阅读说明：本技术 一种电子元器件的涂胶设备 (Gluing equipment for electronic components ) 是由 吴福洲 房奕亮 于 2020-12-03 设计创作，主要内容包括：本发明提供一种电子元器件的涂胶设备,包括固定架、横板、拨片、调高机构、偏心轮、风轮、滚轴、固定机构、散热板以及胶嘴,固定架内部设有横板,横板内部设有拨片,拨片内部设有滚轴,滚轴外部设有偏心轮,滚轴外部设有风轮,固定架右侧设有调高机构,拨片顶部设有散热板,散热板右侧设有固定机构,胶嘴内部设有加热管,水箱内部设有加热棒,出水管底部设有水泵,与现有技术相比,本发明具有如下的有益效果：通过散热板对电路板底部进行散热,使电路板上方的密封胶快速冷却固定,从而提高密封胶的固化效率,通过设置的振动机构,使散热板上的密封胶,可以快速分散开,并快速流入电路板内的凹槽处,使电路板密封效果更好。(The invention provides gluing equipment for electronic components, which comprises a fixed frame, a transverse plate, a shifting sheet, a height adjusting mechanism, an eccentric wheel, a wind wheel, a rolling shaft, a fixing mechanism, a heat dissipation plate and a glue nozzle, wherein the transverse plate is arranged inside the fixed frame, the shifting sheet is arranged inside the transverse plate, the rolling shaft is arranged inside the shifting sheet, the eccentric wheel is arranged outside the rolling shaft, the wind wheel is arranged outside the rolling shaft, the height adjusting mechanism is arranged on the right side of the fixed frame, the heat dissipation plate is arranged at the top of the shifting sheet, the fixing mechanism is arranged on the right side of the heat dissipation plate, a heating pipe is arranged inside the glue nozzle, a heating rod is arranged inside: dispel the heat to the circuit board bottom through the heating panel, make the sealed glue of circuit board top cool off fast fixed to improve sealed solidification efficiency who glues, through the vibration mechanism who sets up, make sealed glue on the heating panel, can disperse fast and open, and flow in the groove in the circuit board fast, make the sealed effect of circuit board better.)

1. The utility model provides an electronic components's rubber coating equipment, includes mount (1), diaphragm (2), plectrum (3), heightening mechanism (4), eccentric wheel (6), wind wheel (5), roller bearing (7), fixed establishment (8), heating panel (9) and gluey mouth (10), its characterized in that: the utility model discloses a heating device, including mount (1), baffle (2), roller bearing (7), eccentric wheel (6) are equipped with in the outside of roller bearing (7), roller bearing (7) outside is equipped with wind wheel (5), mount (1) right side is equipped with heightening mechanism (4), baffle (3) top is equipped with heating panel (9), heating panel (9) right side is equipped with fixed establishment (8), glue inside heating pipe (11) that is equipped with of mouth (10), heating pipe (11) right-hand member is equipped with water tank (12), inside heating rod (122) that is equipped with of water tank (12), water tank (12) bottom is equipped with outlet pipe (123), outlet pipe (123) bottom is equipped with water pump (13).

2. A paste application apparatus for an electronic component as claimed in claim 1, wherein: the height adjusting mechanism (4) comprises a rotating shaft (401), a driving bevel gear (801), a driven bevel gear (801), a screw (405) and a rocking handle (406), a first threaded hole (201) is formed in the transverse plate (2), the screw (405) is arranged in the first threaded hole (201), the driven bevel gear (801) is arranged at the lower end of the screw (405), a first bearing is arranged at the bottom of the fixing frame (1), the screw (405) is arranged in the bearing, a round hole is formed in the right side of the fixing frame (1), a second bearing is arranged in the round hole, the rotating shaft (401) is arranged in the second bearing, the driving bevel gear (801) is arranged at the left end of the rotating shaft (401), a first sliding groove (202) is formed in the transverse plate (2), a shifting sheet (3) is arranged in the first sliding groove (202), and a vibrating mechanism is arranged in the shifting sheet, in the actual use process, the driven bevel gear (801) is meshed with the driving bevel gear (801), and the height of the transverse plate (2) is adjusted by rotating the rocking handles (406) at the left side and the right side of the fixed frame (1).

3. A paste application apparatus for an electronic component as claimed in claim 2, wherein: the vibration mechanism comprises a wind wheel (5), an eccentric wheel (6) and a rolling shaft (7), a through hole is formed in the shifting piece (3), the rolling shaft (7) is arranged in the through hole, the wind wheel (5) is arranged outside the rolling shaft (7), the eccentric wheel (6) is arranged outside the rolling shaft, the wind wheel (5) comprises a blade (501), a roller (502), a first shaft hole (503) and a first key groove (504), the blade (501) is arranged outside the wind wheel (5), the roller (502) is arranged inside the blade (501), the first shaft hole (503) is arranged inside the roller (502), the first key groove (504) is arranged inside the first shaft hole (503), the first flat key is arranged inside the first key groove (504), the second shaft hole (601) is arranged inside the eccentric wheel (6), the second key groove (602) is arranged inside the second shaft hole (601), second keyway (602) inside is equipped with the flat key of second, roller bearing (7) outside is equipped with third keyway (701), plectrum (3) top is equipped with heating panel (9), heating panel (9) left side and heating panel (9) right side are equipped with fixed establishment (8) respectively, eccentric wheel (6) and roller bearing (7) carry out the key-type connection through first flat key and fix, wind wheel (5) and roller bearing (7) carry out the key-type connection through first flat key and fix, in the in-service use process, hot-blast air blows out through air exit (902), and wind-force is used in wind wheel (5), makes wind wheel (5) rotatory, and wind wheel (5) rotation drives roller bearing (7) rotatory, and roller bearing (7) drive eccentric wheel (6) are rotatory.

4. A paste application apparatus for an electronic component as claimed in claim 3, wherein: the fixing mechanism (8) comprises a gear (801), a third shaft hole (802), a fixing shaft (803), a second threaded hole (804), a first knob (805), a toothed plate (806), a latch (807), a second sliding groove (808), a second knob (809), a clamping plate (810), a first rubber pad (811) and a second rubber pad (812), an inner cavity is arranged inside the fixing mechanism (8), the gear (801) is arranged inside the inner cavity, the third shaft hole (802) is arranged inside the gear (801), the fixing shaft (803) is arranged inside the third shaft hole (802), the second knob (809) is arranged at the front end of the fixing shaft (803), the second threaded hole (804) is arranged at the top of the fixing mechanism (8), the second threaded hole (804) is arranged inside the second threaded hole (804), a threaded rod is arranged inside the second threaded hole (804), the first knob (805) is arranged at the top of the threaded rod, the utility model discloses a solar energy heat dissipation device, including fixed establishment (8), fixed establishment (8) inside is equipped with second spout (808), second spout (808) inside is equipped with pinion rack (806), pinion rack (806) right side is equipped with latch (807), pinion rack (806) top is equipped with splint (810), splint (810) bottom is equipped with first rubber pad (811), splint (810) below is equipped with heating panel (9), heating panel (9) upper surface is equipped with second rubber pad (812), and in the in-service use process, through rotatory second knob (809), second knob (809) drive gear (801) rotation through fixed axle (803), gear (801) mesh through latch (807) on pinion rack (806) to drive pinion rack (806) and reciprocate.

5. A gluing device for electronic components, as claimed in claim 4, wherein: the heat dissipation plate (9) comprises a cavity (901), an air outlet (902), a heat exchange cavity (903), an air outlet (904), heat dissipation holes (905), a baffle (906), a groove (907) and an air inlet pipe (908), the cavity (901) is arranged inside the heat dissipation plate (9), a plurality of air outlets (904) are arranged inside the cavity (901), the air inlet pipe (908) is arranged on the front surface of the heat dissipation plate (9), the plurality of heat dissipation holes (905) are arranged on the upper surface of the heat dissipation plate (9), the air outlet (902) is arranged at the bottom of the heat dissipation plate (9), the baffle (906) is arranged on the back panel of the heat dissipation plate (9), the groove (907) is arranged inside the baffle (906), the cavity (901), the air outlet (heat dissipation holes (902), the air outlet (, high-pressure gas is introduced into the gas inlet pipe (908), the gas enters the air outlet (902) through the cavity (901) and enters the heat exchange cavity (903), a part of the gas is discharged through the heat dissipation holes (905), and a part of the gas is discharged through the air outlet (902).

Technical Field

The invention belongs to the field of gluing equipment, and particularly relates to gluing equipment for an electronic component.

Background

At present, electronic components are components of electronic elements and small-sized electric machines and instruments, are usually composed of a plurality of parts, and can be commonly used in similar products; it is a general name of some parts in the industries of electric appliances, radio, instruments and the like, such as capacitors, transistors, hairsprings, springs and other sub-devices. The electronic component includes: the electronic device comprises a resistor, a capacitor, a potentiometer, an electronic tube, a radiator, an electromechanical element, a connector, a semiconductor discrete device, an electroacoustic device, a laser device, an electronic display device, a photoelectric device, a sensor, a power supply, a switch, a micro special motor, an electronic transformer, a relay, a printed circuit board, an integrated circuit, various circuits, piezoelectricity, crystals, quartz, a ceramic magnetic material, a base material substrate for a printed circuit, a special material for an electronic functional process, an electronic adhesive (tape) product, an electronic chemical material, a component and the like, wherein the existing electronic device is mostly required to be subjected to gluing, sealing and discharging in the production process, so that the waterproof and sealing effects are achieved.

However, after the existing electronic components rubber coating, can only wait for the colloid natural cooling, when using cold wind to accelerate the colloid solidification, because the inside unable timely heat dissipation of colloid leads to the colloid surface to produce the fold, influences sealed effect, at circuit board injecting glue in-process, the colloid flows into the depressed part of circuit board fast, and the injecting glue finishes the back, appears the colloid easily and piles up, the problem of unevenness, consequently, needs an electronic components's rubber coating equipment now to solve above problem urgently.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide gluing equipment for electronic components, which solves the problems in the background art by adding a fixed frame, a transverse plate, a shifting sheet, a height adjusting mechanism, an eccentric wheel, a wind wheel, a rolling shaft, a fixing mechanism, a heat dissipation plate and a glue nozzle.

The technical scheme of the invention is realized as follows: the utility model provides an electronic components's rubber coating equipment, includes mount, diaphragm, plectrum, heightening mechanism, eccentric wheel, wind wheel, roller bearing, fixed establishment, heating panel and jiao zui, the inside diaphragm that is equipped with of mount, the inside plectrum that is equipped with of diaphragm, the inside roller bearing that is equipped with of plectrum, the roller bearing outside is equipped with the eccentric wheel, the roller bearing outside is equipped with the wind wheel, the mount right side is equipped with heightening mechanism, the plectrum top is equipped with the heating panel, the heating panel right side is equipped with fixed establishment, the inside heating pipe that is equipped with of jiao zui, the heating pipe right-hand member is equipped with the water tank, the inside heating rod that is equipped with.

As a preferred embodiment, the height-adjusting mechanism comprises a rotating shaft, a driving bevel gear, a driven bevel gear, a screw rod and a rocking handle, wherein a first threaded hole is formed in the transverse plate, the screw rod is arranged in the first threaded hole, the driven bevel gear is arranged at the lower end of the screw rod, a first bearing is arranged at the bottom of the fixing frame, the screw rod is arranged in the bearing, a round hole is formed in the right side of the fixing frame, a second bearing is arranged in the round hole, a rotating shaft is arranged in the second bearing, the driving bevel gear is arranged at the left end of the rotating shaft, a first sliding groove is formed in the transverse plate, a shifting piece is arranged in the first sliding groove, a vibrating mechanism is arranged in the shifting piece, and in the actual use process, the driven bevel gear is meshed with the driving bevel gear, and.

As a preferred embodiment, the vibration mechanism includes a wind wheel, an eccentric wheel and a roller, a through hole is formed inside the paddle, the roller is arranged inside the through hole, the wind wheel is arranged outside the roller, the eccentric wheel is arranged outside the roller, the wind wheel includes blades, a roller, a first shaft hole and a first key groove, the blades are arranged outside the wind wheel, the roller is arranged inside the blades, the first shaft hole is formed inside the roller, the first key groove is formed inside the first shaft hole, a first flat key is arranged inside the first key groove, a second shaft hole is formed inside the eccentric wheel, a second key groove is formed inside the second shaft hole, a second flat key is arranged inside the second key groove, a third key groove is formed outside the roller, a heat dissipation plate is arranged at the top of the paddle, fixing mechanisms are respectively arranged on the left side of the heat dissipation plate and the right side of the heat dissipation plate, and the eccentric wheel and, the wind wheel and the roller are fixedly connected through a first flat key in a key mode, in the actual use process, hot air is blown out through the air outlet, wind power acts on the wind wheel to enable the wind wheel to rotate, the wind wheel rotates to drive the roller to rotate, and the roller drives the eccentric wheel to rotate.

As a preferred embodiment, the fixing mechanism includes a gear, a third shaft hole, a fixing shaft, a second threaded hole, a first knob, a toothed plate, a latch, a second chute, a second knob, a clamping plate, a first rubber pad, and a second rubber pad, an inner cavity is provided inside the fixing mechanism, the gear is provided inside the inner cavity, the third shaft hole is provided inside the gear, the fixing shaft is provided inside the third shaft hole, the second knob is provided at the front end of the fixing shaft, a second threaded hole is provided at the top of the fixing mechanism, a second threaded hole is provided inside the second threaded hole, a threaded rod is provided inside the second threaded hole, the first knob is provided at the top of the threaded rod, the second chute is provided inside the fixing mechanism, the toothed plate is provided inside the second chute, the latch is provided at the right side of the toothed plate, the clamping plate is provided at the top of the toothed plate, and the first rubber pad is, the splint below is equipped with the heating panel, the heating panel upper surface is equipped with the second rubber pad, and in the in-service use process, through rotatory second knob, the second knob passes through the fixed axle and drives the gear rotation, and the gear passes through the latch meshing on the pinion rack to drive the pinion rack and reciprocate.

As a preferred embodiment, the heating panel includes cavity, air exit, heat transfer chamber, gas vent, louvre, baffle, recess and intake pipe, the inside cavity that is equipped with of heating panel, the inside a plurality of gas vents that is equipped with of cavity, the heating panel front surface is equipped with the intake pipe, the heating panel upper surface is equipped with a plurality of louvres, the heating panel bottom is equipped with the air exit, the heating panel backplate is equipped with the baffle, the inside recess that is equipped with of baffle, cavity, air exit, louvre and intake pipe communicate with each other inside, in the in-service use process, make the intake pipe let in high-pressure gas, gas gets into the air exit through the cavity and gets into the heat transfer intracavity portion, and some is gaseous through the louvre discharge.

After the technical scheme is adopted, the invention has the beneficial effects that: inside discharging into the water tank through the heating pipe, realize giving gluey mouth and preheat, prevent sealed glue at flow in-process and gluey mouth internal fixation, lead to the circulation not smooth, dispel the heat to the circuit board bottom through the heating panel, it is fixed to make the sealed quick cooling of gluing of circuit board top, thereby improve sealed solidification efficiency of gluing, through the vibrating mechanism who sets up, sealed glue on the messenger's heating panel, can disperse fast, and flow in the groove in the circuit board fast, make the sealed effect of circuit board better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of a gluing device for electronic components according to the present invention.

Fig. 2 is a sectional view of a gluing apparatus for electronic components according to the present invention.

Fig. 3 is an enlarged view of a portion a of the glue spreading apparatus for electronic components according to the present invention.

Fig. 4 is an enlarged view of a portion B of the electronic component gluing device according to the present invention.

Fig. 5 is an enlarged view of the gluing device for electronic components at position C.

Fig. 6 is a left side view of a wind wheel of the gluing device for the electronic component.

Fig. 7 is a left side view of the eccentric wheel of the gluing device for the electronic component.

Fig. 8 is a front view of a roller of the gluing device for electronic components according to the present invention.

Fig. 9 is a partial sectional view of a heat sink of the paste applying apparatus for electronic components according to the present invention.

In the figure, 1-fixing frame, 2-horizontal plate, 201-first threaded hole, 202-first sliding groove, 3-shifting piece, 4-heightening mechanism, 401-rotating shaft, 402-driving bevel gear, 403-driven bevel gear, 405-screw rod, 406-rocking handle, 5-wind wheel, 501-blade, 502-roller, 503-first shaft hole, 504-first key groove, 6-eccentric wheel, 601-second shaft hole, 602-second key groove, 7-rolling shaft, 701-third key groove, 8-fixing mechanism, 801-gear, 802-third shaft hole, 803-fixing shaft, 804-second threaded hole, 805-first knob, 806-toothed plate, 807-latch, 808-second sliding groove, 809-second knob, 810-clamping plate, 811-first rubber pad, 812-second rubber pad, 9-heat dissipation plate, 901-cavity, 902-air outlet, 903-heat exchange cavity, 904-air outlet, 905-heat dissipation hole, 906-baffle, 907-groove, 908-air inlet pipe, 10-rubber nozzle, 11-heating pipe, 12-water tank, 122-heating rod, 123-water outlet pipe and 13-water pump.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 9, the present invention provides a technical solution: the utility model provides an electronic components's rubber coating equipment, including mount 1, diaphragm 2, plectrum 3, heighten mechanism 4, eccentric wheel 6, wind wheel 5, roller bearing 7, fixed establishment 8, heating panel 9 and gluey mouth 10, mount 1 is inside to be equipped with diaphragm 2, the inside plectrum 3 that is equipped with of diaphragm 2, the inside roller bearing 7 that is equipped with of plectrum 3, roller bearing 7 outside is equipped with eccentric wheel 6, roller bearing 7 outside is equipped with wind wheel 5, 1 right side of mount is equipped with heighten mechanism 4, 3 tops of plectrum are equipped with heating panel 9, 9 right sides of heating panel are equipped with fixed establishment 8, glue the inside heating pipe 11 that is equipped with of mouth 10, 11 right-hand members of heating pipe are equipped with water tank 12, the inside heating rod 122 that is equipped with.

Referring to fig. 2 to 4, the height adjusting mechanism 4 includes a rotating shaft 401, a driving bevel gear 801, a driven bevel gear 801, a screw 405 and a rocking handle 406, a first threaded hole 201 is formed in a horizontal plate 2, the screw 405 is formed in the first threaded hole 201, the driven bevel gear 801 is arranged at the lower end of the screw 405, a first bearing is arranged at the bottom of a fixing frame 1, the screw 405 is arranged in the bearing, a circular hole is formed in the right side of the fixing frame 1, a second bearing is arranged in the circular hole, the rotating shaft 401 is arranged in the second bearing, the driving bevel gear 801 is arranged at the left end of the rotating shaft 401, a first sliding chute 202 is formed in the horizontal plate 2, a shifting piece 3 is arranged in the first sliding chute 202, a vibrating mechanism is arranged in the shifting piece 3, during actual use, the driven bevel gear 801 and the driving bevel gear 801 are engaged, the height of the horizontal plate, the vibration frequency of the pick 3 is changed, so that the adhesion of the sealant and the circuit board is better.

Referring to fig. 2, 6, 7, 8 or 9, the vibration mechanism includes a wind wheel 5, an eccentric wheel 6 and a roller 7, a through hole is formed inside the paddle 3, the roller 7 is disposed inside the through hole, the wind wheel 5 is disposed outside the roller 7, the eccentric wheel 6 is disposed outside the roller, the wind wheel 5 includes a blade 501, a roller 502, a first shaft hole 503 and a first key groove 504, the blade 501 is disposed outside the wind wheel 5, the roller 502 is disposed inside the blade 501, the first shaft hole 503 is disposed inside the roller 502, the first key groove 504 is disposed inside the first shaft hole 503, the second shaft hole 601 is disposed inside the eccentric wheel 6, the second key groove 602 is disposed inside the second shaft hole 601, the second key groove 602 is disposed inside the second key groove, the third key groove 701 is disposed outside the roller 7, the top of the paddle 3 is disposed with a heat dissipation plate 9, the left side and the right side of the heat dissipation plate 9 are respectively, eccentric wheel 6 and roller bearing 7 carry out the key-type connection through first flat key and fix, and wind wheel 5 and roller bearing 7 carry out the key-type connection through first flat key and fix, and in the in-service use process, hot-blast air blows out through air exit 902, and wind-force is used in on wind wheel 5, makes wind wheel 5 rotatory, and wind wheel 5 is rotatory to drive roller bearing 7 rotatory, and roller bearing 7 drives eccentric wheel 6 rotatory, through the vibrating mechanism who sets up, makes the sealed glue of circuit board upper surface adhere to more level and more smooth.

Referring to fig. 2 to 3, the fixing mechanism 8 includes a gear 801, a third shaft hole 802, a fixing shaft 803, a second threaded hole 804, a first knob 805, a toothed plate 806, a latch 807, a second sliding groove 808, a second knob 809, a clamping plate 810, a first rubber pad 811, and a second rubber pad 812, an inner cavity is provided inside the fixing mechanism 8, the gear 801 is provided inside the inner cavity, the third shaft hole 802 is provided inside the gear 801, the fixing shaft 803 is provided inside the third shaft hole 802, the front end of the fixing shaft 803 is provided with the second knob 809, the top of the fixing mechanism 8 is provided with the second threaded hole 804, the second threaded hole 804 is provided inside the second threaded hole 804, the top of the threaded rod is provided with the first knob 805, the second sliding groove 808 is provided inside the fixing mechanism 8, the toothed plate 806 is provided inside the second sliding groove 808, the right side of the toothed plate is provided with the latch 807, the clamping plate 810 is provided on the top of the toothed plate 806, the, splint 810 below is equipped with heating panel 9, and heating panel 9 upper surface is equipped with second rubber pad 812, and in the in-service use process, through rotatory second knob 809, second knob 809 drives gear 801 through fixed axle 803 and rotates, and gear 801 passes through the latch 807 meshing on the pinion rack 806 to drive pinion rack 806 and reciprocate, through the fixed establishment who sets up for the fixed of circuit board.

Referring to fig. 1 to 2, the heat dissipating plate 9 includes a cavity 901, an air outlet 902, a heat exchanging cavity 903, an air outlet 904, a heat dissipating hole 905, a baffle 906, a groove 907, and an air inlet 908, the cavity 901 is disposed inside the heat dissipating plate 9, the air outlet 904 is disposed inside the cavity 901, the air inlet 908 is disposed on the front surface of the heat dissipating plate 9, the heat dissipating hole 905 is disposed on the upper surface of the heat dissipating plate 9, the air outlet 902 is disposed at the bottom of the heat dissipating plate 9, the baffle 906 is disposed on the back surface of the heat dissipating plate 9, the groove 907 is disposed inside the baffle 906, the cavity 901, the air outlet 902, the heat dissipating hole 905, and the air inlet 908 are communicated with each other, during actual use, high pressure air is introduced into the air inlet 908, air enters the air outlet 902 through the cavity 901 and, the fixing speed of the sealant above the circuit board is faster.

As an embodiment of the present invention: in the in-service use process, pour into sealed glue into through gluey mouth 10 top, add the water source through water tank 12 top, make heating rod 122 switch on, heating rod 122 heats for the inside water source of water tank 12, when heating to the uniform temperature, start water pump 13, water pump 13 is inside water suction heating pipe 11 inside water tank 12, and discharge into water tank 12 through heating pipe 11 inside, realize giving gluey mouth 10 and preheat, prevent sealed glue at the flow in-process with gluey mouth 10 inner wall solidification, lead to the circulation not smooth.

Inserting a circuit board to be glued into a concave position in the baffle 906 from front to back, placing the bottom of the circuit board above a second rubber pad 812, rotating a second knob 809, driving a fixing shaft 803 to rotate by the second knob 809, driving a gear 801 to rotate by the second knob 809 through the fixing shaft 803, meshing the gear 801 through a latch 807 on a toothed plate 806, thereby driving the toothed plate 806 to move downwards, enabling a clamping plate 810 to move downwards, clamping the circuit board by the second clamping plate 810 through a first rubber pad 811, rotating a first knob 805, driving a threaded rod to rotate by the first knob 805, enabling the threaded rod to rotate to enter a threaded hole, clamping the bottom of the threaded rod between another adjacent teeth on the gear 801, completing the fixation of the circuit board, gluing the upper part of the circuit board through a glue nozzle 10,

the high-pressure gas is led into the air inlet pipe 908, the gas enters the air outlet 902 through the cavity 901 and enters the heat exchange cavity 903, a part of the gas is discharged through the heat radiation holes 905, the heat radiation is carried out on the bottom of the circuit board, the sealant above the circuit board is rapidly cooled and fixed, so that the curing efficiency of the sealant is improved, a part of the gas is discharged through the air outlet 902 and is blown to the wind wheel 5, the wind power acts on the wind wheel 5, the wind wheel 5 rotates to drive the roller 7 to rotate, the roller 7 drives the eccentric wheel 6 to rotate, the roller 7 vibrates through the arranged eccentric wheel 6, the vibration is transmitted to the stirring sheet 3 through the roller 7, the stirring sheet 3 transmits the vibration to the heat radiation plate 9, the circuit board on the heat radiation plate 9 vibrates, the sealant on the heat radiation plate 9 can be rapidly dispersed through the arranged vibration mechanism, the sealing effect of the circuit board is better.

In the in-service use process, through the rotation rocking handle 406, because driven bevel gear 801 and drive bevel gear 801 meshing, through the rotation mount 1 left and right sides rocking handle 406, carry out the regulation of diaphragm 2 height, the rotation rocking handle 406, make diaphragm 2 height upwards adjust, because diaphragm 2 rebound has reduced the length of dialling the board 3 vibration region, thereby reduce the vibration range of dialling board 3, make diaphragm 2 height downwards adjust, because diaphragm 2 rebound has increased the length of dialling the board 3 vibration region, thereby increase the vibration range of dialling board 3, through carrying out the regulation of diaphragm 2 height, thereby change the vibration range of plectrum 3, because sealed glue receives vibration acceleration dispersion, and the dispersion is more even, thereby make the adhesion of sealed glue and circuit board better.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.