阅读说明：本技术 基板搬送装置及具备基板搬送装置的基板处理装置 (Substrate conveying device and substrate processing device provided with same ) 是由 谷泽昭寻 木场隆 小林贤一 赤泽贤一 杜峯杰 柏木诚 真继阿沙葵 南条贵弘 青山英治 于 2019-07-09 设计创作，主要内容包括：提供搬送四边形的基板的自动化装置。根据一实施方式,提供用于搬送四边形的基板的基板搬送装置,该基板搬送装置具有：多个搬送辊,被构成为支承基板的下表面；多个辊轴,安装有所述多个搬送辊；马达,用于使所述多个辊轴旋转；以及推动器,用于提升所述多个搬送辊上的基板,以使所述多个搬送辊上的基板远离所述多个搬送辊,所述推动器具有平台,能够在所述多个搬送辊之间的空隙通过。(Provided is an automation device for conveying a quadrangular substrate. According to one embodiment, there is provided a substrate transfer apparatus for transferring a substrate having a rectangular shape, the substrate transfer apparatus including: a plurality of conveying rollers configured to support a lower surface of the substrate; a plurality of roller shafts to which the plurality of conveyance rollers are attached; a motor for rotating the plurality of roller shafts; and a pusher for lifting the substrate on the plurality of transport rollers to separate the substrate on the plurality of transport rollers from the plurality of transport rollers, the pusher having a platform that is capable of passing through a gap between the plurality of transport rollers.)

1. A substrate transfer apparatus for transferring a quadrangular substrate, comprising:

a plurality of conveying rollers configured to support a lower surface of the substrate;

a plurality of roller shafts to which the plurality of conveyance rollers are attached;

a motor for rotating the plurality of roller shafts; and

a pusher for lifting the substrate on the plurality of transport rollers to separate the substrate on the plurality of transport rollers from the plurality of transport rollers,

the pusher has a platform that is capable of passing through a gap between the plurality of rollers.

2. The substrate carrier device according to claim 1,

a support member is disposed between the plurality of conveying rollers.

3. The substrate carrier device according to claim 1 or 2,

the substrate processing apparatus includes a plurality of guide rollers that support a substrate in a width direction perpendicular to a substrate conveyance direction.

4. The substrate carrying apparatus according to any one of claims 1 to 3,

the substrate has a non-pattern region not used as an element,

the plurality of conveying rollers are configured to be capable of contacting with the non-pattern area of the substrate.

5. The substrate carrying apparatus according to any one of claims 1 to 4,

at least a part of the plurality of conveying rollers is formed of a conductive polymer.

6. The substrate carrying apparatus according to any one of claims 1 to 5,

there is also a magnetic gear through which the motor rotates the roller shaft.

7. The substrate carrying apparatus according to any one of claims 1 to 6,

the substrate transfer apparatus further includes a stopper configured to enter a transfer path of the substrate transferred on the plurality of transfer rollers and to be capable of coming into contact with the substrate being transferred.

8. The substrate carrying apparatus according to any one of claims 1 to 7,

the substrate processing apparatus further includes a sensor for detecting that no substrate is present at a predetermined position on the plurality of transport rollers.

9. The substrate carrying apparatus according to any one of claims 1 to 8,

the substrate processing apparatus further includes a plurality of support rollers configured to support an upper surface of the substrate conveyed by the plurality of conveying rollers.

10. The substrate carrying apparatus according to any one of claims 1 to 9,

the motor for rotating the plurality of roller shafts is a servo motor.

11. The substrate carrying apparatus according to any one of claims 1 to 10,

the platform of the pusher has a plurality of support columns,

the pusher includes an elevating mechanism for vertically elevating the surface plate, and the elevating mechanism is configured to be capable of moving the surface plate between an upper position where the surface plate is elevated and a lower position where the surface plate is lowered, and when the surface plate is moved from the lower position to the upper position, at least a part of the plurality of support columns of the surface plate passes through gaps between the plurality of roller shafts, and receives the substrate on the plurality of conveying rollers by the plurality of support columns.

12. The substrate carrying apparatus according to any one of claims 1 to 11,

the pusher has a linear moving mechanism for linearly moving the platform in a horizontal plane.

13. The substrate carrying apparatus according to any one of claims 1 to 12,

the pusher has a rotational movement mechanism for rotationally moving the platform in a horizontal plane.

14. The substrate carrier device according to claim 12,

the pusher has a linear motion prevention mechanism for preventing linear motion of the platform.

15. The substrate carrier device according to claim 13,

the pusher has a rotational movement prevention mechanism for preventing rotational movement of the platform.

16. A substrate processing apparatus includes:

a polishing section for polishing a substrate;

a cleaning section for cleaning the substrate;

a drying section for drying the substrate; and

a conveying section that conveys a substrate among the polishing section, the cleaning section, and the drying section,

the conveying section includes the substrate conveying apparatus according to any one of claims 1 to 15.

17. The substrate processing apparatus of claim 16,

the polishing section has:

a platen for holding a polishing pad;

the machine table driving mechanism is used for driving the machine table to rotate;

a top ring for holding a substrate; and

a pressing mechanism for pressing the substrate held by the top ring against the polishing pad held by the platen,

the top ring is configured to be able to receive a substrate from the stage of the pusher and to be able to transfer the substrate held by the top ring to the stage of the pusher.

18. The substrate processing apparatus of claim 17,

the grinding part is provided with a grinding fluid supply mechanism which is used for supplying grinding fluid to the grinding pad on the machine table.

19. The substrate processing apparatus of claim 18,

the polishing liquid supply mechanism is provided with a flow path arranged in the machine table, and the flow path is communicated with the surface of the machine table and an opening part divided by the polishing pad.

20. The substrate processing apparatus according to any one of claims 17 to 19,

the top ring has an air bag, and the substrate processing apparatus is configured to control pressing force of the substrate against the polishing pad by fluid pressure supplied into the air bag.

21. The substrate processing apparatus according to any one of claims 17 to 20,

the surface of the machine table is provided with an organic silicon layer or a fluorine resin layer, and the organic silicon layer or the fluorine resin layer is used for easily stripping the grinding pad from the machine table.

22. The substrate processing apparatus according to any one of claims 17 to 21,

the substrate processing apparatus has the polishing pad held on the platen,

the surface of the polishing pad has grooves communicating with the outer periphery of the polishing pad and grooves not communicating with the outer periphery of the polishing pad.

23. The substrate processing apparatus of claim 22,

the grooves of the polishing pad have grooves forming concentric circular patterns and grooves forming radial patterns.

24. The substrate processing apparatus of claim 22,

the grooves of the polishing pad have grooves forming a lattice pattern.

25. The substrate processing apparatus according to any one of claims 16 to 24,

the cleaning unit has a cleaning nozzle for spraying a cleaning liquid onto the substrate on the conveying roller.

26. The substrate processing apparatus of claim 25,

the cleaning nozzles are disposed on both the upper surface side and the lower surface side of the substrate on the conveying roller.

27. The substrate processing apparatus according to any one of claims 16 to 26,

the drying section has a drying nozzle that ejects a gas toward the substrate on the conveying roller.

28. The substrate processing apparatus of claim 27,

the drying nozzles are disposed on both the upper surface side and the lower surface side of the substrate on the conveying roller.

29. The substrate processing apparatus according to any one of claims 16 to 28,

the polishing apparatus is provided with a housing which houses at least one of the polishing section, the cleaning section, the drying section, and the conveying section, wherein the housing is provided with a window for viewing the inside from the outside, and the window is provided with a light shielding member.

Technical Field

The present invention relates to a substrate transfer apparatus and a substrate processing apparatus including the same. The present application claims the priority of japanese patent application No. 2018-132231, which was filed on 12.7.2018. All disclosures including the specification, claims, drawings and abstract of Japanese patent application No. 2018-132231 are incorporated herein by reference in their entirety.

Background

In the manufacture of semiconductor devices, a Chemical Mechanical Polishing (CMP) apparatus is used to planarize the surface of a substrate. The substrate used for manufacturing a semiconductor device is in many cases a disk shape. In addition, there is a growing demand for flatness when planarizing the surface of a rectangular substrate such as a CCL substrate (Copper Clad Laminate/Copper Clad Laminate) substrate, a PCB (Printed Circuit Board/Printed Circuit Board) substrate, a mask substrate, or a display panel, not only for semiconductor devices. Further, there is an increasing demand for flattening the surface of a package substrate on which electronic components such as a PCB substrate are arranged.

Documents of the prior art

Patent document 1: japanese patent laid-open publication No. 2003-103458

Patent document 2: japanese patent laid-open No. 2014-176950

Disclosure of Invention

Although the circular semiconductor substrate is sized according to a specification (for example, SEMI specification), since the CCL substrate (chip Clad Laminate substrate) or the rectangular substrate such as a pcb (printed Circuit board) substrate, a mask substrate, or a display panel is not sized, there may be substrates of various sizes. In view of the manufacturing efficiency of the device, the substrate size tends to become large, and a large and heavy substrate is likely to be bent or deformed, and the same technique as that of the conventional circular substrate transfer apparatus is not necessarily applied. Therefore, it is an object to provide an automated apparatus for transporting a rectangular substrate.

Means for solving the problems

According to one embodiment, there is provided a substrate transfer apparatus for transferring a substrate having a rectangular shape, the substrate transfer apparatus including: a plurality of conveying rollers configured to support a lower surface of the substrate; a plurality of roller shafts to which the plurality of conveyance rollers are attached; a motor for rotating the plurality of roller shafts; and a pusher for lifting the substrate on the plurality of transport rollers to separate the substrate on the plurality of transport rollers from the plurality of transport rollers, the pusher having a platform that is passable through a gap between the plurality of transport rollers.

Drawings

Fig. 1 is a plan view showing an overall structure of a substrate processing apparatus according to an embodiment.

Fig. 2 is a side view schematically showing a load cell according to an embodiment.

Fig. 3 is a perspective view showing a conveyance mechanism of a load unit according to an embodiment.

Fig. 4 is a plan view schematically showing a substrate as a target processing object according to an embodiment.

Fig. 5 is an enlarged view showing the vicinity of the conveying roller shown in fig. 3.

Fig. 6 is a side view schematically showing a conveying unit according to an embodiment.

Fig. 7 is a perspective view showing a conveying unit according to an embodiment.

Fig. 8 is a perspective view illustrating a pusher according to an embodiment.

Fig. 9 is a partial cross-sectional view of the pusher shown in fig. 8, viewed from arrow 9.

FIG. 10 is a side view illustrating one support column of the first platform according to one embodiment.

FIG. 11 is a side view illustrating one support post of the second platform according to one embodiment.

FIG. 12 is a partial cross-sectional view showing the first and second stages in an upper position.

Fig. 13 is a partial cross-sectional view showing the first and second stages in the upper position and the second stage in a position raised relative to the first stage.

Fig. 14 is a top view showing the arrangement of the intermediate plate and the XY stopper according to an embodiment.

Fig. 15 is an enlarged view of the vicinity of the rotating platform of the pusher shown in fig. 8.

Fig. 16 is a perspective view showing a conveying roller and a press roller in a cleaning section according to an embodiment.

Fig. 17 is a perspective view illustrating a platen roller according to an embodiment, alone.

Fig. 18 is a cross-sectional view of the block and screw shown in fig. 17, viewed from arrow 18.

Fig. 19 is a perspective view schematically showing a polishing unit according to an embodiment.

Fig. 20 is a side sectional view schematically showing a top ring structure according to an embodiment.

Fig. 21 is a side view schematically showing a drying unit according to an embodiment.

Fig. 22 is a perspective view showing a conveying roller and a driving mechanism of an upper conveying roller according to an embodiment.

Fig. 23 is a side view illustrating the driving mechanism shown in fig. 22.

Fig. 24 is a diagram illustrating a driving mechanism of the upper conveying roller according to an embodiment.

Fig. 25 is a side view schematically showing an unloading unit according to an embodiment.

Fig. 26 is a diagram showing a casing of the conveyance unit as an example.

Fig. 27A is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 27B is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 27C is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 27D is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 27E is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 27F is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 28A is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 28B is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 28C is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 28D is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 28E is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Fig. 28F is a diagram illustrating a pattern of grooves formed in a polishing pad according to an embodiment.

Detailed Description

Embodiments of a substrate transfer apparatus and a substrate processing apparatus including the substrate transfer apparatus according to the present invention will be described below with reference to the accompanying drawings. In the drawings, the same or similar elements are denoted by the same or similar reference numerals, and in the description of the respective embodiments, the overlapping description of the same or similar elements may be omitted. The features shown in the respective embodiments may be applied to other embodiments as long as they are not contradictory to each other.

Fig. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1000 according to an embodiment. The substrate processing apparatus 1000 shown in fig. 1 includes: a loading unit 100, a conveying unit 200, a polishing unit 300, a drying unit 500, and an unloading unit 600. In the illustrated embodiment, the conveyance unit 200 includes two conveyance units 200A and 200B, and the polishing unit 300 includes two polishing units 300A and 300B. In one embodiment, these individual units may be formed independently. Since these units are independently formed, the substrate processing apparatus 1000 having different structures can be simply formed by arbitrarily combining the number of the units. The substrate processing apparatus 1000 includes a control device 900, and each component of the substrate processing apparatus 1000 is controlled by the control device 900. In one embodiment, the control device 900 may be a general electronic computer including an input/output device, a computing device, a storage device, and the like.

< load cell >

The load cell 100 is a unit for guiding the substrate WF before polishing, cleaning, and the like into the substrate processing apparatus 1000. Fig. 2 is a side view schematically showing a load cell 100 according to an embodiment. In one embodiment, the load cell 100 includes a housing 102. The housing 102 includes an inlet opening 104 on the receiving substrate WF side. In the embodiment shown in fig. 2, the right side is the inlet side. The load cell 100 receives a substrate WF to be processed from the inlet opening 104. A processing apparatus is disposed upstream (right side in fig. 2) of the load cell 100, and a processing step before processing of the substrate WF is performed in the substrate processing apparatus 1000 according to the present description. In the embodiment shown in fig. 2, the load unit 100 includes an ID reader 106. The ID reader 106 reads the ID of the substrate received from the entrance opening 104. The substrate processing apparatus 1000 performs various processes on the substrate WF in response to the read ID. In one embodiment, the ID reader 106 may not be present. In one embodiment, the load cell 100 is configured to conform to the mechanical Equipment interface specification (IPC-SMEMA-9851) of SMEMA (Surface Mount Equipment Manufacturers Association).

In the embodiment shown in fig. 2, the load unit 100 includes: the plurality of conveyance rollers 202 convey the substrate WF. By rotating the conveyance roller 202, the substrate WF on the conveyance roller 202 can be conveyed in a specific direction (in the left direction in fig. 2). In the illustrated embodiment, the housing 102 of the load cell 100 has an outlet opening 108 for the substrate WF. The load unit 100 includes: the sensor 112 detects whether or not the substrate WF is present at a specific position on the conveying roller 202. The sensor 112 may be any form of sensor, such as an optical sensor. In the embodiment shown in fig. 2, three sensors 112 are provided in the housing 102, one sensor 112a provided near the inlet opening 104, one sensor 112b provided near the center of the load cell 100, and the other sensor 112c provided near the outlet opening 108. In one embodiment, the operation of the load cell 100 may be controlled according to the substrate WF detected by the sensors 112. For example, when the sensor 112a near the entrance opening 104 detects the presence of the substrate WF, the conveying roller 202 in the load cell 100 may start rotating, and the rotation speed of the conveying roller 202 may be changed. When the sensor 112c near the exit opening 108 detects the presence of the substrate WF, the entrance shutter 218 of the transfer unit 200A of the subsequent unit may be opened.

Fig. 3 is a perspective view showing a conveyance mechanism of the load unit 100 according to an embodiment. In the illustrated embodiment, the carrying mechanism of the load unit 100 includes: a plurality of conveyance rollers 202, and a plurality of roller shafts 204 to which the conveyance rollers 202 are attached. In the illustrated embodiment, three conveying rollers 202 are attached to each roller shaft 204. The substrate WF is disposed on the conveying rollers 202, and is conveyed by the rotation of the conveying rollers 202. The mounting position of the conveyance roller 202 on the roller shaft 204 may be any position as long as the substrate WF can be stably conveyed. However, since the conveying roller 202 contacts the substrate WF, the conveying roller 202 should be disposed in contact with an area where there is no problem even if it contacts the substrate WF to be processed. In one embodiment, the conveying roller 202 of the load cell 100 may be composed of a conductive polymer. In one embodiment, the conveying roller 202 is electrically grounded via the roller shaft 204. This is to prevent the substrate WF from being charged and damaging. In one embodiment, an ionizer (not shown) may be provided in the load cell 100 to prevent the substrate WF from being charged.

Fig. 4 is a plan view schematically showing a substrate WF as a target processing object according to an embodiment. As shown in fig. 4, in one embodiment, the substrate WF is a thin plate-like substrate having a substantially rectangular shape (including a square shape). The substrate WF shown in fig. 4 includes a pattern region 10 and a non-pattern region 20. The "pattern region" is a region provided with wiring, a functional chip, and the like, is a region used as an element formed on a substrate, and is a region provided with significant wiring, a functional chip, and the like in an element function. The term "non-pattern region" refers to a region that is not used as an element formed on a substrate. In the embodiment shown in fig. 4, the substrate WF includes two pattern regions 10, and each pattern region 10 surrounds a non-pattern region 20. In one embodiment, the substrate WF may include ID information of the substrate WF in the non-pattern region 20, and may include, for example, an ID tag 12. The ID of the substrate WF can be read by the ID reader 106.

The load cell 100 shown in fig. 2 and 3 receives and conveys the substrate WF so that the surface formed in the pattern region 10 of the substrate WF shown in fig. 4 becomes the lower surface. Therefore, the conveying roller 202 is disposed so as to contact only the non-pattern region 20 of the substrate WF. Specifically, as shown in fig. 3, the conveying roller 202 is provided at a position contacting the non-pattern region 20 at the end of the substrate WF and at a position contacting the non-pattern region 20 at the center of the substrate WF. The position of the conveyance roller 202 can be changed in accordance with the substrate WF to be processed. Therefore, according to the illustrated embodiment, the mounting position of the conveyance roller 202 to the roller shaft 204 is changed, and the conveyance roller can be used to convey substrates WF having different sizes or different patterns. Since the rectangular substrate is not sized according to the specification as in the case of the circular semiconductor substrate, the transfer mechanism according to the embodiment of the present specification can transfer substrates of various sizes with only a slight change, which is advantageous.

In the embodiment shown in fig. 3, the roller shaft 204 is rotationally driven by a motor 208 via a gear 206. In one embodiment, the motor 208 may be a servo motor. By using the servo motor, the rotational speed of the roller shaft 204 and the conveying roller 202, that is, the conveying speed of the substrate WF can be controlled. Also, in one embodiment, the gear 206 may be a magnetic gear. Since the magnetic gear is a non-contact type power transmission mechanism, particles are not generated due to friction unlike a contact type gear, and maintenance such as oil supply is not required.

Fig. 5 is an enlarged view of the vicinity of the conveying roller shown in fig. 3. As shown in fig. 5, a support member 210 is disposed between the conveying rollers 202 adjacent to each other in the conveying direction. The support member 210 prevents the substrate WF conveyed by the conveying rollers 202 from entering the gap between the conveying rollers 202. The support member 210 is disposed at a position slightly lower than the height of the surface of the conveying roller 202 with which the substrate WF is in contact.

As shown in fig. 3 and 5, a plurality of guide rollers 212 for supporting the substrate WF are provided in the width direction of the substrate WF being conveyed. The width direction is a direction perpendicular to the conveyance direction of the substrate WF and parallel to the surface of the substrate WF. As shown in fig. 3, the guide roller 212 is configured to support a side surface of the substrate WF being conveyed. The position of the guide roller 212 may be changed according to the size of the substrate WF to be conveyed. The guide roller 212 shown in the figure is configured to be freely rotatable without being connected to a power source. In one embodiment, the guide roller 212 may be changed in position according to the width of the substrate WF to be conveyed.

As shown in fig. 2 and 3, the load cell 100 is provided with auxiliary rollers 214 near the inlet opening 104 and the outlet opening 108. The auxiliary roller 214 is disposed at the same height as the conveying roller 202. The position of the auxiliary roller 214 can be changed according to the size of the substrate WF to be conveyed. The auxiliary rollers 214 support the substrate WF so that the substrate WF being transported does not fall between the units and other units. The auxiliary roller 214 is configured to be freely rotatable without being connected to a power source.

In one embodiment, the load unit 100 may include: an inverting mechanism (not shown) for inverting the received substrate WF. In the illustrated embodiment, the load cell 100 receives and conveys the substrate WF so that the surface of the pattern region 10 on which the substrate WF is formed becomes the lower surface, but when the substrate WF is conveyed to the load cell 100 so that the surface of the pattern region 10 on which the substrate WF is formed becomes the upper surface by the way of an upstream processing apparatus, the substrate WF is inverted by an inverter so that the surface of the pattern region 10 on which the substrate WF is formed becomes the lower surface, and therefore, the subsequent processing of the substrate processing apparatus 1000 can be performed.

< conveying Unit >

Fig. 6 is a side view schematically showing the conveyance unit 200 according to one embodiment. The substrate processing apparatus 1000 shown in fig. 1 includes two conveyance units 200A and 200B. Since the two conveying units 200A and 200B can have the same structure, they will be described below as the conveying unit 200.

Fig. 7 is a perspective view showing the conveyance unit 200 according to an embodiment. The illustrated conveyance unit 200 includes: the plurality of conveyance rollers 202 convey the substrate WF. By rotating the conveyance roller 202, the substrate WF on the conveyance roller 202 can be conveyed in a specific direction. The conveying roller 202 of the conveying unit 200 may be formed of a conductive polymer or a non-conductive polymer. The conveying roller 202 is attached to a roller shaft 204, and is driven by a motor 208 via a gear 206, as in the load unit 100. In one embodiment, the motor 208 may be a servo motor and the gear 206 may be in the form of a gear, but may also be a magnetic gear as with the load cell 100. The illustrated conveying unit 200 includes, as with the load unit 100: the guide roller 212 supports a side surface of the substrate WF being transported. The illustrated conveyance unit 200 includes: the sensor 216 detects whether or not the substrate WF is present at a specific position on the conveying roller 202. The sensor 216 may be any form of sensor, such as an optical sensor. In the embodiment shown in fig. 6, seven sensors 216 (216a to 216g) are provided in the conveying unit 200. In one embodiment, the operation of the transfer unit 200 may be controlled in response to the detection of the substrate WF by the sensors 216a to 216 g. The positions and functions of these sensors 216a to 216g will be described later. As shown in fig. 6, the conveyance unit 200 includes: the entrance shutter 218 is openable and closable to receive the substrate WF in the transfer unit 200. In one embodiment, as in the loading unit 100, the transfer unit 200 is provided with a plurality of guide rollers 212 (shown in fig. 7) for supporting the substrate WF on both sides in the width direction of the substrate WF and supporting members 210 (not shown in fig. 7) for preventing the substrate WF from entering the gap between the transfer rollers 202 adjacent to the transfer direction.

As shown in fig. 6, the carrying unit 200 has a stopper 220. The stopper 220 is connected to a stopper moving mechanism 222, and the stopper 220 can enter the conveyance path of the substrate WF moving on the conveyance roller 202. When the stopper 220 is positioned in the transfer path of the substrate WF, the side surface of the substrate WF moving on the transfer roller 202 contacts the substrate WF, and the moving substrate WF can be stopped at the position of the stopper 220. When the stopper 220 is positioned away from the conveyance path of the substrate WF, the substrate WF can move on the conveyance roller 202. The stop position of the substrate WF by the stopper 220 is a position (substrate transfer position) at which a pusher 230 described later can receive the substrate WF on the transfer roller 202.

As shown in fig. 6 and 7, the carrying unit 200 includes a pusher 230. The pusher 230 is configured to lift the substrate WF positioned on the plurality of conveyance rollers 202 so that the substrate WF is separated from the plurality of conveyance rollers 202. The pusher 230 is configured to be able to transfer the held substrate WF to the conveying roller 202 of the conveying unit 200.

Fig. 8 is a perspective view illustrating a pusher 230 according to an embodiment. Fig. 9 is a partial sectional view of the pusher 230 shown in fig. 8, viewed from the arrow 9. Fig. 9 schematically shows the conveyance roller 202 together with the pusher 230, the substrate WF disposed at the substrate transfer position on the conveyance roller 202, and the top ring 302 for receiving the substrate WF. In the embodiment shown in fig. 8 and 9, the pusher 230 includes a first stage 232 and a second stage 270. The first stage 232 is a stage for supporting the holding member 308 of the top ring 302 when the substrate WF is transferred from the pusher 230 to the top ring 302, which will be described later. The first platform 232 includes a plurality of support posts 234. Fig. 10 is a side view illustrating one support column of the first stage 232 according to an embodiment. As shown in fig. 10, one end of the support column 234 includes: a flat support surface 234a that supports the holding member 308 of the top ring 302; and an inclined surface 234b for guiding the plurality of support columns 234. In one embodiment, among the plurality of support columns 234, the support columns 234 positioned at the four corners may include support surfaces 234a and inclined surfaces 234b as shown in fig. 10. The recesses formed by the four corner support posts 234 allow for positional alignment of the retaining members 308. The support columns 234 other than the four corners may include only the support surfaces 234 a. The other end of each support column 234 is connected to a common base 236. The support columns 234 are provided at positions that do not interfere with the conveying rollers 202, and in the embodiment shown in fig. 9, the support columns 234 are disposed between the conveying rollers 202. The second surface plate 270 is configured to receive the substrate WF on the conveying roller 202. The second platform 270 includes a plurality of support columns 272. FIG. 11 is a side view illustrating one support column 272 of the second platform 270 according to one embodiment. As shown in fig. 11, one end of the support column 272 has a flat support surface 272 a. The other end of each support column 272 is connected to a common base 274. The support columns 272 are provided at positions that do not interfere with the conveying rollers 202, and in the embodiment shown in fig. 9, the support columns 272 are disposed between the conveying rollers 202. Each support column 272 is arranged to support the non-pattern region 20 of the substrate WF. The first platform 232 and the second platform 270 are connected to the lifting mechanism, respectively, and can move in the height direction (z direction), respectively, as described in detail below.

The first stage 232 is configured to be movable in the height direction (z direction). In one embodiment, the pusher 230 has a first elevating mechanism 231. In one embodiment, as shown in fig. 8 and 9, the first lifting mechanism 231 of the pusher 230 is a pneumatic lifting mechanism, and includes a cylinder 240 and a piston 242. An end of the piston 242 is connected to a movable base 244. The cylinder 240 is connected to the stationary base 246. The fixing base 246 is fixed to the case 201 covering the entire conveying unit 200, the bottom surface on which the conveying unit 200 is provided, or the like. By adjusting the air pressure in the cylinder 240, the piston 242 is moved, and the movable base 244 can be moved in the height direction (z direction). The first stage 232 and the second stage 270 can be moved in the height direction by moving the movable base 244 in the height direction. In the illustrated embodiment, an XY stage 248 is mounted on the movable base 244, and the XY stage 248 can move the first stage 232 and the second stage 270 in the horizontal plane. The XY table 248 may be a known XY table configured to move in two vertical directions with a linear guide or the like. In the illustrated embodiment, a rotary table 250 is mounted on the XY table 248. The rotary table 250 is configured to be rotatable in an XY plane (horizontal plane). In other words, the rotary table 250 is configured to be rotatable about the z-axis. The rotary table 250 may be a known rotary table 250 configured by a rotary bearing or the like. The second lifting mechanism 233 is mounted on the rotary platform 250. The second lifting mechanism 233 includes a cylinder 252 and a piston 254. The cylinder 252 is connected to the base 236 of the first platform 232. A movable piston 254 is connected to the cylinder 252, and the piston 254 is movable by adjusting the air pressure in the cylinder 252. A base 274 of the second platform 270 is connected to an end of the piston 254. Therefore, the piston 254 and the second stage 270 can be moved in the height direction (z direction) by adjusting the air pressure in the cylinder 252. Further, according to the above configuration, the first lifting mechanism 231 moves both the first platform 232 and the second platform 270 in the height direction (z direction), and the second lifting mechanism 233 can move the second platform 270 in the height direction (z direction) with respect to the first platform 232. The first stage 232 and the second stage 270 are movable in two directions (XY directions) perpendicular to each other in the horizontal plane by the XY stage 248. The first stage 232 and the second stage 270 are rotatable in the horizontal plane (around the z-axis) by the rotating stage 250. Therefore, when the substrate WF is received between the pusher 230 and the top ring 302, which will be described later, the pusher 230 and the top ring 302 can be aligned. In the illustrated embodiment, the first lifting mechanism 231 and the second lifting mechanism 233 are pneumatic lifting mechanisms, but these lifting mechanisms may be hydraulic lifting mechanisms, or may be electric lifting mechanisms using a motor, a ball screw, or the like.

The first stage 232 and the second stage 270 are movable between a lower position and an upper position by the first elevating mechanism 231. Fig. 9 shows the first platform 232 and the second platform 270 in the lower position. When the first and second stages 232 and 270 are in the lower positions, as shown in fig. 9, the end portions of the support columns 234 and 272 of the first and second stages 232 and 270 are located lower than the surface of the substrate WF supporting the transfer roller 202. Fig. 12 shows the first platform 232 and the second platform 270 in the up position. When the first and second stages 232 and 270 are at the upper positions, the end portions of the support columns 234 and 272 of the first and second stages 232 and 270 are located higher than the surface of the substrate WF supporting the transfer roller 202. That is, when the first and second stages 232 and 270 move from the lower position to the upper position, the substrate WF disposed on the transfer roller 202 can be lifted up and received by the second stage 270. Fig. 13 shows the first stage 232 and the second stage 270 in the upper position, and the second stage 270 is in the raised position with respect to the first stage 232. When the substrate WF is transferred from the pusher 230 to the top ring 302 described later, the second stage 270 holding the substrate WF is raised relative to the first stage 232 as shown in fig. 13.

As described above, the first stage 232 and the second stage 270 may be moved in a horizontal plane by the XY stage 248. In one embodiment, the first and second stages 232 and 270 may be configured to be movable in the horizontal plane by the XY stage 248 only in the upper position, and not movable in the lower position. In one embodiment, the pusher 230 may include an XY stop 280 for restricting the movement of the XY stage 248. In the illustrated embodiment, the rotary platform 250 is connected to the XY platform 248 via an intermediate plate 249. The pusher 230 of the illustrated embodiment includes four rod-shaped stopper members extending in the height direction as XY stoppers 280. Fig. 14 is a top view showing the arrangement of the intermediate plate 249 and the XY stopper 280. As shown in fig. 14, the intermediate plate 249 includes four arc portions 249 a. Each XY stopper 280 is disposed at a position where it engages with the four arc portions 249a of the intermediate plate 249. XY stop 280 is shown attached to stationary stage 246. The bar-shaped XY stopper 280 includes: a base 280a having a first diameter; the tip portion 280b has a diameter smaller than the first diameter. When the first and second stages 232, 270 are in the lower positions, the base portion 280a of each XY stopper 280 engages with the four arc portions 249a of the intermediate plate 249. The base portion 280a is positioned so as to contact the four circular arc portions 249a of the intermediate plate 249, and when the base portion 280a of each XY stopper 280 contacts the four circular arc portions 249a of the intermediate plate 249, the intermediate plate 249 becomes unable to move in the horizontal plane, and as a result, movement of the first and second stages 232 and 270 with the XY stage 248 is inhibited. When the first stage 232 and the second stage 270 are at the upper positions, the four arc portions 249a of the intermediate plate 249 slightly engage with the distal end portions 280b of the XY stoppers 280, respectively. That is, since the diameter of the tip portion 280b is smaller than that of the base portion 280a, the tip portion 280b is separated from the arc portion 249a of the intermediate plate 249 by a certain distance. Therefore, when the four arc portions 249a of the intermediate plate 249 lightly engage with the distal end portion 280b of each XY stopper 280, the intermediate plate 249 can move only in a certain range within the horizontal plane.

As described above, the first and second stages 232 and 270 may be rotated in a horizontal plane by the rotating stage 250. In one embodiment, the first and second stages 232 and 270 may be configured to be rotatable in the horizontal plane by the rotating stage 250 only when the first and second stages are located at the upper position, and may not be rotatable when the first and second stages are located at the lower position. In one embodiment, as shown in fig. 8, the pusher 230 may include: a rotation stopper 282 for restricting rotation caused by the rotation of the rotation platform 250. The illustrated rotary platform 250 includes a protrusion 250a extending in the horizontal direction. The pusher 230 of the illustrated embodiment includes two rod-shaped stopper members extending in the height direction as the rotation stoppers 282. Fig. 15 is an enlarged view of the vicinity of the rotating platform 250 of the pusher 230 shown in fig. 8. The rotation stopper 282 is disposed so as to sandwich the protrusion 250a between two rod-shaped stop members. As shown in fig. 8, the rotation stopper 282 is attached to the stationary base 246. The rod-shaped rotation stopper 282 includes: a base 282a having a first diameter; and a tip part 282b having a diameter smaller than the first diameter. When the first and second stages 232 and 270 are located at the lower positions, the protruding portion 250a is tightly held by the two rotation stoppers 282. Therefore, when the first and second stages 232 and 270 are positioned at the lower positions, the base portions 282a of the two rotation stoppers 282 restrict the rotation of the protrusions 250a provided on the rotation stage 250, and as a result, the rotation of the first and second stages 232 and 270 by the rotation stage 250 is prohibited. When the first and second stages 232 and 270 are located at the upper positions, the protruding portions 250a of the rotating stages 250 are lightly clamped by the tip portions 282b of the two rotation stoppers 282. Since the tip portion 282b has a smaller diameter than the base portion 282a, the tip portion 282b slightly restricts the rotation of the protrusion 250a of the rotation platform 250. Therefore, when the tip portions 282b of the two rotation stoppers 282 are lightly engaged with the protrusions 250a, the rotation platform 250 can be rotated only within a range between the two tip portions 282 b.

The conveyance unit 200 shown in fig. 6 and 7 has a cleaning unit. As shown in fig. 6 and 7, the cleaning unit has a cleaning nozzle 284. The cleaning nozzle 284 has: an upper cleaning nozzle 284a disposed above the conveying roller 202; and a lower cleaning nozzle 284b disposed at a lower side. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b are connected to a supply source of a cleaning liquid, not shown. The upper cleaning nozzle 284a is configured to supply a cleaning liquid to the upper surface of the substrate WF conveyed on the conveying roller 202. The lower cleaning nozzle 284b is configured to supply a cleaning liquid to the lower surface of the substrate WF conveyed on the conveying roller 202. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b are configured to have a width equal to or greater than the width of the substrate WF conveyed by the conveying roller 202, and clean the entire surface of the substrate WF when the substrate WF is conveyed by the conveying roller 202. As shown in fig. 6 and 7, the cleaning unit is located downstream of the substrate transfer position of the pusher 230 of the transfer unit 200.

As shown in fig. 6, in the cleaning section, a pressure roller 290 is disposed on the conveying roller 202. Fig. 16 is a perspective view showing the conveying roller 202 and the pressing roller 290 in the cleaning section. Fig. 17 is a perspective view showing the pressing roller 290 alone. In fig. 17, the support shaft 291 and the block 292 are shown by broken lines. As shown in fig. 16 and 17, the platen roller 290 is rotatably mounted on a support shaft 291. The support shaft 291 is fixed to the block 292 or is formed integrally with the block 292. As shown in fig. 16 and 17, the block 292 has three holes 293a to 293c penetrating in the height direction, and screws 294a to 294c are inserted therein, respectively. Fig. 18 is a cross-sectional view of the block 292 and screws 294a to 294c shown in fig. 17, viewed from arrow 18. As shown in fig. 18, block 292 is attached to base 295 by two screws 294a, 294 c. An elastic member 296 such as a spring is provided between each of the two screws 294a and 294c and the block 292, and the block 292 is urged to the base 295 by the elastic member 296. The base 295 is a member fixed to the conveying roller 202, and is fixed to the supporting roller shaft 204, for example. The front end of the screw 294b in the center of the block 292 contacts the base 295, and the distance between the block 292 and the base 295 is adjustable by the insertion depth of the screw 294 b. In other words, the distance between the conveying roller 202 and the pressing roller 290 can be adjusted by the insertion depth of the screw 294 b. The distance between the conveying roller 202 and the pressing roller 290 may be appropriately determined according to the thickness of the substrate WF to be conveyed. The position of the pressing roller 290 may be changed according to the size of the substrate WF conveyed together with the conveying roller 202.

As shown in fig. 6, the sensor 216d is disposed near the inlet of the cleaning section. In one embodiment, when the substrate WF is detected by the sensor 216d, the cleaning nozzle 284 ejects the cleaning liquid to start cleaning the substrate WF. In cleaning the substrate WF, the number of rotations of the conveying roller 202 may be set as the speed for cleaning. In the embodiment of fig. 6, the sensor 216f is disposed near the outlet point of the washing section. In one embodiment, when the sensor 216f detects the substrate WF, the ejection of the cleaning liquid from the cleaning nozzle 284 may be terminated. In cleaning the substrate WF, the substrate WF is transported by the transport roller 202 and the pressing roller 290 while being sandwiched therebetween, so that the substrate WF can be stably transported even during the cleaning liquid injection.

As shown in fig. 6, the conveyance unit 200 has an openable and closable exit shutter 286. The conveying unit 200 includes a sensor 216g near the exit. In one embodiment, when the sensor 216g detects the substrate WF, the exit gate 286 may be opened to transfer the substrate WF to the next unit. In one embodiment, when the sensor 216g detects the substrate WF, the conveyance of the substrate WF by the conveyance roller 202 may be stopped without opening the exit gate 286, and after the processing of the next unit is completed and the substrate reception of the next unit is completed, the exit gate 286 may be opened to convey the substrate WF to the next unit.

< grinding unit >

Fig. 19 is a perspective view schematically showing a polishing unit 300 according to an embodiment. The substrate processing apparatus 1000 shown in fig. 1 includes two polishing units 300A and 300B. Since the two polishing units 300A, 300B may be of the same construction, they will be described below together as two polishing units 300.

As shown in fig. 19, the polishing unit 300 includes a polishing table 350 and a top ring 302. The polishing table 350 is rotationally driven by a drive source not shown. A polishing pad 352 is attached to the polishing table 350. In one embodiment, the polishing pad 352 may be attached via a layer for facilitating peeling from the polishing pad 352. Examples of such a layer include an organic silicon layer and a fluorine resin layer, and the layers described in, for example, Japanese patent application laid-open No. 2014-176950 may be used. The top ring 302 holds the substrate WF and presses against the polishing pad 352. The top ring 302 is rotationally driven by a drive source not shown. The substrate WF is polished by being held by the top ring 302 and pressed against the polishing pad 352.

In one embodiment, grooves are provided on the surface of the polishing pad 352. Such grooves are used to control the flow of the polishing liquid supplied to the surface of the polishing pad 352. The size, dimension, cross-sectional shape, and pattern of the grooves are arbitrary.

Fig. 27A to F are diagrams showing a pattern of grooves 359 formed in the polishing pad 352 according to an embodiment. Fig. 27A to F are plan views showing the surface of the polishing pad 352, that is, the surface contacting the substrate WF during polishing. In the embodiment shown in fig. 27A to C, the grooves 359 of the polishing pad 352 have a pattern in the shape of concentric circles and a pattern extending radially from the center of the circular polishing pad 352. In the illustrated embodiment, the radial grooves 359 do not extend to the outermost periphery of the polishing pad 352 and terminate partway along the polishing pad 352. A portion of the grooves 359 may also extend to the outermost periphery of the polishing pad 352 as an alternative embodiment. During polishing, the polishing pad 352 rotates together with the polishing table 350. Therefore, the polishing liquid supplied from the polishing liquid supply nozzle 354 or the through hole 357 positioned substantially at the center of the polishing pad 352, which will be described later, is forced radially outward of the polishing pad 352 by centrifugal force, and flows outward in the semi-passing direction. At this time, since the polishing liquid ends in the middle of the polishing pad 352 as shown in the radial grooves 359, the polishing liquid overflows from the radial grooves 359 at the end portion, is further guided to the concentric grooves 359, and easily enters between the polishing pad 352 and the substrate. As shown, the grooves 359 of various lengths extend radially and communicate with the concentric circular grooves to efficiently supply polishing slurry between the polishing pad 352 and the substrate. In the embodiment shown in fig. 27D to F, the grooves 359 are formed in a lattice shape. In the pattern of the grooves 359 shown in fig. 27D, a lattice of the same size is formed, and the grooves 359 do not extend to the outermost periphery. In the pattern of the grooves 359 shown in fig. 27E, a lattice of different sizes is formed, and the grooves 359 do not extend to the outermost periphery to end. In the pattern of the grooves 359 shown in fig. 27F, a lattice of the same size is formed, and the grooves 359 do not extend to the outermost periphery to terminate. The polishing pad having such grooves is used to polish the substrate WF, and the amount of the polishing liquid used is suppressed, thereby obtaining a good polishing rate.

Fig. 28A to F are diagrams showing the pattern of grooves 359 formed in the polishing pad 352 according to one embodiment. Fig. 28A to F are plan views showing the surface of the polishing pad 352, that is, the surface contacting the substrate WF during polishing. In the embodiment shown in fig. 28A to C, the grooves 359 of the polishing pad 352 have a pattern in the shape of concentric circles and a pattern extending radially from the center of the circular polishing pad 352. In the illustrated embodiment, the radial grooves 359 do not extend to the outermost periphery of the polishing pad 352 and terminate partway along the polishing pad 352. A portion of the grooves 359 may also extend to the outermost periphery of the polishing pad 352 as an alternative embodiment. In the embodiment shown in fig. 28A to C, a part of the radial groove 359 forming the tip in the middle is spaced from the outer side of the radial groove 359 forming the tip in the radial direction at a constant interval, and the radial groove 359 is further formed on the outermost periphery. Such radial grooves 359 promote the discharge of the polishing liquid by allowing the polishing liquid overflowing from the grooves 359 (supply grooves) at the end portions to flow into the grooves 359 (discharge grooves) located outside the separation portions again. The used polishing liquid or polishing debris accumulated on the polishing pad is less likely to accumulate in the grooves for discharge, and the formation of scratches on the substrate WF during polishing can be further prevented as compared with the example shown in fig. 27 in which the grooves for discharge are not provided. The discharge groove preferably has a larger cross-sectional area than the supply groove. The concentric grooves 359 function in the same manner as described above with reference to fig. 27A to C. In the embodiment shown in fig. 28D to F, the grooves 359 are formed in a lattice shape. In the embodiment shown in fig. 28D to F, the grooves 359 (grooves for supply) in the lattice pattern do not extend to the outermost periphery, but are terminated on the way, and the outer sides thereof are formed at a constant interval, and the grooves 359 (grooves for discharge) are further formed toward the outermost periphery. The pattern of the grooves 359 shown in the drawings is an example, and grooves of any pattern may be formed. A pattern of grooves can also be formed that combines any of the features shown. The polishing pad having such grooves polishes the substrate WF, thereby suppressing the amount of the polishing liquid used, obtaining a good polishing rate, and further suppressing scratches caused by the polishing debris.

As shown in fig. 19, the polishing unit 300 includes: a polishing liquid supply nozzle 354 for supplying a polishing liquid or a dressing liquid to the polishing pad 352. The grinding fluid is slurry. The conditioning liquid is, for example, pure water. As shown in fig. 19, a passage 353 for supplying the polishing liquid is provided in the polishing table 350 and the table shaft 351. The passage 353 communicates with the opening 355 on the surface of the polishing table 350. The polishing pad 352 has a through-hole 357 formed at a position corresponding to the opening 355 of the polishing table 350, and the polishing liquid passing through the passage 353 is supplied from the opening 355 of the polishing table 350 and the through-hole 357 of the polishing pad 352 to the surface of the polishing pad 352. The opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 may be one or plural. The positions of the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 are arbitrary, but in one embodiment, the openings are disposed near the center of the polishing table 35. The polishing unit 300 further includes a dresser 356 to adjust the polishing pad 352. The polishing unit 300 further includes: and an atomizer 358 for spraying a liquid or a mixed fluid of a liquid and a gas toward the polishing pad 352. The liquid sprayed from sprayer 358 is, for example, pure water, and the gas is, for example, nitrogen.

The top ring 302 is supported by a top ring shaft 304. The top ring 302 is rotated around the axial center of the top ring shaft 304 as indicated by an arrow AB by a driving unit not shown. The top ring shaft 304 is movable in the vertical direction by a drive mechanism not shown. The polishing table 350 is supported by a table shaft 351. The polishing table 350 is rotated around the axis of the table shaft 351 by a driving unit not shown as an arrow AC.

The substrate WF is held by vacuum suction on the surface of the top ring 302 facing the polishing pad 352. During polishing, the polishing liquid is supplied from the polishing liquid supply nozzle 354 and/or from the through-hole 357 in the polishing pad 352 to the polishing surface of the polishing pad 352. During polishing, the polishing table 350 and the top ring 302 are rotationally driven. The substrate WF is polished by being pressed against the polishing surface of the polishing pad 352 by the top ring 302.

As shown in fig. 19, the top ring shaft 304 is connected to an arm 360, and the arm 360 can swing about a rotation shaft 362. In polishing the substrate WF, the arm 360 may be fixed or swung so that the top ring 302 passes through the center of the polishing pad 352. In polishing the substrate WF, the arm 360 may be fixed or swung so that the substrate WF covers the through-hole 357 of the polishing pad 352. As shown in fig. 1, the top ring 302 is movable toward the carrying unit 200 by a swingable arm 360. When the top ring 302 moves to the substrate transfer position of the transfer unit 200, the top ring 302 can receive the substrate WF from the pusher 230 as described above with reference to fig. 9, 12, and 13. After the polishing unit 300 polishes the substrate WF, the substrate WF may be transferred from the top ring 302 to the pusher 230. The top ring 302 is configured to detect the rotation angle thereof by a rotation angle detector, not shown, and to stop the rotation in advance when the top ring is received or transferred to or from the substrate WF of the pusher 230, so that the holding member 308 of the top ring 302 and the pusher 230 can be aligned with the recesses formed by the support columns 234 at the four corners.

Fig. 20 is a side sectional view schematically showing the structure of a top ring 302 according to an embodiment. The top ring 302 is connected to the lower end of a top ring shaft 304. The top ring 302 includes: a substantially quadrangular head main body 306; and a holding member 308 disposed at a lower portion of the head main body 306. The head main body 306 may be formed of a material having high strength and rigidity, such as metal or ceramic. The holding member 308 may be made of a resin material having high rigidity, ceramic, or the like.

In a space formed inside the head main body 306 and the holding member 308, an elastic pad 310 abutting against the substrate WF is housed. Between the elastic pad 310 and the head main body 306, a pressure chamber (air bag) P1 is provided. The pressure chamber P1 is formed by the elastic pad 310 and the head main body 306. The pressure chamber P1 is supplied with a pressurized fluid such as pressurized air or vacuum sucked through the fluid passage 312. In the embodiment shown in fig. 20, the pressure chamber P1 is formed over the entire surface of the substrate WF to be held. In one embodiment, the elastic pad 310 and the head main body 306 may form a plurality of pressure chambers. When a plurality of pressure chambers are formed, a fluid passage communicating the pressure chambers may be provided to independently control the pressure of each pressure chamber.

The peripheral end of the substrate WF surrounds the holding member 308, and the substrate WF does not jump out of the head main body 306 during polishing. An elastic bag 314 is disposed between the holding member 308 and the head main body 306, and a pressure chamber Pr is formed inside the elastic bag 314. The holding member 308 is movable up and down with respect to the head main body 306 by expansion/contraction of the elastic bag 314. A fluid passage 316 is communicated with the pressure chamber Pr, and a pressurized fluid such as pressurized air is supplied to the pressure chamber Pr through the fluid passage 316. The internal pressure of the pressure chamber Pr is adjustable. Therefore, the pressing force of the holding member 308 against the polishing pad 352 can be adjusted independently of the pressing force of the substrate WF against the polishing pad 352. The top ring 302 according to the embodiment shown in fig. 20 is configured to include a plurality of holding members 308, and the pressing force of each holding member 308 against the polishing pad 352 can be adjusted by making each holding member 308 independent from each other by each elastic bag. In one embodiment, one holding member 308 and one elastic bag 314 in a substantially rectangular ring shape may be used.

< drying Unit >

The drying unit is a device for drying the substrate WF. In the substrate processing apparatus 1000 shown in fig. 1, the drying unit 500 dries the substrate WF cleaned in the cleaning section of the transfer unit 200 after polishing by the polishing unit 300. As shown in fig. 1, the drying unit 500 is disposed downstream of the conveying unit 200.

Fig. 21 is a side view schematically showing a drying unit 500 according to an embodiment. The drying unit 500 includes a conveying roller 202 for conveying the substrate WF. In one embodiment, the conveying roller 202 of the drying unit 500 may be composed of a conductive polymer. The conveying roller 202 is electrically grounded via a roller shaft 204. This is to prevent the substrate WF from being charged and damaging. In one embodiment, the drying unit 500 may be provided with an ionizer (not shown) for preventing the substrate WF from being charged. The conveying roller 202 of the drying unit 500 is driven by the gear 206 and the motor 208, like the conveying roller 202 of the conveying unit 200. As shown in fig. 21, an entrance shutter 502 is provided on the entrance side of the drying unit 500. The entrance shutter 502 is configured to be openable and closable. As shown in fig. 21, the drying unit 500 includes: the sensor 504 detects whether or not the substrate WF is present at a specific position on the conveying roller 202. The sensor 504 may be any form of sensor, such as an optical sensor. In the embodiment shown in fig. 21, three sensors 504 (504a to 504c) are provided in the drying unit 500, and in one embodiment, the operation of the drying unit 500 can be controlled in accordance with the detection of the substrate WF by these sensors 504a to 504 c. The positions and functions of these sensors 504a to 504c will be described later.

In the embodiment shown in fig. 21, the drying unit 500 includes: the nozzle 530 is used to inject gas toward the substrate WF conveyed by the conveying roller 202. The gas may be, for example, compressed air or nitrogen. In the illustrated embodiment, the nozzle 530 has: a lower nozzle 530a disposed below the conveying roller 202; and an upper nozzle 530b disposed above the conveying roller 202. The lower nozzle 530a is arranged to inject gas onto the lower surface of the substrate WF conveyed on the conveying roller 202. The upper nozzle 530b is arranged to inject gas onto the upper surface of the substrate WF conveyed by the conveying roller 202. The lower nozzle 530a and the upper nozzle 530b have widths equal to or larger than the width of the substrate WF to be transferred. Therefore, the gas can be sprayed to the entire substrate WF to be transferred through the lower nozzle 530a and the upper nozzle 530 b. The drying unit 500 blows off the water droplets on the substrate WF being transported by the lower nozzle 530a and the upper nozzle 530b, and dries the substrate WF. One lower nozzle 530a and one upper nozzle 530b may be provided, or a plurality of lower nozzles and a plurality of upper nozzles may be provided in the substrate WF transfer direction. In the embodiment shown in fig. 21, three lower nozzles 530a and three upper nozzles 530b are provided, respectively. Each nozzle 530 may be formed in a slit shape extending to the width of the substrate WF as a gas supply port.

The drying unit 500 shown in fig. 21 has an upper conveying roller 506 disposed on the conveying roller 202. The upper conveying roller 506 is connected to a power source and is configured to be rotatable. In one embodiment, the upper conveying roller 506 is configured to be driven by the gear 206 and the motor 208, as in the conveying roller 202.

Fig. 22 to 24 are views for explaining a driving mechanism of the upper conveying roller 506 according to an embodiment. Fig. 22 is a perspective view showing a driving mechanism of the conveyance roller 202 and the upper conveyance roller 506 according to an embodiment. Fig. 23 is a side view illustrating the driving mechanism shown in fig. 22. Fig. 24 is a side view of the drive mechanism shown in fig. 23 viewed from the opposite side. The drive mechanism of the upper conveying roller 506 has a coupling member 508. As shown, the connecting member 508 is a substantially L-shaped member. As shown in fig. 23, at one end of the connecting member 508, there are provided: the concave portion 510 is engaged with the roller shaft 204 that rotates the conveyance roller 202. The other end of the link member 508 is connected to an upper roller 512 that rotates the upper conveying roller 506 via a bearing or the like. In the illustrated embodiment, the upper conveying roller 506 may be disposed on the adjacent conveying roller 202 via an L-shaped coupling member 508. In the illustrated embodiment, the connecting member 508 is configured to be movable about the roller shaft 204 in the recess 510. Therefore, the upper conveying roller 506 is biased downward by the upper conveying roller 506 and the upper roller 512, but the upper conveying roller 506 can be moved upward according to the thickness of the substrate WF to be conveyed. The position of the upper conveying roller 506 can be changed according to the size of the substrate WF conveyed together with the conveying roller 202.

As shown in fig. 22 and 23, the first gear 514 is connected to the roller shaft 204, and when the roller shaft 204 rotates, the first gear 514 also rotates. The second gear 516 is connected to the first gear 514, and the rotation of the first gear 514 is transmitted to the second gear 516. A belt 518 is connected to the second gear 516, and rotation of the second gear 516 is transmitted to the belt 518. Belt 518 is connected to upper roller 512, and rotation of belt 518 rotates upper roller 512. With this configuration, the rotational force of the conveying roller 202 can be transmitted to the upper conveying roller 506. In the illustrated embodiment, the first gear 514 and the second gear 516 are transmission devices including mechanical gears, but magnetic gears may be used.

As shown in fig. 23, the drive mechanism of the upper conveying roller 506 has a stopper 520 that contacts the link member 508. By adjusting the position of the stopper 520, the lower limit of the displacement of the connecting member 508 centered on the roller shaft 204 can be restricted, and the distance between the upper conveying roller 506 and the lower conveying roller 202 can be adjusted by the stopper 520. The distance between the upper conveying roller 506 and the conveying roller 202 may be changed according to the substrate WF to be conveyed.

In one embodiment, as shown in fig. 21, the drying unit 500 is provided with an outlet shutter 540 on the outlet side. The exit door 540 is configured to be openable and closable. When the drying unit 500 dries the substrate WF, the outlet shutter 540 may be opened to transfer the dried substrate WF to the outside of the drying unit 500.

The drying unit 500 according to the above embodiment is configured to convey the substrate WF between the conveying rollers 202 and the upper conveying rollers 506 from the top and bottom. Therefore, even when the gas is jetted toward the substrate WF by the nozzle 530, the substrate WF can be stably transported.

< unload Unit >

The unloading unit 600 is a unit for carrying out the substrate WF subjected to the polishing, cleaning, and other processes from the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in fig. 1, the unloading unit 600 receives the substrate dried by the drying unit 500. As shown in fig. 1, the unloading unit 600 is disposed downstream of the drying unit 500.

Fig. 25 is a side view schematically showing an unloading unit 600 according to an embodiment. In one embodiment, the unloading unit 600 is provided with a housing 602. The housing 602 includes an inlet opening 604 on the receiving substrate WF side. In the embodiment shown in fig. 25, the right side is the inlet side. The unloading unit 600 receives the substrate WF from the inlet opening 604. In one embodiment, the unloading unit 600 is configured to conform to the mechanical device interface specification (IPC-SMEMA-9851) of SMEMA (surface Motor Equipment Manufacturers Association).

In the embodiment shown in fig. 25, the unloading unit 600 includes a plurality of conveying rollers 202 for conveying the substrate WF. By rotating the conveyance roller 202, the substrate on the conveyance roller 202 can be conveyed in a specific direction. In one embodiment, the conveying roller 202 of the unloading unit 600 may be made of a conductive polymer. In one embodiment, the conveying roller 202 is electrically grounded via the roller shaft 204. This is to prevent the substrate WF from being charged and damaging. In one embodiment, an ionizer (not shown) may be provided in the unloading unit 600 to prevent the substrate WF from being charged.

In the illustrated embodiment, the housing 602 of the unloading unit 600 has an outlet opening 608 for the substrate WF. The unloading unit 600 has a sensor 612 for detecting whether or not the substrate WF is present at a specific position on the conveying roller 202. The sensor 612 may be any form of sensor, such as an optical sensor. In the embodiment shown in fig. 25, three sensors 612 are provided in the housing 602, one being a sensor 612a provided near the inlet opening 604, one being a sensor 612b provided near the center of the unloading unit 600, and the other being a sensor 612c provided near the outlet opening 608. In one embodiment, the operation of the unloading unit 600 may be controlled in response to the detection of the substrate WF by the sensors 612. For example, when the sensor 612a near the entrance opening 604 detects the presence of the substrate WF, the rotation of the conveyance roller 202 in the unloading unit 600 may be started, or the rotation speed of the conveyance roller 202 may be changed. In one embodiment, when the load unit 100 needs an inverter, the unloading unit 600 may include: an inverter (not shown) for inverting the substrate WF.

The following describes a transfer path of the substrate WF in the substrate processing apparatus 1000. The operation of the substrate processing apparatus 1000 is controlled by the control apparatus 900. Another processing apparatus is disposed upstream of the substrate processing apparatus 1000. The substrate WF processed by another processing apparatus on the upstream side is carried in from the inlet opening 104 of the load unit 100 of the substrate processing apparatus 1000. In the above embodiment, the substrate WF is transported with the surface polished by the polishing unit 300 facing downward. In one embodiment, when the sensor 112a of the load cell 100 detects the substrate WF, the movement of the conveying roller 202 of the load cell 100 may be started. The substrate WF introduced from the load cell 100 is read by the reader 106 for ID of the substrate WF. The process of the substrate processing apparatus 1000 may be determined in accordance with the read ID. Further, when it is determined that the introduced substrate WF is not to be processed by the substrate processing apparatus 1000 based on the read ID, the conveyance by the conveyance roller 202 may be stopped. When the substrate WF is transported in the load cell 100 by the transport rollers 202, the substrate WF is detected by the sensor 112 c. When the sensor 112c detects the substrate WF and the transfer unit 200A can prepare for receiving the substrate WF, the entrance gate 218 of the transfer unit 200A is opened, and the transfer roller 202 transfers the substrate WF from the load unit 100 to the transfer unit 200A. When the transfer unit 200A cannot prepare for receiving the substrate WF, the operation of the transfer rollers 202 of the loading unit 100 is stopped, and the substrate WF is ready to be received.

When the substrate WF is transferred to the transfer unit 200A, the sensor 216a disposed on the inlet side of the transfer unit 200A detects the substrate WF. When the sensor 216a confirms that the substrate WF passes behind, the entrance shutter 218 is closed. Thereafter, the position of the substrate WF is monitored by the sensor 216b, and the substrate WF is conveyed by the conveying rollers 202 of the conveying unit 200A. At this time, the stopper moving mechanism 222 moves the stopper 220 in the moving path of the substrate WF. The substrate WF conveyed by the conveying roller 202 contacts the stopper 220 to stop the substrate WF. The sensor 216c is disposed at the position of the stopper 220, and when the sensor 216c detects the substrate WF, the operation of the conveyance roller 202 is stopped. The substrate WF stopped at the position of the stopper 220 (substrate transfer position) is transferred to the top ring 302 of the polishing unit 300A via the pusher 230.

When the substrate WF stops at the substrate transfer position, the arm 360 of the polishing unit 300A is swung to position the top ring 302 on the substrate WF of the transfer unit 200A. Fig. 9 shows a state where the pusher 230 is located at a lower position when the substrate transfer by the pusher 230 is started. From the lower position shown in fig. 9, the first stage 232 and the second stage 270 are raised by the first raising/lowering mechanism 231. When the first and second stages 232 and 270 are raised, the support columns 234 and 272 of the first and second stages 232 and 270 pass between the conveying rollers 202. At this time, the support columns 272 of the second stage 270 lift the substrate WF from below. When the first stage 232 and the second stage 270 are located at the raised positions by the first elevating mechanism 231, the position and the angular direction of the pusher 230 in the horizontal plane are adjusted by the XY stage 248 and the rotating stage 250 as described above, and the support columns 234 of the first stage 232 are aligned to support the holding members 308 of the top ring 302. Fig. 12 shows the first elevating mechanism 231, the first and second stages 232 and 270 are located at the elevated position, and the holding member 308 of the top ring 302 is supported by the support column 234 of the first stage 232. In this state, the second stage 270 is raised with respect to the first stage 232 by the second lifting mechanism 233. In this state, the substrate WF is disposed on the lower surface of the elastic pad 310 of the top ring 302. Fig. 13 shows a state in which the substrate WF is disposed below the elastic pad 310 of the top ring 302. Next, the top ring 302 holds the substrate WF on the lower surface of the elastic pad 310 by vacuum suction.

When the substrate WF is held by the top ring 302, the arm 360 is swung, and the top ring 302 holding the substrate WF is moved to a position facing the polishing pad 352 of the polishing unit 300A. Thereafter, the polishing table 350 and the top ring 302 are rotated to press the substrate WF against the polishing pad 352, thereby polishing the substrate WF. During polishing of the substrate WF, the polishing liquid is supplied to the surface of the polishing pad 352 through the polishing liquid supply nozzle 354 and the passage 353.

When the polishing of the substrate WF by the polishing unit 300A is completed, the arm 360 is swung to move the top ring 302 holding the substrate WF to the substrate transfer position of the transfer unit 200A. As shown in fig. 12, the top ring 302 is moved such that the holding member 308 of the top ring 302 is supported by the first platform 232. Thereafter, the vacuum suction of the top ring 302 is opened, and the substrate WF is supported by the support columns 272 of the second stage 270. Thereafter, as shown in fig. 9, the pusher 230 is lowered, and the substrate WF is transferred to the transfer roller 202.

When the polishing unit 300A finishes polishing the substrate WF, the polishing unit 300A performs dressing, cleaning, and the like of the polishing pad 352 using the dresser 356, the sprayer 358, and the like.

When the substrate WF is transferred from the polishing unit 300A to the transfer unit 200A, the transfer rollers 202 start transferring the substrate WF again. The sensor 216d is provided at a position where cleaning of the substrate WF is started, and when the substrate WF is detected by the sensor 216d, cleaning of the substrate WF is started. When cleaning the substrate WF, the rotation speed of the conveying roller 202 may be changed to a cleaning speed. The substrate WF is cleaned by conveying the substrate WF by the conveying roller 202 and spraying a cleaning liquid onto the substrate WF from the upper cleaning nozzle 284a and the lower cleaning nozzle 284 b. The sensor 216e is disposed in the cleaning section, and the sensor 216e monitors the position of the substrate WF, cleans the substrate WF, and conveys the substrate WF. The sensor 216f is disposed at a position where the cleaning of the substrate W is completed, and when the substrate WF is detected by the sensor 216f, the ejection of the cleaning liquid from the upper cleaning nozzle 284a and the lower cleaning nozzle 284b is stopped. When the cleaning of the substrate WF is completed, the rotation speed of the conveying roller 202 is changed to the conveying speed. The sensor 216g is disposed near the outlet of the conveyance unit 200A. When the sensor 216g detects the substrate WF and can prepare for receiving a substrate in the next unit, the exit gate 286 is opened to transfer the substrate WF from the transfer unit 200A to the transfer unit 200B. When the sensor 216g detects the substrate WF, the polishing unit 300B cannot prepare a receiving substrate, and the rotation of the conveyance roller 202 is stopped until the receiving preparation of the substrate WF is possible, and the substrate WF is on standby.

In one embodiment, the substrate WF processing in the transfer unit 200B may be the same as the transfer unit 200A. This process usually includes a case where the polishing units 300A and 300B perform two-stage polishing of the same substrate WF. In one embodiment, the polishing of the substrate WF may be performed only in the polishing unit 300A or the polishing unit 300B (only one-stage polishing). For example, when the polishing unit 300A polishes the substrate WF only and the polishing unit 300B does not polish the substrate WF, the transfer unit 200B transfers the substrate WF to the drying unit 500 of the next unit by the transfer rollers 202 without transferring the substrate WF to the polishing unit 300B and cleaning. Note that, when the polishing unit 300A does not polish the substrate, and only when the polishing unit 300B polishes the substrate, the transfer unit 200A transfers the substrate WF to the transfer unit 200B of the next unit without transferring the substrate WF to the polishing unit 300A and cleaning the substrate WF.

In the substrate processing apparatus 1000 shown in fig. 1, the substrate WF is transferred from the transfer unit 200B to the drying unit 500. When the substrate WF is received by the drying unit 500, the outlet shutter 286 of the conveying unit 200B and the inlet shutter 502 of the drying unit 500 are opened, and the conveying roller 202 conveys the substrate WF from the conveying unit 200B to the drying unit 500. When it is detected that the substrate WF passes through the sensor 504a disposed near the entrance of the drying unit 500, the entrance shutter 502 of the drying unit 500 and the exit shutter 286 of the transfer unit 200B are closed. The sensor 504b is disposed at a position where the drying unit 500 starts drying the substrate WF, and when the conveying roller 202 conveys the substrate WF in the drying unit 500 and the sensor 504b detects the substrate WF, gas injection from the lower nozzle 530a and the upper nozzle 530b is started. The sensor 504c is disposed near the outlet of the drying unit 500, and stops the gas injection from the lower nozzle 530a and the upper nozzle 530b when the sensor 504c detects the substrate WF. When the sensor 504c detects the substrate WF, the exit shutter 540 is opened to transfer the substrate WF from the drying unit 500 to the unloading unit 600.

The substrate WF conveyed by the unloading unit 600 is monitored by the sensors 612a to 612c, conveyed to the outlet by the conveying roller 202, and conveyed out of the substrate processing apparatus 1000 through the outlet opening 608. On the exit side of the unloading unit 600, another processing apparatus for the next processing step of the substrate WF is disposed, and the unloading unit 600 transfers the substrate WF to the processing apparatus for the next processing step.

In the substrate processing apparatus 1000 shown in fig. 1, two conveying units 200 and two polishing units 300 are provided, but one conveying unit 200 and one polishing unit 300 may be provided, or three or more polishing units may be provided. As described above, the loading unit 100, the conveying unit 200, the polishing unit 300, the drying unit 500, and the unloading unit 600 may be configured as independent units. The housings of these units may be provided with windows for viewing the interior. Fig. 26 is a diagram showing a casing 201 of the conveyance unit 200 as an example. As shown in fig. 26, the casing 201 of the conveyance unit 200 includes an openable/closable door 203 on the front surface. The door 203 is provided with a window 205 for observing the inside of the conveying unit 200. The window 205 may be provided with a light shielding member, such as a light shielding sheet, for shielding external light. The light blocking member may have light blocking properties to prevent light from corroding the substrate WF when the light reaches the substrate WF. Fig. 26 shows, as an example, a door 203 and a window 205 provided in the casing 201 of the conveyance unit 200, and similar doors and/or windows may be provided in the other load unit 100, the drying unit 500, and the unloading unit 600.

At least the following technical ideas are grasped from the above embodiments.

[ means 1] according to means 1, there is provided a substrate transfer device for transferring a quadrangular substrate, the substrate transfer device including: a plurality of conveying rollers configured to support a lower surface of the substrate; a plurality of roller shafts to which the plurality of conveyance rollers are attached; a motor for rotating the plurality of roller shafts; and a pusher for lifting the substrate on the plurality of transport rollers to separate the substrate on the plurality of transport rollers from the plurality of transport rollers, the pusher having a platform that is capable of passing through a gap between the plurality of roller shafts.

Mode 2 according to mode 2, in the substrate transport apparatus according to mode 1, a support member is disposed between the plurality of transport rollers.

Mode 3 according to mode 3, the substrate transport apparatus according to mode 1 or 2 includes a plurality of guide rollers that support the substrate in a width direction perpendicular to a transport direction of the substrate.

Mode 4 according to mode 4, in the substrate transport apparatus according to any one of modes 1 to 3, the substrate has a non-pattern region not used as a device, and the plurality of transport rollers are disposed so as to be contactable with the non-pattern region of the substrate.

[ mode 5] according to mode 5, in the substrate transport apparatus according to any one of modes 1 to 4, at least a part of the plurality of transport rollers is formed of a conductive polymer.

Mode 6 according to mode 6, the substrate transport apparatus according to any one of modes 1 to 5 further includes a magnetic gear, and the motor rotates the roller shaft via the magnetic gear.

Mode 7 according to mode 7, the substrate carrying device according to any one of modes 1 to 6 further includes a stopper configured to enter a carrying path of the substrate carried on the plurality of carrying rollers and to be capable of coming into contact with the substrate being carried.

Mode 8 according to mode 8, the substrate transport apparatus according to any one of modes 1 to 7 further includes a sensor for detecting that there is no substrate at a predetermined position on the plurality of transport rollers.

[ embodiment 9] according to embodiment 9, the substrate transport apparatus according to any one of embodiments 1 to 8 further includes a plurality of support rollers configured to support an upper surface of the substrate transported by the plurality of transport rollers.

[ claim 10] according to the aspect 10, in the substrate transport apparatus according to any one of the aspects 1 to 9, the motor for rotating the plurality of roller shafts is a servo motor.

[ claim 11] according to the aspect 11, in the substrate transport apparatus according to any one of the aspects 1 to 10, wherein the table of the pusher has a plurality of support columns, the pusher includes an elevating mechanism for vertically elevating the table, the elevating mechanism is configured to be capable of moving the table between an upper position where the table is elevated and a lower position where the table is lowered, and when the table is moved from the lower position to the upper position, at least a part of the plurality of support columns of the table passes through gaps between the plurality of roller shafts, and the substrate on the plurality of transport rollers is received by the plurality of support columns.

[ means 12] according to means 12, in the substrate transport apparatus according to any one of the means 1 to 11, the pusher includes a linear movement mechanism for linearly moving the stage in a horizontal plane.

Mode 13 according to mode 13, in the substrate transport apparatus according to any one of modes 1 to 12, the pusher includes a rotary moving mechanism for rotating the stage in a horizontal plane.

Mode 14 according to mode 14, in the substrate transport apparatus according to mode 12, the pusher includes a linear motion prevention mechanism for preventing linear motion of the stage.

Mode 15 according to mode 15, in the substrate transport apparatus according to mode 13, the pusher includes a rotation preventing mechanism for preventing a rotation of the stage.

[ MODE 16] according to mode 16, there is provided a substrate processing apparatus including: a polishing section for polishing a substrate; a cleaning section for cleaning the substrate; a drying section for drying the substrate; and a conveying section that conveys the substrate among the polishing section, the cleaning section, and the drying section, wherein the conveying section includes a substrate conveying apparatus according to any one of modes 1 to 15.

[ claim 17] according to the aspect 17, in the substrate processing apparatus according to the aspect 16, the polishing unit includes: a platen for holding a polishing pad; the machine table driving mechanism is used for driving the machine table to rotate; a top ring for holding a substrate; and a pressing mechanism for pressing the substrate held by the top ring against the polishing pad held by the platen, wherein the top ring is configured to receive the substrate from the platen of the pusher and to transfer the substrate held by the top ring to the platen of the pusher.

[ means 18] according to means 18, in the substrate processing apparatus according to means 17, the polishing section has a polishing liquid supply mechanism for supplying a polishing liquid to the polishing pad on the platen.

[ means 19] according to means 19, in the substrate processing apparatus according to means 18, the polishing liquid supply mechanism includes a flow path provided in the platen, and the flow path communicates with an opening defined by a surface of the platen and the polishing pad.

[ means 20] according to means 20, in the substrate processing apparatus according to any one of the means 17 to 19, the top ring includes a bladder, and the substrate processing apparatus is configured to be capable of controlling a pressing force of the substrate against the polishing pad by a fluid pressure supplied into the bladder.

Mode 21 according to mode 21, in the substrate processing apparatus according to any one of modes 17 to 20, a surface of the table has a silicone layer or a fluororesin layer for facilitating peeling of the polishing pad from the table.

[ means 22] according to means 22, in the substrate processing apparatus according to any one of the means 17 to 21, the substrate processing apparatus includes the polishing pad held by the platen, and includes a groove communicating with an outer periphery of the polishing pad and a groove not communicating with the outer periphery of the polishing pad on a surface of the polishing pad.

[ means 23] according to means 23, in the substrate processing apparatus according to means 22, the groove of the polishing pad has a groove forming a concentric pattern and a groove forming a radial pattern.

[ means 24] according to the means 24, in the substrate processing apparatus according to the means 22, the grooves of the polishing pad have grooves forming a lattice pattern.

[ means 25] according to the means 25, in the substrate processing apparatus according to any one of the means 16 to 24, the cleaning section includes a cleaning nozzle for spraying a cleaning liquid onto the substrate on the conveying roller.

[ means 26] according to the means 26, in the substrate processing apparatus according to the means 25, the cleaning nozzles are disposed on both sides of an upper surface side and a lower surface side of the substrate on the conveying roller.

Mode 27 according to mode 27, in the substrate processing apparatus according to any one of modes 16 to 26, the drying section includes a drying nozzle that ejects a gas onto the substrate on the conveying roller.

Mode 28 according to mode 28, in the substrate processing apparatus according to mode 27, the drying nozzles are disposed on both sides of an upper surface side and a lower surface side of the substrate on the conveying roller.

[ means 29] according to means 29, in the substrate processing apparatus according to any one of the means 16 to 28, a housing that houses at least one of the polishing section, the cleaning section, the drying section, and the conveying section, wherein the housing includes a window for viewing the inside from the outside, and the window includes a light blocking member.

[ notation ] to show

10 pattern region

20 non-pattern area

100 load cell

200 conveying unit

202 conveying roller

204 roll shaft

206 Gear

208 motor

210 support member

212 guide roller

214 auxiliary roller

216 sensor

218 entrance stop

220 stop dog

222 stopper moving mechanism

230 pusher

231 first lifting mechanism

232 first platform

233 second lifting mechanism

234 supporting column

244 movable pedestal

246 fixed pedestal

249 middle plate

250 rotating platform

270 second platform

280 XY stop

282 rotation stop

284 cleaning nozzle

286 outlet shutter

290 press roll

300 grinding unit

302 top ring

306 head body

308 holding member

310 elastic cushion

350 grinding table

352 grinding pad

500 drying unit

506 upper conveying roller

530 nozzle

600 unload unit

900 control device

1000 substrate processing apparatus

WF substrate