阅读说明：本技术 检查指示信息产生装置、基板检查系统、检查指示信息产生方法以及检查指示信息产生程序 (Inspection instruction information generating device, substrate inspection system, inspection instruction information generating method, and inspection instruction information generating program ) 是由 椹木雅也 于 2019-07-18 设计创作，主要内容包括：本发明根据表示基板的面状导体IP、导电部P、配线W、及通孔V如何导通连接的导电结构信息D1,所述基板包括：导体层Lc、设置有多个导电部P的基板面F、配线层L、以及通孔V,当存在多个经由配线层L的配线W而相互导通的导电部P彼此的群组时,执行如下的检查指示信息产生处理：自所述各群组中各选择一对导电部P作为第一选择导电部,并将表示所述经选择的多对第一选择导电部的信息作为检查指示信息D2来产生。(The present invention is a substrate, which is based on conductive structure information D1 indicating how a planar conductor IP, a conductive part P, a wire W, and a via hole V of the substrate are conductively connected, the substrate including: the conductor layer Lc, the substrate surface F on which the plurality of conductive sections P are provided, the wiring layer L, and the through holes V, and when there are a plurality of groups of conductive sections P that are electrically connected to each other via the wiring W of the wiring layer L, the following inspection instruction information generation processing is executed: a pair of conductive sections P is selected as a first conductive section selection from each of the groups, and information indicating the selected pairs of first conductive section selection is generated as inspection instruction information D2.)

1. An examination instruction information generating apparatus comprising: a storage unit that stores conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate including: a conductor layer which is a layer provided with the planar conductor having conductivity spreading in a planar or mesh shape, a substrate surface provided with a plurality of the conductive portions, a wiring layer which is a layer laminated between the conductor layer and the substrate surface, through holes which connect wirings of the wiring layer with the plurality of conductive portions, and through holes which connect wirings of the wiring layer with the planar conductor of the conductor layer; and

an inspection instruction information generation section that, when there is a plurality of groups of the conductive sections that are electrically connected to each other via the wiring of the wiring layer, executes, based on the conductive structure information, an inspection instruction information generation process of: a pair of the conductive parts is selected from each of the groups as a first electrically conductive part, and information indicating the selected pairs of first electrically conductive parts is recorded as inspection instruction information.

2. The inspection instruction information generation device according to claim 1, wherein the inspection instruction information generation processing includes the steps of:

(a) grouping the conductive parts electrically connected to each other via the wiring of the wiring layer based on the conductive structure information; and

(b) the inspection instruction information is recorded in such a manner that, for the plurality of grouped groups, two conductive sections are selected as the pair of first selective conductive sections from among the conductive sections included in each group, and the selected plurality of pairs of first selective conductive sections are set as inspection sections capable of performing inspection simultaneously.

3. The inspection instruction information generating apparatus according to claim 2, wherein in the step (b), when there is a group having a conductive portion that is not selected as the first electrically conductive portion, two conductive portions including the conductive portion that is not selected as the first electrically conductive portion are recorded in the inspection instruction information as a pair of second electrically conductive portions to be inspected at different times from the plurality of pairs of first electrically conductive portions for the group.

4. The inspection instruction information generation device according to claim 2 or 3, wherein the substrate includes a plurality of the wiring layers, further including a plurality of through holes connecting the plurality of wiring layers,

the inspection instruction information generating unit further performs the following steps: (d) when the wires of the wiring layers are connected in parallel, the conductive structure information is changed so that the plurality of wires connected in parallel are replaced with one of the wires closest to the substrate surface before the step (a), and the plurality of wires are connected in parallel, and the conductive structure information is changed so that the one of the wires closest to the substrate surface is replaced with the one of the wires closest to the substrate surface

The inspection instruction information generation process is executed based on the conductive structure information changed in the step (d).

5. The inspection instruction information generating apparatus according to claim 4, wherein the inspection instruction information generating section further performs the steps of: (e) in the case where the through holes or the rows of through holes are connected in parallel by the wiring and the planar conductor, the conductive structure information changed in the step (d) is changed so that the through holes or the rows of through holes connected in parallel are replaced with one through hole or one row of through holes before the step (a), and the conductive structure information is changed

Performing the inspection instruction information generation process based on the conductive structure information changed in the step (e).

6. The inspection instruction information generation device according to any one of claims 2 to 5, wherein the substrate includes a plurality of the wiring layers, and further includes a plurality of through holes that connect the plurality of wiring layers between layers,

the inspection instruction information generating unit (f) executes the steps (a) and (b) with a wiring layer closest to the substrate surface among the plurality of wiring layers as a processing target,

(g) regarding the other wiring layers except the wiring layer closest to the substrate surface, the other wiring layers are respectively treated as the treatment objects,

(g1) for each of the wires of the wiring layer to be processed, corresponding to one of the wires, one of the conductive portions electrically connected to one of the through holes connected to a side of the one wire remote from the conductor layer on a side opposite to the one wire is selected, and the selected conductive portions are grouped for the corresponding wires,

(g2) the step (b) is performed for the groups grouped in the step (g1), and

and (b) recording the first selective conductive parts of each pair in the inspection instruction information in association with the wiring layer to be processed.

7. The inspection instruction information generating apparatus according to claim 6, wherein in the step (b), the inspection instruction information is recorded by sorting the plurality of pairs of first selective conductive sections in order for the wiring layers from the point of selecting the wiring layer close to the substrate surface as the processing target in the steps (f) and (g).

8. The inspection instruction information generating apparatus according to any one of claims 1 to 7, wherein (h) one of the conductive portions electrically connected on the opposite side to the planar conductor is selected for each through hole connected to one side of the planar conductor, thereby grouping the selected conductive portions as conductive portions corresponding to one side of the planar conductor, selecting two conductive portions as a pair of first selected conductive portions from among the grouped conductive portions, and recording the selected pair of first selected conductive portions in the inspection instruction information.

9. The inspection instruction information generation device according to claim 3, wherein the inspection instruction information generation processing further includes the steps of:

(j) searching for the wire that is not sandwiched by the pair of first selectively conductive portions and is not sandwiched by the pair of second selectively conductive portions; and

(k) the inspection instruction information is recorded with a conductive portion that is electrically connected to one end of the searched wire without passing through the wire and a conductive portion that is electrically connected to the other end of the wire without passing through the wire as a pair of third selective conductive portions to be inspected at a time different from that of the plurality of pairs of first selective conductive portions.

10. The inspection instruction information generating apparatus according to any one of claims 1 to 9, wherein the substrate surface and the wiring layer are respectively provided on both sides of the conductor layer, and

the inspection instruction information generation section performs the inspection instruction information generation process on both sides of the conductor layer.

11. The inspection instruction information generation device according to claim 10, wherein the substrate includes a plurality of the conductor layers, and through holes that connect the planar conductors of the plurality of conductor layers to each other, and

the inspection instruction information generation process further includes the steps of:

(l) One of the conductive portions on one of the two substrate surfaces and one of the conductive portions on the other substrate surface are recorded in the inspection instruction information as a pair of fourth selective conductive portions to be inspected at a time different from that of the plurality of pairs of first selective conductive portions.

12. The inspection instruction information generating apparatus according to any one of claims 1 to 11, wherein the inspection instruction information generating section further performs a process of: (m) converting the conductive structure information into a data structure of a tree structure by making the through hole correspond to a node, making the wiring correspond to a branch, making the planar conductor correspond to a root node, and making the conductive structure information into a data structure of a tree structure

The inspection instruction information generation process is executed based on the conductive structure information converted into the tree structure by the (m) process.

13. A substrate inspection system comprising:

the examination indication information generating apparatus according to any one of claims 1 to 12; and

an inspection processing unit that inspects the substrate based on the inspection instruction information; and is

The inspection processing unit performs the following steps:

(c1) a first current supply process for causing a current to flow between the paired first selective conductive sections is simultaneously performed for the plurality of pairs of first selective conductive sections indicated by the inspection instruction information, a voltage between the paired first selective conductive sections is detected, and the through holes and the wirings of the current paths between the first selective conductive sections of each pair are inspected based on the current and the voltage.

14. A substrate inspection system comprising:

the examination indication information generating apparatus according to claim 3; and

an inspection processing unit that inspects the substrate based on the inspection instruction information; and is

The inspection processing unit performs the following steps:

(c1) simultaneously performing a first current supply process for causing a current to flow between the paired first selective conductive portions with respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, detecting a voltage between the paired first selective conductive portions, and inspecting via holes and wirings of current paths between the first selective conductive portions of each of the pairs based on the current and the voltage; and

(c2) a second current supply process of causing a current to flow between the paired second selective conductive parts indicated by the inspection instruction information is executed at a time different from the first current supply process, a voltage between the paired second selective conductive parts is detected, and a via and a wiring of a current path between the paired second selective conductive parts are inspected based on the current and the voltage.

15. A substrate inspection system comprising:

the examination indication information generating apparatus according to claim 7; and

an inspection processing unit that inspects the substrate based on the inspection instruction information;

the inspection processing unit executes the following steps for each wiring layer in the order indicated by the inspection instruction information: (c1) a first current supply process of causing a current to flow between the paired first selective conductive portions is simultaneously performed for the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a voltage between the paired first selective conductive portions is detected, a via hole and a wiring of a current path between the first selective conductive portions of each pair are inspected based on the current and the voltage, and

if the result of the inspection in the step (c1) is not good, the step (c1) for the wiring layer whose order is next or later is not executed.

16. A substrate inspection system comprising:

the examination instruction information generating apparatus according to claim 10; and

an inspection processing unit that inspects the substrate based on the inspection instruction information;

the inspection processing unit performs the following steps: (c1) a first current supply process of causing a current to flow between the paired first selective conductive portions is simultaneously performed for the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a voltage between the paired first selective conductive portions is detected, a via hole and a wiring of a current path between the first selective conductive portions of each pair are inspected based on the current and the voltage, and

in the step (c1), the first current supply process for the plurality of pairs of first electrically conductive option portions associated with one side of the conductor layer by the inspection instruction information and the first current supply process for the plurality of pairs of first electrically conductive option portions associated with the other side of the conductor layer are simultaneously executed.

17. An inspection instruction information generating method including an inspection instruction information generating step of generating inspection instruction information based on conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate including: a conductor layer provided with a layer of the planar conductor having conductivity spreading in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer laminated between the conductor layer and the substrate surface, through holes connecting the wirings of the wiring layer to the plurality of conductive parts, and through holes connecting the wirings of the wiring layer to the planar conductor of the conductor layer,

when there are a plurality of groups of the conductive parts that are electrically connected to each other via the wiring of the wiring layer, the following inspection instruction information generation processing is performed: selecting one pair of the conductive parts from each of the groups as a first conductive part for selection, and generating information representing the selected pairs of first conductive parts for selection as inspection instruction information.

18. An inspection instruction information generating program for causing a computer to generate inspection instruction information based on conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate comprising: a conductor layer provided with a layer of the planar conductor having conductivity spreading in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer laminated between the conductor layer and the substrate surface, through holes connecting the wirings of the wiring layer to the plurality of conductive parts, and through holes connecting the wirings of the wiring layer to the planar conductor of the conductor layer,

when there are a plurality of groups of the conductive parts that are electrically connected to each other via the wiring of the wiring layer, the following inspection instruction information generation processing is performed: selecting one pair of the conductive parts from each of the groups as a first conductive part for selection, and generating information representing the selected pairs of first conductive parts for selection as inspection instruction information.

Technical Field

The present invention relates to an inspection instruction information generating device that generates inspection instruction information for instructing an inspection portion when a substrate is inspected, a substrate inspection system that performs an inspection using the inspection instruction information, an inspection instruction information generating method, and an inspection instruction information generating program.

Background

Conventionally, there have been known substrate inspection apparatuses including: when a measurement object is a circuit board in which a penetration is made from one surface to the other surface of the circuit board, such as a through hole (via) provided in the circuit board, a measurement current is caused to flow into the measurement object, and a voltage generated in the measurement object is measured, whereby a resistance value of the measurement object is measured from the current value and the voltage value (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2012-117991

Disclosure of Invention

Further, in a substrate including a conductor (hereinafter, referred to as a planar conductor) extending in a planar shape therein, there is a substrate in which a conductive portion such as a pad, a bump, or a wiring on a surface of the substrate is electrically connected to the planar conductor in a thickness direction of the substrate.

Fig. 22 is a conceptual diagram illustrating a multilayer substrate WB which is an example of a substrate including a planar conductor IP which is a conductor pattern spread in a planar shape in a substrate inner layer. The multilayer substrate WB shown in fig. 22 has a substrate surface BS provided with conductive portions PA and PB such as pads and wiring patterns. The conductive portions PA and PB are electrically connected to the planar conductor IP through the through holes RA and RB. In the example of the multilayer substrate WB, the planar conductor IP corresponds to a planar conductor.

Further, as a method for manufacturing a substrate, there is a method comprising: two printed wiring boards are formed by laminating a conductive metal plate as a base on both surfaces of the metal plate to form printed wiring boards, and peeling the formed boards from the base metal plate. In such a method for manufacturing a substrate, the substrate (hereinafter, referred to as an intermediate substrate) in a state before the substrate is peeled off from the underlying metal plate has a form in which the metal plate is sandwiched between two substrates. Such an intermediate substrate is also referred to as carrier substrate.

Fig. 23 is a conceptual diagram illustrating an example of such an intermediate substrate MB. In the intermediate substrate MB shown in fig. 23, a substrate WB1 is provided on one surface of the metal plate MP, and a substrate WB2 is provided on the other surface of the metal plate MP. A substrate surface BS1 of the substrate WB1 is provided with a conductive portion PA1 such as a pad or a wiring pattern, conductive portions PB1 and …, and a conductive portion PF 1. A contact surface BS2 of the substrate WB1 with the metal plate MP is provided with a conductive portion PA2 such as a pad or a wiring pattern, conductive portions PB2 and …, and a conductive portion PF 2. The metal plate MP is, for example, a conductive metal plate having a thickness of about 1mm to 10 mm.

The conductive portions PA1 to PF1 are electrically connected to the conductive portions PA2 to PF2 through the through holes RA to RF. Since the conductive portions PA2 to PF2 are closely attached to and electrically connected to the metal plate MP, the conductive portions PA1 to PF1 are electrically connected to the metal plate MP through the through holes RA to RF. The conductive portion PA1 is paired with the through hole RA, the conductive portion PB1 is paired with the through hole RB, and the conductive portions and the through holes are paired, respectively. The substrate WB2 is configured similarly to the substrate WB1, and therefore, the description thereof is omitted. In the example of the intermediate substrate MB, the metal plate MP corresponds to a planar conductor.

In some cases, the resistance values RA and RB of the through holes RA and RB are measured as an inspection of the multilayer substrate WB, the intermediate substrate MB, and the like.

In fig. 24, R1 to R4 represent resistances of equivalent resistances of the planar conductor IP. In order to measure the resistance values RA and RB of the through holes RA and RB, it is conceivable to cause a measurement current I to flow between the conductive portion PA1 and the conductive portion PB1 and measure between the conductive portion PA1 and the conductive portion PB1The generated voltage V was calculated as V/I, which is a resistance value. Thus, V/I provides a resistance RA and a resistance RB of the through hole RA and the through hole RB and a resistance R of the resistance R1 of the planar conductor IP at two points on the current path from the conductive portion PA1 to the conductive portion PB1₁The total of (a) and (b).

Here, in fig. 24, the conductive portions PA1 to PE1 are arranged in a straight line in relation to the paper surface. However, in an actual substrate, the conductive portions PA1 to PE1 are two-dimensionally distributed on the substrate surface. Therefore, when a pair of conductive parts PA1 and PC1 are selected and a current I flows in the conductive parts PA1 and PC1 for resistance measurement₁Selecting another pair of conductive parts PB1 and PD1 and flowing current I₂Then, exists at the current I₁Current I₂A repetitive situation arises in the current path of (a).

In the example shown in fig. 24, repetition of the current is generated in the resistor R2. In this case, the voltage V between the conductive part PA1 and the conductive part PC1 is I₁(Ra+R₁+R₂+Rc)+I₂R₂. If set to I₁＝I₂Then V/I₁＝(Ra+R₁+R₂+Rc)+R₂Thus obtaining the resistance value (Ra + R) to be measured₁+R₂+ Rc) and resistance R₂The resistance values obtained by the addition result in a decrease in resistance measurement accuracy.

Therefore, in order to prevent the measurement current from being repeated, it is necessary to sequentially perform the inspection between the pair of conductive portions one by one, which may increase the inspection time of the entire substrate.

The invention aims to provide an inspection instruction information generating device for generating inspection instruction information indicating an inspection part which is easy to shorten the inspection time of a substrate, a substrate inspection system comprising the inspection instruction information generating device, an inspection instruction information generating method and an inspection instruction information generating program.

An inspection instruction information generating device according to an example of the present invention includes: a storage unit that stores conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate including: a conductor layer which is a layer provided with the planar conductor having conductivity spreading in a planar shape, a substrate surface provided with a plurality of the conductive portions, a wiring layer which is a layer laminated between the conductor layer and the substrate surface, through holes which connect wirings of the wiring layer with the plurality of conductive portions, and through holes which connect wirings of the wiring layer with the planar conductor of the conductor layer; and an inspection instruction information generation section that, when there is a plurality of groups of the conductive sections that are electrically connected to each other via the wiring of the wiring layer, executes, based on the conductive structure information, an inspection instruction information generation process of: a pair of the conductive parts is selected from each of the groups as a first electrically conductive part, and information indicating the selected pairs of first electrically conductive parts is recorded as inspection instruction information.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit executes: (c1) a first current supply process for causing a current to flow between the paired first selective conductive sections is simultaneously performed for the plurality of pairs of first selective conductive sections indicated by the inspection instruction information, a voltage between the paired first selective conductive sections is detected, and the through holes and the wirings of the current paths between the first selective conductive sections of each pair are inspected based on the current and the voltage.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit executes: (c1) simultaneously performing a first current supply process for causing a current to flow between the paired first selective conductive portions with respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, detecting a voltage between the paired first selective conductive portions, and inspecting via holes and wirings of current paths between the first selective conductive portions of each of the pairs based on the current and the voltage; and (c2) performing a second current supply process of causing a current to flow between the pair of second selectively conductive parts indicated by the inspection instruction information, at a time different from the first current supply process, and detecting a voltage between the pair of second selectively conductive parts, and inspecting a via and a wiring of a current path between the pair of second selectively conductive parts based on the current and the voltage.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit performs the following steps for the wiring layers in an order indicated by the inspection instruction information: (c1) and (c) simultaneously performing a first current supply process for causing a current to flow between the paired first selective conductive portions with respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, detecting a voltage between the paired first selective conductive portions, and inspecting a via hole and a wiring of a current path between the paired first selective conductive portions based on the current and the voltage, wherein the step (c1) is not performed with respect to the wiring layer in the next or subsequent order when a result of the inspection in the step (c1) is defective.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit executes: (c1) a first current supply process of causing a current to flow between the paired first selective conductive portions is simultaneously performed for the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a voltage between the paired first selective conductive portions is detected, via holes and wirings of current paths between the first selective conductive portions of each pair are inspected based on the current and the voltage, and in the step (c1), the first current supply process for the plurality of pairs of first selective conductive portions corresponding to one side of the conductor layer by the inspection instruction information and the first current supply process for the plurality of pairs of first selective conductive portions corresponding to the other side of the conductor layer are simultaneously performed.

An inspection instruction information generating method according to an example of the present invention includes an inspection instruction information generating step of generating inspection instruction information based on conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate including: a conductor layer which is a layer provided with the planar conductor having conductivity spreading in a planar shape, a substrate surface provided with a plurality of the conductive portions, the wiring layer which is a layer laminated between the conductor layer and the substrate surface, through holes which connect wirings of the wiring layer with the plurality of conductive portions, and through holes which connect wirings of the wiring layer with the planar conductor of the conductor layer, wherein when there are a plurality of groups of the conductive portions which are electrically connected to each other via the wirings of the wiring layer, the following inspection instruction information generation processing is executed: selecting one pair of the conductive parts from each of the groups as a first conductive part for selection, and generating information representing the selected pairs of first conductive parts for selection as inspection instruction information.

Drawings

Fig. 1 is a schematic view conceptually showing a configuration of a substrate inspection system 1 according to an embodiment of the present invention.

Fig. 2 is a block diagram showing an example of an electrical configuration of the measurement unit shown in fig. 1.

Fig. 3 is a cross-sectional view showing an example of a substrate to be inspected.

Fig. 4 is a plan view showing an example of a substrate to be inspected.

Fig. 5 is a diagram illustrating an example of the conductive structure information D1' simplified from the conductive structure information D1 of the substrate B shown in fig. 3.

Fig. 6 is a diagram illustrating conductive structure information D1 ″ that expresses the conductive structure information D1' shown in fig. 5 with a tree structure.

Fig. 7 is a flowchart showing an example of the operation of the inspection instruction information generation method and the inspection instruction information generation device using the inspection instruction information generation method according to the embodiment of the present invention.

Fig. 8 is a flowchart showing an example of the operation of the inspection instruction information generation method and the inspection instruction information generation device using the inspection instruction information generation method according to the embodiment of the present invention.

Fig. 9 is a flowchart showing an example of the operation of the inspection instruction information generation method and the inspection instruction information generation device using the inspection instruction information generation method according to the embodiment of the present invention.

Fig. 10 is a flowchart showing an example of the operation of the substrate inspection method and the substrate inspection apparatus using the substrate inspection method according to the embodiment of the present invention.

Fig. 11 is a flowchart showing an example of a first step of the inspection instruction information generation method according to the embodiment of the present invention.

Fig. 12 is a flowchart showing an example of processing related to a branch (branch) connected to a root node in the examination instruction information generation method according to the embodiment of the present invention.

Fig. 13 is a flowchart showing an example of processing relating to a branch connected to a root node in the examination instruction information generation method according to the embodiment of the present invention.

Fig. 14 is a flowchart showing an example of the second step of the inspection instruction information generation method according to the embodiment of the present invention.

Fig. 15 is a partially enlarged view of fig. 5.

Fig. 16 is an explanatory diagram showing another example of the conductive structure information D1 ″ shown in fig. 6.

Fig. 17 is an explanatory view showing another example of the substrate shown in fig. 3.

Fig. 18 is an explanatory diagram showing a table format of an example of the inspection instruction information.

Fig. 19 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in fig. 1.

Fig. 20 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in fig. 1.

Fig. 21 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in fig. 1.

Fig. 22 is a conceptual diagram illustrating an example of a substrate including a planar conductor.

Fig. 23 is a conceptual diagram illustrating an example of a substrate including a planar conductor.

Fig. 24 is an explanatory view for explaining a method of measuring the resistance values of the through hole and the planar conductor IP of the multilayer substrate WB shown in fig. 22.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals denote the same components, and a description thereof will be omitted. The substrate inspection system 1 shown in fig. 1 includes an inspection instruction information generation device 3 and a substrate inspection device 2.

The inspection instruction information generating apparatus 3 shown in fig. 1 includes an inspection instruction information generating section 31 and a storage section 32. The examination instruction information generating apparatus 3 is configured using a computer such as a personal computer, for example, and includes: a Central Processing Unit (CPU) that executes predetermined arithmetic Processing, a Random Access Memory (RAM) that temporarily stores data, a Hard Disk Drive (HDD) and/or a nonvolatile storage device such as a flash Memory, a communication circuit, and peripheral circuits thereof.

The inspection instruction information generation device 3 functions as the inspection instruction information generation unit 31 by executing an inspection instruction information generation program according to an embodiment of the present invention, which is stored in a nonvolatile storage device, for example. The storage unit 32 is configured using, for example, the nonvolatile storage device.

The conductive structure information D1 is stored in the storage section 32. The transmitted conductive structure information D1 may be stored in the storage unit 32 by transmitting the conductive structure information D1 from the outside to the check instruction information generation device 3 via, for example, a communication circuit not shown, or the conductive structure information D1 may be stored in the storage unit 32 by reading the conductive structure information D1 stored in a storage medium such as a Universal Serial Bus (USB) memory by the check instruction information generation device 3, and the conductive structure information D1 may be stored in the storage unit 32 by various methods.

The conductive structure information D1 is information indicating how the planar conductor IP, the conductive portion P, the wiring W in each wiring layer L, and the via hole V of the substrate B are electrically connected to each other. As the conductive structure information D1, for example, so-called guerber data (gerber data) used in the manufacture of the substrate, a netlist (netlist), or the like can be used.

The inspection instruction information generation section 31 generates inspection instruction information D2 for the substrate inspection apparatus 2 based on the conductive structure information D1, the inspection instruction information D2 indicating a pair of conductive sections P into which a current should flow for inspection. The inspection instruction information generating unit 31 may transmit the inspection instruction information D2 to the board inspection apparatus 2 via a communication circuit, which is not shown, for example. Alternatively, the examination instruction information generating unit 31 may write the examination instruction information D2 in the storage medium. The user may cause the board inspection apparatus 2 to read the inspection instruction information D2 from the storage medium. The operation of the inspection instruction information generating unit 31 will be described later in detail.

The substrate inspection apparatus 2 shown in fig. 1 is an apparatus for inspecting a substrate B of an inspected substrate as an inspection object.

The substrate B may be, for example, an intermediate substrate or a multilayer substrate, or may be a printed wiring board, a film carrier (film carrier), a flexible substrate, a ceramic multilayer wiring board, a semiconductor substrate such as a semiconductor chip or a semiconductor wafer, a package substrate for semiconductor packaging, an electrode plate for liquid crystal display or plasma display, an intermediate substrate in a process for producing these substrates, or a so-called carrier substrate. The multilayer substrate WB shown in fig. 22 and the intermediate substrate MB shown in fig. 23 correspond to an example of the substrate B as the substrate to be inspected.

The substrate inspection apparatus 2 shown in fig. 1 has a frame 112. The substrate fixing device 110, the measuring section 121, the measuring section 122, the moving mechanism 125, and the control section 20 are mainly provided in the internal space of the housing 112. The substrate fixing device 110 is configured to fix the substrate B at a predetermined position.

The measuring portion 121 is located above the substrate B fixed to the substrate fixing apparatus 110. The measuring portion 122 is located below the substrate B fixed to the substrate fixing apparatus 110. The measurement portions 121 and 122 include a measurement jig 4U and a measurement jig 4L for bringing probes into contact with a plurality of conductive portions provided on the substrate B.

A plurality of probes Pr are attached to the measurement jig 4U and the measurement jig 4L. The measurement jigs 4U and 4L are arranged and hold a plurality of probes Pr so as to correspond to the arrangement of conductive portions to be measured provided on the surface of the substrate B. The moving mechanism 125 moves the measuring section 121 and the measuring section 122 appropriately in the housing 112 in response to a control signal from the control section 20, and brings the probes Pr of the measuring jig 4U and the measuring jig 4L into contact with the conductive sections of the substrate B.

The substrate inspection apparatus 2 may include only one of the measurement section 121 and the measurement section 122, and the substrate B may have a conductive section on only one surface. The substrate inspection apparatus 2 may be configured to perform measurement of both surfaces of the substrate to be inspected by either one of the measurement units by inverting the front and back of the substrate.

The control unit 20 is configured to include, for example, the following components: a Central Processing Unit (CPU) that executes predetermined arithmetic Processing, a Random Access Memory (RAM) that temporarily stores data, a Read Only Memory (ROM) that stores a predetermined control program, a nonvolatile storage Unit 22 such as a Hard Disk Drive (HDD), and peripheral circuits thereof. The control unit 20 functions as an inspection processing unit 21 by executing a control program stored in the storage unit 22, for example.

The measurement unit 121 shown in fig. 2 includes: a scanner unit 13, a plurality of measurement blocks 12, and a plurality of probes Pr. The measurement unit 122 is configured similarly to the measurement unit 121, and therefore, the description thereof is omitted.

The measurement block 12 includes a power supply unit CS, a power supply unit CM, and a voltage detection unit VM. The power supply section CS and the power supply section CM are constant current circuits that output a current I corresponding to a control signal from the control section 20. The power supply section CS causes the current I to flow in a direction of supply to the scanner section 13, and the power supply section CM causes the current I to flow in a direction of introduction from the scanner section 13. The voltage detection unit VM is a voltage detection circuit that measures a voltage and transmits the voltage value to the control unit 20.

The scanner unit 13 is a switching circuit configured by using a switching element such as a transistor or a relay switch. The scanner unit 13 corresponds to the plurality of measurement blocks 12, and includes a plurality of current terminals + F and-F for supplying a current I for resistance measurement to the substrate B, and a voltage detection terminal + S and a voltage detection terminal-S for detecting a voltage generated between the conductive portions of the substrate B by the current I. In addition, a plurality of probes Pr are electrically connected to the scanner unit 13. The scanner unit 13 switches the connection relationship between the current terminal + F, the current terminal-F, the voltage detection terminal + S, the voltage detection terminal-S, and the plurality of probes Pr in response to a control signal from the control unit 20.

One end of the output terminal of the power supply unit CS is connected to a circuit ground (circuit ground), and the other end is connected to the current terminal + F. One end of the output terminal of the power supply section CM is connected to the circuit ground, and the other end is connected to the current terminal-F. One end of the voltage detection unit VM is connected to the voltage detection terminal + S, and the other end is connected to the voltage detection terminal-S.

The scanner unit 13 is capable of connecting the current terminal + F, the current terminal-F, the voltage detection terminal + S, and the voltage detection terminal-S to any probe Pr in an electrically conductive manner in response to a control signal from the control unit 20. Thus, the scanner unit 13 can cause a current I to flow between any of the conductive portions with which the probe Pr is in contact in response to a control signal from the control unit 20, and can measure a voltage V generated between the conductive portions by the voltage detection unit VM.

Since the plurality of measurement blocks 12 are provided, current supply and voltage measurement can be simultaneously performed between the plurality of conductive portions.

The power supply unit CS and the power supply unit CM are not limited to the example in which one end of the power supply unit CS and the power supply unit CM is connected to the circuit ground, as long as the current I can flow into the substrate B through the scanner unit 13. For example, one end of the power supply section CS may be connected to one end of the power supply section CM to form a current loop (current loop).

Thus, the control unit 20 outputs a control signal to the scanner unit 13, thereby causing the plurality of power supply units CS and CM to flow a current I between the plurality of pairs of probes Pr, and causing the plurality of voltage detection units VM to detect a voltage between the plurality of pairs of probes Pr.

Fig. 3 also serves as an explanatory diagram illustrating the conductive structure information D1 of the substrate B. The conductive structure information D1 is not necessarily data represented by an image, but in the following description, the structure represented by the conductive structure information D1 is shown and described with the use of drawings for easy understanding.

The substrate B shown in fig. 3 is a multilayer substrate in which five substrates B1 to B5 are stacked. The surface of one side of the substrate B is a substrate surface F1, and the surface of the other side is a substrate surface F2. The boundary between the substrate B1 and the substrate B2 is defined as a wiring layer L1, the boundary between the substrate B2 and the substrate B3 is defined as a wiring layer L2, the boundary between the substrate B3 and the substrate B4 is defined as a conductor layer Lc, and the boundary between the substrate B4 and the substrate 5 is defined as a wiring layer L4.

Conductive portions P1 to P7 are provided on substrate surface F1, and conductive portions P11 to P17 are provided on substrate surface F2. The conductive portions P1 to P7 and the conductive portions P11 to P17 serve as inspection points against which the probes Pr abut, such as pads, bumps, wirings, and electrodes.

The conductor layer Lc is provided with a planar conductor IP which is a conductor spread in a planar or mesh shape. The wiring layer L1 is provided with a wiring W11 and a wiring W12, the wiring layer L2 is provided with a wiring W21 and a wiring W22, and the wiring layer L4 is provided with a wiring W41, a wiring W42, a wiring W43, a wiring W44 and a wiring W45. The planar conductor IP may be a conductor that is spread into a sheet shape, i.e., a planar shape, or may be a conductor having the following shape: conductor patterns such as wiring are combined into a regular or irregular net shape (mesh shape) and spread in a planar shape as a whole in the same layer.

Note that, although fig. 3 shows an example in which the planar conductor IP extends over substantially the entire area of the substrate B, the planar conductor IP is not necessarily limited to an example in which the planar conductor IP extends over substantially the entire area of the substrate B. The planar conductor IP may be provided only in a partial region of the substrate B. For example, the wiring W may be provided in a region of the substrate B of the conductor layer Lc where the planar conductor IP is not provided.

The substrate B shown in fig. 4 includes a planar conductor IPa and a planar conductor IPd electrically separated from each other. The planar conductor IPa can be used as an analog ground (analog ground), for example, and the planar conductor IPd can be used as a digital ground (digital ground), for example. As shown in fig. 4, the substrate B may include a plurality of planar conductors IP insulated from each other.

The wiring W41, the wiring W42, and the wiring W43 are each a single wiring in which the wiring W41, the wiring W42, and the wiring W43 of the wiring layer L4 are connected, and for convenience of description, the portions of the single wiring W41, W42, and W43 are referred to as the wiring W41, the wiring W42, and the wiring W43. Similarly, the wires W44 and W45 are one wire in which the wire W44 is connected to the wire W45, and the wires W44 and W45 are part of the wires W44 and W45, respectively.

Substrate B is provided with through holes V11 to V17 penetrating through substrate B1, through holes V21 to V27 penetrating through substrate B2, through holes V31 to V36 penetrating through substrate B3, through holes V41 to V45 penetrating through substrate B4, and through holes V51 to V57 penetrating through substrate B5.

The conductive structure information stored in the storage unit 22 includes information indicating how the conductive portions P1 to P7, conductive portions P11 to P17, wiring W11, wiring W12, wiring W21, wiring W22, wiring W41 to wiring W45, through holes V11 to V17, through holes V21 to V27, through holes V31 to V36, through holes V41 to V45, through holes V51 to V57, and the planar conductor IP are electrically connected, for example, information indicating the connection relationship shown in fig. 3.

Hereinafter, the conductive portions such as the conductive portion P1 to the conductive portion P7, and the conductive portion P11 to the conductive portion P17 are collectively referred to as conductive portions P, the wires such as the wire W11, the wire W12, the wire W21, the wire W22, and the wire W41 to the wire W45 are collectively referred to as wires W, the wires such as the through holes V11 to V17, the through holes V21 to V27, the through holes V31 to V36, the through holes V41 to V45, the through holes V51 to V57 are collectively referred to as through holes V, and the wire layers L1, L2, and L4 are collectively referred to as wire layers L.

Each conductive portion P is conductively connected to the planar conductor IP via the through hole V or the wire W. In this way, the wiring structure in which the conductive portions P are conductively connected to the planar conductor IP is generally used for circuit grounding or connection of a power supply pattern. The substrate B may include a wiring or a pad not connected to a circuit ground or a power supply pattern.

When the substrate B is mounted on the substrate fixing apparatus 110, the movement mechanism 125 brings each probe Pr of the measuring section 121 into contact with the conductive sections P1 to P7, and brings each probe Pr of the measuring section 122 into contact with the conductive sections P11 to P17. Thus, the measuring sections 121 and 122 can cause the current I to flow between any pair of conductive sections P, and detect the voltage between the pair of conductive sections P.

The measuring units 121 and 122 may have one conductive part P in contact with a probe Pr for current supply and a probe Pr for voltage measurement for resistance measurement by a so-called four-terminal resistance measurement method, and may have one conductive part P in contact with one probe P for both current supply and voltage measurement for resistance measurement by a so-called two-terminal resistance measurement method.

The inspection processing unit 21 controls the measuring unit 121 and the measuring unit 122, supplies a current I from the power supply unit CS (see fig. 2) to one of a pair of conductive parts P selected as described below, and extracts the current I from the other through the power supply unit CM (see fig. 2), thereby supplying the current I between the conductive parts P, detecting a voltage between the conductive parts P, and inspecting the substrate B based on the current and the voltage. The inspection processing unit 21 may perform resistance measurement by a four-terminal resistance measurement method or a two-terminal resistance measurement method based on the current and the voltage, and inspect the substrate B based on the resistance value.

Hereinafter, the case where the inspection processing section 21 performs current supply and voltage detection by controlling the measuring section 121 and the measuring section 122 will be described only as the case where the inspection processing section 21 supplies current and detects voltage. The operation of the inspection processing unit 21 will be described later in detail.

Next, the operation of the inspection instruction information generation device 3 will be described. The case where the inspection instruction information corresponding to the substrate B shown in fig. 3 is generated will be described as an example. Fig. 5 and 6 are explanatory views illustrating an example of the conductive structure information D1 changed during the execution of the inspection instruction information generation method when the inspection instruction information corresponding to the substrate B shown in fig. 3 is generated. The operation of the inspection instruction information generating device 3 that executes the inspection instruction information generating method according to the inspection instruction information generating program according to the embodiment of the present invention will be described below with reference to fig. 5 to 14.

In the following flowcharts, the same processes are assigned the same step numbers and the description thereof is omitted.

First, when grouping the conductive parts P of the substrate B, the inspection instruction information generating unit 31 performs a process of simplifying the connection configuration indicated by the conductive configuration information D1 as a preprocessing. Specifically, when the wires W of the plurality of wiring layers L are connected in parallel, the inspection instruction information generating unit 31 generates the conductive structure information D1' by copying and changing the conductive structure information D1 so as to replace the parallel-connected wires W with the wire W closest to the substrate surface F1 among the wires W (step S1 (D)).

Specifically, in the substrate B shown in fig. 3, the plurality of wiring layers L1, the wiring W11 of the wiring layer L2, and the wiring W21 are connected in parallel through the via hole V21 and the via hole V22. In this case, as shown in fig. 5, the two wires W11 and W21 are replaced with one wire W11 closest to the substrate surface F1 among the wires W11 and W21, and the conductive structure information D1 is generated as conductive structure information D1'. At this time, one end of the via V22 becomes open, and therefore, in terms of data, it is also possible to perform processing in which the via V22 does not exist. This simplifies the wiring structure of the substrate B, and facilitates subsequent processing.

Then, when the line W and the planar conductor IP connect the via V or the row of the vias V in parallel, the inspection instruction information generating unit 31 changes the conductive structure information D1 so that the parallel connected via V or the row of the vias V is replaced with one via or one row of vias (step S2 (e)).

Specifically, in the substrate B shown in fig. 3, the via V24 and the via V33 are connected in series to form a column, and the via V25 and the via V34 are connected in series to form a column. The row of the through holes V24 and V33 and the row of the through holes V25 and V34 are connected in parallel by the wiring W12 and the planar conductor IP. The wiring W22 connects the planar conductor IP to the through hole V32 and the through hole V33 in parallel.

In this case, for example, as shown in fig. 5, for the conductive structure information D1', the column of the through hole V24, the through hole V33 and the column of the through hole V25, the through hole V34 are replaced with any one column, for example, the column of the through hole V24, the through hole V33, and the through hole V32 and the through hole V33 are replaced with one through hole V, for example, the through hole V32.

The through hole V41 and the through hole V42 are connected in parallel by the serial connection of the line W41, the line W42, and the line W43, and the planar conductor IP. In this case, for example, as shown in fig. 5, on the conductive structure information D1, the via V41, the via V42 are replaced with one via V, for example, with a via V41. The wiring W44 and the wiring W45 connect the through hole V43, the through hole V44, and the through hole V45 in parallel with the planar conductor IP. In this case, for example, as shown in fig. 5, the via V43, the via V44, and the via V45 are replaced with one via V, for example, with the via V43 for the conductive structure information D1'. This simplifies the wiring structure of the substrate B, and facilitates subsequent processing.

Further, the inspection instruction information generating section 31 does not necessarily need to execute step S1 or step S2, and may execute the subsequent processing with the conductive structure information D1' as the conductive structure information D1 in the form of data representing the actual wiring structure of the substrate B shown in fig. 3.

Then, the inspection instruction information generating section 31 converts the data structure of the conductive structure information D1' into a tree structure (step S3 (m)). The conductive structure information D1' that has been converted into a tree structure is referred to as conductive structure information D1 ". As shown in fig. 6, in the conductive structure information D1 ″, one wire W is expressed by one node N, the planar conductor IP is expressed by the root node NR, and the through hole V is expressed as a branch M connecting the conductive portion P and the node, or a branch M connecting the nodes.

The inspection instruction information generation unit 31 does not necessarily need to execute step S3, and may execute subsequent processing using the conductive structure information D1 and the conductive structure information D1' in the form of data indicating the wiring structure of the substrate B. In the following description, the processing for the node N is the same as the processing for the wiring W corresponding to the node N, the processing for the root node NR is the same as the processing for the planar conductor IP, and the processing for the branch M is the same as the processing for the wiring W corresponding to the node N.

In the example of the conductive structure information D1 ″ of the tree structure shown in fig. 6, the node N11 corresponds to the wiring W11(W21), the node N12 corresponds to the wiring W12, the node N21 corresponds to the wiring W22, the node N41 corresponds to the wiring W41, the wiring W42, the wiring W43, and the node N42 corresponds to the wiring W44, the wiring W45. In addition, branch M11 corresponds to via V11(V21), branch M12 corresponds to via V12 (V12), branch M12 corresponds to via V12 (V12), branch Mr 12 corresponds to via V12, branch Mr 12 corresponds to via V12 (V12), branch Mr 12 corresponds to via V12, branch M12 corresponds to via V12, and branch M12 corresponds to via V12 (V12 ).

Then, the inspection instruction information generating section 31 selects the wiring layer L1 closest to the substrate surface F1 as the first selection layer LL1, and selects the wiring layer L4 closest to the substrate surface F2 as the second selection layer LL2 (step S4 (F) step). The processing of step S4 to step S27 and step S101 to step S501 corresponds to an example of the check instruction information generation processing.

Then, the inspection instruction information generation unit 31 executes the first process (step S5). Referring to fig. 11, the inspection instruction information generation unit 31 groups conductive parts P of the substrate surface F1, which are electrically connected to each other via the node N (wiring W) of the first selection layer LL1, into groups based on the conductive structure information D1 "(step S101, step (a) of step (F)).

Here, since the first selection layer LL1 is the wiring layer L1, in the conductive structure information D1 ″ of the tree structure shown in fig. 6, the conductive portions P1 and P2 which are electrically connected via the node N11 of the first selection layer LL1 are grouped, and the conductive portions P4 and P5 which are electrically connected via the node N12 of the first selection layer LL1 are grouped.

Then, the inspection instruction information generating unit 31 selects two conductive parts from among the conductive parts P included in each group grouped in step S101 as a pair of first selected conductive parts, and records the selected conductive parts as a pair of first selected conductive parts in the inspection instruction information D2 in association with the first selection layer LL1 (step S102 (b)). The first selected conductive part is information indicating a conductive part (inspection site) which can be inspected at the same time.

In the example of fig. 6, the conductive portion P1 and the conductive portion P2 are selected as the first selected conductive portion from the group of the conductive portion P1 and the conductive portion P2 corresponding to the wiring layer L1, and the conductive portion P4 and the conductive portion P5 are selected as the first selected conductive portion from the group of the conductive portion P4 and the conductive portion P5. Hereinafter, the pair of the conductive portion P1 and the conductive portion P2 is expressed as a conductive portion pair P1 and P2.

Then, if there is a group having a conductive part P not selected as the first electrically conductive part among the groups grouped in step S101, the inspection instruction information generating unit 31 selects two conductive parts P including the conductive part P not selected as the first electrically conductive part as a pair of second electrically conductive parts for the group, and records the selected two conductive parts P in the inspection instruction information D2 in association with the first selection layer LL1 (step S103 (b) of step (f)). The second selectively conductive part is information indicating a conductive part (inspection site) to be inspected at a different time from the first selectively conductive part.

In the example of fig. 6, among the group of the conductive part P1, the conductive part P2, and the group of the conductive part P4, the conductive part P5, there is no group having a conductive part P that is not selected as the first-selected conductive part, and therefore the inspection instruction information generation section 31 shifts the process to the next step S104.

Then, the inspection instruction information generating unit 31 groups the conductive parts P of the substrate surface F2, which are electrically connected to each other via the node N (wiring W) of the second selection layer LL2, into groups based on the conductive structure information D1 ″ (step S104, step (a) of step (F)).

Here, since the second selection layer LL2 is the wiring layer L4, in the conductive structure information D1 ″ of the tree structure shown in fig. 6, the conductive portion P11, the conductive portion P12, the conductive portion P13, and the conductive portion P14 which are electrically connected via the node N41 of the second selection layer LL2 are grouped, and the conductive portion P15, the conductive portion P16, and the conductive portion P17 which are electrically connected via the node N42 of the second selection layer LL2 are grouped.

Then, the inspection instruction information generating unit 31 selects two conductive parts from among the conductive parts P included in each group grouped in step S104 as a pair of first selected conductive parts, and records the selected conductive parts in the inspection instruction information D2 in association with the second selection layer LL2 (step S105 (b)).

In the example of fig. 6, as the first selective conductive portion, for example, the conductive portion P11 or the conductive portion P12 is selected from the group of the conductive portion P11, the conductive portion P12, the conductive portion P13 and the conductive portion P14, and as the first selective conductive portion, for example, the conductive portion P15 or the conductive portion P16 is selected from the group of the conductive portion P15, the conductive portion P16 and the conductive portion P17.

Then, when there is a group having a conductive part P not selected as the first electrically conductive part among the groups grouped in step S104, the inspection instruction information generating unit 31 selects two conductive parts P including the conductive part P not selected as the first electrically conductive part as a pair of second electrically conductive parts for the group, and records the selected two conductive parts P in the inspection instruction information D2 in association with the second selection layer LL2 (step S106, step (b) of step (f)), and then ends the first step and shifts the process to step S7 (fig. 7).

In the example of fig. 6, the group of the conductive portion P11, the conductive portion P12, the conductive portion P13, and the conductive portion P14, and the group of the conductive portion P15, the conductive portion P16, and the conductive portion P17 have the conductive portion P13, the conductive portion P14, and the conductive portion P17 which are not selected as the first selective conductive portions. In this case, the inspection instruction information generation section 31 selects the pair of conductive sections P13, P14 and the pair of conductive sections P16, P17 as the second selected conductive section.

Returning to fig. 7, the check instruction information generation unit 31 checks the flag Fip1 as a control flag for control processing (step S7).

When the flag Fip1 is 1 (YES in step S7), it indicates that the flag Fip1 is set to 1 in step S12 described later, and the generation of the inspection instruction information D2 corresponding to each wiring layer L on the substrate surface F1 side of the conductor layer Lc and on the substrate surface F1 side of the conductor layer Lc is completed. Therefore, the check instruction information generation unit 31 does not perform steps S11 to S16, and proceeds to step S17 (fig. 9).

If the flag Fip1 is not 1 (NO in step S7), the check instruction information generation unit 31 proceeds to step S11 (fig. 8) and checks whether or not the conductor layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (step S11).

When the conductor layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (yes in step S11), the inspection instruction information generation unit 31 sets the flag Fip1 to 1 (step S12), and shifts the process to step S301 (fig. 12) in order to select the conductive portion P for inspection of the through hole V connected to the substrate surface F1 side of the planar conductor IP.

On the other hand, if the conductor layer Lc is not adjacent to the side of the first selective layer LL1 away from the substrate surface F1 (no in step S11), the inspection instruction information generating section 31 selects the wiring layer L adjacent to the side of the first selective layer LL1 away from the substrate surface F1 as a new first selective layer LL1 (step S13 (g)). Thus, steps S14 to S16 are executed with the new first selection layer LL1 as a processing target.

For example, in the example shown in fig. 6, the first selection layer LL1 is now the wiring layer L1. The conductor layer Lc is not adjacent to the side of the wiring layer L1 remote from the substrate surface F1 (no in step S11), and the wiring layer L2 adjacent to the side of the wiring layer L1 remote from the substrate surface F1 becomes a new first selection layer LL1 (step S13).

Then, the inspection instruction information generating section 31 selects, for each node N of the first selection layer LL1, a conductive portion P of the substrate surface F1 electrically connected, i.e., electrically connected, on the opposite side to the node N, with respect to one branch M (through hole V) connected to the side of one of the nodes N away from the root node NR, based on the conductive structure information D1 ″. The inspection instruction information generation unit 31 groups the selected conductive parts P for each corresponding node N (step S14 (g 1)).

In the example shown in fig. 6, there is a node N21 in the wiring layer L2 as the first selection layer LL 1. A branch M21 and a branch M22 are connected to the node N21. A conductive portion P3 is provided as a conductive portion P of the substrate surface F1 directly or indirectly conductive to the side opposite to the node N21 of the branch M21. Thus, the conductive portion P3 corresponding to the branch M21 is selected. The conductive portion P of the substrate surface F1 directly or indirectly electrically connected to the side opposite to the node N21 of the branch M22 includes a conductive portion P4 and a conductive portion P5. Any one of the conductive portion P4 and the conductive portion P5, for example, the conductive portion P4 is selected as the conductive portion P corresponding to the branch M22. Thereby, the conductive portions P3 and P4 are grouped in accordance with the node N21.

Then, the inspection instruction information generating unit 31 selects two arbitrary conductive parts from among the conductive parts P included in each group grouped in step S14 as a pair of first selected conductive parts, associates the selected conductive parts with the first selection layer LL1, and records the selected conductive parts in the inspection instruction information D2 (step S15, step (b) of step (g 2)).

In the example shown in fig. 6, two conductive parts P3, P4 are selected as a pair of first selective conductive parts from the conductive parts P3, P4 grouped by step S14.

For example, as in the conductive structure information D1 ″ of the tree structure shown in fig. 16, when the node N11 is not connected to the root node NR but is connected to the node N21 via the branch M23, in step S14, the conductive portion P1 and the conductive portion P2 are included as the conductive portion P of the substrate surface F1 that is directly or indirectly conductive to the opposite side of the branch M23 from the node N21. Any one of the conductive portion P1 and the conductive portion P2, for example, the conductive portion P1 is selected as the conductive portion P corresponding to the branch M23. Conductive portion P1, conductive portion P3, and conductive portion P4, in which conductive portion P1 is added to conductive portion P3 and conductive portion P4, are grouped in correspondence with node N21.

Further, in step S15, two conductive portions, for example, conductive portion P1 and conductive portion P3 are selected from conductive portion P1, conductive portion P3 and conductive portion P4 as a pair of first selected conductive portions.

Then, when there is a group having a conductive part P not selected as the first electrically conductive part among the groups grouped in step S14, the inspection instruction information generation section 31 selects, as a pair of second electrically conductive parts, two conductive parts P including the conductive part P not selected as the first electrically conductive part for the group, records the selected two conductive parts P in the inspection instruction information D2 in association with the first selection layer LL1 (step S16 (b) of the step (g 2)), and then proceeds to step S17 (fig. 9).

On the other hand, when there is no group having a conductive part P not selected as the first electrically conductive part among the groups grouped by step S14, the inspection instruction information generation section 31 proceeds directly to step S17.

Then, the check instruction information generation unit 31 checks the flag Fip2 as a control flag for the control processing (step S17).

When the flag Fip2 is 1 (yes in step S17), it indicates that the flag Fip2 is set to 1 in step S19 described later, and the generation of the inspection instruction information D2 for each wiring layer L on the substrate surface F2 side of the conductor layer Lc and on the substrate surface F2 side of the conductor layer Lc is completed. Therefore, the check instruction information generation unit 31 does not perform steps S18 to S24, and proceeds to step S26 (fig. 10).

When the flag Fip2 is not 1 (no in step S17), the check instruction information generation unit 31 proceeds to step S18, and checks whether or not the conductor layer Lc is adjacent to the second selection layer LL2 on the side away from the substrate surface F2 (step S18).

When the conductor layer Lc is adjacent to the second selection layer LL2 on the side away from the substrate surface F2 (yes in step S18), the inspection instruction information generation unit 31 sets the flag Fip2 to 1 (step S19), and shifts the process to step S401 (fig. 13) in order to select the conductive portion P for inspection of the through hole V connected to the substrate surface F2 side of the planar conductor IP.

For example, in the example shown in fig. 6, if the second selection layer LL2 is the wiring layer L4 at present, the conductor layer Lc is adjacent to the side of the wiring layer L4 away from the substrate surface F2 (yes in step S18), and therefore the flag Fip2 is set to 1 (step S19), and the process proceeds to step S401 (fig. 13).

Referring to fig. 13, in step S401, the inspection instruction information generating unit 31 selects one conductive portion P electrically connected, i.e., electrically connected, to the opposite side of the root node NR (planar conductor IP) for each branch M (through hole V) connected to the substrate surface F2 side of the root node NR (planar conductor IP), thereby grouping the selected conductive portion P as a conductive portion corresponding to the substrate surface F2 side of the root node NR (step S401 (h)).

In the example shown in fig. 6, a branch Mr5 and a branch Mr6 are connected to the substrate surface F2 side of the root node NR. Conductive portion P electrically connected to branch Mr5 includes conductive portion P11, conductive portion P12, conductive portion P13, and conductive portion P14. Conductive portions P electrically connected to branch Mr6 include conductive portion P15, conductive portion P16, and conductive portion P17. Therefore, in step S401, any one of conductive portion P11, conductive portion P12, conductive portion P13, and conductive portion P14, for example, conductive portion P11, and any one of conductive portion P15, conductive portion P16, and conductive portion P17, for example, conductive portion P15, is selected. Thereby, the conductive portions P11 and P15 are grouped.

Then, the inspection instruction information generating unit 31 selects two electrically conductive sections P from among the electrically conductive sections P grouped in step S401 as a pair of first electrically conductive sections, and records the selected electrically conductive sections in the inspection instruction information D2 in association with the substrate surface F2 side of the root node NR (step S402 (h)).

In step S402, two conductive sections P are selected as a pair of first selected conductive sections from the conductive sections P11 and the conductive sections P15 grouped in step S401. In this case, the conductive portions P grouped in step S401 are only two conductive portions P11 and P15, and therefore the two conductive portions P11 and P15 are selected as a pair of first selected conductive portions.

Then, when there is a group having a conductive part P not selected as the first electrically conductive part among the groups grouped in step S401, the inspection instruction information generation section 31 selects, as a pair of second electrically conductive parts, two conductive parts P including the conductive part P not selected as the first electrically conductive part for the group, records the selected two conductive parts P in the inspection instruction information D2 in association with the substrate surface F2 side of the root node NR (step S403), and then shifts the process to step S26 (fig. 10).

Conventionally, since there is no group having a conductive part P that is not selected as the first conductive part among the groups grouped in step S401, the inspection instruction information generation unit 31 directly shifts the process to step S26 (fig. 10).

Further, instead of executing steps S402 and S403, the inspection instruction information generating unit 31 may select a plurality of pairs of electrically conductive sections P so as to include all the electrically conductive sections P selected in step S401, and record the selected electrically conductive sections P in the inspection instruction information D2 as a plurality of pairs of first electrically conductive sections in association with the substrate surface F2 side of the root node NR.

In this case, in the inspection by the inspection processing unit 21 described later, the inspection is performed while supplying the currents to the plurality of pairs of first selective conductive portions corresponding to the substrate surface F2 side of the root node NR. When current is supplied to a plurality of pairs of conductive parts P at the same time, the current paths overlap. However, since the root node NR, that is, the resistance of the planar conductor IP is very small compared to the wiring W, even when the current path is overlapped in the planar conductor IP, the influence on the voltage measurement result is small.

Therefore, by selecting a plurality of pairs of conductive parts P so as to include all the conductive parts P selected in step S401, and recording the selected pairs of first conductive parts P in the inspection instruction information D2 in association with the substrate surface F2 side of the root node NR as a plurality of pairs of first conductive parts, instead of executing step S402 and step S403, it is possible to supply current to a plurality of pairs of first conductive parts P at the same time in the inspection by the inspection processing unit 21 described later, and thus the inspection time can be shortened.

On the other hand, if the conductor layer Lc is not adjacent to the side of the second selective layer LL2 away from the substrate surface F2 (no in step S18), the inspection instruction information generating section 31 selects the wiring layer L adjacent to the side of the second selective layer LL2 away from the substrate surface F2 as a new second selective layer LL2 (step S21 (g)). Thus, steps S22 to S24 are executed with the new second selection layer LL2 as a processing target.

Then, the inspection instruction information generating section 31 selects, for each node N of the second selection layer LL2, a conductive portion P of the substrate surface F2 electrically connected, i.e., electrically connected, on the opposite side to the node N, with respect to one branch M (through hole V) connected to the side of one of the nodes N away from the root node NR, based on the conductive structure information D1 ″. Then, the inspection instruction information generation unit 31 groups the selected conductive parts P for each corresponding node N (step S22 (g 1)).

Then, the inspection instruction information generating unit 31 selects two arbitrary conductive parts from among the conductive parts P included in each group grouped in step S22 as a pair of first selected conductive parts, associates the selected conductive parts with the second selection layer LL2, and records the selected conductive parts in the inspection instruction information D2 (step S23, step (b) of step (g 2)).

Then, when there is a group having a conductive part P not selected as the first electrically conductive part among the groups grouped in step S22, the inspection instruction information generation section 31 selects, as a pair of second electrically conductive parts, two conductive parts P including the conductive part P not selected as the first electrically conductive part for the group, records the selected conductive parts P in the inspection instruction information D2 in association with the second selection layer LL2 (step S24 (b) of the step (g 2)), and then proceeds to step S26 (fig. 10).

On the other hand, when there is no group having a conductive part P not selected as the first electrically conductive part among the groups grouped by step S22, the check instruction information generation section 31 proceeds directly from step S23 to step S26 (fig. 10).

In the example shown in fig. 6, at present, that is, in the process on the substrate surface F2 side corresponding to the wiring layer L2 and the planar conductor IP, there is no group having the conductive part P not selected as the first-selected conductive part, so the inspection instruction information generation section 31 does not perform recording of the inspection instruction information D2 and shifts the process from step S23 to step S26 (fig. 10).

Then, the inspection instruction information generating unit 31 checks whether or not the inspection instruction information D2 on the substrate surface F1 and the substrate surface F2 side corresponding to all the wiring layers L and the planar conductors IP has been generated (step S26).

When the inspection instruction information D2 on the substrate surface F1 and the substrate surface F2 side corresponding to all the wiring layers L and the planar conductors IP has been generated (yes in step S26), the process shifts to step S27. On the other hand, if there remain substrate surfaces F1 and F2 sides of the wiring layer L and the planar conductor IP in which the corresponding inspection instruction information D2 has not been generated (no in step S26), the process proceeds to step S11 (fig. 8).

In step S11, the check instruction information generating unit 31 checks whether or not the conductor layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (step S11). In the example shown in fig. 6, at present, the first selection layer LL1 is a wiring layer L2. Since the conductor layer Lc is adjacent to the wiring layer L2 on the side away from the substrate surface F1 (yes in step S11), the inspection instruction information generation unit 31 sets the flag Fip1 to 1 (step S12), and shifts the process to step S301 (fig. 12).

In step S301, the inspection instruction information generation unit 31 selects one conductive section P that is electrically connected to the opposite side of the root node NR (planar conductor IP) for each branch M (through hole V) connected to the substrate surface F1 side of the root node NR (planar conductor IP), thereby grouping the selected conductive section P as a conductive section corresponding to the substrate surface F1 side of the root node NR (step S301 (h)).

In the example shown in fig. 6, a branch Mr1, a branch Mr2, a branch Mr3, and a branch Mr4 are connected to the substrate surface F1 side of the root node NR. Conductive portions P electrically connected to branch Mr1 include conductive portion P1 and conductive portion P2. Conductive portions P electrically connected to branch Mr2 include conductive portion P3, conductive portion P4, and conductive portion P5. Conductive portion P electrically connected to branch Mr3 is conductive portion P6. Conductive portion P electrically connected to branch Mr4 is conductive portion P7.

Therefore, in step S301, any one of conductive portion P1 and conductive portion P2, for example, conductive portion P1, any one of conductive portion P3, conductive portion P4, and conductive portion P5, for example, conductive portion P3, and further conductive portion P6 and conductive portion P7 are selected. Thereby, the conductive portion P1, the conductive portion P3, the conductive portion P6, and the conductive portion P7 are grouped.

Then, the inspection instruction information generating unit 31 selects two arbitrary electrically conductive sections P from among the electrically conductive sections P grouped in step S301 as a pair of first electrically conductive sections, and records the selected electrically conductive sections as inspection instruction information D2 in association with the substrate surface F1 side of the root node NR (step S302 (h)).

In the example shown in fig. 6, any two conductive parts P, for example, the conductive part P1 and the conductive part P3 are selected as a pair of first selected conductive parts from the conductive part P1, the conductive part P3, the conductive part P6 and the conductive part P7 grouped in step S301.

Then, when there is a group having a conductive part P not selected as the first electrically conductive part among the groups grouped in step S301, the inspection instruction information generation section 31 selects, as a pair of second electrically conductive parts, two conductive parts P including the conductive part P not selected as the first electrically conductive part for the group, records the selected two conductive parts P in the inspection instruction information D2 in association with the substrate surface F1 side of the root node NR (step S303), and then shifts the process to step S17 (fig. 9).

In step S302, among the conductive portions P1, P3, P6, and P7 grouped in step S301, the conductive portion P6 and P7 are not selected as the first selected conductive portion, and therefore the inspection instruction information generation section 31 selects, as a pair of second selected conductive portions, two conductive portions P including the conductive portion P6 and the conductive portion P7 which are not selected as the first selected conductive portion, for a group of the conductive portion P1, P3, P6, and P7 having the conductive portion P which is not selected as the first selected conductive portion, in which case the conductive portion P6 and P7 are selected as a pair of second selected conductive portions (step S303).

In step S303, for example, when the conductive portion included in the group is three conductive portions of the conductive portion P1, the conductive portion P3, and the conductive portion P6, and the conductive portion not selected as the first selective conductive portion is only one conductive portion P6, any one of the conductive portion P6, the conductive portion P1, and the conductive portion P3 is selected as a pair of second selective conductive portions.

In addition, as in the above steps S402 and S403, the inspection instruction information generating unit 31 may select a plurality of pairs of electrically conductive sections P so as to include all the electrically conductive sections P selected in step S301, and may record the selected electrically conductive sections P as a plurality of pairs of first selected electrically conductive sections in the inspection instruction information D2 in association with the substrate surface F1 side of the root node NR, instead of executing the steps S302 and S303. For example, the inspection instruction information generation unit 31 may be configured to record the inspection instruction information D2 by associating the conductive part P1, the conductive part P3, the conductive part P6, and the conductive part P7 with the substrate surface F1 sides of a plurality of pairs of the first selected conductive part and the root node NR, by pairing the conductive part P1, the conductive part P3, the conductive part P6, and the conductive part P7 from among the conductive part P1, the conductive part P3, the conductive part P6, and the conductive part P7 grouped in step S301.

Then, in step S17 (fig. 9), since the current flag Fip2 is 1, the check instruction information generation unit 31 shifts the process to step S26 (fig. 10).

In step S26, the processing of steps S5 to S403 is executed for all the wiring layers L and the planar conductors IP on the substrate surface F1 and substrate surface F2 sides (yes in step S26), and therefore the second step is further executed to prevent omission of inspection sites (step S27).

Referring to fig. 14, the inspection instruction information generation unit 31 searches for a wire W that is not sandwiched between the pair of first electrically conductive parts and the pair of second electrically conductive parts selected in steps S1 to S403 (step S501 (j)).

In the example shown in fig. 6, in steps S1 to S403, the pair of conductive portions P1, P2, the pair of conductive portions P1, P3, the pair of conductive portions P3, P4, the pair of conductive portions P4, P5, the pair of conductive portions P11, P12, the pair of conductive portions P11, P15, the pair of conductive portions P15, P16 are selected as the pair of first selective conductive portions, and the pair of conductive portions P6, P7, the pair of conductive portions P13, P14, the pair of conductive portions P16, P17 are selected as the pair of second selective conductive portions.

Then, on the substrate surface F1 side, the electrically conductive sections P1 to P7 are connected in series as the first electrically conductive section and the second electrically conductive section, and therefore there is no wire W that is not sandwiched between either the pair of the first electrically conductive section and the pair of the second electrically conductive section. On the other hand, on the substrate surface F2 side, the pair of conductive portions P11 and P12 and the pair of conductive portions P13 and P14 are discontinuous.

Fig. 15 is an explanatory diagram for explaining the second step. Fig. 15 is an enlarged view of the vicinity of the conductive portions P11 to P14 in fig. 5.

In the example shown in fig. 6 and 15, in steps S1 to S403, the pair of electrically conductive sections P11 and P12 and the pair of electrically conductive sections P13 and P14 are selected as the pair of the first electrically conductive section and the pair of the second electrically conductive section, but the pair of electrically conductive sections P12 and P13 is not selected. As a result, the wire W42 shown in fig. 15 is not sandwiched between either the pair of first electrically conductive sections or the pair of second electrically conductive sections.

Then, the inspection instruction information generation unit 31 checks whether or not there is a matching wire W (step S503), and if there is a matching wire W (yes in step S503), the process proceeds to step S504. On the other hand, if there is no matching wire W (no in step S503), the inspection instruction information generation unit 31 ends the process. In the example shown in fig. 6, the wiring W42 coincides.

In step S504, the inspection instruction information generating unit 31 records the conductive part P electrically connected to one end of the corresponding wire W without passing through the wire W and the conductive part P electrically connected to the other end of the wire W without passing through the wire W as a pair of third selective conductive parts to be inspected at a timing different from that of the first selective conductive part in the inspection instruction information D2 (step S504 (k)).

In the example shown in fig. 15, for example, a conductive portion P12 that is electrically connected to one end T1 of the line W42 not via the line W42 and a conductive portion P13 that is electrically connected to the other end T2 of the line W42 not via the line W42 are selected as a pair of third selectively conductive portions (step S504).

Then, the inspection instruction information generating unit 31 checks whether or not the substrate B includes a plurality of conductor layers Lc (step S505), and if a plurality of conductor layers Lc are present (yes in step S505), the process proceeds to step S506. On the other hand, if there are no plurality of conductor layers Lc (no in step S505), the inspection instruction information generation unit 31 ends the process.

In step S506, the inspection instruction information generating unit 31 checks whether or not there is a through hole V connecting the planar conductors IP of the plurality of conductor layers Lc (step S506). If the through hole V is present (yes in step S506), the process proceeds to step S507. On the other hand, if the through hole V does not exist (no in step S506), the check instruction information generation unit 31 ends the process.

The substrate B shown in fig. 17 includes two conductor layers Lc, and is provided with a through hole Vc that connects the planar conductors IP of the two conductor layers Lc to each other. In order to check the conduction of through hole Vc, it is necessary to flow a current between conductive portion P of substrate surface F1 and conductive portion P of substrate surface F2.

Therefore, in step S507, the inspection instruction information generation unit 31 records one of the conductive portions P on the substrate surface F1 and one of the conductive portions P on the substrate surface F2 as a pair of fourth selected conductive portions to be inspected at a timing different from that of the first selected conductive portions in the inspection instruction information D2 (step S507, step (l)), and ends the processing.

As a result of recording the pair of fourth selective conductive portions in inspection instruction information D2, substrate inspection apparatus 2 can inspect through-hole Vc by inspection based on inspection instruction information D2.

Among the first electrically conductive option, the second electrically conductive option, the third electrically conductive option, and the fourth electrically conductive option selected in steps S1 to S507, only one pair of electrically conductive options P to be inspected, which is the fourth electrically conductive option selected substrate surface F1 and the electrically conductive option P of substrate surface F2 for inspecting the through hole Vc, is selected from both surfaces of the substrate B.

When a current is caused to flow between the pair of conductive portions P of the substrate B and the voltage is measured to perform an inspection, an external electromagnetic field overlaps with the detection voltage as noise. Since the external electromagnetic field is applied substantially in the same manner on the surface on one side of the substrate B, the noise voltage due to the external electromagnetic field becomes substantially constant on the surface on one side of the substrate B. Therefore, when the voltage between the pair of conductive portions P in the surface on one side of the substrate B is measured, noise superimposed on the measured voltage becomes a common mode (common mode), and as a result, the influence of the noise on the measured voltage is reduced.

On the other hand, a difference occurs in the intensity of the electromagnetic field applied to the front and back of the substrate B between the two surfaces of the substrate B, and a difference occurs in the noise voltage due to the external electromagnetic field between the one surface and the other surface of the substrate B. Therefore, when the voltage between the pair of conductive portions P is measured across both surfaces of the substrate B, the noise superimposed on the measured voltage becomes a normal mode (normal mode), and as a result, the noise voltage is directly superimposed on the measured voltage. As a result, the influence of noise when measuring the voltage between the pair of conductive portions P across both surfaces of the substrate B becomes larger than when measuring the voltage between the pair of conductive portions P within one surface of the substrate B.

According to steps S1 to S507, the conductive portion P extending between both surfaces of the substrate B is set as the minimum fourth electrically-conductive-selected portion necessary for the inspection of the through-hole Vc, and in addition, the conductive portions P in the surface on one side of the substrate B are set as the pair of the first electrically-conductive-selected portion, the pair of the second electrically-conductive-selected portion, and the pair of the third electrically-conductive-selected portion, so that the influence of noise in the case of the inspection based on the inspection instruction information D2 is reduced.

When inspecting the through-hole between both surfaces of the substrate B, it is necessary to bring the probe Pr of the measuring jig 4U into contact with the conductive part P of the substrate surface F1 of the substrate B and to bring the probe Pr of the measuring jig 4L into contact with the conductive part P of the substrate surface F2 of the substrate B. At this time, when a contact failure occurs in either one of the probe Pr of the measurement jig 4U and the probe Pr of the measurement jig 4L, it is not possible to specify which probe Pr has a contact failure.

Therefore, the probes Pr of the two measurement jigs are once separated from the substrate B, and then the probes Pr of the two measurement jigs are again brought into contact with the substrate B to perform a re-inspection. This re-inspection must be repeated a plurality of times before the probes Pr of both measuring jigs contacting both surfaces of the substrate B normally contact the conductive part P. When the separation and contact of the probe Pr with respect to the conductive portion P are repeated in this manner, the inspection time is prolonged, and the conductive portion P is easily damaged.

According to steps S1 to S507, since the inspection of the conductive portions P extending between both surfaces of the substrate B is minimized and most of the conductive portions P provided on one surface of the substrate B are inspected, re-inspection due to contact failure is reduced and damage to the conductive portions P is easily reduced.

As described above, the inspection instruction information generation device 3 can generate the inspection instruction information D2 by the processing of step S1 to step S507. In addition, in step S1 to step S507, the order of the conductive part pairs to be subjected to inspection by the substrate inspection apparatus 2 corresponds to the order of the inspection instruction information D2 for each corresponding substrate surface. Specifically, inspection instruction information D2 is recorded in order from the layer corresponding to the layer close to substrate surface F1 and substrate surface F2.

Through the processing of step S15, step S16, step S23, step S24, step S102, step S103, step S105, step S106, step S302, step S303, step S402, step S403, step S504, and step S507 performed by the inspection instruction information generating unit 31, the inspection instruction information D2 shown in fig. 18 is generated by associating each conductive part pair to be inspected with the types of the substrate surface, the layer, and the first selected conductive part, the second selected conductive part, the third selected conductive part, and the fourth selected conductive part. Here, "layer" means each layer of the wiring layer L and the conductor layer Lc.

In fig. 18, the substrate surface F1 is associated with five conductive part pairs, and the order in which inspection is to be performed is shown in top-down order. Similarly, the substrate surface F2 is associated with six conductive part pairs, and the order in which inspection is to be performed is shown in top-down order.

The inspection instruction information D2 obtained as described above is transmitted to the board inspection apparatus 2 via a communication circuit, not shown, for example, or the inspection instruction information D2 is stored in a storage medium such as a USB memory, and the board inspection apparatus 2 reads the storage medium, thereby storing the inspection instruction information D2 in the storage unit 22.

Next, the operation of the substrate inspection apparatus 2 will be described. Hereinafter, a case will be described as an example in which the storage unit 22 stores the inspection instruction information D2 shown in fig. 18.

Referring to fig. 19, the inspection processing unit 21 selects, as an inspection layer LT1, the layer that is the first layer among the layers on the substrate surface F1 side based on the inspection instruction information D2 (step S51). In the example shown in fig. 18, the layer that establishes the first layer in the order corresponding to the substrate face F1 (uppermost) is the wiring layer L1, and thus the wiring layer L1 is taken as the inspection layer LT 1.

Then, the inspection processing unit 21 selects, as the inspection layer LT2, the layer that is the first in order among the layers on the substrate surface F2 side based on the inspection instruction information D2 (step S52). In the example shown in fig. 18, the layer that establishes the first layer in the order corresponding to the substrate face F2 (uppermost) is the wiring layer L4, and thus the wiring layer L4 is taken as the inspection layer LT 2.

Then, the inspection processing unit 21 performs a first current supply process of simultaneously supplying a measurement current to the pair of conductive portions of the first selected conductive portion of the inspection layer LT1 and the inspection layer LT2 (step S53 (c 1)). In the example shown in fig. 18, since the inspection layer LT1 is the wiring layer L1 and the inspection layer LT2 is the wiring layer L4, the inspection processing unit 21 simultaneously flows the measurement current to the pair of conductive portions P1 and P2, the pair of conductive portions P4 and P5, the pair of conductive portions P11 and P12, and the pair of conductive portions P15 and P16, which are the first selective conductive portions of the wiring layer L1 and the wiring layer L4.

Then, the inspection processing unit 21 detects the voltage between the pair of conductive portions of the first selected conductive portion of the inspection layer LT1 and the inspection layer LT2, and inspects the through hole V and the wiring W of the current path between the conductive portions based on the voltage and the measurement current (step S54 (c 1)).

In the example of fig. 18, the inspection processing unit 21 causes currents to flow into each of the pairs of conductive portions P1 and P2, the pairs of conductive portions P4 and P5, the pairs of conductive portions P11 and P12, and the pairs of conductive portions P15 and P16, and detects a voltage between each pair. The inspection processing unit 21 divides the voltage between the pairs by the current flowing between the pairs, for example, to calculate the resistance value between the pairs. The inspection processing unit 21 compares the calculated resistance values with reference values stored in the storage unit 22 in advance, for example, and determines that the substrate B is good if the resistance values are equal to or less than the reference values, and determines that the substrate B is defective if the resistance values exceed the reference values.

In step S54, the examination processing unit 21 reports the determination result to the user by displaying the result on a reporting unit such as a display device, not shown, for example. Further, the inspection processing unit 21 does not need to report the determination result to the user.

In step S54, a via hole V corresponding to branch M11, branch M12, branch M13, branch M14, branch M41, branch M42, branch M45, branch M46, which become current paths between each pair of the conductive portion pair P1, P2, the conductive portion pair P4, P5, the conductive portion pair P11, P12, and the conductive portion pair P15, P16, and a wiring W corresponding to node N11, node N12, node N41, node N42 are checked.

In step S53, current can be simultaneously flowed into each pair of the pair of conductive portions P1, P2, the pair of conductive portions P4, P5, the pair of conductive portions P11, P12, and the pair of conductive portions P15, P16, which have been selected as the first selective conductive portions, and the voltage between each pair can be measured, so that the inspection time of the substrate can be easily shortened.

Further, if a current is caused to flow simultaneously between a plurality of pairs of conductive portions P that are electrically connected through the same node N (wiring W), there is a possibility that a wiring W through which a measurement current repeatedly flows is generated. In this case, the voltage generated by the repetition of the current may be a measurement error, and thus the inspection accuracy may be lowered.

On the other hand, in the inspection instruction information D2, the conductive portion pair P of the first selective conductive portion is selected so that no current overlap occurs even if the measurement current flows simultaneously in each layer. Therefore, in steps S51 to 54, the conductive part pair P into which the measurement current flows simultaneously is determined based on the inspection instruction information D2, whereby the inspection accuracy can be reduced and the inspection time of the substrate can be shortened.

Then, when the substrate B is determined to be defective in step S54 (yes in step S55), the inspection processing unit 21 terminates the process without executing the subsequent processes. On the other hand, if the substrate B is not determined to be defective in step S54 (no in step S55), the inspection processing unit 21 shifts the process to step S61 (fig. 20).

In step S61, the inspection processing unit 21 performs a second current supply process for causing a measurement current to flow between the conductive parts of the pair of inspection layers LT1 and LT2, which are conductive part pairs of the second selected conductive part, at a time different from the first current supply process (step S61 (c 2)).

Then, the inspection processing unit 21 detects the voltage between the pair of conductive portions of the second electrically conductive option of the inspection layer LT1 and the inspection layer LT2, and inspects the through hole V and the wire W of the current path between the pair of second electrically conductive option based on the voltage and the measurement current (step S62 (c 2)). The inspection processing unit 21 performs the inspection and the report of the determination result thereof by the same method as in the case of step S54.

The supply and check of the measurement current in steps S61 and S62 are performed at a timing different from that in step S53, that is, at a timing when the measurement current in step S53 does not flow.

In steps S61 and S62, the inspection of the second electrically conductive option is performed at a time different from the inspection of the first electrically conductive option, thereby preventing the measurement current from being repeated. The processes of steps S61 and S62 may be performed simultaneously for the pair of conductive portions of the second electrically conductive option of the inspection layer LT1 and the pair of conductive portions of the second electrically conductive option of the inspection layer LT 2.

In the example of fig. 18, currently, inspection layer LT1 is wiring layer L1, and inspection layer LT2 is wiring layer L4, and therefore there is no conductive part pair of the second electrically conductive selective part of inspection layer LT1 (wiring layer L1), and therefore the second current supply process for the conductive part pair of the second electrically conductive selective part of inspection layer LT1 (wiring layer L1) is not performed. The inspection processing section 21 performs steps S61, S62 for the pair of conductive portions P13, P14, and the pair of conductive portions P16, P17, which are the second selective conductive portions of the wiring layer L1, the wiring layer L4, in a different manner from steps S53, S54.

Then, when the substrate B is determined to be defective in the inspection in step S62 (yes in step S63), the inspection processing unit 21 ends the process without executing the subsequent processes. On the other hand, if the substrate B is not determined to be defective in the inspection in step S62 (no in step S63), the inspection processing unit 21 shifts the process to step S64.

In step S64, the inspection processing unit 21 checks whether or not both the inspection layer LT1 and the inspection layer LT2 are the conductor layer Lc, and whether or not one is the conductor layer Lc and the other is not (step S64). When the inspection layer LT1 and the inspection layer LT2 do not match either the case where both the inspection layer LT1 and the inspection layer LT2 are the conductor layer Lc or the case where one is the conductor layer Lc and none is present (no in step S64), the inspection processing unit 21 proceeds to step S65, and when the inspection layer LT1 and the inspection layer LT2 are both the conductor layer Lc or the case where one is the conductor layer Lc and none is present (yes in step S64), the inspection processing unit 21 proceeds to step S71 (fig. 21). At present, since neither the check layer LT1 nor the check layer LT2 is the conductor layer Lc (no in step S64), the process proceeds to step S65.

In step S65, if the inspection layer LT1 is not the conductor layer Lc, the inspection processing unit 21 sets the next layer of the layers on the substrate surface F1 side as the inspection layer LT1 based on the inspection instruction information D2 (step S65). When the current inspection layer LT1 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT 1. Then, if the inspection layer LT2 is not the conductor layer Lc, the inspection processing unit 21 sets the next layer of the layers on the substrate surface F2 side as the inspection layer LT2 based on the inspection instruction information D2 (step S66), and proceeds to step S53 (fig. 19). When the current inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT 2.

Since the inspection layer LT1 is the wiring layer L1 and the inspection layer LT2 is the wiring layer L4, the inspection processing unit 21 sets the new inspection layer LT1 as the wiring layer L2 and the new inspection layer LT2 as the conductor layer Lc, and the process proceeds to step S53 (fig. 19).

In step S53, the inspection processing unit 21 simultaneously flows a measurement current into the pair of conductive portions P3 and P4 as the first selected conductive portion of the wiring layer L2 and the pair of conductive portions P11 and P15 as the first selected conductive portion of the conductor layer Lc on the substrate surface F2, detects a voltage between the pair of conductive portions P3 and P4 and a voltage between the pair of conductive portions P11 and P15, and inspects the via hole V and the wiring W of the current path between the conductive portions based on the detected voltages and the measurement current (step S53, step S54 (c 1)).

If no in step S55, the check processing unit 21 proceeds to step S61. According to the inspection instruction information D2 shown in fig. 18, there is no second selectively conductive part corresponding to the conductor layer Lc of the wiring layer L2 and the substrate surface F2, and therefore the process proceeds to step S64 without performing step S61 to step S63.

In step S64, since it does not match the case where both the inspection layer LT1 and the inspection layer LT2 are the conductor layer Lc or the case where one is the conductor layer Lc and the other is no inspection layer, the process proceeds to step S65, and the inspection processing unit 21 sets the conductor layer Lc, which is a layer next to the wiring layer L2 on the substrate surface F1 side of the inspection instruction information D2, as the inspection layer LT1 (step S65). In step S66, since the inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 proceeds to step S53 again without setting a new inspection layer LT 2.

In step S53, the inspection processing unit 21 flows a measurement current into the pair of conductive portions P1 and P3, which are the first selected conductive portion of the conductive layer Lc on the substrate surface F1 side, detects a voltage between the pair of conductive portions P1 and P3, and inspects the via hole V and the wire W of the current path between the conductive portions on the basis of the voltage and the measurement current (step S53, step S54, (c 1)).

If no in step S55, the check processing unit 21 proceeds to step S61. According to the inspection instruction information D2 shown in fig. 18, the second electrically conductive selected portion of the conductor layer Lc on the substrate surface F1 side is the pair of electrically conductive portions P6, P7. Therefore, the inspection processing unit 21 executes steps S61 and S62 on the pair of conductive parts P6 and P7.

If no in step S63, the check processing unit 21 proceeds to step S64. At present, the check layer LT1 is set as the conductor layer Lc in the step S65, and the check layer LT2 is set as none in the step S66 (yes in the step S64), so the process proceeds to a step S71 (fig. 21).

In step S71, the inspection processing unit 21 performs a third current supply process for causing a measurement current to flow between the paired conductive parts, on the conductive part pair of the third selective conductive part, at a time different from the first current supply process and the second current supply process (step S71).

Then, the inspection processing unit 21 detects the voltage between the pair of conductive portions of the third selected conductive portion, and inspects the through hole V and the wire W of the current path between the conductive portions based on the voltage and the measurement current (step S72). The inspection processing unit 21 performs the inspection and the report of the determination result thereof by the same method as in the case of step S54.

In the example of fig. 18, there is no third electrically conductive option corresponding to the substrate surface F1, and the third electrically conductive option corresponding to the substrate surface F2 is the pair of electrically conductive options P12 and P13. Therefore, the inspection processing unit 21 performs a third current supply process of causing a measurement current to flow between the conductive portions of the conductive portion pairs P12 and P13, separately from the first current supply process and the second current supply process (step S71), detects a voltage between the conductive portions of the conductive portion pairs P12 and P13, and inspects the through hole V and the wire W of the current path between the conductive portions, based on the voltage and the measurement current (step S72).

In the example of fig. 18, the wiring W42 of the current path between the pair of conductive portions P12 and P13 shown in fig. 15 is examined. Thus, the inspection omission of the wiring W can be reduced, and the inspection accuracy of the substrate B can be improved.

Then, the inspection processing unit 21 performs a fourth current supply process of causing a measurement current to flow between the paired conductive portions, on the conductive portion pair of the fourth selective conductive portion, at a time different from the first to third current supply processes (step S73).

Then, the inspection processing unit 21 detects the voltage between the pair of conductive portions of the fourth selected conductive portion, inspects the through hole V and the wire W of the current path between the conductive portions based on the voltage and the measurement current (step S74), and ends the processing. The inspection processing unit 21 performs the inspection and the report of the determination result thereof by the same method as in the case of step S54.

In the example of fig. 18, since the fourth electrically conductive option is not present, the inspection processing unit 21 does not perform step S73 or step S74 and ends the processing.

According to steps S73, S74, for example, the through-hole Vc of the substrate B including two conductor layers Lc and provided with the through-hole Vc connecting the planar conductors IP of the two conductor layers Lc to each other as shown in fig. 17 can be inspected.

Further, the inspection instruction information generating apparatus 3 sorts the inspection instruction information D2 for each substrate surface in order from the layer corresponding to the layer close to the substrate surface F1 and the substrate surface F2. As a result, the substrate inspection apparatus 2 can sequentially inspect the wiring layer L from the substrate surface F1 and the substrate surface F2 by defining the inspection procedure in step S51, step S52, step S65, and step S66.

In general, the number of wires W provided in the wiring layer L tends to increase as the substrate B approaches the substrate surfaces F1 and F2. The larger the number of wires W provided in the wiring layer L, the more the number of conductive part pairs corresponding to the first selective conductive part of one layer increases. The greater the number of conductive part pairs of the first selected conductive part, the greater the number of conductive part pairs that can be simultaneously inspected in step S53.

Therefore, by setting the wiring layer L as the inspection target in order from the substrate surface F1 and the substrate surface F2, the number of simultaneous inspections at the early stage of the inspection can be increased. If the number of simultaneous inspections at the initial stage of the inspection can be increased, the defect of the substrate B can be detected at the early stage of the inspection. Therefore, when the inspection is ended when a defect is detected as in steps S55 and S63, the wiring layer L is set as the inspection target in order from the point of proximity to the substrate surface F1 and the substrate surface F2, whereby the time until a defect is detected can be shortened, and the possibility that the inspection time can be shortened is increased.

Further, although the inspection instruction information generation device 3 and the substrate inspection device 2 are configured as separate devices, the inspection instruction information generation device 3 and the substrate inspection device 2 may be configured as a single device. For example, the following configuration is also possible: the substrate inspection apparatus 2 includes an inspection instruction information generation unit 31 and a storage unit 32, and thus the substrate inspection apparatus 2 also serves as an inspection instruction information generation device. In this case, the substrate inspection system is configured by one substrate inspection apparatus which also serves as the inspection instruction information generating apparatus.

The inspection instruction information generation device 3 and the inspection instruction information generation method do not necessarily need to execute all the flows shown in fig. 7 to 14, and the inspection processing unit 21 does not necessarily need to execute all the flows shown in fig. 19 to 21.

Even when, for example, only step S101 or step S102 is executed, the inspection instruction information generation device 3 and the inspection instruction information generation method can generate the following inspection instruction information D2: the inspection time of the wiring W of the wiring layer L1 adjacent to the substrate surface F1 and the through hole V connecting the wiring layer L1 adjacent to the substrate surface F1 and the conductive portion P can be easily shortened. In this case, the inspection processing unit 21 may execute step S53 and step S54.

Further, the example in which the wiring layer L and the conductive portion P are provided on both surfaces of the conductor layer Lc is shown, but the wiring layer L and the conductive portion P may be provided only on one surface of the conductor layer Lc. For example, substrate B may not include substrate B4, substrate B5. In this case, it is not necessary to execute the processing related to the selection layer LL2, for example, steps S18 to S24, steps S104 to S106, steps S401 to S403, step S52, step S66, and the like.

The inspection processing unit 21 may be configured as follows: even if a failure is detected during the inspection without executing steps S55 and S63, the inspection is continued. The inspection instruction information generation device 3 and the inspection instruction information generation method are not necessarily limited to the example in which the inspection instruction information D2 records the pair of conductive parts in order from the layer corresponding to the layer close to the substrate surface F1 and the substrate surface F2 in step S4, step S13, and step S21. The inspection instruction information generation device 3 and the inspection instruction information generation method may record the conductive part pairs in the inspection instruction information D2 in an arbitrary order.

That is, an example of the inspection instruction information generating apparatus of the present invention includes: a storage unit that stores conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate including: a conductor layer which is a layer provided with the planar conductor having conductivity spreading in a planar or mesh shape, a substrate surface provided with a plurality of the conductive portions, a wiring layer which is a layer laminated between the conductor layer and the substrate surface, through holes which connect wirings of the wiring layer with the plurality of conductive portions, and through holes which connect wirings of the wiring layer with the planar conductor of the conductor layer; and an inspection instruction information generation section that, when there is a plurality of groups of the conductive sections that are electrically connected to each other via the wiring of the wiring layer, executes, based on the conductive structure information, an inspection instruction information generation process of: a pair of the conductive parts is selected from each of the groups as a first electrically conductive part, and information indicating the selected pairs of first electrically conductive parts is recorded as inspection instruction information.

An inspection instruction information generating method according to an example of the present invention includes an inspection instruction information generating step of generating inspection instruction information based on conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are conductively connected, the substrate including: a conductor layer which is a layer provided with the planar conductor having conductivity spreading in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer which is a layer laminated between the conductor layer and the substrate surface, through holes which connect wirings of the wiring layer with the plurality of conductive parts, and through holes which connect wirings of the wiring layer with the planar conductor of the conductor layer, wherein when there are a plurality of groups of the conductive parts which are mutually conductive via the wirings of the wiring layer, the following inspection instruction information generation processing is executed: selecting one pair of the conductive parts from each of the groups as a first conductive part for selection, and generating information representing the selected pairs of first conductive parts for selection as inspection instruction information.

An inspection instruction information generating program according to an example of the present invention causes a computer to generate, based on conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a through hole of a substrate are to be electrically connected, the substrate including: a conductor layer which is a layer provided with the planar conductor having conductivity spreading in a planar or mesh shape, a substrate surface provided with a plurality of the conductive parts, a wiring layer which is a layer laminated between the conductor layer and the substrate surface, through holes which connect wirings of the wiring layer with the plurality of conductive parts, and through holes which connect wirings of the wiring layer with the planar conductor of the conductor layer, wherein when there are a plurality of groups of the conductive parts which are mutually conductive via the wirings of the wiring layer, the following inspection instruction information generation processing is executed: selecting one pair of the conductive parts from each of the groups as a first conductive part for selection, and generating information representing the selected pairs of first conductive parts for selection as inspection instruction information.

When there are a plurality of groups of conductive portions that are electrically connected to each other via wiring in the wiring layer, even if a current is caused to flow between the conductive portions of a certain group, the current does not flow into the other group. Therefore, according to the above configuration, when there are a plurality of groups of conductive portions that are electrically connected to each other via the wiring of the wiring layer, a pair of conductive portions is selected as a first selected conductive portion from each of the groups in accordance with the conductive structure information by the inspection instruction information generation processing, and information indicating the selected plurality of pairs of first selected conductive portions is recorded as the inspection instruction information. Then, a pair of first selective conductive sections is selected from one group, and thus the plurality of pairs of first selective conductive sections belong to different groups, respectively. Therefore, even if the currents flow simultaneously to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, the currents do not overlap. Therefore, by setting the plurality of pairs of first selective conductive sections based on the inspection instruction information obtained in the above manner as the inspection sites, it is possible to simultaneously perform the inspection of a plurality of sites, and as a result, it is easy to shorten the inspection time of the substrate.

Preferably, the inspection instruction information generation process includes the steps of: (a) grouping the conductive parts electrically connected to each other via the wiring of the wiring layer based on the conductive structure information; and (b) selecting two conductive parts from among the conductive parts included in each group as the pair of first selective conductive parts for the plurality of grouped groups, and recording the selected pairs of first selective conductive parts as inspection parts which can be inspected simultaneously in the inspection instruction information.

According to the above configuration, in (a), the conductive portions that are electrically connected to each other via the wiring of the wiring layer are grouped, that is, the conductive portions that may overlap each other in current paths when current is caused to flow into the plurality of conductive portion pairs are grouped. In addition, in (b), for a plurality of groups grouped, that is, for a plurality of groups in which a current does not overlap with a current path of another group even when a current is caused to flow between pairs of conductive sections in a group, two conductive sections are selected as a pair of first selected conductive sections from among conductive sections included in each group, and the plurality of selected pairs of first selected conductive sections are recorded in the inspection instruction information as inspection portions capable of being inspected at the same time. Then, a pair of first selective conductive sections is selected from one group, and thus the plurality of pairs of first selective conductive sections belong to different groups, respectively. Therefore, even if the currents flow simultaneously to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, the currents do not overlap. Therefore, by setting the plurality of pairs of first selective conductive sections based on the inspection instruction information obtained in the above manner as the inspection sites, it is possible to simultaneously perform the inspection of a plurality of sites, and as a result, it is easy to shorten the inspection time of the substrate.

Preferably, in the step (b), when there is a group having a conductive portion that is not selected as the first selectively conductive portion, the inspection instruction information is recorded in a pair of second selectively conductive portions, which are to be inspected at different times from the plurality of pairs of first selectively conductive portions, with respect to the group, the two conductive portions including the conductive portion that is not selected as the first selectively conductive portion.

According to the above configuration, it is possible to reduce the possibility that the conductive portion not selected as the first selective conductive portion is omitted from the inspection portion.

Preferably, the substrate includes a plurality of wiring layers, and further includes a plurality of through holes for connecting the plurality of wiring layers, and the inspection instruction information generation unit further performs the steps of: (d) in the case where the wirings of the plurality of wiring layers are connected in parallel, the electrical conduction structure information is changed so that the plurality of wirings connected in parallel are replaced with one of the wirings closest to the substrate surface before the step (a), and the inspection instruction information generation processing is executed based on the electrical conduction structure information changed in the step (d).

According to the structure, the conductive structure information is simplified, and therefore the inspection instruction information generation process is performed according to the simplified conductive structure information. As a result, the execution of the check instruction information generation process becomes easy.

Preferably, the inspection instruction information generating unit further performs the steps of: (e) in the case where the through holes or the row of through holes are connected in parallel by the wiring and the planar conductor, before the step (a), the conductive structure information changed in the step (d) is changed so that the through holes or the row of through holes connected in parallel is replaced with one through hole or one row of through holes, and the inspection instruction information generation process is executed based on the conductive structure information changed in the step (e).

According to the structure, the conductive structure information is simplified, and therefore the inspection instruction information generation process is performed according to the simplified conductive structure information. As a result, the execution of the check instruction information generation process becomes easy.

Preferably, the substrate includes a plurality of wiring layers, and further includes a plurality of through holes for connecting the plurality of wiring layers, the inspection instruction information generating unit (f) executes the steps (a) and (b) with a wiring layer closest to the substrate surface among the plurality of wiring layers as a processing target, (g) sets the other wiring layers as processing targets for the wiring layers other than the wiring layer closest to the substrate surface, and (g1) groups the selected conductive parts by selecting one of the conductive parts electrically connected to the side opposite to the wiring of the one through hole for each of the wirings connected to the side of the one wiring away from the conductive layer, for each of the corresponding wirings, (g2) the step (b) is performed for the group grouped in the step (g1), and the step (b) records the first selective conductive sections of each pair in the inspection instruction information in association with the wiring layer to be processed.

According to the above configuration, the inspection instruction information can be recorded in the pair of conductive portions serving as inspection sites for inspecting the substrate including the plurality of wiring layers and the plurality of through holes connecting the plurality of wiring layers.

In the step (b), it is preferable that the inspection instruction information is recorded in the step (f) and the step (g) after the plurality of pairs of first selective conductive sections are sorted for each wiring layer in order from the point of selecting the wiring layer close to the substrate surface as the processing target.

In general, the closer the substrate surface is to the substrate surface, the greater the number of wires provided in the wiring layer tends to be. The larger the number of wires provided in the wiring layer, the more the number of pairs of first selective conductive parts in the wiring layer to be processed, that is, the more the pairs of conductive parts into which the measurement current can be simultaneously introduced at the time of inspection. Therefore, when a plurality of pairs of first selective conductive sections are sequentially sorted for each wiring layer from the time when the wiring layer close to the substrate surface is selected as the processing target, and then recorded in the inspection instruction information, the wiring layer to be inspected can be selected in the order sorted by the inspection instruction information, and the measurement current can be flowed into the pair of first selective conductive sections corresponding to the wiring layer to perform the inspection. By performing the inspection in this manner, the number of simultaneous inspections at an early stage of the inspection can be increased. If the number of simultaneous inspections at the initial stage of the inspection can be increased, the defect of the substrate can be detected at the early stage of the inspection.

Preferably, (h) the inspection instruction information includes inspection instruction information indicating inspection instruction information for inspecting the surface of the planar conductor, and the inspection instruction information includes inspection instruction information indicating inspection instruction information for inspecting the surface of the planar conductor.

According to the above configuration, the through hole connected to the planar conductor can be inspected.

Preferably, the inspection instruction information generation process further includes the steps of: (j) searching for the wire that is sandwiched by the pair of first selectively conductive parts and is not sandwiched by the pair of second selectively conductive parts; and (k) recording, in the inspection instruction information, a conductive portion that is electrically connected to one end of the searched wire without passing through the wire and a conductive portion that is electrically connected to the other end of the wire without passing through the wire as a pair of third selective conductive portions to be inspected at a time different from that of the plurality of pairs of first selective conductive portions.

According to the above configuration, it is possible to reduce the possibility of occurrence of recording omission to the inspection target portion of the inspection instruction information.

Preferably, the substrate surface and the wiring layer are provided on both sides of the conductor layer, respectively, and the inspection instruction information generation unit executes the inspection instruction information generation process on both sides of the conductor layer.

According to the above configuration, inspection instruction information corresponding to the substrate having the substrate surface and the wiring layer provided on both sides of the conductor layer can be generated.

Preferably, the substrate includes a plurality of conductor layers and through holes for connecting the planar conductors of the plurality of conductor layers to each other, and the inspection instruction information generation process further includes: (l) One of the conductive portions on one of the two substrate surfaces and one of the conductive portions on the other substrate surface are recorded in the inspection instruction information as a pair of fourth selective conductive portions to be inspected at a time different from that of the plurality of pairs of first selective conductive portions.

According to the above configuration, the inspection instruction information may be recorded in a pair of fourth selective conductive portions for inspecting through holes connecting planar conductors of the plurality of conductor layers, with respect to the substrate including the plurality of conductor layers and the through holes connecting planar conductors of the plurality of conductor layers.

Preferably, the inspection instruction information generating unit further performs the steps of: (m) converting the conductive structure information into a data structure of a tree structure by making the through hole correspond to a node, making the wiring correspond to a branch, and making the planar conductor correspond to a root node, and executing the inspection instruction information generation processing based on the conductive structure information converted into the tree structure by the step (m).

According to the structure, the conductive structure information is simplified, and therefore the inspection instruction information generation process is performed according to the simplified conductive structure information. As a result, the execution of the check instruction information generation process becomes easy.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit executes: (c1) a first current supply process for causing a current to flow between the paired first selective conductive sections is simultaneously performed for the plurality of pairs of first selective conductive sections indicated by the inspection instruction information, a voltage between the paired first selective conductive sections is detected, and the through holes and the wirings of the current paths between the first selective conductive sections of each pair are inspected based on the current and the voltage.

According to the above configuration, by simultaneously performing the first current supply process on a plurality of pairs of first selective conductive sections based on the inspection instruction information, it is possible to simultaneously perform the inspection on a plurality of portions while avoiding the repetition of the measurement current, and as a result, it is easy to shorten the inspection time of the substrate.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit executes: (c1) simultaneously performing a first current supply process for causing a current to flow between the paired first selective conductive portions with respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, detecting a voltage between the paired first selective conductive portions, and inspecting via holes and wirings of current paths between the first selective conductive portions of each of the pairs based on the current and the voltage; and (c2) performing a second current supply process of causing a current to flow between the pair of second selectively conductive parts indicated by the inspection instruction information, at a time different from the first current supply process, and detecting a voltage between the pair of second selectively conductive parts, and inspecting a via and a wiring of a current path between the pair of second selectively conductive parts based on the current and the voltage.

According to the above configuration, inspection of a through hole or a wiring on a current path connected to a conductive portion not selected as the first selective conductive portion can be performed.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit performs the following steps for the wiring layers in an order indicated by the inspection instruction information: (c1) and (c) simultaneously performing a first current supply process for causing a current to flow between the paired first selective conductive portions with respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, detecting a voltage between the paired first selective conductive portions, and inspecting a via hole and a wiring of a current path between the paired first selective conductive portions based on the current and the voltage, wherein the step (c1) is not performed with respect to the wiring layer in the next or subsequent order when a result of the inspection in the step (c1) is defective.

According to the above configuration, the inspection is performed with the wiring layers as the processing targets in order from the side close to the substrate surface, whereby the defect of the substrate can be detected at an early stage of the inspection. When the inspection result is defective, the inspection of the wiring layer in the next and subsequent order is not performed. As a result, the defect is detected quickly, and the inspection is ended at the time point when the defect is detected, so that the inspection time is easily shortened.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, wherein the inspection processing unit executes: (c1) a first current supply process of causing a current to flow between the paired first selective conductive portions is simultaneously performed for the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a voltage between the paired first selective conductive portions is detected, via holes and wirings of current paths between the first selective conductive portions of each pair are inspected based on the current and the voltage, and in the step (c1), the first current supply process for the plurality of pairs of first selective conductive portions corresponding to one side of the conductor layer by the inspection instruction information and the first current supply process for the plurality of pairs of first selective conductive portions corresponding to the other side of the conductor layer are simultaneously performed.

According to the above configuration, when inspecting the substrate provided with the substrate face and the wiring layer on both sides of the conductor layer, respectively, the inspection for one side of the conductor layer and the inspection for the other side can be performed simultaneously, and therefore, the inspection time can be easily shortened.

That is, the inspection instruction information generating device, the inspection instruction information generating method, and the inspection instruction information generating program having the above-described configuration can generate the following inspection instruction information: an inspection site where the inspection time of a substrate can be easily shortened is shown. In addition, the substrate inspection system with the structure can easily shorten the inspection time of the substrate.

The present application is based on japanese patent application laid-open at 9/14/2018, and the contents of japanese patent application No. 2018-172302 are included in the present application. In addition, the specific embodiments or examples presented in the description section will make the technical content of the present invention clear throughout, and the present invention should not be construed narrowly limited to such specific examples.

Description of the symbols

1: substrate inspection system

2: substrate inspection device

3: inspection instruction information generating apparatus

4U, 4L: measuring clamp

12: measuring block

13: scanner unit

20: control unit

21: inspection processing unit

22: storage unit

31: inspection instruction information generating unit

32: storage unit

110: substrate fixing device

112: frame body

121. 122: measuring part

125: moving mechanism

B. B1-B5: substrate

BS, BS 1: substrate surface

BS 2: contact surface

CS, CM: power supply unit

D1, D1', D1 ": conductive structure information

D2: checking indication information

F1, F2: substrate surface

Fip1, Fip 2: flag sign

I、I₁、I₂: electric current

IP, IPA, IPd: planar conductor

L, L1, L2, L4: wiring layer

Lc: conductive layer

LL 1: first selection layer

LL 2: second selection layer

LT1, LT 2: inspection layer

M, M11-M14, M21-M23, M41-M47, Mr 1-Mr 6: branch of

MB: intermediate substrate

MP: metal plate

N, N11, N12, N21, N41, N42: node point

NR: root node

P, P1-P7, P11-P17: conductive part

PA, PB, PA 1-PF 1, PA 2-PF 2: conductive part

Pr: probe needle

RA to RF: through hole

T1: one end of

T2: the other end of the tube

V, V11-V17, V21-V27, V31-V36, V41-V45, V51-V57 and Vc: through hole

VM: voltage detection unit

W, W11, W12, W21, W22, W41 to W45: wiring harness

WB: multilayer substrate

WB1, WB 2: substrate