阅读说明：本技术 一种基于半导体加工的多晶硅片单面制绒方法 (Polycrystalline silicon slice single-side texturing method based on semiconductor processing ) 是由 孙强 于 2021-06-28 设计创作，主要内容包括：本发明公开了一种基于半导体加工的多晶硅片单面制绒方法,属于多晶硅加工领域,实现通过摆动气缸带动扩风管将风机释放的风进行摆动吹出,减少直吹对多晶硅片本体带来的影响,同时风力吹动使其在伸缩杆和缓冲机构的辅助下上下运动,并带动挤压锤来回挤压弹性气囊,使其通过L形管沿着多晶硅片本体表面吹风,使水珠快速掉落下来,而色变检测片遇水变色,帮助技术人员判断是否风干彻底,且在摆动过程中,部分风经过导气管鼓入到鼓气管内,吹动鼓入球向绝磁囊体内运动,带动其撑开,使Fe-Ni合金粉末不能有效的隔绝两个弧形磁铁块之间的磁性相斥影响,带动伸缩囊体向上延伸,使多晶硅片本体左右偏转,使水和残留的废渣滚落下来。(The invention discloses a polycrystalline silicon slice single-side texturing method based on semiconductor processing, which belongs to the field of polycrystalline silicon processing, and realizes that an air expanding pipe is driven by a swing air cylinder to swing and blow out air released by a fan, so that the influence of direct blowing on a polycrystalline silicon slice body is reduced, meanwhile, the air is blown by wind power to move up and down under the assistance of a telescopic rod and a buffer mechanism, and an extrusion hammer is driven to extrude an elastic air bag back and forth, so that the air bag is blown along the surface of the polycrystalline silicon slice body through an L-shaped pipe, water drops fall off quickly, a color change detection piece changes color when meeting water, a technician is helped to judge whether the air is dried thoroughly, in the swinging process, part of air is blown into an air blowing pipe through an air guide pipe, a blowing ball moves into an insulating magnetic bag body to drive the air blowing ball to expand the air blowing ball to move towards the insulating magnetic bag body, so that Fe-Ni alloy powder cannot effectively isolate the magnetic repulsion influence between two arc-shaped magnet blocks, and a telescopic bag body is driven to extend upwards, the polycrystalline silicon wafer body deflects left and right, so that water and residual waste slag roll off.)

1. A polycrystalline silicon slice single-side texturing method based on semiconductor processing is characterized by comprising the following steps: the method comprises the following steps:

s1, taking a polycrystalline silicon sheet material, and spin-coating a photoresist layer on the non-texturing surface of the polycrystalline silicon sheet as a mask layer;

s2, using an acid etching solution based on HF and HNO3 to perform texturing on the texturing surface of the polycrystalline silicon wafer;

s3, after texturing is finished, respectively performing alkali washing and acid washing on the textured polycrystalline silicon wafer, and then removing the mask layer on the non-textured surface of the textured polycrystalline silicon wafer;

and S4, after washing, carrying out air drying treatment on the polycrystalline silicon slices through an air drying device.

2. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, according to claim 1, is characterized in that: the air drying device in the S4 comprises an air drying base (1), wherein the upper end of the air drying base (1) is rotatably connected with a sealing cover (2), the upper end of the sealing cover (2) is provided with a fan (3), the lower end of the fan (3) is fixedly connected with an exhaust pipe (4), the lower end of the exhaust pipe (4) penetrates through the upper end of the sealing cover (2) and extends to the inside of the sealing cover, the lower end of the exhaust pipe (4) is rotatably connected with an air expanding pipe (5), the inner top end of the sealing cover (2) is provided with a swing cylinder (6), the output end of the swing cylinder (6) is fixedly connected with the air expanding pipe (5), the upper end of the air drying base (1) is fixedly connected with a support column, the upper end of the support column is fixedly connected with a collection box (8), the inner bottom of the collection box (8) is fixedly connected with a fixed plate (9), and the front end and the rear end of the fixed plate (9) are both rotatably connected with connecting rods, the upper side of the collecting box (8) is provided with an operating platform (11), the lower end of the operating platform (11) is fixedly connected with the upper ends of the two connecting rods, a plurality of uniformly distributed drain holes are formed in the upper end of the operating platform (11), the upper end of the operating platform (11) is fixedly connected with a color change detection sheet (10), the upper end of the operating platform (11) is close to the left end and the right end and is fixedly connected with a mounting plate (14), a clamp (13) is arranged in the mounting plate (14), the upper side of the operating platform (11) is provided with a polycrystalline silicon wafer body (12), the left end and the right end of the polycrystalline silicon wafer body (12) are both contacted with the inner wall of the clamp (13), a telescopic rod (15) is fixedly connected between the upper end of the clamp (13) and the inner top end of the mounting plate (14), and a buffer mechanism is arranged between the lower end of the clamp (13) and the inner bottom end of the mounting plate (14), the inner wall fixed connection of mounting panel (14) has elasticity gasbag (20), elasticity gasbag (20) intussuseption is filled with the air, the upper end fixedly connected with L venturi tube (21) of elasticity gasbag (20), and L venturi tube (21) and elasticity gasbag (20) inside are linked together, the one end fixedly connected with extrusion hammer (19) of polycrystal silicon chip body (12) are kept away from in anchor clamps (13), extrusion hammer (19) contact with elasticity gasbag (20).

3. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, according to claim 2, is characterized in that: the upper end of the collecting box (8) is fixedly connected with air guide tubes (27) at the left end and the right end, two telescopic bag bodies (28) are fixedly connected between the lower end of the operating platform (11) and the inner bottom end of the collecting box (8), the inner top end and the inner bottom end of each telescopic bag body (28) are fixedly connected with arc-shaped magnet blocks (33), one end of each telescopic bag body (28) close to the air guide tube (27) is provided with an air injection hole, the inner wall of each air injection hole is fixedly connected with an air blowing tube (29), one end of each air blowing tube (29) far away from the corresponding telescopic bag body (28) is fixedly connected with the corresponding air guide tube (27), the inner top end of each air blowing tube (29) is fixedly connected with a tension rope (30), one end of each tension rope (30) close to the corresponding telescopic bag body (28) is fixedly connected with a blowing ball (31), and the outer end of each blowing ball (31) is in contact with the inner wall of each air blowing tube (29), one end of the air blowing pipe (29) far away from the air guide pipe (27) is fixedly connected with a magnetism isolating bag body (32), the outer end of the air blowing ball (31) is in contact with the inner wall of the magnetism isolating bag body (32), Fe-Ni alloy powder is filled in the magnetism isolating bag body (32), and the content of Ni is 80%.

4. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, according to claim 2, is characterized in that: expand fixedly connected with U-shaped heat absorption cover (22) between tuber pipe (5) inside wall, the inner wall fixedly connected with diaphragm (23) of U-shaped heat absorption cover (22), it has the heat absorption fluid to fill between U-shaped heat absorption cover (22) and diaphragm (23), U-shaped heat absorption cover (22) outer end fixedly connected with separates temperature utricule (24), it is filled with carbon dioxide gas to separate temperature utricule (24), expand equal fixedly connected with lifting rope (25) in both ends inner wall about tuber pipe (5), the lower extreme fixedly connected with elasticity ball (26) of lifting rope (25).

5. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, according to claim 2, is characterized in that: buffer gear includes straight section of thick bamboo (17), the inner bottom fixed connection of straight section of thick bamboo (17) lower extreme and mounting panel (14), sliding connection has piston (18) in straight section of thick bamboo (17), fixedly connected with spring between the lower extreme of piston (18) and the inner bottom of mounting panel (14), the upper end fixedly connected with movable rod (16) of piston (18), the chisel has the through-hole in the inner top of straight section of thick bamboo (17), the lower extreme fixed connection of through-hole and anchor clamps (13) is passed to the upper end of movable rod (16).

6. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, according to claim 2, is characterized in that: the inner bottom end of the collection box (8) is fixedly connected with a sponge absorption block (7), and the surface of the sponge absorption block (7) is coated with a corrosion-resistant coating.

7. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, according to claim 2, is characterized in that: the surface of the color change detection sheet (10) is coated with a water-based silk-screen printing ink coating, and the initial color of the color change detection sheet (10) is white.

8. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, which is characterized by comprising the following steps of: the telescopic capsule body (28) and the magnetism insulation capsule body (32) are both made of elastic materials, and the two ends, close to each other, of the arc-shaped magnet blocks (33) are both arranged in an S pole mode.

9. The single-sided texturing method of the polycrystalline silicon wafer based on the semiconductor processing, which is characterized by comprising the following steps of: the tension rope (30) is made of rubber materials, and the interior of the bulge-in ball (31) is hollow.

Technical Field

The invention relates to the field of polycrystalline silicon processing, in particular to a polycrystalline silicon slice single-side texturing method based on semiconductor processing.

Background

Polycrystalline silicon is a form of elemental silicon, and when molten elemental silicon is solidified under a super-cooling condition, silicon atoms are arranged in a diamond lattice form to form a plurality of crystal nuclei, and if the crystal nuclei grow to form crystal grains with different crystal plane orientations, the crystal grains are combined to crystallize into polycrystalline silicon. In the process of processing the polycrystalline silicon, texturing is an important process, granular corrosion pits can be formed on the surface of the polycrystalline silicon wafer by etching the surface of the silicon wafer through the acidic corrosion liquid, and the corrosion pits are beneficial to multiple reflections of incident light on the surface of the polycrystalline silicon wafer, so that the incidence probability of the incident light into the silicon wafer is increased, and the reflectivity is reduced.

At present, single face system fine hair is with its reduction silicon chip loss and chemical consumption, become a development trend of silicon chip system fine hair, receive people's liking deeply, and at the system fine hair in-process, need wash the polycrystalline silicon piece after the system fine hair is ended, get rid of residual liquid and residue, then wash and air-dry, but air-dry the form that the device is for directly blowing mostly among the prior art, cause the damage to polycrystalline silicon piece easily, and can't effectual judgement air-dry thoroughly, can't effectual clear up to remaining waste residue, the result of use is poor.

Disclosure of Invention

1. Technical problem to be solved

Aiming at the problems in the prior art, the invention aims to provide a polycrystalline silicon slice single-side texturing method based on semiconductor processing, which can realize that an air expanding pipe is driven by a swing cylinder to swing and blow out air released by a fan, so that the influence of direct blowing on a polycrystalline silicon slice body is reduced, meanwhile, the air is blown by the wind power to move up and down under the assistance of a telescopic rod and a buffer mechanism, an extrusion hammer is driven to extrude an elastic air bag back and forth, the elastic air bag is blown along the surface of the polycrystalline silicon slice body through an L-shaped pipe, so that water drops quickly fall off, a color change detection sheet changes color when encountering water, a technician is helped to judge whether air is completely dried, in the swing process, part of air is blown into the air blowing pipe through an air guide pipe, a blowing-in ball moves into an isolated magnet bag body to drive the air blowing-in ball to expand the isolated magnet bag, so that Fe-Ni alloy powder can not effectively isolate the magnetic repulsion influence between two arc magnet blocks, drive flexible utricule and upwards extend, make the polycrystalline silicon piece body control deflect, make water and remaining waste residue roll and fall, avoid remaining, and along with the continuous work of fan, the production heat attacks along with wind, and the heat-absorbing body in the U-shaped heat absorption cover cooperates the thermal-insulated effect of carbon dioxide gas, can effectual absorption heat, avoids high temperature environment to cause the influence to the polycrystalline silicon piece body.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

A single-side texturing method of a polycrystalline silicon wafer based on semiconductor processing comprises the following steps:

s1, taking a polycrystalline silicon sheet material, and spin-coating a photoresist layer on the non-texturing surface of the polycrystalline silicon sheet as a mask layer;

s2, using an acid etching solution based on HF and HNO3 to perform texturing on the texturing surface of the polycrystalline silicon wafer;

s3, after texturing is finished, respectively performing alkali washing and acid washing on the textured polycrystalline silicon wafer, and then removing the mask layer on the non-textured surface of the textured polycrystalline silicon wafer;

and S4, after washing, carrying out air drying treatment on the polycrystalline silicon slices through an air drying device.

Further, the air drying device in S4 includes an air drying base, a sealing cover is rotatably connected to the upper end of the air drying base, a fan is installed at the upper end of the sealing cover, an exhaust pipe is fixedly connected to the lower end of the fan, the lower end of the exhaust pipe penetrates through the upper end of the sealing cover and extends into the sealing cover, an air expansion pipe is rotatably connected to the lower end of the exhaust pipe, a swing cylinder is installed at the inner top end of the sealing cover, the output end of the swing cylinder is fixedly connected with the air expansion pipe, a support column is fixedly connected to the upper end of the air drying base, a collection box is fixedly connected to the upper end of the support column, a fixed plate is fixedly connected to the inner bottom end of the collection box, connecting rods are rotatably connected to the front and rear ends of the fixed plate, an operation table is arranged on the upper side of the collection box, the lower end of the operation table is fixedly connected to the upper ends of the two connecting rods, and a plurality of uniformly distributed drain holes are chiseled on the operation table, the upper end of the operating platform is fixedly connected with a color change detection sheet, the upper end of the operating platform is close to both the left end and the right end and is fixedly connected with a mounting plate, a clamp is arranged in the mounting plate, a polycrystalline silicon wafer body is arranged on the upper side of the operating platform, both the left end and the right end of the polycrystalline silicon wafer body are in contact with the inner wall of the clamp, a telescopic rod is fixedly connected between the upper end of the clamp and the inner top end of the mounting plate, a buffer mechanism is arranged between the lower end of the clamp and the inner bottom end of the mounting plate, an elastic air bag is fixedly connected to the inner wall of the mounting plate and is filled with air, an L-shaped pipe is fixedly connected to the upper end of the elastic air bag and is communicated with the interior of the elastic air bag, one end of the clamp, far away from the polycrystalline silicon wafer body, is fixedly connected with an extrusion hammer which is in contact with the elastic air bag, so that the polycrystalline silicon wafer body can be clamped and fixed by the clamp, and starts to drive the fan to release the air, enters the air expanding pipe through the exhaust pipe, drives the swing cylinder to drive the air expanding pipe to swing left and right, enables the air to be blown out through swing, avoids directly blowing to the polycrystalline silicon wafer body, reduces the influence on the polycrystalline silicon wafer body, blows along with the wind direction, drives the polycrystalline silicon wafer body and the clamp to move up and down under the assistance of the telescopic rod and the buffer mechanism, and drives the extrusion hammer to move up and down in the process of moving up and down, so as to realize the back-and-forth extrusion of the elastic air bag, after the elastic air bag is extruded, the air is blown along the surface of the polycrystalline silicon wafer body through the L-shaped pipe, so as to realize the throwing and blowing of water beads on the polycrystalline silicon wafer body, simultaneously, waste residues remained on the surface of the elastic air bag are loosened, the water beads drop and flow through the color change detection piece, so that the color of the elastic air bag is changed, and after no water exists, the water returns to the original color of the elastic air bag, helps a technician to judge whether the air drying is completely finished, the water drops are prevented from remaining, and then enter the collecting box through the water discharging hole to be collected.

Further, air guide tubes are fixedly connected to the upper end of the collecting box close to the left end and the right end, two telescopic bag bodies are fixedly connected between the lower end of the operating platform and the inner bottom end of the collecting box, arc-shaped magnet blocks are fixedly connected to the inner top end and the inner bottom end of each telescopic bag body, an air injection hole is drilled in one end of each telescopic bag body close to each air guide tube, an air blowing tube is fixedly connected to the inner wall of the air injection hole, one end of each air blowing tube, far away from each telescopic bag body, is fixedly connected with the air guide tube, a tension rope is fixedly connected to the inner top end of each air blowing tube, one end of each tension rope, close to each telescopic bag body, is fixedly connected with a blowing ball, the outer end of each blowing ball is in contact with the inner wall of each air blowing tube, one end of each air blowing tube, far away from each air guide tube, is fixedly connected with an insulating bag body, the outer end of each blowing ball is in contact with the inner wall of the insulating bag body, and Fe-Ni alloy powder is filled in the insulating bag body, and the content of Ni is 80%, in the swinging blowing process of the air expansion pipe, part of air enters the air guide pipe, then enters the air blowing pipe, along with the blowing of the air, the blowing-in ball moves into the magnetism insulation bag body, at the moment, the tension rope is stretched, along with the entering of the blowing-in ball, the magnetism insulation bag body is propped open, the originally closed Fe-Ni alloy powder can effectively isolate the magnetic influence between the two arc magnet blocks, the volume of the magnetism insulation bag body is enlarged after the propping open, the Fe-Ni alloy powder is diffused, the magnetism between the two arc magnet blocks starts to generate repulsion action again, so that the telescopic bag body extends upwards, the operation table and the polycrystalline silicon wafer body are driven to deflect left and right, water drops and residual waste residues are convenient to roll down and enter the collection box, the occurrence of the residues is avoided, and the cleaning is more thorough.

Furthermore, a U-shaped heat absorption sleeve is fixedly connected between the inner side walls of the air expansion pipes, a diaphragm is fixedly connected to the inner wall of the U-shaped heat absorption sleeve, heat absorption fluid is filled between the U-shaped heat absorption sleeve and the diaphragm, a heat insulation bag body is fixedly connected to the outer end of the U-shaped heat absorption sleeve, carbon dioxide gas is filled in the heat insulation bag body, lifting ropes are fixedly connected to the inner walls of the left end and the right end of the air expansion pipes, an elastic ball is fixedly connected to the lower end of each lifting rope, the elastic ball can generate heat along with the continuous work of the fan to drive the temperature to rise, meanwhile, the wind released by the lifting ropes carries the heat to blow, the heat absorption fluid in the U-shaped heat absorption sleeve can absorb the heat carried in the wind, and along with the blowing of the wind, the elastic ball is driven to move and collide with the surface of the diaphragm for multiple times to deform the diaphragm to drive the heat absorption fluid to flow, so that the heat absorption fluid is more fully contacted with the heat, the reinforcing absorption effect, the carbon dioxide gas in the thermal-insulated bag has thermal-insulated effect simultaneously, can effectually completely cut off the heat transfer in the U-shaped heat absorption cover to the downside, avoids the polycrystalline silicon chip body to be in high temperature environment, causes the influence to it.

Further, the buffer mechanism comprises a straight cylinder, the lower end of the straight cylinder is fixedly connected with the inner bottom end of the mounting plate, a piston is connected in the straight cylinder in a sliding manner, a spring is fixedly connected between the lower end of the piston and the inner bottom end of the mounting plate, a movable rod is fixedly connected to the upper end of the piston, a through hole is formed in the inner top end of the straight cylinder, the upper end of the movable rod penetrates through the through hole and is fixedly connected with the lower end of the clamp, when the polycrystalline silicon wafer body and the clamp are blown by wind power to move downwards, the movable rod moves downwards along with the polycrystalline silicon wafer body and the clamp, the piston is extruded to move towards the inside of the straight cylinder, the spring is compressed at the moment, the wind is blown along with the left-right swinging of the wind expansion pipe, when the wind power is weak, the piston and the movable rod move upwards to push the polycrystalline silicon wafer body and the clamp to move upwards to the original position, and the repeated downward and upward resetting movement is carried out, the polycrystalline silicon wafer body and the clamp move up and down, and water drops are quickly thrown away.

Furthermore, the inner bottom end of the collecting box is fixedly connected with a sponge absorbing block, the surface of the sponge absorbing block is coated with a corrosion-resistant coating, the sponge absorbing block can absorb the dripping water, and meanwhile, the corrosion-resistant coating can effectively prevent residual acid-base solution which drips from corroding the sponge absorbing block, so that the sponge absorbing block is prevented from being damaged, and the service life of the sponge absorbing block is prolonged.

Furthermore, the surface of the color change detection sheet is coated with the water-based silk-screen ink coating, the initial color of the color change detection sheet is white, the water-based silk-screen ink coating on the color change detection sheet can change color when meeting water and changes from white to transparent, and meanwhile, the water is restored to the initial white color after being dissipated, so that people can observe and judge the water-based silk-screen ink coating conveniently.

Further, flexible utricule and the utricule of stopping magnetism all adopt the elasticity material to make, two the one end that the arc magnet piece is close to each other is the S utmost point setting, and flexible utricule and the utricule of stopping magnetism made through using the elasticity material can realize taking place deformation under the drive of power, and the effect of simultaneous force can resume to original state fast after disappearing, and the like nature setting of two arc magnet pieces can produce the flexible utricule of power drive that repels each other and upwards extend.

Further, the pulling force rope adopts the rubber material to make, the inside of going into the ball is hollow setting, and the ball can reduce its quality influence greatly into the drum of hollow setting, realizes blowing its emergence motion easily after the wind-force is gone into, and the pulling force rope that adopts the rubber material to make has the elastic action, and after wind-force disappears, the pulling drum goes into the ball and resets.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

the scheme realizes that the air expanding pipe is driven by the swing air cylinder to swing and blow out the air released by the fan, the influence of direct blowing on the polycrystalline silicon wafer body is reduced, meanwhile, the air power blows to enable the air expanding pipe to move up and down under the assistance of the telescopic rod and the buffer mechanism, and the extrusion hammer is driven to extrude the elastic air bag back and forth, so that the elastic air bag blows along the surface of the polycrystalline silicon wafer body through the L-shaped pipe, water drops fall off quickly, the color change detection piece changes color when encountering water, technicians are helped to judge whether the air is dried thoroughly, in the swinging process, part of the air is blown into the air expanding pipe through the air guide pipe, the blowing ball moves into the magnetic isolation bag body to drive the expansion of the air bag, Fe-Ni alloy powder cannot effectively isolate the influence of magnetic repulsion between the two arc-shaped magnet blocks, the telescopic bag body is driven to extend upwards, the polycrystalline silicon wafer body deflects left and right, and the water and the residual waste residues roll off, the heat absorption body in the U-shaped heat absorption sleeve can effectively absorb heat by matching the heat insulation effect of carbon dioxide gas, and the influence of a high-temperature environment on the polycrystalline silicon wafer body is avoided.

Drawings

FIG. 1 is a schematic flow chart of a single-sided texturing method for a polycrystalline silicon wafer according to the present invention;

FIG. 2 is a schematic perspective view of an air drying device according to the present invention

FIG. 3 is a schematic view of the overall cross-sectional structure of the air drying apparatus according to the present invention;

FIG. 4 is an enlarged schematic view of the structure at A in FIG. 3;

FIG. 5 is a schematic cross-sectional view of the air diffuser according to the present invention;

FIG. 6 is a schematic perspective view of a U-shaped heat-absorbing jacket according to the present invention;

FIG. 7 is a schematic cross-sectional view of a telescopic bladder of the present invention;

fig. 8 is an enlarged schematic view of the structure at B in fig. 7.

The reference numbers in the figures illustrate:

1. air-drying the base; 2. a sealing cover; 3. a fan; 4. an exhaust duct; 5. an air expanding pipe; 6. a swing cylinder; 7. a sponge absorbing block; 8. a collection box; 9. a fixing plate; 10. a color change detection sheet; 11. an operation table; 12. a polycrystalline silicon wafer body; 13. a clamp; 14. mounting a plate; 15. a telescopic rod; 16. a movable rod; 17. a straight cylinder; 18. a piston; 19. extruding a hammer; 20. an elastic air bag; 21. an L-shaped tube; 22. a U-shaped heat absorbing sleeve; 23. a diaphragm; 24. a thermal insulation bag body; 25. a lifting rope; 26. an elastic ball; 27. an air duct; 28. a flexible bladder body; 29. blowing a gas pipe; 30. a tension rope; 31. rolling the ball; 32. a magnetic isolation capsule body; 33. an arc-shaped magnet block.

Detailed Description

The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

referring to fig. 1, a method for texturing a single surface of a polysilicon wafer based on semiconductor processing includes the following steps:

s1, taking a polycrystalline silicon sheet material, and spin-coating a photoresist layer on the non-texturing surface of the polycrystalline silicon sheet as a mask layer;

s2, using an acid etching solution based on HF and HNO3 to perform texturing on the texturing surface of the polycrystalline silicon wafer;

s3, after texturing is finished, respectively performing alkali washing and acid washing on the textured polycrystalline silicon wafer, and then removing the mask layer on the non-textured surface of the textured polycrystalline silicon wafer;

and S4, after washing, carrying out air drying treatment on the polycrystalline silicon slices through an air drying device.

Referring to fig. 2-4 and 7-8, the air drying device in S4 includes an air drying base 1, the upper end of the air drying base 1 is rotatably connected with a sealing cover 2, the upper end of the sealing cover 2 is provided with a fan 3, the lower end of the fan 3 is fixedly connected with an exhaust pipe 4, the lower end of the exhaust pipe 4 penetrates the upper end of the sealing cover 2 and extends into the sealing cover, the lower end of the exhaust pipe 4 is rotatably connected with an air expanding pipe 5, the inner top end of the sealing cover 2 is provided with a swing cylinder 6, the output end of the swing cylinder 6 is fixedly connected with the air expanding pipe 5, the upper end of the air drying base 1 is fixedly connected with a support column, the upper end of the support column is fixedly connected with a collection box 8, the inner bottom end of the collection box 8 is fixedly connected with a fixed plate 9, the front and rear ends of the fixed plate 9 are both rotatably connected with connecting rods, the upper side of the collection box 8 is provided with an operation table 11, the lower end of the operation table 11 is fixedly connected with the upper ends of the two connecting rods, a plurality of uniformly distributed drain holes are drilled at the upper end of an operating platform 11, a color change detection sheet 10 is fixedly connected at the upper end of the operating platform 11, mounting plates 14 are fixedly connected at the positions, close to the left and right ends, of the upper end of the operating platform 11, clamps 13 are arranged in the mounting plates 14, a polycrystalline silicon wafer body 12 is arranged at the upper side of the operating platform 11, the left and right ends of the polycrystalline silicon wafer body 12 are contacted with the inner walls of the clamps 13, telescopic rods 15 are fixedly connected between the upper end of the clamps 13 and the inner top ends of the mounting plates 14, a buffer mechanism is arranged between the lower end of the clamps 13 and the inner bottom ends of the mounting plates 14, an elastic air bag 20 is fixedly connected to the inner walls of the mounting plates 14, air is filled in the elastic air bag 20, an L-shaped pipe 21 is fixedly connected to the upper end of the elastic air bag 20, the L-shaped pipe 21 is communicated with the interior of the elastic air bag 20, and an extrusion hammer 19 is fixedly connected to one end, far away from the polycrystalline silicon wafer body 12, of the clamps 13, the extrusion hammer 19 is in contact with the elastic air bag 20, so that the polycrystalline silicon wafer body 12 can be clamped and fixed through the clamp 13, the fan 3 is driven to release air, the air enters the air expansion pipe 5 through the exhaust pipe 4, the swing cylinder 6 is driven to drive the air expansion pipe 5 to swing left and right at the same time, the air is blown out through swinging, the direct blowing on the polycrystalline silicon wafer body 12 is avoided, the influence on the polycrystalline silicon wafer body is reduced, the polycrystalline silicon wafer body 12 and the clamp 13 are driven to move up and down under the assistance of the telescopic rod 15 and the buffer mechanism along with the downward blowing of the wind, the extrusion hammer 19 is driven to move up and down in the up and down movement process, the elastic air bag 20 is extruded back and forth, after the elastic air bag 20 is extruded, the air is blown along the surface of the polycrystalline silicon wafer body 12 through the L-shaped pipe 21, the water beads on the polycrystalline silicon wafer body 12 are thrown and blown down, and the waste residues remained on the surface of the elastic air bag are loosened, the drop drops and flows through the color change detection sheet 10 to change color, and the drop drops return to the original color after no water exists, the change of the color helps technicians to judge whether the air drying is completely finished, the drop drops are prevented from remaining, the drop drops then enter the collection box 8 through the drain hole to be collected, the buffer mechanism comprises a straight cylinder 17, the lower end of the straight cylinder 17 is fixedly connected with the inner bottom end of the mounting plate 14, a piston 18 is connected in the straight cylinder 17 in a sliding manner, a spring is fixedly connected between the lower end of the piston 18 and the inner bottom end of the mounting plate 14, a movable rod 16 is fixedly connected at the upper end of the piston 18, a through hole is drilled at the inner top end of the straight cylinder 17, the upper end of the movable rod 16 passes through the through hole to be fixedly connected with the lower end of the clamp 13, when the polycrystalline silicon wafer body 12 and the clamp 13 are blown by wind power to move downwards, the movable rod 16 moves downwards along with the straight cylinder 17 to extrude the piston 18 to move towards the straight cylinder 17, at the moment, the spring is compressed, and blows along with the left-right swinging of the air expansion pipe 5, when the wind power is weak, the piston 18 and the movable rod 16 move upwards under the elastic action of the spring to push the polycrystalline silicon wafer body 12 and the clamp 13 to move upwards and return to the original position, and the polycrystalline silicon wafer body 12 and the clamp 13 move up and down through repeated downward and upward return movement, so that water drops are quickly thrown away, in the technical scheme, the type of the fan 3 is SF2.5-4, and the type of the swinging cylinder 6 is MSQA10A-M9 BW.

Referring to fig. 2 and 7, air ducts 27 are fixedly connected to the upper end of the collection box 8 near the left and right ends, two telescopic capsules 28 are fixedly connected between the lower end of the console 11 and the inner bottom end of the collection box 8, arc-shaped magnet blocks 33 are fixedly connected to the inner top end and the inner bottom end of the telescopic capsules 28, an air injection hole is drilled in one end of each telescopic capsule 28 near the air duct 27, an air blowing tube 29 is fixedly connected to the inner wall of the air injection hole, one end of each air blowing tube 29 far from the telescopic capsule 28 is fixedly connected to the air duct 27, a tension rope 30 is fixedly connected to the inner top end of each air blowing tube 29, a blowing ball 31 is fixedly connected to one end of each tension rope 30 near the telescopic capsule 28, the outer end of each blowing ball 31 contacts with the inner wall of the air blowing tube 29, one end of each air blowing tube 29 far from the air duct 27 is fixedly connected to a magnetic insulation capsule 32, the outer end of each blowing ball 31 contacts with the inner wall of the magnetic insulation capsule 32, Fe-Ni alloy powder is filled in the magnetic insulation capsule 32, and the content of Ni is 80%, in the swinging blowing process of the air expanding pipe 5, part of air enters the air guide pipe 27, then enters the air blowing pipe 29, the blowing-in ball 31 is blown to move towards the magnetism insulation bag body 32 along with the blowing-in of the air, at the moment, the tension rope 30 is stretched, the magnetism insulation bag body 32 is expanded along with the entering of the blowing-in ball 31, the originally closed Fe-Ni alloy powder can effectively isolate the magnetic influence between the two arc magnet blocks 33, the volume of the magnetism insulation bag body 32 is enlarged after the expansion, the Fe-Ni alloy powder is diffused, the magnetism between the two arc magnet blocks 33 starts to generate a repulsive action, the telescopic bag body 28 extends upwards, the operation table 11 and the polycrystalline silicon wafer body 12 are driven to deflect left and right, water drops and residual waste residues are convenient to roll down and enter the collection box 8, the occurrence of the residues is avoided, and the cleaning is more thorough.

Referring to fig. 5-6, a U-shaped heat absorbing sleeve 22 is fixedly connected between the inner side walls of the air expanding pipe 5, a diaphragm 23 is fixedly connected to the inner wall of the U-shaped heat absorbing sleeve 22, a heat absorbing fluid is filled between the U-shaped heat absorbing sleeve 22 and the diaphragm 23, a thermal insulating bag 24 is fixedly connected to the outer end of the U-shaped heat absorbing sleeve 22, a carbon dioxide gas is filled in the thermal insulating bag 24, lifting ropes 25 are fixedly connected to the inner walls of the left and right ends of the air expanding pipe 5, and elastic balls 26 are fixedly connected to the lower ends of the lifting ropes 25, and generate heat with the continuous operation of the fan 3, so as to drive the temperature to rise, and the released wind blows along with the heat, and the heat absorbing fluid in the U-shaped heat absorbing sleeve 22 can absorb the heat carried in the wind, and drive the elastic balls 26 to move along with the blowing of the wind to contact and collide with the surface of the diaphragm 23 for multiple times, so as to deform the heat absorbing fluid to flow, and make the heat absorbing fluid contact with the heat more fully, the reinforcing absorption effect, the carbon dioxide gas in the thermal-insulated utricule 24 has thermal-insulated effect simultaneously, and the heat transfer to the downside in can effectual isolated U-shaped endothermal jacket 22 avoids the polycrystalline silicon chip body 12 to be in high temperature environment, causes the influence to it.

Referring to fig. 3, a sponge absorbing block 7 is fixedly connected to an inner bottom end of the collecting box 8, a corrosion-resistant coating is coated on the surface of the sponge absorbing block 7, the sponge absorbing block 7 can absorb dropped water, and meanwhile, the corrosion-resistant coating can effectively prevent residual acid-base solution dropped from corroding the sponge absorbing block 7, so that the sponge absorbing block is prevented from being damaged, and the service life of the sponge absorbing block is prolonged.

Referring to fig. 7-8, the flexible capsule 28 and the magnetism-insulating capsule 32 are both made of elastic materials, the two arc-shaped magnet blocks 33 are both arranged in an S-pole manner, the flexible capsule 28 and the magnetism-insulating capsule 32 made of elastic materials can be driven by force to deform, and can be quickly restored to an original state after the force disappears, the two arc-shaped magnet blocks 33 are arranged in the same nature, and can generate mutually repulsive force to drive the flexible capsule 28 to extend upwards, the tension rope 30 is made of rubber, the inside of the blowing ball 31 is arranged in a hollow manner, the blowing ball 31 arranged in the hollow manner can greatly reduce the mass influence, so that the blowing ball can be easily blown to move after wind blows, the tension rope 30 made of rubber has an elastic effect, and the blowing ball 31 is pulled to reset after the blowing ball disappears.

In the invention, when the related technicians use the sealing cover 2 is firstly turned open, the polycrystalline silicon wafer body 12 is clamped and fixed through the clamp 13, then the fan 3 is driven to release air, the air enters the air expanding pipe 5 through the exhaust pipe 4, the swing cylinder 6 is driven to drive the air expanding pipe 5 to swing left and right at the same time, so that the air is blown out through swinging, the air is prevented from directly blowing onto the polycrystalline silicon wafer body 12, the influence on the polycrystalline silicon wafer body is reduced, when the crystalline silicon wafer body 12 and the clamp 13 are driven to move downwards along with the air blown downwards, the movable rod 16 moves downwards along with the crystalline silicon wafer body 12 and the clamp, the piston 18 is extruded to move towards the straight cylinder 17, the spring is compressed, and the air is blown along with the left and right swinging of the air expanding pipe 5, when the wind power is weak, the piston 18 and the movable rod 16 move upwards through the elastic action of the spring, so as to push the polycrystalline silicon wafer body 12 and the clamp 13 to move upwards and restore to the original position, so repeated downward and upward resetting movement firstly, the polycrystalline silicon wafer body 12 and the clamp 13 move up and down, and the extrusion hammer 19 is driven to move up and down in the up and down movement process to realize the back-and-forth extrusion of the elastic air bag 20, after the elastic air bag 20 is extruded, the air is blown along the surface of the polycrystalline silicon wafer body 12 through the L-shaped pipe 21, the water drops on the polycrystalline silicon wafer body 12 are thrown off and blown off, simultaneously, the waste residues remained on the surface of the water drops are loosened, the water drops drip off and flow through the color change detection sheet 10 to cause the color change of the water drops, and after no water exists, the water drops recover to the original color, the technical personnel can judge whether the air drying is completely finished through the color change of the water drops, the water drops are prevented from remaining, then enter the collecting box 8 through the drain hole to be collected, and in the swinging air blowing process of the air expanding pipe 5, part of the air enters the air guide pipe 27, then the mixture is blown into the blowing pipe 29, the blowing ball 31 is blown to move towards the magnetism insulation bag body 32 along with the blowing of wind, at the moment, the tension rope 30 is stretched, the magnetism insulation bag body 32 is stretched along with the entering of the blowing ball 31, the originally closed Fe-Ni alloy powder can effectively isolate the magnetic influence between the two arc magnet blocks 33, the volume of the magnetism insulation bag body 32 is enlarged after the stretching, the Fe-Ni alloy powder is diffused, the magnetism between the two arc magnet blocks 33 starts to generate repulsion action, the telescopic bag body 28 is extended upwards to drive the operation table 11 and the polycrystalline silicon wafer body 12 to deflect left and right, water drops and residual waste residues conveniently roll and enter the collection box 8, the operation of the fan 3 can generate heat along with the continuous operation of the fan, the temperature is driven to rise, the wind released by the fan blows along with the heat, and the heat absorption fluid in the U-shaped heat absorption sleeve 22 can absorb the heat carried in the wind, and along with the blowing of wind, drive elastic ball 26 and take place the motion, contact the collision many times with diaphragm 23 surface, make it take place to deform, drive endothermic fluid and take place to flow, make its contact with the thermal more abundant, the reinforcing absorption effect, the carbon dioxide gas in the thermal-insulated utricule 24 has thermal-insulated effect simultaneously, can effectually completely cut off the heat transfer downside in the U-shaped heat absorption cover 22, avoids polycrystal silicon chip body 12 to be in high temperature environment, causes the influence to it.

The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.