阅读说明：本技术 一种光电子组件及其制造方法 (Optoelectronic component and method for the production thereof ) 是由 史文俊 李志伟 张强 李晓辉 周恩波 于 2018-09-20 设计创作，主要内容包括：一种光电子组件(300)及其制造方法,可以提升封装后的光电子组件(300)传输信号的带宽。所述光电子组件(300)包括：电容(301)、电感(302)、载体组件(304)及光电子元件(303),其中,电容(301)、电感(302)及光电子元件(303)均设置于载体组件(304)上；电感(302)与电容(301)用于形成谐振回路,其中,谐振回路的谐振频率与光电子元件(303)的信号输出频率具有关联关系；光电子元件(303)的第一电极通过电感(302)与载体组件(304)的第一电极连接,光电子元件(303)的第二电极与载体组件(304)的第二电极连接；电容(301)的第一电极与载体组件(304)的第一电极连接,电容(301)的第二电极与载体组件(304)的第二电极连接。(An optoelectronic device (300) and a method for manufacturing the same are provided, which can improve the bandwidth of a signal transmitted by the packaged optoelectronic device (300). The optoelectronic assembly (300) comprises: the device comprises a capacitor (301), an inductor (302), a carrier assembly (304) and an optoelectronic element (303), wherein the capacitor (301), the inductor (302) and the optoelectronic element (303) are all arranged on the carrier assembly (304); the inductor (302) and the capacitor (301) are used for forming a resonant loop, wherein the resonant frequency of the resonant loop has a correlation relation with the signal output frequency of the optoelectronic element (303); the first electrode of the optoelectronic element (303) is connected to the first electrode of the carrier component (304) via an inductance (302), and the second electrode of the optoelectronic element (303) is connected to the second electrode of the carrier component (304); a first electrode of the capacitor (301) is connected to a first electrode of the carrier assembly (304) and a second electrode of the capacitor (301) is connected to a second electrode of the carrier assembly (304).)

An optoelectronic assembly, comprising: capacitor, inductance, carrier subassembly and optoelectronic component, wherein:

the capacitor, the inductor and the optoelectronic element are all arranged on the carrier assembly;

the inductor and the capacitor are used for forming a resonant circuit, wherein the resonant frequency of the resonant circuit is in correlation with the signal output frequency of the optoelectronic element;

the first electrode of the optoelectronic element is connected to the first electrode of the carrier assembly via the inductor, and the second electrode of the optoelectronic element is connected to the second electrode of the carrier assembly;

the first electrode of the capacitor is connected with the first electrode of the carrier assembly, and the second electrode of the capacitor is connected with the second electrode of the carrier assembly.

An optoelectronic assembly according to claim 1, wherein the inductor comprises a wire inductor, the first electrode of the optoelectronic element is connected to one end of the wire inductor, and the other end of the wire inductor is connected to the first electrode of the carrier assembly.

An optoelectronic assembly according to claim 1, wherein the inductor comprises a wire inductor, the first electrode of the optoelectronic element is connected to one end of the wire inductor, and the other end of the wire inductor is connected to the first electrode of the capacitor.

An optoelectronic assembly according to any one of claims 1 to 3, wherein the difference between the resonant frequency of the resonant tank and the signal output frequency of the optoelectronic element is within a predetermined range of values; alternatively, the resonant frequency of the resonant tank is equal to the signal output frequency of the optoelectronic element.

An optoelectronic device according to claim 1 or 2, wherein the first electrode of the capacitor is located on an upper surface of the capacitor, the second electrode of the capacitor is located on a lower surface of the capacitor, the second electrode of the capacitor is attached to the second electrode of the carrier device, and the first electrode of the capacitor is connected to the first electrode of the carrier device by a gold wire.

An optoelectronic assembly according to claim 1 or 2, wherein the first electrode of the capacitor and the second electrode of the capacitor are both located on a lower surface of the capacitor, the first electrode of the capacitor is attached to the first electrode of the carrier assembly, and the second electrode of the capacitor is attached to the second electrode of the carrier assembly.

An optoelectronic assembly according to claim 1 or 2, wherein the first electrode of the capacitor and the second electrode of the capacitor are respectively located at two ends of the capacitor, the first electrode of the capacitor is attached to the first electrode of the carrier assembly, and the second electrode of the capacitor is attached to the second electrode of the carrier assembly.

The optoelectronic assembly of claim 1 or 3, wherein the second electrode of the capacitor is disposed on a lower surface of the capacitor, the second electrode of the capacitor is attached to the second electrode of the carrier assembly, and the first electrode of the capacitor comprises a first conductive plating layer, a second conductive plating layer, and a third conductive plating layer, wherein the first conductive plating layer is disposed on the lower surface of the capacitor, the second conductive plating layer is disposed on an upper surface of the capacitor, the third conductive plating layer is used for connecting the first conductive plating layer and the second conductive plating layer, the first conductive plating layer is attached to the first electrode of the carrier assembly, and the other end of the wire inductor is connected to the second conductive plating layer.

An optoelectronic assembly according to any one of claims 1 to 3, wherein the carrier assembly further comprises a drive assembly including a drive circuit and a bias circuit, the first electrode of the carrier assembly being connected to the first electrode of the drive circuit and the first electrode of the bias circuit, the second electrode of the carrier assembly being connected to the second electrode of the drive circuit and the second electrode of the bias circuit.

The optoelectronic assembly of claim 9, wherein the carrier assembly further comprises a carrier, an insulating base, a circuit board, a first lead, and a second lead, wherein:

the capacitor, the inductor and the photoelectronic element are arranged on the carrier, the driving circuit and the bias circuit are arranged on the circuit board, the carrier is fixed on the insulating base, a first electrode of the carrier component is connected with a first electrode of the driving circuit and a first electrode of the bias circuit on the circuit board through the first lead, and a second electrode of the carrier component is connected with a second electrode of the driving circuit and a second electrode of the bias circuit on the circuit board through the second lead.

An optoelectronic assembly according to any one of claims 1 to 10, wherein the optoelectronic assembly is in the form of a coaxial package, a chip-on-board package or a cassette package.

A method of fabricating an optoelectronic assembly, the method comprising:

providing a carrier assembly, an optoelectronic element, an inductor and a capacitor;

disposing the optoelectronic element and the capacitor on the carrier assembly;

connecting the first electrode of the optoelectronic component to the first electrode of the carrier assembly via the inductance and connecting the second electrode of the optoelectronic component to the second electrode of the carrier assembly;

and connecting the first electrode of the capacitor with the first electrode of the carrier assembly, and connecting the second electrode of the capacitor with the second electrode of the carrier assembly, wherein the inductor and the capacitor are used for forming a resonant loop, and the resonant frequency of the resonant loop has a correlation relation with the signal output frequency of the optoelectronic element.

The method of claim 12, wherein the inductor comprises a wire inductor, and wherein connecting the first electrode of the optoelectronic element to the first electrode of the carrier assembly through the inductor comprises:

and connecting the first electrode of the optoelectronic element with one end of the lead inductor, and connecting the other end of the lead inductor with the first electrode of the carrier assembly.

The method of claim 12, wherein the inductor comprises a wire inductor, and wherein connecting the first electrode of the optoelectronic element to the first electrode of the carrier assembly through the inductor comprises:

and connecting the first electrode of the optoelectronic element with one end of the lead inductor, and connecting the other end of the lead inductor with the first electrode of the capacitor.

The method according to any one of claims 12 to 14, characterized in that the difference between the resonance frequency of the resonant tank and the signal output frequency of the optoelectronic element is within a preset range of values; alternatively, the resonant frequency of the resonant tank is equal to the signal output frequency of the optoelectronic element.

The method of claim 12 or 13, wherein the first electrode of the capacitor is located on an upper surface of the capacitor and the second electrode of the capacitor is located on a lower surface of the capacitor, and connecting the first electrode of the capacitor to the first electrode of the carrier assembly and connecting the second electrode of the capacitor to the second electrode of the carrier assembly comprises: and attaching the second electrode of the capacitor to the second electrode of the carrier assembly, and connecting the first electrode of the capacitor to the first electrode of the carrier assembly through a gold wire.

The method of claim 12 or 13, wherein the first electrode of the capacitor and the second electrode of the capacitor are both located on a lower surface of the capacitor, and connecting the first electrode of the capacitor to the first electrode of the carrier assembly and connecting the second electrode of the capacitor to the second electrode of the carrier assembly comprises:

and attaching the first electrode of the capacitor to the first electrode of the carrier, and attaching the second electrode of the capacitor to the second electrode of the carrier component.

The method of claim 12 or 13, wherein the first electrode of the capacitor and the second electrode of the capacitor are located at two ends of the capacitor, respectively, and connecting the first electrode of the capacitor to the first electrode of the carrier assembly and connecting the second electrode of the capacitor to the second electrode of the carrier assembly comprises:

and attaching the first electrode of the capacitor to the first electrode of the carrier, and attaching the second electrode of the capacitor to the second electrode of the carrier component.

The method of claim 12 or 14, wherein the second electrode of the capacitor is located on a lower surface of the capacitor, and the first electrode of the capacitor comprises a first conductive plating layer, a second conductive plating layer and a third conductive plating layer, wherein the first conductive plating layer is located on the lower surface of the capacitor, the second conductive plating layer is located on an upper surface of the capacitor, and the third conductive plating layer is used for connecting the first conductive plating layer and the second conductive plating layer, and the connecting the first electrode of the capacitor with the first electrode of the carrier assembly and the connecting the second electrode of the capacitor with the second electrode of the carrier assembly comprises:

and attaching the second electrode of the capacitor to the second electrode of the carrier, attaching the first conductive coating to the first electrode of the carrier, and connecting the other end of the lead inductor to the second conductive coating.

The method of any one of claims 12 to 19, wherein the carrier assembly further comprises a drive assembly comprising a drive circuit and a bias circuit, the method further comprising: connecting the first electrode of the carrier assembly to the first electrode of the driving circuit and the first electrode of the bias circuit, and connecting the second electrode of the carrier assembly to the second electrode of the driving circuit and the second electrode of the bias circuit.