阅读说明：本技术 一种fpc用无导电粒子电磁波防护膜 (Non-conductive particle electromagnetic wave protective film for FPC ) 是由 桂礼家 姜火林 于 2020-11-05 设计创作，主要内容包括：本发明公开了一种FPC用无导电粒子电磁波防护膜,所述防护膜包含载体膜,所述载体膜上涂布有保护层,所述保护层上涂布有屏蔽层,所述屏蔽层上涂布有纯胶层,所述纯胶层上压合有胶面保护膜；所述保护层的制备原料,按重量份计,包括第一橡胶20～30份,第一环氧树脂30～40份,色粉0.5～1份,阻燃剂0.5～2份,第一固化剂30～40份。本发明中的FPC用无导电粒子电磁波防护膜具有耐折性好、粘结强度大、屏蔽效果好、耐折性好等特点。(The invention discloses a non-conductive particle electromagnetic wave protective film for FPC, comprising a carrier film, wherein a protective layer is coated on the carrier film, a shielding layer is coated on the protective layer, a pure glue layer is coated on the shielding layer, and a glue surface protective film is pressed on the pure glue layer; the protective layer comprises, by weight, 20-30 parts of first rubber, 30-40 parts of first epoxy resin, 0.5-1 part of toner, 0.5-2 parts of a flame retardant and 30-40 parts of a first curing agent. The non-conductive particle electromagnetic wave protective film for the FPC has the characteristics of good folding endurance, high bonding strength, good shielding effect, good folding endurance and the like.)

1. The non-conductive particle electromagnetic wave protective film for the FPC is characterized by comprising a carrier film (1), wherein a protective layer (2) is coated on the carrier film, a shielding layer (3) is coated on the protective layer (2), a pure glue layer (4) is coated on the shielding layer (3), and a glue surface protective film (5) is pressed on the pure glue layer (4); the protective layer (2) is prepared from the following raw materials, by weight, 20-30 parts of first rubber, 30-40 parts of first epoxy resin, 0.5-1 part of toner, 0.5-2 parts of a flame retardant and 30-40 parts of a first curing agent.

2. The electromagnetic wave shielding film of claim 1, wherein the first rubber is carboxylated nitrile rubber.

3. The electromagnetic wave shielding film without conductive particles for FPC of claim 2, wherein Mooney viscosity of said carboxylated nitrile rubber is 27-45.

4. The non-conductive particle electromagnetic wave shielding film for the FPC of claim 1, wherein the first epoxy resin has an epoxy equivalent of 175 to 330g/eq and a viscosity of 2000 to 5000mPa.s at 25 ℃.

5. The non-conductive particle electromagnetic wave shielding film for the FPC of claim 1, wherein the raw materials for preparing the pure adhesive layer (4) comprise, by weight, 15-30 parts of a second rubber, 25-45 parts of a second epoxy resin, 0.5-1 part of an auxiliary agent, 1-3 parts of an accelerator, 10-20 parts of conductive particles, and 30-45 parts of a second curing agent.

6. The electromagnetic wave shielding film of claim 5, wherein the second rubber is a hydroxy nitrile rubber.

7. The electro-conductive particle-free electromagnetic wave shielding film for an FPC as recited in claim 5, wherein the second epoxy resin is a bisphenol A type epoxy resin.

8. The non-conductive particle electromagnetic wave shielding film for the FPC of claim 5, wherein the conductive particles are nano-silver graphene.

9. The non-conductive particle electromagnetic wave shielding film for the FPC of claim 8, wherein the nano-silver in the nano-silver graphene has a particle size of 20 to 100 nm.

10. A method for producing the conductive particle-free electromagnetic wave shielding film for FPC as claimed in any one of claims 1 to 9, comprising the steps of:

s1, removing oil stains and foreign matters on the surface of the carrier film (1);

s2, coating a protective layer (2) on the surface of the carrier film (1), wherein the thickness of the protective layer is 1-2 mu m, and drying the protective layer (2) by an oven to solidify the protective layer; the temperature of the oven is 60-120 ℃;

s3, forming a coarsening base layer on the protective layer (2) by using a sand blasting process, and then plating metal ions on the protective layer (2) by one of a chemical plating method, an electroplating method, a magnetron sputtering method, a vacuum plating method and an evaporation plating method to form a shielding layer (3);

s4, coating the pure glue layer (4) on the shielding layer (3) with the thickness of 2-5 mu m, and drying by an oven to solidify the pure glue layer (4); the temperature of the oven is 60-120 ℃;

s5, a layer of adhesive surface protective film (5) is thermally adhered on the pure adhesive layer.

Technical Field

The invention relates to the technical field of electromagnetic shielding, in particular to a non-conductive particle electromagnetic wave protective film for an FPC (flexible printed circuit).

Background

With the development of miniaturization and light weight of electronic products, the assembly of electronic products is continuously developing towards high density, which greatly pushes the development of flexible circuit boards. Under the promotion of the international market, the functional flexible circuit board is in the leading position of the flexible circuit board market, and an important index of the functional flexible circuit board is electromagnetic shielding. As the functions of communication devices such as mobile phones are aggregated, the components are rapidly driven at high frequency and high speed, and problems of electromagnetic interference inside and outside the components and attenuation of signals during transmission, i.e., insertion loss and jitter, are becoming serious. Electromagnetic shielding films have been used to reduce or attenuate electromagnetic interference. The electromagnetic shielding film is a transparent adhesive film meeting certain light transmission requirements, and when a transmission path of electromagnetic waves meets the electromagnetic shielding film, the electromagnetic shielding film can change the transmission direction of the electromagnetic waves and effectively block the transmission of various electromagnetic waves such as radio waves, infrared waves, ultraviolet waves and the like, so that the interference influence of information leakage, electronic eavesdropping and electromagnetic radiation can be successfully blocked, the normal work of equipment is ensured, and personnel are prevented from being influenced by the electromagnetic radiation.

In the prior art, the electromagnetic shielding film has the following problems: (1) the insulating layer of the electromagnetic shielding film adopts the ink, the ink is printed on a common carrier film due to low molecular weight, high filler proportion and high crosslinking density of the ink, the volume shrinkage of the curing reaction is large, and the electromagnetic shielding film produced by adopting the ink is hard and brittle and cannot resist bending due to the characteristics of brittleness and hardness of the ink. (2) In the subsequent complicated high-temperature and high-pressure operation flow of the FPC, the metal layer of the metal shielding layer is easy to have the conditions of cracking, oxidation and the like, so that the shielding performance is reduced, and even the shielding performance is lost, and the metal layer is easy to cause electromagnetic leakage after being bent for many times. (3) The shielding film made of the common conductive adhesive has low conductivity, poor continuous conductivity and poor shielding performance, so that the requirements of the FPC industry are difficult to meet.

Disclosure of Invention

In order to solve the above problems, the present invention provides a non-conductive particle electromagnetic wave protection film for FPC, the protection film comprises a carrier film 1, a protection layer 2 is coated on the carrier film, a shielding layer 3 is coated on the protection layer 2, a pure glue layer 4 is coated on the shielding layer 3, and a glue surface protection film 5 is pressed on the pure glue layer 4; the protective layer 2 is prepared from 20-30 parts by weight of first rubber, 30-40 parts by weight of first epoxy resin, 0.5-1 part by weight of toner, 0.5-2 parts by weight of flame retardant and 30-40 parts by weight of first curing agent.

As a preferred technical solution, the first rubber is carboxylated nitrile rubber.

As a preferable technical scheme, the Mooney viscosity of the carboxyl nitrile rubber is 27-45.

As a preferable technical scheme, the epoxy equivalent of the first epoxy resin is 175-330 g/eq, and the viscosity is 2000-5000 mPa.s at 25 ℃.

As a preferable technical scheme, the raw materials for preparing the pure rubber layer 4 comprise, by weight, 15-30 parts of second rubber, 25-45 parts of second epoxy resin, 0.5-1 part of an auxiliary agent, 1-3 parts of an accelerator, 10-20 parts of conductive particles and 30-45 parts of a second curing agent.

As a preferred technical solution, the second rubber is hydroxy nitrile rubber.

As a preferable embodiment, the second epoxy resin is a bisphenol a type epoxy resin.

As a preferable technical solution, the conductive particles are nano silver graphene.

As a preferable technical scheme, the particle size of the nano silver in the nano silver graphene is 20-100 nm.

The second aspect of the present invention also provides a method for preparing the non-conductive particle electromagnetic wave shielding film for FPC as described above, comprising the steps of:

s1, removing oil stains and foreign matters on the surface of the carrier film 1;

s2, coating a protective layer 2 on the surface of the carrier film 1, wherein the thickness of the protective layer 2 is 1-2 mu m, and drying the protective layer 2 by an oven to solidify the protective layer; the temperature of the oven is 60-120 ℃;

s3, forming a coarsened base layer on the protective layer 2 by using a sand blasting process, and plating metal ions on the protective layer 2 by using one of a chemical plating method, an electroplating method, a magnetron sputtering method, a vacuum plating method and an evaporation plating method to form a shielding layer 3;

s4, coating the pure glue layer 4 on the shielding layer 3, wherein the thickness of the pure glue layer 4 is 2-5 mu m, and drying the pure glue layer 4 through an oven to solidify the pure glue layer; the temperature of the oven is 60-120 ℃;

s5, a layer of adhesive surface protection film 5 is thermally pasted on the pure adhesive layer.

Advantageous effects

The non-conductive particle electromagnetic wave protective film for the FPC has the characteristics of good folding endurance, high bonding strength, good shielding effect, good folding endurance and the like. The rubber of the protective layer adopts carboxyl nitrile rubber, and polar carboxyl groups are introduced into the molecular structure of the carboxyl nitrile rubber, so that the compatibility of the carboxyl nitrile rubber and epoxy resin is improved, and the prepared coating has high strength, strong bonding effect with a release carrier film and excellent aging resistance. According to the invention, the protective layer, the shielding layer and the pure glue layer interact with each other, so that metal ions on the shielding layer are not easy to fall off, and the shielding effect of the protective film is improved.

Drawings

FIG. 1 is a schematic cross-sectional view of the present invention.

Reference numerals: the adhesive comprises 1-a carrier film, 2-a protective layer, 3-a shielding layer, 4-a pure adhesive layer and 5-an adhesive surface protective film.

Detailed Description

The disclosure may be understood more readily by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.

In order to solve the above problems, the present invention provides a non-conductive particle electromagnetic wave protection film for FPC, the protection film comprises a carrier film 1, a protection layer 2 is coated on the carrier film, a shielding layer 3 is coated on the protection layer 2, a pure glue layer 4 is coated on the shielding layer 3, and a glue surface protection film 5 is pressed on the pure glue layer 4; the protective layer 2 is prepared from 20-30 parts by weight of first rubber, 30-40 parts by weight of first epoxy resin, 0.5-1 part by weight of toner, 0.5-2 parts by weight of flame retardant and 30-40 parts by weight of first curing agent.

In some preferred embodiments, the first rubber is a carboxylated nitrile rubber. The rubber of the invention adopts carboxyl nitrile rubber, and polar carboxyl groups are introduced into the molecular structure of the carboxyl nitrile rubber, so that the compatibility with epoxy resin is increased, and the prepared coating has high strength, strong bonding effect with a release carrier film and excellent aging resistance. In the system, the protective layer formed by the protective layer and the toner powder have good wear resistance and tear strength by cooperating with the toner powder, because the carboxyl group in the carboxyl nitrile rubber reacts with the metal oxide or the salt thereof in the toner powder to form ionic cross-linking bonds. The ionic aggregate formed by ionic bonds is equivalent to a physical cross-linking point in a polymer matrix and has obvious reinforcing and hardening effects on the whole macromolecular network, so that the wear resistance and the tear strength of the coating can be improved.

In some preferred embodiments, the carboxylated nitrile rubber has a Mooney viscosity of from 27 to 45. The Mooney viscosity of the carboxyl nitrile rubber is selected to be 27-45, the viscosity of the epoxy resin in the system is selected to be 2000-5000 mPa.s at 25 ℃, and the Mooney viscosity of the carboxyl nitrile rubber is selected to be within the range, so that the dispersibility of the carboxyl nitrile rubber in the epoxy resin is improved, the caking property of the protective layer is improved, and the viscosity of the system is adjusted to improve the curing efficiency. The inventor finds that the two can ensure the bonding strength of the coating and improve the curing efficiency of the system when acting together.

Mooney viscosity: also called rotational (Mooney) viscosity, is a value measured by a Mooney viscometer and basically reflects the degree of polymerization and molecular weight of the synthetic rubber.

The carboxylated nitrile rubber in the present invention is obtained from Shanghai-based deep International trade company, brand: the american swiss chard.

In some preferred embodiments, the first epoxy resin has an epoxy equivalent of 175 to 330g/eq and a viscosity of 2000 to 5000mPa.s at 25 ℃. According to the invention, the epoxy resin is selected to be the epoxy resin with the epoxy equivalent of 175-330 g/eq and the viscosity of 2000-5000 mPa.s at 25 ℃, so that the folding resistance of the coating is improved, and when the epoxy equivalent of the epoxy resin is too high, the crosslinking density of the rest curing agents is relatively reduced, so that the curing efficiency is low and the bonding strength is weak; when the epoxy equivalent value of the epoxy resin is smaller, the crosslinking density of the epoxy resin and the curing agent is high, the intermolecular force is strong, the brittleness of the coating is enhanced, and the folding resistance is reduced. The viscosity of the coating is 2000-5000 mPa.s at 25 ℃, because the Mooney viscosity of the carboxyl nitrile rubber in the system is 27-45, and the two have combined action, so that the coating has high curing efficiency while the binding power is ensured.

In the present invention, the first epoxy resin is purchased from kelvin chemical industry, brand: KUKDO nations.

In some preferred embodiments, the toner is one of Hensmei TR81, TR28, R-FC5, R-TC30, TR88, TR92, available from Keyed chemical.

In some preferred embodiments, the flame retardant is Crainen OP-930, available from Kane chemical.

In some preferred embodiments, the first curing agent is a winning curing agent, sunmid 315, available from kelvin chemical.

In some preferred embodiments, the protective layer is prepared by: the raw materials are uniformly mixed according to the parts by weight.

In some preferred embodiments, the raw materials for preparing the pure rubber layer 4 comprise, by weight, 15 to 30 parts of a second rubber, 25 to 45 parts of a second epoxy resin, 0.5 to 1 part of an auxiliary agent, 1 to 3 parts of an accelerator, 10 to 20 parts of conductive particles, and 30 to 45 parts of a second curing agent.

In some preferred embodiments, the second rubber is a hydroxy nitrile rubber. The rubber used in the pure rubber layer is hydroxy nitrile rubber, so that the toughness of the pure rubber layer coating is improved; the hydroxyl nitrile rubber molecules and the epoxy matrix can be pre-crosslinked, in the process, an oxirane ring in the epoxy matrix and hydroxyl functional groups at two ends of the hydroxyl nitrile rubber molecules form a block copolymer through chemical bonding, and when the block copolymer is broken, the development of cracks can be effectively prevented, so that the toughness of the high polymer material is improved.

In the present invention, the hydroxy nitrile rubber is available under the trademark PolybdCN-15 (USA).

In some preferred embodiments, the second epoxy resin is a bisphenol a type epoxy resin. The epoxy resin used in the pure glue layer is bisphenol A type epoxy resin, and hydroxyl groups and ether groups in the bisphenol A type epoxy resin have high polarity, so that stronger intermolecular acting force can be generated between epoxy molecules and adjacent interfaces, and the epoxy groups can react with free bonds on the metal surface of the shielding layer to form stable chemical bonds; therefore, when the protective film and the protective layer act together, the stable adhesion of the metal of the shielding layer is ensured, the metal is not easy to fall off, and the shielding performance of the protective film is durable and effective.

In the invention, the bisphenol A epoxy resin is purchased from Keye chemical industry, and the model is as follows: NPEL 128.

In some preferred embodiments, the adjuvant is Crainen OP-935, available from Kane chemical.

In some preferred embodiments, the enhancer is KS chemistry LP-1050 available from Keyed chemical.

In some preferred embodiments, the conductive particles are nano-silver graphene.

In some preferred embodiments, the particle size of the nano silver in the nano silver graphene is 20 to 100 nm.

The nano-silver graphene in the invention is purchased from Dalianmei new material Co.

In some preferred embodiments, the second curing agent is HDI trimer, brand: germany bayer, type: VESATAT B1358/100.

In some preferred embodiments, the method for preparing the pure glue layer comprises: the raw materials are uniformly mixed according to the parts by weight.

The second aspect of the present invention also provides a method for preparing the non-conductive particle electromagnetic wave shielding film for FPC as described above, comprising the steps of:

s1, removing oil stains and foreign matters on the surface of the carrier film 1;

s2, coating a protective layer 2 on the surface of the carrier film 1, wherein the thickness of the protective layer 2 is 1-2 mu m, and drying the protective layer 2 by an oven to solidify the protective layer; the temperature of the oven is 60-120 ℃;

s3, forming a coarsened base layer on the protective layer 2 by using a sand blasting process, and plating metal ions on the protective layer 2 by using one of a chemical plating method, an electroplating method, a magnetron sputtering method, a vacuum plating method and an evaporation plating method to form a shielding layer 3;

s4, coating the pure glue layer 4 on the shielding layer 3, wherein the thickness of the pure glue layer 4 is 2-5 mu m, and drying the pure glue layer 4 through an oven to solidify the pure glue layer; the temperature of the oven is 60-120 ℃;

s5, a layer of adhesive surface protection film 5 is thermally pasted on the pure adhesive layer.

In some preferred embodiments, the carrier film 1 and the adhesive surface protection film 5 are both release films.

In some preferred embodiments, the metal ions in step S3 are at least one of silver ions, copper ions, and aluminum ions.

Examples

The technical solution of the present invention is described in detail by the following examples, but the scope of the present invention is not limited to the examples. Unless otherwise specified, all the raw materials in the present invention are commercially available.

Example 1

Embodiment 1 provides a non-conductive particle electromagnetic wave protective film for FPC, the protective film comprising a carrier film 1, a protective layer 2 coated on the carrier film, a shielding layer 3 coated on the protective layer 2, a pure glue layer 4 coated on the shielding layer 3, and a glue surface protective film 5 laminated on the pure glue layer 4; the raw materials for preparing the protective layer 2 comprise, by weight, 20 parts of first rubber, 39 parts of first epoxy resin, 0.5 part of toner, 0.5 part of flame retardant and 40 parts of first curing agent.

The first rubber is carboxyl nitrile rubber.

The Mooney viscosity of the carboxylated nitrile rubber was 27 (available from Shanghai Riyugo International trade, Inc., brand: Raynaud, USA, model: 1072 CGX).

The first epoxy resin has an epoxy equivalent of 175-205 g/eq and a viscosity of 2000-4000 mPa.s at 25 ℃ (obtained from Kay chemical industry, brand: KUKDO Country, model: SMR-207).

The toner was hounsfield TR81, available from kelvin chemical.

The flame retardant is Kelain OP-930, available from Kain chemical industry.

The first curing agent is a winning curing agent Sunmide 315 which is purchased from Kai-Yin chemical industry.

The preparation method of the protective layer comprises the following steps: the raw materials are uniformly mixed according to the parts by weight.

The raw materials for preparing the pure rubber layer 4 comprise, by weight, 15 parts of second rubber, 45 parts of second epoxy resin, 1 part of an auxiliary agent, 1 part of an accelerator, 8 parts of conductive particles and 30 parts of a second curing agent.

The second rubber was a hydroxy nitrile rubber, having the designation PolybdCN-15 (USA).

The second epoxy resin was bisphenol A type epoxy resin (available from Kay chemical, model: NPEL 128).

The auxiliary agent is Kelain OP-935, which is purchased from Kay chemical industry.

The accelerant is KS chemical LP-1050, purchased from Keyinjin chemical.

The conductive particles are nano silver graphene.

The particle size of the nano silver in the nano silver graphene is 20nm (the nano silver graphene is purchased from New Dalimei Material Co., Ltd., model number: GO 500-1).

The second curing agent is HDI tripolymer, brand: germany bayer, type: VESATAT B1358/100.

The preparation method of the pure glue layer comprises the following steps: the raw materials are uniformly mixed according to the parts by weight.

The embodiment also provides a preparation method of the non-conductive particle electromagnetic wave protection film for the FPC, which comprises the following steps:

s1, removing oil stains and foreign matters on the surface of the carrier film 1;

s2, coating a protective layer 2 on the surface of the carrier film 1, wherein the thickness of the protective layer 2 is 1-2 mu m, and drying the protective layer 2 by an oven to solidify the protective layer; the temperature of the oven is 60 ℃;

s3, forming a coarsened base layer on the protective layer 2 by using a sand blasting process, and plating silver ions on the protective layer 2 by using a chemical plating method to form a shielding layer 3;

s4, coating the pure glue layer 4 on the shielding layer 3, wherein the thickness of the pure glue layer 4 is 2-5 mu m, and drying the pure glue layer 4 through an oven to solidify the pure glue layer; the temperature of the oven is 60 ℃;

s5, a layer of adhesive surface protection film 5 is thermally pasted on the pure adhesive layer.

The carrier film 1 and the adhesive surface protective film 5 are release films.

Example 2

Embodiment 2 provides a non-conductive particle electromagnetic wave protective film for FPC, the protective film comprises a carrier film 1, a protective layer 2 is coated on the carrier film, a shielding layer 3 is coated on the protective layer 2, a pure glue layer 4 is coated on the shielding layer 3, and a glue surface protective film 5 is pressed on the pure glue layer 4; the raw materials for preparing the protective layer 2 comprise, by weight, 30 parts of first rubber, 30 parts of first epoxy resin, 1 part of toner, 2 parts of flame retardant and 37 parts of first curing agent.

The first rubber is carboxyl nitrile rubber.

The Mooney viscosity of the carboxylated nitrile rubber was 45 (from Shanghai Ri-go International trade, Inc., brand: Raynaud, USA, model: NX 75).

The first epoxy resin has an epoxy equivalent of 305-330 g/eq and a viscosity of 2500-5000 mPa.s at 25 ℃ (obtained from KUKDO national city, Kay chemical industry, type: SM-716).

The toner was hounsfield TR28, available from kelvin chemical.

The flame retardant is Kelain OP-930, available from Kain chemical industry.

The first curing agent is a winning curing agent Sunmide 315 which is purchased from Kai-Yin chemical industry.

The preparation method of the protective layer comprises the following steps: the raw materials are uniformly mixed according to the parts by weight.

The raw materials for preparing the pure rubber layer 4 comprise, by weight, 30 parts of second rubber, 40 parts of second epoxy resin, 1 part of an auxiliary agent, 3 parts of an accelerator, 20 parts of conductive particles and 45 parts of a second curing agent.

The second rubber was a hydroxy nitrile rubber, having the designation PolybdCN-15 (USA).

The second epoxy resin was bisphenol A type epoxy resin (available from Kay chemical, model: NPEL 128).

The auxiliary agent is Kelain OP-935, which is purchased from Kay chemical industry.

The accelerant is KS chemical LP-1050, purchased from Keyinjin chemical.

The conductive particles are nano silver graphene.

The particle size of the nano silver in the nano silver graphene is 100nm (the nano silver graphene is purchased from New Dalimei Material Co., Ltd., model number: GO 500-3).

The second curing agent is HDI tripolymer, brand: germany bayer, type: VESATAT B1358/100.

The preparation method of the pure glue layer comprises the following steps: the raw materials are uniformly mixed according to the parts by weight.

The embodiment also provides a preparation method of the non-conductive particle electromagnetic wave protection film for the FPC, which comprises the following steps:

s1, removing oil stains and foreign matters on the surface of the carrier film 1;

s2, coating a protective layer 2 on the surface of the carrier film 1, wherein the thickness of the protective layer 2 is 1-2 mu m, and drying the protective layer 2 by an oven to solidify the protective layer; the temperature of the oven is 120 ℃;

s3, forming a coarsening base layer on the protective layer 2 by using a sand blasting process, and then plating aluminum ions on the protective layer 2 by using a magnetron sputtering method to form a shielding layer 3;

s4, coating the pure glue layer 4 on the shielding layer 3, wherein the thickness of the pure glue layer 4 is 2-5 mu m, and drying the pure glue layer 4 through an oven to solidify the pure glue layer; the temperature of the oven is 120 ℃;

s5, a layer of adhesive surface protection film 5 is thermally pasted on the pure adhesive layer.

The carrier film 1 and the adhesive surface protective film 5 are release films.

Example 3

Embodiment 3 provides a non-conductive particle electromagnetic wave protective film for FPC, the protective film comprising a carrier film 1, a protective layer 2 coated on the carrier film, a shielding layer 3 coated on the protective layer 2, a pure glue layer 4 coated on the shielding layer 3, and a glue surface protective film 5 laminated on the pure glue layer 4; the raw materials for preparing the protective layer 2 comprise, by weight, 25 parts of first rubber, 35 parts of first epoxy resin, 1 part of toner, 1 part of flame retardant and 40 parts of first curing agent.

The first rubber is carboxyl nitrile rubber.

The Mooney viscosity of the carboxylated nitrile rubber was 45 (from Shanghai Ri-go International trade, Inc., brand: Raynaud, USA, model: NX 75).

The first epoxy resin has an epoxy equivalent of 305-330 g/eq and a viscosity of 2500-5000 mPa.s at 25 ℃ (obtained from KUKDO national city, Kay chemical industry, type: SM-716).

The toner was US Hensmei R-TC30, available from Kay chemical.

The flame retardant is Kelain OP-930, available from Kain chemical industry.

The first curing agent is a winning curing agent Sunmide 315 which is purchased from Kai-Yin chemical industry.

The preparation method of the protective layer comprises the following steps: the raw materials are uniformly mixed according to the parts by weight.

The raw materials for preparing the pure rubber layer 4 comprise, by weight, 25 parts of second rubber, 40 parts of second epoxy resin, 1 part of an auxiliary agent, 1 part of an accelerator, 15 parts of conductive particles and 45 parts of a second curing agent.

The second rubber was a hydroxy nitrile rubber, having the designation PolybdCN-15 (USA).

The second epoxy resin was bisphenol A type epoxy resin (available from Kay chemical, model: NPEL 128).

The auxiliary agent is Kelain OP-935, which is purchased from Kay chemical industry.

The accelerant is KS chemical LP-1050, purchased from Keyinjin chemical.

The conductive particles are nano silver graphene.

The particle size of the nano silver in the nano silver graphene is 50nm (the nano silver graphene is purchased from New Dalimei Material Co., Ltd., model number: GO 500-2).

The second curing agent is HDI tripolymer, brand: germany bayer, type: VESATAT B1358/100.

The preparation method of the pure glue layer comprises the following steps: the raw materials are uniformly mixed according to the parts by weight.

The embodiment also provides a preparation method of the non-conductive particle electromagnetic wave protection film for the FPC, which comprises the following steps:

s1, removing oil stains and foreign matters on the surface of the carrier film 1;

s2, coating a protective layer 2 on the surface of the carrier film 1, wherein the thickness of the protective layer 2 is 1-2 mu m, and drying the protective layer 2 by an oven to solidify the protective layer; the temperature of the oven is 100 ℃;

s3, forming a coarsening base layer on the protective layer 2 by using a sand blasting process, and then plating copper ions on the protective layer 2 by using a vacuum plating method to form a shielding layer 3;

s4, coating the pure glue layer 4 on the shielding layer 3, wherein the thickness of the pure glue layer 4 is 2-5 mu m, and drying the pure glue layer 4 through an oven to solidify the pure glue layer; the temperature of the oven is 100 ℃;

s5, a layer of adhesive surface protection film 5 is thermally pasted on the pure adhesive layer.

The carrier film 1 and the adhesive surface protective film 5 are release films.

Comparative example 1

The first rubber was changed to nitrile rubber (model: GM50, available from Congtonto New materials science and technology Co., Jingjiang, Inc.), and the remainder was the same as in example 3.

Comparative example 2

The first epoxy resin is modified to 600 to 700g/eq in epoxy equivalent and 205 to 550mPa.s in viscosity at 25 ℃ (from KUKDO Country, trade name: SM-172EK75), and the rest is the same as in example 3.

Comparative example 3

The first epoxy resin is modified to 600-700 g/eq in epoxy equivalent and 1200-2000 mPa.s in viscosity at 25 ℃ (from KUKDO Country, trade name: SM-172X75), and the rest is the same as in example 3.

Comparative example 4

The second rubber was changed to nitrile rubber (available from Shanghai area chemical Co., Ltd., model No. N230S), and the remainder was the same as in example 3.

Comparative example 5

The particle size of the nano-silver in the nano-silver graphene is changed to 400nm (purchased from Dalian Mei alkene New Material Co., Ltd., model: GO500-4), and the rest is the same as in example 3.

Performance testing

TABLE 1

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.