阅读说明：本技术 一种光接近传感器模组 (Optical proximity sensor module ) 是由 卢军 于 2020-12-23 设计创作，主要内容包括：本发明公开了一种光接近传感器模组,包括载板、胶条和单颗模组,所述载板上端安装胶条,载板外壁设置有单颗模组,单颗模组上安装胶块,胶块一侧开设有填孔,胶块和填孔下端设置有滑切线。本光接近传感器模组,胶块的四周为一个独立的空间,可以在里面摆放所需要的LED芯片、感应器件和接收器件,第一腔体内安装发射芯片,通过加载电流激发红外芯片,发射信号从第一腔体上方的窗口发出信号,在没有遇到障碍物的时候,信号不会折射回来,当红外信号遇到障碍物的时候,信号发射激发第一腔体的接收芯片,实现遇到障碍物的光电感应过程,芯片发出信号就暂停,当装置光源被遮挡的时候,芯片就发出信号。(The invention discloses an optical proximity sensor module, which comprises a support plate, an adhesive tape and a single module, wherein the adhesive tape is installed at the upper end of the support plate, the single module is arranged on the outer wall of the support plate, a glue block is installed on the single module, a filling hole is formed in one side of the glue block, and sliding tangent lines are arranged at the lower ends of the glue block and the filling hole. This light proximity sensor module, glue the piece be an independent space all around, can put required LED chip in the inside, induction element and receiving device, installation emission chip in the first cavity, arouse infrared chip through loading current, emission signal is from the window signals of first cavity top, when not meetting the barrier, the signal can not refract back, when infrared signal meets the barrier, signal transmission arouses the receiving chip of first cavity, the realization meets the photoelectric sensing process of barrier, chip signals is just paused, when the device light source is sheltered from, the chip is just the signals.)

1. The utility model provides an optical proximity sensor module, includes support plate (1), adhesive tape (2) and single module (3), its characterized in that: the upper end of the carrier plate (1) is provided with an adhesive tape (2), the outer wall of the carrier plate (1) is provided with a single module (3), a rubber block (101) is arranged on the single module (3), one side of the rubber block (101) is provided with a filling hole (102), and the lower ends of the rubber block (101) and the filling hole (102) are provided with a sliding tangent line (103);

the single module (3) comprises a first cavity (301), a second cavity (302), a third cavity (303), a fourth cavity (304), a receiving chip (305), a copper foil (306), a collector (307), an emitter (308), a first gold wire (309), an emitting chip (310), an emitting cathode (311), an emitting anode (312) and a second gold wire (313), the periphery of the single module (3) is connected with one end of the first cavity (301), the second cavity (302), the third cavity (303) and one end of the fourth cavity (304), one side of the upper end of the single module (3) is connected with one end of the collector (307), the other end of the collector (307) is connected with one end of the copper foil (306), the other end of the copper foil (306) is connected with the receiving chip (305), the emitter (308) is installed on the other side of the upper end of the single module (3), and the receiving chip (305) are connected through the first gold wire (309), single module (3) lower extreme one side links to each other with transmission negative pole (311) one end, and transmission negative pole (311) other end links to each other with transmission chip (310), and anodal (312) are launched in single module (3) lower extreme other end installation, and transmission anodal (312) link to each other through second gold thread (313) with transmission chip (310).

2. The optical proximity sensor module as recited in claim 1, wherein: the upper end of the carrier plate (1) is provided with adhesive tapes (2), the adhesive tapes (2) are provided with a plurality of groups, and the gap between each group of adhesive tapes (2) is 0.5 mm.

3. The optical proximity sensor module as recited in claim 1, wherein: the carrier plate (1) is provided with a plurality of groups of single modules (3), and each group of single modules (3) are separated by a sliding tangent line (103).

4. The optical proximity sensor module as recited in claim 3, wherein: the single die sets (3) are separated by a sliding tangent (103) to form a cavity of 2.0 x 1.6 x 0.72.

5. The optical proximity sensor module as recited in claim 1, wherein: the collector (307) and the emitter (308) are located on the same horizontal line, the transverse distance between the collector (307) and the emitter (308) is 1.7mm, and the vertical span between the collector (307) and the emitter (308) is 0.55 mm.

6. The optical proximity sensor module as recited in claim 1, wherein: the type of the transmitting chip (310) is 940.

7. The optical proximity sensor module as recited in claim 1, wherein: the distance between the collector (307) and the emitting cathode (311) is 2.1 mm.

Technical Field

The invention relates to the technical field of optical proximity sensor modules, in particular to an optical proximity sensor module.

Background

In its broadest definition, a sensor is a device, module or subsystem whose purpose is to detect events or changes in the environment and to transmit information to other electronic devices, typically computer processors. Sensors are always used with other electronic devices, a sensor being a device or apparatus which can sense a predetermined measured object and convert it into a usable signal according to a certain rule, usually consisting of a sensing element and a converting element, and a measuring apparatus which converts the measured object into a certain physical quantity in a certain relation with a certain accuracy and which is convenient for application.

The existing optical proximity sensor has low precision, the signal emission is often abnormal, the signal is not refracted or the signal is abnormally refracted, and the user experience is greatly reduced.

Disclosure of Invention

The invention aims to provide an optical proximity sensor module, wherein an emitting chip is arranged in a first cavity, an infrared chip is excited by loading current, an emitting signal sends out a signal from a window above the first cavity, the signal cannot be refracted back when no obstacle is encountered, when the infrared signal encounters an obstacle, the signal is emitted to excite a receiving chip of the first cavity, the photoelectric sensing process of encountering the obstacle is realized, when a light source is received by a device, the signal sent by the chip is suspended, when the light source of the device is shielded, the chip sends out the signal, and the problems in the prior art can be solved.

In order to achieve the purpose, the invention provides the following technical scheme:

an optical proximity sensor module comprises a support plate, an adhesive tape and a single module, wherein the adhesive tape is installed at the upper end of the support plate, the single module is arranged on the outer wall of the support plate, a rubber block is installed on the single module, a filling hole is formed in one side of the rubber block, and sliding tangent lines are arranged at the lower ends of the rubber block and the filling hole;

the single module comprises a first cavity, a second cavity, a third cavity, a fourth cavity, a receiving chip, a copper foil, a collector, a transmitter, a first gold thread, a transmitting chip, a transmitting negative electrode, a transmitting positive electrode and a second gold thread, the single module is connected with the first cavity all around, the second cavity, the third cavity and one end of the fourth cavity, one side of the upper end of the single module is connected with one end of the collector, the other end of the collector is connected with one end of the copper foil, the other end of the copper foil is connected with the receiving chip, the transmitter is installed on the other side of the upper end of the single module, the transmitter is connected with the receiving chip through the first gold thread, one side of the lower end of the single module is connected with one end of the transmitting negative electrode, the other end of the transmitting negative electrode is connected with the transmitting chip, the transmitting positive electrode is installed on.

Preferably, the upper end of the carrier plate is provided with a plurality of groups of adhesive tapes, and the gap between each group of adhesive tapes is 0.5 mm.

Preferably, a plurality of groups of single modules are arranged on the carrier plate, and each group of single modules are separated by a sliding cutting line.

Preferably, the single die sets are separated by the sliding cut lines to form a cavity of 2.0 x 1.6 x 0.72.

Preferably, the collector and the emitter are located on the same horizontal line, the transverse distance between the collector and the emitter is 7mm, and the vertical span between the collector and the emitter is 0.55 mm.

Preferably, the type of the transmitting chip is 940.

Preferably, the distance between the collector and the emitting cathode is 2.1 mm.

Compared with the prior art, the invention has the following beneficial effects:

the optical proximity sensor module comprises a carrier plate, adhesive tapes arranged at the upper end of the carrier plate, wherein a plurality of groups of adhesive tapes are arranged, the gap between each group of adhesive tapes is 0.5mm, each adhesive tape is cut into an island shape by a blade with the width of 0.5mm, the carrier plate and the adhesive tapes are filled by a special compression mold in an injection molding way, fillers are special lightproof black materials, each adhesive tape is separated by the black filling materials and is independent of each other and not interfered by the black filling materials, an independent space is formed around the adhesive block, a required LED chip, a sensing device and a receiving device can be placed in the adhesive block, a transmitting chip is arranged in a first cavity, an infrared chip is excited by loading current, a transmitting signal sends out from a window above the first cavity, the signal can not be refracted back when the infrared signal meets an obstacle, the signal is emitted to excite the receiving chip of the first cavity when the infrared signal meets the obstacle, and the photoelectric sensing process, when the device receives the light source, the chip sends out signals and then pauses, and when the light source of the device is shielded, the chip sends out signals.

Drawings

FIG. 1 is a front elevational view of the overall construction of the present invention;

FIG. 2 is a side view of the overall structure of the present invention;

FIG. 3 is a left side view of the overall structure of the present invention;

FIG. 4 is a top view of the overall structure of the present invention;

FIG. 5 is an exploded view of a single module of the present invention.

In the figure: 1. a carrier plate; 101. gluing blocks; 102. filling holes; 103. sliding a tangent line; 2. an adhesive tape; 3. a single die set; 301. a first cavity; 302. a second cavity; 303. a third cavity; 304. a fourth cavity; 305. a receiving chip; 306. copper foil; 307. a collector; 308. a transmitter; 309. a first gold wire; 310. a transmitting chip; 311. an emission cathode; 312. an emission anode; 313. and a second gold wire.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, an optical proximity sensor module comprises a carrier plate 1, adhesive tapes 2 and single modules 3, wherein the adhesive tapes 2 are mounted on the upper end of the carrier plate 1, the adhesive tapes 2 are provided with a plurality of groups, the gap between each group of adhesive tapes 2 is 0.5mm, the adhesive tapes 2 are cut into an island shape by a 0.5mm wide blade, the carrier plate 1 and the adhesive tapes 2 are injection-molded and filled by a special pressing mold, the filler is a special opaque black material, each adhesive tape 2 is separated by a black filler material, are independent from each other and are not interfered by the black filler material, the single modules 3 are arranged on the outer wall of the carrier plate 1, the carrier plate 1 is provided with a plurality of groups of single modules 3, each group of single modules 3 is separated by a sliding tangent line 103, a cavity of 2.0 x 1.6 x 0.72 is formed after the single modules 3 are separated by the sliding tangent line 103, the single modules 3 are provided with adhesive blocks 101, required LED chips, induction devices and receiving devices can be placed in the glue block 101, a filling hole 102 is formed in one side of the glue block 101, a sliding tangent line 103 is arranged at the lower ends of the glue block 101 and the filling hole 102, and the middle of the filling hole 102 is filled with ink, so that glue leakage to the back side can be prevented.

Wherein the single module 3 comprises a first cavity 301, a second cavity 302, a third cavity 303, a fourth cavity 304, a receiving chip 305, a copper foil 306, a collector 307, an emitter 308, a first gold wire 309, an emitting chip 310, an emitting cathode 311, an emitting anode 312 and a second gold wire 313, the periphery of the single module 3 is connected with one end of the first cavity 301, the second cavity 302, the third cavity 303 and the fourth cavity 304, the emitting chip 310 is arranged in the first cavity 301, the infrared chip is excited by loading current, the emitted signal emits a signal from a window above the first cavity 301, when the signal does not encounter an obstacle, the signal can not be refracted back, when the infrared signal encounters the obstacle, the signal is emitted to excite the receiving chip of the first cavity 301, so as to realize the photoelectric induction process of encountering the obstacle, one side of the upper end of the single module 305 is connected with one end of the collector 307, the other end of the collector 307 is connected with one end of the copper foil 306, the other end of the copper foil 306 is connected with the receiving chip 305, the other side of the upper end of the single module 3 is provided with the emitter 308, the collector 307 and the emitter 308 are positioned on the same horizontal line, the distance between the collector 307 and the emitting negative electrode 311 is 2.1mm, the transverse distance between the collector 307 and the emitter 308 is 1.7mm, the vertical span between the collector 307 and the emitter 308 is 0.55mm, the emitter 308 is connected with the receiving chip 305 through a first gold wire 309, one side of the lower end of the single module 3 is connected with one end of the emitting negative electrode 311, the other end of the emitting negative electrode 311 is connected with the emitting chip 310, the emitting chip 310 is 940 in model, the other end of the lower end of the single module 3 is provided with an emitting positive electrode 312, and the emitting positive electrode 312 is connected with the.

In summary, in the optical proximity sensor module, the adhesive tape 2 is mounted on the upper end of the carrier board 1, the adhesive tape 2 is provided with a plurality of groups, the gap between each group of adhesive tapes 2 is 0.5mm, the adhesive tapes 2 are cut into an island shape by a blade with a width of 0.5mm, the carrier board 1 and the adhesive tapes 2 are filled by injection molding of a special pressing mold, the filler is a special opaque black material, each adhesive tape 2 is separated by the black filler material and is independent from each other without interference, the periphery of the adhesive block 101 is an independent space in which required LED chips, sensing devices and receiving devices can be placed, a transmitting chip 310 is mounted in the first cavity 301, an infrared chip is excited by loading current, a transmitting signal is emitted from a window above the first cavity 301, when the infrared signal does not encounter an obstacle, the signal is not refracted back, when the infrared signal encounters the obstacle, the signal is emitted to excite the receiving chip 305 of the first cavity 301, the photoelectric sensing process of meeting the obstacle is realized.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.