阅读说明：本技术 一种pcb工艺做成的层叠母排 (Laminated busbar made by PCB technology ) 是由 朱松余 于 2019-08-13 设计创作，主要内容包括：本发明提供一种PCB工艺做成的层叠母排,包括上叠层母排和下叠层母排,上叠层母排从上至下依次设置有一号PET膜、一号PCB板、一号铝排和二号PET膜,下叠层母排从上至下依次设置有三号PET膜、二号铝排、二号PCB板、四号PET膜和环氧树脂板；上叠层母排和下叠层母排的对应位置上设置有电集孔,电集孔在同一侧边上设置有多组,每组电集孔通过导电线沿着一号PCB板的长度依次延伸出焊点,位于焊点周围分布有安装电容或电池的大孔和安装信号采集装置的小孔。本发明方便了模组的安装,成本低,且故障率低,大大提高生产力。(The invention provides a laminated busbar made by a PCB process, which comprises an upper laminated busbar and a lower laminated busbar, wherein the upper laminated busbar is sequentially provided with a first PET film, a first PCB, a first aluminum busbar and a second PET film from top to bottom; the corresponding positions of the upper laminated busbar and the lower laminated busbar are provided with electric collecting holes, the electric collecting holes are arranged on the same side, welding points sequentially extend out of each electric collecting hole along the length of the first PCB through conductive wires, and large holes for mounting capacitors or batteries and small holes for mounting signal acquisition devices are distributed around the welding points. The invention facilitates the installation of the module, has low cost and low failure rate, and greatly improves the productivity.)

1. A laminated busbar made by a PCB process is characterized by comprising an upper laminated busbar and a lower laminated busbar,

the upper laminated busbar is sequentially provided with a first PET film (1), a first PCB (2), a first aluminum bar (3) and a second PET film (4) from top to bottom,

the lower laminated busbar is sequentially provided with a third PET film (5), a second aluminum bar (13), a second PCB (6), a fourth PET film (7) and an epoxy resin plate (8) from top to bottom;

the laminated bus bar is characterized in that an electricity collecting hole (9) is formed in the corresponding position of the upper laminated bus bar and the lower laminated bus bar, multiple groups of electricity collecting holes (9) are formed in the same side, each group of electricity collecting holes (9) sequentially extend out of a welding point (10) along the length of a first PCB (2) through a conducting wire, and a large hole (11) for installing a capacitor or a battery and a small hole (12) for installing a signal acquisition device are distributed around the welding point (10).

2. The laminated busbar manufactured by the PCB process according to claim 1, wherein the laminated busbar comprises: and the capacitor or the battery is fixed in the large hole (11) by laser welding or a nut.

3. The laminated busbar manufactured by the PCB process according to claim 2, wherein the laminated busbar comprises: the plurality of wires arranged in the same group of the current collecting holes (9) are divided into a left wire and a right wire which are arranged, and welding spots (10) of each wire are vertically arranged from top to bottom.

4. The laminated busbar manufactured by the PCB process according to claim 3, wherein the laminated busbar comprises: and the signal acquisition device is connected in the first aluminum row (3) of the upper laminated bus through electric welding in the small hole (12).

5. The laminated busbar manufactured by the PCB process according to claim 4, wherein the laminated busbar comprises: and four sides of the upper laminated busbar and the lower laminated busbar are fastened with the module machine frame through screws.

6. The laminated busbar manufactured by the PCB process according to claim 5, wherein the laminated busbar comprises: the thickness of the first PET film (1), the second PET film (4), the third PET film (5) and the fourth PET film (7) is 0.25 mm.

7. The laminated busbar manufactured by the PCB process according to claim 6, wherein the laminated busbar comprises: the thickness of the epoxy resin plate (8) is 3 mm.

Technical Field

The invention mainly relates to the field of battery modules, in particular to a laminated busbar made by a PCB (printed circuit board) process.

Background

When the lower module is designed, the connection and installation of the single units are troublesome, the labor hour is consumed, the module yield is severely limited, and the wiring failure rate is high.

Because the voltage and partial temperature of each monomer need to be sampled, the traditional process is processed on the basis of an open-wire signal acquisition line, the process is complex, the cost is high, and the failure rate is high.

Published chinese utility model patent, application No. CN201720451404.1, patent name: the utility model provides a super capacitor module structure, application date: 2017-04-27, the invention relates to a super capacitor module structure, which comprises a plurality of super capacitor monomers arranged in parallel, two laminated busbars fixedly arranged at two ends of each super capacitor monomer respectively and a protection monitoring circuit for protecting all the super capacitor monomers in a monitoring module; the laminated busbar comprises at least one busbar layer, a frame layer, a plurality of insulating film layers and a protection monitoring circuit outgoing line, wherein the busbar layer is formed by multiple layers of lamination and integrated forming. Female integrated into one piece that arranges of stromatolite of this structure avoids loaded down with trivial details manual operation when the on-the-spot installation, has solved current ultracapacitor system module structure complicacy, and the installation is inconvenient, technical problem such as the heat dissipation is poor, has overall structure simple, simple to operate, the good characteristics of heat dissipation.

Disclosure of Invention

The invention provides a laminated busbar made by a PCB process, aiming at the defects in the prior art, and providing the laminated busbar made by the PCB process, which comprises an upper laminated busbar and a lower laminated busbar,

the upper laminated busbar is sequentially provided with a first PET film 1, a first PCB 2, a first aluminum row 3 and a second PET film 4 from top to bottom,

the lower laminated busbar is sequentially provided with a third PET film 5, a second aluminum row 13, a second PCB 6, a fourth PET film 7 and an epoxy resin plate 8 from top to bottom;

the power supply device is characterized in that the corresponding positions of the upper laminated busbar and the lower laminated busbar are provided with power collecting holes 9, a plurality of groups of power collecting holes 9 are arranged on the same side, each group of power collecting holes 9 sequentially extend out of a welding point 10 along the length of the first PCB 2 through a conducting wire, and a large hole 11 for mounting a capacitor or a battery and a small hole 12 for mounting a signal acquisition device are distributed around the welding point 10.

Preferably, the capacitor or battery is fixed in the large hole 11 by laser welding or a nut.

Preferably, the current collecting holes 9 in the same group are connector leading-out positions.

Preferably, the PCB signal acquisition points are connected in the first aluminum row 3 of the upper laminated mother through electric welding in the small holes 12.

Preferably, four sides of the upper laminated busbar and the lower laminated busbar are fastened with the module machine frame through screws.

Preferably, the thicknesses of the first PET film 1, the second PET film 4, the third PET film 5 and the fourth PET film 7 are all 0.25 mm.

Preferably, the thickness of the epoxy resin plate 8 is 3 mm.

The invention has the beneficial effects that:

(1) the PCB board is used for replacing an open wire signal acquisition wire, the mature process is low in cost, and the failure rate is low;

(2) the laminated busbar is made, so that the productivity is greatly improved;

(3) the design of the laminated busbar facilitates the installation of the module to a great extent, greatly improves the production efficiency and reduces the reject ratio.

Drawings

Fig. 1 is a structural diagram of an upper laminated busbar connection according to the present invention;

FIG. 2 is a structural diagram of the lower laminated busbar connection according to the present invention;

FIG. 3 is a schematic diagram of a PCB board in an upper stacked mother row according to the present invention;

in the figure, the position of the upper end of the main shaft,

1. a first PET film; 2. a first PCB board; 3. a first aluminum row; 4. a second PET film; 5. no. three PET film; 6. a second PCB board; 7. no. four PET film; 8. an epoxy board; 9. an electric collecting hole; 10. welding spots; 11. macropores; 12. a small hole; 13. and a second aluminum row.

Detailed Description

As shown in fig. 1 to 3, the present invention includes: an upper laminated busbar and a lower laminated busbar,

the upper laminated busbar is sequentially provided with a first PET film 1, a first PCB 2, a first aluminum row 3 and a second PET film 4 from top to bottom,

the lower laminated busbar is sequentially provided with a third PET film 5, a second aluminum row 13, a second PCB 6, a fourth PET film 7 and an epoxy resin plate 8 from top to bottom;

the power supply device is characterized in that the corresponding positions of the upper laminated busbar and the lower laminated busbar are provided with power collecting holes 9, a plurality of groups of power collecting holes 9 are arranged on the same side, each group of power collecting holes 9 sequentially extend out of a welding point 10 along the length of the first PCB 2 through a conducting wire and are led out in a connector form, and a large hole 11 for installing a capacitor or a battery and a small hole 12 for installing a signal acquisition device are distributed around the welding point 10.

In use, the upper laminated busbar (PCB process) mainly consists of, from top to bottom: 0.25mm PET film-2 mm thick PCB-3 mm thick aluminum row-0.25 mm PET film; the lower laminated busbar PCB process mainly comprises the following components from top to bottom: 0.25mm PET film-3 mm thick aluminum row-2 mm thick PCB-0.25 mm PET film-3 mm thick epoxy resin board.

When the laminated busbar (PCB process) is assembled in the module, the following work is only needed:

1. welding or nut fixing the capacitor or the battery and the aluminum row in the laminated mother row;

2. the four sides of the laminated busbar are fastened with the module machine frame screws.

In the present embodiment, the capacitor or battery is preferably fixed in the large hole 11 by laser welding or a nut.

By the arrangement of the structure, the connection between the capacitor or the battery and the upper PCB and the lower PCB is guaranteed, and the product quality is improved.

In this embodiment, preferably, the plurality of wires located in the same group of the current collecting holes 9 are arranged in a left-right two-strand arrangement, and the welding points 10 of each wire are arranged vertically from top to bottom.

By means of the structure, the arrangement of the wires on the PCB is structured, the space is utilized to the maximum extent, the cost is saved, and the maximum installation quantity is increased.

In the present embodiment, the signal acquisition device is connected to the first aluminum row 3 of the upper laminated mother by electric welding in the small hole 12.

With the structure, the small hole 12 is a signal acquisition position, is directly integrated with the aluminum bar in the laminated busbar by processes such as spot welding and the like, is led out to the position of the welding spot 9 through a path on the PCB and is finally led out by a connector. In addition, when installed in a module, the signal acquisition part does not need any further processing.

In this embodiment, preferably, four sides of the upper laminated busbar and the lower laminated busbar are fastened to the module machine frame through screws.

Set up above-mentioned structure, be convenient for go up the female installation and the fastening of arranging with the module frame of stromatolite female arranging and lower stromatolite, improve the firmness, reduce the installation degree of difficulty.

In this embodiment, the thicknesses of the first PET film 1, the second PET film 4, the third PET film 5, and the fourth PET film 7 are all preferably 0.25 mm.

By adopting the structure and the PET with certain thickness, the rigidity of the product is ensured.

In the present embodiment, the thickness of the epoxy resin plate 8 is preferably 3 mm.

By means of the structure, the epoxy resin has good bonding strength and chemical resistance, and the problem that the plate is warped due to heating can be effectively solved.

The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.