阅读说明：本技术 防护基板的激光加工系统及激光加工方法 (Laser processing system and laser processing method for protective substrate ) 是由 凌步军 朱鹏程 袁明峰 孙月飞 冯高俊 赵有伟 滕宇 吕金鹏 冷志斌 于 2020-06-29 设计创作，主要内容包括：本发明提供一种防护基板的激光加工系统及激光加工方法,所述防护基板的激光加工系统包括基板承载台；激光发生装置,包括激光振荡器,振镜组件以及聚光元件；平移驱动装置,与所述激光发生装置连接；控制装置,所述控制装置分别与所述激光发生装置及所述平移驱动装置连接,所述控制装置利用所述平移驱动装置驱动所述激光发生装置移动,以使激光束沿所述防护基板的边缘移动,以对防护基板的侧面进行强化。利用本发明,可以显著提高钢化玻璃材质的防护基板的生产效率,防止裂纹向防护基板的内部传播,可以提高最终形成的产品的质量。(The invention provides a laser processing system and a laser processing method of a protective substrate, wherein the laser processing system of the protective substrate comprises a substrate bearing table; the laser generating device comprises a laser oscillator, a vibrating mirror assembly and a light condensing element; the translation driving device is connected with the laser generating device; the control device is respectively connected with the laser generating device and the translation driving device, and the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and strengthen the side surface of the protective substrate. The invention can obviously improve the production efficiency of the protective substrate made of toughened glass, prevent cracks from propagating to the inside of the protective substrate and improve the quality of a finally formed product.)

1. A protective substrate laser machining system, comprising:

a substrate bearing table for bearing and fixing the protective substrate;

the laser generating device comprises a laser oscillator, a galvanometer component and a light-gathering element, wherein the light-gathering element comprises a light-gathering lens;

the translation driving device is connected with the laser generating device and comprises a linear motor structure or a rotating motor and ball screw combined structure;

the control device is respectively connected with the laser generating device and the translation driving device, and the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and strengthen the side surface of the protective substrate;

wherein the galvanometer assembly comprises a light deflection element, a deflection driving element and a supporting and fixing element; the distal end of the light deflecting element is connected to the support fixing element, the proximal end of the light deflecting element is connected to the output shaft of the deflection driving element, the support fixing element maintains alignment of the rotational axis of the light deflecting element with the rotational axis of the deflection driving element, the light deflecting element includes a mirror, and the deflection driving element includes a swing motor.

2. The laser processing system of claim 1, further comprising a flipping device for flipping the protective substrate, wherein the flipping device is connected to the control device.

3. A laser processing method of a protective substrate is characterized by comprising the following steps:

a laser processing system for providing the protective substrate of claim 1, the laser processing system comprising a substrate carrier, a laser generating device, a translation driving device, and a control device;

the method comprises the following steps of carrying and fixing a protective substrate on a substrate carrying table so that a laser beam can irradiate the edge part of the surface, far away from the substrate carrying table, of the protective substrate;

the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and strengthen the side face of the protective substrate.

4. A laser processing method of a protective substrate is characterized by comprising the following steps:

a laser processing system for providing the protective substrate of claim 1, the laser processing system comprising a substrate carrier, a laser generating device, a translation driving device and a control device;

the protection substrate is loaded and fixed on a substrate loading table, so that laser beams can irradiate the side face of the protection substrate;

the control device drives the laser generating device to move by utilizing the translation driving device, so that the laser beam moves along the edge of the protective substrate, and the side surface of the glass protective plate is strengthened.

5. The laser processing method of a protective substrate according to claim 3 or 4, wherein a pulse width of the laser beam is picoseconds or femtoseconds.

6. The laser processing method of a protective substrate according to claim 3, wherein in the step in which the control device drives the laser generating device to move by the translation driving device so as to move the laser beam along the edge of the protective substrate, the laser beam is irradiated a plurality of times while moving a focal position of the laser beam in a thickness direction of the protective substrate.

7. The laser processing method of a protective substrate according to claim 3, wherein in the step in which the control means drives the laser generating means to move by the translation drive means so as to move the laser beam along the edge of the protective substrate, the laser beam is irradiated a plurality of times while moving the laser beam at predetermined intervals in a direction parallel to the protective substrate from an initial irradiation position of the laser beam.

8. The laser processing method of a protective substrate according to claim 3, 6 or 7, further comprising:

the protective substrate subjected to side wall strengthening is turned for 180 degrees by using a turning device, so that the laser beam can irradiate the edge part of the turned protective substrate, which is far away from the surface of the substrate bearing table;

the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and to re-strengthen the side face of the protective substrate.

9. The laser processing method of a protective substrate according to claim 4, wherein in the step in which the control means drives the laser generating means to move using the translation driving means so as to move the laser beam along the edge of the protective substrate, the laser beam is irradiated a plurality of times while moving a focal position of the laser beam toward a center of the protective substrate.

10. The laser processing method of a protective substrate according to claim 3 or 4, wherein in the step of the control means driving the laser generating means to move by the translation driving means so as to move the laser beam along the edge of the protective substrate, the laser beam is repeatedly irradiated a plurality of times at an initial irradiation position of the laser beam.

Technical Field

The invention relates to the technical field of toughened glass processing, in particular to a laser processing system and a laser processing method of a protective substrate.

Background

A tempered glass protective plate applied to a portable terminal such as a touch screen and a mobile phone serves as an outer layer of a display panel to prevent scratches from being generated on the display panel such as an LCD and an OLED or to prevent it from being subjected to external impact. Such a tempered glass protection plate unit has various shapes according to the shapes of the touch screen and the portable terminal, and a glass original plate must be cut in order to have a required shape.

In the prior art, a glass unit with a desired shape is generally manufactured by cutting a glass original plate before strengthening treatment through mechanical cutting, and after a through hole for installing a key or a camera lens is processed on each glass unit, a strengthening layer is finally formed on both sides of each glass unit, so as to manufacture a tempered glass protection plate.

In order to solve the problem of low production efficiency of mechanical cutting, the toughened glass unit with the required shape can be obtained by directly cutting the toughened glass original plate by using laser beams, and because the two sides of the toughened glass unit cut from the toughened glass original plate are provided with the strengthening layers, the toughened glass unit does not need to be subjected to an additional strengthening layer forming process, so that the production efficiency can be obviously increased.

However, the cutting of the tempered glass original plate with the laser beam to obtain a tempered glass unit of a desired shape still has a problem that the side of the tempered glass unit cut from the tempered glass original plate is still in a state of not being subjected to the tempering treatment; furthermore, during the cutting process, chips are generated at the cut side of the tempered glass unit, which may be a cause of propagation of cracks to the far inside of the tempered glass unit later, and a grinding process is also required for the side wall of the tempered glass unit to remove the chips, and a manual grinding process is performed for each tempered glass unit in order to remove the chips formed at the side of the tempered glass unit, which may significantly reduce the production yield of the tempered glass unit, cause an increase in labor costs, and finally, cause an increase in unit price of the product.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a laser processing system and a laser processing method for a protective substrate, which are used to solve the technical problems that in the prior art, a laser beam is used to cut a strengthened toughened glass original plate to obtain the protective substrate, a manual grinding process is required to be performed on a side surface of the protective substrate, the production yield of the protective substrate is significantly reduced, and the production cost is high.

In order to achieve the above and other related objects, the present invention provides a laser processing system and a laser processing method for a protective substrate, the laser processing system including:

a substrate bearing table for bearing and fixing the protective substrate;

the laser generating device comprises a laser oscillator, a vibrating mirror assembly and a light condensing element;

the translation driving device is connected with the laser generating device;

the control device is respectively connected with the laser generating device and the translation driving device, and the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and strengthen the side surface of the protective substrate;

wherein the galvanometer assembly comprises a light deflection element, a deflection driving element and a supporting and fixing element; the distal end of the light deflecting element is connected to the support fixing element, the proximal end of the light deflecting element is connected to the output shaft of the deflection driving element, and the support fixing element maintains the alignment of the rotational axis of the light deflecting element and the rotational axis of the deflection driving element.

In an optional embodiment, the laser processing system for the protective substrate further includes a turning device for turning the protective substrate, and the turning device is connected to the control device.

To achieve the above and other related objects, the present invention also provides a laser processing method of a protective substrate, the method comprising:

providing the laser processing system for the protective substrate, wherein the laser processing system comprises a substrate bearing table, a laser generating device, a translation driving device and a control device;

the method comprises the following steps of carrying and fixing a protective substrate on a substrate carrying table so that a laser beam can irradiate the edge part of the surface, far away from the substrate carrying table, of the protective substrate;

the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and strengthen the side face of the protective substrate.

In an alternative embodiment, the pulse width of the laser beam is picoseconds or femtoseconds.

In an alternative embodiment, in the step of the control device driving the laser generating device to move by using the translation driving device so as to move the laser beam along the edge of the protective substrate, the laser beam is irradiated a plurality of times while moving the focal position of the laser beam along the thickness direction of the protective substrate.

In an alternative embodiment, in the step of the control means driving the laser generating means to move by the translation driving means so as to move the laser beam along the edge of the protective substrate, the laser beam is irradiated a plurality of times while moving the laser beam at predetermined intervals in a direction parallel to the protective substrate from the initial irradiation position of the laser beam.

In an optional embodiment, the laser processing method of the protective substrate further includes:

the protective substrate subjected to side wall strengthening is turned for 180 degrees by using a turning device, so that the laser beam can irradiate the edge part of the turned protective substrate, which is far away from the surface of the substrate bearing table;

the control device drives the laser generating device to move by utilizing the translation driving device so as to enable the laser beam to move along the edge of the protective substrate and to re-strengthen the side face of the protective substrate.

In an alternative embodiment, in the step of the control device driving the laser generating device to move by using the translation driving device so as to move the laser beam along the edge of the protective substrate, the laser beam is repeatedly irradiated for a plurality of times at the initial irradiation position of the laser beam.

To achieve the above and other related objects, the present invention provides a method for laser processing a protective substrate, including:

providing the laser processing system for the protective substrate, wherein the laser processing system comprises a substrate bearing table, a laser generating device, a translation driving device and a control device;

the protection substrate is loaded and fixed on a substrate loading table, so that laser beams can irradiate the side face of the protection substrate;

the control device drives the laser generating device to move by utilizing the translation driving device, so that the laser beam moves along the edge of the protective substrate, and the side surface of the glass protective plate is strengthened.

In an alternative embodiment, the pulse width of the laser beam is picoseconds or femtoseconds.

In an alternative embodiment, in the step in which the control means drives the laser generating means to move using the translation drive means so as to move the laser beam along the edge of the protective substrate, the laser beam is irradiated a plurality of times while moving the focal position of the laser beam toward the center of the protective substrate.

In an alternative embodiment, in the step of the control device driving the laser generating device to move by using the translation driving device so as to move the laser beam along the edge of the protective substrate, the laser beam is repeatedly irradiated for a plurality of times at the initial irradiation position of the laser beam.

By utilizing the laser processing system and the laser processing method of the protective substrate, the laser cutting side surface of the toughened glass unit (namely the protective substrate) does not need to be manually ground, so that the production efficiency of the protective substrate can be obviously improved, cracks are prevented from being propagated to the inside of the protective substrate, and the quality of a finally formed product (such as a touch screen or a portable terminal) can be improved;

according to the laser processing system and the laser processing method of the protective substrate, the laser beam with the short pulse width is adopted to reinforce the cutting side face of the protective substrate, the shape or the length of the moving path of the laser beam can be easily controlled, and meanwhile, the reinforcing process of the protective substrate can be effectively carried out;

by utilizing the laser processing system and the laser processing method of the protective substrate, the width of the strengthening layer on the laser cutting side surface of the protective substrate can be realized by adopting various ways;

by utilizing the laser processing system and the laser processing method of the protective substrate, the strengthening layer can be formed in the protective substrate more quickly;

in the laser processing system of the protective substrate, the supporting and fixing element is introduced into the galvanometer component, and the supporting and fixing element keeps the alignment of the rotation axis of the light deflection element and the rotation axis of the deflection driving element, so that harmful vibration along the direction vertical to the rotation axis is avoided when the light deflection element rotates around the rotation axis of the light deflection element, the random error of the laser irradiation position of the laser processing system of the protective substrate is effectively improved, and the irradiation position of a laser beam can be controlled more accurately.

Drawings

Fig. 1 is a schematic structural diagram of a laser processing system according to a first embodiment of the present invention.

Fig. 2 is a schematic structural diagram of the galvanometer assembly of the present invention.

Fig. 3 is a schematic structural diagram of the protective substrate of the present invention.

Fig. 4 is a schematic structural diagram of a laser processing system according to a second embodiment of the present invention.

Fig. 5 is a schematic flow chart illustrating a laser processing method for a protective substrate using a laser processing system for a protective substrate according to a first embodiment of the present invention.

Fig. 6 is a schematic flow chart illustrating a laser processing of a protective substrate by a laser processing system according to a second embodiment of the present invention.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.

The embodiment of the invention discloses a laser processing system and a laser processing method of a protective substrate, and by using the laser processing system and the laser processing method, a laser cutting side surface 620 of the protective substrate 600 can be strengthened, so that a manual grinding process of the laser cutting side surface 620 of the protective substrate 600 is not needed, the production efficiency of the protective substrate 600 can be obviously improved, cracks are prevented from being propagated to the interior of the protective substrate 600, and the quality of a finally formed product (such as a touch screen or a portable terminal) can be improved. In the present invention, the shield substrate 600 may be a substrate before a through hole for mounting a key or a camera lens is formed; the protective substrate 600 may also be a substrate with a strengthening layer and a touch layer attached to a glass substrate; the protective substrate 600 may also be a substrate with only a reinforcing layer attached to a glass substrate; the protective substrate 600 may also be a glass substrate that is strengthened by chemical treatment, thermal treatment, or the like without an adhesion strengthening layer or a touch layer, and for example, the protective substrate 600 may be a tempered glass unit that is cut from a tempered glass original plate by a laser cutting process. Fig. 3 shows a schematic structural diagram of a protective substrate 600 of the present invention, where the protective substrate 600 has an upper surface 610 and a lower surface 630, which are oppositely disposed, and a side surface 620.

The laser processing system of the present invention includes a substrate stage 400, a laser generator 100, a translation driver 300 and a controller 200, and there may be two different embodiments according to the position of the protective substrate 600 irradiated by the laser beam LB of the laser generator 100 (i.e. the setting position of the laser generator 100), which correspond to fig. 1 and fig. 4, respectively, where fig. 1 is a schematic structural diagram of the laser processing system of the protective substrate when the laser beam LB irradiates the edge portion of the surface (upper surface 610 or lower surface 630) of the protective substrate 600, and fig. 4 is a schematic structural diagram of the laser processing system of the protective substrate when the laser beam LB irradiates the side surface 620 of the protective substrate 600; fig. 5 is a flowchart illustrating a process of reinforcing the laser-cut side surface 620 of the protective substrate 600 using the laser processing system of the protective substrate shown in fig. 1, and fig. 6 is a flowchart illustrating a process of reinforcing the laser-cut side surface 620 of the protective substrate 600 using the laser processing system of the protective substrate shown in fig. 4.

Fig. 1 shows a schematic structural view of a first embodiment of a laser processing system of a protective substrate of the present invention. Referring to fig. 1, the substrate carrying table 400 of the glass protection-based laser processing system is used for carrying and fixing a protection substrate 600, so as to facilitate subsequent laser processing of the protection substrate 600; the laser generating device 100 comprises a laser oscillator 110, a galvanometer component 120 and a light-gathering element 130, the laser generating device 100 is used for generating a laser beam LB irradiating a protective substrate 600, the laser generating device 100 is arranged above the protective substrate 600, and the arrangement position of each element in the laser generating device 100 is satisfied that the laser beam LB emitted by the laser generating device 100 can irradiate the edge part of the surface (namely, the upper surface 610) of the protective substrate 600 far away from the substrate bearing table 400; the translation driving device 300 is connected to the laser generating device 100, and is configured to drive the laser generating device 100 to move according to a preset track under the control of the control device 200; the control device 200 is respectively connected to the laser generating device 100 and the translation driving device 300, and the control device 200 drives the laser generating device 100 to move by using the translation driving device 300, so that the laser beam LB moves along the edge of the protective substrate 600 to reinforce the side surface 620 of the protective substrate 600, which will be described in the laser processing method section below.

Referring to fig. 2, the galvanometer assembly 120 includes a light deflecting element 123, a deflection driving element 121, and a supporting and fixing element 124; the distal end of the light deflecting element 123 is connected to the supporting and fixing element 124, the proximal end of the light deflecting element 123 is connected to the output shaft 122 of the deflection driving element 121, and the supporting and fixing element 124 maintains the alignment of the rotation axis of the light deflecting element 123 and the rotation axis of the deflection driving element 121, so that the supporting and fixing element 124 can limit the generation of harmful vibration in the direction perpendicular to the rotation axis when the light deflecting element 123 rotates around the rotation axis thereof, thereby effectively improving the random error of the laser irradiation position of the laser processing system, and more accurately controlling the irradiation position of the laser beam LB. The light deflecting element 123 may be, for example, a mirror, a wave plate or a lens, such as a mirror. The deflection driving element 121 may be, for example, a swing motor, which can be driven by a driving voltage or a driving current to deflect within a certain range, so as to drive the deflection of the light deflecting element 123 connected thereto, and adjust the laser beam LB to move along the predetermined direction.

Referring to fig. 1, in this embodiment, the laser processing system of the protective substrate further includes a turning device 500 for turning over the protective substrate 600, and the turning device 500 is connected to the control device 200, that is, the turning device 500 can turn over the protective substrate 600 by 180 degrees to turn over the upper surface 610 and the lower surface 630 of the protective substrate 600. As an example, the flipping mechanism 500 may include a rotary compression cylinder or a rotary motor, for example. It is understood that in some embodiments, the laser processing system of the protective substrate may not be provided with the flipping mechanism 500.

Referring to fig. 1, in the present embodiment, the translation driving device 300 may include, for example, a first driving device for driving the laser generating device 100 to move along a first direction (x direction), and a second driving device for driving the laser generating device 100 to move along a second direction (y direction), where the first direction and the second direction are perpendicular to each other. . The translation driving device 300 may be a linear motor structure or a combination structure of a rotary motor and a ball screw.

In this embodiment and a second embodiment to be described later, the laser beam LB irradiated to the edge portion of the upper surface 610 of the shield substrate 600 is a short pulse width laser beam LB having a picosecond pulse width or a femtosecond pulse width, and the shape or the length of the moving path of the laser beam LB can be more easily controlled by reinforcing the cut side surface 620 of the shield substrate 600 with the short pulse width laser beam LB. This is because, when the protective substrate 600 is irradiated with the laser beam LB having a wide pulse width, a photothermal reaction occurs inside the protective substrate 600 irradiated with the laser beam LB, making it difficult to control the moving direction or length of the laser beam LB; when the laser beam LB has a pulse width shorter than the thermal diffusion time of the material of the protective substrate 600, the photochemical reaction of the bond rupture between molecules is a main mechanism, so that the side 620 of the protective substrate 600 can be effectively reinforced while the shape or length of the moving path of the laser beam LB is more easily controlled.

Fig. 4 is a schematic structural view showing a second embodiment of the laser processing system of the protective substrate of the present invention. This embodiment differs from the first embodiment mainly in two points, one is that the laser beam generating device 100 is disposed at a different position, the other is that the reversing device 500 is not disposed, and the other configurations are the same as those of the first embodiment, and therefore, the description thereof will not be repeated. Referring to fig. 4, in this embodiment, the laser generator 100 is disposed on one side of the protective substrate 600, and the arrangement positions of the components in the laser generator 100 are such that the laser beam LB emitted from the laser generator 100 can be irradiated onto the side surface 620 of the protective substrate 600.

Fig. 5 is a schematic flow chart illustrating a laser processing of a protective substrate 600 by a laser processing system of a protective substrate according to a first embodiment of the present invention. The laser processing method of the protective substrate 600 includes the steps of S101, providing a laser processing system of the protective substrate shown in fig. 1, where the laser processing system includes a substrate carrying table 400, a laser generating device 100, a translation driving device 300, and a control device 200; step S102, carrying and fixing the protective substrate 600 on the substrate bearing table 400 so that the laser beam LB can irradiate the edge part of the surface of the protective substrate 600 far away from the substrate bearing table 400; step S103, the control device 200 drives the laser generator 100 to move by using the translation driving device 300, so that the laser beam LB moves along the edge of the protection substrate 600, so as to reinforce the side surface 620 of the protection substrate 600.

Referring to fig. 1 and 5, in step S101, the laser processing system of the protective substrate is described in detail above, and is not repeated herein.

Referring to fig. 1 and 5, in step S102, according to the structure shown in fig. 1, a protection substrate 600 is loaded and fixed on a substrate stage 400, so that a laser beam LB can be irradiated to an edge portion of the surface of the protection substrate 600 away from the substrate stage 400.

Referring to fig. 1 and 5, in step S103, a laser beam LB is irradiated onto an edge portion of the surface of the protective substrate 600 away from the substrate stage 400, and the control device 200 drives the laser generator 100 to move by using the translation driving device 300, so that the laser beam LB moves along the edge of the protective substrate 600, thereby strengthening the side surface 620 of the protective substrate 600. The strengthening principle is as follows: the laser beam LB irradiated to the upper surface 610 of the shield substrate 600 is propagated to the inside of the shield substrate 600, and the reinforcing layer is formed around the portion irradiated with the laser beam LB by changing the physical properties (density change) of the glass material in the inside of the shield substrate 600 irradiated with the laser beam LB, so that the reinforcing layer can be formed on the cut side surface 620 of the shield substrate 600 by irradiating the laser beam LB to the adjacent edge portion of the laser cut side surface 620 of the shield substrate 600.

Referring to fig. 1 and 5, in step S103, the strengthening layer of the cut side surface 620 is formed with reference to the irradiation position of the laser beam LB, and the position of the laser beam LB for irradiating the protective substrate 600 may be, for example, as close as possible to the edge position of the upper surface 610 of the cut side surface 620 in order to prevent the edge portion of the protective substrate 600 from being damaged and to reduce the size.

In step S103, the laser beam LB may be continuously linear or may be in a plurality of points spaced apart from each other at a predetermined interval, and the irradiation pattern of the laser beam LB may be changed by adjusting the switching frequency of the laser beam LB, so that the laser beam LB is irradiated on the edge of the upper surface 610 of the shield substrate 600. Increasing the switching frequency of the laser beam LB allows the laser beam LB to irradiate the edge portion of the upper surface 610 of the shield substrate 600 in a continuous linear form (the laser beams LB in a plurality of spot forms are overlapped with each other to appear as a linear form as a whole).

In step S103, the laser beam LB is irradiated once to the edge portion of the upper surface 610 of the protective substrate 600 along the predetermined moving line, so as to form a reinforcing layer on the cut side surface 620 of the protective substrate 600, and the laser beam LB is repeatedly irradiated at the same position as the initial irradiation position (i.e., the predetermined moving line) of the laser beam LB, so as to form a reinforcing layer on the cut side surface 620 of the protective substrate 600; that is, the irradiation frequency of the laser beam LB irradiated to the upper surface 610 of the protective substrate 600 may be adjusted as necessary to form a desired reinforcing layer on the cut side surface 620 of the protective substrate 600.

In step S103, the width of the reinforcing layer formed inside the glass antiskid plate may be adjusted, and as described above, the reinforcing layer having a relatively thin width may be formed inside the protective substrate 600 by repeatedly irradiating the laser beam LB one or more times at the same position as the initial irradiation position of the laser beam LB, and in order to obtain the reinforcing layer having a relatively thick width, the laser beam LB may be irradiated a plurality of times (at least twice) while moving the laser beam LB in a horizontal direction (a direction parallel to the protective substrate 600) at a predetermined movement interval from the initial irradiation position of the laser beam LB, so that the reinforcing layer having a relatively thick width may be formed inside the protective substrate 600.

In step S103, the focal position of the laser beam LB may be fixed or may be varied. When the focal position of the laser beam LB is fixed, the laser beam LB may be moved along the edge portion of the shield substrate 600, and the focal position of the laser beam LB may be on the upper surface 610 of the shield substrate 600 or inside the shield substrate 600. While the focal position of the laser beam LB is moved in the thickness direction of the shield substrate 600, the laser beam LB is irradiated a plurality of times along the edge portion of the shield substrate 600, so that the formation speed of the reinforcing layer can be increased.

After step S103 is performed, the laser system of the protective substrate 600 may further include turning the protective substrate 600, which has undergone sidewall reinforcement, 180 ° by using a turning device 500, so as to turn the upper surface 610 and the lower surface 630 of the protective substrate 600, so that the laser beam LB may be irradiated to an edge portion of the turned protective substrate 600, which is far away from the surface of the substrate carrier 400 (i.e., the lower surface 630); then, a strengthening process similar to step S103 is performed on the lower surface 630 of the protective substrate 600, that is, the control device 200 drives the laser generating device 100 to move by using the translation driving device 300, so that the laser beam LB moves along the edge of the protective substrate 600, so as to re-strengthen the side surface 620 of the protective substrate 600.

Fig. 6 is a schematic flow chart illustrating a laser processing of a protective substrate 600 by a laser processing system of a protective substrate according to a second embodiment of the present invention. The laser processing method of the protective substrate 600 includes the steps of providing a laser processing system of the protective substrate shown in fig. 4 in step S201, where the laser processing system includes a substrate carrying table 400, a laser generating device 100, a translation driving device 300, and a control device 200; step S202, carrying and fixing the protective substrate 600 on the substrate carrying table 400, so that the laser beam LB can irradiate the side 620 of the protective substrate 600 far away from the substrate carrying table 400; in step S203, the control device 200 drives the laser generator 100 to move by using the translation driving device 300, so that the laser beam LB moves along the edge of the protection substrate 600, so as to reinforce the side surface 620 of the protection substrate 600.

Referring to fig. 4 and 6, in step S201, the laser processing system of the protective substrate is described in detail above, and is not repeated herein.

Referring to fig. 4 and 6, in step S202, the protective substrate 600 is mounted on the substrate stage 400 according to the structure shown in fig. 4, so that the laser beam LB can irradiate the side 620 of the protective substrate 600.

Referring to fig. 4 and 6, in step S203, a laser beam LB is irradiated onto an edge portion of the surface of the protective substrate 600 away from the substrate stage 400, and the control device 200 drives the laser generating device 100 to move by using the translation driving device 300, so that the laser beam LB moves along the edge of the protective substrate 600, thereby strengthening the side surface 620 of the protective substrate 600. The strengthening principle is as follows: the laser beam LB irradiated to the upper surface 610 of the shield substrate 600 is propagated to the inside of the shield substrate 600, and the reinforcing layer is formed around the portion irradiated with the laser beam LB by changing the physical properties (density change) of the glass material in the inside of the shield substrate 600 irradiated with the laser beam LB, so that the reinforcing layer can be formed on the cut side surface 620 of the shield substrate 600 by irradiating the laser beam LB to the adjacent edge portion of the laser cut side surface 620 of the shield substrate 600.

In step S203, the irradiation pattern of the laser beam LB may be changed by adjusting the switching frequency of the laser beam LB, and the laser beam LB irradiated to the side surface 620 of the shield substrate 600 may be in a continuous linear form or in a form of a plurality of points spaced apart at a constant interval. Increasing the switching frequency of the laser beam LB allows the laser beam LB to irradiate the edge portion of the upper surface 610 of the shield substrate 600 in a continuous linear form (the laser beams LB in a plurality of spot forms are overlapped with each other to appear as a linear form as a whole).

In step S203, the laser beam LB is irradiated to the side surface 620 of the protective substrate 600 once along the predetermined moving line, so that the reinforcing layer can be formed on the cut side surface 620 of the protective substrate 600, and the laser beam LB is repeatedly irradiated at the same position as the initial irradiation position (i.e., the predetermined moving line) of the laser beam LB, so that the reinforcing layer can be formed on the cut side surface 620 of the protective substrate 600; that is, the irradiation frequency of the laser beam LB irradiated to the side surface 620 of the shield substrate 600 may be adjusted as necessary to form a desired reinforcing layer on the cut side surface 620 of the shield substrate 600.

In step S203, the width of the reinforcing layer formed inside the glass antiskid plate may be adjusted, and as described above, the reinforcing layer having a relatively thin width may be formed inside the protective substrate 600 by repeatedly irradiating the laser beam LB one or more times at the same position as the initial irradiation position of the laser beam LB, and in order to obtain the reinforcing layer having a relatively thick width, the laser beam LB may be irradiated a plurality of times (at least two times) while moving the focal position of the laser beam LB toward the center of the protective substrate 600, that is, distances from the focal positions of the laser beam LB on the front and rear sides to the center of the protective substrate 600 are different, so that the reinforcing layer having a relatively thick width may be formed inside the protective substrate 600.

In summary, by using the laser processing system and the laser processing method of the protective substrate of the present invention, a manual grinding process is not required for the laser-cut side surface of the protective substrate, so that the production efficiency of the protective substrate can be significantly improved, cracks can be prevented from propagating into the protective substrate, and the quality of a finally formed product (e.g., a touch screen or a portable terminal) can be improved; according to the laser processing system and the laser processing method of the protective substrate, the laser beam with the short pulse width is adopted to reinforce the cutting side face of the protective substrate, the shape or the length of the moving path of the laser beam can be easily controlled, and meanwhile, the reinforcing process of the protective substrate can be effectively carried out; by utilizing the laser processing system and the laser processing method of the protective substrate, the width of the strengthening layer on the laser cutting side surface of the protective substrate can be realized by adopting various ways; by utilizing the laser processing system and the laser processing method of the protective substrate, the strengthening layer can be formed in the protective substrate more quickly; in the laser processing system of the protective substrate, the supporting and fixing element is introduced into the galvanometer component, and the supporting and fixing element keeps the alignment of the rotation axis of the light deflection element and the rotation axis of the deflection driving element, so that harmful vibration along the direction vertical to the rotation axis is avoided when the light deflection element rotates around the rotation axis of the light deflection element, the random error of the laser irradiation position of the laser processing system of the protective substrate is effectively improved, and the irradiation position of a laser beam can be controlled more accurately.

In the description herein, numerous specific details are provided, such as examples of components and/or methods, to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of embodiments of the invention.

Reference throughout this specification to "one embodiment", "an embodiment", or "a specific embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment, and not necessarily all embodiments, of the present invention. Thus, respective appearances of the phrases "in one embodiment", "in an embodiment", or "in a specific embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined in any suitable manner with one or more other embodiments. It is to be understood that other variations and modifications of the embodiments of the invention described and illustrated herein are possible in light of the teachings herein and are to be considered as part of the spirit and scope of the present invention.

It will also be appreciated that one or more of the elements shown in the figures can also be implemented in a more separated or integrated manner, or even removed for inoperability in some circumstances or provided for usefulness in accordance with a particular application.

Additionally, any reference arrows in the drawings/figures should be considered only as exemplary, and not limiting, unless otherwise expressly specified. Further, as used herein, the term "or" is generally intended to mean "and/or" unless otherwise indicated. Combinations of components or steps will also be considered as being noted where terminology is foreseen as rendering the ability to separate or combine is unclear.

As used in the description herein and throughout the claims that follow, "a", "an", and "the" include plural references unless otherwise indicated. Also, as used in the description herein and throughout the claims that follow, unless otherwise indicated, the meaning of "in …" includes "in …" and "on … (on)".

The above description of illustrated embodiments of the invention, including what is described in the abstract of the specification, is not intended to be exhaustive or to limit the invention to the precise forms disclosed herein. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention, as those skilled in the relevant art will recognize and appreciate. As indicated, these modifications may be made to the present invention in light of the foregoing description of illustrated embodiments of the present invention and are to be included within the spirit and scope of the present invention.

The systems and methods have been described herein in general terms as the details aid in understanding the invention. Furthermore, various specific details have been given to provide a general understanding of the embodiments of the invention. One skilled in the relevant art will recognize, however, that an embodiment of the invention can be practiced without one or more of the specific details, or with other apparatus, systems, assemblies, methods, components, materials, parts, and/or the like. In other instances, well-known structures, materials, and/or operations are not specifically shown or described in detail to avoid obscuring aspects of embodiments of the invention.

Thus, although the present invention has been described herein with reference to particular embodiments thereof, a latitude of modification, various changes and substitutions are intended in the foregoing disclosures, and it will be appreciated that in some instances some features of the invention will be employed without a corresponding use of other features without departing from the scope and spirit of the invention as set forth. Thus, many modifications may be made to adapt a particular situation or material to the essential scope and spirit of the present invention. It is intended that the invention not be limited to the particular terms used in following claims and/or to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include any and all embodiments and equivalents falling within the scope of the appended claims. Accordingly, the scope of the invention is to be determined solely by the appended claims.