阅读说明：本技术 用于测量机械负载的传感器布置 (Sensor arrangement for measuring mechanical loads ) 是由 E·扎尼切利 于 2020-09-25 设计创作，主要内容包括：本发明涉及用于测量机械负载的传感器布置(1),包括-要被机械负载的第一构件(2)；-布置在第一构件(2)上的第一传感器组件(3)；-印刷电路板(PCB)(4)；-布置在PCB(4)上并且与第一传感器组件(3)隔开的第二传感器组件(5),其中第二传感器组件(5)的输出信号指示第一与第二传感器组件(3、5)之间的距离；以及-布置在PCB(4)上并且被配置成接收第二传感器组件(5)的输出信号的电子组件(11、12、13、14),其中传感器布置(1)被配置成使得第一与第二传感器组件(3、5)之间的距离(19)取决于施加到第一构件(2)的机械负载。(The invention relates to a sensor arrangement (1) for measuring a mechanical load, comprising-a first member (2) to be mechanically loaded; -a first sensor assembly (3) arranged on the first member (2); -a Printed Circuit Board (PCB) (4); -a second sensor assembly (5) arranged on the PCB (4) and spaced apart from the first sensor assembly (3), wherein an output signal of the second sensor assembly (5) is indicative of a distance between the first and second sensor assemblies (3, 5); and-an electronic component (11, 12, 13, 14) arranged on the PCB (4) and configured to receive an output signal of the second sensor assembly (5), wherein the sensor arrangement (1) is configured such that a distance (19) between the first and second sensor assemblies (3, 5) is dependent on a mechanical load applied to the first member (2).)

1. A sensor arrangement (1) for measuring mechanical loads, comprising

-a first member (2) to be mechanically loaded;

-a first sensor assembly (3) arranged on the first member (2);

-a Printed Circuit Board (PCB) (4);

-a second sensor assembly (5) arranged on the PCB (4) and spaced apart from the first sensor assembly (3), wherein an output signal of the second sensor assembly (5) is indicative of a distance between the first and second sensor assemblies (3, 5); and

-electronic components (11, 12, 13, 14) arranged on the PCB (4) and configured to receive an output signal of the second sensor component (5),

wherein the sensor arrangement (1) is configured such that the distance (19) between the first and second sensor components (3, 5) is dependent on a mechanical load applied to the first member (2).

2. A sensor arrangement (1) according to claim 1, wherein the first sensor component (3) comprises a magnetic material and the second sensor component (5) is configured to sense a magnetic field strength of the magnetic material.

3. A sensor arrangement (1) according to claim 2, wherein the second sensor component (5) comprises an inductive sensor, a hall sensor or a magneto-resistive sensor.

4. A sensor arrangement (1) according to any one of the preceding claims, further comprising a first wall (7) and an opposite second wall (8), wherein the first end (20) of the PCB (4) is attached to the first wall (7) in a cantilever manner and the second sensor component (5) is arranged on the second end (21) of the PCB (4).

5. A sensor arrangement (1) according to any one of the preceding claims, wherein in an unloaded state of the first member (2), the first member (2) and the PCB (4) extend substantially parallel to each other.

6. A sensor arrangement (1) according to any one of the preceding claims, characterized in that the sensor arrangement (1) is configured such that the distance between the first sensor component (3) and the second sensor component (5) decreases or increases when a mechanical load is applied to the first member (2).

7. A sensor arrangement (1) according to any one of the preceding claims, further comprising a second member (6), the PCB (4) being arranged in a cavity (22) between the first member (2) and the second member (6).

8. A sensor arrangement (1) according to claim 7, wherein the first member (2) and the PCB (6) extend parallel to each other in a loaded and unloaded state of the first member (2).

9. The sensor arrangement (1) according to any one of the preceding claims, when they depend on claims 4 and 8, further comprising a housing (10) surrounding the PCB (4), wherein the first member (2), the second member (6), the first wall (7) and the second wall (8) are part of the housing (10).

10. A sensor arrangement (1) according to any one of the preceding claims, wherein the electronic component (11, 12, 13, 14) comprises at least one of an analog-to-digital converter (11), a processing unit (12), a storage unit (13) and a communication unit (14).

11. A sensor arrangement (1) according to any one of the preceding claims, further comprising a fixing means (23) for fixing the sensor arrangement (1) to a structure (24) in a cantilever manner.

12. A sensor arrangement (1) according to any one of the preceding claims, wherein the PCB (4) is positioned relative to the first member (2) such that the position of the second sensor assembly (5) remains constant independent of mechanical loads applied to the first member (2).

13. A sensor arrangement (1) according to any one of claims 1-11, wherein the PCB (4) comprises a slot (17) defining a tongue (16), and a frame (18) surrounding the tongue (16), wherein the frame (18) is attached to the first wall (7) and the second wall (8), and the second sensor component (5) is arranged on the tongue (16) such that the position of the second sensor component (5) depends on the mechanical load applied to the first member (2).

14. Sensor arrangement (1) according to claim 14, characterized in that the groove (17) and/or the tongue (16) are substantially U-shaped or C-shaped.

15. A machine for carrying variable loads, the machine having a sensor arrangement (1) as claimed in any one of the preceding claims.