阅读说明：本技术 一种老化测试装置 (Aging testing device ) 是由 曹佶 赵宝忠 于 2019-10-16 设计创作，主要内容包括：本发明公开了一种老化测试装置,包括用于配置老化测试信息的上位机控制组件、通信组件、电源系统、用于接收和驱动测试信息的信息驱动组件,以及用于装载待测存储器的老化组件,所述上位机控制组件通过所述通信组件与所述信息驱动组件电性连接,所述通信组件和所述信息驱动组件分别与所述电源系统电性连接；所述老化组件包括烘箱和多个间隔设置的老化板,所述老化板设置在所述烘箱内,所述信息驱动组件包括多个用于驱动测试信息的驱动板和用于连接多根信息线的高频连接器,所述驱动板通过所述高频连接器与所述老化板电性连接。其能解决存储器老化测试装置的测试频率不高,而不能满足高速存储器老化测试的问题。(The invention discloses an aging test device, which comprises an upper computer control assembly, a communication assembly, a power supply system, an information driving assembly and an aging assembly, wherein the upper computer control assembly is used for configuring aging test information; the aging assembly comprises an oven and a plurality of aging plates arranged at intervals, the aging plates are arranged in the oven, the information driving assembly comprises a plurality of driving plates used for driving test information and a high-frequency connector used for connecting a plurality of information lines, and the driving plates are electrically connected with the aging plates through the high-frequency connector. The aging test device can solve the problem that the aging test of the high-speed memory cannot be met due to low test frequency of the aging test device of the memory.)

1. An aging testing device is characterized in that: the device comprises an upper computer control assembly, a communication assembly, a power supply system, an information driving assembly and an aging assembly, wherein the upper computer control assembly is used for configuring aging test information, the information driving assembly is used for receiving and driving the test information, the aging assembly is used for loading a memory to be tested, the upper computer control assembly is electrically connected with the information driving assembly through the communication assembly, and the communication assembly and the information driving assembly are respectively electrically connected with the power supply system;

the aging assembly comprises an oven and a plurality of aging plates arranged at intervals, the aging plates are arranged in the oven, the information driving assembly comprises a plurality of driving plates used for driving test information and a high-frequency connector used for connecting a plurality of information lines, and the driving plates are electrically connected with the aging plates through the high-frequency connector.

2. The burn-in test apparatus of claim 1, wherein: the high-frequency connector is an SEAM connector.

3. The burn-in test apparatus of claim 1, wherein: the driving board is a high-frequency substrate SH260 and is provided with 256 paths of I/O signal channels.

4. The burn-in test apparatus of claim 3, wherein: the information driving assembly further comprises an embedded control unit, the embedded control unit comprises an ARM9TDMI chip for receiving the aging test information, and the ARM9TDMI chip is electrically connected with the I/O signal channel.

5. The burn-in test apparatus of claim 4, wherein: the information driving assembly further comprises a plurality of graph generating and detecting units used for generating graph test signals and detecting the graph test signals, each graph generating and detecting unit comprises an FPGA main control module, and the FPGA main control module is in signal connection with the embedded control unit.

6. The burn-in test apparatus of claim 1, wherein: the upper computer control assembly comprises a database module, a code editing module, a network communication module, an aging control module and a parameter editing module, wherein the code editing module, the network communication module, the aging control module and the parameter editing module are respectively in signal connection with the database module, and the communication assembly, the parameter editing module and the aging control module are respectively in signal connection with the network communication module.

7. The burn-in test apparatus of claim 6, wherein: the upper computer control assembly further comprises a human-computer interaction interface, and the database module, the code editing module and the parameter editing module are respectively in signal connection with the human-computer interaction interface.

8. The burn-in test apparatus of claim 1, wherein: the communications component includes a 64-port switched 1000M hub.

9. The burn-in test apparatus of claim 1, wherein: the aging testing device further comprises a first cabinet body, and the upper computer control assembly and the power supply system are arranged in the first cabinet body.

10. The burn-in test apparatus of claim 1, wherein: the aging test device further comprises a second cabinet body, the second cabinet body is connected with the oven, and the information driving assembly is arranged in the second cabinet body.

Technical Field

The invention relates to the field of chip testing, in particular to an aging testing device of a memory.

Background

At present, no special aging test equipment for the memory exists in China, the batch aging test of the memory cannot be met, the aging test can only be carried out on low-speed universal aging equipment for the integrated circuit, the aging equipment for the integrated circuit generally adopts a small-scale FPGA chip as the generation of a digital signal, the transmission of a high-speed digital signal is not effectively solved, the highest frequency can only be below 1MHZ, and the driving current can also be greatly reduced along with the increase of the frequency, so that the aging test experiment of the large-batch high-speed memory cannot be met.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention aims to provide a burn-in test device, which can solve the problem that the test frequency of the memory burn-in test device is not high, so that the high-speed memory burn-in test can not be met.

The purpose of the invention is realized by adopting the following technical scheme:

an aging test device comprises an upper computer control assembly, a communication assembly, a power supply system, an information driving assembly and an aging assembly, wherein the upper computer control assembly is used for configuring aging test information, the information driving assembly is used for receiving and driving the test information, the aging assembly is used for loading a memory to be tested, the upper computer control assembly is electrically connected with the information driving assembly through the communication assembly, and the communication assembly and the information driving assembly are respectively electrically connected with the power supply system; the aging assembly comprises an oven and a plurality of aging plates arranged at intervals, the aging plates are arranged in the oven, the information driving assembly comprises a plurality of driving plates used for driving test information and a high-frequency connector used for connecting a plurality of signal wires, and the driving plates are electrically connected with the aging plates through the high-frequency connector.

Preferably, the high frequency connector is a SEAM connector.

Preferably, the driving board is a high-frequency substrate SH260, and the driving board is provided with 256 paths of I/O signal channels.

Preferably, the information driving assembly further comprises an embedded control unit, the embedded control unit comprises an ARM9TDMI chip for receiving the aging test information, and the ARM9TDMI chip is electrically connected with the I/O signal channel.

Preferably, the information driving assembly further comprises a plurality of graph generating and detecting units for generating graph test signals and detecting the graph test signals, wherein the graph generating and detecting units comprise an FPGA main control module, and the FPGA main control module is in signal connection with the embedded control unit.

Preferably, the upper computer control assembly comprises a database module, a code editing module, a network communication module, an aging control module and a parameter editing module, wherein the code editing module, the network communication module, the aging control module and the parameter editing module are respectively in signal connection with the database module, and the communication assembly, the parameter editing module and the aging control module are respectively in signal connection with the network communication module.

Preferably, the upper computer control assembly further comprises a human-computer interaction interface, and the database module, the code editing module and the parameter editing module are respectively in signal connection with the human-computer interaction interface.

Preferably, the communication assembly comprises a 64-port switched 1000M hub.

Preferably, the aging testing device further comprises a first cabinet body, and the upper computer control assembly and the power supply system are arranged in the first cabinet body.

Preferably, the aging test device further comprises a second cabinet body, the second cabinet body is connected with the oven, and the information driving assembly is arranged in the second cabinet body.

Compared with the prior art, the invention has the beneficial effects that:

the high-frequency connector is arranged, and can connect a plurality of signal wires together, so that the high-frequency connector ensures large driving current amount, and can realize high-speed transmission of test information transmitted between the driving plate and the aging board, thereby meeting the aging test requirement of the high-speed memory.

Drawings

FIG. 1 is an overall architecture diagram of the present invention;

FIG. 2 is a schematic perspective view of the burn-in test apparatus of the present invention;

FIG. 3 is a schematic perspective view of another embodiment of the burn-in tester of the present invention;

FIG. 4 is an exploded view of the burn-in apparatus of the present invention;

FIG. 5 is a schematic plan view of the burn-in apparatus of the present invention;

FIG. 6 is an overall architecture diagram of the upper computer control assembly of the present invention.

In the figure: 1. an aging test device; 10. an upper computer control assembly; 11. a human-computer interaction interface; 20. a communication component; 30. an information driving component; 31. a second cabinet; 32. a drive plate; 33. a vent hole; 40. a power supply system; 50. an aging component; 51. aging the board; 52. an oven; 53. an aging rack; 60. a first cabinet; 61. a base; 62. a universal wheel.

Detailed Description

So that the manner in which the features and advantages of the invention are attained and can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "lateral", "longitudinal", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are used for convenience of description and simplicity of description only, and do not indicate or imply that the devices or elements indicated must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Example one

As shown in fig. 1-5, the present invention discloses a burn-in test apparatus 1, which includes a host computer control component 10 for configuring burn-in test information, a communication component 20, a power system 40, an information driving component 30 for receiving and driving the test information, and a burn-in component 50 for loading a memory to be tested, wherein the host computer control component 10 is electrically connected to the information driving component 30 through the communication component 20, and the communication component 20 and the information driving component 30 are respectively electrically connected to the power system 40; the burn-in assembly 50 comprises an oven 52 and a plurality of burn-in boards 53 arranged at intervals, the burn-in boards 53 are arranged in the oven 52, the information driving assembly 30 comprises a plurality of driving boards 32 used for driving test information and a high-frequency connector used for connecting a plurality of signal lines, and the driving boards 32 are electrically connected with the burn-in boards 51 through the high-frequency connector.

In the above embodiment, the user configures the burn-in test information through the upper computer control unit 10, the burn-in test information may be programming code, such as code language of C + + or assembly, and the edited test information is transmitted to the information driver component 30 through the communication component 20, the information driving component 30 receives the aging test information sent by the upper computer, drives the aging test information through the driving board, transmits the aging test information to the aging board 51 through the high-frequency connector, the device to be tested (memory) arranged on the burn-in board is tested, a plurality of memories to be tested are arranged on the burn-in board, during the testing process, the information driving component 30 can also detect the test information on the burn-in board 51, so as to ensure the validity of the test information, meanwhile, the information driving component 30 may also return the test result information to the upper computer control component 10. In addition, the plurality of signal lines are preferably pin lines, the high-frequency connector can connect the plurality of pin lines together, and the other ends of the plurality of pin lines can be electrically connected with the burn-in board 51, so that the high-frequency connector is ensured to have large drive current (which can also be understood as "drive information amount"), and the high-speed transmission of test information transmitted between the drive board 32 and the burn-in board 51 can be realized, so that the burn-in test of a high-speed memory can be met; the oven 52 can provide a suitable high temperature (generally 70-90 degrees) to the burn-in assembly 50 to burn in the device under test on the burn-in board 53, and the burn-in boards 53 are spaced to avoid signal interference between the burn-in boards 51.

The high-frequency connector is preferably a SEAM connector through a large amount of experiments and tests, and is most preferably a high-frequency high-density patch BGA connector SEAM-50-6-S-RE.

The driving board is a high-frequency substrate SH260, the driving board can be connected with the high-frequency connector in a plugging mode, and a special power supply layer and a ground layer are designed on the driving board to reduce the noise of a ground wire; the drive board is provided with 256 paths of I/O signal channels and signal shielding lines, so that interference of signals of all paths can be avoided, test information can be completely transmitted, transmission of multiple paths of test signals can be realized, and the test of a large-capacity or large-batch memory can be met; the number of design layers of the driving board is 14-16, and a shielding wire can be added between digital signal wires by adopting a multi-layer board design, so that the problem of crosstalk between the signal wires is reduced. In order to facilitate the connection of the driving board and the high-frequency connector, a positioning pin is designed at the top of the driving board, and a frame of the driving board is fixed by a precise aluminum piece to ensure that the driving board is tightly connected with the high-frequency connector; the drive board adopts the modularized design idea, and functional modules are all connected and fixed in a mother board and daughter board mode, and subsequent upgrading can be carried out on equipment through reserved interfaces.

Example two

In this embodiment, it is different from the above embodiments in that the information driving component 30 further includes a plurality of embedded control units and a pattern generation and detection unit for generating a pattern test signal and detecting the pattern test signal, the embedded control unit includes an ARM9TDMI chip for receiving aging test information, the ARM9TDMI chip is electrically connected to an I/O signal channel on the driving board, the pattern generation and detection unit includes an FPGA main control module, and the FPGA main control module is in signal connection with the embedded control unit.

In the above embodiment, the ARM9TDMI chip has the characteristics of portability, expandability, real-time performance, and the like, can complete tri-state control (on-off or high-impedance state control) of 256I/O signal channels of the driving board, can also well receive a signal of the upper computer control assembly 10, and can return self-check information of the ARM9TDMI chip and an aging test result of the memory. The ARM9TDMI chip can be electrically connected with the driving board through a GPIO control line.

The pattern generation and detection unit is in signal connection with the ARM9TDMI chip through a data bus, and the FPGA main control module is used for completing configuration tasks of an aged device (a memory), receiving various test signals or instruction codes, generating test pattern signals which are convenient for testing the memory by the test signals or the instruction codes, and transmitting the test pattern signals to the drive board. The pattern generation and detection unit can also complete the definition of a pin signal of a tested device, can detect a test signal at regular time when testing a memory, ensures the validity of the test signal, can detect the function of the aging test device 1, and transmits various data and the working state of the aging test device 1 back to the embedded control unit.

EXAMPLE III

In this embodiment, as shown in fig. 6, the upper computer control component includes a human-computer interaction interface 11, a database module, a code editing module, a network communication module, an aging control module, and a parameter editing module, the code editing module, the network communication module, the aging control module, and the parameter editing module are respectively in signal connection with the database module, and the communication component, the parameter editing module, and the aging control module are respectively in signal connection with the network communication module. The database module, the code editing module and the parameter editing module are respectively in signal connection with the human-computer interaction interface.

In the above embodiment, the human-machine interface 11 is a main human-machine interface 11 of the local testing apparatus 1, and is used for starting, setting, device definition, aging scheme and code selection, test pattern information generation, aging monitoring, and the like of the local testing apparatus 1, so that the operation is simpler. The database module is used for storing pipe fitting definitions, aging test instruction programs, corresponding machine codes, required aging graph information and the like aiming at various different devices. And the code editing module is used for translating the aging test assembly code formulated by the aging test scheme into a machine code or an instruction code which can be executed by the DSP chip and storing the machine code or the instruction code in the database module. The aging control module is used for monitoring the running state of the aging test device 1 in real time, and can send alarm information when the aged device is short-circuited, open-circuited and abnormal in test; when the aging current suddenly changes, the channel can be automatically closed, so as to protect the aged device and the aging test device 1. The network communication module can realize high-speed communication between the upper computer control assembly and the communication assembly, is used for sending the aging codes, the graphic information and the control data information to the information driving assembly, and simultaneously reads various running states of the information driving assembly and the tested device. The parameter editing module sets or edits various test parameters such as test temperature, test time, test specification and the like through the human-computer interaction interface 11.

In addition, in the test process of the aging test device 1, the database module can record various parameters of an aged device in the aging test process in real time, and provides data support for later-stage test. The aging test device 1 can also simulate the working state of the tested device in actual working to carry out aging test, thereby ensuring better aging test effect.

Example four

In this embodiment, it differs from the previous embodiments in that the communication assembly comprises a 64-port switched 1000M hub. The power system 40 includes a primary burn-in programmable power supply and a secondary burn-in programmable power supply. The primary aging program-controlled power supply mainly supplies power to the upper computer control assembly 10 and the communication assembly 20, and the secondary aging program-controlled power supply mainly supplies power to the information driving assembly.

In the above embodiment, since the burn-in test apparatus 1 is provided with a plurality of (generally 48) embedded control units for burn-in test, and a large amount of test information needs to be transmitted, these embedded control units and the upper computer control module are connected to form a local area network through the communication module, so as to realize high-speed data transmission and meet the test of high-speed memories. After the communication component is adopted, the upper computer control component 10 can be placed on a local area network or even a wide area network to complete the operation of the test device. Meanwhile, the upper computer control module 10 may operate any of a plurality of information driving modules. The one-stage aging programmable power supply adopts a highly reliable liquid crystal display digital power supply, has high accuracy and stable performance, is provided with a GPIB bus interface, can realize an online communication detection function, and ensures the reliability of a power supply system. The two-stage aging programmable power supply adopts a high-efficiency small-sized modular design idea, and improves the integration level and the convenience of maintenance. The power supply system 40 adopts a digital programmable control mode, sends instructions through the upper computer control component 10, and is very convenient to use.

EXAMPLE five

In this embodiment, it is different from the above embodiment in that, as shown in fig. 2 to 5, the aging test apparatus 1 further includes a first cabinet 60 and a second cabinet 31, and the upper computer control assembly 10 and the power supply system 40 are both disposed in the first cabinet 60. The second cabinet 31 is connected to the oven 52, and the information driving assembly 30 is disposed in the second cabinet 31.

In the above embodiment, as shown in fig. 2, the upper computer control assembly 10 and the power supply system 40 are both disposed in the first cabinet 60, and the information driving assembly 30 is disposed in the second cabinet 31, so as to avoid high temperature of the oven 52. The first cabinet 60, the second cabinet 31 and the oven 52 are detachably connected, so that the carrying and the assembly are facilitated; in order to facilitate moving the aging testing device 1, universal wheels 62 are disposed at the lower ends of the first cabinet 60, the second cabinet 31 and the oven 52. Wherein, the first cabinet 60 further includes a base 61, and the base 61 facilitates installation of the upper computer control assembly 10 and the power supply system 40. The oven 52 may be heated by heating air or by electrical resistance to produce heat, and the oven 52 is provided with a safety door that is closed when heated. As shown in fig. 4, the aging assembly 50 includes an aging rack 53 and an aging plate 51, and the aging plate 51 is disposed on the aging rack 53 at intervals. The information driving module 30 is provided with a plurality of ventilation holes 33 for heat dissipation.

In summary, the aging test device 1 adopts the upper computer control component 10, the communication component 20 and the information driving component 30 to perform the aging test on the device to be tested on the aging component 50, the driving board is electrically connected with the aging board 51 through the high-frequency connector, and the high-frequency connector can connect a plurality of pin lines together, so that the driving current of the high-frequency connector is ensured to be sufficient. In addition, the drive board has 256 paths of I/O signals, and can meet the burn-in test of most storage devices on the market.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.