阅读说明：本技术 一种精准定位受力、灵敏度可调的柔性触觉传感器 (Flexible touch sensor with accurate positioning stress and adjustable sensitivity ) 是由 董林玺 吴宣邑 杨伟煌 刘超然 于 2020-12-08 设计创作，主要内容包括：本发明公开了一种精准定位受力、灵敏度可调的柔性触觉传感器。本发明包括PDMS柔性衬底、石墨烯电极、PDMS微结构介电层。结构上分为上中下层,上层是PDMS与图案化石墨烯电极混合层,中层是由浇筑于微结构硅模具中成型的PDMS微结构介电层,下层的结构、材料与上层相同,空间上是由上层翻转后水平面旋转90°。本发明主要采用PDMS材料和石墨烯材料构成,在衬底与电介质材料上统一选用PDMS材料可最大程度上保证传感器的柔性弯曲与拉伸特性,可安装在具有不同弧度的机械手上,又基于其可实现精准受力定位的特点,可安装在鞋垫等通过受力区域捕捉、分析人体生理信号的位置。(The invention discloses a flexible touch sensor with accurate positioning stress and adjustable sensitivity. The device comprises a PDMS flexible substrate, a graphene electrode and a PDMS microstructure dielectric layer. The structure of the micro-structured silicon die is divided into an upper layer, a middle layer and a lower layer, the upper layer is a mixed layer of PDMS and a patterned graphene electrode, the middle layer is a PDMS micro-structured dielectric layer formed by pouring in the micro-structured silicon die, the structure and the material of the lower layer are the same as those of the upper layer, and the lower layer is spatially rotated by 90 degrees from the horizontal plane after being overturned by the upper layer. The sensor mainly comprises PDMS materials and graphene materials, the PDMS materials are uniformly selected on the substrate and the dielectric materials, the flexible bending and stretching characteristics of the sensor can be guaranteed to the greatest extent, the sensor can be mounted on mechanical arms with different radians, and can be mounted at positions of insoles and the like for capturing and analyzing human physiological signals through stress areas based on the characteristic that the sensor can realize accurate stress positioning.)

1. The utility model provides a flexible touch sensor of accurate location atress, sensitivity adjustable capacitanc, contains a plurality of sensing units, and every sensing unit adopts three layer construction under well, its characterized in that:

the upper layer structure comprises a PDMS film used as a substrate and two-dimensional graphene used as an electrode;

the middle layer structure is a PDMS microstructure dielectric layer as an insulator;

the structure and the material of the lower layer are the same as those of the upper layer, the upper layer structure is turned over in space and then the horizontal plane is rotated by 90 degrees, two electrodes which are vertical to each other are formed together with the upper layer structure, and the central circular areas of the two electrodes are capacitor units;

the graphene electrode in the upper layer structure and the graphene electrode in the lower layer structure form an upper polar plate and a lower polar plate of the capacitor, a boss of the dielectric layer is used as a support between the electrodes, and an air medium is formed between the polar plates.

2. The capacitive flexible touch sensor of claim 1, wherein: the bosses of the dielectric layer are arranged in a radial shape, the stress deformation condition of the device is changed by changing the size, the arrangement density and the arrangement included angle of the bosses, and then the change of the sensitivity is adjusted, so that the sensor is suitable for more occasions.

3. The capacitive flexible touch sensor of claim 1, wherein:

the boss of the dielectric layer enables the capacitor unit to be deformed easily after being stressed, and meanwhile, unloading of external stress of the capacitor unit is achieved, and therefore accurate stress positioning is achieved.

Technical Field

The invention relates to the field of flexible touch sensors, in particular to a flexible touch sensor with accurate positioning stress and adjustable sensitivity; the sensor takes graphene as an electrode and a flexible material as a substrate, and innovations are arranged on bosses of a dielectric layer, so that high sensitivity is achieved, and the influence of stress outside a monitoring area can be eliminated.

Background

Today's social information technology is changing day by day. New technologies such as internet, cloud computing, big data, artificial intelligence and the like are full of all corners of the society. Intelligent robots, household appliances, vending machines, mobile phones, computers and various media carriers in industrial production and daily life begin a 'tactile revolution'. The touch is caused by the pressure and traction force acting on the receptor on the surface of the organism, and is one of the important means for the organism to obtain information from the external environment.

The demand for tactile information has prompted sensing technology. The flexible touch sensor is an electronic device for converting a touch signal into an electric signal, and has great application prospects in the fields of wearable electronic equipment, health monitoring, motion monitoring, software robots, human-computer interaction, artificial intelligence and the like. Scientists have demonstrated that microstructures are effective in improving the performance of flexible capacitive touch sensors, for example, micro-pyramid structures have been used to fabricate ultra-sensitive flexible touch sensors. However, these microstructures are usually prepared by conventional photolithography and chemical etching methods, and are complicated, time-consuming and expensive. It is currently a challenge to produce low cost, simple, high performance flexible tactile sensors.

The development of sensitive, flexible and transparent touch sensors is a hot research point for the next generation of flexible displays and human-computer interfaces. While some materials and structural designs have been previously developed for high performance tactile sensors, achieving flexibility, full transparency, and high sensitivity multi-point identification without crosstalk remains a significant challenge for such systems.

Compared with a resistance type touch sensing mechanism, the capacitance type touch sensor has the advantages of temperature independence, low power consumption, good long-term signal drift stability, easiness in multi-point identification and the like. In general, the structure of a capacitive sensor consists of two parallel electrodes with a dielectric layer in between. A highly compressible dielectric material is necessary to achieve high sensitivity, the lower the young's modulus of the dielectric, the greater the deformation of the sensor under pressure, resulting in a greater change in capacitance. Therefore, efforts have been made to use low young's modulus elastomers as dielectric materials, including Polydimethylsiloxane (PDMS), polyurethane, or Ecoflex. However, these low modulus elastomers also tend to have high viscoelasticity, slowing their response and relaxation times. To overcome this limitation and further increase sensitivity, some tactile sensors employ a dielectric layer structured by sequentially fabricating microstructured surfaces. Microstructured dielectric layers allow greater deformation at isostatic pressures, resulting in higher sensitivity and faster response/relaxation times than conventional dielectric layers. However, such media designs have inherent disadvantages such as complicated fabrication, cross-talk between adjacent cells, and deterioration in transparency. These disadvantages can be ameliorated by replacing the dielectric layer with an air gap between surrounding spacers in each haptic cell. Another limiting factor of existing capacitive sensors is that most of them still rely on opaque or brittle materials as electrodes, thereby hindering their application to truly flexible and transparent touch sensors. The flexibility and transparency of the substrate and electrodes to accommodate the overall capacitive touch sensor highlights the importance of careful selection of electrode materials. Among the various candidate materials for tactile sensor electrodes, single-layer graphene is a promising material when flexibility and transparency are required. Due to the high strain-to-break (>20%) and high transmittance (> 97.5%) of graphene, many graphene-based tactile sensors have been reported so far, but most utilize graphene as piezoresistive or resistive sensing elements. While previous work has shown high performance with sufficient flexibility and transparency, these devices still suffer from the limitations of conventional piezoresistive and resistive tactile sensors. Therefore, it is desirable to develop a tactile sensor that overcomes the limitations of existing devices and provides better performance.

Disclosure of Invention

In order to solve the problems in the prior art, the invention adopts the following technical scheme:

the invention comprises a plurality of sensing units which can be arranged in M rows by N columns, and the minimum sensing unit can be distributed in a sensitive area needing to detect force, thereby realizing the stress of a precise capture area. Each sensing unit comprises an upper layer structure, a middle layer structure and a lower layer structure. The upper layer structure comprises a PDMS film serving as a substrate and two-dimensional graphene serving as an electrode, the middle layer structure is a PDMS microstructure dielectric layer serving as an insulator, the structure and the material of the lower layer are the same as those of the upper layer, the upper layer is turned over in space and then rotates by 90 degrees on the horizontal plane, two electrodes which are perpendicular to each other are formed on the top view of the device, and the central circular area is a capacitor unit.

Preferably, a two-dimensional graphene is manufactured by using a CVD method as an electrode, and then the patterned graphene electrode is transferred to a PDMS flexible substrate, thereby realizing a graphene/PDMS thin film.

Preferably, the preparation method of the PDMS flexible substrate and the microstructure dielectric layer comprises the following steps:

(a) mixing Sylgard 184 PDMS and a curing agent in a ratio of 10:1, and fully stirring;

(b) standing the PDMS mixed solution, and putting the PDMS mixed solution into a vacuum box to remove bubbles in the solution;

(c) uniformly coating the PDMS mixed solution with bubbles removed on a carrier by using a spin coater;

(d) placing the carrier and the uniformly coated PDMS mixed solution in a drying oven;

(e) the support was separated from the cured PDMS.

Preferably, the temperature of the vacuum box in step (b) should not exceed room temperature, and is preferably controlled to be below 25 ℃.

Preferably, the time of the spin coater in the step (c) during slow rotation is not too short, and the spin coater only needs to have 60s-90s, so that the spin coater has enough time to prepare for high-speed rotation.

Preferably, the carrier is pre-sprayed with a dry fluorine release agent to make release easier in later operations.

Preferably, the temperature in step (d) is not too low, resulting in too long a curing time, nor too high a curing time, which affects the toughness of the material, and may be 70 ° to 90 ° for one hour.

A method of making the capacitive flexible touch sensor, comprising the steps of:

(1) preparing a graphene electrode;

(2) a graphene electrode to a PDMS flexible substrate;

(3) PDMS mixed solution;

(4) performing vacuum defoaming on the PDMS mixed solution;

(5) filling the microstructure silicon mold with PDMS mixed solution;

(6) and the PDMS dielectric layer demoulded from the silicon mould is jointed and connected with the two layers of graphene electrode/PDMS mixed films, so that the high-sensitivity capacitive flexible touch sensor with accurate stress positioning can be realized.

The invention has the beneficial effects that:

1. the plurality of sensing elements are arranged in M rows by N columns to form any number of row and column combinations of the sensing array, and the pixelated sensor array successfully identifies any spatial distribution of applied pressure.

2. The invention can easily control the sensitivity and the sensing range by adjusting the size, the arrangement density and the arrangement included angle of the bosses of the dielectric layer, prevents the crosstalk between adjacent units by the structural isolation of the spacers to each unit, and also prevents the influence of the external stress of each unit on the inside of the unit.

3. According to the invention, the bosses of the dielectric layer are of a radial structure outwards from the center of the detection unit (namely the capacitance parts formed by the upper graphene electrode, the lower graphene electrode and the dielectric layer), the distance between the bosses is increased along with the distance from the center of the detection unit, so that the gap parts between the bosses in the sensor are easier to deform, and the stress of the supporting part outside the detection unit is led to the outside along the overhead channels of the bosses, so that the influence in the detection unit is reduced to be ignored, and accurate stress positioning is realized.

4. The invention mainly adopts PDMS material and graphene material, the graphene has high breaking strain (>20%) and high transmittance (nearly 97.5%), the Young modulus of PDMS is about 2Mpa, and the light transmittance is more than 92%. On the one hand, the transparency of the sensor is ensured, and on the other hand, the bending and stretching flexibility characteristics are also ensured to a great extent.

Drawings

Fig. 1 is a schematic diagram of a disassembled structure of a sensing unit of the present invention.

Fig. 2 is a diagram of four silicon dies for dielectric layers of the present invention.

Fig. 3 is a schematic diagram of an array sensor of the present invention comprising 4 x 4 sensor cells.

Fig. 4 is a graph comparing the force and capacitance curves of the sensor composed of the 6 structure in fig. 2 and the sensor composed of the 7 structure in fig. 2.

Fig. 5 is a graph comparing the force and capacitance curves of the sensor composed of the 6 structure in fig. 2 and the sensor composed of the 8 structure in fig. 2.

Fig. 6 is a graph comparing the force and capacitance curves of the sensor composed of the structure 6 in fig. 2 and the sensor composed of the structure 9 in fig. 2.

Description of reference numerals: 1-an upper layer of PDMS substrate; 2-upper graphene electrodes; 3-a dielectric layer; 4-lower graphene electrodes; 5-lower PDMS substrate; 6-dielectric layer silicon die with boss diameter of 70 μm, boss arrangement interval of 35 μm and boss arrangement included angle of 30 °; 7-dielectric layer silicon die with boss diameter of 85 μm, boss arrangement interval of 20 μm and boss arrangement included angle of 30 °; 8-dielectric layer silicon die with boss diameter of 70 μm, boss arrangement interval of 70 μm and boss arrangement included angle of 30 °; 9-dielectric layer silicon die with boss diameter of 70 μm, boss arrangement interval of 35 μm and boss arrangement included angle of 22.5 degrees; 10-boss diameter; 11-boss arrangement spacing; 12-convex plate arrangement included angle.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

A sensitivity-adjustable capacitive flexible touch sensor capable of realizing accurate stress positioning comprises a plurality of sensing units arranged in M rows by N columns, wherein each sensing unit comprises an upper-layer PDMS substrate 1, an upper-layer graphene electrode 2, a dielectric layer 3, a lower-layer graphene electrode 4 and a lower-layer PDMS substrate 5.

The boss of the dielectric layer supports the part except the sensing unit electrode, so that the detection unit (namely the capacitance part formed by the upper graphene electrode, the lower graphene electrode and the dielectric layer) is easier to deform after being stressed. This structure also can realize the uninstallation to the outer atress of detecting element simultaneously, the outer power of detecting element because the existence of radial channel will be along the built on stilts channel drainage of boss to the outside, so falls to neglecting to the influence in the detecting element to realize accurate atress location.

The bosses of the dielectric layer are arranged in a radial shape, so that the influence of the stress outside the detection unit on the output signal of the capacitance sensor can be effectively eliminated. Under the condition that the maximum change value is not changed due to the stress of the capacitor, the stress deformation condition of the device can be changed by changing the size, the arrangement density and the arrangement included angle of the lug boss, and then the change of the sensitivity is adjusted, so that the sensor is suitable for more occasions.

The sensor is made of PDMS materials except electrodes, and highly compressible dielectric materials are necessary for obtaining high sensitivity; the lower the Young's modulus of the medium, the greater the deformation and thus the change in capacitance that results when pressure is applied to the sensor. Therefore, PDMS materials with low young's modulus are used.

Example 1

A can realize the accurate stress positioning's the flexible tactile sensor manufacturing approach of capacitanc of sensitivity adjustable, the dielectric layer boss structure is: the method comprises the following steps of forming bosses with the diameter of 70 mu m, the boss arrangement interval of 35 mu m and the boss arrangement included angle of 30 degrees:

(1) firstly, preparing a graphene/PDMS film;

putting the germanium (110) substrate into a furnace, introducing hydrogen and argon or nitrogen for protection, heating to about 1000 ℃, stabilizing the temperature, and keeping the temperature for about 20 min; then stopping introducing the protective gas, introducing carbon source (such as methane) gas, and finishing the reaction for about 30 min; cutting off a power supply, closing the methane gas, introducing protective gas to exhaust the methane gas, cooling the tube to room temperature under the environment of the protective gas, and taking out the germanium (110) substrate to obtain the graphene on the germanium (110) substrate. And carrying out ICP etching to obtain the germanium (110) substrate carrying the patterned graphene.

And spin-coating Polydimethylsiloxane (PDMS) on the surface of the graphene to serve as a supporting layer, then immersing the graphene into a proper chemical solution to corrode the germanium substrate, and fishing the graphene/PDMS film to distilled water to clean the graphene/PDMS film after the germanium substrate is corroded.

The same method was used to obtain the underlying graphene/PDMS film.

(2) Then, manufacturing a PDMS dielectric layer;

referring to fig. 2, the filling material of the dielectric layer silicon mold 6 is manufactured:

(a) mixing Sylgard 184 PDMS and a curing agent in a ratio of 10:1, and fully stirring;

(b) standing the PDMS mixed solution, and putting the PDMS mixed solution into a vacuum box to remove bubbles in the solution;

(c) uniformly coating the PDMS mixed solution with bubbles removed on a carrier by using a spin coater;

(d) placing the carrier and the uniformly coated PDMS mixed solution in a drying oven;

(e) separating the carrier from the cured PDMS;

removing the residual micro-bubbles in the filling material in the step (b) to fully fill the PDMS liquid mixture. The temperature of the vacuum box can not exceed the room temperature and is controlled below 25 ℃.

In the step (c), the spin coater is kept at 60-90 s during the slow rotation of the ring, so that the spin coater has enough time to prepare for high-speed rotation. The silicon mold may be pre-sprayed with a dry fluorine release agent to facilitate release of the filler material from the silicon mold.

The temperature in step (d) was maintained at 85 ℃ for one hour. And completely curing the dielectric layer filling the groove.

And (5) stripping the mold after the filler is cured, and finishing the manufacturing of the dielectric layer.

(3) And finally, placing the bottom graphene/PDMS film on the bottom of the alignment platform, placing the dielectric layer on the top of the alignment platform, slowly reducing the height of the dielectric layer through the alignment platform, controlling the position and the angle of the dielectric layer, attaching the dielectric layer to the graphene/PDMS film, extruding the air in the middle of the graphene/PDMS film, and keeping the sample still after the graphene/PDMS and the dielectric layer are completely attached for 15 min. The top graphene/PDMS film is placed on the top of the alignment platform, the height of the dielectric layer is slowly reduced through the alignment platform, the position and the angle of the dielectric layer are controlled, the dielectric layer is attached to the graphene/PDMS/dielectric layer, air does not need to be squeezed, and contact is guaranteed. And (3) placing the sample on a heating table, and heating at 70 ℃ for 20min to obtain the capacitive flexible touch sensor.

Example 2

A can realize the accurate stress positioning's the flexible tactile sensor manufacturing approach of capacitanc of sensitivity adjustable, the dielectric layer boss structure is: the method comprises the following steps of forming bosses with the diameter of 85 micrometers, the boss arrangement interval of 20 micrometers and the boss arrangement included angle of 30 degrees:

(1) firstly, preparing a graphene/PDMS film;

putting the germanium (110) substrate into a furnace, introducing hydrogen and argon or nitrogen for protection, heating to about 1000 ℃, stabilizing the temperature, and keeping the temperature for about 20 min; then stopping introducing the protective gas, introducing carbon source (such as methane) gas, and finishing the reaction for about 30 min; cutting off a power supply, closing the methane gas, introducing protective gas to exhaust the methane gas, cooling the tube to room temperature under the environment of the protective gas, and taking out the germanium (110) substrate to obtain the graphene on the germanium (110) substrate. And carrying out ICP etching to obtain the germanium (110) substrate carrying the patterned graphene.

And spin-coating Polydimethylsiloxane (PDMS) on the surface of the graphene to serve as a supporting layer, then immersing the graphene into a proper chemical solution to corrode the germanium substrate, and fishing the graphene/PDMS film to distilled water to clean the graphene/PDMS film after the germanium substrate is corroded.

The same method was used to obtain the underlying graphene/PDMS film.

(2) Then, manufacturing a PDMS dielectric layer;

referring to fig. 2, the filling material of the dielectric layer silicon mold 7 is manufactured:

(a) mixing Sylgard 184 PDMS and a curing agent in a ratio of 10:1, and fully stirring;

(b) standing the PDMS mixed solution, and putting the PDMS mixed solution into a vacuum box to remove bubbles in the solution;

(c) uniformly coating the PDMS mixed solution with bubbles removed on a carrier by using a spin coater;

(d) placing the carrier and the uniformly coated PDMS mixed solution in a drying oven;

(e) separating the carrier from the cured PDMS;

removing the residual micro-bubbles in the filling material in the step (b) to fully fill the PDMS liquid mixture. The temperature of the vacuum box can not exceed the room temperature and is controlled below 25 ℃.

In the step (c), the spin coater is kept at 60-90 s during the slow rotation of the ring, so that the spin coater has enough time to prepare for high-speed rotation. The silicon mold may be pre-sprayed with a dry fluorine release agent to facilitate release of the filler material from the silicon mold.

The temperature in step (d) was maintained at 85 ℃ for one hour. And completely curing the dielectric layer filling the groove.

And (5) stripping the mold after the filler is cured, and finishing the manufacturing of the dielectric layer.

(3) And finally, placing the bottom graphene/PDMS film on the bottom of the alignment platform, placing the dielectric layer on the top of the alignment platform, slowly reducing the height of the dielectric layer through the alignment platform, controlling the position and the angle of the dielectric layer, attaching the dielectric layer to the graphene/PDMS film, extruding the air in the middle of the graphene/PDMS film, and keeping the sample still after the graphene/PDMS and the dielectric layer are completely attached for 15 min. The top graphene/PDMS film is placed on the top of the alignment platform, the height of the dielectric layer is slowly reduced through the alignment platform, the position and the angle of the dielectric layer are controlled, the dielectric layer is attached to the graphene/PDMS/dielectric layer, air does not need to be squeezed, and contact is guaranteed. And (3) placing the sample on a heating table, and heating at 70 ℃ for 20min to obtain the capacitive flexible touch sensor.

Referring to fig. 4, the increase of the boss diameter enables the sensor to have a wider working range under the condition that the maximum capacitance variation is not changed.

Example 3

A can realize the accurate stress positioning's the flexible tactile sensor manufacturing approach of capacitanc of sensitivity adjustable, the dielectric layer boss structure is: the method comprises the following steps of forming bosses with the diameter of 70 mu m, the boss arrangement interval of 70 mu m and the boss arrangement included angle of 30 degrees:

(1) firstly, preparing a graphene/PDMS film;

putting the germanium (110) substrate into a furnace, introducing hydrogen and argon or nitrogen for protection, heating to about 1000 ℃, stabilizing the temperature, and keeping the temperature for about 20 min; then stopping introducing the protective gas, introducing carbon source (such as methane) gas, and finishing the reaction for about 30 min; cutting off a power supply, closing the methane gas, introducing protective gas to exhaust the methane gas, cooling the tube to room temperature under the environment of the protective gas, and taking out the germanium (110) substrate to obtain the graphene on the germanium (110) substrate. And carrying out ICP etching to obtain the germanium (110) substrate carrying the patterned graphene.

And spin-coating Polydimethylsiloxane (PDMS) on the surface of the graphene to serve as a supporting layer, then immersing the graphene into a proper chemical solution to corrode the germanium substrate, and fishing the graphene/PDMS film to distilled water to clean the graphene/PDMS film after the germanium substrate is corroded.

The same method was used to obtain the underlying graphene/PDMS film.

(2) Then, manufacturing a PDMS dielectric layer;

referring to fig. 2, the filling material of the dielectric layer silicon mold 8 is manufactured:

(a) mixing Sylgard 184 PDMS and a curing agent in a ratio of 10:1, and fully stirring;

(b) standing the PDMS mixed solution, and putting the PDMS mixed solution into a vacuum box to remove bubbles in the solution;

(c) uniformly coating the PDMS mixed solution with bubbles removed on a carrier by using a spin coater;

(d) placing the carrier and the uniformly coated PDMS mixed solution in a drying oven;

(e) separating the carrier from the cured PDMS;

removing the residual micro-bubbles in the filling material in the step (b) to fully fill the PDMS liquid mixture. The temperature of the vacuum box can not exceed the room temperature and is controlled below 25 ℃.

In the step (c), the spin coater is kept at 60-90 s during the slow rotation of the ring, so that the spin coater has enough time to prepare for high-speed rotation. The silicon mold may be pre-sprayed with a dry fluorine release agent to facilitate release of the filler material from the silicon mold.

The temperature in step (d) was maintained at 85 ℃ for one hour. And completely curing the dielectric layer filling the groove.

And (5) stripping the mold after the filler is cured, and finishing the manufacturing of the dielectric layer.

(3) And finally, placing the bottom graphene/PDMS film on the bottom of the alignment platform, placing the dielectric layer on the top of the alignment platform, slowly reducing the height of the dielectric layer through the alignment platform, controlling the position and the angle of the dielectric layer, attaching the dielectric layer to the graphene/PDMS film, extruding the air in the middle of the graphene/PDMS film, and keeping the sample still after the graphene/PDMS and the dielectric layer are completely attached for 15 min. The top graphene/PDMS film is placed on the top of the alignment platform, the height of the dielectric layer is slowly reduced through the alignment platform, the position and the angle of the dielectric layer are controlled, the dielectric layer is attached to the graphene/PDMS/dielectric layer, air does not need to be squeezed, and contact is guaranteed. And (3) placing the sample on a heating table, and heating at 70 ℃ for 20min to obtain the capacitive flexible touch sensor.

Referring to fig. 5, the decrease of the arrangement density of the bosses enables the sensitivity of the sensor to be improved under the condition that the maximum capacitance variation is not changed.

Example 4

A can realize the accurate stress positioning's the flexible tactile sensor manufacturing approach of capacitanc of sensitivity adjustable, the dielectric layer boss structure is: the diameter of the bosses is 70 μm, the arrangement distance of the bosses is 35 μm, and the arrangement included angle of the bosses is 22.5 degrees, and the method comprises the following steps:

(1) firstly, preparing a graphene/PDMS film;

putting the germanium (110) substrate into a furnace, introducing hydrogen and argon or nitrogen for protection, heating to about 1000 ℃, stabilizing the temperature, and keeping the temperature for about 20 min; then stopping introducing the protective gas, introducing carbon source (such as methane) gas, and finishing the reaction for about 30 min; cutting off a power supply, closing the methane gas, introducing protective gas to exhaust the methane gas, cooling the tube to room temperature under the environment of the protective gas, and taking out the germanium (110) substrate to obtain the graphene on the germanium (110) substrate. And carrying out ICP etching to obtain the germanium (110) substrate carrying the patterned graphene.

And spin-coating Polydimethylsiloxane (PDMS) on the surface of the graphene to serve as a supporting layer, then immersing the graphene into a proper chemical solution to corrode the germanium substrate, and fishing the graphene/PDMS film to distilled water to clean the graphene/PDMS film after the germanium substrate is corroded.

The same method was used to obtain the underlying graphene/PDMS film.

(2) Then, manufacturing a PDMS dielectric layer;

referring to fig. 2, the filling material for manufacturing the dielectric layer silicon mold 9:

(a) mixing Sylgard 184 PDMS and a curing agent in a ratio of 10:1, and fully stirring;

(b) standing the PDMS mixed solution, and putting the PDMS mixed solution into a vacuum box to remove bubbles in the solution;

(c) uniformly coating the PDMS mixed solution with bubbles removed on a carrier by using a spin coater;

(d) placing the carrier and the uniformly coated PDMS mixed solution in a drying oven;

(e) separating the carrier from the cured PDMS;

removing the residual micro-bubbles in the filling material in the step (b) to fully fill the PDMS liquid mixture. The temperature of the vacuum box can not exceed the room temperature and is controlled below 25 ℃.

In the step (c), the spin coater is kept at 60-90 s during the slow rotation of the ring, so that the spin coater has enough time to prepare for high-speed rotation. The silicon mold may be pre-sprayed with a dry fluorine release agent to facilitate release of the filler material from the silicon mold.

The temperature in step (d) was maintained at 85 ℃ for one hour. And completely curing the dielectric layer filling the groove.

And (5) stripping the mold after the filler is cured, and finishing the manufacturing of the dielectric layer.

(3) And finally, placing the bottom graphene/PDMS film on the bottom of the alignment platform, placing the dielectric layer on the top of the alignment platform, slowly reducing the height of the dielectric layer through the alignment platform, controlling the position and the angle of the dielectric layer, attaching the dielectric layer to the graphene/PDMS film, extruding the air in the middle of the graphene/PDMS film, and keeping the sample still after the graphene/PDMS and the dielectric layer are completely attached for 15 min. The top graphene/PDMS film is placed on the top of the alignment platform, the height of the dielectric layer is slowly reduced through the alignment platform, the position and the angle of the dielectric layer are controlled, the dielectric layer is attached to the graphene/PDMS/dielectric layer, air does not need to be squeezed, and contact is guaranteed. And (3) placing the sample on a heating table, and heating at 70 ℃ for 20min to obtain the capacitive flexible touch sensor.

Referring to fig. 6, the reduction of the arrangement angle of the bosses enables the working range of the sensor to be enlarged under the condition that the maximum capacitance variation is not changed.

The working process of the invention is as follows: with reference to fig. 1 and 3, when a force acts on the sensor, the electrode portion of the sensing unit is forced to move down, so that the distance between the capacitor plates is decreased, and the capacitance value is increased, and at this time, the force acting outside the electrode portion of the sensing unit is guided out by the hollow portion of the included angle of the radial boss, so that the external force of the electrode portion does not affect the electrode portion, and the crosstalk between the sensing units is avoided. The existence that has the radial boss not only can make this sensor possess the characteristics of high sensitivity, still guarantees its high sensitivity and guarantees great working range simultaneously, can not lead to the sensor to measure because of the atress is too big and reach the saturation.

In conclusion, the sensor is flexible, completely transparent, high in sensitivity and capable of realizing accurate acceptance and positioning. By adjusting the structural dimensions of the sensor, the sensitivity and sensing range can be easily controlled. The structural isolation of each cell by the spacers prevents cross talk between adjacent cells. The radial bosses can effectively decompose the stress outside the detection unit (namely the capacitance part formed by the upper graphene electrode, the lower graphene electrode and the dielectric layer) and decompose the stress to the maximum extent in a mode of causing the collapse of the boss gap structure. Thus, the pixelated sensor array successfully identifies the spatial distribution of any applied pressure, and the tactile sensor will provide opportunities for portable/wearable devices, large-scale touch screens, and human physiological signal detection.