阅读说明：本技术 用于石油钻井系统的随钻测量总成的中央存储单元 (Central storage unit for measurement while drilling assembly of petroleum drilling system ) 是由 韩军 詹晟 胡风涛 赵金海 于 2020-09-18 设计创作，主要内容包括：本发明涉及用于石油钻井系统的随钻测量总成的中央存储单元,以及一种用于石油钻井系统的收集和存储传感器数据的设备。该设备包括：钻柱,其包括井下钻具组合,所述井下钻具组合包括钻头和随钻测量MWD总成；主板,其包括位于所述MWD总成中的主板微控制器单元(MCU)；多个传感器板,其用于感测和收集传感器数据；中央存储单元,其包括位于所述MWD总成中的中央存储单元MCU,以用于存储由多个传感器板所收集传感器数据；以及内部总线,其耦合到所述主板、所述多个传感器板和所述中央存储单元,用于将传感器数据从所述多个传感器板传递至所述中央存储单元,以用于由所述中央存储单元进行存储；其中,所述中央存储单元可从所述MWD总成中拆卸下来。(The present invention relates to a central storage unit for a measurement-while-drilling assembly for an oil drilling system, and an apparatus for collecting and storing sensor data for an oil drilling system. The apparatus comprises: a drill string comprising a downhole drilling assembly comprising a drill bit and a measurement-while-drilling (MWD) assembly; a motherboard comprising a motherboard microcontroller unit (MCU) located in the MWD assembly; a plurality of sensor boards for sensing and collecting sensor data; a central storage unit comprising a central storage unit MCU located in the MWD assembly for storing sensor data collected by a plurality of sensor boards; and an internal bus coupled to the motherboard, the plurality of sensor boards, and the central storage unit for transferring sensor data from the plurality of sensor boards to the central storage unit for storage by the central storage unit; wherein the central storage unit is detachable from the MWD assembly.)

1. An apparatus for collecting and storing sensor data for an oil drilling system, comprising:

a drill string comprising a downhole drilling assembly comprising a drill bit and a measurement-while-drilling assembly;

a motherboard comprising a motherboard microcontroller unit located in the measurement-while-drilling assembly;

a plurality of sensor boards for sensing and collecting sensor data;

a central storage unit comprising a central storage unit microcontroller unit located in the measurement-while-drilling assembly for storing sensor data collected by the plurality of sensor boards; and

an internal bus coupled to the motherboard, the plurality of sensor boards, and the central storage unit for transferring sensor data from the plurality of sensor boards to the central storage unit for storage by the central storage unit;

wherein the central storage unit is detachable from the measurement-while-drilling assembly.

2. The apparatus of claim 1, further comprising an orientation module coupled to the internal bus for sensing and collecting orientation data related to a state and direction of the drill string.

3. The device of claim 2, wherein the orientation module comprises one or more orientation sensors, one or more accelerometers, one or more magnetometers, and one or more temperature sensors.

4. The device of claim 1, wherein the motherboard microcontroller unit sends commands to the plurality of sensor boards for commanding the sensor boards to sense data.

5. The apparatus of claim 1, wherein one or more sensor boards periodically output or provide sensor data onto the internal bus.

6. The device of claim 1, wherein one or more sensor boards output or provide sensor data onto the internal bus in response to a request from the central storage unit microcontroller unit or the motherboard microcontroller unit.

7. The device of claim 1, wherein said central storage unit further comprises a bus adapter coupling said internal bus to said central storage unit microcontroller unit.

8. The apparatus of claim 7, wherein:

the central storage unit further comprises a secure digital card coupled to the central storage unit microcontroller unit for storing the sensor data; and

the secure digital card is removable from the central storage unit.

9. The apparatus of claim 7, wherein:

the central storage unit further comprises a secure digital card array coupled to the central storage unit microcontroller unit for storing the sensor data;

the secure digital card array comprises a plurality of secure digital cards; and

each secure digital card in the array of secure digital cards is removable.

10. The apparatus of claim 9, wherein:

each secure digital card is assigned to a sensor board; and

each secure digital card stores sensor data from the assigned one of the sensor boards.

11. A measurement-while-drilling system for a drill string of an oil drilling system, the measurement-while-drilling system comprising:

a motherboard comprising a motherboard microcontroller unit;

a plurality of sensor boards for sensing and collecting sensor data;

a central storage unit comprising a central storage unit microcontroller unit for storing sensor data collected by the plurality of sensor boards; and

an internal bus coupled to the motherboard, the plurality of sensor boards, and the central storage unit for transferring sensor data from the plurality of sensor boards to the central storage unit for storage by the central storage unit;

wherein the central storage unit is detachable from the measurement while drilling system.

12. The measurement-while-drilling system of claim 11, further comprising an orientation module coupled to the internal bus for sensing and collecting orientation data related to the state and direction of the drill string.

13. The measurement-while-drilling system of claim 12, wherein the orientation module comprises one or more orientation sensors, one or more accelerometers, one or more magnetometers, and one or more temperature sensors.

14. The measurement-while-drilling system of claim 11, wherein the motherboard microcontroller unit sends commands to the plurality of sensor boards for commanding the sensor boards to sense data.

15. The measurement-while-drilling system of claim 11, wherein one or more sensor boards periodically output or provide sensor data onto the internal bus.

16. The measurement-while-drilling system of claim 11, wherein one or more sensor boards output or provide sensor data onto the internal bus in response to a request from the central storage unit microcontroller unit or the motherboard microcontroller unit.

17. The measurement-while-drilling system of claim 11, wherein the central storage unit further comprises a bus adapter coupling the internal bus to the central storage unit microcontroller unit.

18. The measurement-while-drilling system of claim 17, wherein:

the central storage unit further comprises a secure digital card array coupled to the central storage unit microcontroller unit for storing the sensor data;

the secure digital card array comprises a plurality of secure digital cards; and

each secure digital card in the array of secure digital cards is removable.

19. The measurement-while-drilling system of claim 17, wherein:

the central storage unit further comprises a secure digital card array coupled to the central storage unit microcontroller unit for storing the sensor data;

the secure digital card array comprises a plurality of secure digital cards; and

each secure digital card in the array of secure digital cards is removable.

20. The measurement-while-drilling system of claim 19, wherein:

each secure digital card is assigned a sensor board; and

each secure digital card stores sensor data from the assigned one of the sensor boards.

Technical Field

The invention provides an oil drilling system which comprises a drill string and a downhole drilling tool assembly. The downhole drilling assembly may include a Central Storage Unit (CSU) for a Measurement While Drilling (MWD) assembly for downhole storage of sensor data from a plurality of sensors.

Background

Logging While Drilling (LWD) instruments and Measurement While Drilling (MWD) instruments are widely used in oil and gas drilling and formation evaluation. For example, these instruments may be mounted in a downhole drilling assembly (BHA) of a drill string connected to a derrick at the surface. The MWD tool may be part of an MWD system (MWD package) in the BHA of the drill string.

However, there are difficulties in collecting, processing, and storing large amounts of sensor data. For example, a motherboard containing a main microcontroller unit (MCU) is the core of the MWD system in the BHA. The main board is used for acquiring sensor data on other boards through an internal bus. The motherboard is also used to record sensor data into an external flash memory on the motherboard. In order to further search, process and retrieve the sensor data from the external flash memory, the stored (recorded) sensor data must be downloaded from the external flash memory on the motherboard by a specific communication protocol and command. The downloading of sensor data is very time consuming. In addition, in conventional MWD systems, the external memory is often mounted on the motherboard by soldering. If the MCU on the motherboard, the external memory mounted on the motherboard, or the communication bus on the motherboard is damaged or completely fails for any reason, including manufacturing defects or damage during use, then the sensor data stored in the external flash memory cannot be accessed. Thus, sensor data will be lost.

Therefore, there is a need for an apparatus, device, and method to efficiently and reliably collect and store sensor data in a BHA at high speed for further analysis.

Disclosure of Invention

The present invention provides devices, apparatus and methods for efficiently and reliably collecting and storing sensor data from a drill string at a sensor so that the sensor data can be retrieved for further analysis.

In one aspect of one or more embodiments, an apparatus for collecting and storing sensor data for an oil drilling system is presented, which may include: a drill string comprising a downhole drilling assembly comprising a drill bit and a measurement-while-drilling (MWD) assembly; a motherboard including a motherboard microcontroller unit (MCU) located in the MWD assembly; a plurality of sensor boards for sensing and collecting sensor data; a central storage unit comprising a central storage unit (MCU) located in the MWD assembly for storing sensor data collected by a plurality of sensor boards; and an internal bus coupled to the motherboard, the plurality of sensor boards, and the central storage unit for transferring sensor data from the plurality of sensor boards to the central storage unit for storage by the central storage unit; wherein the central storage unit is detachable from the MWD assembly.

In one aspect of one or more embodiments, the apparatus can further include an orientation module coupled to the internal bus for sensing and collecting orientation data related to a state and direction of the drill string.

In one aspect of one or more embodiments, the orientation module includes one or more orientation sensors, one or more accelerometers, one or more magnetometers, and one or more temperature sensors.

In one aspect of one or more embodiments, the main board MCU sends commands to the plurality of sensor boards for commanding the sensor boards to sense data.

In one aspect of one or more embodiments, one or more sensor boards periodically output or provide sensor data onto the internal bus.

In one aspect of one or more embodiments, one or more sensor boards output or provide sensor data onto the internal bus in response to a request from the central storage unit MCU or the main board MCU.

In one aspect of one or more embodiments, the central storage unit further comprises a bus adapter coupling the internal bus to the central storage unit MCU.

In one aspect of one or more embodiments, said central storage unit further comprises a Secure Digital (SD) card coupled to said central storage unit MCU for storing said sensor data; the SD card is detachable from the central storage unit.

In one aspect of one or more embodiments, the central storage unit further comprises an SD card array coupled to the central storage unit MCU for storing the sensor data; the SD card array comprises a plurality of SD cards; each SD card in the array of SD cards is removable.

In one aspect of one or more embodiments, each SD card is assigned a sensor board; each SD card stores sensor data from an assigned one of the sensor boards.

In one aspect of one or more embodiments, a Measurement While Drilling (MWD) system for a drill string of an oil drilling system is presented. The MWD system may comprise: a motherboard including a motherboard microcontroller unit (MCU); a plurality of sensor boards for sensing and collecting sensor data; a central storage unit including a central storage unit (MCU) for storing sensor data collected by the plurality of sensor boards; and an internal bus coupled to the motherboard, the plurality of sensor boards, and the central storage unit for transferring sensor data from the plurality of sensor boards to the central storage unit for storage by the central storage unit; wherein the central storage unit is detachable from the MWD system.

In one aspect of one or more embodiments, the apparatus can further include an orientation module coupled to the internal bus for sensing and collecting orientation data related to a state and direction of the drill string.

In one aspect of one or more embodiments, the orientation module includes one or more orientation sensors, one or more accelerometers, one or more magnetometers, and one or more temperature sensors.

In one aspect of one or more embodiments, the main board MCU sends commands to the plurality of sensor boards for commanding the sensor boards to sense data.

In one aspect of one or more embodiments, one or more sensor boards periodically output or provide sensor data onto the internal bus.

In one aspect of one or more embodiments, one or more sensor boards output or provide sensor data onto the internal bus in response to a request from the central storage unit MCU or the main board MCU.

In one aspect of one or more embodiments, the central storage unit further comprises a bus adapter coupling the internal bus to the central storage unit MCU.

In one aspect of one or more embodiments, said central storage unit further comprises a Secure Digital (SD) card coupled to said central storage unit MCU for storing said sensor data; the SD card is detachable from the central storage unit.

In one aspect of one or more embodiments, the central storage unit further comprises an SD card array coupled to the central storage unit MCU for storing the sensor data; the SD card array comprises a plurality of SD cards; each SD card in the array of SD cards is removable.

In one aspect of one or more embodiments, each SD card is assigned a sensor board; each SD card stores sensor data from an assigned one of the sensor boards.

Drawings

The teachings of the present invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawings.

FIG. 1 shows a schematic of an oil drilling system at a wellsite, according to one embodiment;

FIG. 2 shows a schematic of a portion of a well tool according to one embodiment;

FIG. 3 shows a schematic diagram of certain components of an MWD assembly, according to one embodiment;

FIG. 4 shows a schematic diagram of a central storage unit according to one embodiment;

FIG. 5 shows a schematic diagram of a central storage unit according to one embodiment;

FIG. 6 shows a schematic diagram of a central storage unit according to one embodiment;

FIG. 7 shows a schematic diagram of a central storage unit according to one embodiment;

FIG. 8 shows a flowchart of a method of collecting sensor data from one or more sensors and storing the collected sensor data for retrieval and further processing, according to one embodiment.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. It should be understood that wherever practicable similar or like reference numbers may be used in the figures and may indicate similar or like elements.

The drawings show embodiments of the invention for the purpose of illustration only. One skilled in the art will readily recognize from the following description that alternative embodiments exist without departing from the general principles of the present invention.

The oil drilling system may include a Logging While Drilling (LWD) instrument or system having a formation evaluation tool that may measure pressure, gamma ray, resistivity, sonic, porosity, and density characteristics of the formation, as well as other measured parameters associated with the formation. These evaluation tools may include magnetic resonance imaging and formation testing tools disposed in an assembled drill string. These formation evaluation tools also include petrophysical and geosteering capabilities with higher resolution imaging, and look-ahead sensors.

The oil drilling system may also include a Measurement While Drilling (MWD) system, which may include, for example, survey tools for measuring formation properties (e.g., resistivity, natural gamma rays, porosity), borehole geometry (inclination, azimuth), drilling system orientation (toolface), and mechanical properties of the drilling process of the borehole. MWD tools or systems can measure the borehole trajectory, provide a magnetic or gravity toolface for directional control, and a telemetry system that can pulse data up through the drill pipe as pressure waves. Examples of MWD measurement systems may use mud pulse or electromagnetic telemetry. MWD surveys can be used both as directional surveys with steerable Bottom Hole Assemblies (BHA) and as an alternative to magnetic multi-point surveys while rotary drilling. Both LWD and MWD systems enjoy this mode of communication with the surface and may be incorporated as one tubular string in a drilling assembly, i.e., a drill string.

FIG. 1 shows a schematic of an oil drilling system at a well site according to one embodiment of the present invention. The drilling system 100 in fig. 1 has a derrick 1 on the surface of the earth, which is shown on land. However, the drilling system 100 may also be located on any other surface, such as water. Kelly 2 drives a drill string 3 into a wellbore 5. At the lower portion of the drill string 3 is a Bottom Hole Assembly (BHA)4, which includes a non-magnetic drill collar 8 in which a MWD system (MWD assembly) 9 is mounted, a LWD instrument 10, a downhole motor 11, a near bit measurement sub 7, a drill bit 6, and the like. During drilling operations, the drilling system 100 may be operated in a rotary mode, wherein the drill string 3 is rotated from the surface by a motor (i.e., a top drive) in a rotary table or travelling block. The drilling system 100 may also be operated in a sliding mode, in which the drill string 3 is not rotated from the surface, but is driven by a downhole motor 11 to rotate the downhole drill bit. Drilling mud is pumped from the surface through the drill string 3 to the drill bit 6 and injected into the annulus between the drill string 3 and the borehole wall. The drilling mud carries the cuttings from the well to the surface.

In one or more embodiments, MWD system (MWD assembly) 9 may include a pulse sub, a pulse drive sub, a battery sub, a central storage unit, a motherboard, a power sub, a directional module sub, and other sensor boards. In certain embodiments, some of these devices may be located in other regions of the BHA 4.

The non-magnetic drill collar 8 has an MWD system 9 that includes a tool assembly for measuring inclination, azimuth, borehole trajectory, and the like. LWD instruments 10, such as neutron porosity and density measurement tools, may also be included in the non-magnetic drill collar 8 or elsewhere in the drill string 3 for determining formation properties such as porosity and density. The instruments may be electrically or wirelessly coupled together, powered by a battery pack or a drilling mud driven generator. All of the information collected may be transmitted to the surface by a mud pulse telemetry system, electromagnetic transmission, or other communication system.

A measurement sub 7 may be provided between the downhole motor 11 and the drill bit 6 for measuring formation resistivity, gamma rays and borehole trajectory. Data may be transmitted to the MWD or other communication device via a cable embedded in the downhole motor 11. The downhole motor 11 may be connected to a curved housing adjustable at the surface by 1 ° to 3 °, preferably up to 4 °. Due to the slight curvature of the curved housing, the drill bit 6 can drill a curved trajectory.

FIG. 2 shows a schematic of a portion of a well tool according to one embodiment. FIG. 2 shows an example of a portion of BHA4 of drill string 3 according to one embodiment. The BHA includes a downhole motor 210 (which is one example of downhole motor 11 in fig. 1), a universal joint (i.e., U-joint) assembly 220, a gauging sub 240 (which is one example of gauging sub 7 in fig. 1) fitted over a U-joint connecting rod 222, and a drive shaft assembly 230. The universal joint assembly 220 includes an upper U-joint 221 adjacent the downhole motor 210, a lower U-joint 223 distal from the downhole motor 210, and a U-joint connecting rod 222 connected between the upper U-joint and the lower U-joint. The drive shaft assembly 230 has a drive shaft 234 of a tube type having a proximal end coupled to the curved housing 231 and a distal end adapted to secure a drill bit (not shown in FIG. 2) as a female button 235. A thrust bearing 233 is provided between the drive shaft 234 and the bearing housing 232.

Drilling mud is pumped through downhole motor 210 to cause rotational motion of motor 214, which is transmitted through U-joint assembly 220 to drive shaft assembly 230. A drill bit (not shown in fig. 2) mounted in a box 235 in the shaft assembly 230 is driven to rotate thereby. The shaft assembly 230 also carries the axial and radial thrust generated by the drilling. The gauging nipple 240 fits over the U-joint connecting rod 222 like a sleeve. The measurement sub 240 rotates with the drilling assembly and simultaneously measures formation information, borehole trajectory, etc.

The downhole motor 210 may be a Positive Displacement Motor (PDM), a moro motor, a turbine, or other suitable motor known in the art. As shown in fig. 2, the downhole motor 210 has a dump valve assembly 211 and a drop prevention assembly 212. The purge valve assembly 211 has an open position and a closed position. When the downhole motor 211 is closed, the bypass valve is opened so that mud can be discharged into the annulus in the wellbore. Additionally, when the flow rate and pressure of the drilling mud reaches some predetermined value, the bypass valve closes so that the drilling mud may flow through the downhole motor 210. The anti-trip assembly 212, which may also be referred to as a safety catch assembly, may be used to remove the downhole motor 210 from the well in the event of a motor connection failure. The anti-drop assembly 212 may cause the mud pressure to rise rapidly, alerting the surface of the connection failure when it fails.

As shown in fig. 2, gauging nipple 240 is disposed about U-joint connection rod 222 between upper U-joint 221 and lower U-joint 223. In this embodiment, the gauging nipple 240 is tubular with a hollow center in its longitudinal direction. A U-joint connecting rod 222 extends through the hollow center portion of the gauging nipple 240. An upper U-joint 221 (located on the proximal end of the U-joint connecting rod 222) is coupled to the distal end of the motor 214, while a lower U-joint 223 (located on the distal end of the U-joint connecting rod 222) is coupled to the proximal end of the drive shaft 234. The stator connection 216 acts as a transition connection to couple the gauging sub 240 with the downhole motor 210. The upper proximal end of the stator connector 216 is coupled to the stator 213 of the downhole motor 210, while its distal end is connected to the upper threaded connection of the gauging sub 240. The lower threaded connection of the gauging nipple 240 is connected to the bent housing 231. The length of the gauging sub 240 may vary depending on the instrument it houses. The length of the U-joint connecting rod 222 and the length of the stator connection 216 may vary depending on the length of the gauging nipple 240, and vice versa.

The data collected by the measurement sub 240 is sent to an MWD system (MWD package) 9 located above the downhole motor 210 and from there transmitted to the surface. The measuring nipple integrates modules for detecting gamma rays, resistivity and formation density. The measurements are directional or azimuthal so the data can better reflect the formation properties near the wellbore section segment by segment. Since fluxgate magnetometers are typically used to obtain azimuthal measurements of the borehole, the measurements may be disturbed by electromagnetic fields surrounding the tool.

As described above, the measurement sub 240 may include sensors and circuitry for measuring resistivity, gamma ray, and borehole trajectory (e.g., borehole inclination). Additionally, the measurement sub 240 may be powered by a battery pack mounted in the measurement sub 240 itself or above the downhole motor 210, or by power generated by a turbine generator driven by the drilling mud. Thus, a channel for data communication and/or power transmission is provided between the gauging nipple 240 and the instruments above the downhole motor 210.

In the embodiment shown in FIG. 2, power for the gauging nipple 240 may be supplied by instrumentation above the downhole motor 210. The stator 213 in the downhole motor has one or more channels 215 for receiving wire/data cables for connecting the measurement sub 240 to a tool (MWD tool, not shown in fig. 2) located above the downhole motor 210. The channel 215 may be a channel machined into the surface of the stator 213 or constructed in an elastomeric layer within the stator 213. The data cable allows stable and fast data transmission.

In one embodiment, the gauging sub 240 may also have a wireless communication module that communicates with a corresponding module mounted above the downhole motor 210 to establish data communication between the two modules via electromagnetic signals.

As described above, the gauging nipple 240 is an example of the gauging nipple 7 in the downhole drilling assembly 4 of the drill string 3 in fig. 1. One or more sensors may be installed in the gauging nipple 7 or other location of the downhole drilling assembly 4 for measuring and collecting sensor data. In one or more embodiments, the sensor data is transmitted or provided to an MWD assembly, such as MWD assembly 9.

FIG. 3 shows certain components of an MWD system (MWD assembly) 9 in a downhole drilling assembly (BHA)4, according to one embodiment. Fig. 3 shows a Central Storage Unit (CSU)300 coupled to a motherboard 310, an orientation module 320, and one or more sensor boards (e.g., a plurality of sensor boards from a first sensor board to an nth sensor board, where N is a natural number (countable number)). For example, the central storage unit 300 is coupled to the first sensor board 330 and the nth sensor board 340. The sensor board may include a sensor board Micro Control Unit (MCU) or a Central Processing Unit (CPU). The individual sensors on the sensor board or the sensors communicating with the sensor board may also have a microcontroller unit or a central processing unit.

Motherboard 310 is the core of MWD system 9. The motherboard 310 has a motherboard microcontroller unit (MCU) and various internal and external buses for communicating with other sensors. The motherboard MCU may be firmware. The main board MCU may control one or more sensor boards including one or more sensors for sensing data.

The orientation module 320 may have means for providing information about the state and direction of the drill string 3. For example, the orientation module 320 may have one or more orientation sensors, one or more accelerometers, one or more magnetometers, and one or more temperature sensors. The orientation module 320 may be equipped with an MCU or may rely on the MCU of the motherboard 310.

The central storage unit 300 may be a general purpose memory board instead of external flash memory on the main board 310. The Central Storage Unit (CSU)300 has many advantages. For example, in conventional MWD systems, external memory for storing sensor data is typically mounted on the motherboard by soldering. This may damage the motherboard during manufacture or actual use of the main circuit board in a conventional MWD system. The Central Storage Unit (CSU)300 is a separate board that is not mounted to the motherboard, which reduces the likelihood of damage to the motherboard and the likelihood of disrupting storage of sensor data on the Central Storage Unit (CSU) 300. Furthermore, since the Central Storage Unit (CSU)300 is a board, it can be connected to the MWD system with relative ease by contacting the Central Storage Unit (CSU)300 and plugging (or otherwise connecting) it securely into the MWD system without damaging the board of the Central Storage Unit (CSU)300 or the MWD system. In addition, the central storage unit 300 has a Central Storage Unit (CSU) microcontroller unit, which is not controlled by a motherboard microcontroller unit (MCU) on the motherboard 310. The CSU microcontroller unit may not be controlled by any other controller or any other board. The CSU microcontroller unit may be firmware. Furthermore, the central storage unit 300 has a large storage capacity, which may include one or more storage devices, such as a Secure Digital (SD) card, a miniSD card, a microSD card, and/or other storage devices (storage devices). In addition, the central storage unit 300 may have a greater storage capacity by using an SD card array, a miniSD card array, a microSD card array, and/or one or more storage device arrays.

Additionally, the central storage unit 300 is detachable from the MWD system 9. Thus, the entire MWD assembly 9 need not be disassembled from the Bottom Hole Assembly (BHA)4 of the drill string 3. In addition, each of the one or more storage devices (storage devices) is detachable (e.g., plugged in/out). Further, by attaching the central storage unit 300 to one or more internal buses, the central storage unit 300 can record sensor data. The central storage unit 300 may store (record) sensor data received or provided by other sensor boards, such as the first sensor board 330. The removability of the central storage unit 300 and the storage devices on the central storage unit 300 avoids the need to remove or use the entire MWD system 9 to transfer sensor data from one or more storage devices of the central storage unit 300 to another memory or computing device for further processing or retrieval. In addition, the removability of the central storage unit 300 and the storage devices on the central storage unit 300 also avoids the use of the motherboard 310 to transmit sensor data from the MWD system 9 to another memory or computing device. For example, if the motherboard 310 is damaged or fails in any way, such damage or failure of the motherboard 310 may not impact the transfer of sensor data from the Central Storage Unit (CSU)300 to another memory or computing device. The motherboard 310 does not participate in the transfer of sensor data from the Central Storage Unit (CSU)300 to another memory or computer device (e.g., a personal computer) for further processing or retrieval.

As described above, the central storage unit 300 is coupled to a plurality of sensor boards from the first sensor board to the nth sensor board, where N is a natural number (countable number). For example, in fig. 3, a central storage unit 300 is coupled to a first sensor board 330 and an nth sensor board 340. Each sensor board may include one or more sensors to collect sensor data by the sensors. These sensors may measure and/or detect whatever the sensor is designed to detect. In some embodiments, one or more sensors may periodically output sensor data on an internal common bus. The central memory unit 300 may be connected to an internal bus. Alternatively, in some embodiments, the motherboard MCU may send a capture command to one or more sensor boards to measure, detect, and/or collect sensor data over an internal bus. The acquisition command may include one or more identifiers to identify the one or more sensors. One example of an internal bus is a Control Area Network (CAN) bus. The acquisition command of the motherboard MCU may also instruct one or more sensors to output sensor data on the internal bus. The central storage unit 300 may be coupled to one or more sensor boards by the same internal bus. The central storage unit 300 may retrieve or receive sensor data from the internal bus regardless of how the sensor data is output to the internal bus. Examples of internal buses may include a CAN bus, a Q bus, or a serial bus (e.g., a Recommended Standard (RS)232 serial bus). The central storage unit 300 may be a data logger for logging sensor data. In addition, the central storage unit 300 may hold other types of data, such as communication data.

FIG. 4 shows a schematic diagram of an example of a central storage unit 400 according to one embodiment. The central storage unit 400 in fig. 4 is an example of the central storage unit 300 in fig. 3. The central storage unit 400 includes a bus adapter 410, a microcontroller unit (MCU)420, and a Secure Digital (SD) card 430. One SD card can store 500GB or more of sensor data. Bus adapter 410 may couple central storage unit 400 to one or more buses coupled to one or more sensors on one or more sensor boards. The one or more buses may also be referred to as internal buses, or may be referred to as one or more internal buses. Bus adapter 410 may be implemented by a firmware driver and bus controller chip in MCU420 as desired. The bus adapter 410 receives sensor data from one or more buses or retrieves sensor data from one or more sensors on one or more sensor boards using one or more buses. MCU420 receives sensor data from bus adapter 410 or retrieves sensor data from bus adapter 410.

MCU420 may be coupled to SD card 430 by a plurality of lines (e.g., wires) that may form a bus. These wires may also be referred to as connectors. In some embodiments, such as the embodiment shown in fig. 4, MCU420 may be coupled to SD card 430 through a Serial Peripheral Interface (SPI) bus, which may be a four-wire bus (first to fourth connectors or first to fourth wires). One line (first line), referred to as SPI CLK, may provide the serial clock signal from MCU420 to SD card 430. SPI CLK (first line) may also be referred to as SCK to represent the serial clock. The SPI bus may also include two data lines (a second line and a third line). These two data lines output or provide sensor data, which may be stored (recorded) in the SD card 430. The second line may also be referred to as SPI MISO (serial peripheral interface master input/slave output). The third line may be referred to as SPI MOSI (serial peripheral interface master output/slave input). Another line, referred to as SPI CS (serial peripheral interface chip select), may provide an enable signal or a disable signal from MCU420 to SD card 430. The SPI CS line may also be referred to as the select line (fourth line). The SPI CS line may also be referred to as SPI SS to denote the slave select line. In the communication relationship between MCU420 and the SD card, MCU420 is referred to as a host, and SD card 430 is referred to as a slave.

MCU420 may output a serial clock signal on the SPI CLK line to SD card 430. MCU420 may provide or output sensor data stored in SD card 430. An enable signal or a disable signal (select signal or not) may be output or provided on the SPI CS line. Sensor data acquired by MCU420 from bus adapter 410 may be output to or read from the SPI MISO and SPI MOSI lines of MCU 420. If the enable signal is output or provided on the SPI CS line, the sensor data may be received through or read using the SPI MISO line and the SPI MOSI line. Thereafter, the sensor data may be stored (recorded) in the SD card 430. Thus, in the embodiment shown in FIG. 4, removable SD card 430 may store (record) sensor data collected by one or more sensors located on one or more sensor boards. Removable SD card 430 may be removed and the sensor data may be transmitted and/or retrieved for further storage or processing by another computing device.

FIG. 5 shows a schematic diagram of a central storage unit 500 according to one embodiment. The central storage unit 500 in fig. 5 is an example of the central storage unit 300 in fig. 3. The central storage unit 500 includes a bus adapter 510, a microcontroller unit (MCU)520, a binary decoder 530, a first Secure Digital (SD) card 540, and a second SD card 550. One SD card can store 500GB or more of sensor data. The first SD card 540 and the second SD card 550 may be detachable. The central storage unit 500 may also be removable.

Bus adapter 510 may couple central storage unit 500 to one or more buses coupled to one or more sensors located on one or more sensor boards. The one or more buses may also be referred to as internal buses, or as one or more internal buses. Bus adapter 510 may be implemented as desired by a firmware driver and bus controller chip in MCU 520. The bus adapter 510 receives sensor data from one or more buses or retrieves sensor data from one or more sensors located on one or more sensor boards using one or more buses. MCU520 receives sensor data from bus adapter 510 or retrieves sensor data from bus adapter 510.

In the exemplary embodiment shown in fig. 5, MCU520 may be coupled to first SD card 540 and second SD card 550 through a plurality of wires (e.g., wires) forming a bus. The plurality of wires may also be referred to as connectors. In some embodiments, such as the embodiment shown in fig. 5, MCU520 may be coupled to SD card 540 and SD card 550 by lines in a four-wire Serial Peripheral Interface (SPI) bus, which may be a four-wire bus (first to fourth connectors or first to fourth wires). More specifically, one line (first line) called SPI CLK may provide the serial clock signal from MCU520 to SD cards 540 and 550. SPI CLK (first line) may also be referred to as SCK to represent the serial clock. The SPI bus may also include two data lines (a second line and a third line). These two data lines output or provide sensor data. The second line may be referred to as SPI MISO (serial peripheral interface master input/slave output). The third line may be referred to as SPI MOSI (serial peripheral interface master output/slave input). In the communication relationship between MCU520 and SD cards 540 and 550, MCU520 is referred to as a host, and SD cards 540 and 550 are both referred to as slaves.

In the exemplary embodiment shown in fig. 5, a fourth line of the SPI bus may be coupled to MCU520, which MCU520 is in turn coupled to binary decoder 530. The fourth line may be referred to as a discrimination bit line. Binary decoder 530 may be a 1-2 binary decoder that receives a signal on an identification BIT line denoted as SD ID BIT. Binary decoder 530 may be coupled to first SD card 540(SD 0) via a first SPI CS line and to second SD card 550(SD 1) via a second SPI CS line. "CS" may represent chip selection and may also be referred to as "SS" to represent slave selection. The signal on the identification bit line may appear as a high signal or a low signal. The high or low signal output or provided by the identification bit line is a command or instruction from MCU520 to binary decoder 530, which binary decoder 530 uses to select (enable or disable) first SD card 540 or second SD card 550. Thus, the MCU is also coupled to a first SD card 540 and a second SD card 550 through a binary decoder 530.

Using the fourth line (identification bit line), MCU520 may command or instruct binary decoder 530 to place an enable signal on the first SPI CS line and a disable signal on the second SPI CS line so that sensor data may be received or retrieved by first SD card 540 from both data lines SPI MISO and SPI MOSI. Thus, the first SD card 540 can store the sensor data in the first SD card 540. Using the fourth line, MCU520 may also command or instruct binary decoder 530 to place a disable signal on the first SPI CS line and an enable signal on the second SPI CS line so that sensor data may be received or retrieved by second SD card 550 from both data lines SPI MISO and SPI MOSI. Thus, the second SD card 550 can store the sensor data in the second SD card 550.

In some embodiments, MCU520 may store one or more types of sensor data on first SD card 540 and one or more other types of sensor data on second SD card 550 by instruction to binary decoder 530 on a fourth line. The type of sensor data may be identified based on the identifier acquired and analyzed by the MCU 520.

In some embodiments, MCU520 may select second SD card 550 to store sensor data when first SD card 540 has stored a maximum amount of sensor data or first SD card 540 is unavailable (e.g., has been damaged or removed). In some embodiments, MCU520 may select first SD card 540 to store sensor data when second SD card 550 has stored the maximum amount of sensor data or second SD card 550 is not available (e.g., has been damaged or removed). In some embodiments, MCU520 may select first SD card 540 to store sensor data until the maximum amount of sensor data that may be stored on first SD card 540 is stored. When first SD card 540 has stored as much sensor data as possible, MCU520 may select second SD card 550 to store additional sensor data.

In some embodiments, MCU520 may output a serial clock signal to first SD card 540 and second SD card 550 over the SPI CLK line. MCU520 may also provide or output sensor data for storage by at least one of first SD card 540 and second SD card 550. However, the first SD card 540 and/or the second SD card 550 must be selected to store the sensor data. As described above, binary decoder 530 may be coupled to first SD card 540(SD 0 card) by a first SPI CS line and to second SD card 540(SD 1 card) by a second SPI CS line. First SD card 540 is selected by an enable signal on the first SPI CS line. Second SD card 550 is selected by an enable signal on the second SPI CS line. When one or more SD cards are selected, the one or more SD cards may receive or retrieve the clock signal on the SPI CLK line and the sensor data from the two data lines SPI MISO and SPI MOSI for storage in the one or more SD cards. Thereafter, the sensor data may be stored (recorded) in one or more of the first SD card 540 and the second SD card 550. In the embodiment shown in FIG. 5, one or more removable SD cards 540 and 550 store (record) sensor data collected by one or more sensors located on one or more sensor boards. The one or more removable SD cards 540 and 550 can be removed and sensor data stored on the one or more removable SD cards 540 and 550 can be transferred and/or retrieved for further storage or processing of the sensor data by another computing device.

FIG. 6 shows a schematic diagram of a central storage unit 600 according to one embodiment. The central storage unit 600 in fig. 6 is an example of the central storage unit 300 in fig. 3. The central storage unit 600 includes a bus adapter 610, a Micro Controller Unit (MCU)620, a binary decoder 630, a first Secure Digital (SD) card 640(SD 00 card), a second SD card 650(SD 01 card), a third SD card 660(SD 10 card), and a fourth SD card 670(SC 11 card). An SD card can store 500GB or more of sensor data. The first SD card 640, the second SD card 650, the third SD card 660, and the fourth SD card 670 may be detachable. The central storage unit 600 may be detachable.

Bus adapter 610 may couple central storage unit 600 to one or more buses coupled to one or more sensors located on one or more sensor boards. The one or more buses may also be referred to as, or may be referred to as, internal buses. Bus adapter 610 may be implemented as desired by a firmware driver and bus controller chip in MCU 620. The bus adapter 610 receives sensor data from one or more buses or retrieves sensor data from one or more sensors located on one or more sensor boards using one or more buses. MCU 620 receives sensor data from bus adapter 610 or retrieves sensor data from bus adapter 610.

In the exemplary embodiment shown in fig. 6, the MCU 620 may be coupled to the first SD card 640, the second SD card 650, the third SD card 660, and the fourth SD card 670 through a plurality of lines (e.g., wires) forming a bus. The plurality of wires may also be referred to as connectors. In some embodiments, such as the embodiment shown in FIG. 6, MCU 620 may be coupled to first SD card 640, second SD card 650, third SD card 660, and fourth SD card 670 by lines in a Serial Peripheral Interface (SPI) bus. More specifically, one line (first line) called SPI CLK may provide the serial clock signal from MCU 620 to SD card 640 and 670. SPI CLK (first line) may also be referred to as SCK to represent the serial clock. The SPI bus may also include two data lines (a second line and a third line). Two data lines output or provide sensor data. The second line may also be referred to as SPI MISO (serial peripheral interface master input/slave output). The third line may also be referred to as SPI MOSI (serial peripheral interface master output/slave input). In the communication relationship between MCU 620 and SD cards 640 and 670, MCU 620 is referred to as the host, and SD cards 640 and 670 are referred to as the slaves.

In the exemplary embodiment shown in fig. 6, a fourth line and a fifth line may couple MCU 620 to binary decoder 630. The fourth line may be referred to as identification BIT line 0(SD ID BIT-0 or first identification BIT line) and the fifth line may be referred to as identification BIT line 1(SD ID BIT-1 or second identification BIT line). Binary decoder 630 may be a 2-4 binary decoder that receives one signal on a first identified bit line and another signal on a second identified bit line. Binary decoder 630 may be coupled to first SD card 640(SD 00) by a first SPI CS line, to second SD card 650(SD 01) by a second SPI CS line, to third SD card 660(SD 10) by a third SPI CS line, and to fourth SD card 670(SD11) by a fourth SPI CS line. "CS" may represent chip selection and may also be referred to as "SS" to represent slave selection.

Using the fourth line (first identification bit line) and the fifth line (second identification bit line), MCU 620 may command or instruct binary decoder 630 to place an enable signal on the first SPI CS line and a disable signal on the second SPI CS line, the third SPI CS line, and the fourth SPI CS line so that first SD card 640 may receive or retrieve sensor data from both data lines SPI MISO and SPI MOSI. Thus, the first SD card 640 may store the sensor data in the first SD card 640. Using the fourth and fifth lines, MCU 620 may also command or instruct binary decoder 630 to place an enable or disable signal onto any of the first to fourth SPI CS lines, so that any SD card can acquire and store (record) sensor data using both data lines SPI MISO and SPI MOSI according to a clock signal on the SPI CLK line.

In some embodiments, MCU 620 may store one or more types of sensor data in one or more selected SD cards of SD cards 640 and 670 by commands and/or instructions to binary decoder 630 on a fourth line and a fifth line. The type of sensor data may be identified based on the identifier acquired and analyzed by MCU 620. Based on the commands and/or instructions obtained by the binary decoder 630, the binary decoder 630 selects one or more of the first to fourth SD cards 640-670.

More specifically, in some embodiments, the MCU 620 may output the serial clock signal on the SPI CLK line to the first to fourth SD cards 640-670. The MCU 620 can also provide or output sensor data for storage by at least one of the first SD card 640 through the fourth SD card 670. However, each of the first to fourth SD cards 640 to 670 must be selected to store sensor data. As described above, binary decoder 630 receives commands and/or instructions from MCU 620 regarding the selection of an SD card to store (record) sensor data. Binary decoder 630 may be coupled to first SD card 640(SD 00) by a first SPI CS line, to second SD card 650(SD 01) by a second SPI CS line, to third SD card 660(SD 10) by a third SPI CS line, and to fourth SD card 670(SD11) by a fourth SPI CS line. First SD card 640 is selected by an enable signal on the first SPI CS line. The second SD card 650 is selected by an enable signal on the second SPI CS line. Third SD card 660 is selected by an enable signal on the third SPI CS line. The fourth SD card 670 is selected by an enable signal on the fourth SPI CS line.

When one or more SD cards are selected, the one or more SD cards can receive or retrieve the clock signal on the SPI CLK line, as well as the sensor data from the two data lines SPI MISO and SPI MOSI for storage in the one or more SD cards. Thereafter, the sensor data may be stored (recorded) in one or more of the first SD card 640, the second SD card 650, the third SD card 660, and the fourth SD card 670. Thus, in the embodiment shown in FIG. 6, one or more removable SD cards 640 and 650 store (record) sensor data collected by one or more sensors located on one or more sensor boards. The one or more removable SD cards 640-.

FIG. 7 shows a schematic diagram of a central storage unit 700 according to one embodiment. The central storage unit 700 in fig. 7 is an example of the central storage unit 300 in fig. 3. Central storage unit 700 includes bus adapter 710, microcontroller unit (MCU)720, binary decoder 730, Secure Digital (SD)00 card 740, SD 0m card 750, SD n0 card 760, and SD nm card 770. The reference letter "n" may be a natural number (countable number), and the reference letter "m" may be a natural number (countable number). In this embodiment, there may be an n by m array of SD cards. The total number of SD cards in the array is the product of n and m. An SD card can store 500GB or more of sensor data.

Bus adapter 710 may couple central storage unit 700 to one or more buses coupled to one or more sensors located on one or more sensor boards. The one or more buses may also be referred to as, or may be referred to as, internal buses. Bus adapter 710 may be implemented as desired by a firmware driver and bus controller chip in MCU 720. Bus adapter 710 receives sensor data from one or more buses or retrieves sensor data from one or more sensors located on one or more sensor boards using one or more buses. MCU 720 receives sensor data from bus adapter 710 or retrieves sensor data from bus adapter 710.

In the exemplary embodiment shown in FIG. 7, MCU 720 may be coupled to individual SD cards in an n by m array of SD cards, which may include SD 00 card 740, SD 0m card 750, SD n0 card 760, and SD nm card 770. MCU 720 may be coupled to each SD card in the n by m array of SD cards through a plurality of lines forming a bus. The plurality of wires may also be referred to as connectors. In some embodiments, such as the exemplary embodiment shown in fig. 7, MCI 720 may be coupled to an SD card by lines in a serial bus. More specifically, one line (first line) called SPI CLK may supply the serial clock signal from the MCU 720 to the SD cards of the SD 00 card denoted by reference numeral 740 to the SD nm card denoted by reference numeral 770. SPI CLK (first line) may also be referred to as SCK to represent the serial clock. The SPI bus may also include two data lines (a second line and a third line). These two data lines output or provide sensor data. The second line may be referred to as SPI MISO (serial peripheral interface master input/slave output). The third line may be referred to as SPI MOSI (serial peripheral interface master output/slave input). In the communication relationship between MCU 720 and the SD card array, MCU 720 is referred to as a master and each SD card in the n × m array of SD cards is referred to as a slave.

In the exemplary embodiment shown in fig. 7, additional lines may couple MCU 720 to nm binary decoder 730. This additional line may be generally referred to as an identification bit line, as the identification bit line may carry a signal to the nm binary decoder 730. These signals may be commands and/or instructions to command nm binary decoder 730 to select or deselect one or more SD cards in the array of SD cards. When one SD card is selected, it can receive or retrieve data from both data lines SPI MISO and SPI MOSI according to the clock signal transmitted over SPI CLK. As shown in FIG. 7, the first identification BIT line may be denoted as SD ID BIT-0 and the second identification BIT line may be denoted as SD ID BIT-1. Each identification BIT line may be identified by a natural number (countable number) until the last identification BIT line is identified as SD ID BIT-n. The signals on the identification bitlines are received or retrieved from the identification bitlines to teach the SD cards in the n x m array of SD cards by sending a signal on a different line to instruct or command the nm binary decoder 730 to select or not select individual SD cards in the n x m array of SD cards. Alternatively, the nm binary decoder 730 may select or deselect individual SD cards in the n × m array of SD cards by allowing each SD card to retrieve a select or deselect signal from the nm binary decoder 730. The line coupling the nm binary decoder to one of the n x m array of SD cards is represented by SPI CS (serial peripheral interface chip select), so that the nm binary decoder 730 can select and deselect each SD card in the n x m array of SD cards. As described above, this selection is based on one or more commands or instructions obtained from MCU 720 through the use of identified bit lines.

In some embodiments, MCU 720 may store one or more types of sensor data on one or more SD cards selected from a plurality of SD cards in an n × m array of SD cards by sending or providing commands and/or instructions to binary decoder 730. The type of sensor data may be identified based on the identifier acquired and analyzed by MCU 720. Based on the commands and/or instructions retrieved by binary decoder 730, binary decoder 730 selects one or more SD cards in the n × m array of SD cards.

In some embodiments, when one or more SD cards are selected, the one or more SD cards may receive or retrieve the clock signal on the SPI CLK line, as well as the sensor data from both data lines SPI MISO and SPI MOSI for storage in the one or more SD cards. Thereafter, the sensor data may be stored (recorded) within one or more of the n × m SD cards in the SD card array. Thus, in the embodiment shown in FIG. 7, one or more removable SD cards store (record) sensor data collected by one or more sensors located on one or more sensor boards. One or more removable SD cards can be removed and sensor data stored on the one or more removable SD cards can be transmitted and/or retrieved for further storage or processing of the sensor data by another computing device.

FIG. 8 illustrates a flow diagram of a process for collecting sensor data from one or more sensors and storing the collected sensor data for retrieval and further processing, according to one embodiment. As described above with respect to fig. 3, motherboard 310 is the core of MWD system 9. The motherboard 310 has a motherboard microcontroller unit (MCU) and various internal and external buses that communicate with the sensors. The motherboard MCU may be firmware. The main board MCU may control one or more sensor boards including one or more sensors to sense data. Fig. 3 shows a first sensor board 330 through an nth sensor board 340, which may all be coupled to the motherboard 310 and controlled by the motherboard MCU. As described above, "N" may be a natural number (a countable number). In step 800, one or more sensors located on one or more sensor boards are turned on to sense data when the one or more sensor boards receive one or more commands or instructions from the motherboard MCU. When the sensor board receives the command or instruction, the sensor may be commanded or instructed to sense the data. Alternatively, in step 800, one or more sensors are turned on by retrieving one or more commands or instructions by one or more sensor boards from one or more wires or buses coupling the one or more sensor boards to the motherboard MCU. When the sensor board retrieves the command or instruction, the sensor may be commanded or instructed to sense the data.

In step 810, one or more sensors for sensing data provide sensor data to one or more sensor boards for data collection. The one or more sensor boards used to collect data may periodically output the collected data onto one or more wires or buses that couple the one or more sensor boards to the central storage unit 300. Alternatively, one or more sensor boards used to collect data may periodically provide the collected data for retrieval using one or more wires or buses. The one or more lines or buses may couple one or more sensor boards to the central storage unit 300.

Alternatively, in step 810, one or more sensors for sensing data provide sensor data to one or more sensor boards for data collection. Upon request from the motherboard 310 or the central storage unit 300, the one or more sensor boards used to collect data may output the collected data onto one or more wires or buses coupled to the central storage unit 300. Alternatively, the one or more sensor boards used to collect data may provide the collected data for retrieval by the central storage unit 300 on one or more lines or buses coupled to the central storage unit 300, upon request from the main board 310 or the central storage unit 300.

As described above, the central storage unit 300 may be a general-purpose memory board, rather than an external flash memory on the main board 310. The Central Storage Unit (CSU)300 has many advantages. For example, the central storage unit 300 has a Central Storage Unit (CSU) microcontroller unit that is not controlled by a motherboard microcontroller unit (MCU) on the motherboard 310.

In step 820, the central storage unit 300 collects or retrieves sensor data from one or more wires or buses. In step 830, the central storage unit 300 stores the sensor data. Examples of a central storage unit 300 for storing sensor data are shown in fig. 4-7. In step 840, the motherboard MCU of the motherboard 310 determines whether one or more sensors continue to sense data. If the one or more sensors are no longer sensing data, the operation ends until the one or more sensors are turned on again in step 800. If one or more sensors continue to sense data, then sensor data continues to be collected in step 810.

The software in the processes, functions, methods, and/or apparatus described herein may be recorded, stored, or installed in one or more non-transitory computer-readable media (computer-readable storage (recording) media) that include program instructions (computer-readable instructions) that are executed by a computer to enable one or more processors to perform (implement or run) the program instructions. The media may also include, alone or in combination with the program instructions, data files, data structures, and the like. The media and program instructions may be those specially designed and configured or those well known and available to those having skill in the computer software arts. Examples of non-transitory computer readable media include: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD ROM disks and DVDs; magneto-optical media, such as optical disks; and hardware devices that are specially configured to store and execute program instructions, such as Read Only Memory (ROM), Random Access Memory (RAM), flash memory, and the like. Examples of program instructions include both machine code, such as produced by a compiler, and files containing higher level code that may be executed by the computer using an interpreter. The program instructions may be executed by one or more processors. The described hardware devices may be configured as one or more software modules recorded, stored, or installed in one or more non-transitory computer-readable media, to perform the above-described steps and methods, and vice versa. In addition, the non-transitory computer readable medium may be dispersed in computer systems connected through a network, and the program instructions may be stored and executed in a dispersed manner. Additionally, the computer readable medium may also be embodied in at least one Application Specific Integrated Circuit (ASIC) or Field Programmable Gate Array (FPGA). The non-transitory computer readable medium may include hardware such as a microcontroller unit. An ASIC may be an example of hardware.

While embodiments of the invention have been shown and described, modifications thereof can be made by one skilled in the art without departing from the spirit or teaching of the invention. The embodiments described herein are exemplary only, and are not limiting. Many variations and modifications of the methods, systems and apparatus are possible within the scope of the invention. Accordingly, the scope of protection is not limited to the embodiments described herein, but is only limited by the claims. The scope of the claims is intended to include all equivalents of the subject matter of the claims.