阅读说明：本技术 图像传感器封装 (Image sensor package ) 是由 俞度在 金丙宪 南宫容吉 洪宗彻 梁时重 于 2020-01-16 设计创作，主要内容包括：图像传感器封装,包括：衬底；图像传感器,安装在衬底上；接合线,将图像传感器连接到衬底；反射器,设置在图像传感器上；密封构件,密封图像传感器的一部分和接合线,并覆盖反射器的至少一部分,密封构件包括暴露图像传感器的有效成像面的孔；以及滤光片,附接到密封构件。(An image sensor package comprising: a substrate; an image sensor mounted on the substrate; a bonding wire connecting the image sensor to the substrate; a reflector disposed on the image sensor; a sealing member that seals a portion of the image sensor and the bonding wire and covers at least a portion of the reflector, the sealing member including a hole that exposes an effective imaging surface of the image sensor; and an optical filter attached to the sealing member.)

1. An image sensor package, comprising:

a substrate;

an image sensor mounted on the substrate;

a bonding wire connecting the image sensor to the substrate;

a reflector disposed on the image sensor;

a sealing member that seals a portion of the image sensor and the bonding wire and covers at least a portion of the reflector, the sealing member including a hole that exposes an effective imaging surface of the image sensor; and

an optical filter attached to the sealing member.

2. The image sensor package of claim 1, wherein the reflector is disposed outside of the active imaging plane.

3. The image sensor package of claim 1, wherein a portion of the reflector is covered by the sealing member and a remaining portion of the reflector is exposed by the aperture of the sealing member.

4. The image sensor package of claim 1, wherein the sealing member comprises an upper surface and an inside surface forming the aperture, and

the inner side surface is rougher than the upper surface.

5. The image sensor package of claim 1, wherein the sealing member comprises an inside surface forming the aperture, and

the inner side surface includes a step portion.

6. The image sensor package according to claim 5, wherein the step portion is such that a size of a portion of the hole adjacent to the image sensor is larger than a size of a portion of the hole adjacent to the optical filter when the hole is viewed in a direction perpendicular to an upper surface of the image sensor.

7. The image sensor package of claim 5, wherein the inside surface of the sealing member includes a first surface extending from an upper surface of the sealing member toward the stepped portion and a second surface extending from the stepped portion toward the reflector, and

the first surface protrudes more toward a center of the hole than the second surface.

8. The image sensor package of claim 1, wherein the sealing member comprises an inside surface forming the aperture, and

a portion of the inside surface adjacent to the reflector has a concave shape.

9. An image sensor package, comprising:

a substrate;

an electronic component mounted on the substrate;

an image sensor mounted on the substrate;

a bonding wire connecting the image sensor to the substrate;

a reflector disposed on the substrate;

a sealing member sealing the electronic component and covering at least a portion of the reflector, the sealing member including a hole exposing the image sensor; and

an optical filter attached to the sealing member.

10. The image sensor package of claim 9, wherein the sealing member comprises an upper surface and an inside surface forming the aperture, and

the inner side surface is rougher than the upper surface.

11. The image sensor package of claim 9, wherein the sealing member includes an inside surface that forms the aperture, and

the inner side surface includes a step portion.

12. The image sensor package of claim 9, wherein the sealing member includes an inside surface that forms the aperture, and

a portion of the inside surface adjacent to the reflector has a concave shape.

13. The image sensor package of claim 9, wherein the hole further exposes the bond wire.

14. An image sensor package, comprising:

a substrate;

an electronic component mounted on the substrate;

an image sensor mounted on the substrate;

a bonding wire connecting the image sensor to the substrate;

a reflector disposed on the image sensor or the substrate;

a sealing member that seals the electronic component and covers only a portion of the reflector, the sealing member including an aperture that exposes an effective imaging surface of the image sensor and a portion of the reflector that is not covered by the sealing member; and

an optical filter attached to the sealing member and covering the aperture in the sealing member.

15. The image sensor package of claim 14, wherein the image sensor includes a bond pad, the bond wire connected to the bond pad,

the reflector is disposed on the image sensor between the bond pad and the active imaging surface, an

The sealing member also seals a portion of the image sensor, the bonding pad, and the bonding wire.

16. The image sensor package of claim 15, wherein the sealing member comprises an inside surface forming the aperture, and

the inner side surface includes a step portion that makes a size of a portion of the hole adjacent to the image sensor larger than a size of a portion of the hole adjacent to the optical filter when the hole is viewed in a direction perpendicular to an upper surface of the image sensor.

17. The image sensor package of claim 15, wherein the electronic component is disposed between the bond wire and an outer edge of the substrate.

18. The image sensor package of claim 14, wherein the reflector is disposed on the substrate between the electronic component and the bond wire, and

the hole also exposes the bond wire.

19. The image sensor package of claim 18, wherein the sealing member comprises an inside surface forming the aperture, and

the inner side surface includes a step portion that makes a size of a portion of the hole adjacent to the image sensor larger than a size of a portion of the hole adjacent to the optical filter when the hole is viewed in a direction perpendicular to an upper surface of the image sensor.

20. The image sensor package of claim 18, wherein the electronic component is disposed between the reflector and an outer edge of the substrate.

Technical Field

The application relates to an image sensor package.

Background

In general, a camera module is included in various information technology devices such as portable electronic devices. Due to the recent trend toward miniaturization of portable electronic devices, miniaturization of the camera module itself is also required.

An infrared cut filter is disposed in the camera module to block light in the infrared region.

In general, the infrared ray cut filter is attached to the case using an additional device, or a structure capable of attaching the infrared ray cut filter to the case is formed.

However, the apparatus or structure for attaching the infrared cut filter limits the amount by which the overall height of the camera module can be reduced.

Recently, the thickness of portable electronic devices such as smartphones has been decreasing. However, if the height of the camera module included in the smartphone cannot be reduced, it is difficult to reduce the thickness of the smartphone.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, an image sensor package includes: a substrate; an image sensor mounted on the substrate; a bonding wire connecting the image sensor to the substrate; a reflector disposed on the image sensor; a sealing member that seals a portion of the image sensor and the bonding wire and covers at least a portion of the reflector, the sealing member including a hole that exposes an effective imaging surface of the image sensor; and an optical filter attached to the sealing member.

The reflector may be disposed outside the effective imaging plane.

A portion of the reflector may be covered by the sealing member, and the remaining portion of the reflector may be exposed by the hole of the sealing member.

The sealing member may include an upper surface and an inside surface forming the hole, and the inside surface may be rougher than the upper surface.

The sealing member may include an inner side surface forming the hole, and the inner side surface may include a stepped portion.

The step portion may be such that a size of a portion of the hole adjacent to the image sensor is larger than a size of a portion of the hole adjacent to the optical filter when the hole is viewed in a direction perpendicular to an upper surface of the image sensor.

The inner side surface of the sealing member may include a first surface extending from the upper surface of the sealing member toward the step portion and a second surface extending from the step portion toward the reflector, and the first surface may protrude more toward the center of the hole than the second surface.

The sealing member may include an inner side surface forming the hole, and a portion of the inner side surface adjacent to the reflector may have a concave shape.

In another general aspect, an image sensor package includes: a substrate; an electronic component mounted on the substrate; an image sensor mounted on the substrate; a bonding wire connecting the image sensor to the substrate; a reflector disposed on the substrate; a sealing member sealing the electronic component and covering at least a portion of the reflector, the sealing member including a hole exposing the image sensor; and an optical filter attached to the sealing member.

The sealing member may include an upper surface and an inside surface forming the hole, and the inside surface may be rougher than the upper surface.

The sealing member may include an inner side surface forming the hole, and the inner side surface may include a stepped portion.

The sealing member may include an inner side surface forming the hole, and a portion of the inner side surface adjacent to the reflector may have a concave shape.

The holes may also expose bond wires.

In another general aspect, an image sensor package includes: a substrate; an electronic component mounted on the substrate; an image sensor mounted on the substrate; a bonding wire connecting the image sensor to the substrate; a reflector disposed on the image sensor or the substrate; a sealing member sealing the electronic component and covering only a portion of the reflector, the sealing member including an aperture exposing an effective imaging surface of the image sensor and a portion of the reflector not covered by the sealing member; and an optical filter attached to the sealing member and covering the hole in the sealing member.

The image sensor may include a bond pad to which the bond wire is connected, the reflector may be disposed on the image sensor between the bond pad and the active imaging surface, and the sealing member may further seal a portion of the image sensor, the bond pad, and the bond wire.

The sealing member may include an inner side surface in which the hole is formed, and the inner side surface may include a stepped portion such that a size of a portion of the hole adjacent to the image sensor is larger than a size of a portion of the hole adjacent to the optical filter when the hole is viewed in a direction perpendicular to an upper surface of the image sensor.

The electronic component may be disposed between the bond wire and an outer edge of the substrate.

A reflector may be disposed on the substrate between the electronic component and the bond wires, and the holes may also expose the bond wires.

The sealing member may include an inner side surface in which the hole is formed, and the inner side surface may include a stepped portion such that a size of a portion of the hole adjacent to the image sensor is larger than a size of a portion of the hole adjacent to the optical filter when the hole is viewed in a direction perpendicular to an upper surface of the image sensor.

The electronic component may be disposed between the reflector and an outer edge of the substrate.

Other features and aspects will become apparent from the following detailed description, the accompanying drawings, and the appended claims.

Drawings

Fig. 1 is a schematic cross-sectional view of an example of a camera module.

Fig. 2 is a schematic cross-sectional view of an example of an image sensor package.

Fig. 3 to 9 are schematic cross-sectional views illustrating an example of a method of manufacturing an image sensor package.

Fig. 10 is a schematic cross-sectional view showing an example of a process of removing the protective member during a process of manufacturing the image sensor package.

Fig. 11 is a schematic cross-sectional view showing an example in which the protective member has been removed from the image sensor package.

Fig. 12 is a schematic cross-sectional view of another example of an image sensor package.

Like reference numerals refer to like elements throughout the drawings and detailed description. The figures may not be drawn to scale and the relative sizes, proportions and depictions of the elements in the figures may be exaggerated for clarity, illustration and convenience.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, apparatuses, and/or systems described herein. Various changes, modifications, and equivalents of the methods, devices, and/or systems described in this application will, however, become apparent after understanding the disclosure of this application. For example, the order of operations described in this application is merely an example, and is not limited to the order set forth in this application, except as operations that must occur in a particular order, but rather obvious variations may be made upon understanding the disclosure of this application. In addition, descriptions of features well known in the art may be omitted for the sake of clarity and conciseness.

The features described in this application may be embodied in different forms and should not be construed as limited to the examples described in this application. Rather, the examples described herein are provided merely to illustrate some of the many possible ways to implement the methods, apparatuses, and/or systems described herein, which will be apparent after understanding the disclosure of the present application.

Throughout the specification, when an element such as a layer, region or substrate is described as being "on," "connected to" or "coupled to" another element, it can be directly on, "connected to" or "coupled to" the other element or one or more other elements may be present between the element and the other element. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element, there may be no other elements intervening between the element and the other element.

As used in this application, the term "and/or" includes any one of the associated listed items as well as any combination of any two or more items.

Although terms such as "first", "second", and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections are not limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, first component, first region, first layer, or first portion referred to in these examples may also be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the examples described in this application.

Spatially relative terms such as "above … …", "above", "below … …" and "below" may be used herein for descriptive convenience to describe one element's relationship to another element as illustrated in the figures. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to other elements would then be oriented "below" or "lower" relative to the other elements. Thus, the term "above … …" encompasses both an orientation of "above. The device may also be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used in this application should be interpreted accordingly.

The terminology used in the present application is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The articles "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, integers, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and/or groups thereof.

Fig. 1 is a schematic cross-sectional view of an example of a camera module.

Referring to fig. 1, the camera module includes a lens part 100, a case 200, and an image sensor package 300.

The lens portion 100 includes a plurality of lenses (not shown) for imaging an object.

The housing 200 accommodates the lens section 100, and may include an actuator (not shown) for moving the lens section 100 in a direction of an optical axis of the lens section 100 and/or a direction perpendicular to the optical axis of the lens section 100.

The image sensor package 300 may be combined with the lower portion of the housing 200.

The image sensor package 300 is a device that converts light incident through the lens part 100 into an electrical signal.

Fig. 2 is a schematic cross-sectional view of an example of an image sensor package.

Referring to fig. 2, the image sensor package 300 includes a substrate 310, an image sensor 320, a sealing member 330, and an optical filter 340.

The substrate 310 may be a printed circuit board.

The image sensor 320 converts light incident on the image sensor 320 through the lens part 100 into an electrical signal. As an example, the image sensor 320 may be a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS) device.

The electrical signal converted by the image sensor 320 may be output as an image through a display unit of the portable electronic device.

The image sensor 320 is fixed to the substrate 310 and electrically connected to the substrate 310 by a bonding wire W. Electronic components 311 are mounted on substrate 310.

The image sensor 320 has an effective imaging plane P that receives light to form an image, and the bonding pads 321 and the reflectors 350 are disposed on the image sensor 320 outside the effective imaging plane P. The bonding wire W is bonded to the bonding pad 321 to electrically connect the image sensor 320 to the substrate 310.

The reflector 350 is disposed between the bonding pad 321 and the effective imaging plane P, and at least a portion of the reflector 350 is covered by the sealing member 330, which will be described later.

The sealing member 330 is configured to cover the bonding wires W that electrically connect the image sensor 320 to the substrate 310.

The sealing member 330 covers and seals a part of the image sensor 320, and covers and seals the bonding wire W and the electronic component 311.

The bonding pad 321 to which the bonding wire W is bonded is disposed outside the effective imaging plane P of the image sensor 320, and the sealing member 330 covers and seals the bonding wire W and the bonding pad 321.

Thus, the bonding wire W is protected by the sealing member 330. Therefore, when external impact is applied to the bonding wire W, the problem that the bonding wire W is cut or broken can be prevented.

In addition, the sealing member 330 prevents debris from the bonding wire W from penetrating into the effective imaging plane P of the image sensor 320.

The sealing member 330 may have a color capable of absorbing light. The sealing member 330 may include a color having a low reflectivity, for example, black.

Therefore, the external light in the camera module can be prevented from being incident on the effective imaging plane P of the image sensor 320.

When extraneous light, which is not necessary for forming an image, is incident on the effective imaging plane P, a flare phenomenon and other undesirable effects may occur. However, the sealing member 330 disposed around the effective imaging plane P of the image sensor 320 prevents external light from being incident on the effective imaging plane P.

The sealing member 330 is made of an epoxy resin material and is formed using an injection molding process.

A hole H exposing the effective imaging plane P of the image sensor 320 is formed in the sealing member 330.

The filter 340 is an infrared ray cut filter that blocks light in an infrared region among light incident through the lens part 100. The filter 340 is attached to the sealing member 330. As an example, the optical filter 340 is attached to the upper surface of the sealing member 330 such that the optical filter 340 is spaced apart from the image sensor 320 by a predetermined interval.

In the related art, the filter 340 is attached to the case 200 using an additional device, or a structure capable of attaching the filter 340 to the case 200 is formed. However, the apparatus or structure for attaching the filter 340 limits the amount by which the overall height of the camera module can be reduced.

Recently, the thickness of portable electronic devices such as smartphones has been decreasing. However, if the height of the camera module included in the smartphone cannot be reduced, it is difficult to reduce the thickness of the smartphone.

However, since the optical filter 340 is attached to the sealing member 330 in the example of the image sensor package 300 shown in fig. 2, an additional apparatus or structure for attaching the optical filter 340 is not required. Accordingly, the height of the image sensor package 300 may be reduced, and thus the height of a camera module including the image sensor package 300 may be reduced.

Fig. 3 to 9 are schematic cross-sectional views illustrating an example of a method of manufacturing an image sensor.

Referring to fig. 3, an electronic component 311 and an image sensor 320 having a bonding pad 321 are mounted on a substrate 310.

Referring to fig. 4, a reflector 350 is formed on the image sensor 320 outside the effective imaging plane P of the image sensor 320. The reflector 350 may be formed such that the reflector 350 surrounds the outer circumference of the effective imaging plane P.

Referring to fig. 5, the image sensor 320 is connected to the substrate 310 with a bonding wire W. One end of the bonding wire W is connected to the bonding pad 321 of the image sensor 320, and the other end of the bonding wire W is connected to the substrate 310.

Fig. 4 and 5 show that the reflector 350 is first formed on the image sensor 320, and then the image sensor 320 is connected to the substrate 310 with the bonding wire W. Alternatively, the image sensor 320 may be first connected to the substrate 310 with the bonding wire W, and then the reflector 350 may be formed on the image sensor 320.

Referring to fig. 6, a protective member 400 is attached to an upper surface of the image sensor 320. The size of the protective member 400 is larger than the size of the effective imaging plane P of the image sensor 320. Thus, the protective member 400 covers the effective imaging plane P of the image sensor 320.

The protective member 400 has a size large enough to cover a portion of the reflector 350 formed on the image sensor 320 outside the effective imaging plane P, but small enough so that the protective member 400 does not cover any portion of the bonding pads 321 disposed on the image sensor 320 outside the reflector 350.

The protective member 400 may be made of a flexible adhesive material to protect the effective imaging plane P of the image sensor 320 in the injection molding process.

Referring to fig. 7, the sealing member 330 is formed through an injection molding process.

The protective member 400 serves as a barrier to protect the effective imaging plane P of the image sensor 320 from being damaged by the injection molding process while preventing the resin material for forming the sealing member 330 from flowing toward the effective imaging plane P.

The upper surface of the sealing member 330 is formed on substantially the same plane as the upper surface of the sheathing member 400. The height of the sheathing member 400 is set in consideration of the height of the sealing member 330, so that the sealing member 330 can be formed through an injection molding process without a mold having a complicated shape. Therefore, the manufacturing cost can be reduced.

The sealing member 330 covers and seals the electronic component 311, the bonding wire W, and a portion of the image sensor 320, and covers a portion of the reflector 350.

When the side surface of the sheathing member 400 is a vertical surface, the inner side surface 331 of the sealing member 330, which is in contact with the side surface of the sheathing member 400, is also a vertical surface.

Therefore, the sealing member 330 can completely cover the bonding wire W, thereby providing stable sealing.

Referring to fig. 8, the protection member 400 is removed. The protective member 400 is coupled to the sealing member 330 formed using an injection molding process, and thus the protective member 400 is separated from the sealing member 330 using a laser.

The protective member 400 is also attached to the image sensor 320, and thus the protective member 400 is separated from the image sensor 320 using water, or by irradiating Ultraviolet (UV) light or applying heat to the protective member 400, or by any of various other methods. Thus, the protective member 400 is removed.

When the protective member 400 is removed, the effective imaging plane P is exposed, and the sealing member 330 surrounds the outer circumference of the effective imaging plane P. That is, the sealing member 330 has a hole H exposing the effective imaging plane P.

A portion of the reflector 350 is covered by the sealing member 330, and the remaining portion of the reflector 350 is exposed by the hole H.

Referring to fig. 9, the filter 340 is attached to the upper surface of the sealing member 330. As described above, since the filter 340 is attached to the sealing member 330, an additional apparatus or structure for attaching the filter 340 is not required. Accordingly, the height of the image sensor package 300 itself may be reduced, and thus the height of a camera module including the image sensor package 300 may be reduced.

Fig. 10 is a schematic cross-sectional view showing an example of a process of removing the protective member during a process of manufacturing the image sensor package, and fig. 11 is a schematic cross-sectional view showing an example of the protective member having been removed from the image sensor package.

Referring to fig. 10, laser light is irradiated on the boundary between the sealing member 330 and the protective member 400 as indicated by an arrow in fig. 10. Accordingly, the protective member 400 is separated from the sealing member 330.

The reflector 350 is disposed on the image sensor 320 at a boundary between the sealing member 330 and the protective member 400. As an example, a portion of the reflector 350 is covered by the sealing member 330, and the remaining portion of the reflector 350 is covered by the protective member 400.

Since the reflector 350 is disposed on the image sensor 320 at the boundary between the sealing member 330 and the protective member 400, the reflector 350 prevents the image sensor 320 from being damaged by the laser when the laser is irradiated on the boundary to separate the protective member 400 from the sealing member 330.

Further, referring to fig. 11, when laser light is irradiated on a boundary between the sealing member 330 and the protective member 400, a portion of the sealing member 330 is removed by the laser light reflected by the reflector 350.

As an example, a stepped portion 332 is formed on the inner side surface 331 of the sealing member 330. The inner side surface 331 of the sealing member 330 is a surface forming the hole H of the sealing member 330. The stepped portion 332 is formed adjacent to the reflector 350.

The inner side surface 331 of the sealing member 330 includes a first surface 331a extending from the upper surface of the sealing member 330 toward the reflector 350, and a second surface 331b extending from the first surface 331a toward the reflector 350.

The first surface 331a is a surface that protrudes more toward the center of the hole H than the second surface 331b, and the step portion 332 is formed between the first surface 331a and the second surface 331 b. As an example, the inner side surface 331 of the sealing member 330 forming the hole H of the sealing member 330 has a concave shape at a position adjacent to the reflector 350.

The stepped portion 332 formed in the inner side surface 331 of the sealing member 330 makes the size of the portion of the hole H adjacent to the image sensor 320 larger than the size of the portion of the hole H adjacent to the optical filter 340 when the hole H is viewed in the direction perpendicular to the upper surface of the image sensor 320.

The inner side surface 331 of the sealing member 330 may be rougher than the upper surface of the sealing member 330. Therefore, if the light is reflected by the inner side surface 331 of the sealing member 330, the reflected light is scattered, thereby preventing the occurrence of the flare phenomenon.

A portion of the light passing through the lens portion 100 may be incident on the inner side surface 331 of the sealing member 330 and reflected by the inner side surface 331 before the light is received by the image sensor 320. That is, even when the sealing member 330 is made of a material having a low reflectance, a part of light passing through the lens portion 100 may be reflected by the inner side surface 331. When the image sensor 320 receives the reflected light, a flare phenomenon occurs.

However, in the example of the image sensor package 300 shown in fig. 2, the inner side surface 331 of the sealing member 330 may be roughened to scatter the reflected light so that the reflected light is not concentrated at one point. Therefore, the occurrence of the flare phenomenon can be suppressed.

Fig. 12 is a schematic cross-sectional view of another example of an image sensor package.

Referring to fig. 12, the image sensor package 300 'of fig. 12 is identical to the image sensor package 300 of fig. 2 except for the position of the reflector 350 and the shape of the sealing member 330', and thus most of the description of the image sensor package 300 'will be omitted except for the description of the position of the reflector 350 and the shape of the sealing member 330'.

Referring to fig. 12, an image sensor package 300 'includes a substrate 310, an image sensor 320, a sealing member 330', and an optical filter 340.

A sealing member 330' is disposed on the substrate 310 to cover and seal the electronic component 311.

The sealing member 330' surrounds the outer circumference of the bonding wire W and has a hole H exposing the bonding wire W and the image sensor 320. Although not shown in fig. 12, the inner side surface 331 'of the sealing member 330' may have the same shape as the inner side surface 331 of the sealing member 330 shown in fig. 11.

The reflector 350 is disposed on the substrate 310 between the electronic component 311 and the bonding wire W, and at least a portion of the reflector 350 is covered with the sealing member 330'.

As an example, a portion of the reflector 350 is covered by the sealing member 330', and the remaining portion of the reflector 350 is exposed by the hole H.

The example of the image sensor package satisfies the demand for miniaturization of the image sensor package.

While the disclosure includes specific examples, it will be apparent, upon an understanding of the present disclosure, that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described in this application are to be considered in a descriptive sense only and not for purposes of limitation. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order and/or if components in the described systems, architectures, devices, or circuits are combined in a different manner and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the present disclosure should be defined not by the specific embodiments but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents should be understood as being included in the present disclosure.