阅读说明：本技术 一种晶片点胶装置以及工艺 (Wafer dispensing device and process ) 是由 诸鑫炎 袁英 于 2021-08-12 设计创作，主要内容包括：本申请公开了一种晶片点胶装置以及工艺,主要涉及一种晶片点胶装置,包括支撑台,所述支撑台上设置有出胶结构,所述出胶结构包括出喷胶阀以及设在出喷胶阀出料端的出胶管,所述支撑台上方设有点胶板,所述点胶板上具有与晶体一一对应的点胶孔,所述出胶结构用于将胶体喷涂至点胶板上,所述支撑台上方滑移连接有用于将胶体填充至点胶孔内的刮板。本申请具有以下效果通过刮板的运动能够将胶体均匀的在同一厚度的情况下往前推送,在挤压作用下,胶体通过点胶孔覆盖在晶片上,这样的点胶方式能够大大提高点胶的效率,并且还能够通过改变点胶孔的形状,还能适配不同的晶片,较为方便。(The application discloses wafer dispensing device and technology mainly relates to a wafer dispensing device, including a supporting bench, be provided with out the glued structure on the supporting bench, it spouts the gluey valve and establishes the play hose that spouts gluey valve discharge end to go out the glued structure, the supporting bench top is equipped with some offset plate, have the point gluey hole with the crystal one-to-one on the point offset plate, it is used for spraying the colloid to some offset plate to go out the glued structure, it is connected with to slide to be used for filling the colloid to the downthehole scraper blade of point gluing to prop up supporting bench top. This application has following effect and can be with the even forward propelling movement under the condition of same thickness of colloid through the motion of scraper blade, under the extrusion, the colloid covers on the wafer through a point hole, and the efficiency of point is glued can be improved greatly to such a point mode of gluing to can also glue the shape in hole through changing the point, can also adapt to different wafers, it is comparatively convenient.)

1. The utility model provides a wafer dispensing device, includes brace table (100), its characterized in that: be provided with out glued structure (110) on brace table (100), go out glued structure (110) including go out spout gluey valve (111) and establish glue outlet pipe (112) of spouting gluey valve (111) discharge end, brace table (100) top is equipped with some offset plate (115), have on some offset plate (115) and glue hole (116) with the point of crystal one-to-one, it is used for spraying the colloid to some offset plate (115) to go out glued structure (110), it is connected with scraper blade (117) that are used for filling the colloid to some offset hole (116) to slide in brace table (100) top.

2. The wafer dispensing device of claim 1, wherein: the rubber outlet pipe (112) is connected with a separating block (120) which divides the rubber outlet pipe (112) into a rubber outlet section (131) and a rubber storage section (132) along the axial direction in a sliding manner along the radial direction, and the separating block (120) is provided with a first separating cavity (121) and a second separating cavity (122) which are not communicated with each other;

the first separation cavity (121) and the inner cavity of the glue outlet pipe (112) are coaxial, the separation block (120) is provided with a glue pumping assembly (140) communicated with the second separation cavity (122), and the upper side of the second separation cavity (122) is provided with a partition (123) for closing the glue outlet section (131).

3. The wafer dispensing device of claim 2, wherein: the glue extracting assembly (140) comprises a glue extracting box (141) connected to the separating block (120) and used for communicating with the lower side of the glue storing section (132), a negative pressure pipe (142) connected to the glue extracting box (141), and a piston (143) connected in the negative pressure pipe (142) in a sliding mode, wherein the separating block (120) is provided with a vent hole communicated with the second separating cavity (122), a driving piece (150) used for driving the piston (143) to move is arranged on the separating block (120), and the piston (143) is intermittently moved by the driving piece (150) and enables glue to be separated from the second separating cavity (122) and enter the glue extracting box (141).

4. The wafer dispensing device of claim 3, wherein: the glue extracting box (141) is connected with the separating block (120) through a connecting rod (144), and the connecting rod (144) is connected to the supporting table (100) in a sliding mode along the radial direction;

when the central axes of the first separation chamber (121) and the rubber outlet pipe (112) are coincident, the lower end of the rubber outlet pipe (112) is opened;

when the central axes of the second separation cavity (122) and the glue outlet pipe (112) are coincident, the glue extracting box (141) is opposite to the lower side of the glue storage section (132).

5. The wafer dispensing device of claim 4, wherein: the bottom of the glue extraction box (141) is inclined and inclines downwards towards one side close to the negative pressure pipe (142), and the air inlet of the negative pressure pipe (142) is higher than the lowest position of the glue extraction box (141).

6. The wafer dispensing device of claim 3, wherein: the driving piece (150) comprises a driving rotary drum (151) rotatably connected to the outer wall of the negative pressure pipe (142), a winding drum (152) arranged in the driving rotary drum (151) in a penetrating mode and rotatably connected to the negative pressure pipe (142), and a linkage rope (153) with one end fixedly connected to a piston (143) and one end fixedly connected to the side wall of the winding drum (152), wherein a driving motor (154) used for driving the driving rotary drum (151) to rotate is arranged on the separation block (120), the driving rotary drum (151) is circumferentially fixed to the outer wall of the winding drum (152) through a linkage structure, when the rotation resistance between the driving rotary drum (151) and the winding drum (152) is greater than a preset value, the driving rotary drum (151) and the winding drum (152) rotate relative to each other after the linkage structure is separated, and a first elastic piece is arranged between the bottom of the negative pressure pipe (142).

7. The wafer dispensing device of claim 6, wherein: the linkage structure comprises a clamping column (171) and a second elastic piece, wherein the clamping column (171) and the second elastic piece are connected to the driving rotary drum (151) in a sliding mode along the radial direction, a sliding groove (172) for the clamping column (171) to slide is formed in the inner wall of the driving rotary drum (151) along the radial direction, a limiting groove (175) for the clamping column (171) to be embedded into is formed in the outer wall of the winding drum (152), and the second elastic piece is arranged on the driving rotary drum (151) and used for driving the end portion of the clamping column (171) to be embedded into the limiting groove (175).

8. The wafer dispensing device of claim 6, wherein: the side wall of the winding drum (152) is provided with a guide groove (155) for embedding the linkage rope (153), and the width of the guide groove (155) is equal to the diameter of the linkage rope (153).

9. The wafer dispensing device of claim 7, wherein: the piston (143) divides the interior of the negative pressure pipe (142) into a suction cavity (156) and an exhaust cavity (157), a connecting rod (158) located in the exhaust cavity (157) is arranged on the piston (143), and one end of the linkage rope (153) is connected to the connecting rod (158).

10. A chip dispensing process is characterized in that: the method comprises the following steps:

s1: pre-sucking the glue, enabling the piston (143) to move towards one side of the glue outlet pipe (112) through a driving motor (154), enabling the driving motor (154) to rotate for a preset number of turns, enabling the first elastic piece to have elastic potential energy, and enabling the winding drum (152) and the driving rotary drum (151) to be fixed in the circumferential direction;

s2: plugging, so that the separating block (120) slides along the radial direction, the first separating cavity (121) is separated from the rubber outlet pipe (112), the second separating cavity (122) is matched with the rubber storage section (132), and the rubber pumping box (141) is matched with the lower side of the rubber storage section (132);

s3: glue is sucked, the driving motor (154) is continuously rotated, so that the separation tendency between the winding drum (152) and the driving rotary drum (151) is increased under the action of the first elastic piece, when the second elastic piece cannot keep the state that the clamping column (171) is embedded in the limiting groove (175), the piston (143) is reset at the moment, a negative pressure state is caused, and glue in the glue storage section (132) is sucked into the glue pumping box (141);

s4: resetting and glue spraying, wherein the separating block (120) is reset, at the moment, the first separating cavity (121) closes the central axis of the glue outlet pipe (112), and the glue outlet pipe (112) sprays glue on the glue dispensing plate (115);

s5: and (3) dispensing, wherein the glue is filled into the dispensing hole (116) through the sliding of the scraper (117), so that the purpose of dispensing the wafer is achieved.

Technical Field

The application relates to the technical field of nixie tube processing, in particular to a wafer dispensing device and a wafer dispensing process.

Background

The prior nixie tube mainly pastes a CHIP LED on a PCB through an SMT CHIP mounter to realize mounting and fixing. The color consistency of the actual CHIP LED is poor, that is, the uniformity of the emitted light is not good, which results in poor product quality.

Therefore, in many manufacturers at present, the color uniformity is controlled by adding light-permeable colloid such as fluorescent glue on the wafer. In addition, the luminous color of the wafer cannot be changed for the manufacturer, and the color of the wafer needs to be changed by a client.

However, at present, the wafer is mainly subjected to dispensing treatment through the needle cylinder manually, so that the efficiency is low and the production is influenced.

Disclosure of Invention

In order to improve the efficiency of dispensing chips, the application provides a chip dispensing device and a process thereof.

In a first aspect, the present application provides a wafer dispensing device, which adopts the following technical scheme: the utility model provides a wafer adhesive deposite device, includes a supporting bench, be provided with out the glued structure on the supporting bench, it includes out spouts gluey valve and establishes the play hose that spouts gluey valve discharge end to go out the glued structure, a supporting bench top is equipped with some offset plates, have the point gluey hole with the crystal one-to-one on some offset plates, it is used for spraying the colloid to some offset plates to go out the glued structure, it is connected with to slide to be used for filling the colloid to the downthehole scraper blade of point gluey to prop up supporting bench top.

Through adopting above-mentioned technical scheme, will go out the colloid blowout in the glue pipe through spouting gluey valve, the colloid will be sprayed on the point offset plate, can with the even forward propelling movement under the condition of same thickness of colloid through the motion of scraper blade, under the extrusion, the colloid covers on the wafer through a point hole of gluing, the efficiency of gluing can be improved greatly to such point mode of gluing to can also be through changing the shape in point gluey hole, can also the different wafer of adaptation, it is comparatively convenient.

Preferably, the glue outlet pipe is connected with a separation block which divides the glue outlet pipe into a glue outlet section and a glue storage section along the axial direction in a sliding manner along the radial direction, and the separation block is provided with a first separation cavity and a second separation cavity which are not communicated with each other;

the first partition cavity and the inner cavity of the rubber outlet pipe are coaxial, the partition block is provided with a rubber pumping assembly communicated with the second partition cavity, and the upper side of the second partition cavity is provided with a partition for sealing the rubber outlet section.

In the actual glue spraying process, the glue at the end of the glue outlet pipe can be solidified and hardened to some extent after the glue is cloudy and uneven in the initial stage and is discarded or is not worked for a long time, and when the glue outlet pipe is pushed by a scraper, the glue outlet pipe can be blocked and the glue outlet hole can be blocked by the hardened glue. Through adopting above-mentioned technical scheme, normally spout the axis that glues in-process first minute separate chamber and keep and go out the rubber tube and close, can spout gluey, and when needs remove gluey, make the partition block move, the second partition chamber is to closing and depositing gluey section, the spacer carries out the shutoff with the upside this moment, the accessible is taken out gluey subassembly and will be located the direct suction of colloid of depositing gluey section, will divide the block motion to make first minute separate chamber to closing the inner chamber of going out the rubber tube afterwards again, just this moment can normally go out gluey.

Preferably, the glue pumping assembly comprises a glue pumping box connected to the separation block and used for communicating with the lower side of the glue storage section, a negative pressure pipe connected to the glue pumping box, and a piston connected to the negative pressure pipe in a sliding manner, the separation block is provided with a vent hole communicated with the second separation cavity, the separation block is provided with a driving piece used for driving the piston to move, and the piston is intermittently moved by the driving piece and enables the glue to be separated from the second separation cavity to enter the glue pumping box.

Through adopting above-mentioned technical scheme, before glue is taken out to needs for the piston is close to out rubber tube one side at the intraductal motion of negative pressure, and makes this moment take out the gluey case to depositing gluey section, through the driving piece afterwards, makes the piston carry out intermittent motion, deposits gluey section downside and forms the negative pressure, gets into through the external atmosphere of air vent, thereby will deposit the colloid suction in the gluey section.

Preferably, the glue extracting box is connected with the separating block through a connecting rod, and the connecting rod is connected to the supporting table in a sliding mode along the radial direction;

when the central axes of the first partition chamber and the rubber outlet pipe are coincident, the lower end of the rubber outlet pipe is opened;

when the second separation cavity is coincident with the central axis of the glue outlet pipe, the glue extracting box is matched with the lower side of the glue storage section.

Through adopting above-mentioned technical scheme, can make only need to make the connecting rod, just can realize switching the demand of two kinds of states, or just separate the chamber intercommunication with first branch, or just separate the piece and will go out the shutoff in middle part of the rubber tube to separate the chamber through the second and with the colloid suction.

Preferably, the bottom of the glue extraction box is inclined and inclines downwards towards one side close to the negative pressure pipe, and the air inlet of the negative pressure pipe is higher than the lowest position of the glue extraction box.

Through adopting above-mentioned technical scheme, when taking the colloid out, will enter into earlier and take out in the gluey incasement to along the inclined plane landing, reduce the influence to the colloid direction of motion when bleeding.

Preferably, the driving part comprises a driving rotary drum rotatably connected to the outer wall of the negative pressure pipe, a winding drum penetrating through the driving rotary drum and rotatably connected to the negative pressure pipe, and a linkage rope with one end fixedly connected to the piston and the other end fixedly connected to the side wall of the winding drum, the separation block is provided with a driving motor for driving the driving rotary drum to rotate, the driving rotary drum is circumferentially fixed to the outer wall of the winding drum through a linkage structure, when the rotation resistance between the driving rotary drum and the winding drum is greater than a preset value, the driving rotary drum and the winding drum rotate relatively after the linkage structure is separated, and a first elastic part is arranged between the piston and the bottom of the negative pressure pipe.

Through adopting above-mentioned technical scheme, when driving motor rotates, will drive the initiative rotary drum in proper order, the reel rotates, and will link when rope progressively draws in, will drive the piston and move in the negative pressure pipe, first elastic component has elastic potential energy, then when the rolling resistance between initiative rotary drum and the reel is greater than the default, both will take place "skid", thereby relative rotation, the reel will take place to rotate this moment, the piston will be under the effect of first elastic component this moment, reset rapidly, thereby form the negative pressure at the negative pressure intraductal, the colloid will be sucked out this moment.

Preferably, the linkage structure includes a clamping column and a second elastic member, the clamping column and the second elastic member are connected to the driving rotary drum in a sliding manner along a radial direction, a sliding groove for the clamping column to slide along the radial direction is formed in the inner wall of the driving rotary drum, a limiting groove for the clamping column to be embedded into is formed in the outer wall of the winding drum, and the second elastic member is arranged on the driving rotary drum and used for driving the end portion of the clamping column to be embedded into the limiting groove.

Through adopting above-mentioned technical scheme, when normal use state, the second elastic component will order about the card post and imbed to the spacing inslot, and initiative rotary drum and reel circumference are fixed, and the pulling force as first elastic component crescent to transmit to the junction of card post and spacing groove through the linkage rope, when the tip of big to card post breaks away from the spacing groove, the reel will idle run.

Preferably, the side wall of the winding drum is provided with a guide groove for embedding the linkage rope, and the width of the guide groove is equal to the diameter of the linkage rope.

Through adopting above-mentioned technical scheme, when the reel draws in, the linkage rope will be embedded into to the guide way in, and because the restriction of width, twine at every turn and can not misplace the joint each other, can accomplish the action smoothly.

Preferably, the piston divides the negative pressure pipe into an air suction cavity and an air exhaust cavity, a connecting rod positioned in the air exhaust cavity is arranged on the piston, and one end of the linkage rope is connected to the connecting rod.

By adopting the technical scheme, the linkage rope can not pass through the air suction cavity in the retracting and releasing process, the airtightness in the air suction cavity can be ensured, and the influence on the movement of the piston is reduced.

On the other hand, the application provides a wafer dispensing process, which adopts the following technical scheme: a chip dispensing process comprises the following steps:

s1: pre-sucking glue, wherein the piston moves towards one side of the glue outlet pipe through a driving motor, the driving motor rotates for a preset number of turns, at the moment, the first elastic part has elastic potential energy, and the winding drum and the driving rotary drum are circumferentially kept fixed;

s2: plugging, so that the separating blocks slide along the radial direction, the first separating cavity is separated from the rubber outlet pipe, the second separating cavity is closed to the rubber storage section, and the rubber pumping box is closed to the lower side of the rubber storage section;

s3: sucking the glue, continuing to rotate the driving motor, so that the separation tendency between the winding drum and the driving rotary drum is increased under the action of the first elastic part, and when the second elastic part cannot keep the state that the clamping column is embedded in the limiting groove, the piston will reset at the moment to cause a negative pressure state, and the glue in the glue storage section will be sucked into the glue pumping box at the moment;

s4: resetting and spraying the glue, resetting the separating block, closing the central axis of the glue outlet pipe by the first separating cavity, and spraying the glue onto the glue dispensing plate by the glue outlet pipe;

s5: and dispensing, wherein the glue is filled into the dispensing hole through the sliding of the scraper, so that the purpose of dispensing the wafer is realized.

Through adopting above-mentioned technical scheme, can be through the mode of the comparatively even colloid of blowout, with the colloid earlier coating on some offset plates, rethread scraper blade covers holistic colloid to the wafer on, and can conform to the shape in some gluey holes, comparatively simple and convenient to raise the efficiency.

In summary, the present application includes at least one of the following beneficial technical effects:

1. in the dispensing process, the glue is firstly sprayed onto the dispensing plate, and is scraped into the dispensing holes through the scraper, so that the working efficiency is high, and the shapes of the dispensing holes can be customized, thereby being suitable for wafers of different shapes;

2. before glue is sprayed to the glue outlet pipe, the glue outlet pipe is partitioned by the partition blocks, and the glue in the glue storage section is pumped out, so that uniform glue with better quality can be sprayed out when the glue outlet pipe is sprayed with the glue;

3. through the initial acting force of the second elastic part, when the pulling force reaches a certain magnitude, the winding drum idles relative to the driving rotary drum, and at the moment, the piston can cause negative pressure in the negative pressure pipe, so that the colloid is drawn out.

Drawings

FIG. 1 is a schematic structural diagram of the present application;

FIG. 2 is a cross-sectional view of the glue extraction box and the spacer block;

FIG. 3 is a schematic view of the structure of the hose outlet;

FIG. 4 is an enlarged view of portion A of FIG. 1 to show the drive member;

FIG. 5 is a schematic view showing the connection between the driving drum and the winding drum.

Description of reference numerals: 100. a support table; 110. a glue outlet structure; 111. a glue spraying valve; 112. discharging the rubber tube; 113. a support; 114. mounting a plate; 115. dispensing a rubber plate; 116. dispensing holes; 117. a squeegee; 118. a slide rail; 119. an insert block; 120. a separation block; 121. a first compartment; 122. a second compartment; 123. a spacer; 124. an extension block; 131. a glue discharging section; 132. a glue storage section; 140. a glue pumping assembly; 141. a glue pumping box; 142. a negative pressure tube; 143. a piston; 144. a connecting rod; 150. a drive member; 151. a driving drum; 152. a reel; 153. a linkage rope; 154. a drive motor; 155. a guide groove; 156. an air suction cavity; 157. an exhaust chamber; 158. a connecting rod; 161. a first spring; 162. a second spring; 171. clamping the column; 172. a sliding groove; 173. a drive sleeve; 174. twisting the block; 175. a limiting groove.

Detailed Description

The present application is described in further detail below with reference to the attached drawings.

The utility model provides a wafer dispensing device, refers to fig. 1, including a supporting bench 100, be provided with out gluey structure 110 on the supporting bench 100, go out gluey structure 110 including spouting gluey valve 111 and establishing at the play hose 112 that spouts gluey valve 111 discharge end, install support 113 on the supporting bench 100, it is connected with mounting panel 114 to slide along the horizontal direction on support 113, spouts gluey valve 111 and the equal fixed mounting of play hose 112 on mounting panel 114, goes out the vertical setting of hose 112.

A dispensing plate 115 is disposed above the supporting table 100, a wafer is disposed below the dispensing plate 115, dispensing holes 116 corresponding to the wafers one to one are formed in the dispensing plate 115, the dispensing structure 110 is used for spraying the glue onto the dispensing plate 115, and a scraper 117 for filling the glue into the dispensing holes 116 is slidably connected above the supporting table 100.

Two slide rails 118 are arranged on the support table 100 in parallel, a screw structure is installed in the slide rails 118 and driven by a motor, and both ends of the scraper 117 are provided with inserts 119 in threaded engagement with the screw, so that the scraper 117 can slide along the length direction of the support table 100.

Referring to fig. 2 and 3, a separating block 120 is mounted on the rubber outlet pipe 112, the separating block 120 is connected to the rubber outlet pipe 112 in a sliding manner along a radial direction, and the separating block 120 has a width capable of plugging the inside of the rubber outlet pipe 112. A first partition chamber 121 and a second partition chamber 122 are arranged at intervals in the length direction of the partition block 120, the first partition chamber 121 and the second partition chamber 122 are not communicated with each other, the partition block 120 has two states when sliding, the first state is that the first partition chamber 121 is matched with the central axis of the glue outlet pipe 112, and the lower end of the glue outlet pipe 112 is open; and the second state is that the second separation chamber 122 is aligned with the central axis of the glue outlet pipe 112, and a spacer 123 is provided on the separation block 120 and above the second separation chamber 122. In the embodiment, the separating block 120 axially separates the rubber outlet pipe 112 into the rubber outlet section 131 and the rubber storage section 132 in the sliding process, when the second separating chamber 122 closes the central axis of the rubber outlet pipe 112, the lower side of the rubber outlet section 131 can be closed due to the action of the upper spacer 123, and the lower side of the second separating chamber 122 is communicated with the rubber storage section 132.

Meanwhile, a glue pumping assembly 140 communicated with the second separating cavity 122 is installed on the separating block 120 for pumping out the glue in the glue storing section 132. The glue extracting assembly 140 comprises a glue extracting box 141, a negative pressure pipe 142 and a piston 143, wherein the glue extracting box 141 is connected to the separating block 120 through a connecting rod 144, so that the glue extracting box 141 and the separating block 120 can move synchronously. The negative pressure pipe 142 is horizontally arranged and installed on the glue extracting box 141, the piston 143 is connected in the negative pressure pipe 142 in a sliding manner in a sealing manner, the partition block 120 is provided with a driving part 150 for driving the piston 143 to move, and a negative pressure environment can be created in the negative pressure pipe 142 through the movement of the piston 143, so that the glue in the glue storing section 132 is pumped into the glue extracting box 141.

After the motion, the upside of taking out gluey case 141 can with deposit gluey section 132 downside intercommunication to take out gluey case 141 bottom towards the slope, and for being close to negative pressure pipe 142 one side downward sloping, and the air inlet of negative pressure pipe 142 is higher than the lowest of taking out gluey case 141, make when taking out gluey colloid can be comparatively smooth and easy along the diapire downflow.

In this embodiment, the mounting plate 114 is also provided with a slide rail 118, in which a screw rod structure is also mounted, the separating block 120 is provided with an extending block 124 extending and screwed to the screw rod structure, when the motor works, the separating block 120 and the glue extracting box 141 can be driven together to move synchronously, and when the second separating cavity 122 is aligned with the central axis of the glue outlet pipe 112, the glue extracting box 141 is also aligned with the lower side of the glue storage section 132 synchronously.

Referring to fig. 2 and 4, the driving member 150 includes a driving drum 151 rotatably connected to an outer wall of the negative pressure pipe 142, a winding drum 152 inserted into the driving drum 151 and rotatably connected to the negative pressure pipe 142, and a linkage rope 153 having one end fixedly connected to the piston 143 and one end fixedly connected to a side wall of the winding drum 152, and a driving motor 154 for driving the driving drum 151 to rotate is installed on the negative pressure pipe 142. The side wall of the drum 152 is provided with a guide groove 155 for the interlocking rope 153 to be inserted, and the width of the guide groove 155 is equal to the diameter of the interlocking rope 153. At this time, the piston 143 divides the interior of the negative pressure tube 142 into a suction chamber 156 and an exhaust chamber 157, the piston 143 is provided with a link 158 located in the exhaust chamber 157, the link 158 penetrates through the end of the negative pressure tube 142, and one end of the linkage rope 153 is connected to the link 158 to form a linkage relationship.

Referring to fig. 2 and 5, the driving drum 151 is circumferentially fixed to an outer wall of the winding drum 152 through a linkage structure, when the driving drum 151 rotates, the winding drum 152 is driven to rotate together with the driving drum 151, so as to collect the linkage rope 153, the piston 143 slides in the negative pressure tube 142, in this embodiment, a first elastic member is disposed between the piston 143 and a bottom of the negative pressure tube 142, the first elastic member is a first spring 161, one end of the first spring 161 is fixedly connected to a side of the piston 143 away from the glue drawing box 141, the other end of the first spring 161 is fixedly connected to an inner wall of the negative pressure tube 142 away from the one end of the glue drawing box 141, the piston 143 is driven by the linkage rope 153 to move toward a side of the glue discharging tube 112, at this time, the first spring 161 will continuously stretch, when a rotational resistance between the driving drum 151 and the winding drum 152 is greater than a predetermined value, that is, when a resilience of the first spring 161 is too large, the linkage structure is disengaged, the driving drum 151 and the winding drum 152 rotate relatively, at this time, the piston 143 is suddenly restored to form a negative pressure in the negative pressure pipe 142.

Referring to fig. 5, the linkage structure includes a locking column 171 and a second elastic member slidably connected to the driving drum 151 in a radial direction, a sliding groove 172 for the locking column 171 to slide is radially formed on an inner wall of the driving drum 151, the sliding groove 172 penetrates through a side wall of the driving drum 151, a driving sleeve 173 is connected to the sliding groove 172 in a threaded manner, an outer wall of the driving sleeve 173 is connected to an inner wall of the sliding groove 172 in a threaded manner, the locking column 171 is slidably connected to the driving sleeve 173, the second elastic member is a second spring 162, two ends of the second spring 162 abut against the inner wall of the driving sleeve 173, the other end abuts against the locking column 171, a limiting groove 175 for the locking column 171 is formed on an outer wall of the winding drum 152, the locking column 171 is driven by the second spring 162 to have a tendency of being inserted into the limiting groove 175, the locking column 171 is cylindrical, the limiting groove 175 is close to a half-groove ball, and the driving drum 151 and the winding drum 152 are fixed in an axial direction, only relative rotation will occur.

On the end of the drive sleeve 173 remote from the winding drum 152, a screw block 174 in the form of a regular hexagon is provided, by means of which screw block 174 the drive sleeve 173 can be screwed or unscrewed, so that the pretension of the second spring 162 can be adjusted. When the driving drum 151 rotates, the resilience of the first spring 161 increases gradually, and when the pressing force of the first spring 161 on the clamping column 171 is insufficient, the end of the clamping column 171 will be disengaged from the limiting groove 175, at this time, the winding drum 152 will idle, and the piston 143 will return, and when the resilience of the first spring 161 is reduced to a value where the second spring 162 can keep the end of the clamping column 171 embedded in the limiting groove 175, at this time, the driving drum 151 will be circumferentially fixed with the winding drum 152, and the piston 143 can move again.

The implementation principle of the embodiment of the application is as follows: before glue spraying, the driving drum 151 is driven by the driving motor 154 to rotate to a critical value position which can be borne by the second spring 162, then the separating block 120 and the glue extracting box 141 are synchronously moved, so that the glue storing section 132 of the glue outlet pipe 112 is involuted with the glue extracting box 141, the driving motor 154 is continuously driven to rotate at the moment, the clamping column 171 is separated from the limiting groove 175, the piston 143 is reset under the action of the first spring 161 at the moment, the volume of the air suction cavity 156 is suddenly increased to form a negative pressure effect, and glue in the glue storing section 132 is sucked into the glue extracting box 141.

Subsequently, the separating block 120 and the glue extracting box 141 are translated, so that the first separating cavity 121 is aligned with the central axis of the glue outlet pipe 112, the lower side of the glue storage section 132 is open at this time, glue can be normally sprayed, and then the glue is filled into the glue dispensing hole 116 after the scraper 117 slides, so that the wafer is covered, and the production efficiency is improved.

Based on the above-mentioned wafer dispensing device, the embodiment of the application also discloses a wafer dispensing process, which comprises the following steps:

s1: pre-sucking the glue, moving the piston 143 towards the glue outlet pipe 112 side by the driving motor 154, and rotating the driving motor 154 for a predetermined number of turns, wherein the first elastic member has elastic potential energy, and the winding drum 152 and the driving rotary drum 151 are circumferentially kept fixed;

s2: plugging, so that the separating block 120 slides along the radial direction, the first separating cavity 121 is separated from the glue outlet pipe 112, the second separating cavity 122 is abutted to the glue storage section 132, and the glue pumping box 141 is abutted to the lower side of the glue storage section 132;

s3: sucking glue, continuing to rotate the driving motor 154, so that the tendency of disengagement between the winding drum 152 and the driving rotary drum 151 is increased under the action of the first elastic member, when the second elastic member cannot keep the state that the clamping column 171 is embedded in the limiting groove 175, the piston 143 will reset at the moment, so as to cause a negative pressure state, and at the moment, the glue in the glue storage section 132 will be sucked into the glue pumping box 141;

s4: resetting and glue spraying, resetting the separating block 120, closing the central axis of the glue outlet pipe 112 by the first separating chamber 121 at the moment, and spraying the glue onto the glue dispensing plate 115 by the glue outlet pipe 112;

s5: and dispensing, wherein the glue is filled into the dispensing hole 116 by the sliding of the scraper 117, thereby achieving the purpose of dispensing the wafer.

The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.