Conductive film, preparation method thereof, touch panel and display device

文档序号:863576 发布日期:2021-03-16 浏览:7次 中文

阅读说明:本技术 导电薄膜及其制备方法、触控面板及显示装置 (Conductive film, preparation method thereof, touch panel and display device ) 是由 陈鑫 张瑶 于 2018-07-17 设计创作,主要内容包括:本发明公开了一种导电薄膜及其制备方法、触控面板及显示装置。所述导电薄膜包括基材、导电层、防护层及导电胶。该导电层设置在所述基材上,所述导电层包括导电材料形成的导电网。该防护层设置在所述导电层上,所述防护层开设有外露所述导电材料的开孔。该导电胶设置在所述防护层上,所述导电胶填充所述开孔而与所述导电材料接触。本发明实施例提供的导电薄膜,通过在设置导电胶之前形成防护层,从而可以避免外露的纳米银线被氧化、硫化而造成导电网断裂的问题,导电胶由尺度不同的两种导电颗粒组成,可以实现导电胶填充开孔而与导电材料充分接触,进而增大导电胶与导电材料的接触面积,减小接触阻抗,且提高所述导电薄膜的导电性。(The invention discloses a conductive film, a preparation method of the conductive film, a touch panel and a display device. The conductive film comprises a substrate, a conductive layer, a protective layer and conductive adhesive. The conductive layer is disposed on the substrate, the conductive layer including a conductive mesh formed of a conductive material. The protective layer is arranged on the conductive layer, and is provided with an opening for exposing the conductive material. The conductive adhesive is arranged on the protective layer, and the conductive adhesive fills the open hole and is in contact with the conductive material. According to the conductive film provided by the embodiment of the invention, the protective layer is formed before the conductive adhesive is arranged, so that the problem of conductive network fracture caused by oxidation and vulcanization of the exposed nano silver wire can be avoided.)

A conductive film, comprising:

a substrate;

a conductive layer disposed on the substrate, the conductive layer comprising a conductive mesh formed of a conductive material;

the protective layer is arranged on the conductive layer and provided with an opening for exposing the conductive material;

and the conductive adhesive is arranged on the protective layer and fills the open hole to be in contact with the conductive material.

The conductive film of claim 1, wherein: the conductive net comprises a node formed by overlapping the conductive materials, and the node is exposed out of the opening of the protective layer and is in contact with the conductive adhesive.

The conductive film of claim 1, wherein the protective layer has a mesh structure and the openings are arranged in an array.

The conductive film of claim 1, wherein the apertures of the protective layer are from 1 μm to 100 μm in diameter.

The conductive film of claim 1, wherein: the conductive adhesive comprises micron-sized particles and nanometer-sized particles, the nanometer-sized particles keep the nanometer size when the conductive adhesive is melted, and the micron-sized particles are not melted with the silver powder.

The conductive film according to claim 5, wherein the micro-scale particles are silver powder and the nano-scale particles are conductive particles.

The conductive film of claim 6, wherein the conductive particles are selected from one or a combination of carbon nanotubes, carbon rods, and graphene.

The conductive film of claim 6, wherein said conductive particles comprise 1% to 20% by weight of said conductive paste.

The conductive film according to claim 6, wherein the conductive particles have a particle diameter smaller than the pore diameter of the openings of the protective layer.

The conductive film according to claim 6, wherein the silver powder has a particle diameter of 10 μm to 200 μm, and the length, width, height and minimum dimension of the conductive particles are 10nm to 100 nm.

The conductive film of claim 1, wherein: the conductive material comprises a nano-silver wire.

The preparation method of the conductive film is characterized by comprising the following steps of:

providing a substrate;

disposing a conductive layer on the substrate, the conductive layer comprising a conductive mesh formed of a conductive material;

forming a protective layer on the conductive layer, wherein the protective layer is provided with an opening for exposing the conductive material;

and arranging conductive adhesive on the protective layer so that the conductive adhesive fills the open hole and is in contact with the conductive material.

The method for producing a conductive film according to claim 12, wherein: the conductive net comprises a node formed by overlapping the conductive materials, and the node is exposed out of the opening of the protective layer and is in contact with the conductive adhesive.

The method for producing a conductive film according to claim 12, wherein: the conductive adhesive comprises micron-sized particles and nanometer-sized particles, the nanometer-sized particles keep the nanometer size when the conductive adhesive is melted, and the micron-sized particles are not melted with the silver powder.

The method for producing a conductive film according to claim 14, wherein: the micron-sized particles are silver powder, and the nano-sized particles are conductive particles.

The method for producing a conductive film according to claim 15, wherein: the particle size of the conductive particles is smaller than the pore diameter of the open pores of the protective layer.

The method for producing a conductive film according to claim 12, wherein: after the conductive adhesive is arranged on the protective layer, the method further comprises the following steps: and curing the conductive adhesive at a preset temperature for a period of time.

The method for producing a conductive film according to claim 13, wherein: the preset temperature is 80-150 ℃, and the curing time is 0.5-2 hours.

A touch panel comprising the conductive film according to any one of claims 1 to 11.

A display device characterized by comprising the touch panel according to claim 19.

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