阅读说明：本技术 一种功能模块及其封装方法 (Functional module and packaging method thereof ) 是由 林志龙 敖利波 史波 曹俊 于 2019-10-22 设计创作，主要内容包括：本发明提出了一种功能模块及其封装方法,其中,该功能模块包括控制模块和至少一个功率模块,所述控制模块和所述功率模块构造成可拆卸地连接。本发明的功能模块能够替代现有的功能模块并能够实现方便更换功能模块内的损坏器件,节省成本。(The invention provides a functional module and a packaging method thereof, wherein the functional module comprises a control module and at least one power module, and the control module and the power module are detachably connected. The functional module can replace the existing functional module, can realize convenient replacement of damaged devices in the functional module, and saves cost.)

1. A functional module comprising a control module and at least one power module, the control module and the power module being configured to be removably connected.

2. The functional module of claim 1 wherein the power module has a protruding pin on one end.

3. The functional module of claim 2, wherein the control module defines at least one receptacle for receiving the pin.

4. The functional module according to claim 2, wherein a pin is provided on the other end of the power module opposite to the end provided with the pin.

5. The functional module of claim 4, wherein the other end is provided with a plurality of pins.

6. The functional module according to any one of claims 1 to 5, wherein the control module and the power module are configured as separate packages.

7. A method for encapsulating a functional module, wherein the functional module comprises a control module and at least one power module, wherein the method comprises: detachably connecting the power module and the control module.

8. The method of claim 7, wherein a pin is protruded at one end of the power module.

9. The method of claim 8, wherein the control module is provided with a plurality of holes for receiving the pins.

10. The method for encapsulating a functional module according to any one of claims 7 to 9, wherein the power module and the control module are individually encapsulated.

Technical Field

The invention belongs to the technical field of packaging, and particularly relates to a functional module and a packaging method thereof.

Background

Most of the power modules used at present adopt a compact packaging mode, and the mode is small in size and convenient to install.

However, when a device is abnormal or damaged, the entire module has to be replaced, which results in waste of devices that are not damaged, and after the module is integrally packaged, it is not easy to individually test and analyze the parameter characteristics of each module, and the replacement and adjustment cannot be conveniently performed.

In order to solve the above-mentioned drawbacks in the prior art, it is necessary to provide a new functional module and a packaging method thereof.

Disclosure of Invention

In view of the above, the present invention provides a functional module, which can replace the existing functional module and can conveniently replace the damaged device in the functional module, thereby saving the cost.

In order to achieve the above object, the present invention proposes a functional module, wherein the functional module comprises a control module and at least one power module, the control module and the power module being configured to be detachably connected.

The functional module as described above, wherein the pins are protruded from one end of the power module.

The functional module as described above, wherein the control module is provided with at least one jack matched with the pin.

The functional module as described above, wherein a pin is provided on the other end of the power module opposite to the end provided with the pin.

The functional module as described above, wherein a plurality of pins are provided on the other end.

The functional module as described above, wherein the control module and the power module are configured to be packaged separately.

The invention also provides a method for encapsulating the functional module, wherein the functional module comprises a control module and at least one power module, and the method comprises the following steps: detachably connecting the power module and the control module.

The method for packaging a functional module as described above, wherein a pin is protruded at one end of the power module.

The method for packaging the functional module as described above, wherein the control module is provided with a jack matched with the pin.

The method of packaging a functional module as described above, wherein the power module and the control module are packaged separately.

According to the functional module, the control module and the power module are detachably connected, so that when one device is damaged, the damaged device can be conveniently replaced, and the cost is saved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a front perspective view of a functional module provided by an embodiment of the present invention;

FIG. 2 is an exploded view of a functional module provided by an embodiment of the present invention;

FIG. 3 is a top view of a functional module provided by an embodiment of the present invention;

FIG. 4 is a right side view of a functional module provided by an embodiment of the present invention; and

fig. 5 is a front view of a functional module provided by an embodiment of the present invention.

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as power module, control module techniques, etc., in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known features are omitted so as not to obscure the description of the present invention with unnecessary detail.

In addition, in order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to explain the technical means of the present invention, the following description will be given by way of specific examples.

As shown in fig. 1, the invention proposes a functional module, wherein the functional module comprises a control module 1 and at least one power module 2, the control module 1 and the power module 2 being configured to be detachably connected.

Specifically, as shown in fig. 2, pins 3 are convexly disposed at one end of the power module 2, and at least one jack 4 matched with the pins 3 is disposed on the control module 1, so that the number and size of the power modules can be adjusted as required through jack connection. In a specific embodiment, the number of the insertion holes 4 is the same as the number of the pins 3, so that the control module 1 and the power module 2 can be detachably connected in a stable manner.

It should be noted that the manner of installing the pin-and-socket fit is only a specific example of the present invention, and the present invention is not limited to this manner, and other equivalent manners capable of implementing the detachable connection of the control module 1 and the power module 2 are all possible, such as snap-fit, mortise-and-tenon connection, and the like.

Further, a pin 5 is provided on the other end of the power module 2 opposite to the end provided with the pin 3. Specifically, a plurality of pins 5 are provided on the other end. In a specific embodiment, two pins 5 are provided at the other end of each power module 2, but other numbers of pins 5 may be provided as needed, and are not limited herein.

Further, the control module 1 and the power module 2 are configured as separate packages, further facilitating the detachable connection of the two.

The specific structures and operating principles of the control module 1 and the power module 2 are well known in the art and will not be described in detail herein.

The control module 1 and the power module 2 are independently packaged into a detachable connection mode; the required power modules 2 can be selected, such as size and number; adjusting the collocation of different control modules 1 and power modules 2 according to the requirements; when a certain module has a problem, only the damaged device needs to be removed for replacement.

The invention also provides a method for encapsulating the functional module, wherein the functional module comprises a control module 1 and at least one power module 2, and the method comprises the following steps: the power module 2 and the control module 1 are detachably connected.

Specifically, one end of the power module 2 is convexly provided with a pin 3, and the control module 1 is provided with at least one jack 4 matched with the pin 3, so that the control module 1 and the power module can be detachably connected together.

Further, the power module 2 and the control module 1 are separately packaged, thereby further facilitating the detachable connection of the two.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.