shown in fig. 7) respectively disposed in the spray grooves 61, and a plurality of nozzles (not shown) respectively disposed in the spray grooves 61 for spraying a high-pressure liquid. In one embodiment, each spraying support 62 is used for supporting a substrate 9 vertically disposed and includes a frame 621, two support wheels 622, and a positioning member 623. The supporting wheels 622 are spaced apart from each other and rotatably disposed on the frame 621 for supporting the vertically arranged substrates 9 together. The positioning member 623 is movably disposed on the frame 621 for positioning the upper portion of the substrate 9. In one embodiment, each support wheel 622 is formed with a circular positioning groove 6221 for engaging a portion of the periphery of the base plate 9. In one embodiment, the spraying module 6 only includes one spraying groove 61 for the spraying bracket 62 to be disposed therein, and the number of the nozzles does not correspond to the number of the spraying brackets 62.

Referring again to fig. 4 to 6, the process machine 3 is used for transporting a plurality of vertically arranged substrates 9 one at a time and comprises a process base 31, a base frame 32, two extension frames 33, and two process claws 34. The process seat 31 is movable relative to the soak module 5 and the blow-off module 6. The base frame 32 is disposed on the process base 31 and is movable in the up-down direction with respect to the process base 31. The extension frames 33 are spaced apart from each other and extend downward from the base frame 32. The process claws 34 are respectively provided at the ends of the extension frame 33 and extend toward each other, and together support the lower portion of the substrate 9. In one embodiment, each of the process claws 34 is formed with a positioning groove 341 (shown in fig. 7) for fitting a part of the periphery of the substrate 9 conveyed by the process machine 3. In one embodiment, the process machine 3 transports the substrate 9 in such a way that a normal vector of the substrate 9 (assuming the substrate is a plane) is parallel to its direction of advance, and a space defined by the base frame 32, the extension frame 33 and the process claw 34 together is larger in size than the plane of the substrate 9 having the normal vector so that the substrate 9 can pass through the space.

In one embodiment, the space defined by the base frame 32, the extension frame 33 and the process claw 34 of the process machine 3 together is of a size sufficient for the substrate 9 to be moved up and down therein by the immersion frame 52. In one embodiment, the distance between the process jaws 34 is greater than the width of the infusion support 52 in a transverse direction perpendicular to the advancement direction. Thereby, the process machine 3 can place a substrate 9 on the soaking frame 52 and leave the soaking frame 52 while the soaking frame 52 is continuously moved up and down.

The control module 8 is electrically or signally connected to the process machine 3 for controlling the actions of the process machine 3.

In one embodiment, the cleaning unit 100 further comprises a cleaning/drying module 7 arranged downstream of the spraying module 6, a first diverting station 4 arranged upstream of the soaking module 5, and a second diverting station 4' arranged between the spraying module 6 and the cleaning/drying module 7.

Referring to fig. 8 and 9, the cleaning/drying module 7 includes a drying base 71, a rotating table 72 rotatably mounted on the drying base 71 for carrying a horizontally disposed substrate 9, and a plurality of cleaning/drying mechanisms (not shown).

The first 4 and second 4' turn stages are electrically or signally connected to the control module 8. Referring to fig. 3A, 3B, 3C and 4, the first steering table 4 includes a steering base 41, four abutting members 42 (only two are shown in fig. 4) disposed on the steering base 41, and four steering pawls 43 movably disposed on the steering base 41. The steering base 41 is movable between a horizontal position (see fig. 3A and 3B) and a vertical position (see fig. 3C). The abutment member 42 is used to support or abut a substrate 9, and the deflecting claw 43 releasably holds the substrate 9. The first transfer table 4 is used to transfer a horizontally disposed substrate 9 into a vertical disposition for transport by the process machine 3. In one embodiment, each of the turning claws 43 forms a positioning groove 431 (see fig. 4) for fitting a part of the periphery of the substrate 9 conveyed by the first turning table 4.

The second turning table 4' is similar in structure to the first turning table 4, and serves to transpose the substrates 9, which are vertically arranged on the process machine 3, to be horizontally arranged on the washing/drying module 7 (see fig. 8 and 9).

Referring to fig. 1 and 2 again, in one embodiment, the substrate wet processing apparatus further includes a susceptor 1, a transfer machine 2 movably disposed on the susceptor 1, and two cleaning units 100 arranged in parallel on the susceptor 1.

The susceptor 1 has an input/output port 11 for a substrate 9 to be transferred into or removed from the substrate wet processing apparatus.

The transfer machine 2 is electrically or signally connected to the control module 8 and comprises a transfer base 21 movably arranged on the base 1 and two transfer arms 22 arranged on the transfer base 21. The transfer arm 22 cooperates with the transfer base 21 to move the two substrates 9 from the input/output ports 11 to the vicinity of the first turn table 4 of the cleaning unit 100, respectively. The transfer machine 2 is also used to move the substrate 9 horizontally placed in the cleaning/drying module 7 of the cleaning unit 100 to the input/output port 11.

Referring again to fig. 10, the control module 10 is operable to control the cleaning unit 100 to perform a substrate cleaning method, the substrate cleaning method comprising the steps of:

81) every predetermined time, the process machine 3 moves a substrate 9 onto the soaking support 52 until a predetermined number of substrates 9 are placed in the soaking module 5;

82) every predetermined time, the process machine 3 moves a substrate 9 placed on the soaking support 52 for the longest time to the spraying support 62, and moves a substrate 9 to the soaking support 52 until a predetermined number of substrates 9 are placed in the spraying module 6; and

83) every predetermined time, the process machine 3 moves a substrate 9 placed the longest in the spray module 6 out of the spray module 6 to perform a cleaning/drying operation, moves a substrate 9 placed the longest on the soak support 52 to the spray support 62, and moves a substrate 9 to the soak support 52.

The number of the substrates 9 to be placed in the soaking module 5 may be the number of the grooves 521 of the soaking frame 52, or may be smaller than the number of the grooves 521, which may be adjusted according to the actual process.

The number of the substrates 9 to be placed in the spraying module 6 may be the number of the spraying brackets 62, or may be smaller than the number of the spraying brackets 62, and may be adjusted according to the actual process.

Preferably, the predetermined time is slightly longer than the time required for the washing/drying operation of the washing/drying module 7. The time required by the soaking operation and the time required by the spraying operation are both longer than the preset time.

For example, in one embodiment, the time required for the cleaning/drying operation is slightly less than two minutes. When the substrate wet processing apparatus performs the cleaning operation, first, the process machine 3 moves one substrate 9 onto the soak support 52 every two minutes until one substrate 9 is placed in each of the recesses 521 of the soak support 52. Next, every two minutes, the process machine 3 moves a substrate 9 placed the longest on the soak support 52 to one of the seasoning supports 62, and moves a substrate 9 to the soak support 52 until each seasoning support 62 of the seasoning module 6 places a substrate 9. Thereafter, every two minutes, the process machine 3 moves a substrate 9 placed the longest in the spray module 6 out of the spray module 6 to perform a cleaning/drying operation, moves a substrate 9 placed the longest on the soak support 52 onto the spray support 62, and moves a substrate 9 onto the soak support 52.

With the above cleaning method, each substrate 9 subjected to the cleaning process is left in the cleaning unit 100 for substantially the same time, and therefore, the substrate wet processing apparatus of the present invention does not require additional space and support structure to store the substrate 9 that has just been subjected to the soaking operation.

Referring again to fig. 7, it should be noted that for each of the blow-off supports 62, the placement or removal of a substrate 9 thereon rotates the support wheels 622. Thus, chemical residue does not accumulate on the support wheel 622.

It should be understood that the above description is only exemplary of the present invention, and should not be taken as limiting the scope of the invention, which is intended to cover all modifications and equivalents of the claims and the specification.