阅读说明：本技术 轧制接合体及其制造方法，以及用于电子设备的增强散热部件 (Rolled joined body, method for producing same, and heat-dissipating reinforcing member for electronic device ) 是由 桥本裕介 黑川哲平 于 2019-08-05 设计创作，主要内容包括：本发明的目的在于提供一种铜层和不锈钢层的轧制接合体,所述轧制接合体具有硬质的铜层,兼具散热性与强度。由铜层10A和不锈钢层20A构成的轧制接合体1A,其特征在于,轧制接合体1A的厚度为0.02mm以上且0.4mm以下,铜层10A的硬度为70Hv以上,轧制接合体1A的180°剥离强度为6N/20mm以上。(The purpose of the present invention is to provide a rolled joint body of a copper layer and a stainless steel layer, which has a hard copper layer and has both heat dissipation and strength. A rolled joined body 1A comprising a copper layer 10A and a stainless steel layer 20A, characterized in that the thickness of the rolled joined body 1A is 0.02mm or more and 0.4mm or less, the hardness of the copper layer 10A is 70Hv or more, and the 180 DEG peel strength of the rolled joined body 1A is 6N/20mm or more.)

1. A rolled joined body composed of a copper layer and a stainless steel layer, wherein,

the thickness of the rolled joined body is 0.02mm to 0.4mm,

the hardness of the copper layer is 70Hv or more,

the 180 DEG peel strength of the rolled joined body is 6N/20mm or more.

2. The rolling joint body according to claim 1,

the thickness of the copper layer is 0.01mm to 0.38mm,

the thickness of the stainless steel layer is 0.01mm to 0.38 mm.

3. The rolled joint body according to claim 1 or 2, wherein,

the hardness of the stainless steel layer is 180Hv or more.

4. The rolled joint body according to any one of claims 1 to 3, wherein,

the 180 DEG peel strength of the rolled joined body is 8N/20mm or more.

5. The rolled joint body according to any one of claims 1 to 4, which is composed of two layers of the copper layer and the stainless steel layer.

6. The rolled joint body according to any one of claims 1 to 5, wherein a part of the stainless steel layer is removed.

7. The rolled joint body according to any one of claims 1 to 5, wherein a portion of the stainless steel layer is removed, and the copper layer is exposed on the removed portion.

8. The rolled joint body according to any one of claims 1 to 5, wherein the copper layer is partially removed.

9. The rolled joint body according to any one of claims 1 to 5, wherein the copper layer is partially removed, and the stainless steel layer is exposed on the removed portion.

10. A reinforced heat-dissipating member for an electronic device, comprising the rolled joint body according to any one of claims 1 to 9.

11. A method for producing a rolled joint body composed of a copper layer and a stainless steel layer, comprising the steps of:

preparing a copper plate and a stainless steel plate;

a step of applying sputter etching treatment to a surface where the copper plate and the stainless steel plate are joined; and

a step of bringing the copper plate into contact with the stainless steel plate after the sputter etching treatment and joining the copper plate and the stainless steel plate by roll press bonding,

the prepared copper plate has a hardness of 80Hv or more,

the copper plate is softened by the sputter etching process and/or by input heat from the stainless steel plate at the time of bringing the copper plate into contact with the stainless steel plate immediately before crimping,

the thickness of the rolled joined body after joining is 0.02mm or more and 0.4mm or less, the hardness of the copper layer of the rolled joined body is 70Hv or more, and the 180 DEG peel strength of the rolled joined body is 6N/20mm or more.

12. The manufacturing method of a rolled joined body according to claim 11, wherein the prepared copper plate is softened to a hardness of less than 70Hv by the sputter etching treatment, and/or softened to a hardness of less than 70Hv at a time point immediately before crimping by input heat from the stainless steel plate at the time of bringing the copper plate into contact with the stainless steel plate.

Technical Field

The present invention relates to a rolled joined body, a method for manufacturing the same, and a heat-dissipating reinforcing member for use in an electronic device.

Background

Metal materials are utilized in various fields, and for example, they can be used as a heat-radiating reinforcing member (a frame material surrounding an electronic component accompanied by heat radiation) in electronic devices such as mobile electronic devices. As such a metal material, stainless steel is widely used. As another metal material, a rolled joined body (metal laminate, composite material) obtained by laminating two or more kinds of metal plates or metal foils is also known. The rolled joint is a highly functional metal material having composite properties that cannot be obtained from the material alone, and for example, a rolled joint in which stainless steel and copper are laminated has been studied for the purpose of improving thermal conductivity.

As a conventional rolled joint, for example, rolled joints disclosed in patent documents 1 and 2 are known. Patent document 1 discloses a base plate made of a composite material in which a first layer made of an austenitic stainless steel, a second layer made of Cu or a Cu alloy and laminated on the first layer, and a third layer made of an austenitic stainless steel and laminated on the second layer on the side opposite to the first layer are roll-bonded, and a method for manufacturing the base plate.

Patent document 2 discloses a composite material having a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer, wherein the crystal grain size of the second layer measured by a comparative method according to JIS H0501 is 0.150mm or less.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 5410646

Patent document 2: japanese patent No. 6237950

Disclosure of Invention

Problems to be solved by the invention

The conventional rolled joined body has a weak adhesion at the time of rolling joining, and requires a heat treatment of 500 ℃ or more after joining in order to improve the peel strength. Specifically, patent document 1 describes that after the rolling and bonding, the formed composite material is diffusion annealed in a reducing atmosphere at about 1000 ℃. In the examples of patent document 2, diffusion annealing at 950 ℃ is performed after rolling.

However, since copper is softened by recrystallization at a temperature of 200 ℃ or higher, the above heat treatment softens the copper, and a rolled joint body composed of hard copper and stainless steel cannot be obtained. On the other hand, with the current increase in speed and functionality of communication, the amount of heat generated in electronic devices increases. In such a heat-dissipating reinforcing member for electronic equipment, further improvement in heat dissipation is required, but when a rolled joint body of copper and stainless steel is used as the heat-dissipating reinforcing member, if the ratio of copper to be improved in heat dissipation is increased, there is a problem that the strength of the rolled joint body as a whole is lowered by the softened copper.

Accordingly, the present invention provides a rolled joint body of a copper layer and a stainless steel layer, which has a hard copper layer and has both heat dissipation and strength

Technical scheme for solving problems

The present inventors have conducted intensive studies in order to solve the above problems, and as a result, have found that: by specifying the conditions of tempering of the combined copper, etching conditions before joining, load at the time of joining, and the like, a rolled joined body in which the copper layer is hard and has sufficient adhesion strength can be obtained. That is, the gist of the present invention is as follows.

(1) A rolled joined body composed of a copper layer and a stainless steel layer, wherein,

the thickness of the rolled joined body is 0.02mm to 0.4mm,

the hardness of the copper layer is 70Hv or more,

the 180 DEG peel strength of the rolled joined body is 6N/20mm or more.

(2) The rolled joined body according to the above (1), wherein,

the thickness of the copper layer is 0.01mm to 0.38mm,

the thickness of the stainless steel layer is 0.01mm to 0.38 mm.

(3) The rolled joined body according to the above (1) or (2), wherein,

the hardness of the stainless steel layer is 180Hv or more.

(4) The rolled joint body according to any one of the above (1) to (3), wherein the 180 ° peel strength of the rolled joint body is 8N/20mm or more.

(5) The rolled joint body according to any one of the above (1) to (4), wherein the rolled joint body is composed of two layers of the copper layer and the stainless steel layer.

(6) The rolled joint body according to any one of the above (1) to (5), wherein a part of the stainless steel layer is removed.

(7) The rolled joined body according to any one of the above (1) to (5), wherein a portion of the stainless steel layer is removed, and the copper layer is exposed at the removed portion.

(8) The rolled joint body according to any one of the above (1) to (5), wherein the copper layer is partially removed.

(9) The rolled joined body according to any one of the above (1) to (5), wherein a portion of the copper layer is removed, and the stainless steel layer is exposed at the removed portion.

(10) A heat-dissipating reinforcing member for an electronic device, comprising the rolled joint body according to any one of the above (1) to (9).

(11) A method for producing a rolled joint body composed of a copper layer and a stainless steel layer, comprising the steps of:

preparing a copper plate and a stainless steel plate;

a step of applying sputter etching treatment to a surface where the copper plate and the stainless steel plate are joined; and

a step of bringing the copper plate into contact with the stainless steel plate after the sputter etching treatment and joining the copper plate and the stainless steel plate by roll press bonding,

the prepared copper plate has a hardness of 80Hv or more,

the copper plate is softened by the sputter etching process and/or by input heat from the stainless steel plate at the time of bringing the copper plate into contact with the stainless steel plate immediately before crimping,

the thickness of the rolled joined body after joining is 0.02mm or more and 0.4mm or less, the hardness of the copper layer of the rolled joined body is 70Hv or more, and the 180 DEG peel strength of the rolled joined body is 6N/20mm or more.

(12) The method for producing a rolled joined body according to the above (11), wherein,

the prepared copper plate is softened to a hardness of less than 70Hv by the sputter etching treatment, and/or softened to a hardness of less than 70Hv at a time point immediately before crimping by input heat from the stainless steel plate at the time of bringing the copper plate into contact with the stainless steel plate.

The present specification includes the disclosures of japanese patent application nos. 2018 and 147973, 2018 and 226838, which are the bases of the priority of the present application.

Effects of the invention

The copper layer of the rolled joint body of the present invention is hard, and has high strength and excellent heat dissipation properties. The rolled joined body can be suitably used as a heat-radiating reinforcing member in an electronic device.

Drawings

FIG. 1 is a sectional view showing one embodiment of a rolled joined body of the present invention.

Fig. 2 is a sectional view showing one form of a soaking plate as an example of the use of the rolled joined body.

Fig. 3 is a cross-sectional view showing another form of the soaking plate as an example of the use of the rolled joined body.

FIG. 4 is a sectional view showing another embodiment of a rolled joined body of the present invention.

Detailed Description

The present invention will be described in detail below based on embodiments.

FIG. 1 is a sectional view showing one embodiment of a rolled joined body of the present invention. As shown in fig. 1, the rolled joined body 1A of the present embodiment is composed of two layers, i.e., a copper layer 10A and a stainless steel layer 20A.

In applications where higher heat dissipation properties are required as a rolled joined body, a copper plate material having a total content of additive metal elements other than copper of 1 mass% or less, more preferably 0.8 mass% or less, can be used as the copper layer 10A. Specifically, sheet materials such as C1100 and C1020 can be mentioned. In applications where higher strength is required as a rolled joint body, a copper plate material having a total content of additive metal elements other than copper of more than 1 mass% can be used as the copper layer 10A. Specifically, an alloy copper plate material such as Corson copper can be mentioned.

Further, as the stainless steel layer 20A, there is no particular limitation, and plate materials such as SUS304, SUS305, SUS201, SUS316L, and SUS430 may be used. In particular, when the rolled joined body is used for electronic devices, austenitic stainless steel sheet materials such as SUS304, SUS305, SUS316, and SUS316L are preferably used.

The thickness of the rolled joined body 1A is 0.02mm to 0.4 mm. Preferably 0.03mm to 0.37 mm. If the thickness is less than 0.02mm, wrinkles, bending, and the like may occur at the time of manufacturing the rolled joined body, and therefore, it is not allowable. Further, if the thickness exceeds 0.4mm, there is a possibility that the weight is increased and the installation space inside the electronic apparatus is reduced, and therefore, it is not preferable. Further, the thickness exceeding 0.4mm may not provide sufficient rolling reduction force at the time of joining the rolled joined body, and may not provide sufficient peel strength.

In the case of applications requiring higher strength and heat dissipation, such as a case or frame for reinforcing a heat dissipation member, an electronic component, or the like, or a heat dissipation member (a rolled joint body 1C in fig. 4 and a rolled joint body 1B in fig. 3 as examples of the heat dissipation member), the lower limit value of the thickness is preferably 0.09mm or more. In the case where a smaller space is required such as a functional member for heat dissipation of an electronic component, electromagnetic wave shielding, or the like (for example, the rolled joined body 1A in the soaking plates 2A, 2B in fig. 2 and 3), the upper limit of the thickness is preferably 0.1mm or less, more preferably 0.09mm or less, and still more preferably 0.055mm or less. Even if the rolled joined body 1A of the present embodiment has such a very thin thickness, the strength of the copper layer 10A is harder than that of the conventional one, and therefore, the space can be reduced compared to the conventional one.

Here, the thickness of the rolled joined body 1A refers to the total thickness of the copper layer 10A and the stainless steel layer 20A. The thickness of the rolled joined body 1A is an average value of measured values obtained by measuring the thickness of any 30 places on the rolled joined body 1A with a micrometer or the like.

The thicknesses of the copper layer 10A and the stainless steel layer 20A in the rolled joined body 1A are not particularly limited, and may be set according to the use of the rolled joined body 1A. The copper layer 10A preferably has a thickness of 0.01mm to 0.38mm, and the stainless steel layer 20A preferably has a thickness of 0.01mm to 0.38 mm. More preferably, the thickness of the copper layer 10A is 0.015mm or more and 0.37mm or less, and the thickness of the stainless steel layer 20A is 0.015mm or more and 0.35mm or less. More preferably, the copper layer 10A has a thickness of 0.05mm to 0.3mm, and the stainless steel layer 20A has a thickness of 0.05mm to 0.3 mm. In particular, when the copper layer exceeds 0.38mm, sufficient peel strength may not be obtained. Further, if the stainless steel layer 20A is too thick with respect to the copper layer 10A, the heat radiation property of the rolled joined body 1A may be insufficient. Further, if the stainless steel layer 20A is too thin, the strength of the rolled joined body 1A cannot be obtained, and therefore, it can be set appropriately in consideration of the balance of these. According to the present embodiment, since the copper layer 10A is harder than the conventional one, there is an advantage that the overall strength can be ensured even if the thickness ratio of the copper layer 10A is increased in order to improve the heat dissipation property of the rolled joined body 1A. Therefore, when the copper layer is applied to the same use as the conventional one such as a heat dissipation enhancing member for electronic equipment, the thickness ratio of the copper layer 10A can be increased as compared with the conventional one. Specifically, the ratio of the thickness of the copper layer 10A to the thickness of the rolled joined body 1A may be set to 5% to 95%, preferably 13% to 87%, and more preferably 15% to 85%. Here, the thickness of the copper layer 10A and the stainless layer 20A in the rolled joined body 1A is an average value of values obtained by obtaining an optical micrograph of a cross section of the rolled joined body 1A and measuring the thickness of the copper layer 10A and the stainless layer 20A at any 10 position in the optical micrograph. In the production of the rolled joined body 1A, since the copper plate and the stainless steel plate as the materials are joined at a predetermined reduction ratio, the thickness of the copper layer 10A and the stainless steel layer 20A of the rolled joined body 1A is generally thinner than the copper plate and the stainless steel plate as the materials before joining, and the reduction ratio is 0% in the measurement range with a micrometer, and the thickness may not be changed.

In the rolled joined body 1A of the present embodiment, the copper layer 10A is hard and has a hardness of 70Hv or more. Preferably 75Hv or more, more preferably 80Hv or more. The upper limit of the hardness is not particularly limited, and may be, for example, 130Hv or less. Since the copper layer 10A is hard, a rolled joined body 1A having both excellent heat dissipation properties and high strength can be obtained. The stainless steel layer 20A also preferably has a sufficient hardness, specifically, 180Hv or more, more preferably 200Hv or more, and still more preferably 250Hv or more. The hardness Hv is a hardness measured in accordance with JIS Z2244 (vickers hardness test-test method) on a copper layer using a micro vickers hardness tester (load 50 gf). The hardness Hv of the stainless steel layer means that a micro vickers hardness tester (load 100gf) is used when the thickness of the stainless steel layer is 0.1mm or more; when the thickness of the stainless steel layer is less than 0.1mm, a hardness measured using a micro Vickers hardness tester (load 50gf) in accordance with JIS Z2244 (Vickers hardness test-test method) is used.

In addition, the peel strength (also referred to as 180 DEG peel strength or 180 DEG peel strength) as an index of the adhesion strength between the copper layer 10A and the stainless steel layer 20A of the rolled joined body 1A of the present embodiment is 6N/20mm or more. In order to suppress the peeling of the interface of the rolled joined body in the processing step, it is preferably 8N/20mm or more, and more preferably 10N/20mm or more, depending on the use of the reinforced heat-radiating member or the like. Further, when the peel strength is significantly increased, the material is broken instead of being peeled, and therefore there is no upper limit value of the peel strength.

The peel strength of the rolled joined body 1A was measured by using a TENSILON universal material tester RTC-1350A (manufactured by Orientec corporation) as a force (unit: N/20mm) required for peeling when a test piece having a width of 20mm was produced from the rolled joined body 1A, a copper layer 10A and a stainless steel layer 20A were peeled off partially, the side of the thick film layer or the side of the hard layer was fixed while the thickness was the same, and the side of the thin film layer or the side of the soft layer having the thickness was stretched at a stretching speed of 50 mm/min in a direction opposite to the direction of 180 DEG to the fixed portion. In the same test, when the test piece width is not 20mm, the peel strength changes depending on the test piece width. Therefore, when the peel strength measured with the test piece width of 10mm is converted into the peel strength measured with the test piece width of 20mm, the product may be multiplied by the test piece width, and therefore 20mm may be divided by 10mm, that is, about 2 times.

In the rolled joined body 1A of the present embodiment, the elongation in the tensile test is preferably 3% or more and 50% or less, and more preferably 5% or more and 40% or less, for a test piece having a width of 12.5 mm. This provides excellent press workability. The elongation in the tensile test can be measured, for example, using a test piece of a tensile strength test described later, in accordance with the measurement of the elongation at break described in JIS Z2241.

The maximum tensile load of the rolled joined body 1 in a tensile test in which the width of the test piece is 12.5mm is preferably 200N or more. From the viewpoint of having sufficient strength, it is more preferably 250 or more, and still more preferably 300N or more. The tensile strength can be calculated from the maximum tensile load, which is a value obtained by dividing the maximum tensile load by the cross-sectional area of the test piece in the tensile test. The maximum tensile load and the tensile strength can be measured, for example, by using a TENSILON universal material testing machine RTC-1350A (manufactured by Orientec corporation) in accordance with JIS Z2241 (method for tensile testing of metal materials). The width of the test piece of 12.5mm corresponds to the specification No. 13B in JIS Z2241.

On the surface of the copper layer 10A and the stainless steel layer 20A on the opposite side of the interface of the rolled joined body 1A, a protective layer may be provided for the purpose of corrosion resistance, oxidation prevention, discoloration prevention, and the like, as necessary, to such an extent that the functions such as electrical conductivity, heat dissipation, and the like are not impaired. Examples of the protective layer for the copper layer 10A include: chemical conversion treated layers, Ni plating, and the like. In the present embodiment, the values of the thickness and hardness of the rolled joined body 1A and the layers described above refer to values for a laminate composed only of the copper layer 10A and the stainless steel layer 20A excluding the protective layer.

The rolled joined body 1A described above has excellent heat dissipation properties of the copper layer 10A, and has high strength as a whole because the copper layer 10A is hard. The rolled joined body 1A can be used as a heat-radiating reinforcing member (frame material) for various electronic devices such as mobile electronic devices and PCs, an electronic component for transmission devices such as automobiles, a housing for electronic components for home appliances, a frame, a functional member for heat radiation and electromagnetic shielding, and the like, by taking advantage of its characteristics. In addition, when the rolled joined body 1A is used as an element of an electronic device, if the stainless layer 20A has magnetism, radio interference may occur, and therefore, it is preferable to use an austenite-based nonmagnetic material as a material of the stainless layer 20A.

Fig. 2 shows a cross section of a soaking plate as an example of the use of the rolled joined body 1A of the present embodiment. The soaking plate 2A has a rolled joined body 1A composed of a copper layer 10A and a stainless steel layer 20A, and a copper plate 30 having a columnar convex portion 31 and a stainless steel plate 40 are further laminated on the copper layer 10A side. A working fluid such as pure water is sealed in the region a surrounded by the convex portion 31. The working fluid in the region a is evaporated by heat from a heat source (not shown) located on the stainless steel plate 40 side, and the vapor is condensed by heat radiation from the stainless steel layer 20A side and flows back to the lower portion, so that the heat can be efficiently diffused in the horizontal and vertical directions by this repetition.

Fig. 3 is a sectional view showing another form of the soaking plate. The rolled joined body 1B of the present invention composed of the copper layer 10B and the stainless steel layer 20B is laminated on the soaking plate 2B in place of the copper plate 30 and the stainless steel plate 40 of the soaking plate 2A shown in fig. 2. Further, a copper layer 60 and a stainless steel plate 70 are laminated on the copper layer 10B side. The rolled joined body 1A of fig. 1 can be processed to produce a rolled joined body 1B. The copper layer 10B is partially removed by etching or the like, and a columnar projection 31 and a region a surrounded by the projection 31 are formed in the same manner as in fig. 2. The working fluid is sealed in the area A. The copper layer 60 and the stainless steel plate 70 may be the rolled joined body 1A of the present invention as in fig. 2, and the copper layer may be a soft copper layer or may be formed of a plating layer. The copper layer 60 and the stainless steel plate 70 are preferably the rolled joined body of the present invention from the viewpoint of further improving the overall strength of the soaking plate 2B. Further, the structure of the soaking plate as shown in fig. 2 and 3 is only one example, and is not limited thereto.

FIG. 4 shows a cross section of another embodiment of the rolled joined body of the present invention. The rolled joined body 1C of this embodiment has a two-layer structure of the copper layer 10C and the stainless steel layer 20C, and further has a structure in which a portion of the stainless steel layer 20C is removed and the copper layer 10C is exposed on the portion S where the stainless steel layer 20C is removed. As shown in fig. 3, a heat transfer device 50 such as a heat pipe may be embedded in the exposed portion S of the copper layer 10C. By using the portion S where the stainless layer 20C is removed as a mounting space for other devices, an integrated element having few irregularities as a whole can be obtained. In addition, with such a configuration, the heat transfer device 50 can be brought into direct contact with the copper layer 10C, and the heat transferred by the heat transfer device 50 can be directly diffused to the copper layer 10C, thereby obtaining a higher heat dissipation effect as a whole. The other structure of the rolled joined body 1C of fig. 4 is the same as that of the embodiment shown in fig. 1. In the embodiment shown in fig. 4, only the portion S of the stainless layer 20C where the heat transport device 50 is installed is removed, but is not limited thereto.

Further, a stainless steel layer subjected to a mesh process or a punching process (corresponding to a state where a plurality of portions are partially removed over the entire surface of the stainless steel layer) may be laminated with a copper layer.

In the embodiment of fig. 4, the stainless steel layer 20C is partially removed and the copper layer 10C is exposed at the portion S where the stainless steel layer 20C is removed, but the stainless steel layer 20C does not necessarily have to be removed until the copper layer 10C is exposed, and for example, a structure may be employed in which only a portion near the surface of the stainless steel layer 20C is removed to a depth of less than the interface between the stainless steel layer 20C and the copper layer 10C. When the heat transport device 50 such as a heat pipe is embedded in such a structure, the distance between the heat transport device 50 and the copper layer 10C is shortened to improve heat dissipation, and the strength of a part of the stainless steel layer 20C can be maintained.

In addition, unlike the embodiment of fig. 4, the rolled joined body composed of the copper layer and the stainless steel layer may have a structure in which the copper layer is partially removed instead of the stainless steel layer. The rolled joined body 1B in the soaking plate 2B of fig. 3 is an example in which a copper layer is partially removed. The stainless steel layer may or may not be exposed on the portion of the copper layer after removal. For example, a copper layer subjected to a mesh process and a punching process (corresponding to a state where a plurality of portions of the entire surface of the copper layer are partially removed) may be laminated with a stainless steel layer.

In the embodiment of fig. 1 and 4, the case where the rolled joined body is composed of two layers of a copper layer and a stainless steel layer has been described, but the rolled joined body is not limited thereto, and may be composed of 3 or more layers of a copper layer and a stainless steel layer. For example, a rolled joint body having a 3-layer structure of stainless steel layer/copper layer/stainless steel layer may be used by laminating stainless steel layers on both sides of a copper layer. Or may be a 3-layer structure of copper layer/stainless steel layer/copper layer. As described above, when the copper layer and/or the stainless steel layer are composed of a plurality of layers, the thickness of the copper layer or the stainless steel layer in the rolled joined body means the total thickness of the plurality of copper layers or the plurality of stainless steel layers. Further, the 180 DEG peel strength of the rolled joined body is required to be 6N/20mm or more, but this condition needs to be satisfied by all the interfaces between the copper layer and the stainless steel layer.

Next, a method for producing a rolled joined body according to the present invention will be described. In the production of a rolled joint body, a stainless steel plate material and a copper plate material are prepared, and these plate materials are joined to each other by various methods such as cold rolling, warm rolling, and surface activation joining. However, warm rolling bonding is a method of performing roll bonding while heating, and since a copper layer is easily softened by heat, it is necessary to pay attention to selection of conditions such as a heating temperature, a heating time, and a bonding load in order to obtain a hardness of 70Hv or more. In cold rolling joining, annealing treatment is also required to improve the adhesion strength after joining, and since the copper layer is easily softened, it is necessary to appropriately adjust the joining conditions and the like so that the hardness of the copper layer becomes 70Hv or more.

Therefore, as a method for producing a rolled joined body, it is preferable to perform joining by surface activation joining. Specifically, the film can be produced by a method including the steps of: a step of preparing a stainless steel plate and a copper plate and applying sputter etching treatment to a surface where the stainless steel plate and the copper plate are joined; and a step of bringing the surfaces after the sputter etching into contact with each other and bonding the surfaces by pressure bonding so as to achieve a predetermined reduction ratio.

The stainless steel sheet that can be used is preferably an annealed material (BA material), 1/2H material, or the like from the viewpoint of formability, and is preferably 1/2H material, 3/4H material, or the like from the viewpoint of maintaining high strength, and is further preferably a tension annealed material, but is not limited thereto.

The thickness of the stainless steel layer before joining may be appropriately set in consideration of the thickness of the stainless steel layer after joining. Specifically, it is preferably in the range of 0.01mm or more and 0.4mm or less. The thickness of the stainless steel plate before joining can be measured by a micrometer or the like, and is an average value of the thicknesses measured at 10 randomly selected positions on the surface of the stainless steel plate.

As the copper plate to be joined to the stainless steel plate, it is necessary to use an original plate which can be softened by a sputter etching process and/or which is softened at a time point immediately before pressure-bonding by input heat from the stainless steel plate when the copper plate is brought into contact with the stainless steel plate. In particular, it is preferable to soften the sheet to a hardness of less than 70Hv at a time point immediately before crimping. Further, if softening is performed by the sputter etching process, the hardness after softening is maintained, and therefore, the state is also softened at a time point immediately before the pressure bonding. If the copper plate is not sufficiently softened at a point of time immediately before the pressure bonding, a sufficient adhesion strength (peel strength) cannot be obtained by the subsequent pressure bonding. Here, in order to soften the copper plate by the sputter etching treatment and the input heat from the stainless steel plate when the copper plate is brought into contact with the stainless steel plate (the temperature of the stainless steel plate is also raised by the sputter etching), the prepared copper plate (the copper plate before softening) preferably has a hardness of 80Hv or more, and more preferably has a hardness of 90Hv or more. As the hardening and tempering, H material is preferably used. Hardness of more than 70Hv and less than 80Hv tends to be hard to soften in etching and heat input from the stainless steel plate. Therefore, the 1/4H material is not preferred. The reason is presumed to be as follows. That is, it was found that the copper plate needs to contain some dislocations and distortions in order to soften the copper plate, that is, to recover or recrystallize, by the heat input from the stainless steel plate during sputter etching and contact. On the contrary, in the copper plate having a hardness of more than 70Hv and less than 80Hv, the dislocation and strain are small, and it is considered that the degree of heat input from the stainless steel plate at the time of sputter etching and contact does not sufficiently soften the steel plate.

Alternatively, as the copper plate, an annealed material (O material) having a hardness of less than 70Hv may be applied.

The thickness of the copper plate before bonding can be set as appropriate in consideration of the thickness of the copper layer after bonding. Specifically, it is preferably in the range of 0.01mm or more and 0.45mm or less. When the thickness of the copper plate exceeds 0.45mm, sufficient adhesion strength may not be obtained after bonding. In this regard, at the time of joining, deformation of the copper layer of the copper plate by stretching as a whole and deformation in the vicinity of the joining interface of the copper layers occur due to the pressure bonding load. In order to obtain a sufficient adhesion force, deformation in the vicinity of the joining interface is important, and as the thickness is increased, deformation due to stretching of the entire copper layer becomes dominant, and deformation at the joining interface necessary for adhesion hardly occurs. Therefore, it is presumed that if the thickness of the copper plate is increased, it is difficult to obtain sufficient adhesion strength. The thickness of the copper plate before joining can be measured in the same manner as the stainless steel plate.

The sputter etching process is performed, for example, as follows: a stainless steel sheet and a copper sheet are prepared as long coils having a width of 100mm to 600mm, the stainless steel sheet and the copper sheet having a joint surface are respectively used as one electrode which is grounded, an alternating current of 1MHz to 50MHz is applied between the stainless steel sheet and the copper sheet and other electrodes which are insulated and protected, so that glow discharge is generated, and the area of the electrode exposed in plasma generated by the glow discharge is 1/3 or less of the area of the other electrodes. In the sputter etching process, the grounded electrode is in the shape of a chill roll, and the temperature rise of each material to be conveyed can be prevented.

In the sputter etching treatment, the bonding surface between the stainless steel plate and the copper plate is sputtered with an inert gas in vacuum, whereby the adsorbed substances on the surface are completely removed and the oxide film on the surface is removed. As the inert gas, argon, neon, xenon, krypton, or the like, or a mixed gas containing at least one of these inert gases can be used.

The sputter etching treatment of the stainless steel plate is preferably performed at a minimum so that the temperature of the stainless steel plate is not excessively increased. This is because the heat input from the stainless steel plate hinders hardening of the copper plate when the temperature of the stainless steel plate is still high after joining, as long as the heat is maintained to such an extent that the copper plate is softened only when the copper plate is in contact with the stainless steel plate. Specific treatment conditions may be, for example, in the case of a single sheet, 1 to 50 minutes under vacuum, for example, at a plasma output of 100W to 1kW, or, for example, in the case of a long material such as a wire material, 1 to 30 m/min at a linear velocity, for example, at a plasma output of 100W to 10 kW. The degree of vacuum in this case is preferably high to prevent re-adsorption of the substances on the surface, for example, 1X 10^-5Pa-10 Pa. In the sputter etching treatment, the temperature of the stainless steel plate is preferably maintained in a temperature range of 5 to 300 ℃. The amount of etching of the stainless steel sheet is, for example, preferably 40nm to 250nm, and more preferably 50nm to 150 nm.

The sputter etching treatment of the copper plate is preferably performed under a condition that the oxide film on the surface is completely removed. This is because if etching is sufficiently performed without removing the oxide film, the adhesion strength with the stainless steel plate is insufficient. In particular, for example in the case of veneers, it is possible to use a vacuumThe plasma output is, for example, 100W to 1kW for 1 to 50 minutes, and for example, in the case of a long material such as a wire material, the plasma output is 100W to 10kW and the linear velocity is 1 m/min to 30 m/min. The degree of vacuum in this case is preferably high to prevent re-adsorption of the substances on the surface, for example, 1X 10^-5Pa-10 Pa. The etching amount of the copper plate is preferably 5nm to 200nm, and more preferably 20 to 150nm, for example. When the hardness of the copper plate is 80Hv or more, it is necessary to set the etching amount of copper to 20nm or more, more preferably 40nm or more so that the hardness of the copper plate is lower than 70Hv, or to set the hardness of the copper plate to lower than 70Hv by input heat from the stainless steel plate when the copper plate is in contact with the stainless steel plate.

The joining surfaces of the stainless steel sheet and the copper sheet after sputter etching are brought into contact with each other as described above, and the stainless steel sheet and the copper sheet are joined by pressure bonding, for example, by roll pressure bonding, whereby the rolled joint body of the present invention can be obtained.

In the joining, a high pressing force is applied to increase the adhesion strength so that the 180 DEG peel strength becomes 6N/20mm, and the copper layer is hardened by the pressing force so that the hardness becomes 70Hv or more. If the pressing force is insufficient, the adhesion strength is insufficient or the copper layer cannot be hardened, and therefore this is not allowable. On the other hand, if the rolling reduction force is too high, warpage that is difficult to reduce even in the shape correction step may occur in the rolled joined body.

The pass line load of the roll press-bonding is not particularly limited, and may be appropriately set so as to obtain a predetermined adhesion strength and hardness of the copper layer. For example, it can be set in the range of 1.0tf/cm to 10.0 tf/cm. For example, when the roll diameter of the pressure-bonding roll is 100mm to 250mm, the pass line load of the roll pressure-bonding is preferably 1.5tf/cm to 5.0tf/cm, more preferably 2.0tf/cm to 4.0 tf/cm. However, when the roll diameter is increased or when the thickness of the stainless steel sheet and the copper sheet (particularly, the copper sheet) before joining is increased, the pass line load may need to be increased in order to secure the pressure, and the numerical range is not limited thereto.

The rolling reduction of the whole rolled joined body is measured by a micrometer, and is preferably 0% to 20%, more preferably 0% to 15%. The rolling reduction of the rolled joined body was determined from the total thickness of the stainless steel plate and the copper plate as materials before joining and the thickness of the final rolled joined body. That is, the rolling reduction of the rolled joint is in accordance with the following formula: (total thickness of stainless steel plate and copper plate before joining-thickness of final rolled joined body)/total thickness of stainless steel plate and copper plate before joining.

The temperature of the atmosphere during bonding is not particularly limited, and is, for example, room temperature to 150 ℃.

In order to prevent the reduction of the bonding strength between the stainless steel plate and the copper plate due to the reabsorption of oxygen on the surfaces of the two plates, the bonding is preferably performed in a vacuum or a non-oxidizing atmosphere, for example, an inert gas atmosphere such as Ar, as in the case of etching.

In the rolled joined body obtained by joining the stainless steel sheet and the copper sheet as described above, heat treatment is not usually performed in the present invention in order to retain the hard copper layer.

The rolled joined body obtained by joining the stainless steel plate and the copper plate as described above is suitable as a heat-radiating reinforcing member for electronic devices. The thickness of the rolled joined body is not less than 70Hv, more preferably not less than 75Hv, still more preferably not less than 80Hv, particularly preferably not less than 85Hv, as the hardness of the copper layer, and not less than 6N/20mm, and more preferably not less than 8N/20mm, from the viewpoint of workability, although the thickness of the rolled joined body is not less than 0.12mm and not more than 0.4 mm. Further, the maximum tensile load is preferably 300N or more. Further, the hardness, peel strength, and maximum tensile load are preferably higher, and therefore the upper limit thereof is not particularly limited.

In addition, when the thickness of the rolled joined body for reinforcing a heat-radiating member is 0.09mm or more and less than 0.12mm, the elongation margin at the time of rolling is small, and therefore it is difficult to increase the hardness. In order to increase the hardness, a very large pressing force is required for the thickness, and the hardness of the copper layer is 70Hv or more, preferably 110Hv or less, more preferably 80Hv or more at the lower limit and 100Hv or less at the upper limit, because of the production problem such as occurrence of large warpage due to such pressing force. The peel strength is 6N/20mm or more, and the maximum tensile load is preferably 200N or more from the viewpoints of workability and strength. The upper limit of the peel strength and the maximum tensile load is not particularly limited, since the peel strength and the maximum tensile load are preferably higher. When the thin rolled joined body of such a thickness is used for an electronic device, the advantage of increasing the installation space inside the electronic device is further highlighted.

In addition, when the thickness of the rolled joined body for reinforcing a heat-radiating member is 0.02mm or more and less than 0.09mm, the elongation margin at the time of rolling is small, and therefore it is more difficult to increase the hardness. In order to increase the hardness, a very large pressing force is required for the thickness, and since a large warpage or wrinkle is generated under such pressing force, which is difficult in manufacturing, the hardness of the copper layer is 70Hv or more, preferably 110Hv or less, and more preferably 75Hv or more and 100Hv or less. The peel strength is 6N/20mm or more, and the maximum tensile load is preferably 150N or more from the viewpoint of workability and strength. The upper limit of the peel strength and the maximum tensile load is not particularly limited, since the peel strength and the maximum tensile load are preferably higher. When the thin rolled joined body of such a thickness is used for an electronic device, the advantage of increasing the installation space inside the electronic device is further highlighted.

Examples

The present invention will be described in detail below based on examples and reference examples, but the present invention is not limited to these examples.

As examples 1 to 9 and comparative examples 1 to 17, a two-layer rolled joint body composed of a copper layer and a stainless steel layer was produced. The respective thicknesses, as well as the quenching and tempering properties and the types (material types) of the joined copper plate (Cu) and stainless steel plate (SUS) are shown in tables 1 and 2.

When joining the copper plate and the stainless steel plate, a sputter etching process is applied to the copper plate and the stainless steel plate. The plasma output (W) and the treatment time (minutes) of the sputter etching treatment in each of the examples and comparative examples are shown in tables 1 and 2. The etching amounts (nm) of the copper plate and the stainless steel plate are also shown. Further, the etching amount of the copper plate was calculated at an etching rate of 6.0nm/min with respect to the plasma output power of 700W based on the result of preliminary experiments. Further, the etching amount of the stainless steel sheet was calculated based on the etching rate of iron with respect to copper and the plasma output power of 700W at an etching rate of 3.0nm/min, with reference to "Gaojin Xian" and "sputtering" in the journal of Japanese television society, Vol.17, No. 7, pages 44 to 50.

In table 1 and table 2, "pause" in the column of the RF treatment conditions of examples 5 and 6 and comparative example 10 means that the sputter etching was stopped for 3 minutes after the sputter etching was performed for 3 minutes, then the sputter etching was performed again for 3 minutes, then the sputter etching was stopped for 3 minutes, and then the sputter etching was performed again for 1 minute.

The copper plate and the stainless steel plate after the sputter etching treatment are brought into contact with each other at room temperature, and are joined by roll pressure bonding using a rolling roll having a rolling roll diameter of 100 to 200mm, thereby producing a rolled joint body. The pass line load (tf/cm) in each of examples and comparative examples is shown in tables 1 and 2.

In comparative examples 13 to 17, after the surface activation bonding, heat treatment was performed at 700 ℃ for 10 minutes.

For each of the rolled joined bodies produced in examples 1 to 9 and comparative examples 1 to 17, the 180 DEG peel strength (N/20mm), the Vickers hardness (Hv) of the copper layer and the stainless steel layer, the maximum tensile load (N), and the tensile strength (N/mm) were measured²) And elongation (%). The 180 ℃ peel strength was measured according to the procedure described above using a TENSILON universal materials tester RTC-1350A (manufactured by Orientec Co., Ltd.). In addition, hardness was measured in accordance with JIS Z2244 (vickers hardness test-test method) using a micro vickers hardness tester (load 50gf) for the copper layer and a micro vickers hardness tester (load 100gf) for the stainless layer, except for examples 8 and 9. The hardness of examples 8 and 9 was measured in accordance with JIS Z2244 (Vickers hardness test-test method) using a micro Vickers hardness tester (load 50gf) for the copper layer and a micro Vickers hardness tester (load 50gf) for the stainless layer. The maximum tensile load, tensile strength and elongation were measured by processing the rolled joined body into test piece No. 13B, and using a TENSILON Universal Material testing machine RTC-1350A (manufactured by Orientec, K.K.) according to the above-mentioned methodManufactured), and measured in accordance with JIS Z2241 (method for tensile testing of metal materials). Further, the vickers hardness of the copper plate at the portion not in contact with the roll at the time of bonding by roll bonding (corresponding to the hardness of the copper plate at the time immediately before the bonding) was measured, and it was confirmed whether or not the copper plate was softened by the sputter etching treatment and/or the input heat from the stainless steel plate at the time of contact with the copper plate and the stainless steel plate. The measurement results are shown in tables 1 and 2.

[ Table 1]

[ Table 2]

As shown in tables 1 and 2, the rolled joint bodies of examples 1 to 9 all had a peel strength of 6N/20mm or more and a hardness of the copper layer of 70Hv or more. Since the copper layer is hard, a rolled joint having both strength and heat dissipation properties can be obtained, and also sufficient adhesion strength can be obtained.

In comparative examples 13 to 17, the hardness of the copper layer in the finally obtained rolled joint body was low and did not reach the level of the rolled joint body of the present invention. This result is considered to be caused by softening of the copper layer by heat treatment at 700 ℃ after bonding.

In comparative examples 1 to 5, the peel strength was low, and the rolled joint was insufficient for reinforcing a heat-dissipating member or the like. This result is presumed to be because the linear load is small (less than 2tf/cm) relative to the thickness of copper, and sufficient adhesion strength cannot be obtained.

In comparative examples 3 to 7 and 11, the peel strength of the rolled joint was low, and it is considered that the copper plate was the 1/4H material, and softening did not occur due to the heat input from the stainless steel plate when the copper plate was in contact with the stainless steel plate, and it was difficult to improve the adhesion strength even by pressure bonding.

It is considered that in comparative example 8, the copper plate subjected to the sputter etching treatment was softened to a low degree, and the adhesion strength of the final rolled joint could not be obtained, and the peel strength was low.

In comparative example 9, since the sputter etching treatment time for the copper plate was short (3 minutes), the oxide film on the surface of the copper plate was not sufficiently removed, and therefore the adhesion strength could not be improved by the pressure bonding, and the peel strength could possibly be lowered.

The hardness of the copper layer in the rolled joined body finally obtained in comparative example 10 was low. This is presumably because the sputter etching treatment of the stainless steel sheet was carried out for a long time (100 minutes), and the temperature of the stainless steel sheet was excessively increased, so that the copper layer was softened by the heat input from the stainless steel layer even after the joining.

In comparative example 12, it is considered that since the copper plate is thick (0.3mm), the linear load of 2tf/cm is insufficient and a sufficient peel strength cannot be obtained.

Description of the reference numerals

1A, 1B, 1C: rolled joined body

2A, 2B: vapor chamber

10A, 10B, 10C: copper layer

20A, 20B, 20C: stainless steel layer

30: copper plate

31: convex part

40. 70: stainless steel plate

50: heat transport device

60: copper layer

A: region(s)

S: in part

All publications, patents and patent applications cited in this specification are herein incorporated in their entirety by reference into the specification.