阅读说明：本技术 一种提高vcp电镀线深镀能力及改善孔内无铜的喷流方法 (Jet flow method for improving deep plating capability of VCP (vertical continuous plating) electroplating line and improving copper-free property in hole ) 是由 巫中山 许伟廉 陈世金 冯冲 韩志伟 徐缓 于 2021-08-09 设计创作，主要内容包括：本发明公开了一种提高VCP电镀线深镀能力及改善孔内无铜的喷流方法,涉及印制板加工技术领域,解决铜缸喷流方式效果差的技术问题,方法为：将印制板放置于第一喷管与第二喷管之间,其特征在于,印制板作为阴极,第一喷管的外侧、第二喷管的外侧分别设有阳极板,第一喷管连接有第一喷流泵,第二喷管连接有第二喷流泵,第一喷流泵的喷流压力不同于第二喷流泵的喷流压力。本发明通过设置第一喷流泵的喷流压力不同于第二喷流泵的喷流压力,可以提高印制板孔内药水的交换能力,最终使得孔内镀铜与板面镀铜差异减小,能有效提高电镀深镀能力,更有利于管控面铜,降低铜离子消耗达到节约成本及精细线路制作,以及避免孔内气泡导致孔内断铜品质异常。(The invention discloses a jet flow method for improving deep plating capability of a VCP plating line and improving copper-free property in a hole, which relates to the technical field of printed board processing and solves the technical problem of poor effect of a copper cylinder jet flow mode, and the method comprises the following steps: the method is characterized in that the printed board is used as a cathode, anode plates are arranged on the outer side of the first spray pipe and the outer side of the second spray pipe respectively, the first spray pipe is connected with a first spray pump, the second spray pipe is connected with a second spray pump, and the jet pressure of the first spray pump is different from that of the second spray pump. According to the invention, the jet pressure of the first jet pump is different from that of the second jet pump, so that the exchange capacity of the liquid medicine in the hole of the printed board can be improved, the difference between copper plating in the hole and plate copper plating is reduced, the electroplating deep plating capacity can be effectively improved, surface copper can be controlled more easily, copper ion consumption is reduced, the cost is saved, fine circuit manufacturing is realized, and the problem of abnormal quality of copper breaking in the hole caused by bubbles in the hole is avoided.)

1. A jet flow method for improving deep plating capacity of VCP electroplating lines and improving copper-free property in holes is characterized in that a printed board (1) is placed between a first spray pipe (2) and a second spray pipe (3), the printed board (1) is used as a cathode, anode plates (4) are respectively arranged on the outer side of the first spray pipe (2) and the outer side of the second spray pipe (3), the first spray pipe (2) is connected with a first jet flow pump, the second spray pipe (3) is connected with a second jet flow pump, and jet flow pressure of the first jet flow pump is different from jet flow pressure of the second jet flow pump.

2. A jet method to increase the throwing power of VCP plating lines and to improve the copper free inside a hole according to claim 1, characterized in that the jet pressure of the first jet pump and the jet pressure of the second jet pump are determined according to the parameters of the printed board (1).

3. The method as claimed in claim 2, wherein a jet pressure parameter table corresponding to various parameters is prepared in advance;

and inquiring the jet pressure parameter table according to the parameters of the printed board (1) to obtain the jet pressure of the first jet pump and the jet pressure of the second jet pump.

4. A jet flow method for improving the deep plating capability of a VCP plating line and the copper-free inside a hole according to any one of claims 1 to 3, wherein the jet flow pressures of the first jet flow pump and the second jet flow pump are controlled by pressure regulating valves, respectively; or the jet pressure of the first jet pump and the jet pressure of the second jet pump are controlled by controlling the working frequency of the first jet pump and the working frequency of the second jet pump respectively.

5. A jet method for increasing the throwing power of VCP plating lines and improving the copper-free inside the hole according to claim 2 or 3, wherein the parameters of the printed board (1) include board thickness parameters, form factor parameters, minimum aperture parameters.

6. A jet flow method for improving the deep plating capability of VCP plating lines and the copper-free inside holes according to claim 4, characterized in that the parameters of the printed board (1) are made into bar codes or two-dimensional codes; and during actual processing, scanning the bar code or the two-dimensional code by a bar code scanning gun to obtain the parameters of the printed board (1).

7. The jet flow method for improving the deep plating capacity of the VCP electroplating line and improving the copper-free property in the hole according to claim 6, further comprising a control module, wherein the control module scans the bar code or the two-dimensional code through a bar code scanning gun to obtain the parameters of the printed board (1), and the control module controls the jet flow pressures of the first jet flow pump and the second jet flow pump through a pressure regulating valve respectively; or the jet pressure of the first jet pump and the jet pressure of the second jet pump are controlled by controlling the working frequency of the first jet pump and the working frequency of the second jet pump respectively.

8. The jet flow method for improving the deep plating capability of a VCP plating line and improving the copper-free property in a hole according to claim 7, wherein the control module is a PLC (programmable logic controller), a singlechip or an industrial personal computer.

9. A jet method for increasing the throwing power of a VCP plating line and improving the copper-free inside a hole according to claim 1, wherein the jet pressure of said first jet pump and the jet pressure of said second jet pump are alternately changed according to a set period.

10. A jet method to increase the throwing power of VCP plating lines and to improve the copper free inside the hole according to claim 1, characterized in that the distance between the printed board (1) and the first nozzle (2) is equal to the distance between the printed board (1) and the second nozzle (3).

Technical Field

The invention relates to the technical field of printed board processing, in particular to a jet flow method for improving deep plating capability of a VCP (vertical continuous plating) electroplating line and improving copper-free property in a hole.

Background

At present, VCP electroplating line (vertical continuous electroplating line) copper cylinder spray pipe jet flow in the PCB industry adopts a side-spraying opposite-spraying mode, the pressure of jet flows on two sides is the same, in the actual production process, when a through hole in a printed board is electroplated in a copper cylinder and is subjected to jet flows with the same pressure on two sides, liquid medicine in the hole cannot be effectively communicated, the deep plating capacity of a plated hole can be influenced, and bubbles in the hole are easy to remain in the hole and cannot be discharged due to the fact that the pressure of jet flows on two sides of the printed board is the same, so that copper in the hole is broken.

Disclosure of Invention

The present invention is directed to solving the above-mentioned problems of the prior art, and an object of the present invention is to provide a jet method capable of improving the deep plating capability of a VCP plating line and improving the copper-free inside the hole.

The technical scheme of the invention is as follows: a printed board is placed between a first spray pipe and a second spray pipe, the printed board serves as a cathode, anode plates are arranged on the outer side of the first spray pipe and the outer side of the second spray pipe respectively, the first spray pipe is connected with a first spray pump, the second spray pipe is connected with a second spray pump, and the spray pressure of the first spray pump is different from that of the second spray pump.

As a further improvement, the jet pressure of the first jet pump and the jet pressure of the second jet pump are determined according to parameters of the printed board.

Furthermore, a jet flow pressure parameter table corresponding to various parameters is preset;

and inquiring the jet pressure parameter table according to the parameters of the printed board to obtain the jet pressure of the first jet pump and the jet pressure of the second jet pump.

Further, jet pressure of the first jet pump and jet pressure of the second jet pump are controlled through pressure regulating valves respectively; or the jet pressure of the first jet pump and the jet pressure of the second jet pump are controlled by controlling the working frequency of the first jet pump and the working frequency of the second jet pump respectively.

Further, the parameters of the printed board include a board thickness parameter, an outline dimension parameter and a minimum aperture parameter.

Further, making the parameters of the printed board into a bar code or a two-dimensional code; and during actual processing, scanning the bar code or the two-dimensional code by a bar code scanning gun to obtain the parameters of the printed board.

The control module scans the bar code or the two-dimensional code through a bar code scanning gun to obtain parameters of the printed board, and the control module controls jet pressure of the first jet pump and jet pressure of the second jet pump through pressure regulating valves respectively; or the jet pressure of the first jet pump and the jet pressure of the second jet pump are controlled by controlling the working frequency of the first jet pump and the working frequency of the second jet pump respectively.

Further, the control module is a PLC, a single chip microcomputer or an industrial personal computer.

Further, the jet pressure of the first jet pump and the jet pressure of the second jet pump are alternately changed in a predetermined period.

Further, the distance between the printed board and the first nozzle is equal to the distance between the printed board and the second nozzle.

Advantageous effects

Compared with the prior art, the invention has the advantages that:

according to the invention, the jet pressure of the first jet pump is different from that of the second jet pump, so that the exchange capacity of the liquid medicine in the hole of the printed board can be improved, the difference between copper plating in the hole and plate copper plating is reduced, the electroplating deep plating capacity can be effectively improved, surface copper can be controlled more easily, copper ion consumption is reduced, the cost is saved, fine circuit manufacturing is realized, and the problem of abnormal quality of copper breaking in the hole caused by bubbles in the hole is avoided.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic structural diagram of the via copper of the present invention.

Wherein: 1-printed board, 2-first spray pipe, 3-second spray pipe and 4-anode plate.

Detailed Description

The invention will be further described with reference to specific embodiments shown in the drawings.

Referring to fig. 1-3, a jet flow method for improving deep plating capability of a VCP plating line and improving copper-free inside a hole is provided, in which a printed board 1 is placed between a first spray pipe 2 and a second spray pipe 3, the printed board 1 is used as a cathode, an anode plate 4 is respectively arranged on the outer side of the first spray pipe 2 and the outer side of the second spray pipe 3, the first spray pipe 2 is connected with a first jet flow pump, the second spray pipe 3 is connected with a second jet flow pump, and jet flow pressure of the first jet flow pump is different from jet flow pressure of the second jet flow pump.

And determining the jet pressure of the first jet pump and the jet pressure of the second jet pump according to the parameters of the printed board 1.

Furthermore, a jet flow pressure parameter table corresponding to various parameters is preset; and inquiring a jet pressure parameter table according to parameters of the printed board 1 to obtain jet pressure of the first jet pump and jet pressure of the second jet pump.

In one embodiment, the jet pressures of the first and second discharge pumps are controlled by pressure regulating valves, that is, the pressure regulating valves are provided at the output ends of the first and second discharge pumps, respectively, and the opening degrees of the pressure regulating valves are adjusted to control the jet pressures of the first and second discharge pumps.

In one embodiment, the jet pressures of the first and second jet pumps are controlled by controlling the operating frequencies of the first and second jet pumps, respectively.

The parameters of the printed board 1 include a board thickness parameter, an outline dimension parameter, and a minimum aperture parameter.

The parameters of the printed board 1 can be made into bar codes or two-dimensional codes and arranged on the printed board 1; in actual processing, the bar code or the two-dimensional code is scanned by a bar code scanning gun to obtain the parameters of the printed board 1.

In one embodiment, the invention further comprises a control module, wherein a jet pressure parameter table is stored in the control module, the control module is a PLC (programmable logic controller), a singlechip or an industrial personal computer, the control module scans bar codes or two-dimensional codes through a code scanning gun to obtain parameters of the printed board 1, the jet pressure parameter table is inquired to obtain jet pressure of the first jet pump and jet pressure of the second jet pump, and the control module controls the jet pressures of the first jet pump and the second jet pump through pressure regulating valves respectively; or the jet pressure of the first jet pump and the jet pressure of the second jet pump are controlled by controlling the operating frequency of the first jet pump and the operating frequency of the second jet pump respectively.

In one embodiment, the jet pressure of the first jet pump and the jet pressure of the second jet pump are alternately changed according to a set period, that is, the jet pressure of the first jet pump is set to be P1 at the beginning and the jet pressure of the second jet pump is set to be P2, and after a while, the jet pressure of the first jet pump is set to be P2 and the jet pressure of the second jet pump is set to be P1, so that the operation is alternately circulated.

The distance between the printed board 1 and the first nozzle 2 is equal to the distance between the printed board 1 and the second nozzle 3.

And (3) comparing the actual application effects:

as shown in FIG. 3, the test printed board was selected to have a board thickness of 2.0mm, a hole diameter of 0.2mm, and an aspect ratio of the outer dimension parameter of 10: 1.

The working frequency of the first jet flow pump and the working frequency of the second jet flow pump are set to be 45HZ, and the effects are as follows: the copper plating is 20 mu m, the average value of the hole copper is 10.2 mu m, and the deep plating capacity is 51 percent.

The working frequency of the second jet pump is adjusted to be 10HZ, the working frequency of the first jet pump is adjusted to be 45%, and the effects are as follows: the copper plating is 20 mu m, the average value of the hole copper is 14.8 mu m, and the deep plating capacity is 74 percent. Fig. 3 shows that the copper thickness at the positions a, b, c, d and e-j is measured, the average deep plating capacity is [ (e + f + g + h + i + j)/6]/(a + b + c + d) × 100%, m represents the plate copper plating thickness, and n represents the base material plus bottom copper.

According to the invention, the jet pressure of the first jet pump is different from that of the second jet pump, so that the exchange capacity of the liquid medicine in the hole of the printed board can be improved, the difference between copper plating in the hole and plate copper plating is reduced, the electroplating deep plating capacity can be effectively improved, surface copper can be controlled more easily, copper ion consumption is reduced, the cost is saved, fine circuit manufacturing is realized, and the problem of abnormal quality of copper breaking in the hole caused by bubbles in the hole is avoided.

The above is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that several variations and modifications can be made without departing from the structure of the present invention, which will not affect the effect of the implementation of the present invention and the utility of the patent.