阅读说明：本技术 加工装置 (Processing device ) 是由 中村胜 于 2021-03-29 设计创作，主要内容包括：本发明提供加工装置,能够在加工装置的附近容易地使用电子设备。加工装置包含：卡盘工作台,其对被加工物进行保持；加工单元,其对保持在卡盘工作台上的被加工物实施加工；以及板,其将包含卡盘工作台和加工单元在内的构成要素包围。在板上配设有电源插座(30),从而能够使用包含检查装置、个人计算机、电风扇、吸尘器在内的电子设备。(The invention provides a processing device, which can easily use electronic equipment near the processing device. The processing device comprises: a chuck table for holding a workpiece; a processing unit which processes the workpiece held on the chuck table; and a plate surrounding the components including the chuck table and the processing unit. A power socket (30) is provided on the board, so that electronic equipment including an inspection device, a personal computer, an electric fan, and a vacuum cleaner can be used.)

1. A processing apparatus, wherein,

the processing device is provided with:

a chuck table for holding a workpiece;

a machining unit for machining the workpiece held on the chuck table;

a plate surrounding components including the chuck table and the machining unit; and

a power socket disposed on the board,

an electronic device including an inspection device, a personal computer, an electric fan, and a vacuum cleaner can be connected to the power outlet for use.

2. The processing device according to claim 1,

the power sockets are arranged at the front, the side and the rear of the plate.

3. The processing device according to claim 1,

the voltage of the power socket is any of 100V, 200V, and 240V.

Technical Field

The present invention relates to a processing apparatus, including: a chuck table for holding a workpiece; a processing unit which processes the workpiece held on the chuck table; and a plate surrounding the components including the chuck table and the processing unit.

Background

A wafer is divided into a plurality of devices such as ICs and LSIs on its front surface by a plurality of intersecting planned dividing lines, the back surface of the wafer is ground by a grinding device to a desired thickness, and then divided into individual device chips by a dicing device or a laser processing device, and the divided device chips are used for electronic devices such as mobile phones and personal computers (see, for example, patent documents 1 and 2).

Patent document 1: japanese patent laid-open publication No. 2018-83252

Patent document 2: japanese patent laid-open publication No. 2018-192546

However, when an oscilloscope is used to detect the vibration of a machining device including a grinding device, a cutting device, and a laser machining device, for example, the following problems occur: it is necessary to insert a plug of an extension cord into a power outlet provided in a factory and to wire it to a processing device, which is troublesome.

Disclosure of Invention

Therefore, an object of the present invention is to provide a processing apparatus capable of easily using an electronic device in the vicinity of the processing apparatus.

According to the present invention, there is provided a processing apparatus comprising: a chuck table for holding a workpiece; a machining unit for machining the workpiece held on the chuck table; a plate surrounding components including the chuck table and the machining unit; and a power socket disposed on the board, to which an electronic device including an inspection device, a personal computer, an electric fan, and a vacuum cleaner can be connected for use.

Preferably, the power supply sockets are disposed in front, side, and rear of the board. Preferably, the voltage of the power outlet is any of 100V, 200V, and 240V.

According to the present invention, since the power supply socket is provided on the board, and the electronic equipment including the inspection device, the personal computer, the electric fan, and the vacuum cleaner can be used, the electronic equipment can be easily used in the vicinity of the processing device.

Drawings

Fig. 1 is a perspective view of a processing apparatus according to an embodiment of the present invention.

Fig. 2 is a block diagram of the processing apparatus shown in fig. 1.

Description of the reference symbols

2: a processing device; 4: a holding unit; 6: a processing unit; 8: a plate; 30: a power socket; 30 a: a front socket; 30 b: a lateral socket; 30 c: a rear socket; 30 d: and an upper socket.

Detailed Description

Hereinafter, a machining apparatus according to an embodiment of the present invention will be described with reference to the drawings.

Referring to fig. 1, a machining apparatus, generally designated by reference numeral 2, includes: a holding unit 4 for holding a workpiece; a processing unit 6 that processes the workpiece held by the holding unit 4; and a plate 8 surrounding the components including the holding unit 4 and the processing unit 6.

The holding unit 4 includes a circular chuck table 10 disposed to be movable in an X-axis direction indicated by an arrow X in fig. 1. The chuck table 10 is rotated by a motor (not shown) and moved in the X-axis direction by an X-axis feeding unit (not shown). In addition, the Y-axis direction indicated by the arrow Y in fig. 1 is a direction perpendicular to the X-axis direction, and the Z-axis direction indicated by the arrow Z in fig. 1 is a vertical direction perpendicular to the X-axis direction and the Y-axis direction. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

The upper end portion of the chuck table 10 is formed of a porous member connected to a suction unit (not shown). The holding unit 4 generates a suction force on the upper surface of the chuck table 10 by the suction unit, and suctions and holds the workpiece such as the wafer W placed on the upper surface of the chuck table 10. The wafer W shown in fig. 1 is attached to an adhesive tape T having a peripheral edge fixed to the ring frame F.

The processing unit 6 includes: a cutting blade 12 disposed so as to be rotatable about an axis in a Y-axis direction; and a motor (not shown) that rotates the cutting tool 12. The machining unit 6 performs cutting on the workpiece held on the chuck table 10 by the cutting tool 12 rotated by the motor. As described above, the machining unit 6 of the present embodiment is a cutting unit that performs cutting on the workpiece held by the holding unit 4. The processing means 6 may be laser processing means for performing laser processing on the workpiece held by the holding means 4, grinding means for performing grinding processing on the workpiece held by the holding means 4, or the like.

As shown in fig. 1, the processing apparatus 2 further includes: a cassette mounting table 16 which is vertically movable and on which a cassette 14 accommodating a plurality of wafers W is mounted, the wafers W being supported by the ring frame F via an adhesive tape T; a lifting unit (not shown) for lifting the cassette loading table 16; a carry-in and carry-out mechanism 20 that pulls out the pre-cut wafer W from the cassette 14, carries it out onto the temporary stage 18, and carries the cut wafer W positioned on the temporary stage 18 into the cassette 14; a first transfer mechanism 22 that transfers the pre-cut wafer W, which is carried out of the cassette 14 onto the temporary stage 18, onto the chuck stage 10; an imaging unit 24 that images the wafer W held on the chuck table 10; a cleaning unit 26 for cleaning the cut wafer W; and a second transfer mechanism 28 that transfers the cut wafer W from the chuck table 10 to the cleaning unit 26.

The plate 8 surrounds the components of the processing apparatus 2. For convenience, the plate 8 shown in fig. 1 is not shown so as to surround the upper part of a part of the components of the processing apparatus 2, but the plate 8 may surround the upper part of all the components of the processing apparatus 2.

A power outlet (power outlet) 30 is disposed on the board 8, and electronic equipment including an inspection device, a personal computer, an electric fan, and a vacuum cleaner can be used. Power outlet 30 of the present embodiment includes: a front receptacle 30a disposed in front of the board 8 (on the near side in the Y-axis direction in fig. 1); a side socket 30b disposed on a side of the board 8 (on the front side in the X-axis direction in fig. 1); a rear socket 30c disposed behind the board 8 (on the rear side in the Y-axis direction in fig. 1); and an upper outlet 30d disposed above plate 8, and the arrangement and number of power outlets 30 can be set arbitrarily. The voltage of power outlet 30 is preferably any of 100V, 200V, and 240V of single-phase ac. In addition, power receptacle 30 is shown exaggerated in fig. 1.

Referring to fig. 2, the processing apparatus 2 includes a distribution board 34 connected to an external power supply 32 and a transformer 36 connected to the distribution board 34. The external power supply 32 may be, for example, a three-phase ac power supply having a voltage of 200V. The transformer 36 converts the voltage of the power supplied to the distribution board 34 into any of 100V, 200V, and 240V of single-phase alternating current, for example. As shown in fig. 2, power receptacle 30 is connected to transformer 36, and the components of processing apparatus 2 such as holding unit 4 and processing unit 6 are connected thereto. The components of the processing apparatus 2 such as the holding unit 4 and the processing unit 6 may be connected to the distribution board 34 without the transformer 36.

When the wafer W is cut by the processing apparatus 2, first, the wafer W is carried out from the cassette 14 onto the temporary stage 18 by the carry-in/carry-out mechanism 20. Next, the wafer W positioned on the temporary placement table 18 is transferred to the chuck table 10 by the first transfer mechanism 22, and the wafer W is sucked and held on the upper surface of the chuck table 10. Next, the wafer W is imaged from above by the imaging unit 24, the orientation of the wafer W is adjusted based on the image of the wafer W imaged by the imaging unit 24, and the region where the wafer W is cut is aligned with the cutting tool 12. Next, the wafer W is cut by cutting the edge of the cutting tool 12 rotating at a high speed, and the wafer W is cut by feeding the chuck table 10 in the X-axis direction by the X-axis feed mechanism.

In the case where an oscilloscope (not shown) is used, for example, to detect vibration of processing device 2, the oscilloscope can be used in the vicinity of processing device 2 by inserting a power plug of the oscilloscope into any of front outlet 30a, side outlet 30b, rear outlet 30c, and upper outlet 30 d.

As described above, according to the processing apparatus 2 of the present embodiment, since the electronic device can be used in the vicinity of the processing apparatus 2 by inserting the power plug of the electronic device including the inspection device, the personal computer, the electric fan, and the vacuum cleaner into the power outlet 30 of the processing apparatus 2, it is not necessary to insert the plug of the extension cord into the power outlet provided in the factory and to wire the extension cord to the processing apparatus 2.